Wafer dry-type cleaning equipment for integrated circuit manufacturing

Abstract

The invention relates to the technical field of dry-type cleaning, and particularly discloses wafer dry-type cleaning equipment for integrated circuit manufacturing, which comprises a box body, the inner wall of the box body is fixedly connected with the fixed end of a first electric telescopic rod, the movable end of the first electric telescopic rod is fixedly connected with a placing disc, and the inner wall of the box body is fixedly connected with a clamping device. The top of the box body is fixedly connected with a plasma generator, the outlet end of the plasma generator communicates with a connecting pipe, the end, away from the plasma generator, of the connecting pipe communicates with a cleaning device, the top of the cleaning device is fixedly connected with the inner wall of the box body, the inner wall of the box body is fixedly connected with a vacuum extraction device, and one side of the box body is rotationally connected with a sealing door through a rotating bolt. An observation window is fixedly connected to one side of the sealing door, the clamping device comprises a connecting block, and a motor support is fixedly connected to one side of the connecting block. According to the wafer dry-type cleaning equipment for integrated circuit manufacturing, the purposes of adjusting the cleaning angle, preventing the vacuum adsorption device from being blocked and flexibly clamping are achieved.

Description

Technical Field

[0001] This invention relates to the field of wafer dry cleaning technology, specifically to a wafer dry cleaning device for integrated circuit manufacturing. Background Technology

[0002] In integrated circuit manufacturing, wafer cleaning is a critical process that runs throughout the entire process. Its core purpose is to remove contaminants from the wafer surface, directly affecting chip yield and performance. Early wafer cleaning mainly used wet cleaning, removing contaminants by immersing or spraying with chemical solutions. However, this method has significant drawbacks. The chemicals can corrode the delicate structures on the wafer surface, especially in advanced processes where structural dimensions have reached the atomic level, drastically increasing the risk of corrosion. The use of chemical solutions also generates large amounts of wastewater containing heavy metals and toxic substances, resulting in high treatment costs and failing to meet environmental protection requirements. Furthermore, the chemicals struggle to penetrate the complex structures on the wafer surface, such as deep holes and trenches, leaving contaminants behind and creating "cleaning blind spots."

[0003] Traditional cleaning equipment has drawbacks such as the need for manual reversing during cleaning, which makes it easy for dust to get stuck. Plasma cleaning is inconvenient to deflect at different angles. During cleaning, vacuum adsorption can suck up the cleaned debris into the vacuum pump, causing blockages. Summary of the Invention

[0004] To solve the above problems, the present invention is implemented through the following technical solution: a wafer dry cleaning equipment for integrated circuit manufacturing, comprising a housing, a fixed end of a first electric telescopic rod fixedly connected to the inner wall of the housing, a placement tray fixedly connected to the movable end of the first electric telescopic rod, a clamping device fixedly connected to the inner wall of the housing, a plasma generator fixedly connected to the top of the housing, a connecting pipe connected to the outlet end of the plasma generator, a cleaning device connected to the end of the connecting pipe away from the plasma generator, a cleaning device fixedly connected to the top of the cleaning device and the inner wall of the housing, a vacuum extraction device fixedly connected to the inner wall of the housing, a sealing door rotatably connected to one side of the housing via a rotating bolt, and an observation window fixedly connected to one side of the sealing door; The clamping device includes a connecting block, a motor bracket is fixedly connected to one side of the connecting block, a first drive motor is fixedly connected to the inner wall of the motor bracket, the drive shaft of the first drive motor passes through the motor bracket and is fixedly connected to a first connecting plate, a slide rail is fixedly connected to the side of the first connecting plate away from the first drive motor, a gripper is fixedly connected to one side of the slider inside the slide rail, and a buffer device is fixedly connected to one side of the gripper.

[0005] Preferably, one side of the connecting block is fixedly connected to the inner wall of the housing, the gripper is slidably connected to the first connecting plate, and the first electric telescopic rod moves the placement tray to a suitable position. Then, the slider in the slide rail of the gripping device is activated to move the gripper. Under the action of the buffer device, the gripper stably and gently grips the wafer.

