Online thickness measurement system for semiconductor film deposition

Abstract

The invention discloses an online thickness measurement system for semiconductor film deposition, and relates to the technical field of thickness measurement devices. The device comprises a main body structure which comprises a bottom plate, an adjusting plate located above the bottom plate and a supporting plate located above the adjusting plate; an automatic detection structure, comprising a stroke frame on the outer side of a supporting plate, a first motor located on one side of the upper end of a bottom plate, a first screw located at the output end of the first motor, a first nut, a second motor located at one end of the stroke frame and a second screw located at the output end of the second motor and rotationally installed in the stroke frame, wherein the first nut is connected to the outer wall of the first screw in a threaded and sleeving mode; the outer wall of the second screw is sleeved with the second nut in a threaded mode, and the stroke frame is located at the lower end of the second nut. By arranging the negative pressure adsorption fixing structure, the multi-dimensional mobile automatic detection mechanism and the adjustable clamping plate, the problems of low precision and poor efficiency of manual detection of the deposition thickness of the semiconductor film are solved, and automatic and accurate measurement is realized.

Description

Technical Field

[0001] This invention relates to the field of thickness measurement device technology, and in particular to an online thickness measurement system for semiconductor thin film deposition. Background Technology

[0002] In the semiconductor manufacturing field, thin film deposition is one of the core processes. The uniformity and accuracy of the thin film thickness directly determine the performance and reliability of semiconductor devices. Therefore, online thickness measurement is a key link to ensure production quality. Currently, semiconductor thin film deposition thickness detection mostly relies on manual handheld detection equipment, which has many prominent problems: manual detection requires frequent movement of the detection head, which is not only labor-intensive and inefficient, but also prone to deviation in the manually controlled detection force and movement trajectory, resulting in large measurement data errors and making it difficult to meet the requirements of high-precision production. Meanwhile, traditional inspection devices mostly use mechanical clamping to fix the workpiece, which can easily damage the surface of semiconductor workpieces. Furthermore, they cannot adapt to workpieces of different sizes and shapes, resulting in poor versatility and an inability to quickly meet diverse thin film inspection needs, thus hindering the convenience and efficiency of the production process. Therefore, those skilled in the art have provided an online thickness measurement system for semiconductor thin film deposition to address the problems mentioned in the background. Summary of the Invention

[0003] 1. Technical Solution

[0004] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution: This invention relates to an online thickness measurement system for semiconductor thin film deposition, comprising: The main structure includes a base plate, an adjustment plate located above the base plate, and a support plate located above the adjustment plate; The automatic detection structure includes a travel frame on the outside of the support plate, a motor 1 located on the upper side of the base plate, a screw 1 located at the output end of the motor 1, a nut 1 threaded onto the outer wall of the screw 1 and connected at one end to the outer wall of the travel frame, a motor 2 located at one end of the travel frame, a screw 2 located at the output end of the motor 2 and rotatably installed inside the travel frame, a nut 2 threaded onto the outer wall of the screw 2, and a travel frame located at the lower end of the nut 2. as well as; The fixed structure includes a hydraulic rod located inside the stroke frame, a mounting frame located at the lower telescopic end of the hydraulic rod, symmetrically distributed clamping plates located inside the mounting frame, and a detection head located inside the clamping plates.

[0005] Furthermore, a bearing bracket is provided on the rear side of the upper end of the base plate, one end of the screw is rotatably installed inside the bearing bracket, a guide rail is provided on one side of the upper end of the base plate, and a slider is provided at the lower end of the travel frame, which is slidably sleeved on the outer wall of the guide rail. Specifically, the bearing bracket provides rotational support to one end of the screw, and the slider at the bottom of the lower end of the travel frame slides on the outer wall of the guide rail to provide sliding support to the travel frame.

[0006] Furthermore, a guide rail 2 is provided on the inner wall of the upper end of the travel frame, and a slider 2 is slidably installed on the outer wall of the guide rail 2 at the upper end of the nut 2; Specifically, slider two guides nut two in a sliding manner, so that nut two is provided with sliding support.

[0007] Furthermore, a bottom box is provided at the lower end of the support plate, with adsorption holes evenly distributed inside the upper part of the support plate, and a negative pressure pump located at one end of the bottom box with the suction end penetrating through the bottom box. Specifically, the suction force of the adsorption pump is transmitted to the adsorption pores through the bottom box, and then acts on the semiconductor through the adsorption pores.

