Water cooling plate device

Abstract

The invention provides a water cooling plate device. The water cooling plate device comprises a heat conduction shell, fins, a liquid inlet pipe and a liquid outlet pipe. The heat conduction shell has a heat dissipation space. The fins are arranged on the heat conduction shell and located in the heat dissipation space. The liquid inlet pipe is connected to the side, away from the fins, of the heat conduction shell and communicates with the heat dissipation space. The liquid inlet pipe comprises a first divergent part and a first external connection part. The first divergent part is connected with the heat conduction shell and the first external connection part. The width of the first divergent part is gradually increased from the end connected to the first external connection part to the end connected to the heat conduction shell. The liquid outlet pipe is connected to the side, away from the fins, of the heat conduction shell and communicates with the heat dissipation space. The first diverging portion corresponds to at least part of the fins. And the diverging direction of the first diverging part is not parallel to the extending direction of the fins. The heat dissipation efficiency of the water cooling plate device can be improved.

Description

Technical Field

[0001] This invention relates to a water-cooled plate device, and more particularly to a water-cooled plate device with a gradually expanding section in the liquid inlet pipe. Background Technology

[0002] Electronic devices generate a significant amount of heat during operation. If this heat is not effectively dissipated, internal electronic components can overheat, leading to malfunctions or system crashes. Therefore, electronic devices are typically equipped with appropriate cooling systems to ensure that components operate within their default temperature range. For high-performance electronic devices (such as servers), liquid cooling systems, such as water-cooled plates, can be used to provide superior heat dissipation.

[0003] Generally, manufacturers incorporate flow equalization structures at the inlet of water-cooled plates to improve heat dissipation efficiency by ensuring more uniform flow of the cooling fluid. However, current water-cooled plates often sacrifice some fin placement space for these flow equalization structures, reducing the fin area. This reduced fin area leads to a smaller heat exchange area, resulting in insufficient heat dissipation capacity and consequently lower heat dissipation efficiency. Therefore, improving the heat dissipation efficiency of water-cooled plate devices is one of the problems that researchers must address. Summary of the Invention

[0004] The purpose of this invention is to provide a water-cooled plate device to improve the heat dissipation efficiency of the water-cooled plate device.

[0005] An embodiment of the present invention discloses a water-cooled plate device for containing a cooling fluid, comprising a heat-conducting shell, a fin, an inlet pipe, and an outlet pipe. The heat-conducting shell has a heat dissipation space for containing the cooling fluid. The fin is disposed on the heat-conducting shell and located in the heat dissipation space. The inlet pipe is connected to the side of the heat-conducting shell away from the fin and communicates with the heat dissipation space. The inlet pipe includes a first expanding portion and a first external portion. Opposite sides of the first expanding portion are connected to the heat-conducting shell and the first external portion, respectively. The width of the first expanding portion increases from the end connected to the first external portion toward the end connected to the heat-conducting shell. The outlet pipe is connected to the side of the heat-conducting shell away from the fin and communicates with the heat dissipation space. The first expanding portion corresponds to at least a portion of the fin. The expanding direction of the first expanding portion is not parallel to the extending direction of the fin.

[0006] According to the water-cooled plate device of the above embodiment, since the liquid inlet pipe has a first gradually widening portion, the cooling fluid can flow more evenly to the heat dissipation space through the first gradually widening portion. Furthermore, the first gradually widening portion corresponds to at least a portion of the fins, meaning the liquid inlet pipe is located above the fins. Therefore, the fins can be distributed throughout the first housing without sacrificing the fin area to create a flow equalization structure. This avoids insufficient heat dissipation capacity of the water-cooled plate caused by a reduction in heat exchange area. In this way, the heat dissipation efficiency of the water-cooled plate device can be improved.

[0007] The above description of the content of this invention and the following description of the embodiments are used to demonstrate and explain the principles of this invention, and to provide a further explanation of the scope of the patent application of this invention. Attached Figure Description

[0008] Figure 1 This is a perspective view of the water-cooled plate device according to the first embodiment of the present invention.