[0006] Preferably, the buffer device includes a second connecting plate, a limiter is fixedly connected to one side of the second connecting plate, and a fixed end of a first elastic telescopic rod is fixedly connected to a portion of one side of the second connecting plate located on the side of the limiter. A clamping block is rotatably connected to the movable end of the first elastic telescopic rod via a rotating seat. A limit groove is formed on the side of the clamping block away from the first elastic telescopic rod, and a buffer pad is fixedly connected to the inner wall of the limit groove.

[0007] Preferably, one side of the second connecting plate is fixedly connected to one side of the gripper. Multiple sets of the first elastic telescopic rods are evenly distributed on one side of the second connecting plate. The multiple sets of first elastic telescopic rods will automatically adjust their respective telescopic lengths according to the size and shape of the wafer, and will automatically adjust their respective telescopic lengths according to the magnitude of the reaction force, so that the clamping block can fit tightly and evenly against the wafer surface. The buffer pad in the limiting groove will first contact the wafer. The buffer pad is made of a soft and elastic material, which can effectively disperse the clamping force and avoid damage or scratches on the wafer surface due to excessive local pressure.

[0008] Preferably, the cleaning device includes a fixed plate, a cross slide rail is fixedly connected to the bottom of the fixed plate, a fixed end of a second elastic telescopic rod is fixedly connected to the bottom of the slider inside the cross slide rail, a bracket is fixedly connected to the movable end of the second elastic telescopic rod, a first servo motor is fixedly connected to one side of the bottom of the bracket, the drive shaft of the first servo motor passes through the bracket and is fixedly connected to a screw, a second servo motor is fixedly connected to the bottom of the side of the bracket away from the first servo motor, a support frame is fixedly connected to the drive shaft of the second servo motor, a gear is rotatably connected to the inner wall of the support frame through a rotating bolt, a connecting frame is fixedly connected to one side of the gear, and a plasma nozzle is fixedly connected to the top of the connecting frame.

[0009] Preferably, the top of the fixing plate is fixedly connected to the inner wall of the box, and the side of the support frame away from the second servo motor is rotatably connected to the drive shaft of the first servo motor through a bearing.

[0010] Preferably, the screw is meshed with the gear, and the connecting frame is rotatably connected to the support frame. Through the coordinated action of the cross slide rail, the second elastic telescopic rod, and two servo motors, the plasma nozzle can precisely adjust its position and angle to ensure that the plasma is evenly sprayed onto all parts of the wafer surface. Whether it is the front, back, or edge of the wafer, it can be thoroughly cleaned, which greatly improves the comprehensiveness and uniformity of cleaning, thereby improving the cleanliness of the wafer. This equipment can adapt to wafers of different specifications and shapes.

[0011] Preferably, the vacuum extraction device includes a support plate, a vacuum pump is fixedly connected to the top of the support plate, an air pipe is connected to the air inlet of the vacuum pump, an air guide box is connected to the end of the air pipe away from the vacuum pump, a barrier is fixedly connected to one side of the air guide box, a first filter screen is fixedly connected to the inner wall of the barrier, and a second filter screen is fixedly connected to the portion of the inner wall of the barrier located on the side of the first filter screen.

[0012] Preferably, the support plate is fixedly connected to one side of the box, the air guide box is fixedly connected to the inner wall of the box, and the first filter and the second filter sequentially filter the incoming exhaust gas to remove particles and microparticles. Through this working principle, the vacuum extraction device can effectively purify the cleaning environment and improve the cleaning quality.

[0013] This invention provides a dry cleaning apparatus for wafers used in integrated circuit manufacturing. It offers the following advantages: 1. This wafer dry cleaning equipment for integrated circuit manufacturing is equipped with a clamping device; the slider in the slide rail drives the clamping jaws to move, and the jaws, under the action of the buffer device, stably and gently clamp the wafer. Then, the sealed door is closed, and the internal condition can be observed through the observation window. Plasma cleaning technology can penetrate into the tiny gaps and uneven areas on the wafer surface, and has a good removal effect on various types of contaminants, greatly improving the cleanliness of the wafer and providing a high-quality foundation for subsequent integrated circuit manufacturing processes.

