Positioning and attaching mold

Abstract

The embodiment of the invention provides a positioning and laminating mold, which comprises a lower mold assembly, an upper mold assembly and a lower mold assembly, the upper die assembly comprises an upper die plate and a positioning pin, the upper die plate is located on the top side of the lower die plate, and the positioning pin is arranged on the upper die plate; the material receiving mechanism comprises a material receiving block and a linkage assembly, the material receiving block is arranged on the linkage assembly and located between the lower die plate and the upper die plate, and the material receiving block is used for bearing a to-be-pasted material provided with a positioning hole; when the upper mold plate and the lower mold plate are closed, the upper mold plate and the lower mold plate can be matched to drive the linkage assembly to drive the material receiving block to leave the attaching path of the to-be-attached material, and before the material receiving block leaves the attaching path, the positioning pin can stretch into the positioning hole so that the lower mold plate can attach the to-be-attached material to the preset position of the first material belt. In the mold closing process, the material receiving block can avoid, and meanwhile, before the material receiving block leaves the laminating path, the positioning pin of the upper mold plate can guide the falling of the material to be laminated, so that the laminating precision is improved.

Description

Technical Field

[0001] This invention relates to the field of die-cutting technology, and in particular to a positioning and fitting mold. Background Technology

[0002] Lamination is a common process in the die-cutting industry, which uses a lamination mold to bond the material to be laminated on the upper strip to the lower strip.

[0003] In related technologies, after the material to be bonded enters the bonding mold, it falls to the lower strip by opening and closing, and then the mold is closed to bond the material to the lower strip. Even if the position of the material to be bonded on the bonding mold is accurate, the material may shift during its fall, causing a deviation in the bonding position between the material and the lower strip, resulting in low bonding accuracy. Summary of the Invention

[0004] The present invention aims to at least solve one of the technical problems existing in the prior art. To this end, the present invention proposes a positioning and bonding mold that can improve bonding accuracy.

[0005] This invention provides a positioning and bonding mold, comprising: a lower mold assembly including a lower template for carrying a first material strip; an upper mold assembly including an upper template and a positioning pin, the upper template being located on the top side of the lower template, and the positioning pin being disposed on the upper template; and a receiving mechanism including a receiving block and a linkage assembly, the receiving block being disposed on the linkage assembly and located between the lower template and the upper template, the receiving block being used to carry a material to be bonded having a positioning hole; when the upper template and the lower template are closed, the upper template and the lower template can cooperate to drive the linkage assembly to move the receiving block away from the bonding path of the material to be bonded, and before the receiving block leaves the bonding path, the positioning pin can extend into the positioning hole, so that the lower template bonds the material to be bonded to a preset position of the first material strip.

[0006] The positioning and fitting mold provided by the embodiments of the present invention has at least the following beneficial effects: By setting up a receiving mechanism, the receiving block is placed on the linkage component. The receiving block carries the material to be bonded. During the mold closing process, the upper and lower mold plates work together to drive the linkage component to move the receiving block away from the bonding path of the material to be bonded, so that the receiving block can avoid obstacles. At the same time, before the receiving block leaves the bonding path, the positioning pin of the upper mold plate can extend into the positioning hole of the material to be bonded to guide the falling of the material to be bonded. This helps to ensure the accurate relative position of the material to be bonded and the first strip, so that the lower mold plate can bond the material to be bonded to the preset position of the first strip, thereby improving the bonding accuracy.

[0007] In one embodiment of this implementation, the linkage component includes a mounting block and a first linkage block. The mounting block is disposed on the lower template, and the first linkage block is slidably engaged with the mounting block and connected to the receiving block. When the upper template and the lower template are closed, the upper template can drive the first linkage block to move the receiving block relative to the lower template.

[0008] In one embodiment of this implementation, the linkage component includes a second linkage block, which is rotatably engaged with the mounting block and meshes with the first linkage block; when the upper template and the lower template are closed, the upper template can push the second linkage block to rotate relative to the mounting base, so that the first linkage block drives the receiving block to move.

