Electronic device

Abstract

The invention discloses an electronic device, which comprises a middle frame in which a main circuit board and an auxiliary circuit board are arranged; one end of the radio frequency transmission line is electrically connected with the main circuit board, and the other end of the radio frequency transmission line is electrically connected with the auxiliary circuit board; the radio frequency transmission line is at least partially embedded in the middle frame, and the side, facing the main circuit board, of the radio frequency transmission line is flush with the inner surface of the middle frame. According to the scheme provided by the invention, the space occupied by the radio frequency transmission line in the middle frame can be reduced; the radio frequency transmission line and the middle frame share the thickness space of the middle frame, so that the electronic equipment can be lightened and thinned; meanwhile, the radio frequency transmission line is embedded in the middle frame, so that the stability of the radio frequency transmission line can be improved, and the complex assembly process is reduced; moreover, when the radio frequency transmission line is embedded in the middle frame, the radio frequency transmission line connected between the main circuit board and the auxiliary circuit board can be shortest by optimizing the path of the radio frequency transmission line in the middle frame, so that the loss of the radio frequency transmission line can be reduced.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, and in particular to an electronic device. Background Technology

[0002] With the rapid development of technology, electronic devices have become ubiquitous in people's lives, especially portable electronic devices such as laptops, tablets, and mobile phones. In these electronic devices, the radio frequency transmission lines mostly utilize flexible circuit boards.

[0003] Flexible circuit boards, as used in related technologies, occupy a significant amount of internal space in electronic devices during use. Summary of the Invention

[0004] This application provides an electronic device that can reduce the space occupied by flexible circuit boards, which is beneficial to the development of thinner and lighter electronic devices.

[0005] To address the aforementioned technical problems, this application proposes an electronic device, comprising:

[0006] The middle frame contains a main circuit board and a sub-circuit board.

[0007] A radio frequency (RF) transmission line, one end of which is electrically connected to the main circuit board and the other end of which is electrically connected to the sub-circuit board; the RF transmission line is at least partially embedded in the middle frame, and the side of the RF transmission line facing the main circuit board is flush with the inner surface of the middle frame.

[0008] The electronic device provided in this application embodiment has a reduced space occupied by the RF transmission line inside the mid-frame because the RF transmission line is at least partially embedded in the mid-frame. In this case, the RF transmission line shares the thickness of the mid-frame with the mid-frame, which is beneficial for making the electronic device thinner and lighter. Simultaneously, the embedded RF transmission line improves its stability and reduces complex assembly processes. Furthermore, by optimizing the path of the RF transmission line within the mid-frame, the shortest possible RF transmission line connecting the main circuit board and the sub-circuit board can be achieved when the RF transmission line is embedded in the mid-frame, thus reducing RF transmission line losses.

[0009] In one embodiment, the middle frame includes a middle plate and a first border, the first border being disposed around the periphery of the middle plate;

[0010] The radio frequency (RF) transmission line is at least partially embedded in the middle board, and the side of the RF transmission line facing the main circuit board is flush with the inner surface of the middle board. Because the RF transmission line is at least partially embedded in the middle board, the space occupied by the RF transmission line inside the middle frame is reduced. In this case, the RF transmission line and the middle board share the thickness space of the middle board, which is beneficial for the thinner and lighter design of the electronic device. At the same time, because the RF transmission line is embedded in the middle board, its stability is improved, and the complex assembly process is reduced. Furthermore, when the RF transmission line is embedded in the middle board, by optimizing the path of the RF transmission line within the middle board, the RF transmission line connecting the main circuit board and the sub-circuit board can be minimized, thus reducing the loss of the RF transmission line.

[0011] In one embodiment, the electronic device further includes a second frame, which is disposed on the inner surface of the middle plate to form a battery compartment;

[0012] The main circuit board and the sub-circuit board are located on both sides of the battery compartment along a first direction. The radio frequency transmission line passes through the second frame and is electrically connected to the main circuit board and the sub-circuit board. The first direction is the length direction of the middle plate. The battery compartment is formed by the second frame, which facilitates battery fixation.

[0013] In one embodiment, the second frame includes a plurality of first connecting rods and a plurality of second connecting rods, the first connecting rods extending along a first direction and the second connecting rods extending along a second direction, wherein the second direction intersects with the first direction;

[0014] The first connecting rod and the second connecting rod are connected in sequence. The second connecting rod has a through hole on the side facing the middle plate. The radio frequency transmission line passes through the through hole and is electrically connected to the main circuit board and the sub-circuit board. Because the second connecting rod has a through hole, it is convenient for the radio frequency transmission line to pass through the second connecting rod.

[0015] In one embodiment, the radio frequency transmission line includes an insulating medium and a microstrip line disposed on the insulating medium;

[0016] The insulating medium is at least partially embedded in the middle plate, and the microstrip line is flush with the inner surface of the middle plate. The microstrip line passes through the second frame and is electrically connected to the main circuit board and the sub-circuit board. In this way, the middle plate serves as a carrier of the insulating medium, enabling the transmission of radio frequency signals.

[0017] In one embodiment, the thickness of the insulating medium is 0.18 mm to 0.22 mm, and / or the linewidth of the microstrip line is 0.018 mm to 0.022 mm.

[0018] In one embodiment, the relative node constant of the insulating medium is between 2.5 and 3.5.