[0014] 2. This wafer dry cleaning equipment for integrated circuit manufacturing is equipped with a buffer device. In traditional clamping methods, due to the lack of an effective buffer mechanism, the impact force or uneven local pressure when the clamping jaws contact the wafer is too great, which can cause scratches and damage to the wafer surface, affecting the quality of the wafer and subsequent integrated circuit manufacturing processes. This device uses multiple sets of first elastic telescopic rods to automatically adjust the telescopic length according to the size and shape of the wafer, as well as buffer pads to disperse the clamping force, which protects the wafer surface in all aspects, greatly reducing the damage rate of the wafer during the clamping process and improving the wafer yield.

[0015] 3. The wafer dry cleaning equipment for integrated circuit manufacturing is equipped with a cleaning device; through the coordinated action of the cross slide rail, the second elastic telescopic rod and two servo motors, the plasma nozzle can be precisely adjusted in position and angle to ensure that the plasma is evenly sprayed onto all parts of the wafer surface. Whether it is the front, back or edge of the wafer, it can be thoroughly cleaned, which greatly improves the comprehensiveness and uniformity of cleaning, thereby improving the cleanliness of the wafer. At the same time, the device can adapt to wafers of different specifications and shapes.

[0016] 4. The wafer dry cleaning equipment for integrated circuit manufacturing is equipped with a vacuum extraction device; the first filter can intercept larger particles and impurities, preventing them from entering the air pipe and vacuum pump, causing equipment damage or affecting extraction efficiency; the second filter further filters finer particles and dust, ensuring that the gas emitted to the outside is cleaner. By timely extraction of waste gas and particles generated during the cleaning process, the secondary contamination of the wafer surface by these pollutants is reduced, thereby improving the cleanliness and yield of the wafer. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the wafer dry cleaning equipment for integrated circuit manufacturing according to the present invention. Figure 2 This is a schematic diagram of the internal structure of the wafer dry cleaning equipment for integrated circuit manufacturing according to the present invention. Figure 3 This is a schematic diagram of the clamping device of the present invention; Figure 4 This is a schematic diagram of the buffer device structure of the present invention; Figure 5 This is a schematic diagram of the cleaning device structure of the present invention; Figure 6 This is a schematic diagram of the side structure of the cleaning device of the present invention; Figure 7 This is a schematic diagram of the vacuum extraction device of the present invention; Figure 8 This is a schematic diagram of the internal structure of the vacuum extraction device of the present invention.

