Wafer detection probe station and detection mode
By integrating photoelectric sensors, pressure sensors, and temperature sensors, and combining them with servo motor drive, high-precision alignment and temperature control of the wafer inspection probe station are achieved, solving the problems of alignment accuracy and chip damage in existing technologies, and improving inspection efficiency and stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- MIKO WEINA SEMICON TECH (KUNSHAN) CO LTD
- Filing Date
- 2026-03-27
- Publication Date
- 2026-05-19
AI Technical Summary
Existing wafer inspection probe stations face challenges in high-precision alignment, chip damage, and temperature control, making it difficult to achieve efficient and low-damage inspection.
By employing photoelectric sensors, pressure sensors, and temperature sensors in conjunction with a servo motor, and through visual inspection, fine-tuning mechanisms, and temperature control, precise probe positioning and temperature regulation are achieved, thus preventing chip damage.
This improved alignment accuracy, reduced the risk of chip damage, and ensured the stability and efficiency of the testing process.
Smart Images
Figure CN122063418A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of semiconductor technology, specifically a wafer inspection probe station and inspection method. Background Technology
[0002] Wafer probe stations are key testing equipment in the integrated circuit manufacturing process of the semiconductor industry, and their technological development has evolved alongside advancements in semiconductor processes. In the semiconductor manufacturing process, wafer testing is a crucial step after wafer fabrication and before packaging. Its core objective is to establish an electrical connection between the die on the wafer and the testing machine using the probe station, to detect the chip's electrical parameters and functional characteristics, and to record and mark chips that do not meet requirements for rejection before proceeding to subsequent processes, thereby effectively reducing packaging and manufacturing costs.
[0003] The precision requirements for modern chip testing have reached the micrometer or even nanometer level: a single wafer may contain more than 150,000 contact points, with a pad spacing of less than 25 micrometers, and the probe contact area is only about one-quarter the cross-sectional area of a human hair. During testing, thousands to hundreds of thousands of probes need to be precisely aligned in an extremely short time. At the same time, multiple factors such as mechanical precision, thermal expansion mismatch, mechanical vibration, interference from material surface reflections, and process residues obscuring alignment marks all pose severe challenges to alignment accuracy. To address these challenges, probe station technology continues to evolve towards higher precision, higher efficiency, and lower damage.
[0004] Inspection technology acts as the "senses" and "brain" of a wafer probe station. It solves the core challenge of micron-level precise alignment through high-precision vision and positional awareness, ensures "safe contact" between the probe and the wafer through real-time force and electrical signal feedback, and guarantees long-term testing stability through temperature drift compensation and environmental monitoring. More importantly, it enables effective screening of chip yield and process diagnosis through electrical parameter testing, thereby improving testing efficiency, reducing manufacturing costs, and providing crucial support for the research and development testing of new devices. Summary of the Invention
[0005] In view of the shortcomings of the prior art, the purpose of this disclosure is to provide a wafer inspection probe station and inspection method.
[0006] The objective of this disclosure can be achieved through the following technical solutions: A wafer inspection probe station includes a support base, an X-axis motion module, a support frame, a Y-axis motion module, a Z-axis motion module, a detection module, and a wafer disk. The X-axis motion module is fixedly connected inside the support base. A fixed support frame is provided on the rear side of the support base. A fixed Y-axis motion module is provided on the support frame. A Z-axis motion module is fixedly installed on the front side of the Y-axis motion module. A detection module is fixedly installed on the front side of the Z-axis motion module. The wafer disk is fixedly installed on the upper side of the X-axis motion module. The X-axis motion module, Y-axis motion module, and Z-axis motion module control the linear motion of the probe in three directions, respectively. The detection module can rotate around the X-axis.
[0007] Furthermore, the X-axis motion module includes a first motor, a first lead screw, a first slider, a pressure sensor, a worktable, a heating wire, a vacuum chuck, and a temperature sensor. A pair of symmetrically distributed and fixedly connected first motors are provided on the front side of the outer end of the support base. Each of the two first motor shafts is equipped with a fixedly connected first lead screw. A threaded first slider is provided on the first lead screw. The two first lead screws together constrain the rotation of the first slider, allowing it to move linearly only in the X-axis direction. A pressure sensor is fixedly connected inside the first slider. The strain gauge of the pressure sensor is fixedly connected to the worktable, allowing it to sense pressure changes on the worktable. A fixedly connected heating wire and a centrally symmetrically distributed vacuum chuck are provided on the upper side of the worktable. The vacuum chuck is used to fix the wafer disk, and a temperature sensor is provided on the inner surface of the vacuum chuck.
