Single-piece soaking equipment
By using a transfer mechanism in a single-piece immersion device to process circuit boards one by one, the problem of chemical fluctuations during the movement of the circuit board immersion device was solved, thus improving processing efficiency and yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- ECLAT FOREVER MACHINERY CO LTD
- Filing Date
- 2024-11-14
- Publication Date
- 2026-05-15
AI Technical Summary
Existing circuit board soaking equipment causes large fluctuations in the solution during movement, resulting in basket tilting or deformation, which affects the processing efficiency and yield of circuit boards.
A single-piece immersion device is used, and a transfer mechanism is used to clamp each circuit board to the immersion, cleaning and drying mechanism to avoid chemical fluctuations. Automatic control is achieved through a path guidance module and an electrical control module.
It enables rapid movement and processing of circuit boards, maintains the yield rate of circuit board production, and avoids equipment damage and poor processing caused by fluctuations in the chemical solution.
Smart Images
Figure CN122054467A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a single-board immersion apparatus, and more particularly to a single-board immersion apparatus that allows for convenient and rapid movement of individual circuit boards while avoiding significant fluctuations in the immersion solution, thereby maintaining the yield rate of circuit board manufacturing. Background Technology
[0002] In typical circuit board soaking equipment, multiple circuit boards are placed in a basket, and then the entire basket of circuit boards is moved to the soaking equipment for coating processing.
[0003] When the entire basket of circuit boards is moved to the soaking equipment, the movement or soaking action causes significant fluctuations in the solution to be soaked. This causes the basket to tilt or deform due to the stress impact of the solution, resulting in damage to the circuit boards. Furthermore, the circuit boards are difficult to remove from the basket, leading to low efficiency and yield during coating processing. Summary of the Invention
[0004] Based on at least one embodiment of the present invention, the present invention proposes a single-board immersion device, which aims to enable the use of a transfer mechanism to clamp single circuit boards one by one to the immersion mechanism, the cleaning mechanism and the drying mechanism for immersion, cleaning and drying of each circuit board, thereby achieving convenient and rapid movement of each circuit board and avoiding large fluctuations in the solution to be immersed, so as to maintain the production yield of the circuit boards.
[0005] To achieve the above and other objectives, the present invention provides a single-piece soaking device, comprising: a frame, at least one transfer mechanism, a soaking mechanism, a cleaning mechanism, and a drying mechanism. The frame includes a path guide module and an electrical control module. The path guide module is located at the top of the frame, and the electrical control module is located on the frame and electrically connected to the path guide module. The transfer mechanism is located on the path guide module and electrically connected to the electrical control module. The soaking mechanism is located on the frame and to one side of the transfer mechanism and electrically connected to the electrical control module. The cleaning mechanism is located on the frame and to one side of the soaking mechanism and electrically connected to the electrical control module. The drying mechanism is located on the frame and to one side of the cleaning mechanism and electrically connected to the electrical control module.
[0006] Optionally, the path guidance module guides the transfer mechanism to correspond to the soaking mechanism, the cleaning mechanism, and the drying mechanism.
[0007] Optionally, the transfer mechanism includes a lifting module and at least one clamp, wherein the lifting module is located on the path guidance module and the clamp is located on the lifting module.
[0008] Optionally, the transfer mechanism further includes a plate adsorption module located on one side of the clamp.
[0009] Optionally, the soaking mechanism includes a medicine tank, a cleaning module, and a first gas guiding module. The cleaning module is located on one side of the medicine tank, and the first gas guiding module is located on the other side of the medicine tank.
[0010] Optionally, the medicine tank is provided with multiple first shelves and multiple drain holes.
[0011] Optionally, the cleaning mechanism includes a water washing tank and a second gas guiding module, wherein the second gas guiding module is disposed on one side of the water washing tank.
[0012] Optionally, the washing tank is provided with multiple second shelves.
[0013] Optionally, the drying mechanism includes a drying tank and a cover, wherein the cover is movably disposed on the top of the drying tank.
[0014] Optionally, the drying tank is provided with multiple third-layer racks. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings required in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0016] Figure 1 This is a schematic diagram of the appearance of a preferred embodiment of the present invention. Figure 1 .
[0017] Figure 2 This is a schematic diagram of the appearance of a preferred embodiment of the present invention. Figure 2 .
[0018] Figure 3 This is a schematic diagram of the appearance of a preferred embodiment of the transfer mechanism of the present invention. Figure 1 .