[0009] Figure 2 for Figure 1 A top view of the water-cooled plate device.

[0010] Figure 3 for Figure 1 Exploded view of the water-cooled plate device.

[0011] Figure 4 For along Figure 2 Cross-sectional view of the water-cooled plate device with section line 4-4.

[0012] Figure 5 For along Figure 2 Another cross-sectional view of the water-cooled plate device with the section line of section 5-5.

[0013] Figure 6 for Figure 1 Another cross-sectional view of the water-cooled plate device.

[0014] Figure 7 This is a perspective view of the water-cooled plate device according to the second embodiment of the present invention.

[0015] Figure 8 for Figure 7 Exploded view of the water-cooled plate device.

[0016] Figure 9 for Figure 7 Cross-sectional schematic diagram of the water-cooled plate device.

[0017] Figure 10 This is a perspective view of the water-cooled plate device according to the third embodiment of the present invention.

[0018] Figure 11 for Figure 10Exploded view of the water-cooled plate device.

[0019] Figure 12 for Figure 10 Cross-sectional schematic diagram of the water-cooled plate device.

[0020] Component designation explanation

[0021] 10, 10A, 10B Water-cooled plate assembly

[0022] 11, 11A, 11B Thermal conductive shells

[0023] 111 First Shell

[0024] 112, 112A, 112B Second Shell

[0025] 1121 Base

[0026] 1122, 1122A, 1122B Protrusions

[0027] 1122B1 Inclined section

[0028] 12 fins

[0029] 121 First trench

[0030] 122 Second trench

[0031] 123 Third trench

[0032] 13, 13A, 13B Inlet Pipes

[0033] 131, 131A, 131B First Graduation Section

[0034] 132 First External Part

[0035] 14, 14A, 14B Discharge tubes

[0036] 141, 141A, 141B Second Graduation Section

[0037] 142 Second External Section

[0038] 15 First baffle block

[0039] 16A Second Baffle Block

[0040] 17A Third Baffle Block

[0041] Directions A to E

[0042] A1, A1a, A1b First Section

[0043] A2, A2a, A2b Second Section

[0044] A3, A3a, A3b, Third Section

[0045] A4, A4a, A4b, Fourth Section

[0046] D1 Distance

[0047] H1 height

[0048] Diameters of R1 and R2

[0049] S heat dissipation space Detailed Implementation

[0050] Please see Figures 1 to 5 . Figure 1 This is a perspective view of the water-cooled plate device according to the first embodiment of the present invention. Figure 2 for Figure 1 A top view of the water-cooled plate device. Figure 3 for Figure 1 Exploded view of the water-cooled plate device. Figure 4 For along Figure 2 Cross-sectional view of the water-cooled plate device with section line 4-4. Figure 5 For along Figure 2 Another cross-sectional view of the water-cooled plate device with the section line of section 5-5.

[0051] The water-cooled plate device 10 of this embodiment is used to contain a cooling fluid (not shown), such as water or a refrigerant, and to thermally couple it to a heat source (not shown). The water-cooled plate device 10 includes a heat-conducting shell 11, a fin 12, a liquid inlet pipe 13, a liquid outlet pipe 14, and a first baffle block 15. The heat-conducting shell 11 includes a first shell 111 and a second shell 112. The first shell 111 and the second shell 112 together surround a heat dissipation space S to contain the cooling fluid. The fin 12 is disposed on the first shell 111 and located in the heat dissipation space S. The second shell 112 includes a base 1121 and a protrusion 1122. The protrusion 1122 and the first shell 111 are respectively connected to opposite sides of the base 1121.

