Dynamic adjustment and protection system for low-temperature heating power of high-power equipment

Abstract

The invention belongs to the technical field of electronic equipment, and discloses a high-power equipment low-temperature heating power dynamic adjustment and protection system, which comprises a heating unit, a control unit and a functional unit, a BMC, an onboard temperature sensor and a current sensor are arranged in the control unit, and the heating unit is used for heating onboard components of the functional unit. The heating unit, the control unit and the function unit are included, the heating unit conducts heat through an aluminum alloy structural part, the heater can be made of a heating film and the like, compared with traditional peripheral heating, 24.3% of PCB space is saved, the heating efficiency is higher, installation is easier and more convenient, a BMC chip of the control unit meets the-60 DEG C low-temperature working requirement, data are collected through temperature and current sensors, and the temperature and current sensors are used for controlling the temperature and current sensors. The power is dynamically adjusted according to the PWM duty ratio in combination with a pre-stored thermal simulation lookup table, heating of each component can be independently controlled, and the system can avoid over-current protection triggering, remarkably save power consumption and ensure stable and reliable work of equipment at low temperature.

Description

Technical Field

[0001] This invention belongs to the field of electronic equipment technology, specifically a dynamic adjustment and protection system for low-temperature heating power of high-power equipment. Background Technology

[0002] Currently, traditional heating solutions for high-power equipment in low-temperature environments have two significant technical shortcomings during the startup phase:

[0003] 1. Traditional heating methods often use heating films to heat the entire area around the target component. These heating films require a large amount of PCB (Printed Circuit Board) layout space and suffer from low heating efficiency and long heating time, making them unsuitable for the actual use requirements of high-power equipment that demand fast start-up response and strict adaptability to low-temperature conditions. If the equipment has multiple components that require low-temperature preheating, the independent layout, fixing and wiring process of each heating film is cumbersome, which greatly increases the difficulty of equipment integration and assembly complexity.

[0004] 2. Traditional heating methods use a constant power output mode and lack dynamic power adjustment capability. In low-temperature start-up scenarios, there is a risk that the heating unit and the main body of the equipment will run at the same time. This will not only cause a significant increase in the operating current of the entire equipment, but may also generate instantaneous inrush current, which will cause unnecessary power redundancy loss. In severe cases, it will also trigger the system overcurrent protection mechanism, causing the equipment start-up process to be interrupted and unable to work normally.

[0005] To address the aforementioned technical challenges, this invention provides a dynamic adjustment and protection system for low-temperature heating power of high-power equipment, breaking through the bottlenecks of traditional heating solutions and ensuring stable, continuous, and reliable operation of high-power equipment under low-temperature conditions. Summary of the Invention

[0006] The purpose of this invention is to provide a dynamic adjustment and protection system for low-temperature heating power of high-power equipment, so as to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, the technical solution adopted by the present invention is as follows: a dynamic adjustment and protection system for low-temperature heating power of high-power equipment, the system comprising a heating unit, a control unit and a functional unit;

[0008] The control unit incorporates a BMC, an onboard temperature sensor, and a current sensor. The heating unit is used to heat the onboard components of the functional unit. The control unit collects ambient temperature data via the onboard temperature sensor and obtains real-time operating mode and component temperature information of the functional unit through the low-speed data interface of the BMC. Based on the ambient temperature, operating mode, and component temperature information, the control unit adjusts the output power of the power control component through the GPIO interface, thereby adjusting the operating state of the heating unit. Simultaneously, the current sensor collects the total operating current of the device in real time, enabling current monitoring.

[0009] The heating unit conducts heat to the target heating component through structural components; the control unit has a pre-stored lookup table of heating power consumption, component temperature and working mode obtained based on thermodynamic simulation, and dynamically adjusts the heating power of the heating unit by adjusting the PWM duty cycle to avoid the device triggering overcurrent protection.

[0010] Preferably, the heating unit includes a heater and a structural component; the structural component is made of aluminum alloy, and the heater is selected from heating film, heating wire or ceramic heating rod; the heater is embedded inside the structural component, and heat conduction is achieved through the structural component.

[0011] Preferably, the BMC of the control unit meets the low-temperature operation requirement of 60°C and is a chip with AD conversion function; the BMC establishes a real-time communication connection with the functional unit through UART or IIC low-speed data interface.

[0012] Preferably, the operating mode lookup table is stored in the onboard flash of the device. The lookup table contains a one-to-one correspondence between ambient temperature, functional unit operating mode and PWM duty cycle. The BMC of the control unit queries the operating mode lookup table based on the collected ambient temperature and functional unit operating mode information to determine the corresponding PWM duty cycle.

[0013] Preferably, the key parameters in the working mode lookup table correspond as follows: when the ambient temperature is 58℃, the device cannot start normally, and the PWM duty cycle of the heating unit is set to 100%; when the ambient temperature is 35℃, the functional unit is in normal working mode 3, and the PWM duty cycle of the heating unit is set to 30%; when the ambient temperature is 30℃, the functional unit is in normal working mode 3, and the PWM duty cycle of the heating unit is set to 0%.