[0008] Furthermore, the support frame includes a first support plate, an alarm light, and a slide rail. The Y-axis motion module includes a second motor, a second lead screw, and a second slider. The Z-axis motion module includes a second support plate, a third motor, a third lead screw, and a third slider. The first support plate is fixedly installed on the rear side of the support base. An alarm light is fixedly installed on one side of the first support plate. A slide rail is fixedly installed on the inner upper side of the first support plate. A second motor is fixedly installed on one side above the first support plate. A second lead screw is fixedly installed on the shaft of the second motor. A second slider with a threaded connection is provided on the second lead screw. The second slider slides in cooperation with the slide rail. The slide rail restricts the rotation of the second slider, causing it to move linearly along the Y-axis. A second support plate is fixedly connected to the outer side of the second slider. A third motor is fixedly installed on the upper side of the second support plate. A third lead screw is fixedly installed on the shaft of the third motor. A third slider with a threaded connection is provided on the third lead screw. The inner side of the second support plate restricts the rotation of the third slider, causing it to move linearly along the Z-axis.
[0009] Furthermore, the detection module includes a connecting plate, a fourth motor, a third support plate, a first mounting block, a microscope, a photoelectric sensor, a fine-tuning mechanism, a detection probe, a second mounting block, and liquid nitrogen nozzles. The third slider surface is fixedly connected to the connecting plate, and the lower side of the connecting plate is fixedly connected to the fourth motor. The shaft of the fourth motor is fixedly connected to the third support plate. The upper outer surface of the third support plate is fixedly mounted with the first mounting block, which contains the microscope and the photoelectric sensor. The middle outer surface of the support plate is fixedly mounted with the fine-tuning mechanism, which contains the detection probe. The lower outer surface of the support plate is fixedly mounted with the second mounting block, which contains a micro-displacement limiting groove. Symmetrically distributed liquid nitrogen nozzles are fixedly mounted on both sides of the second mounting block. The movement range of the detection probe is limited by the micro-displacement limiting groove.
[0010] It is worth noting that the first motor, the second motor, the third motor, and the fourth motor are all servo motors.
[0011] Furthermore, the control process for the photoelectric sensor, pressure sensor, and temperature sensor includes the following steps: SA1: Start-up power module, providing stable voltage to the working circuit; SA2: The sensor module starts working. The sensor module is divided into A and a trigger module. A refers to a specific type of sensor, which captures the corresponding signal according to its function. At the same time, the trigger module records the required information and generates the original electrical signal. SA3: The original electrical signal enters the signal conditioning module, where the filtering circuit filters out electromagnetic interference and noise in the environment, making the signal waveform smoother. The amplification circuit amplifies the weak sensor signal to a standard voltage range that the microcontroller / PLC can recognize, resulting in a clear, standard, and effective digital signal. SA4: The valid digital signal obtained from SA3 is sent to the data processing module. After being processed by the core microcontroller / PLC of the data processing module, it is transmitted to the alarm module, display module, and storage module respectively, and outputs three functions represented by B, C, and D respectively. If A in SA2 is a photoelectric sensor, then B is photoelectric alarm, C is image display, and D is relative position recording. If A is a pressure sensor, then B is pressure alarm, C is pressure value display, and D is probe height recording. If A is a temperature sensor, then B is temperature alarm, C is temperature display, and D is actual temperature recording.
[0012] Furthermore, the workflow of the photoelectric sensor is divided into the following steps: SB1: Place the wafer disk on the worktable and activate the photoelectric sensor; the photoelectric sensor then begins to operate. SB2: The photoelectric sensor performs visual detection on the position of the detection probe and the chip, and compares the actual position of the detection probe with the reference coordinates of the chip position to obtain the comparison result, which is then processed in step SB3. SB3: Based on the comparison results of step SB2, determine whether the position of the detection probe meets the standard for detecting wafer chips. If the determination result is "yes", proceed to step SB7; if the determination result is "no", proceed to step SB4 for the next step. SB4: Since the result of the judgment in step SB3 is "no", the photoelectric sensor triggers the alarm module to realize the photoelectric alarm, and the alarm light starts to work; SB5: Activate the fine-tuning mechanism to perform fine-tuning; SB6: Under the action of the fine-tuning mechanism, the detection probe is precisely calibrated and re-enters the SB2 stage, repeating the above process; SB7: Since the result of step SB3 is "yes", the detection requirements have been met and the positioning is complete.
[0013] Furthermore, the working process of the pressure sensor is divided into the following steps: SC1: After the positioning in SB7 is completed, the pressure sensor is activated; SC2: The detection probe begins to move vertically, making contact with the chip and generating pressure; SC3: The pressure sensor generates a sample value based on the applied pressure, compares the sample value with a theoretically set threshold, generates a comparison result, and enters step SC4 for further processing; SC4: Based on the comparison results of step SC3, determine whether the sampled value is within the working pressure range. If it is determined to be "yes", proceed to step SC8; if it is determined to be "no", proceed to step SC5 for further processing. SC5: Since the judgment in step SC4 is "no", the alarm module is triggered by the pressure sensor to realize the pressure alarm, and the alarm light starts to work; SC6: The fine-tuning mechanism is activated, and the fine-tuning mechanism begins to work; SC7: Under the action of the fine-tuning mechanism, the detection probe is adjusted and re-enters the SC3 stage, repeating the above process until the judgment requirements in the SC4 stage are met; SC8: Since the determination in step SC4 is "yes", the detection probe has reached the appropriate position. When the temperature requirement is also met, the detection will proceed.