[0008] Furthermore, the upper end of the support plate is provided with a rubber pad located outside the adsorption hole, the upper end of the base plate is provided with symmetrically distributed bearing seats, a rotating shaft is rotatably installed inside the bearing seats, a bottom block connected to one side of the upper end of the rotating shaft is sleeved on the outer wall of the rotating shaft, an electric push rod is provided on one side of the upper end of the base plate, and a ball is rotatably installed inside the upper end of the electric push rod. Specifically, the rubber pad provides soft support to the bottom of the semiconductor, while the electric push rod is fixedly attached to the bottom of the adjustment plate via ball bearings. The adjustment plate rotates inside the bearing housing via a rotating shaft, providing rotational support for the adjustment plate.

[0009] Furthermore, a screw three is rotatably installed inside the mounting frame, and a handle is provided at one end of the screw three. A screw hole is opened inside the clamping plate, which is threaded and sleeved on the outer wall of the screw three. A slider three is provided at the upper end of the clamping plate, and a guide rail three is provided on the inner wall of the upper end of the mounting frame, which is slidably installed with the slider three. Specifically, the gripping handle facilitates the application of rotational force to the screw three, and the slider three slides on the outer wall of the guide rail three to provide sliding support for the clamping plate.

[0010] Furthermore, a distance sensor is provided on one side of the outer wall of the stroke frame. The detection end of the distance sensor faces the upper part of the support plate, and the distance sensor is electrically connected to the control module of the hydraulic rod. It is used to provide real-time feedback on the distance between the detection head and the surface of the semiconductor workpiece and to automatically adjust the extension and retraction of the hydraulic rod. Specifically, traditional testing requires manual data recording, which is inefficient and prone to errors and omissions. Measurement results cannot be known in real time during the testing process and must be checked after completion. If the data is abnormal, the test must be repeated, wasting time. The data lacks systematic storage, making subsequent traceability and analysis inconvenient. The data acquisition module synchronously captures the thickness measurement value and multi-dimensional movement coordinates of the detection head, and after processing, it is presented intuitively on the touch screen. It also supports data storage and export, eliminating the need for manual data recording, avoiding handwriting errors, and ensuring strong data traceability. Operators can monitor the testing status in real time without the need for post-event verification, improving the informatization of the testing process. The touch operation is convenient and allows for quick setting of testing parameters.

[0011] Furthermore, the clamping surface of the clamping plate is provided with an arc-shaped rubber layer, the surface of which is provided with anti-slip texture, and the thickness of the arc-shaped rubber layer is 2-5mm, which is used to enhance the clamping stability of the detection head while avoiding surface wear. Specifically, traditional equipment lacks limit protection. The mechanical movement driven by the motor is prone to exceeding the travel limit due to improper operation or program errors, causing component wear, deformation, or even motor burnout. Vibration from collisions can cause the detection head to shift, affecting the accuracy of measurement data. Operators need to constantly monitor the movement range, increasing labor intensity and making equipment failures more likely due to negligence. When the travel frame moves longitudinally along guide rail one to its limit position, or the travel frame moves laterally along guide rail two to its limit position, the limit sensor triggers a signal to control the motor to stop running. The elastic buffer pad cushions any possible minor collisions, preventing rigid collisions of the mechanical structure due to excessive movement, protecting core components such as the screw, guide rail, and motor, extending the equipment's service life. There is no need for manual monitoring of the movement range, reducing operational difficulty and ensuring continuous and stable detection. The buffer pad reduces vibrations caused by collisions, preventing vibrations from affecting measurement accuracy.

[0012] 2. Beneficial effects

[0013] Compared with the prior art, the advantages of this invention are: This invention places a semiconductor on a rubber pad, and the suction force of a negative pressure pump acts on the interior of the casing and onto the semiconductor through the suction holes, adsorbing the bottom of the semiconductor. Simultaneously, a reciprocating and lateral movement frame moves the detection head of an oxide film thickness detector above the semiconductor, detecting the deposition thickness of the oxide film. This avoids the frequent movement of the detection head by manual handheld oxide film thickness detectors and the problem of improper manual force control, achieving automatic detection of semiconductor thickness. This provides high efficiency and convenience for detecting semiconductor oxide film deposition thickness. Furthermore, the detection head is easily clamped by a bidirectional moving clamp, allowing for convenient replacement of the detection head.