[0052] The liquid inlet pipe 13 is connected to the second housing 112, specifically to the side of the heat-conducting shell 11 away from the fins 12, and communicates with the heat dissipation space S. Specifically, the liquid inlet pipe 13 includes a first expanding portion 131 and a first external connection portion 132. The opposite sides of the first expanding portion 131 are connected to the protrusion 1122 of the second housing 112 and the first external connection portion 132, respectively. The width of the first expanding portion 131 increases from the end connected to the first external connection portion 132 towards the end connected to the protrusion 1122 of the second housing 112. This gradually widening design of the first expanding portion 131 allows the cooling fluid to flow more evenly into the heat dissipation space S after entering through the liquid inlet pipe 13.

[0053] The long side of the first expanding portion 131 is flush with the edge of the protrusion 1122 of the second housing 112. Furthermore, the first expanding portion 131 corresponds to at least a portion of the fin 12. That is, the liquid inlet pipe 13 is located above the fin 12. Moreover, the expanding direction of the first expanding portion 131 is not parallel to the extending direction of the fin 12, for example. For instance, the expanding direction of the first expanding portion 131 is perpendicular to the extending direction of the fin 12, for example.

[0054] The outlet pipe 14 is connected to the second housing 112, specifically to the side of the heat-conducting shell 11 away from the fins 12, and communicates with the heat dissipation space S. Specifically, the outlet pipe 14 includes a second expanding portion 141 and a second external connection portion 142. The opposite sides of the second expanding portion 141 are connected to the protrusion 1122 of the second housing 112 and the second external connection portion 142, respectively. The width of the second expanding portion 141 increases from the end connected to the second external connection portion 142 towards the end connected to the protrusion 1122 of the second housing 112. This gradually widening design of the second expanding portion 141 allows the cooling fluid to flow out of the heat dissipation space S more evenly.

[0055] The long side of the second expanding portion 141 is flush with the edge of the protrusion 1122 of the second housing 112. Furthermore, the liquid outlet pipe 14 corresponds to at least another portion of the fin 12. That is, the liquid outlet pipe 14 is located above the fin 12. Moreover, the expanding direction of the second expanding portion 141 is not parallel to the extending direction of the fin 12, for example. For instance, the expanding direction of the second expanding portion 141 is perpendicular to the extending direction of the fin 12, for example.

[0056] Furthermore, the diameter R2 of the second external portion 142 is larger than the diameter R1 of the first external portion 132. Since the liquid cooling fluid will evaporate into gaseous cooling fluid after flowing in the heat dissipation space S and absorbing the heat transferred by the heat source, and the density of the gaseous cooling fluid is greater than the density of the liquid cooling fluid, the volumetric flow rate of the cooling fluid at the outlet pipe 14 is greater than that at the inlet pipe 13. Therefore, by designing the diameter R2 of the second external portion 142 to be larger than the diameter R1 of the first external portion 132, the flow rate of the cooling fluid at the outlet pipe 14 is reduced to avoid the cooling fluid at the outlet pipe 14 from being too fast and causing corrosion to the water-cooled plate device 10.

[0057] The first baffle block 15 is disposed on the protrusion 1122 of the second housing 112 and located in the heat dissipation space S. The first baffle block 15 and the protrusion 1122 are, for example, separate components. The distance between the fins 12 and the first baffle block 15 increases from near the inlet pipe 13 towards near the outlet pipe 14. That is, the space between the fins 12 and the first baffle block 15 increases from near the inlet pipe 13 towards near the outlet pipe 14, making the flow resistance of the cooling fluid near the outlet pipe 14 less than that near the inlet pipe 13. This promotes the flow of cooling fluid towards the outlet pipe 14, preventing backflow and reducing heat dissipation efficiency.

[0058] The fin 12 has a first groove 121, a second groove 122 and a third groove 123, so that the liquid cooling fluid absorbs the heat from the heat source and transfers it to the heat-conducting shell 11 at the fin 12 and evaporates into gaseous cooling fluid, and can then detach from the fin 12 through the first groove 121, the second groove 122 and the third groove 123.