[0009] In one embodiment of this implementation, the angle formed by the sliding direction of the first linkage block relative to the mounting block and the closing direction of the upper template is an acute angle.

[0010] In one embodiment of this implementation, the linkage component includes an elastic element that connects the first linkage block and the mounting block, and is used to drive the first linkage block to slide back to its initial position relative to the mounting block after the upper template and the lower template are separated.

[0011] In one embodiment of this implementation, the lower mold assembly includes a peeling blade connected to the lower mold plate and adjacent to the receiving block. The peeling blade is used to peel the material to be applied from the second strip, allowing the material to be applied to slide onto the receiving block.

[0012] In one embodiment of this implementation, the material to be applied includes a product part and a positioning part. The positioning part is connected to one side of the product part and has a positioning hole. The receiving block is used to support the positioning part and has a clearance hole opposite to the positioning hole. The clearance hole extends through to the side of the receiving block.

[0013] In one embodiment of this implementation, the material to be applied includes two positioning parts connected to opposite sides of the product part, and the receiving mechanism includes two receiving blocks and two linkage components arranged in a one-to-one correspondence, with the two receiving blocks respectively supporting the corresponding positioning parts.

[0014] In one embodiment of this implementation, the upper template is provided with a first clearance groove, which is used to receive at least a portion of the receiving block when the upper template and the lower template are closed; and / or, the lower template is provided with a second clearance groove, which is used to receive at least a portion of the receiving block when the upper template and the lower template are closed.

[0015] In one embodiment of this implementation, the positioning pin is retractable relative to the upper template. Before the receiving block leaves the bonding path, the positioning pin can extend into the positioning hole and abut against the first material strip.

[0016] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is a three-dimensional structural schematic diagram of a positioning and fitting mold provided in one embodiment of the present invention; Figure 2 yes Figure 1 A front view structural diagram of the positioning and fitting mold before mold closing; Figure 3 yes Figure 1 A three-dimensional structural diagram of the lower mold assembly carrying the first material strip and the receiving mechanism carrying the material to be bonded in the positioning and bonding mold; Figure 4 yes Figure 1 A three-dimensional structural diagram of the lower mold assembly and material receiving mechanism in the positioning and fitting mold; Figure 5 yes Figure 1 A three-dimensional structural diagram of the receiving mechanism; Figure 6 yes Figure 1 A three-dimensional structural diagram of the upper mold component; Figure 7 yes Figure 1 A front view structural diagram of the positioning and fitting mold during the mold closing process; Figure 8 yes Figure 1 A schematic diagram of the positioning and fitting mold after mold closing; Figure 9 yes Figure 8 A cross-sectional view of the positioning and fitting mold in the front view direction; Figure 10 This is a schematic diagram of the three-dimensional structure of the material to be pasted.

[0018] Figure label: Positioning and fitting mold 100; Lower mold assembly 10; lower template 11; first clearance groove 111; peeling blade 12; Upper mold assembly 20; upper template 21; second clearance groove 211; third clearance groove 212; positioning pin 22; roller 23; Material receiving mechanism 30; material receiving block 31; clearance hole 311; linkage component 32; mounting block 321; first linkage block 322; second linkage block 323; push block 324; First strip 200; Material to be pasted 300; positioning hole 310; product section 320; positioning section 330. Detailed Implementation

