Substrate processing apparatus and substrate processing method using the same

Abstract

The present invention relates to a substrate processing apparatus and a substrate processing method using the same, and a first driving unit, which is a structure allowing a chuck pin and a guide ring unit to move simultaneously, includes a bearing. Thus, even when the guide ring is lowered and the chuck pin is separated from the substrate, the substrate can be rotated, thereby reducing damage to a liquid pit and ensuring substrate processing uniformity.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method using the apparatus, and more specifically, to an apparatus for liquid processing of a substrate and a method for processing a substrate using the apparatus. Background Technology

[0002] Semiconductor processes include cleaning thin films, foreign matter, particles, etc., from substrates. The cleaning process involves placing the substrate on a rotating chuck and simultaneously supplying a processing solution to the upper surface of the substrate while rotating a support unit.

[0003] The support unit can rotate at various speeds depending on the supplied processing liquid, which includes various types of chemical solutions, such as rinsing solutions, drying solutions, and etching solutions. When rinsing and drying solutions are supplied, the support unit can rotate at high speeds. During this process, some of the processing liquid is scattered from the substrate due to centrifugal force. Typically, the scattered processing liquid may lead to particle generation and is therefore recovered by the processing bowl. However, because the processing bowl is spaced a certain distance from the substrate, the amount and range of scattered processing liquid increase with the rotational speed of the rotary chuck, leading to difficulties in recovery. To solve this problem, a guide ring is introduced to guide the processing liquid to the processing bowl at a position closer to the substrate than the processing bowl.

[0004] However, when using guide rings, etchant forms puddles during substrate processing, and a bridging phenomenon occurs between these puddles and the guide ring, making it difficult to maintain puddle stability. Furthermore, while a technique allowing the guide ring to move up and down is employed to avoid interference with the robot transporting the substrate, this technique has limitations: it cannot rotate the substrate while the guide ring is descending. This is because the driven handle connected to the guide ring is designed to descend along with it when a downward force is applied by the driving handle. As a result, although the processing liquid can be effectively recovered via the guide ring, it is difficult to rotate the support unit and maintain puddle stability during substrate processing by forming puddles. Summary of the Invention

[0005] This invention aims to provide a substrate processing apparatus and a substrate processing method using the same apparatus, which can improve the uniformity of substrate liquid processing.

[0006] The present invention also aims to provide a substrate processing apparatus that minimizes damage to liquid pits and a substrate processing method using the apparatus.

[0007] The present invention also aims to provide a substrate processing apparatus that can rotate the substrate even when the guide ring is lowered, and a substrate processing method using the apparatus.

[0008] The present invention also aims to provide a substrate processing apparatus that can rotate the substrate even when the chuck pins are spaced apart from the substrate, and a substrate processing method using the apparatus.

[0009] The purpose of this disclosure is not limited thereto, and other purposes not stated herein will be readily apparent to those skilled in the art from the following description.

[0010] According to an exemplary embodiment of this disclosure, an apparatus for processing a substrate includes: a processing bowl configured to provide a processing space for processing the substrate; a support unit configured to support and rotate the substrate in the processing space; and a processing liquid supply unit configured to supply processing liquid to an upper surface of the substrate supported by the support unit, wherein the support unit includes: a rotary chuck on which the substrate is placed and rotated; a chuck pin mounted on the rotary chuck to support a side portion of the substrate placed on the rotary chuck; a chuck pin support configured to support the chuck pin; a guide ring unit disposed between the processing bowl and the rotary chuck and having a shape surrounding the rotary chuck in a circumferential direction; and a drive assembly configured to cause the substrate to rotate. The guide ring unit moves between a raised position and a lowered position. The raised position is when the guide ring unit rises to guide the processing liquid splashed from the substrate supported by the support unit to the processing bowl. The lowered position is when the guide ring unit is lowered below the support unit. When the guide ring unit moves to the raised position, the chuck pin moves to the support position to support the substrate by clamping the side of the substrate supported by the rotary chuck. When the guide ring unit moves to the lowered position, the chuck pin moves to the separation position, which is a position spaced apart from the substrate supported by the rotary chuck. The drive assembly can be configured to rotate the rotary chuck when the guide ring unit is in the lowered position.

[0011] According to an exemplary embodiment of the present invention, the drive assembly includes: a first drive unit, to which the guide ring unit is coupled; and a second drive unit configured to move the first drive unit in a vertical direction, the first drive unit including a bearing, and the second drive unit including a shank configured to contact the bearing.

[0012] According to an exemplary embodiment of the present invention, the bearing includes: an outer ring and an inner ring; and a roller disposed between the outer ring and the inner ring, and the shank may be configured to contact the outer ring.

[0013] According to an exemplary embodiment of the present invention, the upper surface of the outer ring is configured as a horizontal plane, the handle is configured to at least partially overlap the outer ring when viewed from above, and the bottom surface of the handle may be configured to contact the horizontal plane.

[0014] According to an exemplary embodiment of the present invention, the outer ring may be configured to resist rotation of the inner ring and remain fixed when the inner ring rotates while the handle is in contact with the outer ring.

[0015] According to an exemplary embodiment of the present invention, the bearing is a crossed roller bearing.

[0016] According to an exemplary embodiment of the present invention, the chuck pin support includes a protrusion whose longitudinal direction extends downward from the chuck pin support in the radial direction of the rotating chuck. The first drive unit further includes a connector connecting the guide ring unit and the bearing. The connector has a pusher at a position that partially overlaps with the protrusion when viewed from above. When the guide ring unit moves to the raised position, the pusher pushes the protrusion to move the chuck pin to the supported position. And when the guide ring unit moves to the lowered position, the chuck pin can move to the disengaged position.

[0017] According to an exemplary embodiment of the present invention, the separation position may be a position where the processing liquid supplied to the substrate supported by the chuck pin does not contact the chuck pin.

[0018] According to an exemplary embodiment of the present invention, the guide ring unit includes: a guide ring arranged in annular shape and having a groove at a position corresponding to the chuck pin; and a support body configured to support the guide ring, the guide ring being arranged adjacent to the substrate supported by the chuck pin at the raised position, and the chuck pin being located in the groove, and the groove having a width that does not interfere with the guide ring when the chuck pin moves between the separated position and the supported position.

[0019] According to an exemplary embodiment of the present invention, a method for processing a substrate using an apparatus for processing a substrate as described above is provided. The method includes: a second rotation operation in which the rotating chuck is rotated at a second speed in an open state while the substrate is processed with the processing liquid supplied to the substrate. The open state may be a state in which the substrate is placed on the rotating chuck, the chuck pin is moved to a separation position, and the guide ring unit is moved to a lowered position.

[0020] According to an exemplary embodiment of the present invention, the method further includes: a loading operation, loading the substrate onto the rotary chuck in the open state; a clamping operation, switching from the open state to a closed state; and a first rotation operation, supplying the processing liquid onto the substrate and rotating the rotary chuck at a first speed in the closed state, wherein the second rotation operation may be performed after the first rotation operation.

[0021] According to an exemplary embodiment of the present invention, the second speed may be lower than the first speed.

[0022] According to an exemplary embodiment of the present invention, the second speed may be 10 RPM or lower.

[0023] According to an exemplary embodiment of the present invention, wherein the processing liquid is a first processing liquid, the processing liquid supply unit is configured to supply the first processing liquid and the second processing liquid, and the method further includes: a rinsing operation after the second rotation operation, wherein the substrate is clamped by the chuck pin, the second processing liquid is supplied, and the substrate is rotated at a third speed; and a drying operation, wherein the substrate is rotated at a fourth speed, and the third speed and the fourth speed may be faster than the first speed.