[0019] Figure 4 This is a schematic diagram of the appearance of a preferred embodiment of the transfer mechanism of the present invention. Figure 2 .
[0020] Figure 5 This is a schematic diagram of the appearance of a preferred embodiment of the soaking mechanism of the present invention. Figure 1 .
[0021] Figure 6 This is a schematic diagram of the appearance of a preferred embodiment of the soaking mechanism of the present invention. Figure 2 .
[0022] Figure 7 This is a schematic diagram of the appearance of a preferred embodiment of the cleaning mechanism of the present invention. Figure 1 .
[0023] Figure 8 This is a schematic diagram of the appearance of a preferred embodiment of the cleaning mechanism of the present invention. Figure 2 .
[0024] Figure 9 This is a schematic diagram of the appearance of a preferred embodiment of the drying mechanism of the present invention. Figure 1 .
[0025] Figure 10 This is a schematic diagram of the appearance of a preferred embodiment of the drying mechanism of the present invention. Figure 2 .
[0026] Figure 11 This is a schematic diagram of the appearance of a preferred embodiment of the drying mechanism of the present invention. Figure 3 .
[0027] Figure 12 This is a schematic diagram of the appearance of a preferred embodiment of the feeding mechanism of the present invention.
[0028] Figure 13 This is a schematic diagram of the appearance of a preferred embodiment of the material receiving mechanism of the present invention.
[0029] Figure Labels
[0030] 1. Frame
[0031] 11 Path Guidance Module
[0032] 12 Electronic control modules
[0033] 2 Transfer Mechanism
[0034] 21 Lifting Module
[0035] 22 Fixtures
[0036] 23. Sheet adsorption module
[0037] 3 Immersion Mechanism
[0038] 31. Medicine tank
[0039] 311 First shelf
[0040] 312 Drain hole
[0041] 32 Cleaning Module
[0042] 33 First Gas Guiding Module
[0043] 4. Cleaning facilities
[0044] 41 Washing tank
[0045] 411 Second shelf
[0046] 42 Second Gas Guiding Module
[0047] 5. Drying mechanism
[0048] 51 Drying tank
[0049] 511 Third shelf
[0050] 52. Cover
[0051] 6. Feeding mechanism
[0052] 7 Receiving Mechanism
[0053] 8 circuit boards Detailed Implementation
[0054] The fluid bonding structure of the present invention will be further described below with reference to the accompanying drawings.
[0055] The foregoing and other technical contents, features, and effects of the invention will be clearly presented in the following detailed description of the preferred embodiments with reference to the accompanying drawings. It is worth noting that the directional terms used in the following embodiments, such as up, down, left, right, front, or back, are only for reference to the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting the invention. Furthermore, in the following embodiments, the same or similar components will be referred to by the same or similar reference numerals.
[0056] Please see Figures 1 to 13 As shown in the figure, the present invention is a single-piece soaking device, which includes a frame 1, at least one transfer mechanism 2, a soaking mechanism 3, a cleaning mechanism 4, and a drying mechanism 5.
[0057] The frame 1 includes a path guide module 11 and an electrical control module 12. The path guide module 11 is located on the top of the frame 1, and the electrical control module 12 is located on the frame 1 and electrically connected to the path guide module 11. The path guide module 11 can be a conveyor belt or a track, and the electrical control module 12 can be a computer, a server host, or a programmable controller, so as to automatically control the operation process of the soaking mechanism 3, the washing mechanism 4, and the drying mechanism 5 by utilizing the settings of the transfer mechanism 2.
[0058] The transfer mechanism 2 is located in the path guidance module 11 and is electrically connected to the electronic control module 12.
[0059] The soaking mechanism 3 is located on the frame and on one side of the transfer mechanism 2 and is electrically connected to the electrical control module 12.
[0060] The cleaning mechanism 4 is located on the frame and on one side of the soaking mechanism 3 and is electrically connected to the electrical control module 12.
[0061] The drying mechanism 5 is located on the frame and on one side of the cleaning mechanism 4 and is electrically connected to the electrical control module 12.
[0062] In one embodiment of the present invention, the path guidance module 11 guides the transfer mechanism 2 to correspond to the soaking mechanism 3, the washing mechanism 4 and the drying mechanism 5; in addition, a feeding mechanism 6 and a receiving mechanism 7 can be respectively provided at the front end (near the soaking mechanism 3) and the rear end (near the drying mechanism 5) of the frame 1, so as to place multiple circuit boards 8 to be processed on the feeding mechanism 6; and the processed circuit boards 8 are placed on the receiving mechanism 7 to facilitate subsequent processing of each circuit board 8.
