Heat dissipation method of artificial intelligence computing server and application of heat dissipation method

Abstract

The invention provides a heat dissipation method and application of an artificial intelligence computing server, and the heat dissipation method comprises the steps: building a three-dimensional model of the server according to the parameters of a module in the server; the maximum heat power consumption and the maximum allowable working temperature of a main heat source in the server and the maximum allowable working environment temperature of the server are obtained; the distance between the main heat source and a fan module in the server is adjusted under the maximum heat power consumption, the maximum allowable working temperature and the maximum allowable working environment temperature, the three-dimensional model is simulated after each adjustment, and the actual working temperature of the main heat source is obtained; screening out a corresponding distance when the actual working temperature is smaller than the maximum allowable working environment temperature, and generating a corresponding distance interval; and according to the distance interval, the installation position of the fan module is determined. According to the invention, the heat dissipation efficiency of the server can be improved.

Description

Technical Field

[0001] This invention relates to the field of servers, and more particularly to a heat dissipation method for an artificial intelligence computing server and its application in servers. Background Technology

[0002] In existing server cooling designs, fan modules are typically installed in fixed positions within specific slots in the chassis. This static layout struggles to adapt to the varying heat source distribution across different server models, and under load fluctuations, cooling demands can only be compensated for by adjusting the fan module's speed (airflow). However, when the fan module is too far from the heat source, airflow attenuates significantly, requiring a substantial increase in speed to maintain cooling effectiveness, leading to a surge in power consumption and increased noise.

[0003] Furthermore, modern AI training relies entirely on large-scale GPU clusters, and the concentration of power consumption means the concentration of heat. This enormous heat generation occurs within a very small space (within the server chassis), causing a sharp increase in "heat density" (unit: kW / rack or W / square foot). If this heat cannot be removed from the chip surface in a timely and efficient manner, it will accumulate rapidly, leading to a surge in chip temperature. Currently, the placement of fan modules limits the optimization of heat dissipation efficiency, making it impossible to dynamically adjust the distance for different heat source distributions to balance heat dissipation performance and energy consumption. Secondly, simply relying on increased fan speed to compensate for distance deficiencies can easily trigger the fan's maximum speed under high temperature or high load scenarios, still posing a risk of insufficient heat dissipation or excessively low energy efficiency. Therefore, there are areas for improvement. Summary of the Invention

[0004] This invention provides a heat dissipation method and server for an artificial intelligence computing server, so as to improve the heat dissipation efficiency of the server.

[0005] This invention provides a heat dissipation method for an artificial intelligence computing server, comprising: Based on the parameters of the CPU, GPU, memory module, hard disk module, and fan module within the server, a three-dimensional model of the server is constructed. The maximum thermal power consumption and maximum allowable operating temperature of the main heat sources within the server, as well as the maximum allowable operating ambient temperature of the server, are obtained; the main heat sources include the CPU and GPU; Under the conditions of maximum thermal power consumption, maximum allowable operating temperature, and maximum allowable ambient temperature, the distance between the main heat source and the fan module inside the server is adjusted, and after each adjustment, the 3D model is simulated to obtain the actual operating temperature of the main heat source; the actual operating temperature of the main heat source... It is calculated based on the following formula: ; The ambient temperature at the server's entry point. The thermal power of the main heat source, The total thermal resistance from the main heat source to the working environment; Filter out the distances corresponding to when the actual working temperature is less than the maximum allowable working ambient temperature, and generate the corresponding distance ranges; Based on the distance range, the installation position of the fan module is determined. The fan module includes a housing, a fan bracket, a baffle, and a fan module. When the fan bracket is snapped onto the housing, a receiving groove is formed between the fan bracket and the baffle. The fan module is installed in the receiving groove. The housing has multiple opening groups. When the fan bracket is snapped onto different opening groups on the housing, the position of the fan module in the internal space of the housing will change. Obtain the current operating temperature of the main heat source, and calculate the airflow increment of the fan module based on the temperature difference between the current operating temperature and the maximum allowable operating temperature; Obtain the current airflow and current speed of the fan module, and calculate the target airflow based on the current airflow and the airflow increment; Calculate the target speed of the fan module based on the current air volume, the current speed, and the target air volume; A corresponding duty cycle signal is generated based on the target rotation speed and sent to the fan module.

[0006] In one embodiment of the present invention, the total thermal resistance It is calculated based on the following formula: ; in, The thermal resistance from the interior to the outer casing of the main heat source. The thermal resistance from the casing of the main heat source to the bottom of the fan module. The thermal resistance of the fan module to the working environment.

[0007] In one embodiment of the present invention, the thermal resistance of the fan module to the working environment... The relationship with the fan module is based on: ; in, air density, The specific heat capacity of air at constant pressure. The airflow of the fan module.

[0008] In one embodiment of the present invention, the air volume of the fan module With rotational speed The relationship is as follows: ;in, This is expressed as the target air volume; This represents the current airflow. This represents the target rotational speed of the fan module at the target airflow. This represents the current speed of the fan module at the current airflow level. The air pressure of the fan module With rotational speed The relationship is as follows: ;in, This is expressed as the target air pressure of the fan module at the target airflow. This represents the current air pressure of the fan module under the current airflow. The power consumption of the fan module With rotational speed The relationship is as follows: ;in, This represents the target power consumption of the fan module at the target airflow. This represents the current power consumption of the fan module at the current airflow level.

[0009] In one embodiment of the present invention, the heat dissipation method as described in any one of claims 1 to 4 is applied. The server includes a server body and the fan module, the fan module comprising: The housing includes a bottom plate and two side plates; The baffle is connected to the housing and is located at one end of the housing along its length. A circuit board is connected to the housing and located at the other end of the housing along the length direction; The fan bracket is snapped onto the housing; The fan module is installed in the receiving slot, and the power terminal of the fan module is electrically connected to the circuit board.

[0010] In one embodiment of the present invention, when there are multiple opening groups, the multiple opening groups are located at different positions on the shell in the length direction; When the fan bracket is engaged with different opening groups, the resulting receiving slots are adapted to different models of fan modules.

[0011] In one embodiment of the present invention, the opening assembly includes two edge notches, which are respectively formed on two side plates; the fan bracket includes: Fan bracket; The housing has two snap-fit ​​parts; in the width direction of the housing, the two snap-fit ​​parts are respectively connected to both ends of the fan frame; one end of the snap-fit ​​part is connected to the fan frame, and the other end extends along the width direction; In the depth direction of the housing, the snap-fit ​​portion slides into the edge notch of the corresponding side plate.

[0012] In one embodiment of the present invention, the opening assembly includes a positioning groove formed on the base plate; the fan bracket includes: Fan bracket; A positioning protrusion, one end of which is connected to the fan bracket, and the other end extends toward the bottom plate along the depth direction of the housing; In the depth direction of the housing, the positioning protrusion is engaged in the positioning groove.

[0013] In one embodiment of the present invention, the fan bracket further includes a bent edge and a limiting block. The number of bent edges is two, and the two bent edges are respectively connected to both ends of the fan bracket. The number of limiting blocks is two and they are respectively installed on the two bent edges.

[0014] In one embodiment of the present invention, the fan module includes a first fan and a second fan.