[0019] In one embodiment, the electronic device further includes a second frame, which is disposed on the inner surface of the middle plate to form a battery compartment;

[0020] The main circuit board and the sub-circuit board are located on both sides of the battery compartment along the first direction. The radio frequency transmission line is at least partially embedded in the middle board and the second frame, and the radio frequency transmission line on the second frame is flush with the surface of the second frame.

[0021] The radio frequency transmission line passes through the second frame and is electrically connected to the main circuit board and the sub-circuit board, wherein the first direction is the length direction of the middle board. Since the radio frequency transmission line is at least partially embedded in the middle board and the second frame, the space occupied by the radio frequency transmission line inside the middle frame can be reduced.

[0022] In one embodiment, the second frame includes a plurality of first connecting rods and a plurality of second connecting rods, the first connecting rods extending along a first direction and the second connecting rods extending along a second direction, wherein the second direction intersects with the first direction;

[0023] The first connecting rod and the second connecting rod are connected in sequence. A through hole is provided on the side of the second connecting rod facing the middle plate. The radio frequency transmission line is at least partially embedded in the first connecting rod. The radio frequency transmission line passes through the through hole and is electrically connected to the main circuit board and the sub-circuit board. Because the second connecting rod has a through hole, it facilitates the passage of the radio frequency transmission line through the second connecting rod.

[0024] In one embodiment, the radio frequency transmission line includes an insulating medium and a microstrip line disposed on the insulating medium;

[0025] The insulating medium is at least partially embedded in the middle plate and the first connecting rod, and the microstrip line is in close contact with the inner surface of the middle plate and the surface of the first connecting rod; the microstrip line passes through the through hole and is electrically connected to the main circuit board and the sub-circuit board.

[0026] In one embodiment, the thickness of the insulating medium is 0.18 mm to 0.22 mm, and / or the linewidth of the microstrip line is 0.018 mm to 0.022 mm.

[0027] In one embodiment, the relative node constant of the insulating medium is between 2.5 and 3.5.

[0028] In one embodiment, the electronic device further includes a flexible element, one end of the microstrip line being electrically connected to the main circuit board via the flexible element, and / or,

[0029] The other end of the microstrip line is electrically connected to the sub-circuit board via the elastic element.

[0030] In one embodiment, the radio frequency transmission line is any one of a microstrip line, a coplanar waveguide, or a stripline.

[0031] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without any creative effort.

[0033] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0034] Figure 2 A schematic diagram showing the disassembled structure of an electronic device provided in an embodiment of this application;

[0035] Figure 3 This is a schematic diagram of the internal structure of the middle frame provided in an embodiment of this application;

[0036] Figure 4 This is a schematic diagram of the connection structure between the mid-frame and the radio frequency transmission line provided in an embodiment of this application;

[0037] Figure 5 for Figure 4 A sectional view;

[0038] Figure 6 for Figure 5 Enlarged view of point C in the middle;

[0039] Figure 7 for Figure 4 Enlarged diagram of point A in the diagram;

[0040] Figure 8 This is a schematic diagram of the internal structure of another middle frame provided in an embodiment of this application;

[0041] Figure 9 for Figure 8 A schematic diagram of the radio frequency transmission line structure in the diagram;

[0042] Figure 10 A schematic diagram of a radio frequency transmission line provided in an embodiment of this application;

[0043] Figure 11 This is another schematic diagram of the internal structure of the middle frame provided in an embodiment of this application;

[0044] Figure 12 for Figure 11 A schematic diagram of the radio frequency transmission line structure in the diagram;

[0045] Figure 13 for Figure 12 A sectional view;

[0046] Figure 14 for Figure 13 Enlarged diagram at point F in the diagram;

[0047] Figure 15 for Figure 12 Enlarged diagram of point D in the diagram;

[0048] Figure 16 for Figure 12 Enlarged diagram of point E in the diagram;

[0049] Figure 17 for Figure 4 Enlarged diagram of point B in the diagram;

[0050] Figure 18 This is a schematic diagram of a coplanar waveguide provided in an embodiment of this application;

[0051] Figure 19 This is a schematic diagram of a stripline provided in an embodiment of this application.

[0052] Explanation of reference numerals in the attached figures:

[0053] 100. Electronic devices;

[0054] 10. Housing; 11. Mid-frame; 111. Mid-plate; 112. First frame; 1121. Port; 1122. Sound outlet; 12. Back cover;

[0055] 20. Screen; 21. Display screen; 22. Light-transmitting cover;

[0056] 30. Circuit board; 31. Main circuit board; 32. Sub-circuit board;

[0057] 40. Battery;

[0058] 50. Camera module;

[0059] 60. Speaker module; 61. First housing; 611. Second groove; 612. Sound outlet channel; 613. Third slot; 614. Second support arm; 62. Second housing; 621. Limiting groove; 622. Front cavity; 6221. Front cavity channel; 623. First bonding surface; 624. Fixing plate; 625. Notch; 63. Third housing; 631. Second bonding surface; 64. Speaker body; 641. Pressing surface; 65. Dustproof component; 651. Second bonding layer; 652. Anti-dustproof Dust net; 653, First adhesive layer; 6531, First extension; 654, Bracket; 6541, Through hole; 6542, Second extension; 6543, First groove; 6544, First slot; 6545, Second slot; 6546, Connecting arm; 6547, First support arm; 655, First sealing gasket; 6551, First locking block; 6552, Second locking block; 66, Second sealing gasket; 67, Third adhesive layer; 68, Pressing plate; 681, Protrusion; 682, Bending section;

[0060] 70. Radio frequency transmission line;

[0061] 80. Second frame; 801. First connecting rod; 802. Second connecting rod; 8021. Through hole;

[0062] 90. Elastic components. Detailed Implementation

[0063] The terminology used in the implementation section of this application is only for explaining specific embodiments of this application and is not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0064] This application provides an electronic device, which may include, but is not limited to, mobile phones, tablets, laptops, ultra-mobile personal computers (UMPCs), handheld computers, netbooks, personal digital assistants (PDAs), wearable devices, televisions, and other mobile or fixed terminals. This application uses a mobile phone as an example for illustration.

