Supporting device

Abstract

The invention provides a supporting device which is suitable for being arranged in a semiconductor container and comprises a body and a bearing surface. The bearing surface is on the upper surface of the body. The bearing surface comprises a first inclined surface which gradually inclines and protrudes from the bearing surface to the opening of the semiconductor container; and the second inclined surface gradually inclines and protrudes toward the inner rear wall of the semiconductor container. The bearing surface is used for bearing a contact surface of a semiconductor substrate, and the contact surface is attached and contacted along different inclined surfaces of the first inclined surface and the second inclined surface. By means of the supporting device, the deformation amount during bearing and pollution generated by frictional contact can be effectively reduced.

Description

Technical Field

[0001] This invention relates to an assembly for a semiconductor container, and more particularly to a support device that can be assembled in a semiconductor container to support a semiconductor substrate. Background Technology

[0002] In the semiconductor manufacturing and transportation process, semiconductor containers are generally used to store and place semiconductor substrates such as wafers, photomasks, PCBs, or glass substrates. With the development of semiconductor manufacturing processes, the requirements for manufacturing efficiency, yield, and cost are becoming increasingly stringent. How to improve the structure of semiconductor containers, enhance their efficiency, and / or reduce vibration of semiconductor substrates during transportation to improve process yield and reduce overall costs has become an increasingly important issue.

[0003] Existing semiconductor containers typically include a container body, a door, and a support structure. The container body has a space for accommodating a semiconductor substrate. The door is located at the external opening of the container body's space and can be opened to cover the opening, thereby sealing the space containing the semiconductor substrate. The support structure is located inside the container body's space and is used to support the semiconductor substrate. Summary of the Invention

[0004] However, when the semiconductor substrate contained in the semiconductor container is large, thin, or has low rigidity, the semiconductor substrate will easily slide relative to the supports on both sides, which will generate friction dust or even collisions.

[0005] Please refer to Figure 1 Research has found that one of the reasons for the above phenomenon is that the semiconductor substrate P is slightly deformed due to gravity, which causes warping at the contact point with the support rib R of the support member, reducing the contact area with the support rib R, and forming only a line contact relationship with the support rib R; and this phenomenon can only be improved by adding an intermediate support M in the space of the container body.

[0006] Taking a substrate with a length of 60 cm, a width of 60 cm, a thickness of 1 mm, and a density of 2.38 g / cm³ as an example, its weight is approximately 856.8 g. After being placed into a semiconductor container with side support ribs R and a central support M, the warpage of the substrate's sides relative to the support ribs R can be as high as about 0.05 mm. Under the same conditions, but with a thickness reduced to 0.5 mm, the warpage of the substrate's sides relative to the support ribs R is even higher, reaching about 0.07 mm.

[0007] In view of the shortcomings of the prior art, the inventor felt that it was not perfect, so he devoted his mind to research and overcoming it, and has successfully developed a support device that can reduce the phenomenon of back-and-forth sliding of the semiconductor substrate and / or increase the contact area with the semiconductor substrate.

[0008] In addition, the support device of the present invention can reduce dust generated by friction or reduce dust falling onto the underlying semiconductor substrate.

[0009] The directions or similar terms used throughout this invention, such as "front," "back," "left," "right," "top," "bottom," "inner," "outer," and "side," are primarily for reference to the directions in the accompanying drawings. These directions or similar terms are only used to assist in explaining and understanding the various embodiments of this invention and are not intended to limit the invention.

[0010] The use of the quantifiers "a" or "an" for the elements and components described throughout this invention is for convenience and to provide the general meaning of the scope of the invention; in this invention, it should be interpreted as including one or at least one, and the concept of a single also includes multiple cases, unless it clearly means otherwise.

[0011] The terms "combination," "integration," or "assembly" used throughout this invention mainly include those that can be separated without damaging the components after connection, or those that make the components inseparable after connection. These terms can be selected by those with ordinary knowledge in the art based on the material of the components to be connected or the assembly requirements.

[0012] To achieve the above and other objectives, the present invention provides a support device suitable for placement within a semiconductor container. The support device includes: a body; and a bearing surface located on the upper surface of the body. The bearing surface includes: a first inclined surface that gradually slopes and protrudes from the bearing surface toward the opening of the semiconductor container; and a second inclined surface that gradually slopes and protrudes toward the inner rear wall of the semiconductor container. The bearing surface is used to support a contact surface of a semiconductor substrate, and the contact surface is in contact with the first inclined surface and the second inclined surface along different inclined surfaces.