[0059] The first groove 121, the second groove 122, and the third groove 123, corresponding to the first baffle block 15, sequentially divide the first baffle block 15 into a first section A1, a second section A2, a third section A3, and a fourth section A4. The first section A1, the second section A2, the third section A3, and the fourth section A4 are arranged sequentially from near the inlet pipe 13 towards near the outlet pipe 14. The connection point between the first section A1 and the second section A2 is flush with the side of the first groove 121 near the inlet pipe 13 to prevent liquid cooling fluid from flowing out of the first groove 121 from the fins 12, thereby preventing localized dry burning due to insufficient liquid cooling fluid at the fins 12.

[0060] The second section A2, the third section A3, and the fourth section A4 are inclined planes on the side closest to fin 12, and the slopes of these sections increase sequentially. In other words, the closer to the downstream of the gaseous cooling fluid flow, the greater the slope of the corresponding section on the side closest to fin 12, meaning a larger space above fin 12. Since the flow rate of the gaseous cooling fluid increases non-linearly with the length of the flow path, the aforementioned design provides sufficient space for the gaseous cooling fluid to flow, thereby avoiding a reduction in heat dissipation efficiency.

[0061] The first section A1, on the side away from the second section A2, is inclined, for example, and slopes away from the end away from the fin 12 towards the direction away from the first expanding portion 131, thus guiding the cooling fluid from the inlet pipe 13 into the heat dissipation space S. The fourth section A4, on the side away from the third section A3, is flush with the inner wall surface of the second expanding portion 141. The side of the fourth section A4 flush with the inner wall surface of the second expanding portion 141 is, for example, vertical and not inclined. In this way, in addition to simplifying the structural design of the second housing 112, the height above the fin 12 can be reduced, thereby reducing the space above the fin 12. Therefore, liquid cooling fluid can be prevented from flowing from the fin 12 into the space above the fin 12 for the flow of gaseous cooling fluid, thus preventing localized dry burning due to insufficient liquid cooling fluid at the fin 12.

[0062] Furthermore, the distance D1 between the side of the fourth section A4 closest to the outlet pipe 14 and the fin 12 is, for example, less than or equal to half the height H1 of the fin 12, to reduce the space above the fin 12. In this way, liquid cooling fluid is prevented from flowing from the fin 12 to the space above the fin 12 for gaseous cooling fluid to flow, thereby preventing localized dry burning due to insufficient liquid cooling fluid at the fin 12.

[0063] In this embodiment, because the inlet pipe 13 has a gradually widening first expansion portion 131, the cooling fluid can flow more evenly to the heat dissipation space S through the first expansion portion 131. Furthermore, the first expansion portion 131 corresponds to at least a portion of the fins 12, meaning the inlet pipe 13 is located above the fins 12. Therefore, the fins 12 can cover the first housing 111 without sacrificing the area of ​​the fins 12 to create a uniform flow structure. This avoids insufficient heat dissipation capacity of the water-cooled plate due to a reduction in heat exchange area. In this way, the heat dissipation efficiency of the water-cooled plate device 10 can be improved.

[0064] Furthermore, in the heat dissipation space S of the water-cooled plate device 10, since the slopes of the second section A2, the third section A3 and the fourth section A4 on the side near the fin 12 increase sequentially, that is, the closer to the downstream of the gaseous cooling fluid flow, the larger the space above the fin 12 is, so that the water-cooled plate device 10 can have enough space for the gaseous cooling fluid to flow, thereby avoiding a reduction in heat dissipation efficiency.

[0065] In this embodiment, the first baffle block 15 and the protrusion 1122 are two independent components, but this is not a limitation. In other embodiments, the first baffle block may also be integrally formed with the protrusion.

[0066] In this embodiment, the second segment A2, the third segment A3, and the fourth segment A4 are inclined planes on the side near the fin 12, but this is not a limitation. In other embodiments, the second segment, the third segment, and the fourth segment may also be curved on the side near the fin.

