High-uniformity welding device and method for hemispherical resonator gyroscope base

Abstract

The invention provides a hemispherical resonator gyroscope base high-uniformity welding device and method.The device comprises a vacuum cavity, welding flux, an upper layer heating device, a lower layer heating device, an annular heating device, a first thermocouple, a second thermocouple and a control unit, the upper layer heating device is arranged at the top in the vacuum cavity, and the lower layer heating device is arranged at the bottom in the vacuum cavity; the lower layer heating device is arranged at the bottom in the vacuum chamber, the annular heating device is arranged on the side wall of the vacuum chamber in a surrounding mode, the base is arranged in the vacuum chamber, the welding flux is arranged between the ceramic base contact pin and the plate electrode, the first thermocouple is arranged at the top end of the ceramic base contact pin, and the second thermocouple is arranged on the bottom face of the plate electrode. By applying the technical scheme, the technical problem of low welding strength caused by non-uniform heating of the welding flux in the prior art is solved.

Description

Technical Field

[0001] This invention relates to the field of hemispherical resonant gyroscope technology, and more particularly to a highly uniform welding device and method for a hemispherical resonant gyroscope base. Background Technology

[0002] The hemispherical resonant gyroscope is a novel type of vibrating gyroscope that uses the standing wave precession effect of a hemispherical harmonic oscillator to sense the rotation of a base. It possesses unique advantages such as high precision, low cost, small size, and high reliability, making it a current hot topic in inertial technology research and application. The hemispherical resonant gyroscope's head structure mainly includes a hemispherical harmonic oscillator, a flat plate electrode, a ceramic base, and a shell. The ceramic base is welded to the flat plate electrode via pins, such as... Figure 1 As shown, 1 is the planar electrode, 2 is the solder, 3 is the ceramic base pin, and 4 is the ceramic base substrate. Currently, tin-containing solder is generally used for assembly. This type of solder can withstand significant mechanical forces and impacts, and its good ductility and toughness contribute to soldering reliability. However, when using this solder for reflow soldering, precise temperature control is crucial. Too low a temperature will prevent the solder from completely melting, leading to incomplete soldering or insufficient solder joint strength. Too high a temperature will reduce the wettability of the solder joint. Furthermore, since the welding position of the planar electrode is a fused silica glass-plated gold layer, if the solder joint temperature is too high or the time is too long, the gold layer will react with the tin in the solder to form intermetallic compounds, commonly known as "gold brittleness." "Gold brittleness" lacks ductility, causing material embrittlement. The solder joint is prone to cracking under mechanical stress, reducing soldering reliability. Therefore, strict control of the temperature and holding time at the solder joint is essential during the soldering process.

[0003] Typical reflow soldering equipment uses either top and bottom heating elements or separate flat electrodes and ceramic substrates placed in graphite fixtures for contact heat transfer. For top heating, heat must first be transferred to the flat electrode and then to the upper layer of solder; for bottom heating, heat must first be transferred to the ceramic substrate, then to the ceramic substrate pins, and finally to the lower layer of solder. Because the materials and heat capacities differ at different locations, the heat transfer effect varies, making it difficult to synchronize top and bottom heating. Furthermore, due to manufacturing errors, the ceramic substrate pins may vary in height, resulting in non-contact between the flat electrode and the solder, uneven solder heating, and an inability to achieve high-strength soldering. Summary of the Invention

[0004] This invention provides a highly uniform welding device and method for hemispherical resonant gyroscope bases, which can solve the technical problem of low welding strength caused by uneven heating of solder in the prior art.

[0005] According to one aspect of the present invention, a high-uniformity welding device for a hemispherical resonator gyroscope base is provided. The base includes a ceramic base substrate and ceramic base pins disposed thereon. The device includes: a vacuum chamber, solder, an upper heating device, a lower heating device, an annular heating device, a first thermocouple, a second thermocouple, and a control unit. The upper heating device is disposed at the top of the vacuum chamber, the lower heating device is disposed at the bottom of the vacuum chamber, the annular heating device is disposed around the side wall of the vacuum chamber, the base is disposed in the vacuum chamber, the solder is disposed between the ceramic base pins and the plate electrode, the first thermocouple is disposed at the top of the ceramic base pins, and the second thermocouple is disposed on the bottom surface of the plate electrode.