[0013] In the aforementioned support device, the first inclined surface and the second inclined surface can each form an angle of less than 7 degrees with a horizontal plane.

[0014] The present invention also provides a support device suitable for placement within a semiconductor container. The support device includes: a body; and a bearing surface having at least one segment located on the upper surface of the body. The bearing surface includes: a first inclined surface that gradually slopes and protrudes from the bearing surface toward the opening of the semiconductor container; and a second inclined surface that gradually slopes and protrudes toward the inner rear wall of the semiconductor container. The bearing surface is used to support a contact surface of a semiconductor substrate, and the contact surface is in contact with the first inclined surface and the second inclined surface along different inclined surfaces.

[0015] In the aforementioned support device, there can be multiple fractured sections, and the bearing surface can be stepped fractured sections of different heights and areas. The stepped fractured sections are used to support the contact surface of the semiconductor substrate.

[0016] In the aforementioned support device, the body includes a lower surface that is opposite to the bearing surface. The lower surface and the bearing surface have the same thickness. Multiple fracture sections are based on the lower surface and can gradually thin out from the lower surface to present stepped fracture sections of different heights and areas.

[0017] In the aforementioned support device, the height between adjacent fault sections can be less than 1 mm, and the width can be less than 2 mm.

[0018] In the aforementioned support device, the first inclined surface and the second inclined surface can each form an angle of less than 7 degrees with a horizontal plane.

[0019] The present invention also provides a support device suitable for placement within a semiconductor container. The support device includes: a body; and a bearing surface having a plane and at least one extension extending upward from the plane, wherein at least one dust collection groove is defined between the plane and the extension. The bearing surface is located on the upper surface of the body and includes: a first inclined surface that gradually slopes and protrudes from the bearing surface toward the opening of the semiconductor container; and a second inclined surface that gradually slopes and protrudes toward the inner rear wall of the semiconductor container. The bearing surface is used to support a contact surface of a semiconductor substrate, and the contact surface is in contact with the different inclined surfaces of the first inclined surface and the second inclined surface.

[0020] In the aforementioned support device, the support device can be disposed on the side wall inside the semiconductor container, and the extension can extend upward from the middle and outer side of the plane to define at least two dust collection grooves.

[0021] In the aforementioned support device, the support device can be positioned in the middle of the semiconductor container, and the extension can extend upward from the middle and two outer sides of the plane to define at least two dust collection grooves.

[0022] Accordingly, the support device of the present invention allows the semiconductor substrate to conform to the guidance of the first inclined surface and the second inclined surface, forming a slightly sunken shape in the middle, thereby reducing the likelihood of slippage and effectively reducing dust generated by friction. Furthermore, the support surface of the support device increases the contact area with the semiconductor substrate, providing more stable support and reducing the risk of slippage due to insufficient support area, as well as reducing dust generated by friction. In addition, the support device can also improve production yield by providing the dust collection groove, reducing dust falling onto the lower semiconductor substrate. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of a semiconductor substrate supported by a support device in an existing semiconductor container.

[0024] Figure 2 This is a three-dimensional structural diagram of the semiconductor container according to the first embodiment of the present invention.

[0025] Figure 3 For along Figure 2 Cross-sectional view of line AA in the middle.

[0026] Figure 4 This is a schematic diagram showing the front-to-back tilt change of the support device in the first embodiment of the present invention.

[0027] Figure 5 This is a schematic diagram of the support device of the first embodiment of the present invention with the bearing surface tilted downwards.

[0028] Figure 6 This is a schematic diagram of a semiconductor substrate supported by a support device according to the first embodiment of the present invention.

[0029] Figure 7 This is a partially enlarged three-dimensional structural view of the support device according to the first embodiment of the present invention.

[0030] Figure 8 This is a three-dimensional structural diagram of the support device according to the second embodiment of the present invention.

[0031] Figure 9 This is a partial planar structural diagram of the support device according to the second embodiment of the present invention.

[0032] Figure 10 For along Figure 9 A cross-sectional view of the BB line and a schematic diagram of the supporting semiconductor substrate.

[0033] Figure 11 This is a schematic diagram of a semiconductor substrate supported by a support device according to a third embodiment of the present invention.

[0034] Figure 12 This is a schematic diagram of a semiconductor substrate supported by a support device according to the fourth embodiment of the present invention.