[0067] Please refer to the following: Figure 6 . Figure 6 for Figure 1 Another cross-sectional view of the water-cooled plate device. In this embodiment, the water-cooled plate device 10 is thermally coupled to the heat source to dissipate heat. When the liquid cooling fluid flows in from the inlet pipe 13, it first flows in direction A within the inlet pipe 13 and diffuses into the heat dissipation space S at the first gradually expanding section 131. Then, guided by the side of the first section A1 away from the second section A2, it flows in direction B towards the fins 12.

[0068] Next, the liquid cooling fluid flows along direction C at the fin 12 and absorbs the heat transferred from the heat source to the heat-conducting shell 11. At this time, the liquid cooling fluid evaporates into gaseous cooling fluid after absorbing heat, and the gaseous cooling fluid exits the fin 12 along direction D from the first groove 121, the second groove 122, and the third groove 123, and flows along direction C in the space above the fin 12 to the outlet pipe 14. Then, the gaseous cooling fluid flows along direction E within the outlet pipe 14 and flows out of the outlet pipe 14 to perform the next cooling cycle for the heat source.

[0069] Please see Figures 7 to 9 . Figure 7 This is a perspective view of the water-cooled plate device according to the second embodiment of the present invention. Figure 8 for Figure 7 Exploded view of the water-cooled plate device. Figure 9 for Figure 7 Cross-sectional schematic diagram of the water-cooled plate device.

[0070] The water-cooled plate device 10A of this embodiment is similar to the water-cooled plate device 10 of the first embodiment. Therefore, the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In this embodiment, the long side of the first gradually expanding portion 131A of the liquid inlet pipe 13A and the long side of the second gradually expanding portion 141A of the liquid outlet pipe 14A are separated from the edge of the protrusion 1122A of the second housing 112A. In addition, the water-cooled plate device 10A includes a second baffle block 16A and a third baffle block 17A. The second baffle block 16A and the third baffle block 17A are located in the heat dissipation space S. The second baffle block 16A is disposed at the edge of the protrusion 1122A of the second housing 112A near the edge of the first gradually expanding portion 131A. The third baffle block 17A is disposed at the edge of the second housing 112A near the edge of the second gradually expanding portion 141A. The second baffle block 16A and the third baffle block 17A are, for example, three independent components of the protrusion 1122A.

[0071] The first section A1a is inclined on the side away from the second section A2a, and slopes from the end away from the fin 12 towards the direction away from the outlet pipe 14A. The second baffle block 16A is inclined on the side near the first baffle block 15, and together with the side of the first section A1a away from the second section A2a, it guides the cooling fluid from the inlet pipe 13A into the heat dissipation space S. Furthermore, through the aforementioned design, the cooling fluid can flow from the outermost part of the fin 12 in the heat dissipation space S, thereby making full use of the heat dissipation space S and avoiding a reduction in heat dissipation efficiency. The slope of the side of the second baffle block 16A near the first baffle block 15 is, for example, the same as the slope of the side of the first section A1a away from the second section A2a. On the other hand, the side of the third baffle block 17A near the first baffle block 15 slopes from the end away from the fin 12 towards the direction away from the inlet pipe 13A, so as to guide the cooling fluid from the heat dissipation space S into the outlet pipe 14A.

[0072] In this embodiment, since the long sides of the first expanding portion 131A and the second expanding portion 141A are separated from the edge of the protrusion 1122A, the cooling fluid is prone to mixing or settling near the edge of the protrusion 1122A close to the first expanding portion 131A, thereby reducing heat dissipation efficiency. By providing a second baffle 16A at the edge of the protrusion 1122A of the second housing 112A close to the edge of the first expanding portion 131A, the cooling fluid can flow directly to the fins 12, thus avoiding a reduction in heat dissipation efficiency.

[0073] In this embodiment, the second baffle block 16A and the protrusion 1122A are two independent components, but this is not a limitation. In other embodiments, the second baffle block may also be integrally formed with the protrusion.

[0074] Please see Figures 10 to 12 . Figure 10 This is a perspective view of the water-cooled plate device according to the third embodiment of the present invention. Figure 11 for Figure 10 Exploded view of the water-cooled plate device. Figure 12 for Figure 10 Cross-sectional schematic diagram of the water-cooled plate device.