[0014] Furthermore, the workflow of the temperature sensor is divided into the following steps: SD1: Set a reasonable operating temperature range according to the chip's operating environment requirements and determine the comparison benchmark; SD2: Start the temperature sensor; SD3: The temperature sensor is working to detect the current operating temperature; SD4: Determine whether the actual temperature is within the operating temperature range set in step SD2. If the result is "yes", proceed to step SD9; if the result is "no", proceed to step SD5 for further processing. SD5: If the result is "No" in step SD4, further analyze and compare the results to determine the relationship between the current operating temperature and the set operating temperature range. If the current operating temperature is higher than the set range, proceed to step SD6 for further processing. If the current operating temperature is lower than the set range, proceed to step SD7 for further processing. SD6: If the current operating temperature is higher than the set range, activate the liquid nitrogen nozzle, and the worktable will be cooled to a certain temperature by liquid nitrogen; SD7: If the current operating temperature is lower than the set range, the heating element will be activated, and the worktable will be heated to a certain temperature by the heating element; SD8: Turn off the heating wire or liquid nitrogen nozzle, and re-enter the SD3 stage to repeat the above process; SD9: Since the judgment result is "yes", the normal operating temperature range requirement has been met. When the position of the detection probe meets the requirements, detection is performed.
[0015] The explanations of the nouns, conjunctions, or adjectives used in the above technical solutions are as follows: Fixed connection: refers to a mechanical connection method in which parts or components are fixed in place without any relative movement. It is divided into two types: detachable and non-detachable. The welding mentioned in this article belongs to the category of non-detachable fixed connections.
[0016] Sliding connection: A mechanical connection in which two or more components are joined by relatively sliding contact surfaces, allowing them to move or rotate smoothly relative to each other in one or more directions, while transmitting force, motion or load.
[0017] Meshing link: a mechanical connection method that achieves precise transmission of power, motion or position through the interlocking and embedding of the surfaces of rigid or semi-rigid components (teeth, grooves, threads, etc.). The meshing link discussed in this article refers to the meshing between gears.
[0018] Rotary connection: refers to a mechanical connection method that connects two rotating parts together through parts such as bearings or bushings.
[0019] The beneficial effects of this disclosure are: This invention proposes the following solutions to the alignment accuracy, chip damage, and operating temperature control problems mentioned in the background art: 1. Employing detection technology, it is compatible with photoelectric sensors, pressure sensors, and temperature sensors to constantly monitor the probe's position and make timely adjustments, effectively preventing damage during detection. ① By combining photoelectric sensors with microscopes and fine-tuning mechanisms, digital images are displayed on computer screens through optical imaging, photoelectric conversion, and image acquisition, making it easy to observe subtle deviations that are difficult for the human eye to see. Then, the fine-tuning mechanism is used to correct the deviations.
[0020] ② By cooperating with the pressure sensor and the fine-tuning mechanism, when the contact pressure between the probe and the wafer exceeds a certain range, the pressure sensor feeds back the detection result to the computer, which then activates the fine-tuning mechanism to adjust the height of the probe. This avoids damage to the chip during the detection process, enhances the reliability of the device, reduces unnecessary economic losses, and also improves the positioning accuracy.
[0021] ③ By using a combination of a temperature sensor, a thermoelectric wire, and a liquid nitrogen probe, semiconductor materials are extremely sensitive to temperature changes. Therefore, it is necessary to set the temperature threshold according to different working conditions, and then use a temperature sensor in conjunction with a thermoelectric wire or a liquid nitrogen probe for adjustment.
[0022] 2. The use of a servo motor as the drive motor has advantages such as high-precision positioning and closed-loop control, extremely high low-speed stability, fast response and high acceleration, strong overload capacity, and constant and controllable torque, which further improves the working accuracy of the entire device. Attached Figure Description
[0023] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, those skilled in the art can obtain other drawings based on these drawings without creative effort.
[0024] Figure 1 This is an overall structural diagram of the wafer inspection probe station according to an embodiment of the present invention; Figure 2 This is an exploded view of the X-axis motion module according to an embodiment of the present invention; Figure 3 This is an exploded view of the Y-axis motion module and the Z-axis motion module according to an embodiment of the present invention; Figure 4 This is an exploded view of the detection module in an embodiment of the present invention; Figure 5 This is a schematic diagram of the workbench structure according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the second mounting block structure according to an embodiment of the present invention; Figure 7 This is a flowchart of the sensor control process according to an embodiment of the present invention; Figure 8 This is a flowchart of the photoelectric sensor detection process according to an embodiment of the present invention; Figure 9 This is a flowchart of the pressure sensor detection process according to an embodiment of the present invention; Figure 10 This is a flowchart of the temperature sensor detection process according to an embodiment of the present invention.