[0063] When this invention is used, the transfer mechanism 2 can clamp the circuit boards 8 one by one from the feeding mechanism 6 into the soaking mechanism 3 (approximately one circuit board is clamped into the soaking mechanism 3 every 30 seconds). By inserting a single circuit board 8, large fluctuations in the soaking solution in the soaking mechanism 3 can be effectively avoided. After a predetermined number of circuit boards 8 have been placed in the soaking mechanism 3, the soaking mechanism 3 can perform surface coating processing on each circuit board 8 (at this time, the transfer mechanism 2 can return to its original position after cleaning to clamp and move another batch of circuit boards 8). After the circuit boards 8 undergo surface coating processing in the immersion mechanism 3, the transfer mechanism 2 clamps each circuit board 8 from the immersion mechanism 3 to the cleaning mechanism 4 for surface cleaning. Following cleaning, the transfer mechanism 2 clamps each circuit board 8 from the cleaning mechanism 4 to the drying mechanism 5 for post-cleaning drying. Finally, the transfer mechanism 2 clamps each circuit board 8 from the drying mechanism 5 to the receiving mechanism 7, thus completing the surface coating process for each circuit board 8. Therefore, based on the above embodiment, the transfer mechanism 2 can be used to clamp each individual circuit board 8 to the immersion mechanism 3, the cleaning mechanism 4, and the drying mechanism 5 for immersion, cleaning, and drying. This allows for convenient and rapid movement of the circuit boards and avoids significant fluctuations in the immersion solution, thereby maintaining the yield rate of the circuit board manufacturing process.
[0064] In addition to the above embodiments, in one embodiment of the present invention, the difference from the above embodiments is that the transfer mechanism 2 includes a lifting module 21 and at least one clamp 22. The lifting module 21 is disposed on the path guiding module 11, and the clamp 22 is disposed on the lifting module 21. The transfer mechanism 2 further includes a plate adsorption module 23, which is located on one side of the clamp 22.
[0065] Based on the above embodiments, when placing each circuit board 8, it can first be placed horizontally on the feeding mechanism 6. When the transfer mechanism 2 picks up the circuit board 8 from the feeding mechanism 6, the board adsorption module 23 can first pick up a single circuit board 8 from a horizontal position and flip it into a vertical position (upright). Then, the lifting module 21 of the transfer mechanism 2, in conjunction with the clamp 22, clamps each circuit board 8 into the soaking mechanism 3. By placing a single circuit board 8, large fluctuations in the soaking solution in the soaking mechanism 3 can be effectively avoided. After a predetermined number of circuit boards 8 are placed in the soaking mechanism 3, the soaking mechanism 3 can perform surface coating processing on each circuit board 8. At this time, one of the clamps 22 of the transfer mechanism 2 can return to its original position after cleaning by the cooperation of the lifting module 21 and the path guidance module 11 (e.g., the position of the feeding mechanism 6). The process involves moving another batch of circuit boards 8 in the immersion mechanism 3. After each circuit board 8 undergoes surface coating in the immersion mechanism 3, the transfer mechanism 2, with the cooperation of another clamp 22, the lifting module 21, and the path guide module 11, clamps each circuit board 8 in the immersion mechanism 3 to the cleaning mechanism 4 for surface cleaning. After cleaning, the transfer mechanism 2, with the cooperation of another clamp 22, the lifting module 21, and the path guide module 11, clamps each circuit board 8 in the cleaning mechanism 4 to the drying mechanism 5 for drying. After drying, the transfer mechanism 2, with the cooperation of another clamp 22, the lifting module 21, and the path guide module 11, clamps each circuit board 8 in the drying mechanism 5 to the receiving mechanism 7, thus completing the surface coating process of each circuit board 8. Thus, based on the above embodiments, the transfer mechanism 2 can be used to clamp each circuit board 8 to the soaking mechanism 3, the cleaning mechanism 4 and the drying mechanism 5 in turn, so as to soak, clean and dry each circuit board 8, thereby achieving convenient and rapid movement of each circuit board and avoiding large fluctuations in the soaking solution, so as to maintain the manufacturing yield of the circuit board.