[0018] In the diagram: 1. Box body; 2. First electric telescopic rod; 3. Placement tray; 5. Clamping device; 51. Connecting block; 52. Motor bracket; 53. First drive motor; 54. First connecting plate; 55. Slide rail; 56. Gripper; 57. Buffer device; 571. Second connecting plate; 572. Limiter; 573. First elastic telescopic rod; 574. Clamping block; 575. Limiting groove; 576. Buffer pad; 6. Plasma generator; 7. Connecting pipe; 8. Cleaning device; 81. Fixed plate; 82. Cross slide rail; 83. Second elastic telescopic rod; 84. Bracket; 85. First servo motor; 86. Screw; 87. Second servo motor; 88. Support frame; 89. Gear; 810. Connecting frame; 811. Plasma nozzle; 9. Vacuum extraction device; 91. Support plate; 92. Vacuum pump; 93. Air pipe; 94. Air guide box; 95. Enclosure; 96. First filter screen; 97. Second filter screen; 10. Sealed door; 11. Observation window. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] For the first embodiment, please refer to... Figures 1-3 The present invention provides a technical solution: a wafer dry cleaning equipment for integrated circuit manufacturing, comprising a housing 1, a fixed end of a first electric telescopic rod 2 fixedly connected to the inner wall of the housing 1, a placement tray 3 fixedly connected to the movable end of the first electric telescopic rod 2, a clamping device 5 fixedly connected to the inner wall of the housing 1, a plasma generator 6 fixedly connected to the top of the housing 1, a connecting pipe 7 connected to the outlet end of the plasma generator 6, a cleaning device 8 connected to the end of the connecting pipe 7 away from the plasma generator 6, a cleaning device 8 fixedly connected to the top of the cleaning device 8 and the inner wall of the housing 1, a vacuum extraction device 9 fixedly connected to the inner wall of the housing 1, a sealing door 10 rotatably connected to one side of the housing 1 via a rotating bolt, and an observation window 11 fixedly connected to one side of the sealing door 10; The clamping device 5 includes a connecting block 51. A motor bracket 52 is fixedly connected to one side of the connecting block 51. A first drive motor 53 is fixedly connected to the inner wall of the motor bracket 52. The drive shaft of the first drive motor 53 passes through the motor bracket 52 and is fixedly connected to a first connecting plate 54. A slide rail 55 is fixedly connected to the side of the first connecting plate 54 away from the first drive motor 53. A gripper 56 is fixedly connected to one side of the slider inside the slide rail 55. A buffer device 57 is fixedly connected to one side of the gripper 56.

[0021] One side of the connecting block 51 is fixedly connected to the inner wall of the housing 1, and the gripper 56 is slidably connected to the first connecting plate 54.

[0022] In use, the wafer to be cleaned is placed on the placement tray 3. The first electric telescopic rod 2 is activated, causing its movable end to move the placement tray 3 to a suitable position. Then, the slider in the slide rail 55 moves the gripper 56. Under the action of the buffer device 57, the gripper 56 stably and gently clamps the wafer. Subsequently, the sealing door 10 is closed, and the internal situation can be observed through the observation window 11. The vacuum extraction device 9 is turned on to create a vacuum environment inside the chamber 1. The plasma generator 6 starts working, generating high-energy plasma. This plasma is transported to the cleaning device 8 through the connecting pipe 7. The cleaning device 8 performs a dry cleaning operation on the clamped wafer. The active particles in the plasma react with the wafer. The contaminants on the wafer surface undergo a chemical reaction, decomposing them into harmless small molecules, which are then discharged from the housing 1 through the vacuum extraction device 9, thus achieving the purpose of dry cleaning. When the wafer needs to be flipped during cleaning, the drive shaft of the first drive motor 53 drives the first connecting plate 54 to rotate, turning the wafer over and cleaning the other side of the wafer. Plasma cleaning technology can penetrate into the tiny gaps and uneven areas on the wafer surface, and has a good removal effect on various types of contaminants, greatly improving the cleanliness of the wafer. The entire cleaning process does not require chemical cleaning agents and will not produce wastewater, exhaust gas or other pollutants containing chemical substances, effectively avoiding the secondary pollution problems that may be caused by traditional wet cleaning.

[0023] For the second embodiment, please refer to... Figures 1-4 Based on the first embodiment, the present invention provides a technical solution: the buffer device 57 includes a second connecting plate 571, a limiter 572 is fixedly connected to one side of the second connecting plate 571, a fixed end of a first elastic telescopic rod 573 is fixedly connected to the part of the second connecting plate 571 located on the side of the limiter 572, the movable end of the first elastic telescopic rod 573 is rotatably connected to a clamping block 574 through a rotating seat, a limit groove 575 is opened on the side of the clamping block 574 away from the first elastic telescopic rod 573, and a buffer pad 576 is fixedly connected to the inner wall of the limit groove 575.

[0024] One side of the second connecting plate 571 is fixedly connected to one side of the gripper 56, and multiple sets of the first elastic telescopic rods 573 are evenly distributed on one side of the second connecting plate 571.