[0006] The vacuum chamber is used to provide a vacuum environment that meets the preset vacuum index. The upper heating device, the lower heating device, and the annular heating device are used to heat from above, below, and around the perimeter, respectively. The first thermocouple is used to monitor the temperature of the tip of the ceramic base pin, and the second thermocouple is used to monitor the temperature of the bottom surface of the flat electrode. The control unit is used to adjust the temperature control parameters of the upper heating device, the lower heating device, and the annular heating device according to the temperatures measured by the first and second thermocouples, so that the temperature of the tip of the ceramic base pin is consistent with the temperature of the bottom surface of the flat electrode.

[0007] Furthermore, the solder is a tin-containing solder, and its shape is a disc with the same end face size as the ceramic base pin.

[0008] Furthermore, both the upper and lower heating devices are heat radiation components or contact heat transfer components.

[0009] Furthermore, the annular heating device is an annular heating wire.

[0010] Furthermore, the temperature control parameters include heating power, heating rate, and holding time.

[0011] According to another aspect of the present invention, a welding method for a high-uniformity welding device for a hemispherical resonator gyroscope base as described above is provided, the method comprising:

[0012] Open the vacuum chamber, place the ceramic base in the welding position, and fix the ceramic base substrate;

[0013] Place the solder onto the top of each ceramic base pin in sequence;

[0014] Place the flat electrode onto the solder and press it firmly, then place the counterweight.

[0015] Contact the top of the ceramic base pin with the first thermocouple and fix it in place;

[0016] Contact the bottom surface of the plate electrode with the second thermocouple and fix it in place;

[0017] Close the vacuum chamber and evacuate it to the preset vacuum level;

[0018] Start the upper heating device, the lower heating device, and the ring heating device;

[0019] The temperature at the tip of the ceramic base pin is monitored by the first thermocouple, and the temperature at the bottom of the flat electrode is monitored by the second thermocouple.

[0020] The control unit adjusts the temperature control parameters of the upper heating device, the lower heating device, and the ring heating device based on the temperature measured by the first thermocouple and the temperature measured by the second thermocouple, so that the temperature of the top of the ceramic base pin is consistent with the temperature of the bottom of the flat electrode.

[0021] The present invention provides a highly uniform welding device and method for a hemispherical resonant gyroscope base. This device, by setting an upper heating device, a lower heating device, and a ring heating device within a vacuum chamber, and by placing thermocouples at the top of the ceramic base pins and the bottom of the flat electrode for temperature measurement, and by using a temperature control unit to adjust the temperature parameters of the heating devices in the three directions based on the temperature feedback from the thermocouples, ensures uniform heating of the device during welding, uniform temperature conduction at the solder position, and enhances the welding strength of the solder, thus meeting the high-reliability assembly requirements of the hemispherical resonant gyroscope ceramic base and the flat electrode. Attached Figure Description

[0022] The accompanying drawings, which form part of this specification, are provided to further illustrate embodiments of the invention and, together with the textual description, explain the principles of the invention. It is obvious that the drawings described below are merely some embodiments of the invention, and those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0023] Figure 1 A left view of the welding assembly for an existing hemispherical resonant gyroscope base is shown;

[0024] Figure 2 A left view of a highly uniform welding apparatus for a hemispherical resonator gyroscope base according to a specific embodiment of the present invention is shown.

[0025] Figure 3 A top view of a highly uniform welding apparatus for a hemispherical resonant gyroscope base provided according to a specific embodiment of the present invention is shown. Detailed Implementation

[0026] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0028] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0029] like Figure 2 and Figure 3As shown, in response to the welding requirements of ceramic base and flat plate electrode of hemispherical resonator gyroscope, a high uniformity welding device for hemispherical resonator gyroscope base is provided according to a specific embodiment of the present invention. The base includes a ceramic base substrate 4 and a ceramic base pin 3 disposed thereon. The device includes: a vacuum chamber, solder 2, an upper heating device 5, a lower heating device 6, an annular heating device 7, a first thermocouple 8, a second thermocouple 9, and a control unit. The upper heating device 5 is disposed at the top of the vacuum chamber, the lower heating device 6 is disposed at the bottom of the vacuum chamber, the annular heating device 7 is disposed around the side wall of the vacuum chamber, the base is disposed in the vacuum chamber, the solder 2 is disposed between the ceramic base pin 3 and the flat plate electrode 1, the first thermocouple 8 is disposed at the top of the ceramic base pin 3, and the second thermocouple 9 is disposed on the bottom surface of the flat plate electrode 1.