[0019] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0020] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0021] In the description of this invention, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0022] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0023] In the description of this invention, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0024] Please see Figure 1 , Figure 2 , Figures 7 to 9 , Figure 1 This is a three-dimensional structural schematic diagram of a positioning and fitting mold 100 provided in one embodiment of the present invention; Figure 2 yes Figure 1 A front view of the positioning and fitting mold 100 before mold closing; Figure 7 yes Figure 1 A front view of the positioning and fitting mold 100 during the mold closing process; Figure 8 yes Figure 1 A front view of the positioning and fitting mold 100 after mold closing; Figure 9 yes Figure 8 A cross-sectional view of the positioning and bonding mold 100 in the front view direction. This invention provides a positioning and bonding mold 100, which includes a lower mold assembly 10, an upper mold assembly 20, and a receiving mechanism 30. The lower mold assembly 10 includes a lower template 11 for carrying a first material strip 200. The upper mold assembly 20 includes an upper template 21 and a positioning pin 22. The upper template 21 is located on the top side of the lower template 11, and the positioning pin 22 is disposed on the upper template 21. The receiving mechanism 30 includes a receiving block 31 and a linkage assembly 32. The receiving block 31 is disposed on the linkage assembly 32 and located between the lower template 11 and the upper template 21. The receiving block 31 is used to carry the material 300 to be bonded, which has a positioning hole 310. When the upper template 21 and the lower template 11 are closed, the upper template 21 and the lower template 11 can cooperate with the drive linkage component 32 to drive the receiving block 31 to leave the bonding path of the material to be bonded 300. Before the receiving block 31 leaves the bonding path, the positioning pin 22 can extend into the positioning hole 310 so that the lower template 11 bonds the material to be bonded 300 to the preset position of the first material strip 200.

[0025] Specifically, the upper template 21 is used to connect with drivers such as hydraulic cylinders, air cylinders, and servo motors, so that it can complete the mold closing and mold opening actions with the lower template 11 under the drive of the driver.

[0026] For details, please refer to Figure 3 and Figure 6 , Figure 3 yes Figure 1 A three-dimensional structural diagram of the positioning and bonding mold 100, which includes a lower mold assembly 10 carrying a first material strip 200 and a receiving mechanism 30 carrying a material to be bonded 300. Figure 6 yes Figure 1 A three-dimensional structural diagram of the upper mold assembly 20 is shown. Positioning pins 22 are installed on the bottom side of the lower mold plate 11. The number of positioning pins 22 corresponds to the number of positioning holes 310 on the material to be applied 300, and they are all in one-to-one correspondence. In this embodiment, there are four positioning pins 22 and four positioning holes 310.

[0027] Understandably, please refer to the following documents before pressing down on template 21. Figure 2The receiving block 31 supports the material to be applied 300. The positioning pin 22 of the upper template 21 is aligned with the positioning hole 310 of the material to be applied 300, but has not yet inserted into the positioning hole 310. After the upper template 21 is pressed down a certain distance, please refer to the following for details. Figure 7 The positioning pin 22 extends into the positioning hole 310, but is spaced apart from the first material strip 200. At this time, the receiving block 31 still supports the material to be bonded 300, but has already moved a distance away from the bonding path of the material to be bonded 300 under the action of the linkage component 32. After the upper template 21 is pressed down to close with the lower template 11, please refer to the following for details. Figure 8 and Figure 9 The receiving block 31 is completely removed from the bonding path of the material to be bonded 300, that is, the receiving block 31 will not obstruct the bonding of the material to be bonded 300 with the first material strip 200. The upper template 21 presses the material to be bonded 300 to the preset position of the first material strip 200.

[0028] By setting the receiving mechanism 30, the receiving block 31 is set on the linkage component 32. The receiving block 31 carries the material to be bonded 300. During the mold closing process, the upper template 21 and the lower template 11 cooperate to drive the linkage component 32 to move the receiving block 31 away from the bonding path of the material to be bonded 300, so that the receiving block 31 can avoid obstacles. At the same time, before the receiving block 31 leaves the bonding path, the positioning pin 22 of the upper template 21 can extend into the positioning hole 310 of the material to be bonded 300 to guide the falling of the material to be bonded 300. This helps to ensure that the relative position of the material to be bonded 300 and the first material strip 200 is accurate, so that the lower template 11 can bond the material to be bonded 300 to the preset position of the first material strip 200, thereby improving the bonding accuracy.