[0025] In use, when the gripper 56 approaches the wafer and performs a gripping action, the second connecting plate 571 moves accordingly. At this time, the limiter 572 plays a role in initial positioning and limiting the range of movement, restricting the range of movement of the second connecting plate 571, thereby indirectly controlling the movement distance of the clamping block 574 and preventing excessive movement of the clamping block 574 from damaging the wafer. Multiple sets of first elastic telescopic rods 573 automatically adjust their respective telescopic lengths according to the size and shape of the wafer, and automatically adjust their telescopic lengths according to the magnitude of the reaction force received, thus... The clamping block 574 can fit tightly and evenly on the wafer surface. When the clamping block 574 contacts the wafer surface, the buffer pad 576 in the limiting groove 575 will first contact the wafer. The buffer pad 576 is made of a soft and elastic material, which can effectively disperse the clamping force and avoid damage or scratches on the wafer surface due to excessive local pressure. At the same time, the first elastic telescopic rod 573 will elastically contract according to the reaction force it receives, further buffering the impact force generated during the clamping process, ensuring that the jaws 56 can stably and gently clamp the wafer.

[0026] Third embodiment, please refer to Figures 1-6 Based on the second embodiment, the present invention provides a technical solution: the cleaning device 8 includes a fixed plate 81, a cross slide rail 82 is fixedly connected to the bottom of the fixed plate 81, the bottom of the slider inside the cross slide rail 82 is fixedly connected to the fixed end of the second elastic telescopic rod 83, the movable end of the second elastic telescopic rod 83 is fixedly connected to the bracket 84, a first servo motor 85 is fixedly connected to one side of the bottom of the bracket 84, the drive shaft of the first servo motor 85 passes through the bracket 84 and is fixedly connected to the screw 86, a second servo motor 87 is fixedly connected to the bottom of the side of the bracket 84 away from the first servo motor 85, the drive shaft of the second servo motor 87 is fixedly connected to the support frame 88, a gear 89 is rotatably connected to the inner wall of the support frame 88 through a rotating bolt, a connecting frame 810 is fixedly connected to one side of the gear 89, and a plasma nozzle 811 is fixedly connected to the top of the connecting frame 810.

[0027] The top of the fixed plate 81 is fixedly connected to the inner wall of the housing 1, and the side of the support frame 88 away from the second servo motor 87 is rotatably connected to the drive shaft of the first servo motor 85 through a bearing.

[0028] The screw 86 is meshed with the gear 89, and the connecting frame 810 is rotatably connected to the support frame 88.

[0029] In use, the cross slide rail 82 provides sliding tracks for the second elastic telescopic rod 83 in both horizontal and vertical directions, allowing the second elastic telescopic rod 83 to be flexibly adjusted in position according to actual needs. The second elastic telescopic rod 83 automatically adjusts its telescopic length according to the size and position of the wafer. When adjusted to the appropriate position, the bracket 84 fixedly connected to its movable end is also positioned. The bracket 84, as a carrier for other components, provides stable support for the first servo motor 85 and the second servo motor 87. After the first servo motor 85 starts, its drive shaft drives the screw 86 to rotate. Screw 86 meshes with gear 89. The rotation of screw 86 drives gear 89 to rotate. Gear 89 is fixedly connected to connecting frame 810 via a connecting rod. Therefore, the rotation of gear 89 drives connecting frame 810 to rotate. At the same time, second servo motor 87 starts, and its drive shaft drives support frame 88 to rotate. Because the side of support frame 88 away from second servo motor 87 is rotatably connected to drive shaft of first servo motor 85 via bearing, and connecting frame 810 is rotatably connected to support frame 88, under the action of second servo motor 87, support frame 88 drives connecting frame 810 to rotate in another direction. Through the coordinated action of the first servo motor 85 and the second servo motor 87, the connecting frame 810 can be precisely adjusted to the appropriate position and angle. The plasma nozzle 811, fixed to the top of the connecting frame 810, can uniformly and accurately spray the plasma generated by the plasma generator 6 onto the surface of the wafer held by the clamping device 5, achieving efficient dry cleaning of the wafer. Through the coordinated action of the cross slide rail 82, the second elastic telescopic rod 83, and the two servo motors, the plasma nozzle 811 can precisely adjust its position and angle, ensuring that the plasma is uniformly sprayed onto the wafer surface. Every part of the wafer, whether it is the front, back or the edge, can be thoroughly cleaned, greatly improving the comprehensiveness and uniformity of the cleaning, thereby improving the cleanliness of the wafer. This equipment can adapt to wafers of different specifications and shapes. Since wafers of different batches and specifications vary in size and shape, traditional fixed cleaning devices 8 can hardly meet diverse cleaning needs. However, this cleaning device 8, through adjustable mechanical structure and motor control, can flexibly adjust the position and angle of the plasma nozzle 811 according to the actual situation of the wafer, ensuring the best cleaning effect under different conditions.