[0024] According to an exemplary embodiment of the present invention, an apparatus for processing a substrate includes: a processing bowl configured to provide a processing space for processing the substrate; a support unit configured to support and rotate the substrate in the processing space; and a processing liquid supply unit configured to supply processing liquid to an upper surface of the substrate supported by the support unit, wherein the support unit includes: a rotary chuck on which the substrate is placed and rotated; a chuck pin mounted on the rotary chuck to support a side portion of the substrate placed on the rotary chuck; a guide ring unit disposed between the processing bowl and the rotary chuck and having a shape surrounding the rotary chuck in a circumferential direction; and a drive assembly configured to move the guide ring such that the guide ring unit moves between a raised position and a lowered position, the raised position being a position where the guide ring unit rises to guide processing liquid scattering from the substrate supported by the support unit back to the processing bowl, and the lowered position being a position where the guide ring unit descends below the support unit. When the guide ring unit moves to the raised position, the chuck pin moves to the support position to support the substrate by clamping the side of the substrate supported by the rotary chuck. When the guide ring unit moves to the lowered position, the chuck pin moves to the separation position, which is a position spaced apart from the substrate supported by the rotary chuck. The drive assembly includes: a first drive unit to which the guide ring unit is coupled; and a second drive unit configured to move the first drive unit in a vertical direction. The first drive unit includes a bearing, and the second drive unit includes a shank configured to contact the bearing. The drive assembly is configured to rotate the rotary chuck when the guide ring unit is in the lowered position. The bearing includes: an outer ring and an inner ring; and a roller disposed between the outer ring and the inner ring. The shank may be configured to contact the outer ring, and the outer ring is configured to resist rotation of the inner ring and remain fixed when the inner ring rotates while the shank is in contact with the outer ring.

[0025] According to an exemplary embodiment of the present invention, the separation position may be a position where the processing liquid supplied to the substrate supported by the chuck pin does not contact the chuck pin.

[0026] According to an exemplary embodiment of the present invention, the guide ring unit includes: a guide ring arranged in annular shape and having a groove at a position corresponding to the chuck pin; and a support body configured to support the guide ring, the guide ring being arranged adjacent to the substrate supported by the chuck pin at the raised position, and the chuck pin being located in the groove, and the groove having a width that does not interfere with the guide ring when the chuck pin moves between the separated position and the supported position.

[0027] According to an exemplary embodiment of the present invention, the support unit includes a chuck pin support for supporting the chuck pin. The chuck pin support includes a protrusion whose longitudinal direction extends downward from the chuck pin support in the radial direction of the rotating chuck. The chuck pin is mounted on the chuck pin support. The first drive unit further includes a connector connecting the guide ring unit and the bearing. The connector has a pusher at a position that partially overlaps with the protrusion when viewed from above. When the guide ring unit moves to the raised position, the pusher pushes the protrusion to move the chuck pin to the supported position. And when the guide unit moves to the lowered position, the chuck pin can move to the disengaged position.

[0028] According to an exemplary embodiment of the present invention, the device further includes: a controller that controls the execution of a second rotation operation, causing the rotating chuck to rotate at a second speed in an open state, wherein the open state may be a state in which the substrate is placed on the rotating chuck, the chuck pin is moved to a separation position, and the guide ring unit can be moved to a lowered position.

[0029] According to an exemplary embodiment of the present invention, the controller controls the second rotation operation to be performed after: a loading operation, loading the substrate onto the rotary chuck in the open state; a clamping operation, switching from the open state to a closed state; and a first rotation operation, supplying the processing liquid onto the substrate and rotating the rotary chuck at a first speed in the closed state, wherein the second speed may be lower than the first speed. According to an exemplary embodiment of the present invention, the uniformity of liquid processing on the substrate can be improved.

[0030] According to an exemplary embodiment of the present invention, damage to the liquid pit can be minimized.

[0031] According to an exemplary embodiment of the present invention, the substrate can be rotated even when the guide ring is descending.

[0032] According to an exemplary embodiment of the present invention, the substrate can be rotated even when the chuck pins are spaced apart from the substrate.

[0033] The effects of this disclosure are not limited to those described above, and those skilled in the art can clearly understand from the specification and drawings the effects not stated above. Attached Figure Description

[0034] Various features and advantages of the non-limiting exemplary embodiments of this specification will become more apparent upon review of the detailed description in conjunction with the accompanying drawings. The drawings are for illustrative purposes only and should not be construed as limiting the scope of the claims. Unless explicitly stated otherwise, the drawings should not be considered to be drawn to scale. Various dimensions in the drawings may have been exaggerated for clarity.

[0035] Figure 1 This is a top view schematically illustrating a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0036] Figure 2 It is an illustrative illustration. Figure 1 A figure showing an exemplary embodiment of a liquid handling chamber.

[0037] Figure 3 It is an illustrative illustration. Figure 2 A diagram showing the exhaust and drainage paths of the liquid handling chamber.

[0038] Figure 4 It is an illustrative illustration. Figure 2 A diagram illustrating an exemplary implementation of the support unit.

[0039] Figure 5 This diagram illustrates the state where the chuck pin is in the disengaged position and the guide ring unit is in the lowered position.

[0040] Figure 6 This diagram illustrates the state of the chuck pin moving from the disengaged position to the supported position and the guide ring unit moving from the lowered position to the raised position.

[0041] Figure 7 This is a detailed explanation. Figure 4 A diagram of the bearing.

[0042] Figure 8 This is a flowchart illustrating a substrate processing method according to an exemplary embodiment of the present invention.

[0043] Figure 9 This diagram illustrates the state of the processing liquid being supplied to the substrate during the first rotation operation.

[0044] Figure 10 This diagram illustrates the state of liquid pits formed on the substrate during the second rotation operation. Detailed Implementation

[0045] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. Exemplary embodiments are provided so that this disclosure will be thorough and will fully convey the scope to those skilled in the art. Numerous specific details, such as examples of particular components, apparatuses, and methods, are set forth to provide a thorough understanding of embodiments of this disclosure. It will be apparent to those skilled in the art that specific details are not necessarily required, exemplary embodiments may be embodied in many different forms, and neither should be construed as limiting the scope of this disclosure. In some exemplary embodiments, well-known processes, well-known apparatus structures, and well-known techniques have not been described in detail. The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not restrictive. As used herein, unless the context clearly indicates otherwise, plural forms may be included when no quantity is specified. The terms “comprising,” “including,” and “having” are inclusive and therefore specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. Unless specifically identified as an order of execution, the method steps, processes, and operations described herein should not be construed as requiring them to be performed in the particular order discussed or described. It should also be understood that additional or alternative steps may be employed.

[0046] When an element or layer is described as “on,” “joined,” “connected,” or “linked” to another element or layer, it may be directly “on,” “joined,” “connected,” or “linked” to the other element or layer, or there may be intermediate elements or layers. Conversely, when an element is described as “directly on,” “directly joined,” “directly connected,” or “directly linked” to another element or layer, there may be no intermediate elements or layers. Other terms used to describe relationships between elements (e.g., “between” vs. “directly between,” “adjacent” vs. “directly adjacent,” etc.) should be interpreted in a similar manner. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0047] Although the terms first, second, third, etc., may be used herein to describe various elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, and / or segment from another. Unless the context clearly indicates otherwise, terms such as “first,” “second,” and other numerical terms used herein do not imply sequence or order. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as a second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0048] To facilitate the description of the relationship between one element or feature and another element or feature as shown in the figures, spatial relative terms such as “inside,” “outside,” “below,” “below,” “below,” “above,” and “on top” may be used herein. In addition to the orientations described in the figures, spatial relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figures is flipped, an element described as “below” or “below” other elements or features will be oriented “on top” of other elements or features. Thus, the exemplary term “below” can cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or oriented in other orientations), and the spatial relative descriptors used herein will be interpreted accordingly.

[0049] When the terms “same” or “identical” are used in the description of exemplary embodiments, it should be understood that some imprecision may exist. Therefore, when an element or value is referred to as being the same as another element or value, it should be understood that the element or value is the same as the other element or value within manufacturing or operational tolerances (e.g., ±10%). When the terms “about” or “substantially” are used in conjunction with numerical values, it should be understood that the relevant numerical values ​​include manufacturing or operational tolerances (e.g., ±10%) near the stated values. Furthermore, when the terms “approximately” and “substantially” are used in conjunction with geometry, it should be understood that there is no requirement for the precision of the geometry, but the degree of latitude of the shape is within the scope of this disclosure.