[0029] In one embodiment of this implementation, please refer to Figures 3 to 5 , Figure 4 yes Figure 1 A three-dimensional structural diagram of the lower mold assembly 10 and the receiving mechanism 30 in the positioning and fitting mold 100; Figure 5 yes Figure 1 A three-dimensional structural diagram of the receiving mechanism 30 is provided. To enable the upper template 21 and lower template 11 to drive the receiving block 31 away from the bonding path of the material to be bonded 300 during mold closing, the linkage component 32 includes a mounting block 321 and a first linkage block 322. The mounting block 321 is disposed on the lower template 11, and the first linkage block 322 is slidably fitted onto the mounting block 321 and connected to the receiving block 31. When the upper template 21 and lower template 11 close, the upper template 21 can drive the first linkage block 322 to move the receiving block 31 relative to the lower template 11.

[0030] Specifically, the mounting block 321 is fixed on the lower template 11, and the first linkage block 322 achieves sliding cooperation with the mounting block 321 through the guide rail and guide groove.

[0031] In other embodiments, the mounting block 321 can also be set on the upper template 21. During the mold closing process, the lower template 11 drives the first linkage block 322 to move the receiving block 31 relative to the upper template 21.

[0032] In one embodiment of this implementation, please refer to Figures 3 to 5 To ensure smooth movement of the receiving block 31, the linkage component 32 includes a second linkage block 323. The second linkage block 323 is rotatably engaged with the mounting block 321 and meshes with the first linkage block 322. When the upper mold plate 21 and the lower mold plate 11 are closed, the upper mold plate 21 can push the second linkage block 323 to rotate relative to the mounting base, so that the first linkage block 322 drives the receiving block 31 to move. It can be understood that compared to the upper mold plate 21 directly pushing the first linkage block 322, the structure in which the second linkage block 323 meshes with the first linkage block 322 and is rotatably engaged with the mounting block 321, with the upper mold plate 21 pushing the second linkage block 323 to rotate, thereby driving the first linkage block 322 to move, allows the upper mold plate 21 to better transmit force to the first linkage block 322, making the movement of the receiving block 31 smooth and effectively reducing the risk of jamming.

[0033] Specifically, the linkage component 32 includes a push block 324 with an "L" shaped cross section. The push block 324 is located on the end face of the second linkage block 323 and can be pushed by the upper template 21.

[0034] Specifically, the upper mold assembly 20 includes a roller 23, which is mounted on the upper template 21 and used to push the second linkage block 323 (push block 324). It can be understood that the presence of the roller 23 can effectively reduce the friction between the upper template 21 and the linkage assembly 32, ensuring smooth movement of the receiving block 31.

[0035] In one embodiment of this implementation, please refer to Figure 2 The angle formed by the sliding direction of the first linkage block 322 relative to the mounting block 321 and the mold closing direction of the upper template 21 is an acute angle. It can be understood that by setting the angle formed by the sliding direction of the first linkage block 322 and the mold closing direction of the upper template 21 to an acute angle, the receiving block 31 moves downwards as it moves outwards, reducing the height from which the material to be applied 300 falls, thereby reducing the risk of the material to be applied 300 shifting.

[0036] Specifically, the mold closing direction of the upper template 21 is vertically downward, and the sliding direction of the first linkage block 322 relative to the mounting block 321 is inclined vertically and downward.

[0037] In one embodiment of this implementation, please refer to Figure 5To achieve the reset of the receiving block 31 after mold separation, the linkage component 32 includes an elastic element (not shown). The elastic element connects the first linkage block 322 and the mounting block 321, and is used to drive the first linkage block 322 to slide back to its initial position relative to the mounting block 321 after the upper mold plate 21 and the lower mold plate 11 are separated. With this configuration, after mold separation, the elastic element can drive the first linkage block 322 to move the receiving block 31 back to its initial position where it can receive materials.

[0038] Specifically, the elastic release direction of the elastic element is inclined to the vertical direction and upward.