[0025] In the diagram: Support base 1, X-axis motion module 2, support frame 3, Y-axis motion module 4, Z-axis motion module 5, detection module 6, first motor 7, first lead screw 8, first slider 9, pressure sensor 10, worktable 11, heating wire 12, wafer disk 13, first support plate 14, alarm light 15, second motor 16, second lead screw 17, second slider 18, slide rail 19, second support plate 20, third motor 21, third lead screw 22, third slider 23, connecting plate 24, fourth motor 25, third support plate 26, first mounting block 27, microscope 28, photoelectric sensor 29, fine-tuning mechanism 30, detection probe 31, second mounting block 32, liquid nitrogen nozzle 33, vacuum suction cup 34, temperature sensor 35, micro-displacement limiting groove 36. Detailed Implementation
[0026] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.
[0027] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the present invention.
[0028] Examples of the embodiments are shown in the accompanying drawings, wherein the terms "a" and "b" are used to distinguish identical or similar elements. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the invention, and should not be construed as limiting the invention.
[0029] As an optimized technical solution of the present invention, please refer to Figure 1A wafer inspection probe station includes a support base 1, an X-axis motion module 2, a support frame 3, a Y-axis motion module 4, a Z-axis motion module 5, a detection module 6, and a wafer disk 13. The support base 1 has an X-axis motion module 2 fixedly connected inside, and a fixed support frame 3 is provided on the rear side of the support base 1. The support frame 3 has a fixed Y-axis motion module 4 fixedly connected on it. The Z-axis motion module 5 is fixedly installed on the front side of the Y-axis motion module 4, and the detection module 6 is fixedly installed on the front side of the Z-axis motion module 5. The wafer disk 13 is fixedly installed on the upper side of the X-axis motion module 2. The X-axis motion module 2, the Y-axis motion module 4, and the Z-axis motion module 5 control the linear motion of the probe in three directions, respectively. The detection module 6 can rotate around the X-axis. The main motion modules of the wafer inspection probe station contain four degrees of freedom. By integrating the motion of the four dimensions of X, Y, Z, and θ into a high-precision platform, the high-speed automation of the testing process is achieved while ensuring contact accuracy, and it can flexibly adapt to various complex testing environments.
[0030] Please see Figure 2 and Figure 5 The X-axis motion module 2 includes a first motor 7, a first lead screw 8, a first slider 9, a pressure sensor 10, a worktable 11, a heating wire 12, a vacuum suction cup 34, and a temperature sensor 35. A pair of symmetrically distributed and fixedly connected first motors 7 are provided on the front side of the outer end of the support base 1. Each of the two first motors 7 has a fixedly connected first lead screw 8 on its rotating shaft. The first lead screw 8 has a threadedly connected first slider 9. The two first lead screws 8 together constrain the rotation of the first slider 9, allowing it to move only in a linear motion along the X-axis. A fixedly connected pressure sensor 10 is located inside the first slider 9. The strain gauge of the pressure sensor 10 is fixedly connected to the worktable 11, and can sense the pressure change of the worktable 11. The pressure sensor 10 is a strain resistance sensor, which uses the strain effect to complete the work. It has high sensitivity and long service life. The upper side of the worktable 11 is provided with a fixedly connected heating wire 12 and a centrally symmetrically distributed vacuum chuck 34. The vacuum chuck 34 is used to fix the wafer disk 13. The inner surface of the vacuum chuck 34 is provided with a temperature sensor 35. The temperature sensor 35 is a metal resistance temperature sensor, which uses the resistance temperature effect to complete the work. It has high sensitivity, wide measurement range and good linearity.
[0031] Please see Figure 3The support frame 3 includes a first support plate 14, an alarm light 15, and a slide rail 19. The Y-axis motion module 4 includes a second motor 16, a second lead screw 17, and a second slider 18. The Z-axis motion module 5 includes a second support plate 20, a third motor 21, a third lead screw 22, and a third slider 23. The first support plate 14 is fixedly installed on the rear side of the support base 1. The alarm light 15 is fixedly installed on one side of the first support plate 14. The slide rail 19 is fixedly installed on the inner side of the upper end of the first support plate 14. The second motor 16 is fixedly installed on one side above the first support plate 14. The second lead screw 17 is fixedly installed on the shaft of the second motor 16. The second lead screw 17 is provided with a threaded second slider 18. The second slider 18 is slidably engaged with the slide rail 19, which restricts the rotation of the second slider 18, causing it to move linearly along the Y-axis. A second support plate 20 is fixedly connected to the outer side of the second slider 18. A third motor 21 is fixedly installed on the upper side of the second support plate 20. A third lead screw 22 is fixedly installed on the shaft of the third motor 21. A third slider 23 is threadedly connected to the third lead screw 22. The inner side of the second support plate 20 restricts the rotation of the third slider 23, causing it to move linearly along the Z-axis. The X-axis motion module 2, Y-axis motion module 4, and Z-axis motion module 5 all utilize a screw transmission mechanism to convert the rotational force of the motor shaft into linear motion in different directions of the three sliders.