[0075] The water-cooled plate device 10B of this embodiment is similar to the water-cooled plate device 10 of the first embodiment. Therefore, the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In this embodiment, the water-cooled plate device 10B does not have a first baffle block. In this way, the components of the water-cooled plate device 10B can be saved, thereby reducing the weight of the water-cooled plate device 10B.

[0076] Since the water-cooled plate device 10B does not have a first baffle block, the distance between the fin 12 and the protrusion 1122B of the second housing 112B increases from near the inlet pipe 13B to near the outlet pipe 14B. The first groove 121, second groove 122, and third groove 123 of the fin 12 correspond to the protrusion 1122B, and the first groove 121, second groove 122, and third groove 123 corresponding to the protrusion 1122B sequentially divide the protrusion 1122B into a first segment A1b, a second segment A2b, a third segment A3b, and a fourth segment A4b, as in the first embodiment. Furthermore, the protrusion 1122B has an inclined portion 1122B1. The inclined portion 1122B1 is obliquely located between the first expanding portion 131B of the inlet pipe 13B and the first segment A1b. By providing an inclined section 1122B1, cooling fluid can be guided from the inlet pipe 13B into the heat dissipation space S.

[0077] In this embodiment, the server of the present invention can be used for artificial intelligence (AI) computing, edge computing, and can also be used as a 5G server, cloud server, or vehicle networking server.

[0078] According to the water-cooled plate device of the above embodiment, since the liquid inlet pipe has a first gradually widening portion, the cooling fluid can flow more evenly to the heat dissipation space through the first gradually widening portion. Furthermore, the first gradually widening portion corresponds to at least a portion of the fins, meaning the liquid inlet pipe is located above the fins. Therefore, the fins can be distributed throughout the first housing without sacrificing the fin area to create a flow equalization structure. This avoids insufficient heat dissipation capacity of the water-cooled plate caused by a reduction in heat exchange area. In this way, the heat dissipation efficiency of the water-cooled plate device can be improved.

[0079] Furthermore, in the heat dissipation space of the water-cooled plate device, since the slope of the second, third and fourth sections near the fins increases sequentially, that is, the closer to the downstream of the gaseous cooling fluid flow, the larger the space above the fins, the water-cooled plate device can have enough space for the gaseous cooling fluid to flow, thereby avoiding a reduction in heat dissipation efficiency.

[0080] Although the present invention has been disclosed above with reference to the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the claims attached to this specification.

Claims

1. A water-cooled plate device, characterized in that, The water-cooled plate assembly is used to contain a cooling fluid and includes: A heat-conducting shell having a heat dissipation space and used to contain the cooling fluid; A fin is disposed on the heat-conducting shell and located in the heat dissipation space; A liquid inlet pipe is connected to the side of the heat-conducting shell away from the fins and communicates with the heat dissipation space. The liquid inlet pipe includes a first expanding portion and a first external connection portion. The opposite sides of the first expanding portion are respectively connected to the heat-conducting shell and the first external connection portion. The width of the first expanding portion increases from the end connected to the first external connection portion towards the end connected to the heat-conducting shell. The first expanding portion corresponds to at least a portion of the fins, and the expanding direction of the first expanding portion is not parallel to the extending direction of the fins. A liquid outlet pipe is connected to the side of the heat-conducting shell away from the fins and is connected to the heat dissipation space.

2. The water-cooled plate device according to claim 1, characterized in that, The liquid outlet pipe includes a second gradually expanding portion and a second external connection portion. The opposite sides of the second gradually expanding portion are respectively connected to the heat-conducting shell and the second external connection portion. The width of the second gradually expanding portion increases from one end connected to the second external connection portion toward one end connected to the heat-conducting shell. The second gradually expanding portion corresponds to at least another part of the fins, and the expanding direction of the second gradually expanding portion is not parallel to the extending direction of the fins. The diameter of the second external connection portion is larger than the diameter of the first external connection portion.