[0035] Figure Labels 100 Semiconductor Containers 111 opening 112 Inner posterior wall 200A-200D support device 1 body 2 bearing surface 2a First inclined surface 2b Second Inclined Surface 21 Lowest point 22 center points 23 Fault section 24-plane 25 extension 3 Lower surface 4,4a,4b Dust collection troughs 5 connecting plates 51 Inner side L horizontal plane M intermediate support piece P-semiconductor substrate R-support rib T dust θ1 included angle θ2 downtilt angle Detailed Implementation To fully understand the purpose, features, and effects of the present invention, the present invention will be described in detail below through specific embodiments and in conjunction with the accompanying drawings: Please refer to Figure 2 The invention discloses a support device 200A according to a first embodiment of the present invention. The support device 200A is adapted to be disposed within a semiconductor container 100 and used to support a semiconductor substrate. The semiconductor container 100 may be, for example, a substrate transfer box, photomask transfer box, carrier plate transfer box, or other component carrier loading equipment or processing device in a semiconductor manufacturing process, and the present invention is not limited thereto.

[0036] In one embodiment of the present invention, the support device 200A can be applied to a front-opening type semiconductor container, such as a front-opening unified pod (FOUP). The semiconductor container 100 has an opening 111, and the interior of the semiconductor container 100 has an inner rear wall 112 opposite to the opening 111. The opening 111 and the inner rear wall 112 can be defined to be opposite each other in the Y direction, and in the front and rear directions. The height direction of the semiconductor container 100 is the Z direction. Multiple support devices 200A of this embodiment can be arranged on the left and right sides of the interior of the semiconductor container 100, which are opposite each other in the X direction. The multiple support devices 200A are longitudinally spaced from each other.

[0037] For details, please refer to [link / reference]. Figure 2 and Figure 3The support device 200A in this embodiment includes a body 1 and a bearing surface 2. The bearing surface 2 is located on the upper surface of the body 1 and is adapted to be abutted by a contact surface of the semiconductor substrate. In some embodiments, the semiconductor container 100 may also include a plurality of other types of support devices 200D (intermediate supports). The plurality of support devices 200D are arranged longitudinally (e.g., in the Z direction) within the semiconductor container 100 and are respectively connected at one end to the inner rear wall 112 of the semiconductor container 100, so that the semiconductor substrate is supported by each support device 200D and the support devices 200A on both sides.

[0038] To facilitate the explanation and display of some detailed structural features of the support device 200A, the present invention uses... Figure 4 The schematic diagram shows the support device 200A viewed from the X direction; however... Figure 4 For illustrative purposes only, the support device 200A type in this embodiment is not subject to change. Figure 4 The proportions between the various parts of the body are limited.

[0039] Please refer to Figure 2 , Figure 3 and Figure 4 In this embodiment, the bearing surface 2 of the support device 200A may include a first inclined surface 2a and a second inclined surface 2b. The first inclined surface 2a is closer to the opening 111 of the semiconductor container 100 than the second inclined surface 2b. The first inclined surface 2a gradually slopes and protrudes from the bearing surface 2 toward the opening 111 of the semiconductor container 100, while the second inclined surface 2b gradually slopes and protrudes toward the inner rear wall 112 of the semiconductor container 100.

[0040] In other words, the first inclined surface 2a slopes downward from front to back, while the second inclined surface 2b slopes upward from front to back, and the lowest point 21 of the bearing surface 2 is located between the first inclined surface 2a and the second inclined surface 2b. Figure 4 The invention has a horizontal plane L passing through the lowest point 21, and most of the first inclined plane 2a and the second inclined plane 2b are located on the horizontal plane L; the first inclined plane 2a and the second inclined plane 2b can be directly connected to the lowest point 21, or they can be separated by a small distance from each other, and the invention does not impose any restrictions on either.

[0041] Accordingly, when the semiconductor substrate is placed into the semiconductor container 100 of this embodiment, even if the semiconductor substrate is slightly deformed due to gravity, the semiconductor substrate can still follow the guidance of the first inclined surface 2a and the second inclined surface 2b, so that the contact surface of the semiconductor substrate is in contact with the different inclined surfaces of the first inclined surface 2a and the second inclined surface 2b, so that the semiconductor substrate forms a slightly sunken shape between the front and rear ends. Therefore, the potential energy and contact area required for the semiconductor substrate to slide forward and backward can be increased, thereby improving stability and effectively reducing the situation of the semiconductor substrate sliding back and forth, so as to effectively reduce the dust (particles) generated by the friction of the semiconductor substrate due to sliding.