[0065] Figure 1 This is a schematic diagram of the structure of an electronic device 100 provided in an embodiment of this application. Figure 2 This is a schematic diagram showing the disassembled structure of an electronic device 100 provided in an embodiment of this application, with reference to... Figure 1 and Figure 2As shown, the electronic device 100 provided in this application embodiment may include: a housing 10, a screen 20, a circuit board 30, a battery 40, a camera module 50, a Universal Serial Bus (USB) device (not shown in the figure), and a speaker module 60.

[0066] It should be understood that, Figure 1 and Figure 2 The drawings are not drawn to scale, nor are the other accompanying drawings. Therefore, this application should not be limited to the scale and dimensions shown in the drawings. Furthermore, in this application, "connection" or "electrical connection" can mean not only a direct connection between two parts, but also a connection through one or more intermediate devices. "Installation" or "assembly" in this application can include any existing installation method; for example, one component can be fixed above, below, or in between another component using connectors (e.g., bolts, rivets, etc.) and / or adhesives. These understandings all fall within the scope of the embodiments of this application. Additionally, when the electronic device 100 is a device of other forms, the electronic device 100 may not include at least one of the following: screen 20, circuit board 30, battery 40, camera module 50, and USB device.

[0067] For details, please refer to Figure 1 and Figure 2 As shown, the housing 10 can provide a structural framework for the electronic device 100, for example... Figure 1 and Figure 2 In this device, the housing 10 may include a mid-frame 11 and a back cover 12. When the electronic device 100 has a display function, it may also have a screen 20. Between the screen 20 and the back cover 12, the mid-frame 11, circuit board 30, battery 40, camera module 50, USB device, and speaker module 60 are disposed. The mid-frame 11 can serve as the structural "skeleton" of the electronic device 100. The circuit board 30, battery 40, camera module 50, USB device, and speaker module 60 can be disposed on the mid-frame 11. For example, the circuit board 30, battery 40, camera module 50, USB device, and speaker module 60 can be disposed on the side of the mid-frame 11 facing the back cover 12, or the circuit board 30, battery 40, camera module 50, USB device, and speaker module 60 can be disposed on the side of the mid-frame 11 facing the screen 20.

[0068] The middle frame 11 may include a middle plate 111 and a first frame 112, with the first frame 112 surrounding the outer perimeter of the middle plate 111. Generally, the first frame 112 may include a top frame, a bottom frame, a left frame, and a right frame. The top frame, bottom frame, left frame, and right frame form a square ring structure. The middle plate 111 may be made of aluminum, aluminum alloy, or magnesium alloy. The first frame 112 may be a metal frame or a ceramic frame. The middle plate 111 and the first frame 112 may be snap-fitted, welded, bonded, or integrally formed, or the metal middle plate 111 and the first frame 112 may be fixedly connected by injection molding.

[0069] It is readily understood that the housing 10 of the electronic device 100 provided in this application includes, but is not limited to, the structures described above. For example, in some other embodiments, the housing 10 may be a one-piece or separate shell made of metal or plastic. In this embodiment, the housing 10 is specifically described using the structure composed of a mid-frame 11 and a back cover 12 as an example. When the electronic device 100 does not include the mid-frame 11, the circuit board 30, battery 40, camera module 50, USB device, and speaker module 60 can be fixed to the surface of the screen 20 facing the back cover 12 by means of threaded connection, snap-fit, welding, etc., or they can be fixed to the surface of the back cover 12 facing the screen 20 by means of threaded connection, snap-fit, welding, etc.

[0070] It should be noted that in the electronic device 100, the middle frame 11 and the back cover 12 include, but are not limited to, […]. Figure 1 and Figure 2 In some other embodiments of the structure shown, the back cover 12 can be integrally formed with the first frame 112. For example, the electronic device 100 may include a screen 20, a middle plate 111, and a housing, which can be integrally formed with the first frame 112 and the back cover 12. In this way, the circuit board 30, battery 40, camera module 50, USB device, and speaker module 60 are disposed in the accommodating space formed by the middle plate 111 and the housing.

[0071] Screen 20 is used to display images, videos, etc. Screen 20 may include a light-transmitting cover 22 and a display screen 21 (also called a display panel). The light-transmitting cover 22 and the display screen 21 are stacked and fixedly connected by adhesive or other means. The light-transmitting cover 22 mainly serves to protect the display screen 21 and prevent dust. The material of the light-transmitting cover 22 includes, but is not limited to, glass. The display screen 21 can be a flexible display screen or a rigid display screen. For example, the display screen 21 can be an Organic Light-Emitting Diode (OLED) display screen, an Active-Matrix Organic Light-Emitting Diode (AMOLED) display screen, a Mini Organic Light-Emitting Diode display screen, a Micro Organic Light-Emitting Diode display screen, a Quantum Dot Light-Emitting Diode (QLED) display screen, a Liquid Crystal Display (LCD), etc.