[0050] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which these exemplary embodiments pertain. It should also be understood that terms (including those defined in common dictionaries) should be interpreted as having the meaning consistent with their meaning in the context of the relevant field and should not be interpreted in an idealized or overly formal sense, unless expressly defined herein.

[0051] In this exemplary embodiment, an example of processing a wafer is described. However, the inventive concept can be applied to apparatuses that process substrates other than wafers.

[0052] In the following description, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

[0053] Figure 1 This is a schematic top view illustrating a substrate processing apparatus according to an exemplary embodiment of the present invention. (Refer to...) Figure 1 The substrate processing apparatus includes a transposition module 10, a processing module 20, and a controller 30. According to an exemplary embodiment, the transposition module 10 and the processing module 20 are arranged in one direction. Hereinafter, the direction in which the transposition module 10 and the processing module 20 are arranged is referred to as a first direction 91, and when viewed from above, the direction perpendicular to the first direction 91 is referred to as a second direction 92, and the direction perpendicular to both the first direction 91 and the second direction 92 is referred to as a third direction 93.

[0054] The transposition module 10 transfers the substrate W from the container 80 containing the substrate W to the processing module 20, and houses the substrate W, which has been processed in the processing module 20, within the container 80. The longitudinal direction of the transposition module 10 is arranged in the second direction 92. The transposition module 10 includes a loading port 12 and a transposition frame 14. With reference to the transposition frame 14, the loading port 12 is located on the opposite side of the processing module 20. The container 80 containing the substrate W is placed on the loading port 12. Multiple loading ports 12 can be provided, and multiple loading ports 12 can be arranged along the second direction 92.

[0055] As container 80, a closed container such as a front-opening wafer transfer box (FOUP) can be used. Container 80 can be transported by means of means such as overhead conveyors, overhead conveyors or automated guided vehicles (not shown) or placed on loading port 12 by an operator.

[0056] The transposition frame 14 is equipped with a transposition robot 120. A guide rail 140 with a longitudinal direction of a second direction 92 is provided within the transposition frame 14, and the transposition robot 120 is configured to move on the guide rail 140. The transposition robot 120 includes a hand 122 on which a substrate W is placed, and the hand 122 is configured to move back and forth, rotate about a third direction 93, and move along a third direction 93. Multiple hands 122 are spaced apart from each other in the vertical direction and are capable of moving back and forth independently.

[0057] Processing module 20 includes a buffer unit 200, a transfer chamber 300, and a liquid processing chamber 400. The buffer unit 200 provides space for the substrate W loaded into and unloaded from processing module 20 to temporarily reside. The liquid processing chamber 400 performs a liquid processing process on the substrate W by supplying processing liquid to the substrate W. The transfer chamber 300 transfers the substrate W between the buffer unit 200 and the liquid processing chamber 400.

[0058] The transfer chamber 300 can be configured such that its longitudinal direction is in the first direction 91. A buffer unit 200 can be disposed between the indexing module 10 and the transfer chamber 300. A plurality of liquid handling chambers 400 are provided, which can be arranged on the sides of the transfer chamber 300. The liquid handling chambers 400 and the transfer chamber 300 can be arranged along the second direction 92. The buffer unit 200 can be located at one end of the transfer chamber 300.

[0059] According to the example, liquid processing chambers 400 are respectively disposed on opposite sides of transfer chamber 300. On each of the opposite sides of transfer chamber 300, liquid processing chambers 400 may be disposed in an array of A × B (A and B are each a natural number of 1 or greater than 1) along a first direction 91 and a third direction 93.

[0060] The transfer chamber 300 includes a transfer robot 320. A guide rail 340 with a longitudinal direction in a first direction 91 is provided within the transfer chamber 300, and the transfer robot 320 is configured to move on the guide rail 340. The transfer robot 320 includes a hand 322 in which the substrate W is placed, and the hand 322 is configured to move back and forth, rotate about a third direction 93, and move along the third direction 93. Multiple hands 322 are spaced apart in the vertical direction, and the hands 322 can move back and forth independently of each other.

[0061] The buffer unit 200 includes a plurality of buffers 220 on which the substrate W is placed. The buffers 220 are spaced apart from each other along a third direction 93. The front and rear of the buffer unit 200 are open. The front faces the transposition module 10, and the rear faces the transfer chamber 300. The transposition robot 120 can access the buffer unit 200 through the front, and the transfer robot 320 can access the buffer unit 200 through the rear.

[0062] Figure 2 It is an illustrative illustration. Figure 1 A figure illustrating an exemplary embodiment of a liquid handling chamber. Figure 3 It is an illustrative illustration. Figure 2 A diagram showing the exhaust and drainage paths of the liquid handling chamber. (Refer to...) Figure 2 and Figure 3The liquid handling chamber 400 includes a housing 410, a handling bowl 420, an exhaust bowl 430, multiple lifting mechanisms 441, 442, 443 and 444, a liquid supply unit 450, an exhaust unit 460, a support unit 1000 and a controller 900.

[0063] The housing 410 is configured in a generally cuboid shape. The housing provides an internal space 412. The configuration described below can be provided inside the housing 410. An opening (not shown) serving as a substrate W channel can be formed in the side portion of the housing 410. An exhaust path forming member 414 can be provided in the internal space 412 provided by the housing 410.

[0064] The exhaust path forming member 414 may include a first portion 414a extending horizontally from the lower side of the processing bowl 420, which will be described later, a second portion 414b extending vertically from the outer side of the exhaust bowl 430, and a third portion 414c extending horizontally from the outer side of the second portion 414b.

[0065] Viewed from above, the exhaust path forming member 414 may have a plate shape with a circular hole formed in the central region. The exhaust path forming member 414 may be combined with the processing bowl 420 to define the main exhaust path ME and the secondary exhaust path SE. Furthermore, unlike the processing bowl 420 and the exhaust bowl 430, the height of the exhaust path forming member 414 may be fixed. Additionally, the rotation shaft 1200 of the rotary chuck 1100 (described later) may be inserted into and disposed in the hole formed in the central region of the exhaust path forming member 414.

[0066] The processing bowl 420 can recover the processing liquid supplied by the liquid supply unit 450. The processing bowl 420 can discharge the airflow surrounding the substrate W. The processing bowl 420 can provide a liquid recovery path and an airflow exhaust path. The processing liquid supplied by the liquid supply unit 450 can be recovered through the liquid recovery path, and the airflow surrounding the substrate W can be discharged to the outside of the liquid processing chamber 400 through the airflow exhaust path.

[0067] The processing bowl 420 may include a first bowl 421, a second bowl 422, a third bowl 423, and a liquid receiving member 424. The first bowl 421, the second bowl 422, the third bowl 423, and the liquid receiving member 424 may have an annular shape surrounding the rotary chuck 1100. Additionally, the first bowl 421, the second bowl 422, and the third bowl 423 may be arranged with their upper portions stacked on top of each other.

[0068] The first bowl 421 can be an outer bowl. The first bowl 421 can be the outermost bowl among the multiple bowls included in the processing bowl 420. The first bowl 421 can be configured with an open upper and lower portion. A first groove IN1 can be formed at the lower end of the first bowl 421 facing the first bowl 421. The outer wall 422b of the first liquid receiving portion 422a formed on the outer side of the lower end of the second bowl 422 can be inserted into the first groove IN1.

[0069] The second bowl 422 can be an intermediate bowl. The second bowl 422 can be the bowl located between the outermost and innermost bowls among the multiple bowls included in the processing bowl 420. The second bowl 422 can be configured with an open upper and lower portion. A second groove IN2 can be formed at the lower end of the second bowl 422 facing inwards. The outer wall 423b of the second liquid receiving portion 423a formed on the lower outer side of the third bowl 423 can be inserted into the second groove IN2.

[0070] The third bowl 423 can be an inner bowl. The third bowl 423 can be the innermost bowl among the multiple bowls included in the processing bowl 420. The third bowl 423 can be configured with an open upper and lower portion. A third groove IN3 can be formed at the lower end of the third bowl 423 facing the third bowl 423. The outer wall 424b of the third liquid receiving portion 424a formed on the outside of the liquid receiving member 424 can be inserted into the third groove IN3.