[0042] In one embodiment of the present invention, the first inclined surface 2a and the second inclined surface 2b of the bearing surface 2 form an angle θ1 of less than 7 degrees with the horizontal plane L, and the inclination angles of the first inclined surface 2a and the second inclined surface 2b may be the same or different, which is not limited by the present invention. Thus, the structural design of the bearing surface 2 in this embodiment can improve the shortcomings of the prior art by reducing the back-and-forth sliding of the semiconductor substrate, and will not cause excessive deformation of the semiconductor substrate.

[0043] Furthermore, in one embodiment of the present invention, the bearing surface 2 is projected along the Z direction into the horizontal plane L and has a center point 22 between its front and rear ends. The lowest point 21 of the bearing surface 2 is preferably located between the rear end of the bearing surface 2 and the center point 22. Thus, even if the semiconductor substrate slides within the semiconductor container 100, it tends to slide towards the interior of the semiconductor container 100 rather than towards the opening of the semiconductor container 100.

[0044] Please refer to Figure 5 It presents a schematic diagram of the XZ cross-section of the support device 200A, and Figure 5 This is also a schematic diagram for the purpose of illustrating and showing some detailed structural features of the support device 200A. It is for illustrative purposes only, and the type of the support device 200A in this embodiment is not affected by other embodiments. Figure 5 The proportions between the various parts of the body are limited.

[0045] In one embodiment of the present invention, the bearing surface 2 of each support device 200A can be a downwardly inclined surface sloping towards the free end. The downward inclination angle θ2 of the downwardly inclined surface can be set to 3 degrees or less (including 3 degrees) and greater than 0 degrees, for example, 0.5 degrees. Thus, the bearing surface 2 of the support device 200A in this embodiment can be easily manufactured and formed, ensuring placement into the semiconductor container 100 (marked as...). Figure 2 The semiconductor substrate inside the semiconductor container 100 has a contact surface that can be attached to the corresponding bearing surface 2 to form a surface contact, thereby increasing the contact area between the support device 200A and the semiconductor substrate, thus supporting the semiconductor substrate more stably and making it less likely for the semiconductor substrate to slide inside the semiconductor container 100.

[0046] Please refer to Figure 6 Taking a substrate with a length of 60 cm, a width of 60 cm, a thickness of 1 mm, and a density of 2.38 g / cm³ as an example, its weight is approximately 856.8 g. After being placed into a semiconductor container with support devices 200A and 200D on both sides, the warpage on both sides of the substrate is only about 0.01 mm. Under the same conditions, but with a thickness reduced to 0.5 mm, the warpage on both sides of the substrate is only about 0.03 mm. Compared to the aforementioned existing structure, the warpage on both sides of the substrate is significantly reduced, and the contact area between the substrate and the support device 200A is also significantly increased. The above substrate data are only preferred embodiments and are not data limited to this invention.

[0047] Please refer to Figure 2 and Figure 7 In one embodiment of the present invention, the bearing surface 2 of the support device 200A is provided with at least one discontinuity 23. For example, in an embodiment where the semiconductor container 100 is a front-opening type, multiple support devices 200A of this embodiment can be combined on the left and right sides of the semiconductor container 100 facing each other in the X direction. Each support device 200A can be provided with at least one discontinuity 23, and the number of discontinuities 23 can be at least one layer. When there are multiple discontinuities 23, the bearing surface 2 has stepped discontinuities of different heights and areas, and all stepped discontinuities can be used to support the contact surface of the semiconductor substrate.

[0048] More specifically, the body 1 includes a lower surface 3, which is opposite to the bearing surface 2. The lower surface 3 and the bearing surface 2 have a thickness H. Multiple fault portions 23 are referenced to the lower surface 3, and the thickness between the multiple fault portions 23 and the lower surface 3 gradually decreases to present stepped fault portions of different heights and areas. The height between adjacent fault portions 23 in the Z direction is approximately less than 1 mm, for example, 0.5 to 0.8 mm; the width in the X direction is approximately less than 2 mm, for example, 1 to 1.5 mm, forming the bearing surface 2 of the support device 200A.

[0049] Accordingly, each semiconductor substrate placed in the semiconductor container 100 can be supported by the segment 23 on the support device 200A that best matches its size, so as to solve the problem of the semiconductor substrate sliding in the support device 200A due to size error.