[0032] Please see Figure 4 and Figure 6The detection module 6 includes a connecting plate 24, a fourth motor 25, a third support plate 26, a first mounting block 27, a microscope 28, a photoelectric sensor 29, a fine-tuning mechanism 30, a detection probe 31, a second mounting block 32, and a liquid nitrogen nozzle 33. The third slider 23 has a fixedly connected connecting plate 24 on its surface. The fourth motor 25 is fixedly connected to the lower side of the connecting plate 24. The third support plate 26 is fixedly connected to the shaft of the fourth motor 25. The first mounting block 27 is fixedly mounted on the upper outer surface of the third support plate 26. The microscope 28 and the photoelectric sensor 29 are fixedly mounted inside the first mounting block 27. The photoelectric sensor 29, in cooperation with the microscope 28 and the fine-tuning mechanism 30, undergoes optical imaging. The photoelectric conversion and image acquisition display digital images on the computer screen. The outer surface of the support plate 26 is provided with a fixed fine-tuning mechanism 30. The lower side of the fine-tuning mechanism 30 is fixedly installed with a detection probe 31, which can control the slight displacement of the detection probe 31 to achieve further precise positioning. The lower outer surface of the support plate 26 is provided with a fixed second mounting block 32. The second mounting block 32 has a micro-displacement limiting groove 36 inside. The liquid nitrogen nozzles 33 are fixedly installed on both sides of the second mounting block 32 in a symmetrical distribution. The movement range of the detection probe 31 is limited by the micro-displacement limiting groove 36, and at the same time, a certain support force is provided for the detection probe 31 to avoid damage during operation and increase the service life of the detection probe 31.
[0033] Please see Figure 1-6 The first motor 7, the second motor 16, the third motor 21, and the fourth motor 25 are all servo motors, which can achieve precise control and are an important support for the precise positioning of this invention.
[0034] Please see Figure 7The control process of the photoelectric sensor 29, pressure sensor 10, and temperature sensor 35 includes the following steps: First, the power supply module is started to provide a stable voltage to all circuits. Let A represent a specific type of sensor. The sensor module's A captures the required raw electrical signal and simultaneously triggers the module to record the necessary information. The raw electrical signal is then transmitted to the signal conditioning module. The filtering and amplification circuits in the signal conditioning module process the raw electrical signal. The filtering circuit filters out electromagnetic interference and noise from the environment, smoothing the signal waveform. The amplification circuit amplifies the weak sensor signal to the microcontroller / PLC. Together, they produce a clear and standard effective digital signal, which is then transmitted to the data processing module. The microcontroller / PLC in the data processing module performs core calculations and judgments, and finally transmits the results to the alarm module, display module, and storage module respectively. After processing by each module, the results are output as three functions: B, C, and D. If A is the photoelectric sensor 29, then B is photoelectric alarm, C is image display, and D is relative position recording; if A is the pressure sensor 10, then B is height alarm, C is pressure value display, and D is probe height recording; if A is the temperature sensor 35, then B is temperature alarm, C is temperature display, and D is actual temperature recording. Through this control process, the measured non-electrical quantities (such as photoelectric information, pressure information, and temperature information) can be effectively converted into electrical outputs. After computer image display, various monitoring information can be well reflected.
[0035] Please see Figure 8, for the photoelectric sensor 29, it mainly cooperates with the microscope 28 and the fine adjustment mechanism 30 to finely position the detection probe 31, so as to compensate for the position error in the preliminary positioning. First, place the crystal disk 13 to be measured correctly on the workbench, start the photoelectric sensor 29, perform visual detection, cooperate with the microscope 28 to determine the position of the detection probe 31, and compare it with the position reference coordinates of the chip to be detected in the wafer to determine whether the position is qualified. Taking the chip as the center and the maximum allowable error value as the radius to construct a circle. If the detection probe 31 falls inside the circle, it is determined to be qualified, and the output is "yes", and the positioning is completed; if the detection probe 31 falls outside the circle, it is determined to be unqualified, and the output is "no", and fine adjustment is performed through the fine adjustment mechanism 30. The alarm module is triggered by the photoelectric sensor 29 to achieve photoelectric alarm. The alarm lamp 15 starts to work. When the alarm lamp 15 works, the fine adjustment mechanism 30 is started, so that the detection probe 31 is accurately calibrated, and the position error is smaller than before. Then, it returns to the visual detection link again, and detection and judgment are carried out again. If the output is "yes", the positioning is completed; if the output is "no", the fine adjustment step is repeated until the output is "yes", and the positioning is completed. This positioning process mainly relies on the photoelectric sensor 29, which has the advantages of non-contact detection, fast response, high precision, long life, and strong anti-interference ability. It can be quickly triggered and accurately positioned during the positioning process of the detection probe 31, improving the response speed and alignment accuracy of the entire system.