[0014] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a front-view three-dimensional structural schematic diagram of the present invention; Figure 2 This is a schematic diagram of the main cross-sectional three-dimensional structure of the present invention; Figure 3 This is a schematic diagram of the three-dimensional structure of the bottom box of the present invention in a main cross-section. Figure 4 This is a three-dimensional structural diagram of one side of the screw of the present invention; Figure 5 This is a front-view three-dimensional structural diagram of the fixed structure of the present invention.

[0017] The attached diagram lists the components represented by each number as follows: 100. Main structure; 101. Base plate; 102. Adjustment plate; 103. Support plate; 104. Bearing seat; 105. Base block; 106. Rotating shaft; 107. Adsorption hole; 108. Base box; 109. Rubber pad; 110. Negative pressure pump; 111. Electric push rod; 112. Ball bearing; 200. Automatic detection structure; 201. Motor 1; 202. Screw 1; 203. Stroke frame; 204. Nut 1; 205. Guide rail 1; 206. Motor 2; 207. Screw 2; 208. Guide rail 2; 209. Slider 2; 210. Nut 2; 211. Bearing bracket; 212. Stroke frame; 300. Fixed structure; 301. Screw hole; 302. Hydraulic rod; 303. Mounting frame; 304. Screw three; 305. Handle; 306. Slider three; 307. Clamping plate; 308. Guide rail three; 309. Detection head. Detailed Implementation

[0018] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0019] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0020] Secondly, the present invention will be described in detail with reference to the schematic diagrams. When describing the embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure will be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In addition, actual fabrication should include the three-dimensional spatial dimensions of length, width, and depth.

[0021] To make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0022] Example 1