[0015] The beneficial effects of this invention are as follows: By fixing the position of the fan module's receiving slot and the distance to the heat source to a pre-optimized value during the design phase, the physical positional relationship between the fan module and the main heat source is locked at the hardware level. This directly eliminates the hidden danger of distance deviation caused by assembly or vibration, ensuring that the heat dissipation airflow is always in the best matching state. This significantly reduces the attenuation of airflow efficiency due to distance deviation, avoids the high energy consumption and noise cost of forcibly increasing the fan speed to compensate for distance deviation, and fundamentally ensures the stable coverage of the heat source by the airflow. This effectively solves the risk of junction temperature runaway caused by positional uncertainty in the heat dissipation system. Attached Figure Description

[0016] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0017] In the attached diagram: Figure 1 A flowchart illustrating a server heat dissipation method according to an embodiment of the present invention; Figure 2 This is a schematic diagram of a fan module without a fan module installed in an embodiment of the present invention; Figure 3 for Figure 2 Another structural diagram from a different perspective; Figure 4 for Figure 2 A schematic diagram of a fan module assembly in the middle; Figure 5This is a schematic diagram of another structure of a fan module without a fan module installed, according to an embodiment of the present invention; Figure 6 for Figure 5 Another structural diagram of the fan module assembly; Figure 7 This is a schematic diagram of the fan bracket structure in one embodiment of the present invention; Figure 8 This is a schematic diagram of the positioning element in one embodiment of the present invention.

[0018] The reference numerals in the attached drawings are as follows: 10, housing; 11, base plate; 111, positioning groove; 112, fixing block; 12, side plate; 121, edge notch; 122, positioning through hole; 123, edge notch; 20, baffle; 21, handle; 30, positioning component; 31, snap-fit ​​spring; 32, snap-fit ​​block; 33, bending part; 34, pressing part; 40, fan bracket; 41, fan frame; 42, snap-fit ​​part; 43, bending edge; 44, limiting block; 45, positioning protrusion; 50, first fan; 60, second fan; 70, circuit board; 71, through hole; 72, power connection terminal; 73, first power supply terminal; 74, second power supply terminal. Detailed Implementation

[0019] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0020] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. The drawings only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0021] In the following description, numerous details are explored to provide a more thorough explanation of embodiments of the invention. However, it will be apparent to those skilled in the art that embodiments of the invention may be practiced without these specific details. In other embodiments, well-known structures and devices are shown in block diagram form rather than in detail to avoid obscuring embodiments of the invention.

[0022] Please see Figure 1This invention provides a heat dissipation method for servers, which can be applied to servers and may include the following steps: Step S10: Construct a 3D model of the server based on the parameters of all modules within the server; Step S20: Obtain the maximum thermal power consumption and maximum allowable operating temperature of the main heat sources in the server, as well as the maximum allowable operating ambient temperature of the server; Step S30: Adjust the distance between the main heat source and the fan module inside the server under the maximum thermal power consumption, maximum allowable operating temperature, and maximum allowable operating ambient temperature, and simulate the three-dimensional model after each adjustment to obtain the actual operating temperature of the main heat source. Step S40: Filter out the distances corresponding to when the actual working temperature is lower than the maximum allowable working ambient temperature, and generate the corresponding distance ranges; Step S50: Determine the installation location of the fan module based on the distance range.

[0023] In some embodiments, when performing step S10, specifically, a three-dimensional model containing the assembly relationships of all modules is constructed based on the physical dimensions, spatial layout coordinates, and electrical connection topology parameters of the CPU, GPU, memory module, hard disk module, and fan module within the server. This three-dimensional model can be imported using thermal simulation software (such as ANSYS Icepak or Flotherm), and meshed based on the actual internal structure of the server chassis. Unstructured meshes are used to refine the fan module impeller area, boundary layer meshes are used to refine the heat sink fin area, and a hybrid mesh dominated by hexahedrons is used for other areas to ensure that the model accurately reflects the heat exchange process between airflow and solid surfaces.

[0024] In some embodiments, when performing step S20, the main heat sources within the server may specifically include the CPU and GPU. The maximum thermal power consumption and maximum allowable operating temperature of the main heat sources can be obtained from their design parameters. For example, the CPU's maximum thermal power consumption is 200W (corresponding to full load operation), and its maximum allowable operating temperature is 95°C; the GPU's maximum thermal power consumption is 300W, and its maximum allowable operating temperature is 85°C. The server's maximum allowable ambient temperature can also be obtained from the server's design parameters. For example, the server's maximum allowable ambient temperature is 40°C (i.e., the maximum ambient temperature limit at the server's air intake).

[0025] In some embodiments, when performing step S30, specifically, under constraints of maximum thermal power consumption (e.g., CPU = 200W, GPU = 300W), maximum allowable operating temperature (e.g., CPU = 95℃, GPU = 85℃), and maximum allowable ambient temperature (e.g., 40℃), the straight-line distance between the fan module mounting slot and the CPU heatsink base is adjusted. After each adjustment, the fan module's pressure-volume performance curve (P-CFM curve) is loaded into the thermal simulation software, and computational fluid dynamics simulation is performed. By numerically solving the three-dimensional Navier-Stokes equations, energy conservation equations, and turbulence models, the velocity distribution, pressure field, and temperature field changes of the airflow through the heatsink fins at the fan outlet at a set distance are simulated. Based on the simulation results, the actual operating temperatures of the CPU and GPU chips are output until the minimum critical distance (e.g., 7cm for CPU) and the maximum critical distance (e.g., 12cm for CPU) that satisfy the requirement that the actual operating temperature is lower than the maximum allowable operating temperature are found, thus forming a safe installation distance range for the fan module.

[0026] In some embodiments, when performing step S40, specifically, based on the adjustment of the distance between the fan module and the main heat source and the thermal simulation results, all test data points in the simulation experiments whose actual operating temperature is lower than the maximum allowable operating temperature of the corresponding heat source are screened. For example, the actual operating temperature of the CPU must be lower than 95℃ and the actual operating temperature of the GPU must be lower than 85℃ as valid criteria, and the set of fan module installation distance values ​​corresponding to satisfy the criteria is extracted (e.g., the actual operating temperature of the CPU is 93℃ when the distance d1=5cm, 88℃ when d2=8cm, 94℃ when d3=11cm, etc.). The minimum critical value (e.g., 7cm) and the maximum critical value (e.g., 12cm) of this set of distance values ​​are statistically analyzed to generate the fan module installation distance range [7cm, 12cm]. This distance range indicates that when the straight-line distance between the fan module installation position and the CPU is within this range, under the given maximum thermal power consumption, maximum allowable operating temperature, and maximum allowable operating ambient temperature, it can be ensured that the actual operating temperature of the CPU will not exceed 95℃.

[0027] In some embodiments, when performing step S50, specifically, based on the generated distance range and combined with the spatial layout constraints inside the server chassis, the final installation position of the fan module receiving slot is determined. First, it is verified whether the safe distance range overlaps with the available physical clearance within the chassis. For example, if the available space around the CPU ranges from 5cm to 15cm, then the effective installation area overlapping with the distance range is [7cm, 12cm]. Within the overlapping area, an optimized target position is selected. If noise reduction is prioritized, the lower distance limit is chosen (closer to 7cm, where a smaller airflow is sufficient for heat dissipation). If heat dissipation redundancy is required, the upper distance limit is chosen (closer to 12cm, to avoid overheating interference from nearby heat sources). Finally, the selected distance (e.g., 9cm) is fixed as the positioning size of the receiving slot opening in the chassis metal plate, ensuring that the straight-line distance between the fan module's impeller plane and the CPU is precisely maintained at 9cm after the fan module is inserted.

[0028] In some embodiments, the actual operating temperature of the primary heat source (Junction Temperature, in °C) is calculated using the following formula: . The ambient temperature (in °C) at the server's entry point. The heat power (in W) of the main heat source. The total thermal resistance from the main heat source to the working environment (unit: °C / W).