3. The water-cooled plate device according to claim 2, characterized in that, The heat-conducting shell includes a first shell and a second shell, which together surround the heat dissipation space. The first expanding portion of the liquid inlet pipe and the second expanding portion of the liquid outlet pipe are connected to the second shell, and the fins are disposed on the first shell.

4. The water-cooled plate device according to claim 3, characterized in that, The second housing includes a base and a protrusion. The protrusion and the first housing are respectively connected to opposite sides of the base. The first expanding portion of the inlet pipe and the second expanding portion of the outlet pipe are connected to the protrusion. The distance between the fin and the protrusion increases from the point near the inlet pipe to the point near the outlet pipe.

5. The water-cooled plate device according to claim 4, characterized in that, The fin has a first groove, a second groove, and a third groove. The first groove, the second groove, and the third groove sequentially divide the protrusion into a first segment, a second segment, a third segment, and a fourth segment at the locations corresponding to the protrusion. The first segment, the second segment, the third segment, and the fourth segment are arranged sequentially from the location near the inlet pipe toward the location near the outlet pipe. The connection between the first segment and the second segment is flush with the side of the first groove near the inlet pipe. The side of the second segment, the third segment, and the fourth segment near the fin is an inclined plane, and the slope of the side of the second segment, the third segment, and the fourth segment near the fin increases sequentially.

6. The water-cooled plate device according to claim 5, characterized in that, The long side of the first gradually expanding portion of the inlet pipe and the long side of the second gradually expanding portion of the outlet pipe are flush with the edge of the second housing, and the protrusion has an inclined portion, which is obliquely located between the first gradually expanding portion of the inlet pipe and the first section.

7. The water-cooled plate device according to claim 3, characterized in that, It also includes a first baffle block, which is disposed in the second housing and located in the heat dissipation space, and the distance between the fins and the first baffle block increases from the liquid inlet pipe toward the liquid outlet pipe.

8. The water-cooled plate device according to claim 7, characterized in that, The fin has a first groove, a second groove, and a third groove. The first groove, the second groove, and the third groove sequentially divide the first flow-blocking block into a first segment, a second segment, a third segment, and a fourth segment at the locations corresponding to the first flow-blocking block. The first segment, the second segment, the third segment, and the fourth segment are arranged sequentially from the location near the inlet pipe to the location near the outlet pipe. The connection between the first segment and the second segment is flush with the side of the first groove near the inlet pipe. The side of the second segment, the third segment, and the fourth segment near the fin is an inclined plane, and the slope of the side of the second segment, the third segment, and the fourth segment near the fin increases sequentially.

9. The water-cooled plate device according to claim 8, characterized in that, The long side of the first gradually expanding portion of the inlet pipe and the long side of the second gradually expanding portion of the outlet pipe are flush with the edge of the second housing. The side of the first section away from the second section is inclined and tilts from the end away from the fin toward the direction away from the first gradually expanding portion. The side of the fourth section away from the third section is flush with the inner wall surface of the second gradually expanding portion.

10. The water-cooled plate device according to claim 8, characterized in that, It also includes a second baffle block and a third baffle block, and the long side of the first gradually expanding portion of the liquid inlet pipe and the long side of the second gradually expanding portion of the liquid outlet pipe are separated from the edge of the second housing. The second baffle block and the third baffle block are located in the heat dissipation space. The second baffle block is disposed at the edge of the second housing near the first gradually expanding portion, and the third baffle block is disposed at the edge of the second housing near the second gradually expanding portion. The side of the first section away from the second section is inclined and tilts from the end away from the fins toward the direction away from the liquid outlet pipe. The side of the second baffle block near the first baffle block is inclined, and the slope of the side of the second baffle block near the first baffle block is the same as the slope of the side of the first section away from the second section. The side of the third baffle block near the first baffle block tilts from the end away from the fins toward the direction away from the liquid inlet pipe. The side of the fourth section away from the third section is flush with the inner wall surface of the second gradually expanding portion.

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