[0023] Please see Figures 1-5 As shown, this embodiment is an online thickness measurement system for semiconductor thin film deposition, including: The main structure 100 includes a base plate 101, an adjustment plate 102 located above the base plate 101, and a support plate 103 located above the adjustment plate 102. The automatic detection structure 200 includes a stroke frame 203 on the outside of the support plate 103, a motor 201 located on the upper side of the base plate 101, a screw 202 located at the output end of the motor 201, a nut 204 threaded onto the outer wall of the screw 202 and connected at one end to the outer wall of the stroke frame 203, a motor 206 located at one end of the stroke frame 203, a screw 207 located at the output end of the motor 206 and rotatably mounted inside the stroke frame 203, a nut 210 threaded onto the outer wall of the screw 207, and a stroke frame 212 located at the lower end of the nut 210. as well as; The fixed structure 300 includes a hydraulic rod 302 located inside the stroke frame 212, a mounting frame 303 located at the lower telescopic end of the hydraulic rod 302, clamping plates 307 symmetrically distributed inside the mounting frame 303, and a detection head 309 located inside the clamping plate 307. A bearing bracket 211 is provided on the rear side of the upper end of the base plate 101. One end of the screw 202 is rotatably installed inside the bearing bracket 211. A guide rail 205 is provided on one side of the upper end of the base plate 101. A slider 205 is provided at the lower end of the travel frame 203 and is slidably sleeved on the outer wall of the guide rail 205. The upper inner wall of the travel frame 203 is provided with a guide rail 208, and the upper end of the nut 210 is provided with a slider 209 that is slidably installed on the outer wall of the guide rail 208. A bottom box 108 is provided at the lower end of the support plate 103, and adsorption holes 107 are equally distributed inside the upper end of the support plate 103. A negative pressure pump 110 is located at one end of the bottom box 108 and the suction end passes through the bottom box 108. The upper end of the support plate 103 is provided with a rubber pad 109 located outside the adsorption hole 107. The upper end of the base plate 101 is provided with symmetrically distributed bearing seats 104. A rotating shaft 106 is rotatably installed inside the bearing seat 104. A bottom block 105 is sleeved on the outer wall of the rotating shaft 106, the upper end of which is connected to one side of the upper end of the adjusting plate 102. An electric push rod 111 is provided on one side of the upper end of the base plate 101. A ball bearing 112 is rotatably installed inside the upper end of the electric push rod 111. The mounting frame 303 has a screw 304 rotatably mounted inside. One end of the screw 304 is provided with a handle 305. The clamping plate 307 has a screw hole 301 that is threaded and sleeved on the outer wall of the screw 304. The upper end of the clamping plate 307 is provided with a slider 306. The upper inner wall of the mounting frame 303 is provided with a guide rail 308 that is slidably mounted with the slider 306. A distance sensor is provided on one side of the outer wall of the stroke frame 212. The detection end of the distance sensor faces the support plate 103. The distance sensor is electrically connected to the control module of the hydraulic rod 302 to provide real-time feedback on the distance between the detection head 309 and the surface of the semiconductor workpiece and to automatically adjust the extension and retraction of the hydraulic rod 302. The clamping surface of the clamping plate 307 is provided with an arc-shaped rubber layer. The surface of the arc-shaped rubber layer is provided with anti-slip texture, and the thickness of the arc-shaped rubber layer is 2-5mm. This is used to enhance the clamping stability of the detection head 309 while preventing its surface from wearing. The automatic detection structure 200 and the fixed structure 300 are used; First, place the semiconductor workpiece to be tested on the rubber pad 109 of the support plate 103, start the negative pressure pump 110, and its suction force is transmitted through the bottom box 108 to the equidistant adsorption holes 107 at the upper end of the support plate 103, firmly adsorbing the bottom of the workpiece. The rubber pad 109 not only avoids wear on the workpiece, but also enhances the sealing performance, solving the problem that traditional clamping is prone to damaging the workpiece or unstable fixation. If the workpiece deposition surface is tilted, the electric push rod 111 extends and pushes the adjustment plate 102, causing the adjustment plate 102 to rotate around the rotating shaft 106 in the bearing seat 104 until the workpiece deposition surface is horizontal or at an angle suitable for detection. The ball bearing 112 is designed to reduce friction loss during adjustment, ensuring smooth and accurate angle adjustment. During the detection phase, motor 201 drives screw 202 to rotate, and nut 204 drives stroke frame 203 to move longitudinally along guide rail 205. At the same time, motor 206 drives screw 207 to rotate, and nut 210 drives stroke frame 212 to move laterally along guide rail 208, forming a multi-dimensional movement trajectory in both the longitudinal and lateral directions. Hydraulic rod 302 extends and retracts to adjust the height of mounting frame 303, so that detection head 309 fits against the workpiece deposition surface, achieving full-area scanning detection without blind spots. The automatic movement of detection head 309 is achieved through mechanical transmission. Combined with negative pressure adsorption and angle adjustment mechanisms, the stability of the workpiece and the precise movement of detection head 309 are ensured during the detection process. The advantage of this implementation method is that it completely replaces the manual operation mode of holding detection head 309, avoiding measurement errors caused by uneven force control and movement trajectory deviation during manual detection, greatly improving detection accuracy and efficiency. The angle adjustment function adapts to workpieces with different tilt states, solving the limitation of traditional equipment that can only detect planar workpieces. When installing or replacing the detection head 309, rotating the handle 305 drives the screw 304 to rotate. Through the threaded engagement between the screw hole 301 and the screw 304, the two clamping plates 307 move relative to each other along the guide rail 308, quickly clamping or releasing the detection head 309. This allows for easy assembly and disassembly without complex tools, solving the problem of cumbersome and time-consuming replacement of traditional detection heads 309, and adapting to different types of thin film thickness detection needs. During the testing process, the bearing bracket 211 provides stable support for the screw 202. The sliding cooperation between the slider 1 and the guide rail 205, and between the slider 209 and the guide rail 208, ensures that the travel frame 203 and the travel frame 212 move without jamming or offset, and ensures the straightness of the movement trajectory of the test head 309. The slider 306 at the upper end of the clamping plate 307 cooperates with the guide rail 308 in the mounting frame 303, so that the clamping plate 307 clamps the detection head 309 with uniform force, avoiding the detection head 309 from loosening and affecting the measurement accuracy. At the same time, the uniform distribution design of the adsorption holes 107 makes the workpiece bear force in a balanced manner, preventing excessive local pressure from causing workpiece deformation, and further ensuring the stability of the measurement benchmark. The detection head 309 is easy and flexible to replace, adapting to the diverse needs of semiconductor thin film deposition detection. The guiding and support design of each transmission structure ensures the long-term stability of the equipment and reduces mechanical failures. The combination of negative pressure adsorption and rubber pad 109 not only achieves stable fixation of the workpiece, but also plays a protective role, solving the problem that traditional clamping fixation is prone to damaging the workpiece and affecting the test results, making the measurement data more reliable and valuable.