[0029] In some embodiments, total thermal resistance It is calculated based on the following formula: . The internal thermal resistance to the outer casing, which is the main heat source (a fixed value determined by the chip package). The thermal resistance from the housing, which is the main heat source, to the bottom of the fan module (e.g., determined by thermal grease / pads). This refers to the thermal resistance from the fan module to the operating environment.

[0030] In some embodiments, the thermal resistance of the fan module to the operating environment The relationship with the fan module is based on: . Air density (unit: air density) ). Specific heat capacity at constant pressure (in units of air) ). The airflow of the fan module (Cubic Feetper Minute, in units of...) Therefore, it is necessary to reduce the actual operating temperature of the main heat source. The total thermal resistance must be reduced. This reduces the thermal resistance of the fan module to the operating environment. It is to reduce the total thermal resistance A key step is to increase the fan module's airflow (CFM), which can effectively reduce the thermal resistance between the fan module and the working environment. This compensates for the decrease in heat dissipation performance caused by the increased distance between the fan module and the main heat source.

[0031] In some embodiments, the airflow of the fan module With rotational speed The relationship is as follows: ,in, This is expressed as the target air volume. This represents the current airflow. This represents the target rotational speed of the fan module at the target airflow. This represents the current speed of the fan module at the current airflow. The fan module's air pressure. With rotational speed The relationship is as follows: ,in, This represents the target air pressure of the fan module at the target airflow. This represents the current air pressure of the fan module at the current airflow level. The power consumption of the fan module. With rotational speed The relationship is as follows: ,in, This represents the target power consumption of the fan module at the target airflow. This represents the current power consumption of the fan module at the current airflow level.

[0032] In some embodiments, it is assumed that the current speed of the fan module is... The current airflow is 6000 RPM. The current wind pressure is 100. For 0.1 inch-H2O, the current power consumption The value is 20 W. If the current airflow needs to be increased by 20% to the target airflow to cope with the higher heat dissipation inside the server, then according to the above calculation formula, the converted target speed is... The target wind pressure is 7200 RPM. Target power consumption is 0.144 inch-H2O. The power consumption is 34.56 W, at which point a sharp increase in power consumption will occur.

[0033] In some embodiments, the airflow velocity decreases with increasing distance after exiting the fan outlet of the fan module. For a free-flow axial fan, the velocity at a point on its central axis is... With export flow rate The relationship can be approximated as: .in, This is represented as the distance from the fan outlet. airflow velocity at a location, in units . This represents the airflow velocity at the fan outlet, in m / s. The effective area of ​​the fan outlet is expressed in units of... . It is expressed as an empirical attenuation coefficient, which is related to the fan impeller design and turbulence intensity (usually measured experimentally). It is expressed as the distance from the fan outlet to the main heat source, in units of 1. .

[0034] In some embodiments, the heat dissipation method may further include the following steps: obtaining the current operating temperature of the main heat source, and calculating the airflow increment of the fan module based on the temperature difference between the current operating temperature and the maximum allowable operating temperature; obtaining the current airflow and current speed of the fan module, and calculating the target airflow based on the current airflow and airflow increment; calculating the target speed of the fan module based on the current airflow, current speed, and target airflow; generating a corresponding duty cycle signal based on the target speed, and sending it to the fan module.

[0035] In some embodiments, the server's BMC (Baseboard Management Controller) can continuously collect the ambient temperature at the server's inlet using an array of temperature sensors (such as CPU core sensors, GPU hotspot sensors, and air inlet environmental sensors) distributed on the motherboard. The current operating temperature of the main heat source directly reflects the chip's thermal load status. When the current operating temperature approaches the chip's maximum allowable operating temperature, the airflow regulation process is triggered.

[0036] In some embodiments, the BMC can calculate the required airflow increment based on a safety margin between the current operating temperature and the maximum allowable operating temperature using a preset strategy. That is, based on the temperature difference between the current operating temperature and the maximum allowable operating temperature, the smaller the temperature difference, the larger the required airflow increment. For example, this can be achieved by calling a temperature-airflow mapping table pre-installed in the firmware. For instance, when the current operating temperature reaches 85°C (the maximum allowable operating temperature is 90°C), the table shows a corresponding airflow increment of 20%, meaning the target airflow is 120% of the current airflow. Alternatively, if the temperature continues to rise, using 90°C as the target value and 85°C as the input, the proportional error coefficient and the accumulated integral (such as the temperature rise rate over the past 10 seconds) are calculated, and the airflow adjustment proportional factor is output to finally calculate the target airflow. This calculation process ensures that the airflow increases non-linearly with the temperature rise rate.

[0037] In some embodiments, the BMC can convert the target airflow into a target speed according to the above formula. After obtaining the target speed, the BMC generates a duty cycle signal through the PWM (Pulse Width Modulation) controller on the circuit board, calculates the duty cycle of the PWM signal, and outputs the calculated PWM signal to the fan module's interface (power supply / ground / speed feedback / PWM control line). After receiving the PWM signal, the internal brushless motor driver adjusts the stator winding current. At this time, the fan module's speed changes, and the air pressure and airflow change accordingly, thereby ensuring effective heat dissipation of the heat source under different loads.

[0038] Please see Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 The present invention provides a server that can apply the above-described heat dissipation method. The server may include a server body and a fan module. The fan module may include a housing 10, a baffle 20, a positioning component 30, a fan bracket 40, a fan module, and a circuit board 70.

[0039] In some embodiments, the housing 10 may include a base plate 11 and two side plates 12. The base plate 11 and the two side plates 12 together form a U-shaped groove structure.

[0040] In some embodiments, the base plate 11, serving as the foundation of the housing 10, can be a sheet material with a specific length and width, forming the bottom bearing surface of a U-shaped channel structure. The base plate 11 is primarily used to mount the circuit board 70 and provides a direct support base for the fan bracket 40 and the ultimately installed fan module. The surface of the base plate 11 is flat.

[0041] In some embodiments, the two side plates 12 are respectively connected to the edges on both sides of the base plate 11 along its length and extend upwards in a direction perpendicular to the base plate 11. Each side plate 12 is a flat plate structure, and its height is set according to the requirements of the fan module. The two side plates 12 and the base plate 11 form a fixed angle relationship of nearly right angle at the connection point to define the internal space range of the fan module. The outer surface of the side plate 12 can form the main contact surface for mating with the chassis or rails of the server body.

[0042] In some embodiments, the base plate 11 and the two side plates 12 are spatially interconnected, together forming a U-shaped trough structure open at the top. The base plate 11 forms the bottom of the U-shaped trough structure, and the two side plates 12 form the vertical walls on both sides of the U-shaped trough structure. The U-shaped trough structure has an internal space that extends lengthwise between the two side plates 12, widthwise above the base plate 11, and depthwise from the base plate 11 to the top edge of the side plates 12.

[0043] In some embodiments, the housing 10 can be a one-piece molded structure, meaning that the base plate 11 and the two side plates 12 are single, indivisible components formed in one step from a single piece of sheet material through a specific manufacturing process (such as stamping and precision bending of metal sheet). In this configuration, the connection between the base plate 11 and the side plates 12 forms a natural transition through the continuity of the material, ensuring the integrity and mechanical strength of the structure.

[0044] In some embodiments, the housing 10 can be a split structure, that is, the base plate 11 and the two side plates 12 are each independent components. After manufacturing, these three independent components are firmly assembled and connected at the two side edges of the base plate 11 and the bottom edge of the side plates 12 by mechanical connection (e.g., using screws, rivets, or welding) to finally form a complete housing 10.