[0039] In one embodiment of this implementation, please refer to Figure 3 and Figure 4 In order to achieve automated feeding of the material to be bonded 300 onto the receiving block 31 and improve bonding efficiency, the lower mold assembly 10 includes a peeling blade 12. The peeling blade 12 is connected to the lower template 11 and adjacent to the receiving block 31. The peeling blade 12 is used to peel the material to be bonded 300 from the second strip (not shown) so that the material to be bonded 300 slides onto the receiving block 31.

[0040] Specifically, when the receiving block 31 is in its initial position, the peeling blade 12 is flush with the receiving block 31 in the horizontal direction, so that the peeling blade 12 can peel the material to be applied 300 onto the receiving block 31. The feeding directions of the first material strip 200 and the second material strip are parallel.

[0041] In one embodiment of this implementation, please refer to Figure 3 , Figure 4 and Figure 10 , Figure 10 This is a three-dimensional structural diagram of the material to be applied 300. The material to be applied 300 includes a product part 320 and a positioning part 330. The positioning part 330 is connected to one side of the product part 320 and has a positioning hole 310. The receiving block 31 is used to support the positioning part 330 and has a clearance hole 311 opposite to the positioning hole 310, which extends to the side of the receiving block 31. It can be understood that the positioning hole 310 is usually located at the edge of the material to be applied 300 (positioning part 330) to ensure the positioning effect. However, in order to ensure the support of the receiving block 31, the position supported by the receiving block 31 usually covers the edge of the material to be applied 300 (positioning part 330). This means that the positioning hole 310 of the positioning part 330 will be covered by the receiving block 31, and the positioning pin 22 is prone to interference with the receiving block 31. In this embodiment, by opening a clearance hole 311 opposite to the positioning hole 310 in the receiving block 31, and the clearance hole 311 extends through to the side of the receiving block 31, the portion of the positioning pin 22 that passes through the positioning hole 310 can extend into the clearance hole 311 for clearance. During the process of the receiving block 31 retracting from the bonding path, the positioning pin 22 can leave the receiving block 31 from one side of the clearance groove, thereby avoiding interference between the positioning pin 22 and the receiving block 31.

[0042] In one embodiment of this implementation, please refer to Figure 3 , Figure 4 and Figure 10 In order to better support the material to be pasted 300, the material to be pasted 300 includes two positioning parts 330. The two positioning parts 330 are connected to opposite sides of the product part 320. The receiving mechanism 30 includes two receiving blocks 31 and two linkage components 32 that are arranged in a one-to-one correspondence. The two receiving blocks 31 respectively support the corresponding positioning parts 330.

[0043] Specifically, the mold closing direction of the upper template 21 is vertically downward, the sliding direction of the first linkage block 322 on the left is towards the lower left, and the sliding direction of the first linkage block 322 on the right is towards the lower right.

[0044] In one embodiment of this implementation, please refer to Figure 6 To avoid interference between the receiving block 31 and the upper template 21 during the mold closing process, the upper template 21 is provided with a first clearance groove 111. The first clearance groove 111 is used to accommodate at least part of the receiving block 31 when the upper template 21 and the lower template 11 are closed.

[0045] In one embodiment of this implementation, please refer to Figure 4 To avoid interference between the receiving block 31 and the lower template 11 during the mold closing process, the lower template 11 is provided with a second clearance groove 211. The second clearance groove 211 is used to accommodate at least part of the receiving block 31 when the upper template 21 and the lower template 11 are closed.

[0046] In one embodiment of this implementation, please refer to Figure 6 To avoid interference between the stripper 12 and the upper template 21 during the mold closing process, the upper template 21 is provided with a third clearance groove 212 opposite to the stripper 12. The third clearance groove 212 is used to accommodate at least part of the stripper 12 when the upper template 21 and the lower template 11 are closed.

[0047] In one embodiment of this implementation, please refer to Figure 9 The positioning pin 22 can extend and retract relative to the upper template 21. Before the receiving block 31 leaves the bonding path, the positioning pin 22 can extend into the positioning hole 310 and abut against the first material strip 200. By setting the positioning pin 22 to be able to extend and retract relative to the upper template 21, and to extend into the positioning hole 310 and abut against the first material strip 200 before the receiving block 31 leaves the bonding path, the positioning pin 22 can be used to position the material to be bonded 300 throughout the process to prevent it from falling off, thus further improving the bonding accuracy.