[0071] The liquid receiving member 424 can be disposed inside the third bowl 423. The liquid receiving member 424 can be disposed at the same height as the first liquid receiving part 421a and the second liquid receiving part 422a. The third liquid receiving part 424a can be formed on the outside of the liquid receiving member 424.

[0072] The first drain line DL1 can be connected to the second bowl 422, the second drain line DL2 can be connected to the third bowl 423, and the third drain line DL3 can be connected to the liquid receiving member 424. Each of the first to third drain lines DL1, DL2, and DL3 can discharge the processed liquid recovered through the liquid receiving member to the outside of the substrate processing equipment 400. The first to third drain lines DL1, DL2, and DL3 can also recover different types of processed liquids, or in some cases, the same type of processed liquid.

[0073] Furthermore, the first bowl 421, the second bowl 422, and the third bowl 423 can be configured to be height-adjustable. The first bowl 421, the second bowl 422, and the third bowl 423 can be configured to be height-adjustable via a second lifting mechanism 442, a third lifting mechanism 443, and a fourth lifting mechanism 444, respectively. The second lifting mechanism 442, the third lifting mechanism 443, and the fourth lifting mechanism 444 can be mechanisms capable of generating a lifting drive force that enables the first bowl 421, the second bowl 422, and the third bowl 423 to be height-adjustable, such as an electric motor or a pneumatic / hydraulic cylinder. With the first bowl 421, the second bowl 422, and the third bowl 423 being selectively height-adjusted, multiple secondary exhaust paths SE and multiple liquid recovery paths LE can be formed. For example, when the first bowl 421 rises, a first secondary exhaust path SE1 and a first liquid recovery path LE1 are formed; when the first bowl 421 and the second bowl 422 rise, a second secondary exhaust path SE2 and a second liquid recovery path LE2 are formed; and when the first bowl 421, the second bowl 422 and the third bowl 423 rise, a third secondary exhaust path SE3 and a third liquid recovery path LE3 can be formed.

[0074] The exhaust bowl 430 may be mounted spaced apart from the outside of the processing bowl 420. The exhaust bowl 430 may be spaced apart from the outer bowl 421 of the outermost of the plurality of bowls in the processing bowl 420. The exhaust bowl 430 may be spaced apart from the outer bowl 421 to define at least a portion of the main exhaust path ME for discharging airflow surrounding the substrate W placed on the rotating chuck 1100. The exhaust bowl 430 may be configured to be lifted by a first lifting mechanism 441. The first lifting mechanism 441 may include a lifting motor. However, the invention is not limited thereto; the first lifting mechanism 441 may use a pneumatic cylinder or a hydraulic cylinder as the configuration for generating the lifting drive force.

[0075] Liquid supply unit 450 supplies processing liquid to a substrate supported by support unit 1000. Liquid supply unit 450 includes a first nozzle 451, a second nozzle 452, and a back nozzle 453. First nozzle 451 supplies first processing liquid to the upper surface of substrate W supported by chuck pin 1300. Second nozzle 452 supplies first processing liquid to the upper surface of substrate W supported by chuck pin 1300. First nozzle 451 and second nozzle 452 are supported by nozzle support member 454. Optionally, nozzle support member 454 moves first nozzle 451 and second nozzle 452 between a raised position and a lowered position. In the raised position, first nozzle 451 and second nozzle 452 each supply first processing liquid or second processing liquid to substrate W placed on rotary chuck 1100; while in the lowered position, first nozzle 451 and second nozzle 452, having completed the supply of first or second processing liquid, wait. According to an exemplary embodiment, the first processing liquid may be a chemical, and the second processing liquid may be deionized water. Optionally, liquid supply unit 450 may also include additional nozzles. The additional nozzle can be configured to be supported by a nozzle support 454, or it can be configured to be supported by a separate support. Furthermore, the additional nozzle can be configured to supply a treatment fluid of a different type than the first, second, and third treatment fluids.

[0076] A back nozzle 453 is mounted on the upper surface of the rotary chuck 1100, which will be described later. Furthermore, a through hole 1100a for mounting the back nozzle 453 can be formed at the center of the rotary chuck 1100. The back nozzle 453 supplies a third processing liquid to the bottom surface of the substrate W, which is supported by the chuck pin 1300. According to an exemplary embodiment, the third processing liquid may be ultrapure water.

[0077] The exhaust unit 460 provides pressure relief to the internal space 412. The exhaust unit 460 provides pressure relief to exhaust the peripheral airflow of the substrate W to the outside of the liquid processing chamber 400. The exhaust unit 460 may include an exhaust port 461 and an exhaust device 462.

[0078] An exhaust port 461 may be connected to a first portion 414a of an exhaust path forming member 414. When viewed from above, the exhaust port 461 may be positioned closer to the rotation axis 1200 than the processing bowl 420 and the exhaust bowl 430. Furthermore, the inlet of the exhaust port 461 may be configured to discharge airflow introduced into the exhaust path defined by the space between the processing bowl 420 and the first portion 414a of the exhaust path forming member 414. The inlet of the exhaust port 461 may be configured to face the space between the exhaust path forming member 414 and the first portion 414a.

[0079] The exhaust device 462 can be a device capable of providing pressure relief to the interior space 412 through the exhaust port 461. The exhaust device 462 can be a pump. However, the invention is not limited thereto, and the exhaust device 462 can be modified to be various known devices capable of providing pressure relief to the interior space 412.

[0080] The support unit 1000 supports the substrate W in the processing space. Figure 4 It is an illustrative illustration. Figure 2 A diagram illustrating an exemplary embodiment of the support unit. (Refer to...) Figure 4 The support unit 1000 includes a rotary chuck 1100, a rotary shaft 1200, a chuck pin 1300, a guide ring unit 1400, a chuck pin support 1600, and a drive assembly 1700.

[0081] A rotary chuck 1100 supports a substrate W. The upper surface of the rotary chuck 1100 is generally circular, and its diameter may be larger than the diameter of the substrate W. Hereinafter, the radial direction away from the center of the rotary chuck 1100 is referred to as the fifth direction 95, and the opposite direction of the fifth direction 95 is referred to as the sixth direction 96. Support pins 1110 are provided on the upper surface of the rotary chuck 1100, configured to support the rear surface of the substrate W. A plurality of support pins 1110 are provided. The support pins 1110 are arranged in a ring-like manner. The upper ends of the support pins 1110 protrude from the rotary chuck 1100, such that the substrate W is spaced a predetermined distance from the rotary chuck 1100. A space is formed inside the rotary chuck 1100. A chuck pin support 1600, which will be described later, can be installed inside the rotary chuck 1100.

[0082] The rotating shaft 1200 is configured to be rotatable by the driver 1210. The rotating shaft 1200 is fixedly coupled to the center of the bottom surface of the rotary chuck 1100. According to the example, the driver 1210 is located below the rotating shaft 1200, and the driver 1210 provides rotational force to the rotating shaft 1200. Therefore, the rotary chuck 1100 can be rotated by the driver 1210.

[0083] A chuck pin 1300 is disposed on the side surface of the rotary chuck 1100. A plurality of chuck pins 1300 are provided. The chuck pins 1300 are disposed circumferentially along the rotary chuck 1100. A groove is formed in the upper portion of the chuck pin 1300. This groove is formed facing the substrate W. Furthermore, this groove is formed at a height corresponding to the substrate W supported by the rotary chuck 1100. When the chuck pin 1300 moves from the disengaged position D1 to the supported position D2, the side surface of the substrate W supported by the support pin 1110 is located in the groove, and the chuck pin 1300 supports the side surface of the substrate W at its side portion.