[0024] Working Principle: Before testing, the semiconductor workpiece is placed on the rubber pad 109 of the support plate 103. The negative pressure pump 110 generates uniform suction through the base box 108 and the adsorption hole 107, achieving workpiece fixation without damage. The rubber pad 109 enhances adsorption sealing while preventing surface wear. If the workpiece deposition surface is tilted, the electric push rod 111 pushes the adjustment plate 102 to rotate around the rotating shaft 106, precisely adjusting the workpiece angle to a suitable testing state. During the testing phase, motor 1 201 and motor 206 drive screw 1 202 and screw 2 207 to rotate, respectively. With the guidance of the guide rail and slider, the stroke frame 203 moves longitudinally and the stroke frame 212 moves laterally. The hydraulic rod 302 adjusts the height of the detection head 309 to fit the workpiece surface, achieving full-area scanning detection. The newly added data acquisition module captures the thickness measurement value, movement coordinates, and detection progress of the detection head 309 in real time. After processing, the data is presented intuitively on the touch screen, supporting convenient setting of movement speed, measurement accuracy, and detection parameters, as well as data storage and export. Meanwhile, the limit sensors on the travel frame 203 and travel box 212 monitor the movement range in real time. When the limit position of the guide rail end is approached, a signal is immediately sent to the motor control module to drive the motor to stop running. The elastic buffer pad at the end of the guide rail buffers the possible slight collisions and avoids rigid impact. When the detection head 309 is replaced, the handle 305 is turned to drive the screw 304. Through the threaded engagement, the clamping plate 307 moves along the guide rail 308 to quickly complete the clamping or loosening of the detection head 309. No complicated tools are required. On the basis of the original advantages of automated detection, non-destructive fixation and strong adaptability, the new structure further improves the practicality of the system. The data acquisition and touch display module enables real-time visualization of test data, eliminating the need for manual recording, avoiding handwriting errors, and ensuring strong data traceability. Operators can monitor the test status in real time, promptly detect anomalies and make adjustments, significantly improving the informatization and intelligence level of the test process. Touch operation simplifies the parameter setting process and lowers the operating threshold. Limit sensors and elastic buffer structures effectively prevent rigid collisions of mechanical parts due to excessive travel, protecting core components such as screws, guide rails, and motors, and extending the service life of the equipment. The elimination of the need for constant manual monitoring of the movement range reduces the workload of operators and ensures the continuous and stable testing process. At the same time, the arc-shaped rubber layer reduces vibration caused by collisions, preventing the detection head 309 from shifting due to vibration, and further improving measurement accuracy. Overall, the system retains the original advantages of automation, non-destructive operation, and strong adaptability, while also achieving intelligent data management, safer equipment operation, and more convenient operation procedures through the addition of new structures. It balances testing efficiency, accuracy, and equipment durability, and solves the core problems of low accuracy and poor efficiency of traditional manual testing, easy damage to workpieces by mechanical clamping, and poor adaptability. This system solves the problems of low efficiency, susceptibility to errors and omissions in manual data recording during traditional testing, and lack of systematic data storage, making subsequent traceability and analysis inconvenient. Through the data acquisition and touch display module, it realizes automatic data recording, real-time display, and convenient export of data, providing reliable data support for production quality analysis. It also solves the problem of traditional equipment lacking limit protection, which is prone to exceeding travel limits due to improper operation or program errors, causing component wear, deformation, or even motor burnout. The combination of limit sensors and elastic buffer pads forms double protection, ensuring the long-term stability of the equipment and reducing the cost of mechanical failure maintenance. It also solves the problem of needing to manually monitor the movement range during the testing process, which is labor-intensive and prone to equipment failure due to negligence. The automated limit protection mechanism frees up manpower and avoids the impact of collisions and vibrations on measurement accuracy, further ensuring the accuracy of the test data. The negative pressure pump 110, the base box 108, and the adsorption hole 107 work together to achieve stable fixation of the workpiece without damage. The arc-shaped rubber layer not only avoids surface wear but also enhances the adsorption seal, solving the problems of easy workpiece damage and poor adaptability of traditional mechanical clamping. The combination of motor-driven screw and guide rail slider constructs a multi-dimensional longitudinal and transverse movement mechanism, driving the detection head 309 to scan the entire area without dead angles, completely replacing manual hand operation, avoiding errors caused by uneven manual force control and trajectory deviation, and greatly improving detection accuracy and efficiency. The electric push rod 111 can adjust the workpiece angle to adapt to the detection needs of inclined deposition surfaces, expanding the applicability of the equipment. The adjustable clamp 307 enables quick assembly and disassembly of the detection head 309 through screw transmission without complicated tools, adapting to diverse detection needs. The guiding and support design of each transmission structure ensures stable equipment operation, reduces mechanical failures, and balances detection efficiency, accuracy, and equipment durability, providing reliable assurance for semiconductor production quality control.