[0036] Please refer to Figure 9 , after the precise positioning is completed, a pressure test is carried out to avoid damage to the chips on the crystal disk 13 during the detection process. First, start the pressure sensor 10. When the detection probe 31 starts to contact the chip and generates a certain pressure, the pressure sensor 10 starts to work, obtains the sampling value of the pressure, compares it with the set pressure threshold, and makes a judgment. If the sampling value is within the set threshold, it is determined to be qualified, and the output is "yes", and it directly enters the detection link; if the sampling value is not within the set threshold, it is determined to be unqualified, and the output is "no", and the alarm module is triggered to achieve pressure alarm. The alarm lamp 15 starts to work, and the fine adjustment mechanism 30 is started. The detection probe 31 is adjusted in height, and the pressure value also changes. Then, it returns to the "comparison of sampling value and set threshold" link again, and comparison and judgment are carried out again. If the output is "yes", it enters the detection link. If the output is "no", the fine adjustment step is repeated until the output is "yes", and it enters the detection link. In this process, the pressure sensor accurately judges the contact situation between the detection probe 31 and the chip, can effectively prevent damage to the chips in the measured crystal disk 13, assist in the positioning of the detection probe 31, and at the same time ensure a reasonable contact strength during detection.
[0037] To ensure that the working temperature is within a reasonable range, the temperature sensor 35 is used in this device as Figure 10The workflow is as follows: First, based on the actual working scenario, a normal operating temperature range is set as the benchmark for temperature adjustment. Temperature sensor 35 is activated, monitoring the actual temperature of the current workbench 11 and comparing it with the set temperature range to determine if it meets the standard. If the actual temperature is within the set range, the temperature meets the standard, and the output is "Yes," directly proceeding to the detection stage. If the actual temperature is outside the set range, the temperature does not meet the standard, and the output is "No," requiring further analysis of the temperature data to determine the specific relationship between the temperature and the set range. If the temperature is higher than the set range, the liquid nitrogen nozzle 33 starts working, spraying some liquid nitrogen onto the workbench 11 to lower the temperature and complete the temperature adjustment. If the temperature is lower than the set range, the heating wire 12 starts working, using its own heat to heat the workbench 11, completing the temperature adjustment. Then, the process returns to the temperature monitoring step, re-comparing and judging. If the output is "Yes," the detection stage begins; if the output is "No," the data analysis and temperature adjustment steps are repeated until the output is "Yes," at which point the detection stage begins again.
[0038] The wafer disk 13 has operating temperature requirements in actual operation. Semiconductor devices are particularly sensitive to temperature, so it is important to set the detection range to match the actual operating temperature during testing. The temperature sensor 35 mainly detects whether the wafer disk 13 can operate normally at the set temperature range based on the temperature range set for the wafer disk 13. The temperature sensor 35 has the advantages of accuracy, stability, fast response, small fluctuation, and safety and reliability, realizing fully automatic constant temperature control of the entire system.
[0039] The usage process of this invention is as follows: This invention relates to a wafer inspection probe station. First, the detection temperature is set according to the application scenario of the chip in the wafer disk 13, and temperature adjustment is performed in conjunction with the temperature sensor 35, liquid nitrogen nozzle 33, and heating wire 12. The specific adjustment method is as described in the above embodiment. After the temperature adjustment is completed, preliminary positioning begins. At this time, the first motor 7 is started, and it is important to note that the two first motors 7 need to keep their directions consistent, driving the first lead screw 8 to move. The first lead screw 8 drives the first slider 9 to move through a threaded connection, thereby completing the position adjustment in the X direction. Then, the first motor 7 is turned off, and the second motor 16 is started simultaneously. The second motor 16 drives the second lead screw 17 to rotate. The second lead screw 17 drives the second slider 18 to move through a threaded connection. The second slider 18 moves linearly on the slide rail 19, thereby completing the position adjustment in the Y direction. After adjusting upwards, the second motor 16 is turned off. Then, the photoelectric sensor 29, microscope 28, and fine-tuning mechanism 30 are used for detection, as shown in the above embodiment. At this point, the precise adjustment of the position in the X and Y directions is completed. Next, the third motor 21 is started, which drives the third lead screw 22 to rotate. The third lead screw 22 drives the third slider 23 to move through the threaded engagement, thereby completing the adjustment in the Z direction. Then, the pressure sensor 10 is used for detection, and further adjustments are made through the fine-tuning mechanism 30 to effectively prevent damage to the chip in the tested wafer disk 13. At this point, the device is adjusted to a suitable detection state for the next detection operation. In actual operation, the fourth motor 25 can also drive the third support plate 26 to change the angle of the detection probe 31, thereby achieving multi-angle detection.
[0040] The foregoing has shown and described the basic principles, main features, and advantages of this disclosure. Those skilled in the art should understand that this disclosure is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this disclosure. Various changes and modifications can be made to this disclosure without departing from its spirit and scope, and all such changes and modifications fall within the scope of this disclosure as claimed.