[0084] The chuck pin 1300 is mounted in a chuck pin support 1600 inside the rotary chuck 1100. The chuck pin 1300 is movable together with the chuck pin support 1600. The chuck pin 1300 is configured to move between a separation position D1 and a support position D2. When the chuck pin 1300 moves to the separation position D1, the chuck pin 1300 moves in a direction away from the substrate W. Alternatively, the chuck pin 1300 moves in a fifth direction 95. Thus, the substrate W and the chuck pin 1300 are spaced apart from each other. When the chuck pin 1300 moves to the separation position D1 while supporting the substrate W, the substrate W is transferred to and supported by the support pin 1110. When the chuck pin 1300 moves to the support position D2, the chuck pin 1300 moves toward the substrate W. Alternatively, the chuck pin 1300 moves in a sixth direction 96. When the chuck pin 1300 moves to the support position D2, the substrate W is transferred from the support pin 1110 to the chuck pin 1300. The chuck pin 1300 then clamps the side surface of the substrate W. Therefore, the substrate W is supported by the chuck pin 1300. For example, the interval between the separation position D1 and the support position D2 can be set to 5 mm. Details regarding the chuck pin support 1600 driving the chuck pin 1300 will be described later.

[0085] The guide ring unit 1400 may include a guide ring 1410 and a support 1430.

[0086] Guide ring 1410 guides the processing liquid splashed from substrate W to processing bowl 420. Guide ring 1410 may be disposed between rotary chuck 1100 and processing bowl 420. Guide ring 1410 may be disposed adjacent to rotary chuck 1100. Guide ring 1410 may be disposed around rotary chuck 1100. Guide ring 1410 may be configured to slope downward in a direction away from rotary chuck 1100. Furthermore, guide ring 1410 may be configured to slope downward in two stages.

[0087] The guide ring 1410 includes an upper ring 1411, a middle ring 1412, a lower ring 1413, and a fixing rod 1415. The upper ring 1411, middle ring 1412, and lower ring 1413 are stacked on top of each other. Furthermore, when viewed from above, the upper ring 1411, middle ring 1412, and lower ring 1413 are configured to at least partially overlap. The upper ring 1411 is located above the middle ring 1412. The middle ring 1412 is located between the upper ring 1411 and the lower ring 1413. The lower ring 1413 is located facing the upper ring 1411 in the vertical direction. The lower ring 1413, middle ring 1412, and upper ring 1411 are positioned in the order of lower ring 1413, middle ring 1412, and upper ring 1411 along a third direction 93. The spacing between the upper ring 1411, middle ring 1412, and lower ring 1413 can be the same or different. The spacing between the upper ring 1411, the middle ring 1412, and the lower ring 1413 can be determined based on the size, shape, and spacing of the bowls adjacent to the upper ring 1411, the middle ring 1412, and the lower ring 1413. The upper ring 1411, the middle ring 1412, and the lower ring 1413 are connected to a fixing rod 1415. The fixing rod 1415 can be configured to pass through the edge regions of the upper ring 1411, the middle ring 1412, and the lower ring 1413 in a third direction 93. The upper ring 1411, the middle ring 1412, and the lower ring 1413 can have a ring-plate-like portion and a block-like portion disposed on its outer side, and the fixing rod 1415 can be configured to be inserted into the block-like portion.

[0088] A groove 1410a may be formed on the inner side of the guide ring 1410. The groove 1410a may be formed at a position corresponding to the chuck pin 1300. The groove 1410a is configured to have dimensions in which the chuck pin 1300 can be positioned. Furthermore, the groove 1410a is configured to have a depth such that the chuck pin 1300 can move within the groove 1410a between a separation position D1 and a support position D2. According to an example, the interval between the separation position D1 and the support position D2 is set to 5 mm, and the depth of the groove 1410a may be set to be greater than 5 mm. Therefore, the chuck pin 1300 can move within the groove 1410a. When the guide ring 1410 is positioned adjacent to the substrate W, it may interfere with the chuck pin 1300 that supports the substrate W on the side surface of the substrate W. However, when a groove 1410a is formed in the guide ring 1410, the chuck pin 1300 is located in the groove 1410a, thereby avoiding interference between the guide ring 1410 and the chuck pin 1300. Furthermore, since the guide ring 1410 can be positioned closer to the substrate W, the processing liquid spilled from the substrate W can be recovered more effectively.

[0089] A support body 1430 is disposed around the lower portion of the rotary chuck 1100. The support body 1430 is disposed in a continuous shape. The support body 1430 is disposed in a cylindrical shape with open upper and lower portions. The support body 1430 is located below the guide ring 1410. The guide ring 1410 is mounted above the support body 1430. The guide ring 1410 is connected to the support body 1430 with continuous connection points. Therefore, even if the rotary chuck 1100 rotates, the stress applied to the connection points can be dispersed, and deformation and vibration of the guide ring 1410 due to excessive stress can be suppressed.

[0090] Furthermore, the inner surface of the support 1430 is configured to have a shape corresponding to the outer surface of the rotary chuck 1100. Additionally, the inner surface 1430a of the support 1430 is disposed adjacent to the outer surface 1100a of the rotary chuck 1100. According to the example, the inner surface 1430a of the support 1430 and the outer surface 1100a of the rotary chuck 1100 can be formed in a stepped shape, and the respective stepped surfaces can be configured to be adjacent to each other. Therefore, the space occupied by the support 1430 can be minimized.

[0091] A discharge port 1431 is formed in the support body 1430. When the treatment liquid fails to be guided to the cup body 420 by the guide ring 1410 and splashes into the support body 1430, the treatment liquid is discharged to the outside of the support body 1430 through the discharge port 1431. The discharge port 1431 may be arranged in a groove shape. The longitudinal direction of the discharge port 1431 may be set to be the same as the circumferential direction of the support body 1430. Multiple discharge ports 1431 may be provided. The discharge port 1431 may be formed along the circumferential direction of the support body 1430.

[0092] When the guide ring unit 1400 is positioned near the substrate W supported by the rotary chuck 1100, interference may occur between the support 1430 and the lower portion of the chuck pin 1300. To minimize the interference between the chuck pin 1300 and the support 1430, an insertion port 1432 may be formed in the support 1430.

[0093] Insertion port 1432 can be configured to allow the lower portion of chuck pin 1300 to be inserted. Multiple insertion ports 1432 can be provided. The number of insertion ports 1432 can be configured to correspond to the number of chuck pins 1300. Insertion ports 1432 can be formed along the circumferential direction of support body 1430. Insertion ports 1432 can be formed at positions corresponding to chuck pins 1300.

[0094] The groove 1410a and the insertion port 1432 minimize interference between the chuck pin 1300 and the guide ring unit 1400, and the guide ring 1410 can be mounted closer to the substrate W. Therefore, the guide ring 1410 can effectively guide the processing liquid splattered from the substrate W towards the processing bowl 420.

[0095] A chuck pin support 1610 supports a chuck pin 1300. The chuck pin support 1600 is mounted inside a rotary chuck 1100. The longitudinal direction of the chuck pin support 1610 is the radial direction of the rotary chuck 1100. The chuck pin support 1610 is configured to reciprocate in a fifth direction 95 and a sixth direction 96. According to an example, a guide member (not shown) may be provided on the rotary chuck 1100, and the chuck pin support 1610 may be mounted on the guide member. Furthermore, the chuck pin support 1610 has a support rod 1611, which is configured to extend through the sidewall of the rotary chuck 1100 and protrude outwards. The chuck pin 1300 is fixedly connected to the support rod 1611. Therefore, when the chuck pin support 1610 moves, the chuck pin 1300 moves together. Additionally, the chuck pin support 1610 has a protrusion 1613. The protrusion 1613 has a shape that projects downward from the chuck pin support 1610. The protrusion 1613 has a vertical surface 1613a and an inclined surface 1613b. The vertical surface 1613a and the inclined surface 1613b are joined together to form a continuous surface. The vertical surface 1613a is formed to extend vertically from the lower surface of the chuck pin support 1610. The vertical surface 1613a may be quadrilateral. The inclined surface 1613b is formed to extend from the lower end of the vertical surface 1613a. The inclined surface 1613b is configured to have an inclination relative to the vertical direction. This inclination is formed such that, in a cross-section of the chuck pin support 1610 in the longitudinal direction, the width of the inclined surface 1613b decreases as it extends towards the lower portion of the protrusion.