[0045] Please see Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 In some embodiments, the baffle 20 is connected to the housing 10 and is located at one end of the U-shaped groove structure along its length. A handle 21 may be mounted on the baffle 20.

[0046] In some embodiments, the baffle 20 is a plate-like structure with a specific shape (which may have multiple openings for ventilation). The shape of the baffle 20 needs to match the end cross-sectional profile of the housing 10 to ensure a tight cover or fit to one end of the housing 10. The connection between the baffle 20 and the housing 10 can be achieved through various mechanical means. For example, mounting holes can be provided on the baffle 20, and threaded holes or nut posts can be provided in the corresponding end areas of the side plate 12 or bottom plate 11 of the housing 10. Screws are then passed through the mounting holes of the baffle 20 and screwed into the corresponding positions of the housing 10 for fixation. Alternatively, a snap-fit ​​structure can be provided on the edge of the baffle 20 so that it can snap into the groove or slot provided at the corresponding end of the housing 10 to form a snap-fit. Alternatively, the edge of the baffle 20 can be directly and firmly joined to the end of the housing 10 by spot welding or bonding.

[0047] In some embodiments, a handle 21 designed for manual operation may be installed on the outer surface of the baffle 20. The handle 21 may be shaped to fit a human hand, and may be a curved metal rod, a plastic pull ring, a stamped recessed structure, or any form that facilitates finger insertion and gripping. When the operator needs to install or remove the entire fan module, they can grip or hook the handle 21 with their fingers and then apply a pulling force (for pulling out) or a pushing force (for inserting) along the guide rail / slot on the side plate 12 of the housing 10. By operating the handle 21, the operator can safely and efficiently perform hot-plugging operations of the fan module in the server body.

[0048] Please see Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 In some embodiments, the fan bracket 40 can be snapped onto the housing 10, and the U-shaped groove between the fan bracket 40 and the baffle 20 forms a receiving groove. The fan module can be installed in the receiving groove.

[0049] In some embodiments, the fan bracket 40 may be shaped as a frame or a grid. The fan bracket 40 is provided with a snap-fit ​​structure, and the housing 10 is provided with a retaining structure (i.e., an opening assembly) that matches the snap-fit ​​structure.

[0050] In some embodiments, the receiving slot is a space formed inside the housing 10 for loading a fan module. The bottom plate 11 forms the bottom surface of the receiving slot, and the inner walls of the two side plates 12 form the two side walls of the receiving slot. The inner wall of the baffle 20, which is connected to one end of the housing 10 along the length of the U-shaped slot structure, forms one end face of the receiving slot. When the fan bracket 40 is installed onto the housing 10 by snap-fit, its surface facing the baffle 20 forms the other end face of the receiving slot (i.e., the end opposite to the baffle 20). Therefore, the inner wall of the baffle 20, the surface formed after the fan bracket 40 is installed, the inner surface of the bottom plate 11 of the housing 10, and the inner wall surfaces of the two side plates 12 together enclose a receiving slot for placing and fixing the fan module.

[0051] Please see Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 In some embodiments, at least one set of openings is also formed on the housing 10. When there are multiple sets of openings, the multiple sets of openings are located at different positions on the housing 10 along the length of the U-shaped groove structure.

[0052] In some embodiments, at least one set of openings is formed on the housing 10. An opening set refers to one or more openings or notches that engage with snap-fit ​​structures on the fan bracket 40. An opening set may include opening structures that allow the fan bracket 40 to engage in a fixed position.

[0053] In some embodiments, when the number of opening groups designed on the housing 10 is multiple, the multiple opening groups are respectively arranged at different positions on the housing 10 along the length direction of the U-shaped groove structure. That is, along the length direction of the housing 10 (from the connecting end of the baffle 20 to the other open end or the circuit board mounting end), the multiple opening groups are arranged separately in the length direction and occupy different position points.

[0054] In some embodiments, when the fan bracket 40 engages with different opening groups on the housing 10, its position within the internal space of the housing 10 changes. Specifically, after the fan bracket 40 engages with opening groups at different positions along the length of the housing 10, the final position of the fan bracket 40 within the receiving groove is determined.

[0055] In some embodiments, changes in the position of the fan bracket 40 directly affect the actual dimensions of the receiving slot in the length direction. Therefore, when the fan bracket 40 is engaged with openings at different positions, the dimensions (mainly the length dimension) of the resulting receiving slot will change accordingly. This change in the dimensions of the receiving slot is intended to accommodate the installation of fan modules of different models and specifications.

[0056] Please see Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 In some embodiments, when the fan bracket 40 is engaged with different opening groups, the resulting receiving slots are adapted to different models of fan modules. Taking two opening groups as an example, the fan module can be divided into a first fan 50 and a second fan 60. The first fan 50 can be a 4028 fan, and the second fan 60 can be a 4056 fan.

[0057] In some embodiments, when the fan bracket 40 snaps into the opening assembly near the baffle 20, the resulting receiving slot is shorter and further back, and this size of receiving slot can accommodate the installation of a fan module of model 4028 (i.e., the first fan 50).

[0058] In some embodiments, when the fan bracket 40 snaps into the opening assembly located away from the baffle 20 (closer to the other end of the housing 10), the resulting receiving slot is longer and more forward, and this size of receiving slot can accommodate the installation of a fan module of model 4056 (i.e., the second fan 60).

[0059] In some embodiments, by simply changing the specific opening group position where the fan bracket 40 snaps onto the housing 10, a receiving slot that accommodates the required space size for different types of fan modules (such as 4028 or 4056) can be flexibly formed, thus realizing the function of a fan bracket frame being compatible with multiple fan models.

[0060] Please see Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 In some embodiments, the opening assembly includes two positioning through holes 122, which are respectively formed on the two side plates 12.

[0061] In some embodiments, each set of openings may include two positioning through holes 122. The two positioning through holes 122 are symmetrically arranged on both sides of the housing 10, that is, one positioning through hole 122 is opened on the left side plate 12, and the other positioning through hole 122 is opened on the right side plate 12. Each positioning through hole 122 is a hole that penetrates the thickness of the corresponding side plate 12. The shape of the positioning through hole 122 may be circular, square, or other polygonal, and its size needs to match the limiting block 44 that will be mated. The positioning through hole 122 can provide a space to accommodate and hold the limiting block 44, so that after the limiting block 44 is inserted, it can restrict the degree of freedom of the fan bracket 40 in multiple directions, thereby fixing the fan bracket 40 in the corresponding position.

[0062] Please see Figure 7 In some embodiments, the fan bracket 40 includes a fan frame 41, a bent edge 43, and a limiting block 44. The bent edge 43 is an elastic element, and there are two bent edges 43. In the width direction of the U-shaped groove structure, the two bent edges 43 are respectively connected to both ends of the fan frame 41. One end of the bent edge 43 is connected to the fan frame 41, and the other end extends along the length direction. There are two limiting blocks 44, each mounted on one of the two bent edges 43.

[0063] In some embodiments, the fan bracket 41 may be a frame with holes and support bars. One end of the fan module may be fixed to the fan bracket 41 by bolts 80, plastic rubber nails or other means, and the other end of the fan module may also be fixed to the baffle 20 by bolts 80, plastic rubber nails or other means.

[0064] In some embodiments, a bent edge 43 is connected to each of the two side edges of the fan frame 41 along the width direction of the U-shaped groove structure. The bent edge 43 is a component with specially designed connection and elastic deformation functions. The main body of the bent edge 43 is a long strip structure. One end of the bent edge 43 (the end closer to the main body of the fan frame 41) is firmly connected to the fan frame 41. The other end of the bent edge 43 extends freely along the length direction of the U-shaped groove structure.