[0072] The back cover 12 protects the internal electronic components of the electronic device 100. The materials of the back cover 12 include, but are not limited to, metal, ceramic, plastic, and glass. To ensure both the thinness and lightness of the electronic device 100 and the structural strength of the back cover 12, the material of the back cover 12 can be metal. The light-transmitting cover 22, the first frame 112, and the back cover 12 together form the internal accommodating space of the electronic device 100. This accommodating space houses the display screen 21, circuit board 30, battery 40, camera module 50, USB device, and speaker module 60.

[0073] Continue to refer to Figure 2 As shown, in the electronic device 100 provided in this application embodiment, the circuit board 30 may include: a main circuit board 31 and a sub-circuit board 32.

[0074] The main circuit board 31 is used to integrate a control chip. The control chip can be, for example, an application processor (AP), double data rate synchronous dynamic random access memory (DDR), or universal flash storage (UFS). In some embodiments, the main circuit board 31 is electrically connected to the display screen 21, and the main circuit board 31 is used to control the display screen 21 to display images or videos. The main circuit board 31 can be a rigid circuit board, a flexible circuit board, or a rigid-flex circuit board. The main circuit board 31 can use an FR-4 dielectric substrate, a Rogers dielectric substrate, or a hybrid dielectric substrate of FR-4 and Rogers, etc. Here, FR-4 is a designation for a flame-retardant material grade, and Rogers dielectric substrate is a high-frequency board.

[0075] Sub-circuit board 32 is used to integrate electronic components such as antenna (e.g., 5G antenna) RF front-end and Universal Serial Bus (USB) devices. Sub-circuit board 32 can be a rigid circuit board, a flexible circuit board, or a rigid-flex circuit board. Sub-circuit board 32302 can use FR-4 dielectric substrate, Rogers dielectric substrate, or a hybrid dielectric substrate of FR-4 and Rogers, etc.

[0076] The secondary circuit board 32 is electrically connected to the main circuit board 31 via an RF transmission line 70 to enable data and signal transmission between the secondary circuit board 32 and the main circuit board 31. The RF transmission line 70 can be a flexible printed circuit (FPC). In other embodiments, the RF transmission line 70 can also be a wire or enameled wire.

[0077] Of course, in other embodiments, the circuit board 30 may be one or more pieces. Here, this application does not limit the number of circuit boards 30.

[0078] The battery 40 is used to provide power to electronic devices such as the display screen 21, main circuit board 31, sub-circuit board 32, camera module 50, and speaker module 60 within the electronic device 100. In some embodiments, a battery mounting slot may be provided on the surface of the middle frame 11 facing the rear cover 12, and the battery 40 may be installed in the battery mounting slot.

[0079] The camera module 50 enables the electronic device 100 to take photos and videos. The camera module 50 is electrically connected to the circuit board 30. The camera module 50 can be a front-facing camera, a rear-facing camera, etc. The number of front-facing and rear-facing cameras can be one or more. For example,... Figure 2 As shown in the figure, the camera module 50 in this embodiment is illustrated using three rear cameras as an example.

[0080] The USB device is connected to the secondary circuit board 32. The USB device is an interface device conforming to the USB standard specification. Specifically, the USB device can be a Mini USB device, a Micro USB device, a USB Type-C device, etc. The USB device is used to connect a charger to the electronic device 100 via the port 1121 on the first frame 112 to charge the electronic device 100. It can also be used to transfer data between the electronic device 100 and peripheral devices, and to connect headphones for audio playback. The USB device can also be used to connect other electronic devices, such as augmented reality (AR) devices.

[0081] The speaker module 60 is used to convert audio electrical signals such as music and voice into sound, supporting audio playback functionality. In some embodiments, the speaker module 60 is electrically connected to the secondary circuit board 32. In this case, the audio signal sent by the main circuit board 31 is transmitted to the speaker module 60 via the secondary circuit board 32, and is converted into a sound signal for output by the speaker module 60. Specifically, refer to... Figure 2 and combined Figure 1 As shown, the speaker module 60 has a sound outlet channel on its housing. The sound signal output by the speaker module 60 is output through this sound outlet channel. A sound outlet hole 1122 is provided on the first frame 112, and the sound outlet hole 1122 is connected to the sound outlet channel. The sound output from the sound outlet channel is output to the outside of the electronic device 100 through the sound outlet hole 1122.

[0082] In other embodiments, the speaker module 60 can also be directly electrically connected to the main circuit board 31 via FPC, wires, enameled wires, etc.

[0083] It should be noted that the accompanying drawings of this application describe a single speaker module 60. Of course, there can be multiple speaker modules 60. For example, in some other embodiments of this application, there can be two speaker modules 60, one of which is located at the top of the phone and the other at the bottom. Furthermore, the placement of the speaker modules 60 can be customized according to specific needs, including but not limited to the placement examples described above.

[0084] The following is a detailed description of this application.

[0085] With the rapid development of technology, electronic devices have become ubiquitous in people's lives, especially portable electronic devices such as laptops, tablets, and mobile phones. In these electronic devices, the radio frequency transmission lines mostly utilize flexible circuit boards.

[0086] In related technologies, electronic devices include a mid-frame and a back cover, with the back cover fastened to the mid-frame. The flexible circuit board is located in the cavity formed by the mid-frame and the back cover. As a result, the flexible circuit board occupies the cavity space, which is not conducive to the overall thinning and lightening of electronic devices.