[0030] The vacuum chamber is used to provide a vacuum environment that meets the preset vacuum index. The upper heating device 5, the lower heating device 6, and the annular heating device 7 are used to heat from above, below, and around the perimeter, respectively. The first thermocouple 8 is used to monitor the temperature of the top of the ceramic base pin 3, and the second thermocouple 9 is used to monitor the temperature of the bottom surface of the flat plate electrode 1. The control unit is used to adjust the temperature control parameters of the upper heating device 5, the lower heating device 6, and the annular heating device 7 according to the temperature measured by the first thermocouple 8 and the second thermocouple 9, so that the temperature of the top of the ceramic base pin 3 is consistent with the temperature of the bottom surface of the flat plate electrode 1.

[0031] This configuration provides a highly uniform welding device for hemispherical resonator gyroscope bases. The device employs an upper heating element, a lower heating element, and a ring-shaped heating element within a vacuum chamber. Thermocouples are placed at the top of the ceramic base pins and on the bottom surface of the flat electrode for temperature measurement. A temperature control unit adjusts the temperature parameters of the three heating elements based on the thermocouple feedback, ensuring uniform heating of the device during welding. This results in uniform temperature conduction at the solder position, enhancing the welding strength and meeting the high-reliability assembly requirements of the hemispherical resonator gyroscope ceramic base and the flat electrode. Compared to existing technologies, this invention solves the problem of low welding strength caused by uneven solder heating.

[0032] In this embodiment, the flat plate electrode 1 is a component of the hemispherical resonator gyroscope assembly, and the ceramic base pins 3 and the ceramic base substrate 4 are two components of the hemispherical resonator gyroscope base. In this embodiment, the flat plate electrode 1 is made of fused silica glass plated with gold, and the ceramic base pins 3 are gold-plated, with eight pins evenly distributed. Furthermore, the solder 2 is a tin-containing solder, shaped like a disc with the same end face dimensions as the ceramic base pins 3.

[0033] Based on the above embodiments, in this embodiment of the invention, both the upper heating device 5 and the lower heating device 6 are heat radiation components or contact heat transfer components. The upper heating device 5 is used to heat the device to be welded from above, and the lower heating device 6 is used to heat the device to be welded from below. The annular heating device 7 is an annular heating wire that completely encloses the device to be welded. The first thermocouple 8 is used to measure the temperature of the top of the ceramic base pin 3, and the second thermocouple is used to measure the temperature of the gold layer on the bottom surface of the flat electrode 1.

[0034] Furthermore, in this embodiment of the invention, the temperature control parameters include heating power, heating rate, and holding time. By adjusting these parameters, the temperature conduction around the solder can be kept consistent, thereby ensuring the welding effect.

[0035] According to another aspect of the present invention, a welding method for a high-uniformity welding device for a hemispherical resonator gyroscope base as described above is provided, the method comprising:

[0036] Open the vacuum chamber, place the ceramic base in the welding position, and fix the ceramic base substrate;

[0037] Place the solder onto the top of each ceramic base pin in sequence;

[0038] Place the flat electrode onto the solder and press it firmly, then place the counterweight.

[0039] Contact the top of the ceramic base pin with the first thermocouple and fix it in place;

[0040] Contact the bottom surface of the plate electrode with the second thermocouple and fix it in place;

[0041] Close the vacuum chamber and evacuate it to the preset vacuum level;

[0042] Start the upper heating device, the lower heating device, and the ring heating device;

[0043] The temperature at the tip of the ceramic base pin is monitored by the first thermocouple, and the temperature at the bottom of the flat electrode is monitored by the second thermocouple.