[0065] In some embodiments, a limiting block 44 is installed on the outer side of the free extension portion of each bend 43 (i.e., on the side facing the inner wall of the side plate 12 of the housing 10). The limiting block 44 is a protrusion protruding from the surface of the bend 43. The limiting block 44 can be fixed to the bend 43 by welding, riveting, or snap-fitting, or it can be an integrally formed boss during the manufacturing of the bend 43 (e.g., stamping). The shape and size of the limiting block 44 need to be precisely matched with the corresponding positioning through hole 122 on the side plate 12 of the housing 10 to ensure that the limiting block 44 can be smoothly inserted into the positioning through hole 122 and form an effective snap-fit ​​within the hole. The length of the limiting block 44 should at least ensure that a portion of it can pass through the positioning through hole 122 to achieve the purpose of snap-fitting.

[0066] In some embodiments, when the bent edge 43 is not subjected to external force, the bending angle formed at the connection between the bent edge 43 and the fan frame 41 is greater than 90°. After the bent edge 43 is attached to the corresponding side plate 12, the bent edge 43 undergoes elastic deformation, and the limiting block 44 on the bent edge 43 is engaged in the positioning through hole 122 on the corresponding side plate 12.

[0067] In some embodiments, when the bent edge 43 is in a natural static state (i.e., without any external force), the bending angle formed at its connection with the fan frame 41 body is greater than 90°. That is, the bent edge 43 is in a state of outward tilting relative to the fan frame 41 at its connection point. Each bent edge 43 is made of a material with good elasticity (such as spring steel sheet), which allows it to undergo elastic deformation when subjected to external force and to substantially return to its original shape and angle after the external force is removed.

[0068] Please see Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 In some embodiments, the opening assembly further includes two edge notches 123, which are formed on the two side plates 12 and located on one side of the corresponding positioning through hole 122. After the bent edge 43 is fitted to the corresponding side plate 12, a portion of the surface of the bent edge 43 is exposed from the interior of the side plate 12 through the edge notches 123.

[0069] In some embodiments, each edge notch 123 is a notch structure of a specific shape formed on the edge of the side plate 12 of the housing 10 (i.e., the edge of the side plate 12 facing inward towards the inside of the housing 10). This notch is cut inward (i.e. away from the edge) to a certain depth from the originally smooth edge line of the side plate 12, thereby creating a recessed area or a slotted area in the edge region of the side plate 12. For a positioning through hole 122 and an edge notch 123 provided on the same side plate 12, the edge notch 123 needs to be set at an adjacent position in the horizontal direction of the positioning through hole 122 (e.g., on the left or right side), the two are closely adjacent to each other in position, and the opening of the edge notch 123 is spatially connected to or adjacent to the positioning through hole 122.

[0070] In some embodiments, the core function of the edge notch 123 is achieved when the fan bracket 40 is installed and snapped into place. When the fan bracket 40 needs to be snapped into a set of openings on the housing 10, the fan bracket 40 is first placed in place and an external force is applied to it, forcing the two bent edges 43 of the fan bracket 40 to elastically bend inward from an angle greater than 90° from their natural state until the outer surface of each bent edge 43 finally fits completely against the inner wall of the corresponding side plate 12 of the housing 10.

[0071] In some embodiments, during the process of the bent edge 43 being tightly fitted to the inner wall of the side plate 12, the area on the main structure of the bent edge 43 corresponding to the position of the edge notch 123 is located directly behind the opening formed by the edge notch 123 on the side plate 12. Since the edge notch 123 is a notch formed by slotting inward from the edge of the side plate 12, the outer surface area of ​​the bent edge 43 that should have been blocked and covered by the solid material of the side plate 12 can now be directly contacted from the outside. The edge notch 123 is similar to a channel, providing the operator with a channel to directly contact the bent edge 43 after the bent edge 43 is installed and fitted, so that the surface of this part of the bent edge 43 is no longer completely covered by the material of the side plate 12, but is directly exposed to the external environment. Thus, the operator can squeeze the bent edge 43 through the edge notch 123 to realize the installation and removal of the fan bracket 40.

[0072] Please see Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 In some embodiments, the opening assembly further includes two edge notches 121, which are respectively formed on the two side plates 12. The fan bracket 40 also includes two snap-fit ​​portions 42. In the width direction of the U-shaped groove structure, the two snap-fit ​​portions 42 are respectively connected to both ends of the fan bracket 41. One end of the snap-fit ​​portion 42 is connected to the fan bracket 41, and the other end extends in the width direction. In the depth direction of the U-shaped groove structure, the snap-fit ​​portion 42 slides into the edge notch 121 on the corresponding side plate 12.

[0073] In some embodiments, the two edge notches 121 are symmetrically positioned, with one edge notch 121 formed on the left side plate 12 and the other edge notch 121 formed on the right side plate 12. Each edge notch 121 is a continuous slot machined into the edge of the side plate 12 of the housing 10. This notch is a groove-like structure extending inward from the edge of the side plate 12 (i.e., away from the edge, and perpendicular to both the length and width directions) for a certain distance. Its shape can be rectangular, U-shaped, or other regular geometric shapes. The top of the edge notch 121 is open, and the bottom is closed. The edge notch 121 forms a channel that can accommodate the snap-fit ​​portion 42. The length direction of the edge notch 121 generally extends along the width direction of the side plate 12.

[0074] In some embodiments, the snap-fit ​​portion 42 is a protrusion or extension structure with a specific shape. One end of the snap-fit ​​portion 42 is firmly connected to the main structure of the fan bracket 41. This connection can be achieved by welding, riveting, or by forming it integrally with the fan bracket 41 during the manufacturing of the fan bracket 40 through stamping or bending processes. The other end of the snap-fit ​​portion 42 is not a free end, but extends a certain distance along the width direction of the U-shaped groove structure.

[0075] In some embodiments, when the fan bracket 40 needs to be installed into the housing 10, the initial installation steps involve guiding and aligning the snap-fit ​​portions 42. The fan bracket 40 is inserted into the U-shaped groove of the housing 10 along the depth direction of the U-shaped groove. During this process, it is necessary to ensure that the two snap-fit ​​portions 42 of the fan bracket 40 are respectively aligned with the pre-formed edge notches 121 on the two side plates 12 of the housing 10.

[0076] Please see Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 In some embodiments, the opening assembly further includes a positioning groove 111, which may be formed on the base plate 11. The fan bracket 40 also includes a positioning protrusion 45, one end of which is connected to the fan bracket 41, and the other end extends toward the base plate 11 along the depth direction of the U-shaped groove structure. The positioning protrusion 45 is engaged within the positioning groove 111 along the depth direction of the U-shaped groove structure.

[0077] In some embodiments, the positioning groove 111 is a feature structure formed on the base plate 11 of the housing 10. The positional distribution of the positioning groove 111 on the base plate 11 needs to be spatially coordinated with other structures in the opening assembly (such as the positioning through-hole 122 on the side plate 12). The opening direction of the positioning groove 111 is towards the internal space of the housing 10, that is, it opens upwards towards the depth direction of the U-shaped groove structure. The positioning groove 111 is a groove structure recessed downwards into the surface of the base plate 11. The cross-sectional shape of the positioning groove 111 can be rectangular, trapezoidal, semi-circular, or other regular geometric shapes, and its depth, width, and length dimensions are designed to adapt to the positioning protrusion 45 that will be mated with it. The positioning groove 111 can be used to provide guidance and final locking position for the positioning protrusion 45 in the depth direction, constrain the fan bracket 40 in the depth direction and horizontal plane, and enhance its installation stability.