[0087] To solve the above problems, such as Figure 3 and combined Figure 4 As shown, one embodiment of this application provides an electronic device, which includes: a mid-frame 11 and a radio frequency transmission line 70. The mid-frame 11 is provided with a main circuit board 31 and a sub-circuit board 32. One end of the radio frequency transmission line 70 is electrically connected to the main circuit board 31, and the other end is electrically connected to the sub-circuit board 32. At the same time, the radio frequency transmission line 70 is at least partially embedded in the mid-frame 11, and the side of the radio frequency transmission line 70 facing the main circuit board 31 is flush with the inner surface of the mid-frame 11.

[0088] In this embodiment, the middle frame 11 has an overall concave structure. The middle frame 11 can be a metal frame, an alloy frame, etc., and the specific design can be determined according to the actual situation. This embodiment does not limit this.

[0089] In this embodiment, the radio frequency transmission line 70 can be completely embedded in the middle frame 11, or the radio frequency transmission line 70 can be partially embedded in the middle frame 11. For ease of explanation, the following description will take the example of the radio frequency transmission line 70 being completely embedded in the middle frame 11.

[0090] After the RF transmission line 70 is fully embedded in the middle frame 11, the side of the RF transmission line 70 facing the main circuit board 31 is flush with the inner surface of the middle frame 11.

[0091] The electronic device provided in this application embodiment has a RF transmission line 70 embedded in the middle frame 11. The side of the RF transmission line 70 facing the main circuit board 31 is flush with the inner surface of the middle frame 11, which reduces the space occupied by the RF transmission line 70 inside the middle frame 11. At this time, the RF transmission line 70 and the middle frame 11 share the thickness space of the middle frame 11, which is beneficial to the thinning of the electronic device. At the same time, since the RF transmission line 70 is embedded in the middle frame 11, the stability of the RF transmission line 70 can be improved and the complex assembly process can be reduced. Moreover, when the RF transmission line 70 is embedded in the middle frame 11, by optimizing the path of the RF transmission line 70 in the middle frame 11, the RF transmission line 70 connecting the main circuit board 31 and the sub-circuit board 32 can be minimized, which can reduce the loss of the RF transmission line 70.

[0092] In some embodiments, such as Figure 4 and combined Figure 5 , Figure 6As shown, the middle frame 11 includes a middle plate 111 and a first frame 112, wherein the first frame 112 is disposed around the middle plate 111; the radio frequency transmission line 70 is at least partially embedded in the middle plate 111, and the side of the radio frequency transmission line 70 facing the main circuit board 31 is flush with the inner surface of the middle plate 111.

[0093] In this embodiment, the middle plate 111 has a square structure, and the first frame 112 is disposed on the four peripheries of the middle plate 111. The first frame 112 can be integrally formed with the middle plate 111, and the first frame 112 and the middle plate 111 together form a concave structure.

[0094] refer to Figure 6 As shown, the RF transmission line 70 is embedded within the middle plate 111, with its upper surface flush with the upper surface of the middle plate 111. In this configuration, the RF transmission line 70 does not occupy the space enclosed by the first frame 112 and the middle plate 111, thus reducing the space occupied by the RF transmission line 70 within the middle frame 111. Furthermore, the RF transmission line 70 shares the thickness of the middle plate 111 with the middle plate, which is beneficial for the thinner and lighter design of the electronic device. Simultaneously, since the RF transmission line 70 is embedded within the middle plate 111, its stability is improved, reducing the complexity of the assembly process. Moreover, when the RF transmission line 70 is embedded within the middle plate 111, by optimizing its path within the middle plate 111, the RF transmission line 70 connecting the main circuit board 31 and the sub-circuit board 32 can be minimized, thereby reducing the loss of the RF transmission line 70.

[0095] In some embodiments, such as Figure 4 As shown, the electronic device also includes a second frame 80, which is disposed on the inner surface of the middle plate 111 to form a battery compartment; the main circuit board 31 and the sub-circuit board 32 are located on both sides of the battery compartment along a first direction, and the radio frequency transmission line 70 passes through the second frame 80 and is electrically connected to the main circuit board 31 and the sub-circuit board 32, wherein the first direction is the length direction of the middle plate 111.

[0096] The first direction in this embodiment is as follows: Figure 4 The X-axis direction in the diagram.

[0097] In this embodiment, the second frame 80 can be snapped onto the inner surface of the middle plate 111, or the second frame 80 can be integrally formed with the middle plate 111. The specific method can be determined according to the actual situation, and this embodiment does not limit this.

[0098] In this embodiment, the second frame 80 surrounds a square battery compartment on the inner surface of the middle plate 111, and the battery 40 is fixed inside the battery compartment.

[0099] In this embodiment, a battery compartment is formed by surrounding the inner surface of the middle plate 111 with the second frame 80, and then the battery 40 is placed in the corresponding battery compartment, which makes it easier to fix the battery 40 on the middle plate 111.

[0100] In some embodiments, such as Figure 4 and combined Figure 7 As shown, the second frame 80 includes a plurality of first connecting rods 801 and a plurality of second connecting rods 802. The first connecting rods 801 extend along a first direction, and the second connecting rods 802 extend along a second direction, wherein the second direction intersects with the first direction. The first connecting rods 801 and the second connecting rods 802 are connected in sequence. A through hole 8021 is provided on the side of the second connecting rod 802 facing the middle plate 111. The radio frequency transmission line 70 passes through the through hole 8021 and is electrically connected to the main circuit board 31 and the sub-circuit board 32.