[0030] For the fourth embodiment, please refer to [link / reference]. Figures 1-8Based on the third embodiment, the present invention provides a technical solution: the vacuum extraction device 9 includes a support plate 91, a vacuum pump 92 is fixedly connected to the top of the support plate 91, the air inlet end of the vacuum pump 92 is connected to an air pipe 93, the end of the air pipe 93 away from the vacuum pump 92 is connected to an air guide box 94, a baffle 95 is fixedly connected to one side of the air guide box 94, a first filter screen 96 is fixedly connected to the inner wall of the baffle 95, and a second filter screen 97 is fixedly connected to the portion of the inner wall of the baffle 95 located on one side of the first filter screen 96.

[0031] The support plate 91 is fixedly connected to one side of the box 1, and the air guide box 94 is fixedly connected to the inner wall of the box 1.

[0032] In use, the support plate 91 serves as the basic support component of the entire device, firmly connected to one side of the housing 1, providing a stable mounting platform for the vacuum pump 92. After the vacuum pump 92 is started, its air inlet is connected to the air guide box 94 through the air pipe 93, and begins to draw air from the air guide box 94. The air guide box 94 is fixedly connected to the inner wall of the housing 1, and its position design allows for the effective collection of waste gas and particles generated during the cleaning process. The enclosure 95 surrounds one side of the air guide box 94, forming a relatively enclosed space, which helps to concentrate the extraction of waste gas. The first filter 96 and the second filter 97 fixedly connected to the inner wall of the enclosure 95 play an important filtering role. The first filter 96 can intercept larger particles and impurities, preventing them from entering the air pipe 93 and the vacuum pump 92, causing equipment damage or affecting the extraction efficiency. The second filter 97 further filters finer particles and dust, ensuring that the gas discharged to the outside is cleaner. By timely extraction of waste gas and particles generated during the cleaning process, the secondary contamination of the wafer surface by these contaminants is reduced, thereby improving the cleanliness and yield of the wafer.

[0033] Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art and related fields based on the embodiments of the present invention without inventive effort should fall within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described and explained in the present invention, unless otherwise specified or limited, shall be implemented according to conventional means in the art.

Claims

1. A wafer dry cleaning device for integrated circuit manufacturing, characterized in that: The enclosure includes a housing (1), the inner wall of which is fixedly connected to the fixed end of a first electric telescopic rod (2), the movable end of which is fixedly connected to a placement plate (3), the inner wall of which is fixedly connected to a clamping device (5), the top of which is fixedly connected to a plasma generator (6), the outlet end of which is connected to a connecting pipe (7), the end of which is away from the plasma generator (6) is connected to a cleaning device (8), the top of which is fixedly connected to the inner wall of the housing (1), the inner wall of which is fixedly connected to a vacuum extraction device (9), and a sealing door (10) is rotatably connected to one side of the housing (1) via a rotating bolt, and an observation window (11) is fixedly connected to one side of the sealing door (10). The clamping device (5) includes a connecting block (51), a motor bracket (52) is fixedly connected to one side of the connecting block (51), a first drive motor (53) is fixedly connected to the inner wall of the motor bracket (52), the drive shaft of the first drive motor (53) passes through the motor bracket (52) and is fixedly connected to a first connecting plate (54), a slide rail (55) is fixedly connected to the side of the first connecting plate (54) away from the first drive motor (53), a gripper (56) is fixedly connected to the slider inside the slide rail (55), and a buffer device (57) is fixedly connected to the side of the gripper (56).