[0078] In some embodiments, the number of positioning protrusions 45 is at least one, and can be corresponding to the number of positioning slots 111. The positioning protrusion 45 is a raised structure on the fan bracket 40. One end of the positioning protrusion 45 is securely connected to the bottom surface of the fan frame 41 (i.e., the surface of the fan frame 41 facing the base plate 11). This connection can be welding, riveting, bolting, or an integral structure formed with the fan frame 41 by stamping or casting. The positioning protrusion 45 extends downward a certain distance from the bottom surface of the fan frame 41 along the depth direction of the U-shaped groove structure. The length of the positioning protrusion 45 in the depth direction should be sufficient to insert into the positioning slot 111. The main body shape of the positioning protrusion 45 needs to match the internal shape of the positioning slot 111 to ensure smooth insertion and final engagement.

[0079] In some embodiments, the number of positioning members 30 may be one or two. When there is one positioning member 30, the positioning member 30 is connected to either side plate 12. When there are two positioning members 30, the two positioning members 30 are respectively connected to the two side plates 12.

[0080] In some embodiments, inside the U-shaped groove structure, one end of the positioning member 30 is connected to the side plate 12, and the other end of the positioning member 30 passes through the opening of the baffle 20. The width of the opening of the baffle 20 is greater than the thickness of the positioning member 30. The positioning member 30 is an elastic member.

[0081] In some embodiments, within the U-shaped groove structure of the housing 10, each positioning member 30 is fixed to the corresponding side plate 12 via one end. The end of the positioning member 30 connected to the side plate 12 is a fixed anchor end, while the other end is designed as a free-moving end facing inwards, passing through an opening pre-set in the baffle 20. The opening in the baffle 20 is wider than the thickness of the positioning member 30 at that location, providing necessary clearance for the movement of the positioning member 30 within this opening area, avoiding additional friction or constraint. The positioning member 30 is an elastic element made of an elastic material, such as spring steel or other materials with similar properties, capable of deforming under external force and returning to its original shape after the force is removed, thereby achieving an elastic locking function.

[0082] In some embodiments, when the fan module is installed inside the server body, the positioning member 30 is attached to the side plate 12, and the snap-fit ​​block 32 on the positioning member 30 passes through the opening of the side plate 12 and is located in the snap-fit ​​slot inside the server body.

[0083] In some embodiments, the positioning member 30 takes one form when the fan module is normally installed and fixed inside the server body. In this form, the main body of the positioning member 30 is in a relaxed state or only slightly pre-tightened state, so that the positioning member 30 is in contact with the inner wall of the side plate 12 to which it is connected (or in a preset static position according to the design). At this time, the snap-fit ​​block 32 provided on the positioning member 30 has passed through the opening reserved on the side plate 12 (this opening is different from the opening of the baffle 20) and protrudes from the outer surface of the side plate 12. This snap-fit ​​block 32, which passes through the opening of the side plate 12 and is located outside the side plate 12, can be embedded or hooked into a corresponding snap-fit ​​slot structure provided on the internal rack of the server body or an adjacent structural component. After the snap-fit ​​block 32 enters the snap-fit ​​slot, an effective locking engagement is achieved, preventing the fan module from accidentally loosening or sliding out of the server body.

[0084] In some embodiments, when the fan module is in the plug-in / plug-out state, the positioning member 30 is pressed by an external force to produce elastic deformation, and the snap-fit ​​block 32 on the positioning member 30 after elastic deformation separates from the snap-fit ​​groove.

[0085] In some embodiments, the positioning member 30 needs to be operated when a fan module insertion / removal operation is required (i.e., when the fan module needs to be removed from or inserted into the server body). At this time, a specific external force (e.g., applying force to the pressing part 34) must be applied to the positioning member 30. When this external force acts on the pressing part 34 of the positioning member 30, the main structure of the positioning member 30 will undergo significant elastic bending or torsional deformation due to the elastic properties of its material. This deformation will cause the latching block 32, which is integrated with the positioning member 30, to displace. Through a specific deformation path and direction design, at the same time as the deformation occurs, the latching block 32 will completely move out of the internal latching slot of the server body that it was previously latched in, achieving disengagement. Only in this state of disengagement between the latching block 32 and the latching slot can the fan module smoothly slide out or be inserted into the server body.

[0086] Please see Figure 8 In some embodiments, the positioning member 30 includes a snap-fit ​​spring 31, a snap-fit ​​block 32, a bending portion 33, and a pressing portion 34. The snap-fit ​​spring 31 is an elastic member, with one end connected to the side plate 12 and the other end passing through the opening of the baffle 20. The snap-fit ​​block 32 is connected to the snap-fit ​​spring 31. The bending portion 33 is connected to the other end of the snap-fit ​​spring 31. The pressing portion 34 is connected to the other end of the snap-fit ​​spring 31 through the bending portion 33. When the pressing portion 34 is pressed by an external force in the direction toward the other side plate 12, the pressing portion 34 causes the snap-fit ​​spring 31 to undergo elastic deformation.

[0087] In some embodiments, the snap-fit ​​spring 31 is the core elastic body of the positioning member 30, and it is itself an elastic element that meets the overall elastic requirements of the positioning member 30. The snap-fit ​​spring 31 can be a thin sheet structure with a certain length and width. One end (fixed end) of the snap-fit ​​spring 31 is firmly connected to the side plate 12 of the housing 10, for example, by riveting, screwing, or welding. The other end (free-moving end) of the snap-fit ​​spring 31 is positioned towards the baffle 20 and passes through the opening provided on the baffle 20 after installation and positioning. The snap-fit ​​spring 31 achieves the snap-fit ​​and release action through its own elastic deformation capability.

[0088] In some embodiments, the latching block 32 is a component on the positioning member 30 responsible for the final mechanical locking / unlocking. The latching block 32 is directly and fixedly connected to a specific location on the surface of the snap-fit ​​spring 31 (e.g., near the free-moving end). The shape of the latching block 32 can be a protrusion or hook-like structure with a certain thickness and height. Its shape and size must be able to effectively insert into and hook into the internal latching slot of the server body to generate a reliable latching force.

[0089] In some embodiments, a bend 33 is connected to the free-moving end region of the snap-fit ​​spring 31. The bend 33 can be a bend structure at a specific angle (such as an L-shaped bend, a U-shaped bend) or an additional connecting member. The bend 33 can change the direction of movement. The bend 33 is directly connected to the end of the free-moving end of the snap-fit ​​spring 31. A pressing part 34 can be installed on the bend 33. The pressing part 34 is the part that the operator directly contacts and applies external force to, and can be designed as a plate-shaped, block-shaped, or wing-shaped structure that is easy to press with fingers. The pressing part 34 is connected to the end of the free-moving end of the snap-fit ​​spring 31 through the bend 33. The direction of the external force applied to the pressing part 34 is defined as the direction toward the other side plate 12 (i.e., horizontal and perpendicular to the side plate 12 and pointing toward the other side plate 12). A plastic protective sleeve can be configured on the pressing part 34.