[0096] A first elastic member 1650 is mounted on one side of the chuck pin support 1610. A fixing structure 1120 is formed inside the rotary chuck 1100, and one end of the first elastic member 1650 is connected to the fixing structure 1120. Furthermore, the other end of the first elastic member 1650 is connected to the chuck pin support 1610. The first elastic member 1650 is mounted to push the chuck pin support 1610 in the fifth direction 95. The first elastic member 1650 is configured to be compressed when the pusher 1716 rises, causing the chuck pin 1300 to move to the support position D2. The first elastic member 1650 is configured to apply an elastic force in the fifth direction 95 when the chuck pin 1300 is in the support position D2. Therefore, when the pusher 1716 descends, the chuck pin 1300 moves along the fifth direction 95 under the action of the elastic force, and the chuck pin 1300 moves from the support position D2 to the disengagement position D1. According to the example, the first elastic member 1650 can be a spring.

[0097] The drive assembly 1700 is configured to move the guide ring unit 1400 and the chuck pin 1300 simultaneously. When the guide ring unit 1400 moves, the chuck pin 1300 can move together. When the chuck pin 1300 moves to the support position D2, the guide ring unit 1400 can move to the raised position H2. Similarly, when the chuck pin 1300 moves to the disengagement position D1, the guide ring unit 1400 can move to the lowered position H1. The raised position H2 is the position where the guide ring unit 1400 is raised above the upper surface of the rotary chuck 1100. The lowered position H1 is the position where the guide ring unit 1400 is lowered below the upper surface of the rotary chuck 1100.

[0098] The drive assembly 1700 includes a first drive unit 1710 and a second drive unit 1730. The first drive unit 1710 can be used as a structure that simultaneously moves the chuck pin 1300 and the guide ring unit 1400, and the second drive unit 1730 can be configured to provide power to the first drive unit 1710.

[0099] The first drive unit 1710 includes a connector 1711, a pusher 1716, and a bearing 1720.

[0100] The connector 1711 is disposed inside the rotary chuck 1100. The connector 1711 has a ring structure 1712, a fixing rod 1713, a spoke 1714, and a connecting rod 1715.

[0101] The ring structure 1712 is configured to surround the through hole 1100a. A connecting rod 1715 is mounted below the ring structure 1712. The connecting rod 1715 has a shape that projects downward from and extends from the ring structure 1712. The connecting rod 1715 is configured to pass through the lower wall of the rotary chuck 1100 and protrude from the rotary chuck 1100. A bearing 1720, described later, is coupled to the lower end of the connecting rod 1715. Furthermore, the connecting rod 1715 may be configured to be inserted into a second elastic member 1740.

[0102] Spokes 1714 have a radial shape extending from the ring structure 1712. Multiple spokes 1714 may be provided. These multiple spokes 1714 include multiple first spokes 1714a and multiple second spokes 1714b. The first spokes 1714a and second spokes 1714b are arranged at a predetermined interval. The first spokes 1714a and second spokes 1714b are spaced apart from each other. The length of the second spokes 1714b may be shorter than the length of the first spokes 1714a.

[0103] A fixing rod 1713 is mounted on the first spoke 1714a. The fixing rod 1713 has a shape that extends vertically from the distal end of the first spoke 1714a. The fixing rod 1713 is configured to pass through the lower wall of the rotary chuck 1100. A support body 1430 is connected to the lower end of the fixing rod 1713. Therefore, when the connector 1711 moves, the guide ring 1410 and the support body 1430 can move together.

[0104] A pusher 1716 is coupled to a second spoke 1714b. The pusher 1716 may be coupled to have a shape extending from the distal end of the second spoke 1714b toward a side surface of the second spoke 1714b. The pusher 1716 may be positioned to partially overlap with the protrusion 1613 when viewed from above. Furthermore, the pusher 1716 is positioned to partially overlap with the inclined surface 1613b when viewed from above. The surface on the pusher 1716 corresponding to the inclined surface 1613b may be curved. According to an example, the vertical cross-section of the pusher 1716 may be circular. The pusher 1716 is positioned to rise to a position where it contacts the vertical surface 1613a and to descend to a position where it is spaced apart from the protrusion 1613.

[0105] Figure 5 and Figure 6 This is a schematic diagram illustrating the simultaneous movement of the chuck pin and guide ring. (Refer to...) Figure 5 and Figure 6When the pusher 1716 rises, it contacts the inclined surface 1613b and the vertical surface 1613a in sequence. As the pusher 1716 rises, it applies a force relative to the inclined surface 1613b in a third direction 93 while in contact with it. Since the direction of the force is not set perpendicular to the inclined direction of the inclined surface 1613b, the force applied by the pusher 1716 is not canceled out, and the force in the sixth direction 96 pushes the inclined surface 1613b. Therefore, the chuck pin support 1610 moves along the sixth direction 96. The pusher 1716 rises to the height of the vertical surface 1613a. Simultaneously, the chuck pin 1300 moves to the support position D2 and clamps the substrate W. For example, the interval between the separation position D1 and the support position D2 can be set to 5 mm. Furthermore, when the pusher 1716 rises, the guide ring unit 1400 rises together. The guide ring unit 1400 moves from the lowered position H1 to the raised position H2. According to the example, the interval between the lowered position H1 and the raised position H2 can be set to 20 mm. In the following text, when the chuck pin 1300 is in the disengaged position D1 and the guide ring unit 1400 is in the lowered position H1, the support unit 1000 is in the open state; and when the chuck pin 1300 is in the supported position D2 and the guide ring unit 1400 is in the raised position H2, the support unit 1000 is in the closed state.

[0106] The connecting rod 1715 can be configured to be inserted into the second elastic member 1740. The second elastic member 1740 is configured to lift the connecting member 1711. According to the example, when the connecting member 1711 descends, the second elastic member 1740 is compressed. One end of the second elastic member 1740 is configured to be connected to the lower wall of the rotary chuck 1100, and the other end is configured to be connected to the ring structure 1712. Therefore, the second elastic member can apply an elastic force in the direction in which the connecting member 1711 rises.

[0107] The bearing 1720 is configured to allow the substrate W to rotate even when the guide ring unit 1400 is in the lowered position H1. Figure 7 This is a detailed explanation. Figure 4 A schematic diagram of the bearing. (Refer to...) Figure 7The bearing 1720 may include an inner ring 1721, an outer ring 1722, and a roller 1723. The inner ring 1721 is annularly arranged and configured to surround the rotation shaft 1200. Furthermore, the inner ring 1721 is coupled to a connecting rod 1715. Therefore, when the rotary chuck 1100 rotates, the inner ring 1721 rotates together. The outer ring 1722 is annularly arranged and configured to surround the inner ring 1721. The upper surface 1722a of the outer ring is configured as a horizontal plane. The upper surface 1722a of the outer ring may be stepped. According to an example, the upper surface 1722a of the outer ring is stepped, with each operating upper surface being a horizontal plane, and the outer upper surface may be shaped to be formed at a higher position than the inner upper surface. A shank 1731 contacts the upper surface 1722a of the outer ring. Because the upper surface 1722a is configured as a horizontal plane, the force applied from the shank 1731 can be stably transmitted to the bearing 1720. Rollers 1723 are disposed between the inner ring 1721 and the outer ring 1722. The inner ring 1721 is configured to rotate independently relative to the outer ring 1722 via the rollers 1723. According to the example, the bearing 1720 can be a crossed roller bearing.

[0108] The second drive unit 1730 includes a handle 1731 and a actuator 1733. When viewed from above, the handle 1731 may overlap with the outer ring 1722 of the bearing 1720. The actuator 1733 drives the handle 1731 to move up and down. According to the example, the actuator 1733 may be a cylinder or an actuator. During descent, the handle 1731 contacts the upper surface 1722a of the outer ring. As the handle 1731 descends further, it pulls the bearing 1720 downward. As the bearing 1720 descends, the guide ring unit 1400 connected to the bearing 1720 descends together. The guide ring unit 1400 descends to the lowered position H1. At the same time, the chuck pin 1300 moves upward to the disengaged position D1. When the rotary chuck 1100 is rotated with the handle 1731 in contact with the bearing 1720, the outer ring 1722 is fixed by the handle 1731, but since the inner ring 1721 and the outer ring 1722 are set to be able to rotate independently of each other, the inner ring 1721 can rotate.