[0025] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0026] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An online thickness measurement system for semiconductor thin film deposition, characterized in that: include, The main structure (100) includes a base plate (101), an adjustment plate (102) located above the base plate (101), and a support plate (103) located above the adjustment plate (102). The automatic detection structure (200) includes a stroke frame (203) on the outside of the support plate (103), a motor (201) located on the upper side of the base plate (101), a screw (202) located at the output end of the motor (201), a nut (204) threaded onto the outer wall of the screw (202) and connected at one end to the outer wall of the stroke frame (203), a motor (206) located at one end of the stroke frame (203), a screw (207) located at the output end of the motor (206) and rotatably mounted inside the stroke frame (203), a nut (210) threaded onto the outer wall of the screw (207), and a stroke frame (212) located at the lower end of the nut (210). as well as; The fixed structure (300) includes a hydraulic rod (302) located inside the stroke frame (212), a mounting frame (303) located at the lower telescopic end of the hydraulic rod (302), clamping plates (307) symmetrically distributed inside the mounting frame (303), and a detection head (309) located inside the clamping plate (307).

2. The online thickness measurement system for semiconductor thin film deposition according to claim 1, characterized in that: A bearing bracket (211) is provided on the rear side of the upper end of the base plate (101). One end of the screw (202) is rotatably installed inside the bearing bracket (211). A guide rail (205) is provided on one side of the upper end of the base plate (101). A slider is provided at the lower end of the stroke frame (203) and is slidably sleeved on the outer wall of the guide rail (205).

3. The online thickness measurement system for semiconductor thin film deposition according to claim 1, characterized in that: The upper inner wall of the stroke frame (203) is provided with a guide rail (208), and the upper end of the nut (210) is provided with a slider (209) that is slidably installed on the outer wall of the guide rail (208).

4. The online thickness measurement system for semiconductor thin film deposition according to claim 1, characterized in that: The lower end of the support plate (103) is provided with a bottom box (108), and adsorption holes (107) are equally distributed inside the upper end of the support plate (103). A negative pressure pump (110) is located at one end of the bottom box (108) and the suction end penetrates the bottom box (108).

5. The online thickness measurement system for semiconductor thin film deposition according to claim 1, characterized in that: The upper end of the support plate (103) is provided with a rubber pad (109) located outside the adsorption hole (107). The upper end of the base plate (101) is provided with symmetrically distributed bearing seats (104). A rotating shaft (106) is rotatably installed inside the bearing seat (104). A bottom block (105) is sleeved on the outer wall of the rotating shaft (106) and its upper end is connected to one side of the upper end of the adjusting plate (102). An electric push rod (111) is provided on one side of the upper end of the base plate (101). A ball bearing (112) is rotatably installed inside the upper end of the electric push rod (111).

6. The online thickness measurement system for semiconductor thin film deposition according to claim 1, characterized in that: The mounting frame (303) is rotatably mounted with a screw rod (304). One end of the screw rod (304) is provided with a handle (305). The clamping plate (307) is provided with a screw hole (301) threaded to the outer wall of the screw rod (304). The upper end of the clamping plate (307) is provided with a slider (306). The upper inner wall of the mounting frame (303) is provided with a guide rail (308) that is slidably mounted with the slider (306).

7. The online thickness measurement system for semiconductor thin film deposition according to claim 1, characterized in that: A distance sensor is provided on one side of the outer wall of the stroke frame (212). The detection end of the distance sensor faces the support plate (103) and is electrically connected to the control module of the hydraulic rod (302) to provide real-time feedback on the distance between the detection head (309) and the surface of the semiconductor workpiece and to automatically adjust the extension and retraction of the hydraulic rod (302).

8. The online thickness measurement system for semiconductor thin film deposition according to claim 1, characterized in that: The clamping surface of the clamping plate (307) is provided with an arc-shaped rubber layer. The surface of the arc-shaped rubber layer is provided with anti-slip texture, and the thickness of the arc-shaped rubber layer is 2-5mm. This is used to enhance the clamping stability of the detection head (309) while avoiding surface wear.

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