[0066] In addition to the above embodiments, in one embodiment of the present invention, the difference from the above embodiments is that the soaking mechanism 3 includes a medicine tank 31, a cleaning module 32 and a first gas guiding module 33 (e.g., a hair dryer, blower or air knife). The cleaning module 32 is located on one side of the medicine tank 31, and the first gas guiding module 33 is located on the other side of the medicine tank 31. The medicine tank 31 is provided with a plurality of first shelves 311 and a plurality of drain holes 312.
[0067] Based on the above embodiments, the lifting module 21 of the transfer mechanism 2, in conjunction with the clamp 22, clamps each circuit board 8 into the first shelf 311 of the solution tank 31 of the soaking mechanism 3. By placing a single circuit board 8 into the first shelf 311, large fluctuations in the solution to be soaked in the solution tank 31 of the soaking mechanism 3 can be effectively avoided. After a predetermined number of circuit boards 8 are placed in the first shelf 311 of the soaking mechanism 3, the solution tank 31 of the soaking mechanism 3 can perform surface coating processing on each circuit board 8. Waste or residue generated during the surface coating process is discharged from the soaking mechanism 3 through the drain holes 312 of the solution tank 31 to avoid affecting the surface coating process. At this time, one of the clamps 22 of the transfer mechanism 2 can be dried by the first gas guiding module 33 after cleaning by the cleaning module 32, and then returned to its original position by the cooperation of the lifting module 21 and the path guiding module 11 (e.g., the unloading mechanism 6). The circuit boards 8 are moved to another batch by the transfer mechanism 2 (position) after surface coating processing in the immersion mechanism 3. Then, the transfer mechanism 2, with the cooperation of another clamp 22, the lifting module 21 and the path guide module 11, clamps each circuit board 8 in the immersion mechanism 3 to the cleaning mechanism 4 for surface cleaning. The chemical solution in the chemical tank 31 attached to the other clamp 22 can be dried by the first gas guide module 33. After cleaning, the transfer mechanism 2, with the cooperation of another clamp 22, the lifting module 21 and the path guide module 11, clamps each circuit board 8 in the cleaning mechanism 4 to the drying mechanism 5 for drying after cleaning. After drying, the transfer mechanism 2, with the cooperation of another clamp 22, the lifting module 21 and the path guide module 11, clamps each circuit board 8 in the drying mechanism 5 to the receiving mechanism 7, thereby completing the surface coating process of each circuit board 8. Thus, based on the above embodiments, the transfer mechanism 2 can be used to clamp each circuit board 8 to the soaking mechanism 3, the cleaning mechanism 4 and the drying mechanism 5 in turn, so as to soak, clean and dry each circuit board 8, thereby achieving convenient and rapid movement of each circuit board and avoiding large fluctuations in the soaking solution, so as to maintain the manufacturing yield of the circuit board.
[0068] In addition to the above embodiments, in one embodiment of the present invention, the difference from the above embodiments is that the cleaning mechanism 4 includes a water washing tank 41 and a second gas guiding module 42 (e.g., a hair dryer, blower, or air knife), the second gas guiding module 42 is disposed on one side of the water washing tank 41, wherein the water washing tank 41 is provided with a plurality of second shelves 411.
[0069] Based on the above embodiments, after each circuit board 8 undergoes surface coating processing in the immersion mechanism 3, the transfer mechanism 2, in cooperation with another clamp 22, the lifting module 21, and the path guiding module 11, clamps each circuit board 8 in the immersion mechanism 3 one by one onto the second shelf 411 of the water washing tank 41 in the cleaning mechanism 4, so that each circuit board 8 is surface cleaned by the water washing tank 41 of the cleaning mechanism 4, and the second gas guiding module 42 dries each circuit board 8. After cleaning, the transfer mechanism 2, in cooperation with another clamp 22, the lifting module 21, and the path guiding module 11, clamps each circuit board 8 in the cleaning mechanism 4 one by one onto the drying mechanism 5 for cleaning and drying. After drying, the transfer mechanism 2, in cooperation with another clamp 22, the lifting module 21, and the path guiding module 11, clamps each circuit board 8 in the drying mechanism 5 one by one onto the receiving mechanism 7, thereby completing the surface coating processing of each circuit board 8. Thus, based on the above embodiments, the transfer mechanism 2 can be used to clamp each circuit board 8 to the soaking mechanism 3, the cleaning mechanism 4 and the drying mechanism 5 in turn, so as to soak, clean and dry each circuit board 8, thereby achieving convenient and rapid movement of each circuit board and avoiding large fluctuations in the soaking solution, so as to maintain the manufacturing yield of the circuit board.