[0048] Understandably, to ensure that the material to be bonded 300 does not shift when it falls, the receiving block 31 must be removed before the positioning and bonding mold 100 moves away. Figure 7 The state shown Figure 8 During the process shown, the positioning pin 22 has passed through the positioning hole 310 and abutted against the first material strip 200, ensuring that when the material to be applied 300 falls, it will not shift due to the gap between the positioning pin 22 and the first material strip 200.

[0049] Specifically, the positioning pin 22 can abut against the upper surface of the first material strip 200 or cooperate with the limiting hole (not shown) opened on the first material strip 200.

[0050] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments, and various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. A positioning and fitting mold, characterized in that, include: The lower mold assembly includes a lower mold plate for carrying the first strip; The upper mold assembly includes an upper template and a positioning pin. The upper template is located on the top side of the lower template, and the positioning pin is disposed on the upper template. The receiving mechanism includes a receiving block and a linkage component. The receiving block is disposed in the linkage component and located between the lower template and the upper template. The receiving block is used to carry the material to be applied with positioning holes. When the upper template and the lower template are closed, the upper template and the lower template can cooperate to drive the linkage component to move the receiving block away from the bonding path of the material to be bonded, and before the receiving block leaves the bonding path, the positioning pin can extend into the positioning hole so that the lower template bonds the material to be bonded to the preset position of the first material strip.

2. The positioning and fitting mold according to claim 1, characterized in that, The linkage component includes an installation block and a first linkage block. The installation block is disposed on the lower template, and the first linkage block is slidably fitted to the installation block and connected to the receiving block. When the upper template and the lower template are closed, the upper template can drive the first linkage block to move the receiving block relative to the lower template.

3. The positioning and fitting mold according to claim 2, characterized in that, The linkage component includes a second linkage block, which is rotatably engaged with the mounting block and meshes with the first linkage block. When the upper template and the lower template are closed, the upper template can push the second linkage block to rotate relative to the mounting base, so that the first linkage block drives the receiving block to move.

4. The positioning and fitting mold according to claim 2, characterized in that, The angle formed by the sliding direction of the first linkage block relative to the mounting block and the closing direction of the upper template is an acute angle.

5. The positioning and fitting mold according to claim 2, characterized in that, The linkage component includes an elastic element that connects the first linkage block and the mounting block, and is used to drive the first linkage block to slide back to its initial position relative to the mounting block after the upper template and the lower template are separated.

6. The positioning and fitting mold according to claim 1, characterized in that, The lower mold assembly includes a peeling blade connected to the lower mold plate and adjacent to the receiving block. The peeling blade is used to peel the material to be applied from the second material strip, so that the material to be applied slides onto the receiving block.

7. The positioning and fitting mold according to claim 1, characterized in that, The material to be applied includes a product part and a positioning part. The positioning part is connected to one side of the product part and has a positioning hole. The receiving block is used to support the positioning part and has a clearance hole opposite to the positioning hole. The clearance hole extends to the side of the receiving block.

8. The positioning and fitting mold according to claim 7, characterized in that, The material to be applied includes two positioning parts, which are connected to opposite sides of the product part. The receiving mechanism includes two receiving blocks and two linkage components that are arranged in a one-to-one correspondence. The two receiving blocks respectively support the corresponding positioning parts.

9. The positioning and fitting mold according to claim 1, characterized in that, The upper template is provided with a first clearance groove, which is used to receive at least a portion of the receiving block when the upper template and the lower template are closed; and / or, the lower template is provided with a second clearance groove, which is used to receive at least a portion of the receiving block when the upper template and the lower template are closed.

10. The positioning and fitting mold according to claim 1, characterized in that, The positioning pin is retractable relative to the upper template. Before the receiving block leaves the bonding path, the positioning pin can extend into the positioning hole and abut against the first material strip.

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