[0101] In this embodiment, as Figure 4 As shown, the first direction is the X-axis direction, and the second direction is the Y-axis direction. The angle between the X-axis and the Y-axis can be 80°, 85°, 90°, etc. This embodiment is illustrated by taking the X-axis and Y-axis as being perpendicular to each other.

[0102] In this embodiment, the second frame 80 includes two first connecting rods 801 and two second connecting rods 802. Both the first connecting rods 801 and the second connecting rods 802 are fixed to the inner surface of the middle plate 111. The first connecting rods 801 and the second connecting rods 802 are sequentially connected to form a square battery compartment. It is understood that the second frame 80 may also include three first connecting rods 801, four first connecting rods 801, etc., depending on the actual situation. This embodiment does not limit this.

[0103] refer to Figure 7 As shown, each second connecting rod 802 has a through hole 8021 on the side facing the middle plate 111, so that the radio frequency transmission line 70 can pass through the corresponding through hole 8021 and be electrically connected to the main circuit board 31 and the sub-circuit board 32.

[0104] In this embodiment, the radio frequency transmission line 70 can be distributed perpendicularly to the second connecting rod 802, such as... Figure 8 and combined Figure 9 As shown, the radio frequency transmission line 70 can be inclined relative to the second connecting rod 802. The specific arrangement can be determined according to the actual situation, and this embodiment does not limit this.

[0105] In this embodiment, a through hole 8021 is opened on the second connecting rod 802 to achieve the optimal path for signal transmission of the radio frequency transmission line 70 and reduce line loss.

[0106] In some embodiments, such as Figure 10As shown, the radio frequency transmission line 70 includes an insulating medium 701 and a microstrip line 702 disposed on the insulating medium 701. The insulating medium 701 is at least partially embedded in the middle plate 111, the microstrip line 702 is flush with the inner surface of the middle plate 111, and the microstrip line 702 passes through the second frame 80 and is electrically connected to the main circuit board 31 and the sub-circuit board 32.

[0107] In this embodiment, the microstrip line 702 is an electrical transmission line. It can be made of the same material as the metal plate 111, or it can be a single copper layer of a flexible circuit board, or a thin metal layer realized by LDS process. The specific material can be determined according to the actual situation, and this embodiment does not limit it.

[0108] In this embodiment, the insulating medium 701 can be resin, rubber, etc., and the specific type can be determined according to the actual situation. This specification does not limit this embodiment.

[0109] In this embodiment, the metal middle plate 111 serves as the transmission carrier for radio frequency signals. The radio frequency transmission line 70 is conformally fitted to the middle plate 111 to achieve the transmission of radio frequency signals. In this way, it is equivalent to integrating the radio frequency transmission line 70 and the middle plate 111 together, thereby avoiding occupying the internal space of the middle frame 11.

[0110] In some embodiments, the thickness of the insulating medium 701 is 0.18 mm to 0.22 mm, and / or the linewidth of the microstrip line 702 is 0.018 mm to 0.022 mm.

[0111] Since the thickness of the insulating medium 701 directly affects the characteristic impedance, bandwidth, and loss of the RF transmission line 70, and the linewidth of the microstrip line 702 directly affects the impedance, power loss, and overall performance of the microstrip line 702, this embodiment limits the thickness of the insulating medium 701 and the linewidth of the microstrip line 702 to ensure that the characteristic impedance, bandwidth, and loss of the RF transmission line 70 are within a preset range, and at the same time, ensures that the impedance and power loss of the microstrip line 702 are within a preset range.

[0112] In some embodiments, the relative node constant of the insulating medium 701 is between 2.5 and 3.5.

[0113] In some embodiments, such as Figure 11As shown, the electronic device also includes a second frame 80, which is disposed on the inner surface of the middle plate 111 to form a battery compartment; the main circuit board 31 and the sub-circuit board 32 are located on both sides of the battery compartment along a first direction; the radio frequency transmission line 70 is at least partially embedded in the middle plate 111 and the second frame 80, and the radio frequency transmission line 70 located on the second frame 80 is flush with the surface of the second frame 80; the radio frequency transmission line 70 passes through the second frame 80 and is electrically connected to the main circuit board 31 and the sub-circuit board 32, wherein the first direction is the length direction of the middle plate 111.

[0114] The structure of the second border 80 in this embodiment can be referred to the above description, and will not be repeated here.

[0115] The first direction in this embodiment can be referred to the above description, and will not be repeated here.

[0116] In this embodiment, a portion of the RF transmission line 70 is entirely embedded in the middle plate 111, and the other portion is entirely embedded in the second frame 80. At this time, a portion of the RF transmission line 70 is flush with the inner surface of the middle plate 111, and the other portion is flush with the surface of the second frame 80. Therefore, the RF transmission line 70 does not occupy the internal space of the middle frame 11. Furthermore, since the RF transmission line 70 is embedded in the middle plate 111 and the second frame 80, this improves the stability of the RF transmission line 70 and reduces the complexity of the assembly process.