[0070] In addition to the above embodiments, in one embodiment of the present invention, the difference from the above embodiments is that the drying mechanism 5 includes a drying trough 51 and a cover 52, the cover 52 is movably disposed on the top of the drying trough 51, wherein the drying trough 51 is provided with a plurality of third shelves 511, and the cover 52 may be a plurality of doors or curtains.
[0071] Based on the above embodiments, after each circuit board 8 is cleaned by the cleaning mechanism 4, the cover 52 of the drying mechanism 5 can be opened, and the transfer mechanism 2, with the cooperation of another clamp 22, the lifting module 21 and the path guide module 11, clamps each circuit board 8 in the cleaning mechanism 4 into the third shelf 511 of the drying tank 51 of the drying mechanism 5. Then, the drying tank 51 dries each circuit board 8 after cleaning, and after drying, the transfer mechanism 2, with the cooperation of another clamp 22, the lifting module 21 and the path guide module 11, clamps each circuit board 8 in the drying mechanism 5 into the receiving mechanism 7, thereby completing the surface coating process of each circuit board 8. Thus, based on the above embodiments, the transfer mechanism 2 can be used to clamp each circuit board 8 to the soaking mechanism 3, the cleaning mechanism 4 and the drying mechanism 5 in turn, so as to soak, clean and dry each circuit board 8, thereby achieving convenient and rapid movement of each circuit board and avoiding large fluctuations in the soaking solution, so as to maintain the manufacturing yield of the circuit board.
[0072] In summary, the single-board immersion device of the present invention can use a transfer mechanism to clamp single circuit boards one by one to the immersion mechanism, the cleaning mechanism and the drying mechanism during use, so as to perform immersion, cleaning and drying of each circuit board. This achieves convenient and rapid movement of each circuit board and avoids large fluctuations in the solution to be immersed, thereby maintaining the production yield of the circuit boards.
[0073] The above description is merely an embodiment of the present invention and is not intended to limit the patent scope of the present invention.
Claims
1. A single-piece soaking device, characterized in that, The single-piece immersion device includes: The frame includes a path guidance module and an electrical control module. The path guidance module is located at the top of the frame, and the electrical control module is located on the frame and electrically connected to the path guidance module. At least one transfer mechanism is disposed in the path guidance module and electrically connected to the electronic control module; An immersion mechanism is provided on the frame and located on one side of the transfer mechanism and is electrically connected to the electronic control module; A cleaning mechanism, which is mounted on the frame and located on one side of the soaking mechanism and electrically connected to the electronic control module; and A drying mechanism is provided on the frame and located on one side of the cleaning mechanism and is electrically connected to the electrical control module.
2. The single-piece soaking device according to claim 1, characterized in that, The path guidance module guides the transfer mechanism to correspond to the soaking mechanism, the cleaning mechanism, and the drying mechanism.
3. The single-piece soaking device according to claim 1, characterized in that, The transfer mechanism includes a lifting module and at least one clamp. The lifting module is located on the path guidance module, and the clamp is located on the lifting module.
4. The single-piece soaking device according to claim 3, characterized in that, The transfer mechanism also includes a plate adsorption module, which is located on one side of the fixture.
5. The single-piece soaking device according to claim 1, characterized in that, The soaking mechanism includes a medicine tank, a cleaning module, and a first gas guiding module. The cleaning module is located on one side of the medicine tank, and the first gas guiding module is located on the other side of the medicine tank.
6. The single-piece soaking device according to claim 5, characterized in that, The medicine tank is equipped with multiple first-layer shelves and multiple drainage holes.
7. The single-piece soaking device according to claim 1, characterized in that, The cleaning mechanism includes a water washing tank and a second gas guiding module, the second gas guiding module being located on one side of the water washing tank.
8. The single-piece soaking device according to claim 7, characterized in that, The washing tank is equipped with multiple second-layer shelves.
9. The single-piece immersion device according to claim 1, characterized in that, The drying mechanism includes a drying tank and a cover, with the cover movably disposed on the top of the drying tank.
10. The single-piece immersion device according to claim 9, characterized in that, The drying tank is equipped with multiple third-layer racks.