[0109] A substrate processing method will be described below. The substrate processing method described below can be referenced from... Figures 1 to 7 The substrate processing apparatus described herein is used to perform this process. Therefore, in the following text, reference will be made to... Figures 1 to 7 The reference numerals shown in the accompanying drawings are used to describe a substrate processing method according to an exemplary embodiment. Furthermore, the substrate processing method described below can be executed by controlling the configuration of the substrate processing apparatus described above via a controller.

[0110] The controller 600 controls the overall operation of the substrate processing apparatus 1000. The controller (not shown) may include a central processing unit, read-only memory, and random access memory (RAM). The CPU executes required processes, such as etching processes, according to various schemes stored in its memory areas. In these schemes, device control information for process conditions is input. Simultaneously, these programs or schemes indicating processing conditions may be stored in a non-transitory computer-readable medium. This non-transitory computer-readable medium refers to a medium that semi-permanently stores data and is readable by a computer, rather than a medium that stores data momentarily, such as registers, caches, and memory. Specifically, the various application programs or schemes described above may be stored and provided on non-transitory readable media such as CDs, DVDs, hard disks, Blu-ray discs, USB drives, memory cards, or ROMs.

[0111] Figure 8 This is a flowchart illustrating a substrate processing method according to an exemplary embodiment of the present invention. (Refer to...) Figure 8 The substrate processing method includes loading operation S100, clamping operation S200, first rotation operation S300, second rotation operation S400, rinsing operation S500, and drying operation S600.

[0112] Loading operation S100 is the operation of loading substrate W onto rotary chuck 1100. In loading operation S100, transfer robot 320 loads substrate W into liquid processing chamber 400. In loading operation S100, support unit 1000 is in the open state. In the open state, handle 1731 descends, causing chuck pin 1300 to be in the disengaged position D1, and guide ring unit 1400 to be in the lowered position H1. First elastic member 1650 pushes chuck pin support member 1610, and second elastic member 1740 is compressed. Because guide ring unit 1400 is in the lowered position H1, interference between guide ring unit 1400 and transfer robot 320 entering rotary chuck 1100 and substrate W is avoided. After transfer robot 320 enters liquid processing chamber 400, it loads substrate W onto support pin 1110. Afterward, transfer robot 320 exits liquid processing chamber 400.

[0113] After loading operation S100, clamping operation S200 is performed. Clamping operation S200 is the operation in which the chuck pin 1300 clamps the substrate W placed on the support pin 1110. In clamping operation S200, the support unit 1000 is in a closed state. In clamping operation S200, the handle 1731 rises. The second elastic member 1740 pushes the connector 1711 upward, and the pusher 1716 rises together. As the pusher 1716 rises, the protrusion 1613 of the chuck pin support is pushed in the sixth direction 96, the chuck pin support 1600 moves along the sixth direction 96, and the chuck pin 1300 moves to the support position D2. At the same time, the guide ring unit 1400 connected to the connector 1711 also moves to the raised position H2. The chuck pin 1300 clamps the side surface of the substrate W while moving to the support position D2. Therefore, the substrate W is supported by the chuck pin 1300, and the center of the substrate W can be aligned with the center of the rotating chuck 1100.

[0114] After clamping operation S200, first rotation operation S300 can be performed. Figure 9 This is a schematic diagram illustrating the state of supplying the processing liquid to the substrate during the first rotation operation. (Refer to...) Figure 9 The first rotation operation S300 is an operation of supplying a processing liquid to the substrate W and applying the supplied processing liquid by rotating the substrate W. In the first rotation operation S300, a pool of processing liquid may be formed. This processing liquid may be a first processing liquid, and according to an example, the first processing liquid may be an etching solution. In the first rotation operation S300, the rotary chuck 1100 rotates at a first speed.

[0115] After the first rotation operation S300, the second rotation operation S400 can be executed. Figure 10 This is a schematic diagram illustrating the state of supplying the processing liquid to the substrate during the second rotation operation. (Refer to...) Figure 10In the second rotation operation S400, the support unit 1000 is converted to an open state and rotates at a second speed. In the second rotation operation S400, the handle 1731 descends. During descent, the handle 1731 contacts the bearing 1720 and applies a force to the bearing 1720 in a downward direction. Furthermore, as the connector 1711 descends, the guide ring unit 1400 moves to a lowered position H1. Additionally, the second elastic member 1740 is compressed, and the pusher 1716 descends. The first elastic member 1650 pushes the chuck pin support 1610 in a fifth direction 95, and the chuck pin 1300 moves to a separated position D1. Therefore, the chuck pin 1300 and the guide ring 1410 are spaced apart from the crater to minimize bridging and prevent crater damage. Furthermore, in the second rotation operation S400, the substrate W rotates at a second speed. The second speed may be slower than the first speed. According to an example, the second speed may be 10 RPM or lower. By rotating the substrate W at a low speed, the uniformity of the liquid pits can be improved. Here, the uniformity of the liquid pits refers to the degree of uniformity in the variation of the height of the liquid pits formed on the substrate over a specific area. Therefore, the processing uniformity of the substrate W can be improved.

[0116] Refer to Figure 8 The rinsing operation S500 can be performed after the second rotation operation S400. In the rinsing operation S500, the handle 1731 rises again, the chuck pin 1300 moves to the support position D2, and the guide ring unit 1400 moves to the raised position H2. Afterward, a processing liquid is supplied to the substrate. This processing liquid can be a second processing liquid. The second processing liquid can be a rinsing liquid. According to an example, the rinsing liquid can be deionized water. Furthermore, in the rinsing operation S500, the substrate W rotates at a third speed. The third speed can be higher than the second speed. The substrate W can rotate at the third speed after the supply of the second processing liquid, or it can rotate at the third speed simultaneously with the supply of the second processing liquid. Therefore, the first processing liquid can be replaced by the second processing liquid.

[0117] The drying operation S600 can be performed after the rinsing operation S500. In the drying operation S600, the rotary chuck 1100 rotates at a fourth speed. The fourth speed can be faster than the third speed. Therefore, the second processing liquid supplied to the substrate W can be dispersed outside the substrate W, and the processing liquid remaining on the substrate W is dried. The drying liquid can be selectively supplied in the drying operation S600. According to an example, the drying liquid can be isopropanol (IPA).

[0118] According to an exemplary embodiment of the present invention, even if the support unit 1000 includes the guide ring unit 1400, the guide ring unit 1400 can be lowered when forming the liquid pit, and the chuck pin 1300 can be spaced apart from the substrate W to stably maintain the liquid pit.

[0119] Furthermore, according to an exemplary embodiment of the present invention, even when the guide ring unit 1400 is lowered to the handle 1731, the rotary chuck 1100 can still rotate via the bearing 1720. Therefore, the liquid pits formed on the substrate W move to the edge region of the substrate W by centrifugal force, thereby improving the uniformity of the liquid pits and enhancing the in-plane processing uniformity of the substrate W.

[0120] In the above example, the invention was described using the case where the substrate W is dried by rotating the substrate W or by supplying a drying liquid in the drying operation S600. However, the invention is not limited to this, and a further configuration of spraying a drying gas onto the substrate W can be added to dry the processing liquid.

[0121] The foregoing description provides examples of this disclosure. Furthermore, this description provides exemplary embodiments of this disclosure, and this disclosure can be used in various other combinations, variations, and environments. That is, changes or modifications can be made to this disclosure within the scope of the disclosure described herein, within its equivalents, and / or within the scope of knowledge or skill in the relevant art. The embodiments demonstrate the best state for realizing the spirit of this disclosure, and various changes can be made for specific areas of application and uses of this disclosure. Therefore, the detailed description of this disclosure is not intended to limit this disclosure to these embodiments. Furthermore, the claims should be construed as including other embodiments.

[0122] In the exemplary embodiments described above, the method is described based on a flowchart in the form of a series of operations or modules. However, the present invention is not limited to the order of operations, and some operations may occur in a different order than described above or simultaneously with other operations. Furthermore, those skilled in the art will understand that the operations shown in the flowchart are not exclusive, and may include other operations or may delete one or more operations in the flowchart without affecting the scope of the present invention.