[0050] In addition, each segment 23 is preferably formed in an L-shape or U-shape with its opening facing the center of the interior of the semiconductor container 100, so that the sidewalls of each segment 23 can help limit the position of the semiconductor substrate and reduce the sliding of the semiconductor substrate on the support device 200A, especially the sliding in the X and Y directions, thus achieving a better fixing effect.

[0051] Please refer to Figures 8 to 10This is a second embodiment of the support device 200B of the present invention. The support device 200B of this embodiment may be provided with at least one dust collection groove 4 to receive the dust T generated when the semiconductor substrate P slides, and to prevent the dust T from falling onto the lower support device 200B.

[0052] For example, please refer to the following: Figure 2 In one embodiment where the semiconductor container 100 is a front-opening transfer box, multiple support devices 200B of this embodiment can be combined on the left and right sides of the semiconductor container 100, which are opposite each other in the X direction. Figures 8 to 10 In the illustrated embodiment, multiple support devices 200B can be integrally connected to a connecting plate 5 and protrude from an inner side 51 of the connecting plate 5, and the multiple support devices 200B are longitudinally spaced from each other; the connecting plate 5 can be detachably combined with the left or right side of the semiconductor container 100.

[0053] The support device 200B has at least one dust collection groove 4 on the inner and / or outer side of its bearing surface 2. Herein, the inner side of the bearing surface 2 refers to the side of the bearing surface 2 facing the connecting plate 5; the other side of the bearing surface 2 is the outer side, that is, the outer side of the bearing surface 2 faces the internal center of the semiconductor container 100.

[0054] like Figure 10 As shown, taking the dust collection groove 4 located outside the bearing surface 2 as an example. The bearing surface 2 is located on the upper surface of the body 1. The bearing surface 2 has a plane 24 and at least one extension 25 extending upward from the plane 24. At least one dust collection groove 4 is defined between the plane 24 and the extension 25. For example, near the free end of the extension 25, the plane 24 and the extension 25 are different areas. When the extension 25 is slightly lower than the plane 24, a discontinuity is formed, and the extension 25 extends slightly upward toward the internal center of the semiconductor container 100, so that the plane 24 serves as the bearing position of the semiconductor substrate P, and the extension 25 serves as the dust collection position, wherein the discontinuity between the plane 24 and the extension 25 serves as the dust collection groove 4. In this way, when the semiconductor substrate P contacts the bearing surface 2 of the support device 200B, or when dust T is generated due to the sliding of the semiconductor substrate P during transportation, the dust T can fall downward into the dust collection groove 4 instead of falling directly onto the semiconductor substrate P below. Therefore, cross-contamination between the semiconductor substrates P can be effectively avoided to improve production yield.

[0055] The plane 24 and the extension 25 can be integrally formed and connected, or they can be two combinable components.

[0056] In one embodiment, taking the dust collection groove 4 located inside the bearing surface 2 as an example, a dust collection groove 4 can be formed between the bearing surface 2 and the inner side surface 51 of the connecting plate 5; or as... Figure 11As shown, a dust collection groove 4 is formed between the bearing surface 2 and the sidewall inside the semiconductor container 100. At least a portion of the semiconductor substrate P is located inside the bearing surface 2 near its edge and above the dust collection groove 4.

[0057] Please refer to Figure 11 The support device 200C is the third embodiment of the present invention. The support device 200C can form a dust collection groove 4 on the inner side and the outer side of the bearing surface 2, but the shape and number of dust collection grooves 4 do not limit the present invention.

[0058] The bearing surface 2 may have a plane 24 and two extensions 25 extending upward from the plane 24. The extensions 25 may extend upward from the middle and outer sides of the plane 24 to define the dust collection trough 4a and the dust collection trough 4b. Among them, the projection of the free end of the extension 25 extending upward from the middle of the plane 24 in the Z direction may be located in the outer dust collection trough 4b to improve the dust collection effect. The dust collection trough 4b serves as an auxiliary dust collection device to strengthen the prevention of dust T from falling downward onto the support device 200C of the next layer.

[0059] Similarly, please refer to Figure 2 and Figure 12 In the fourth embodiment, the support device 200D can be disposed in the middle position within the semiconductor container 100, that is, the support device 200D can be the aforementioned intermediate support member. The support device 200D can be processed into a groove, trench, or mountain-shaped structure to form at least one dust collection groove in the upper half of the support device 200D.