Claims
1. A wafer inspection probe station, comprising a support base (1), an X-axis motion module (2), a support frame (3), a Y-axis motion module (4), a Z-axis motion module (5), an inspection module (6), and a wafer disk (13), characterized in that: The support base (1) is provided with a fixed X-axis motion module (2) inside. The support base (1) is provided with a fixed support frame (3) on the rear side. The support frame (3) is provided with a fixed Y-axis motion module (4). The Y-axis motion module (4) is fixedly installed with a Z-axis motion module (5) on the front side. The Z-axis motion module (5) is fixedly installed with a detection module (6) on the front side. The wafer disk (13) is fixedly installed on the upper side of the X-axis motion module (2). The X-axis motion module (2), Y-axis motion module (4) and Z-axis motion module (5) control the linear motion of the probe in three directions respectively. The detection module (6) can rotate around the X-axis.
2. The wafer inspection probe station according to claim 1, characterized in that: The X-axis motion module (2) includes a first motor (7), a first lead screw (8), a first slider (9), a pressure sensor (10), a worktable (11), a heating wire (12), a vacuum suction cup (34), and a temperature sensor (35). A pair of symmetrically distributed and fixedly connected first motors (7) are provided on the front side of the outer end of the support base (1). Each of the two first motors (7) has a fixedly connected first lead screw (8) on its rotating shaft. The first lead screw (8) has a threaded first slider (9). The two first lead screws (8) together constrain the first... The rotation of a slider (9) allows it to move only in a straight line in the X-axis direction. A pressure sensor (10) is fixedly connected inside the first slider (9). The strain gauge of the pressure sensor (10) is fixedly connected to the worktable (11) and can sense the pressure change of the worktable (11). A heating wire (12) is fixedly connected on the upper side of the worktable (11) and a vacuum chuck (34) is centrally symmetrically distributed. The vacuum chuck (34) is used to fix the wafer disk (13). A temperature sensor (35) is provided on the inner surface of the vacuum chuck (34).
3. A wafer inspection probe station according to claim 2, characterized in that: The support frame (3) includes a first support plate (14), an alarm light (15), and a slide rail (19). The Y-axis motion module (4) includes a second motor (16), a second lead screw (17), and a second slider (18). The Z-axis motion module (5) includes a second support plate (20), a third motor (21), a third lead screw (22), and a third slider (23). The first support plate (14) is fixedly installed on the rear side of the support base (1). The alarm light (15) is fixedly installed on one side of the first support plate (14). The slide rail (19) is fixedly installed on the inner side of the upper end of the first support plate (14). The second motor (16) is fixedly installed on one side above the first support plate (14). The shaft of the second motor (16) is fixedly mounted on... A second lead screw (17) is fixedly installed, and a second slider (18) with a threaded connection is provided on the second lead screw (17). The second slider (18) is slidably engaged with a slide rail (19). The slide rail (19) restricts the rotation of the second slider (18) so that it moves linearly along the Y-axis. A second support plate (20) is fixedly connected to the outside of the second slider (18). A third motor (21) is fixedly installed on the upper side of the second support plate (20). A third lead screw (22) is fixedly installed on the shaft of the third motor (21). A third slider (23) with a threaded connection is provided on the third lead screw (22). The inner side of the second support plate (20) restricts the rotation of the third slider (23) so that it moves linearly along the Z-axis.
4. The wafer inspection probe station according to claim 3, characterized in that: The detection module (6) includes a connecting plate (24), a fourth motor (25), a third support plate (26), a first mounting block (27), a microscope (28), a photoelectric sensor (29), a fine-tuning mechanism (30), a detection probe (31), a second mounting block (32), and a liquid nitrogen nozzle (33). The third slider (23) is provided with a fixedly connected connecting plate (24) on its surface. The fourth motor (25) is provided with a fixedly connected fourth motor (25) on its lower side. The third support plate (26) is provided with a fixedly connected third support plate (26) on its rotating shaft. The first mounting block is provided with a fixedly mounted first mounting block on the upper outer surface of the third support plate (26). (27) A microscope (28) and a photoelectric sensor (29) are fixedly installed inside the first mounting block (27). A fine adjustment mechanism (30) is fixedly installed on the outer surface of the middle side of the support plate (26). A detection probe (31) is fixedly installed on the lower side of the fine adjustment mechanism (30). A second mounting block (32) is fixedly installed on the outer surface of the lower side of the support plate (26). A micro-displacement limiting groove (36) is provided inside the second mounting block (32). Liquid nitrogen nozzles (33) are fixedly installed on both sides of the second mounting block (32) in a symmetrical arrangement. The movement range of the detection probe (31) is limited by the micro-displacement limiting groove (36).
5. A wafer inspection probe station according to claim 4, characterized in that: The first motor (7), the second motor (16), the third motor (21) and the fourth motor (25) are all servo motors.