[0117] In some embodiments, such as Figure 12 and combined Figure 13 , Figure 14 , Figure 15 and Figure 16 As shown, the second frame 80 includes a plurality of first connecting rods 801 and a plurality of second connecting rods 802. The first connecting rods 801 extend along a first direction, and the second connecting rods 802 extend along a second direction, wherein the second direction intersects with the first direction. The first connecting rods 801 and the second connecting rods 802 are connected sequentially. A through hole 8021 is provided on the side of the second connecting rod 802 facing the middle plate 111, and the radio frequency transmission line 70 is at least partially embedded in the first connecting rod 801. The radio frequency transmission line 70 passes through the through hole 8021 and is electrically connected to the main circuit board 31 and the sub-circuit board 32. Since the second connecting rod is provided with a through hole, it is convenient for the radio frequency transmission line to pass through the second connecting rod.

[0118] In this embodiment, as Figure 12 As shown, the first direction is the X-axis direction, and the second direction is the Y-axis direction. The angle between the X-axis and the Y-axis can be 80°, 85°, 90°, etc. This embodiment is illustrated by taking the X-axis and Y-axis as being perpendicular to each other.

[0119] In this embodiment, the second frame 80 includes two first connecting rods 801 and two second connecting rods 802. Both the first connecting rods 801 and the second connecting rods 802 are fixed to the inner surface of the middle plate 111. The first connecting rods 801 and the second connecting rods 802 are sequentially connected to form a square battery compartment. It is understood that the second frame 80 may also include three first connecting rods 801, four first connecting rods 801, etc., depending on the actual situation. This embodiment does not limit this.

[0120] refer to Figure 15 , Figure 16 As shown, each second connecting rod 802 has a through hole 8021 on the side facing the middle plate 111, so that the radio frequency transmission line 70 can pass through the corresponding through hole 8021 and be electrically connected to the main circuit board 31 and the sub-circuit board 32.

[0121] refer to Figure 14 As shown, the radio frequency transmission line 70 is at least partially embedded in the first connecting rod 801. The portion of the radio frequency transmission line 70 located on the middle plate 111 is embedded within the middle plate 111. The portion of the radio frequency transmission line 70 located on the middle plate 111 is flush with the inner surface of the middle plate 111. The portion of the radio frequency transmission line 70 located on the first connecting rod 801 is flush with the surface of the first connecting rod 801.

[0122] In this embodiment, a through hole 8021 is opened on the second connecting rod 802 to achieve the optimal path for signal transmission of the radio frequency transmission line 70 and reduce line loss.

[0123] In some embodiments, the radio frequency transmission line 70 includes an insulating medium 701 and a microstrip line 702 disposed on the insulating medium 701, wherein the insulating medium 701 is at least partially embedded in the middle plate 111 and the first connecting rod 801, and the microstrip line 702 is in close contact with the inner surface of the middle plate 111 and the surface of the first connecting rod 801; the microstrip line 702 passes through the through hole 8021 and is electrically connected to the main circuit board 31 and the sub-circuit board 32.

[0124] In this embodiment, the microstrip line 702 is an electrical transmission line. It can be made of the same material as the metal plate 111, or it can be a single copper layer of a flexible circuit board, or a thin metal layer realized by LDS process. The specific material can be determined according to the actual situation, and this embodiment does not limit it.

[0125] In this embodiment, the insulating medium 701 can be resin, rubber, etc., and the specific type can be determined according to the actual situation. This specification does not limit this embodiment.

[0126] In this embodiment, the metal middle plate 111 and the first connecting rod 801 serve as the transmission carriers of radio frequency signals. The radio frequency transmission line 70 is conformally fitted with the middle plate 111 and the first connecting rod 801 to realize the transmission of radio frequency signals. In this way, it is equivalent to integrating the radio frequency transmission line 70 with the middle plate 111 and the first connecting rod 801 together, thereby avoiding occupying the internal space of the middle frame 11.

[0127] In some embodiments, the thickness of the insulating medium 701 is 0.18 mm to 0.22 mm, and / or the linewidth of the microstrip line 702 is 0.018 mm to 0.022 mm.

[0128] Since the thickness of the insulating medium 701 directly affects the characteristic impedance, bandwidth, and loss of the RF transmission line 70, and the linewidth of the microstrip line 702 directly affects the impedance, power loss, and overall performance of the microstrip line 702, this embodiment limits the thickness of the insulating medium 701 and the linewidth of the microstrip line 702 to ensure that the characteristic impedance, bandwidth, and loss of the RF transmission line 70 are within a preset range, and at the same time, ensures that the impedance and power loss of the microstrip line 702 are within a preset range.

[0129] In some embodiments, the relative node constant of the insulating medium 701 is between 2.5 and 3.5.

[0130] In some embodiments, such as Figure 17 As shown, the electronic device also includes an elastic element 90, one end of the microstrip line 702 is electrically connected to the main circuit board 31 through the elastic element 90, and / or, the other end of the microstrip line 702 is electrically connected to the sub-circuit board 32 through the elastic element 90.

[0131] In this embodiment, elastic elements 90 are provided at both ends of the microstrip line 702.

[0132] In this embodiment, the elastic element 90 is a metal spring. By setting the metal spring, it is convenient to connect the microstrip line 702 to the PCB board.

[0133] In some embodiments, the radio frequency transmission line 70 is any one of a microstrip line, a coplanar waveguide, or a stripline.

[0134] refer to Figure 18 and Figure 19 As shown, Figure 18 This is a schematic diagram of a coplanar waveguide. Figure 19 This is a schematic diagram of a stripline. Different types of RF transmission lines 70 have different main transmission modes, maximum frequencies, characteristic impedance ranges, and no-load Q values. The specific type of RF transmission line 70 can be selected according to actual requirements, and this specification does not limit this in the embodiments.