[0060] For example, the extension 25 of the support device 200D can extend upward from the middle and both outer sides of the plane 24 to define at least two dust collection areas, dust collection tank 4a and dust collection tank 4b. The extension 25 serves as the lower surface in contact with the semiconductor substrate P, and the gap between the plane 24 and the extension 25 forms the dust collection area. The dust collection tanks 4a and 4b also serve to collect dust and prevent it from falling downwards onto the support device 200D on the next layer. Therefore, regardless of whether the semiconductor substrate P slides to the left or right, the dust T generated by its friction can almost all fall into the two dust collection tanks 4a and 4b, further improving the overall dust collection effect.

[0061] It is worth mentioning that the extension 25 can be slightly inclined, so that the dust T can be more concentrated in the dust collection grooves 4a and 4b along the inclined surface. In addition to being suitable for semiconductor containers of front-opening transfer boxes, it can also be suitable for semiconductor containers of top-opening transfer boxes, such as top-opening carriers. Furthermore, without contradiction, the support device of each embodiment of the present invention can simultaneously have multiple of the aforementioned structural features. Therefore, the present invention is not limited to the forms disclosed in the figures of each embodiment.

[0062] The present invention has been disclosed above with reference to preferred embodiments. However, those skilled in the art should understand that these embodiments are for illustrative purposes only and should not be construed as limiting the scope of the invention. It should be noted that all variations and substitutions equivalent to these embodiments should be considered within the scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the claims, and the appended claims should be interpreted in the broadest sense to include all modifications, similar arrangements, and processes.

Claims

1. A support device adapted for placement within a semiconductor container, characterized in that, The support device includes: One entity; and A bearing surface, located on the upper surface of the body, the bearing surface includes: A first inclined surface, gradually protruding at an angle from the bearing surface toward the opening of the semiconductor container; and A second inclined surface, which gradually slopes and protrudes toward the inner rear wall of the semiconductor container; The bearing surface is used to support the contact surface of a semiconductor substrate, and the contact surface is in contact with the different inclined surfaces of the first inclined surface and the second inclined surface.

2. The support device according to claim 1, characterized in that, The first inclined surface and the second inclined surface each form an angle of less than 7 degrees with a horizontal plane.

3. A support device suitable for placement within a semiconductor container, characterized in that, The support device includes: One entity; and A bearing surface, having at least one fracture portion, is located on the upper surface of the body, the bearing surface comprising: A first inclined surface, gradually protruding at an angle from the bearing surface toward the opening of the semiconductor container; and A second inclined surface, which gradually slopes and protrudes toward the inner rear wall of the semiconductor container; The bearing surface is used to support the contact surface of a semiconductor substrate, and the contact surface is in contact with the different inclined surfaces of the first inclined surface and the second inclined surface.

4. The support device according to claim 3, characterized in that, If there are multiple fractured sections, the bearing surface will have stepped fractured sections of different heights and areas, which are used to support the contact surface of the semiconductor substrate.

5. The support device according to claim 4, characterized in that, The body includes a lower surface that is opposite to the bearing surface. The lower surface and the bearing surface have the same thickness. Multiple fault sections are based on the lower surface and gradually thin out from the lower surface to present stepped fault sections with different heights and areas.

6. The support device according to claim 4, characterized in that, The height between adjacent fault sections is less than 1 mm, and the width is less than 2 mm.

7. The support device according to claim 3, characterized in that, The first inclined surface and the second inclined surface each form an angle of less than 7 degrees with a horizontal plane.

8. A support device adapted for placement within a semiconductor container, characterized in that, The support device includes: One entity; and A bearing surface having a plane and at least one extension extending upward from the plane, defining at least one dust collection groove between the plane and the extension, the bearing surface being located on the upper surface of the body, the bearing surface including: A first inclined surface, gradually protruding at an angle from the bearing surface toward the opening of the semiconductor container; and A second inclined surface, which gradually slopes and protrudes toward the inner rear wall of the semiconductor container; The bearing surface is used to support the contact surface of a semiconductor substrate, and the contact surface is in contact with the different inclined surfaces of the first inclined surface and the second inclined surface.

9. The support device according to claim 8, characterized in that, The support device is disposed on the sidewall inside the semiconductor container, and the extension extends upward from the middle and outer sides of the plane to define at least two dust collection slots.

10. The support device according to claim 8, characterized in that, The support device is positioned in the middle of the semiconductor container, and the extension extends upward from the middle and two outer sides of the plane to define at least two dust collection slots.

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