Claims

1. An apparatus for processing a substrate, the apparatus comprising: A processing bowl configured to provide processing space for processing substrates; A support unit configured to support and rotate the substrate in the processing space; as well as A processing liquid supply unit is configured to supply processing liquid to the upper surface of the substrate supported by the support unit. The support unit includes: A rotating chuck is used to place and rotate the substrate. A chuck pin, which is mounted on the rotary chuck to support the side of the substrate placed on the rotary chuck; A chuck pin support, configured to support the chuck pin; A guide ring unit, disposed between the processing bowl and the rotating chuck, and having a shape surrounding the rotating chuck in the circumferential direction; and A drive assembly configured to move the guide ring unit, such that the guide ring unit moves between a raised position and a lowered position. The raised position is the position where the guide ring unit rises to guide the processing liquid that has splashed from the substrate supported by the support unit to the processing bowl. The lowering position refers to the position where the guide ring unit is lowered to below the support unit. When the guide ring unit moves to the raised position, the chuck pin moves to the support position to support the substrate by clamping the side of the substrate supported by the rotary chuck, and when the guide ring unit moves to the lowered position, the chuck pin moves to the disengagement position, which is a position spaced apart from the substrate supported by the rotary chuck. The drive assembly is configured to rotate the rotary chuck when the guide ring unit is moved to the lowered position.

2. The device according to claim 1, wherein the driving component comprises: A first driving unit, wherein the guiding ring unit is connected to the first driving unit; as well as The second drive unit is configured to move the first drive unit in the vertical direction. The first drive unit includes a bearing, and The second drive unit includes a handle configured to contact the bearing.

3. The device according to claim 2, wherein the bearing comprises: Outer ring and inner ring; and Rollers are disposed between the outer ring and the inner ring, and The handle is configured to contact the outer ring.

4. The device according to claim 3, wherein the upper surface of the outer ring is configured as a horizontal plane. The handle is configured to at least partially overlap the outer ring when viewed from above, and The bottom surface of the handle is configured to contact the horizontal plane.

5. The device according to claim 3, wherein the outer ring is configured to remain fixed against rotation of the inner ring when the inner ring rotates while the handle is in contact with the outer ring.

6. The device according to claim 3, wherein the bearing is a crossed roller bearing.

7. The device according to claim 3, wherein the chuck pin support includes a protrusion, the longitudinal direction of which extends downward from the chuck in the radial direction of the rotating chuck. The first drive unit further includes a connector that connects the guide ring unit and the bearing. The connector has a pushing element at a position where it partially overlaps with the protrusion when viewed from above. When the guide ring unit moves to the raised position, the pusher pushes the protrusion to move the chuck pin to the supported position, and When the guide ring unit moves to the lowered position, the chuck pin moves to the disengaged position.

8. The apparatus of claim 3, wherein the separation position is a position where the processing liquid supplied to the substrate supported by the chuck pin does not contact the chuck pin.

9. The device of claim 3, wherein the guide ring unit comprises: A guide ring, which is arranged in a ring shape and has a groove at a position corresponding to the chuck pin; as well as A support body configured to support the guide ring. The guide ring is positioned adjacent to the substrate supported by the chuck pin at the raised position, and the chuck pin is located in the groove. The groove has a width that does not interfere with the guide ring when the chuck pin moves between the separated position and the supported position.

10. A method for processing a substrate using the apparatus for processing a substrate according to claim 1, the method comprising: The second rotation operation involves rotating the rotary chuck at a second speed in the open state while simultaneously treating the substrate with the processing liquid supplied to the substrate. The open state is the state in which the substrate is placed on the rotating chuck, the chuck pin is moved to the separation position, and the guide ring unit is moved to the lowered position.

11. The method of claim 10, further comprising: The loading operation involves loading the substrate onto the rotary chuck in the open state. The clamping operation switches the device from the open state to the closed state. as well as In the first rotation operation, the processing liquid is supplied to the substrate in the closed state, and the rotary chuck is rotated at a first speed. The second rotation operation is performed after the first rotation operation.

12. The method of claim 11, wherein the second speed is lower than the first speed.

13. The method of claim 11, wherein the second speed is 10 RPM or lower.

14. The method according to claim 11, wherein the treatment liquid is a first treatment liquid. The processing fluid supply unit is configured to supply the first processing fluid and the second processing fluid. The method further includes: In the rinsing operation following the second rotation operation, the substrate is held by the chuck pin, the second treatment liquid is supplied, and the substrate is rotated at a third speed; as well as The drying process involves rotating the substrate at a fourth speed, and The third speed and the fourth speed are faster than the first speed.

15. An apparatus for processing a substrate, the apparatus comprising: A processing bowl configured to provide processing space for processing substrates; A support unit configured to support and rotate the substrate in the processing space; as well as A processing liquid supply unit is configured to supply processing liquid to the upper surface of the substrate supported by the support unit. The support unit includes: A rotating chuck is used to place and rotate the substrate. A chuck pin, which is mounted on the rotary chuck to support the side of the substrate placed on the rotary chuck; A guide ring unit, disposed between the processing bowl and the rotating chuck, and having a shape surrounding the rotating chuck in the circumferential direction; and A drive assembly configured to move the guide ring, causing the guide ring unit to move between a raised position and a lowered position. The raised position is the position where the guide ring unit rises to guide the processing liquid that has splashed from the substrate supported by the support unit to the processing bowl. The lowering position is the position where the guide ring unit descends to below the support unit. When the guide ring unit moves to the raised position, the chuck pin moves to the support position to support the substrate by clamping the side of the substrate supported by the rotary chuck, and when the guide ring unit moves to the lowered position, the chuck pin moves to the disengagement position, which is a position spaced apart from the substrate supported by the rotary chuck. The driving component includes: A first driving unit, wherein the guide ring unit is connected to the first driving unit; and The second drive unit is configured to move the first drive unit in the vertical direction. The first drive unit includes a bearing, and The second drive unit includes a handle portion configured to contact the bearing. The drive assembly is configured to rotate the rotary chuck when the guide ring unit is moved to the lowered position. The bearing includes: Outer ring and inner ring; and Rollers are disposed between the outer ring and the inner ring, and The handle is configured to contact the outer ring, and The outer ring is configured to resist rotation of the inner ring and remain fixed when the inner ring rotates while the handle is in contact with the outer ring.

16. The apparatus of claim 15, wherein the separation position is a position where the processing liquid supplied to the substrate supported by the chuck pin does not contact the chuck pin.

17. The device of claim 16, wherein the guide ring unit comprises: A guide ring, which is arranged in a ring shape and has a groove at a position corresponding to the chuck pin; as well as A support body configured to support the guide ring. The guide ring is positioned adjacent to the substrate supported by the chuck pin at the raised position, and the chuck pin is located in the groove. The groove has a width that does not interfere with the guide ring when the chuck pin moves between the separated position and the supported position.

18. The device of claim 17, wherein the support unit includes a chuck pin support for supporting the chuck pin. The chuck pin support includes a protrusion, the longitudinal direction of which is in the radial direction of the rotating chuck and extends downward from the chuck pin support. The chuck pin is mounted on the chuck pin support. The first drive unit further includes a connector that connects the guide ring unit and the bearing. The connector has a pushing element at a position where it partially overlaps with the protrusion when viewed from above. When the guide ring unit moves to the raised position, the pusher pushes the protrusion to move the chuck pin to the supported position, and When the guide unit moves to the lowered position, the chuck pin moves to the disengaged position.

19. The apparatus of claim 18, further comprising: Controller The controller controls the execution of the second rotation operation, causing the rotary chuck to rotate at a second speed in the open state, and The open state is the state in which the substrate is placed on the rotating chuck, the chuck pin is moved to the separation position, and the guide ring unit is moved to the lowered position.

20. The device of claim 19, wherein the controller controls the second rotation operation to be performed after: The loading operation involves loading the substrate onto the rotary chuck in the open state. The clamping operation switches the device from the open state to the closed state. as well as In the first rotation operation, the processing liquid is supplied to the substrate in the closed state, and the rotary chuck is rotated at a first speed. The second speed is lower than the first speed.

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