2. The wafer dry cleaning equipment for integrated circuit manufacturing according to claim 1, characterized in that: One side of the connecting block (51) is fixedly connected to the inner wall of the box (1), and the gripper (56) is slidably connected to the first connecting plate (54).

3. The wafer dry cleaning equipment for integrated circuit manufacturing according to claim 1, characterized in that: The buffer device (57) includes a second connecting plate (571), a limiter (572) is fixedly connected to one side of the second connecting plate (571), and a fixed end of a first elastic telescopic rod (573) is fixedly connected to the part of the second connecting plate (571) located on the side of the limiter (572). The movable end of the first elastic telescopic rod (573) is rotatably connected to a clamping block (574) through a rotating seat. A limit groove (575) is opened on the side of the clamping block (574) away from the first elastic telescopic rod (573). A buffer pad (576) is fixedly connected to the inner wall of the limit groove (575).

4. The wafer dry cleaning equipment for integrated circuit manufacturing according to claim 3, characterized in that: The second connecting plate (571) is fixedly connected to the gripper (56) on one side, and the first elastic telescopic rod (573) is provided in multiple sets and evenly distributed on one side of the second connecting plate (571).

5. The wafer dry cleaning equipment for integrated circuit manufacturing according to claim 1, characterized in that: The cleaning device (8) includes a fixed plate (81), a cross slide rail (82) is fixedly connected to the bottom of the fixed plate (81), the bottom of the slider inside the cross slide rail (82) is fixedly connected to the fixed end of the second elastic telescopic rod (83), the movable end of the second elastic telescopic rod (83) is fixedly connected to the bracket (84), a first servo motor (85) is fixedly connected to the bottom of one side of the bracket (84), the drive shaft of the first servo motor (85) passes through the bracket (84) and is fixedly connected to the screw (86), a second servo motor (87) is fixedly connected to the bottom of the side of the bracket (84) away from the first servo motor (85), the drive shaft of the second servo motor (87) is fixedly connected to the support frame (88), the inner wall of the support frame (88) is rotatably connected to the gear (89) through a rotating bolt, a connecting frame (810) is fixedly connected to one side of the gear (89), and a plasma nozzle (811) is fixedly connected to the top of the connecting frame (810).

6. The wafer dry cleaning equipment for integrated circuit manufacturing according to claim 5, characterized in that: The top of the fixing plate (81) is fixedly connected to the inner wall of the box (1), and the side of the support frame (88) away from the second servo motor (87) is rotatably connected to the drive shaft of the first servo motor (85) through a bearing.

7. The wafer dry cleaning equipment for integrated circuit manufacturing according to claim 5, characterized in that: The screw (86) is meshed with the gear (89), and the connecting frame (810) is rotatably connected to the support frame (88).

8. The wafer dry cleaning equipment for integrated circuit manufacturing according to claim 1, characterized in that: The vacuum extraction device (9) includes a support plate (91), a vacuum pump (92) is fixedly connected to the top of the support plate (91), an air pipe (93) is connected to the air inlet end of the vacuum pump (92), an air guide box (94) is connected to the end of the air pipe (93) away from the vacuum pump (92), a barrier (95) is fixedly connected to one side of the air guide box (94), a first filter screen (96) is fixedly connected to the inner wall of the barrier (95), and a second filter screen (97) is fixedly connected to the part of the inner wall of the barrier (95) located on the side of the first filter screen (96).

9. A wafer dry cleaning device for integrated circuit manufacturing according to claim 8, characterized in that: The support plate (91) is fixedly connected to one side of the box (1), and the air guide box (94) is fixedly connected to the inner wall of the box (1).

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