[0090] In some embodiments, when an operator needs to unlock the positioning member 30 to remove the fan module, a horizontal pressing force can be applied to the pressing part 34 with one or two fingers in the direction toward the other side plate 12. This external force is transmitted through the rigid bending part 33 (as a lever or linkage mechanism) and acts on the free movable end of the latching spring 31. The downward pressing motion of the pressing part 34 drives the free end of the latching spring 31 to rotate or bend laterally around its fixed end, forcing the entire body of the latching spring 31 to produce significant bending elastic deformation. The elastic deformation of the latching spring 31 causes the locking block 32 fixed thereon to move together. The movement path and direction of the locking block 32 are preset so that it can completely exit the internal locking slot of the server body, thereby releasing the latch and allowing the fan module to be pulled out. When the external force is removed, the latching spring 31 will automatically spring back to its initial position due to its elastic restoring force, causing the locking block 32 to also return to the state ready for the next locking.

[0091] Please see Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 In some embodiments, the circuit board 70 may be connected to the housing 10 and located at the other end of the U-shaped groove structure in the longitudinal direction. A power connection terminal 72 is disposed on the circuit board 70 in the direction away from the baffle 20. When the fan module is installed inside the server body, the power connection terminal 72 of the circuit board 70 is electrically connected to the power supply terminal of the server body. The power connection terminal of the fan module is electrically connected to the power supply terminal of the circuit board 70.

[0092] In some embodiments, the circuit board 70 is fixedly mounted on the housing 10, located at the other end of the U-shaped groove structure along the length of the housing 10. The other end refers to the side of the U-shaped groove structure that is furthest from the baffle 20 along its length. In the installed state, the baffle 20 is close to the outer side of the server body, while the circuit board 70 is located closer to the inner, deeper area of ​​the server body. The circuit board 70 is the core carrier of the fan module's electrical system, responsible for managing functions such as power supply and signal transmission.

[0093] In some embodiments, a power connector 72 is configured on the circuit board 70. The power connector 72 is located on the surface or edge of the circuit board 70 in the direction away from the baffle 20 (i.e., in the direction of depth towards the interior of the server body). The power connector 72 can be a connector socket or an exposed contact bar (i.e., gold fingers). When the fan module is correctly installed and inserted into the designated position inside the server body, the pre-configured power supply terminal inside the server body (e.g., a mating connector plug or spring contact) will make precise physical contact with this power connector 72 on the circuit board 70 to ensure that the main power supply of the server body can stably and reliably deliver the required power to the circuit board 70.

[0094] In some embodiments, a specific mechanical fixing scheme may be used to securely mount the circuit board 70 on the base plate 11 of the housing 10. Multiple through holes 71 are formed on the circuit board 70. The through holes 71 can be circular holes or openings of other shapes. The distribution of the through holes 71 on the circuit board 70 is pre-planned. Corresponding to the number and position of the through holes 71 on the circuit board 70, multiple upwardly protruding fixing blocks 112 are provided on the base plate 11 of the housing 10. When assembling the circuit board 70, each fixing block 112 on the base plate 11 needs to be precisely passed through the corresponding through hole 71 on the circuit board 70. This design allows the fixing blocks 112 to not only act as initial positioning pins, ensuring the correct position of the circuit board 70 on the plane of the base plate 11, but also to support the circuit board 70 and maintain a predetermined distance between it and the base plate 11. With the fixing block 112 penetrating the through hole 71 of the circuit board 70, in order to finally secure it firmly, it is necessary to screw in screws or other fastening devices into the threaded hole on the top of the fixing block 112 or into the through hole penetrating the fixing block 112 and the base plate 11. By tightening these screws, the circuit board 70 can be stably clamped and fixed to the upper surface of the base plate 11, effectively resisting vibration and insertion / removal forces.

[0095] In some embodiments, circuit board 70, in addition to receiving power input from the server body, also provides power to the fans of the fan module itself. For this purpose, a dedicated fan power supply terminal is provided on circuit board 70. Since the fan module may be configured with two types of fans (i.e., the first fan 50 and the second fan 60) depending on their function or specifications, and these two types of fans require different power supply interface types (e.g., voltage level, current specification, interface physical size, or pin definition), the fan power supply interfaces on circuit board 70 are also correspondingly divided into two types: the first power supply terminal 73 and the second power supply terminal 74.

[0096] In some embodiments, the first power supply terminal 73 may be a fan power supply port for connecting the first fan 50. The first fan 50 has a matching power connector or wire. When the first fan 50 is correctly installed into the fan module, its power wire or connector is inserted into the corresponding first power supply terminal 73 on the circuit board 70. In this way, the power input from the server body and processed by the circuit board 70 can be safely and efficiently delivered to the first fan 50 through the first power supply terminal 73 to drive its operation.

[0097] In some embodiments, the second power supply terminal 74 may be a fan power supply port for connecting the second fan 60. The power interface design of the second fan 60 differs from that of the first fan 50, but its interface is compatible with the second power supply terminal 74. After the second fan 60 is correctly installed, its power connector or wire is inserted into or connected to the corresponding second power supply terminal 74 on the circuit board 70. In this way, the second fan 60 can obtain the specific power required for its operation from the circuit board 70 through the second power supply terminal 74. Through this differentiated design, the circuit board 70 can adapt to and provide correct and independent power supplies for different types of first fans 50 and second fans 60.

[0098] Please see Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 In some embodiments, the surface of the side plate 12 is formed with at least one guide rail that extends along the length direction and engages with a groove inside the server body; and / or, the surface of the side plate 12 is formed with at least one groove that extends along the length direction and engages with a guide rail inside the server body.

[0099] In some embodiments, a guide structure may be designed on the side plate 12 to assist in the insertion and removal of the fan module from the internal structure of the server body. Specifically, at least one guide rail may be formed on the outer surface of the side plate 12 (i.e., the side facing the rack or guide structure of the server body). This guide rail is a strip-shaped protrusion extending along the length of the side plate 12 (i.e., the direction of fan module insertion or removal) formed on the metal or other material surface of the side plate 12 by stamping, processing, or adding components. The cross-sectional shape of the guide rail may be rectangular, trapezoidal, or dovetail, etc., and its continuous length at least covers most of the length of the side plate 12, extending throughout the entire insertion / removal stroke. The height and width of the guide rail are precisely set according to the mating requirements. The main function of the guide rail is to be embedded in a pre-set, matching groove (or guide slot) inside the server body. When the fan module is inserted into the server body, the guide rail is embedded in the corresponding groove, and the two side walls of the groove and the two side surfaces of the guide rail form a tight but slidable mating relationship. The sliding of the guide rail within the groove precisely guides the fan module to move linearly along its length, limiting its swaying and offset in the width and vertical directions (i.e., depth), ensuring that the module is smoothly, stably, and accurately inserted into the designed position.

[0100] In some embodiments, at least one groove may also be formed on the side plate 12. This groove is an elongated groove structure formed on the surface of the side plate 12 by stamping, milling, or welding. The groove also extends continuously along the length of the side plate 12, covering most of the insertion and removal stroke. The opening of the groove faces the internal guide structure of the server body, and its cross-sectional shape (such as rectangular, trapezoidal, semi-circular, etc.) and groove depth and width dimensions must be adapted to the internal guide rails (or convex rails) of the server body. The function of the groove is to accommodate and guide the internally fixed guide rails of the server body. When the fan module is inserted into the server body, the guide rails on the server body will be correspondingly embedded in the groove on the side plate 12. The two opposing inner surfaces of the groove and the two outer surfaces of the embedded guide rails form sliding contact surfaces. The two side walls of the slide groove cover and constrain the embedded guide rail, allowing the guide rail to slide smoothly along the length direction inside the slide groove. At the same time, it strictly limits the fan module's freedom of movement in the width direction (perpendicular to the insertion and removal direction and the depth direction) and the vertical direction (depth direction), effectively preventing the module from swaying, tilting or misaligning during insertion or removal.