[0135] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0136] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0137] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An electronic device, characterized in that, include: A middle frame (11) is provided, and a main circuit board (31) and a sub-circuit board (32) are provided inside the middle frame (11); Radio frequency transmission line (70), one end of which is electrically connected to the main circuit board (31) and the other end of which is electrically connected to the sub-circuit board (32); the radio frequency transmission line (70) is at least partially embedded in the middle frame (11), and the side of the radio frequency transmission line (70) facing the main circuit board (31) is flush with the inner surface of the middle frame (11).

2. The electronic device according to claim 1, characterized in that, The middle frame (11) includes a middle plate (111) and a first border (112), wherein the first border (112) is disposed around the middle plate (111); The radio frequency transmission line (70) is at least partially embedded in the middle plate (111), and the side of the radio frequency transmission line (70) facing the main circuit board (31) is flush with the inner surface of the middle plate (111).

3. The electronic device according to claim 2, characterized in that, The electronic device further includes a second frame (80), which is disposed on the inner surface of the middle plate (111) to form a battery compartment; The main circuit board (31) and the sub-circuit board (32) are located on both sides of the battery compartment along the first direction. The radio frequency transmission line (70) passes through the second frame (80) and is electrically connected to the main circuit board (31) and the sub-circuit board (32). The first direction is the length direction of the middle plate (111).

4. The electronic device according to claim 3, characterized in that, The second frame (80) includes a plurality of first connecting rods (801) and a plurality of second connecting rods (802), wherein the first connecting rods (801) extend along a first direction and the second connecting rods (802) extend along a second direction, wherein the second direction intersects with the first direction; The first connecting rod (801) and the second connecting rod (802) are connected in sequence. The second connecting rod (802) has a through hole (8021) on the side facing the middle plate (111). The radio frequency transmission line (70) passes through the through hole (8021) and is electrically connected to the main circuit board (31) and the sub-circuit board (32).

5. The electronic device according to claim 4, characterized in that, The radio frequency transmission line (70) includes an insulating medium (701) and a microstrip line (702) disposed on the insulating medium (701); The insulating medium (701) is at least partially embedded in the middle plate (111), the microstrip line (702) is flush with the inner surface of the middle plate (111), and the microstrip line (702) passes through the second frame (80) and is electrically connected to the main circuit board (31) and the sub-circuit board (32).

6. The electronic device according to claim 5, characterized in that, The thickness of the insulating medium (701) is 0.18mm-0.22mm, and / or the linewidth of the microstrip line (702) is 0.018mm-0.022mm.

7. The electronic device according to claim 6, characterized in that, The relative node constant of the insulating medium (701) is between 2.5 and 3.

5.

8. The electronic device according to claim 2, characterized in that, The electronic device further includes a second frame (80), which is disposed on the inner surface of the middle plate (111) to form a battery compartment; The main circuit board (31) and the sub-circuit board (32) are located on both sides of the battery compartment along the first direction. The radio frequency transmission line (70) is at least partially embedded in the middle plate (111) and the second frame (80), and the radio frequency transmission line (70) located on the second frame (80) is flush with the surface of the second frame (80). The radio frequency transmission line (70) passes through the second frame (80) and is electrically connected to the main circuit board (31) and the sub-circuit board (32), wherein the first direction is the length direction of the middle plate (111).

9. The electronic device according to claim 8, characterized in that, The second frame (80) includes a plurality of first connecting rods (801) and a plurality of second connecting rods (802), wherein the first connecting rods (801) extend along a first direction and the second connecting rods (802) extend along a second direction, wherein the second direction intersects with the first direction; The first connecting rod (801) and the second connecting rod (802) are connected in sequence. The second connecting rod (802) has a through hole (8021) on the side facing the middle plate (111). The radio frequency transmission line (70) is at least partially embedded in the first connecting rod (801). The radio frequency transmission line (70) passes through the through hole (8021) and is electrically connected to the main circuit board (31) and the sub-circuit board (32).

10. The electronic device according to claim 9, characterized in that, The radio frequency transmission line (70) includes an insulating medium (701) and a microstrip line (702) disposed on the insulating medium (701); The insulating medium (701) is at least partially embedded in the middle plate (111) and the first connecting rod (801), and the microstrip line (702) is in close contact with the inner surface of the middle plate (111) and the surface of the first connecting rod (801); the microstrip line (702) passes through the through hole (8021) and is electrically connected to the main circuit board (31) and the sub-circuit board (32).

11. The electronic device according to claim 10, characterized in that, The thickness of the insulating medium (701) is 0.18mm-0.22mm, and / or the linewidth of the microstrip line (702) is 0.018mm-0.022mm.

12. The electronic device according to claim 11, characterized in that, The relative node constant of the insulating medium (701) is between 2.5 and 3.

5.

13. The electronic device according to claim 5 or 10, characterized in that, The electronic device further includes a flexible element (90), one end of the microstrip line (702) being electrically connected to the main circuit board (31) via the flexible element (90), and / or, The other end of the microstrip line (702) is electrically connected to the sub-circuit board (32) via the elastic element (90).

14. The electronic device according to claim 1, characterized in that, The radio frequency transmission line (70) can be any one of microstrip line, coplanar waveguide, or stripline.

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