6. The wafer inspection probe station according to claim 5, wherein the control process of the photoelectric sensor (29), pressure sensor (10), and temperature sensor (35) includes the following steps: SA1: Start-up power module, providing stable voltage to the working circuit; SA2: The sensor module starts working. The sensor module is divided into A and a trigger module. A refers to a specific type of sensor, which captures the corresponding signal according to its function. At the same time, the trigger module records the required information and generates the original electrical signal. SA3: The original electrical signal enters the signal conditioning module, where the filtering circuit filters out electromagnetic interference and noise in the environment, making the signal waveform smoother. The amplification circuit amplifies the weak sensor signal to a standard voltage range that the microcontroller / PLC can recognize, resulting in a clear, standard, and effective digital signal. SA4: The valid digital signal obtained from SA3 is sent to the data processing module. After being processed by the core microcontroller / PLC of the data processing module, it is transmitted to the alarm module, display module and storage module respectively, and outputs three functions represented by B, C and D respectively. If A in SA2 is a photoelectric sensor (29), then B is photoelectric alarm, C is image display and D is relative position recording. If A is a pressure sensor (10), then B is pressure alarm, C is pressure value display and D is probe height recording. If A is a temperature sensor (35), then B is temperature alarm, C is temperature display and D is actual temperature recording.
7. According to claim 5, the working process of the photoelectric sensor (29) is divided into the following steps: SB1: Place the wafer disk (13) on the worktable (11) and start the photoelectric sensor (29). The photoelectric sensor (29) starts working. SB2: The photoelectric sensor (29) performs visual detection on the detection probe (31) and the chip position, and compares the actual position of the detection probe (31) with the reference coordinates of the chip position to obtain the comparison result, and enters the step SB3 for further processing; SB3: Based on the comparison results of step SB2, determine whether the position of the detection probe (31) meets the standard for detecting wafer chips. If the judgment result is "yes", proceed to step SB7. If the judgment result is "no", proceed to step SB4 for further processing. SB4: Since the result of the judgment in the SB3 step is "no", the photoelectric sensor (29) triggers the alarm module to realize the photoelectric alarm, and the alarm light (15) starts to work; SB5: Activate the fine-tuning mechanism (30) to perform fine-tuning; SB6: Under the action of the fine-tuning mechanism (30), the detection probe (31) is precisely calibrated and enters the SB2 stage again to repeat the above process; SB7: Since the result of step SB3 is "yes", the detection requirements have been met and the positioning is complete.
8. The wafer inspection probe station according to claim 7, wherein the working process of the pressure sensor (10) consists of the following steps: SC1: After the positioning in SB7 is completed, the pressure sensor (10) is activated. SC2: The detection probe (31) begins to move vertically, making contact with the chip and generating pressure; SC3: The pressure sensor (10) generates a sample value based on the applied pressure. The sample value is compared with the theoretically set threshold to generate a comparison result, which is then processed in step SC4. SC4: Based on the comparison results of step SC3, determine whether the sampled value is within the working pressure range. If it is determined to be "yes", proceed to step SC8; if it is determined to be "no", proceed to step SC5 for further processing. SC5: Since the judgment in SC4 is "no", the alarm module is triggered by the pressure sensor (10) to realize the pressure alarm, and the alarm light (15) starts to work; SC6: Start the fine-tuning mechanism (30), and the fine-tuning mechanism (30) begins to work; SC7: Under the action of the fine-tuning mechanism (30), the detection probe (31) is adjusted and enters the SC3 stage again, repeating the above process until the judgment requirements in the SC4 stage are met; SC8: Since the determination in step SC4 is "yes", the detection probe (31) has reached the appropriate position. When the temperature requirement is also met, the detection is performed.
9. The wafer inspection probe station according to claim 5, wherein the working process of the temperature sensor (35) comprises the following steps: SD1: Set a reasonable operating temperature range according to the chip's operating environment requirements and determine the comparison benchmark; SD2: Start temperature sensor (35); SD3: The temperature sensor (35) is working to detect the current operating temperature; SD4: Determine whether the actual temperature is within the operating temperature range set in step SD2. If the result is "yes", proceed to step SD9; if the result is "no", proceed to step SD5 for further processing. SD5: If the result is "No" in step SD4, further analyze and compare the results to determine the relationship between the current operating temperature and the set operating temperature range. If the current operating temperature is higher than the set range, proceed to step SD6 for further processing. If the current operating temperature is lower than the set range, proceed to step SD7 for further processing. SD6: If the current working temperature is higher than the set range, start the liquid nitrogen nozzle (33), and the worktable (11) will be cooled to a certain temperature by liquid nitrogen; SD7: If the current working temperature is lower than the set range, start the heating wire (12) to heat the worktable (11) to a certain temperature; SD8: Turn off the heating wire (12) or liquid nitrogen nozzle (33), and re-enter the SD3 stage to repeat the above process; SD9: Since the judgment result is "yes", the normal working temperature range requirement is met. When the position of the detection probe (31) meets the requirements, detection is performed.