[0044] The control unit adjusts the temperature control parameters of the upper heating device, lower heating device, and ring heating device based on the temperatures measured by the first thermocouple and the second thermocouple, so that the temperature of the top of the ceramic base pin is consistent with the temperature of the bottom of the flat electrode, which ensures that the temperature conduction around the solder is consistent, thereby ensuring the welding effect.

[0045] In summary, this invention provides a highly uniform welding device and method for hemispherical resonator gyroscope bases. This device, by arranging an upper heating device, a lower heating device, and a ring heating device within a vacuum chamber, and by placing thermocouples at the top of the ceramic base pins and the bottom of the flat electrode for temperature measurement, and by using a temperature control unit to adjust the temperature parameters of the three heating devices based on the temperature feedback from the thermocouples, ensures uniform heating of the device during welding, resulting in uniform temperature conduction at the solder position, enhanced welding strength, and meeting the high-reliability assembly requirements of the hemispherical resonator gyroscope ceramic base and the flat electrode. Compared with existing technologies, the technical solution of this invention can solve the technical problem of low welding strength caused by uneven solder heating in existing technologies.

[0046] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0047] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this invention.

[0048] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A highly uniform welding device for a hemispherical resonant gyroscope base, characterized in that, The base includes a ceramic base plate (4) and a ceramic base pin (3) disposed thereon. The device includes a vacuum chamber, solder (2), an upper heating device (5), a lower heating device (6), an annular heating device (7), a first thermocouple (8), a second thermocouple (9), and a control unit. The upper heating device (5) is disposed at the top of the vacuum chamber, the lower heating device (6) is disposed at the bottom of the vacuum chamber, the annular heating device (7) is disposed around the side wall of the vacuum chamber, the base is disposed in the vacuum chamber, the solder (2) is disposed between the ceramic base pin (3) and the flat plate electrode (1), the first thermocouple (8) is disposed at the top of the ceramic base pin (3), and the second thermocouple (9) is disposed on the bottom surface of the flat plate electrode (1). The vacuum chamber is used to provide a vacuum environment that meets the preset vacuum index. The upper heating device (5), the lower heating device (6), and the annular heating device (7) are used to heat from above, below, and around, respectively. The first thermocouple (8) is used to monitor the temperature of the top of the ceramic base pin (3), and the second thermocouple (9) is used to monitor the temperature of the bottom surface of the flat electrode (1). The control unit is used to adjust the temperature control parameters of the upper heating device (5), the lower heating device (6), and the annular heating device (7) according to the temperature measured by the first thermocouple (8) and the second thermocouple (9), so that the temperature of the top of the ceramic base pin (3) is consistent with the temperature of the bottom surface of the flat electrode (1).

2. The apparatus according to claim 1, characterized in that, The solder (2) is a tin-containing solder, and its shape is a disc with the same end face size as the ceramic base pin (3).

3. The apparatus according to claim 2, characterized in that, Both the upper heating device (5) and the lower heating device (6) are heat radiation components or contact heat transfer components.

4. The apparatus according to claim 3, characterized in that, The annular heating device (7) is an annular heating wire.

5. The apparatus according to claim 4, characterized in that, The temperature control parameters include heating power, heating rate, and holding time.

6. A welding method for a high-uniformity welding device for a hemispherical resonant gyroscope base as described in claims 1 to 5, characterized in that, The method includes: Open the vacuum chamber, place the ceramic base in the welding position, and fix the ceramic base substrate; Place the solder onto the top of each ceramic base pin in sequence; Place the flat electrode onto the solder and press it firmly, then place the counterweight. Contact the top of the ceramic base pin with the first thermocouple and fix it in place; Contact the bottom surface of the plate electrode with the second thermocouple and fix it in place; Close the vacuum chamber and evacuate it to the preset vacuum level; Start the upper heating device, the lower heating device, and the ring heating device; The temperature at the tip of the ceramic base pin is monitored by the first thermocouple, and the temperature at the bottom of the flat electrode is monitored by the second thermocouple. The control unit adjusts the temperature control parameters of the upper heating device, the lower heating device, and the ring heating device based on the temperature measured by the first thermocouple and the temperature measured by the second thermocouple, so that the temperature of the top of the ceramic base pin is consistent with the temperature of the bottom of the flat electrode.

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