[0101] In some embodiments, regardless of whether a guide rail scheme, a slide rail scheme, or both are used (e.g., a guide rail on one side plate 12 and a slide rail on the other), the core function remains the same: during the insertion and removal of the fan module from the server body, a continuous and stable linear guide surface (a raised guide rail surface or a recessed slide rail guide surface) is provided along the length of the side plate 12, forming a sliding pair with the corresponding internal fixed structure of the server body (a grooved slide rail or a raised guide rail). This fit restricts the fan module's movement in degrees of freedom outside the insertion and removal path (mainly translational degrees of freedom in the width and vertical depth directions, and possible torsional degrees of freedom). By reducing frictional resistance and providing precise guidance, it ensures that the fan module can smoothly, effortlessly, and accurately complete the installation operation of inserting into the server body or the disassembly operation of removing from the server body, preventing component damage or electrical connector failure due to improper insertion or removal or misalignment. The guide rail / slide rail structure is a key supporting element for achieving reliable mechanical guidance and positioning in this function.

[0102] As can be seen, in the above solution, by fixing the position of the fan module's receiving slot and the distance to the heat source to a pre-optimized value during the design phase, the physical positional relationship between the fan module and the main heat source is locked at the hardware level. This directly eliminates the potential for distance deviation caused by assembly or vibration, ensuring that the heat dissipation airflow is always in optimal matching condition. This significantly reduces the impact of distance deviation on airflow efficiency, avoids the high energy consumption and noise costs of forcibly increasing fan speed to compensate for distance deviation, and fundamentally guarantees the stable coverage of the heat source by the airflow. It effectively solves the risk of junction temperature runaway caused by the uncertainty of the heat dissipation system's position. Through the excellent heat dissipation system and method of this invention, energy costs can be significantly reduced, hardware lifespan can be extended, asset depreciation can be reduced, computing density can be increased, and space costs can be saved. For AI computing servers, the excellent heat dissipation system and method of this invention can improve computing stability and reliability, reduce training interruptions, and significantly reduce electricity costs and hardware replacement costs.

[0103] The server of the present invention can be applied to, for example, network platform servers (e.g., 5G network servers), data centers (e.g., large-scale cloud data centers), databases (e.g., financial database servers), AI computing servers (e.g., edge computing platform servers), servers for monitoring and data acquisition systems, traffic control system servers, smart grid platform servers, distributed control system (DCS) operator stations, artificial intelligence and high-performance computing (HPC) servers, big data analysis servers, network security platform servers, communication and collaboration platform servers, or other suitable types of servers.

[0104] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A heat dissipation method for an artificial intelligence computing server, characterized in that, include: Based on the parameters of the CPU, GPU, memory module, hard disk module, and fan module within the server, a three-dimensional model of the server is constructed. The maximum thermal power consumption and maximum allowable operating temperature of the main heat sources within the server, as well as the maximum allowable operating ambient temperature of the server, are obtained; the main heat sources include the CPU and GPU; Under the conditions of maximum thermal power consumption, maximum allowable operating temperature, and maximum allowable ambient temperature, the distance between the main heat source and the fan module inside the server is adjusted, and after each adjustment, the 3D model is simulated to obtain the actual operating temperature of the main heat source; the actual operating temperature of the main heat source... It is calculated based on the following formula: ; The ambient temperature at the server's entry point. The thermal power of the main heat source, The total thermal resistance from the main heat source to the working environment; Filter out the distances corresponding to when the actual working temperature is less than the maximum allowable working ambient temperature, and generate the corresponding distance ranges; Based on the distance range, the installation position of the fan module is determined. The fan module includes a housing, a fan bracket, a baffle, and a fan module. When the fan bracket is snapped onto the housing, a receiving groove is formed between the fan bracket and the baffle. The fan module is installed in the receiving groove. The housing has multiple opening groups. When the fan bracket is snapped onto different opening groups on the housing, the position of the fan module in the internal space of the housing will change. Obtain the current operating temperature of the main heat source, and calculate the airflow increment of the fan module based on the temperature difference between the current operating temperature and the maximum allowable operating temperature; Obtain the current airflow and current speed of the fan module, and calculate the target airflow based on the current airflow and the airflow increment; Calculate the target speed of the fan module based on the current air volume, the current speed, and the target air volume; A corresponding duty cycle signal is generated based on the target rotation speed and sent to the fan module.

2. The heat dissipation method for an artificial intelligence computing server according to claim 1, characterized in that, The total thermal resistance It is calculated based on the following formula: ; in, The thermal resistance from the interior to the outer casing of the main heat source. The thermal resistance from the casing of the main heat source to the bottom of the fan module. The thermal resistance of the fan module to the working environment.

3. The heat dissipation method for an artificial intelligence computing server according to claim 2, characterized in that, The thermal resistance of the fan module to the working environment The relationship with the fan module is based on: ; in, air density, The specific heat capacity of air at constant pressure. The airflow of the fan module.

4. The heat dissipation method for an artificial intelligence computing server according to claim 3, characterized in that, The air volume of the fan module With rotational speed The relationship is as follows: ;in, This is expressed as the target air volume; This represents the current airflow. This represents the target rotational speed of the fan module at the target airflow. This represents the current speed of the fan module at the current airflow level. The air pressure of the fan module With rotational speed The relationship is as follows: ;in, This is expressed as the target air pressure of the fan module at the target airflow. This represents the current air pressure of the fan module under the current airflow. The power consumption of the fan module With rotational speed The relationship is as follows: ;in, This represents the target power consumption of the fan module at the target airflow. This represents the current power consumption of the fan module at the current airflow level.

5. An artificial intelligence computing server, characterized in that, The server, using the heat dissipation method as described in any one of claims 1 to 4, comprises a server body and the fan module, the fan module comprising: The housing includes a bottom plate and two side plates; The baffle is connected to the housing and is located at one end of the housing along its length. A circuit board is connected to the housing and located at the other end of the housing along the length direction; The fan bracket is snapped onto the housing; The fan module is installed in the receiving slot, and the power terminal of the fan module is electrically connected to the circuit board.

6. The artificial intelligence computing server according to claim 5, characterized in that, When there are multiple opening groups, the multiple opening groups are located at different positions in the shell along the length direction; When the fan bracket is engaged with different opening groups, the resulting receiving slots are adapted to different models of fan modules.

7. The artificial intelligence computing server according to claim 6, characterized in that, The opening assembly includes two edge notches, which are respectively formed on the two side plates; the fan bracket includes: Fan bracket; The housing has two snap-fit ​​parts; in the width direction of the housing, the two snap-fit ​​parts are respectively connected to both ends of the fan frame; one end of the snap-fit ​​part is connected to the fan frame, and the other end extends along the width direction; In the depth direction of the housing, the snap-fit ​​portion slides into the edge notch of the corresponding side plate.

8. The artificial intelligence computing server according to claim 6, characterized in that, The opening assembly includes a positioning groove formed on the base plate; the fan bracket includes: Fan bracket; A positioning protrusion, one end of which is connected to the fan bracket, and the other end extends toward the bottom plate along the depth direction of the housing; In the depth direction of the housing, the positioning protrusion is engaged in the positioning groove.

9. The artificial intelligence computing server according to claim 6, characterized in that, The fan bracket also includes two bent edges and two limiting blocks. The two bent edges are respectively connected to the two ends of the fan bracket, and the two limiting blocks are respectively installed on the two bent edges.

10. The artificial intelligence computing server according to claim 6, characterized in that, The fan module includes a first fan and a second fan.

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