[0014] Preferably, for each component that needs to be heated in the functional unit, the heating unit is configured with a separate heater; the BMC independently controls the output power of each heater through different GPIO pins.

[0015] Preferably, the overcurrent protection current threshold of the device is a preset value, and 30% of it is the overcurrent warning threshold; the current sensor collects the operating current of the heating unit and the functional unit respectively, and when the total current of the two exceeds the overcurrent warning threshold, the BMC immediately reduces the output power of the heating unit.

[0016] Preferably, when the initial ambient temperature is 58°C, the heating power of the heating unit is 70W, and the heater dimensions are 55mm×55mm, the target component temperature can be raised to 35°C through conductive heating via structural components, and the heating process takes no more than 69s.

[0017] Preferably, the BMC is selected as an MCU chip or a ZYNQ chip; the functional unit includes at least one of the following components: FPGA, CPU, DSP, NPU, and GPU, and each component has an embedded temperature sensor and a working mode management module.

[0018] Preferably, the device has external dimensions of 150mm × 200mm; the heating unit adopts a structural component conduction heating method, which can save 73cm² of PCB area compared with the traditional peripheral heating method, and this saved area accounts for 24.3% of the usable PCB area of ​​the device.

[0019] As described above, the technical solution adopted in this invention has the following beneficial effects:

[0020] 1. This invention effectively solves the technical pain points of traditional heating methods, such as low efficiency, large space occupation, complex installation, and long start-up time, by setting a heating conduction structure on the top of the component. This brings significant practical value and technological improvement. Traditional heating methods often use direct heating around the component, which not only has low heat conduction efficiency but also uneven heating, easily leading to localized overheating or insufficient heating of the component, affecting the normal start-up and stable operation of the equipment. In contrast, this invention uses structural component conduction heating, selecting aluminum alloy with excellent thermal conductivity as the structural component. The heater is placed at the corresponding position of the structural component, allowing heat to be quickly conducted through the structural component. The heating is evenly conducted to the target device, which greatly improves the heating efficiency. Thermodynamic simulation has verified that the heating method of this structure enables the device to reach -35°C in no more than 69 seconds. Compared with the 232 seconds of the traditional device-surround heating method, it can save 163 seconds of start-up time, which fully meets the stringent requirements of the equipment for start-up time. At the same time, the heating device adopts an integrated design, which can ensure the flatness of the mounting. The installation method is simple and reliable, reducing the difficulty of equipment assembly and maintenance costs. It does not occupy too much PCB space, providing ample space for the layout of other components inside the equipment, and further optimizing the overall structural design of the equipment.

[0021] 2. This invention achieves precise and independent control of each component by setting an independent heating control mode, effectively improving the flexibility and reliability of equipment heating control. It solves the problem that traditional centralized heating modes cannot adapt to the heating needs of different components. After the equipment PCB design is completed and the positions of each heating component are confirmed, this invention arranges the heater of each component at a designated position on the structural component. The power of each heater is individually controlled via the GPIO pins of the BMC, allowing each component to obtain the appropriate heating power according to its own working requirements. This avoids insufficient heating of some components and excessive heating of others during centralized heating. In this case, this independent control mode adapts to the differentiated heating needs of different types of components inside the equipment. Each component can autonomously adjust its heating state according to its own working characteristics and environmental adaptability, ensuring that all types of components can start and work in the optimal temperature environment, effectively extending the service life of the components and reducing the probability of equipment failure due to improper heating. At the same time, the independent control mode also facilitates the troubleshooting and maintenance of the equipment in the later stage. If the heating of a certain component is abnormal, the heater and control circuit corresponding to that component can be tested separately without affecting the normal operation of other components, which greatly improves the efficiency and convenience of equipment maintenance.

[0022] 3. This invention achieves real-time and precise adjustment of heating power by setting a precise power control mode and a corresponding thermal simulation lookup table storage mechanism. This avoids overcurrent protection triggering and effectively saves equipment power consumption, improving equipment stability and energy efficiency. During the equipment design phase, this invention first uses thermodynamic simulation to accurately draw a lookup table of heating power consumption, component temperature, and operating mode based on the operating modes of components and different ambient temperatures. This lookup table is then stored in the onboard flash memory, providing accurate data support for subsequent real-time control. After the module is powered on, the onboard temperature sensor and the internal temperature sensors of the components collect ambient and chip temperatures in real time. The BMC uses the collected chip temperature information, combined with the lookup table stored in the flash memory, to precisely control the PWM output of the GPIO pins. The precise power control mode, which adjusts the output power of the heating device in real time based on the air-to-air ratio, effectively prevents the heating power from exceeding the limit. Combined with the overcurrent protection threshold of the equipment, taking a normal operating power of 400W for the module and a full power of 200W for the heating device as an example, the overcurrent protection threshold is 520W. The precise power control of this invention ensures that the heating power does not exceed the threshold and will not trigger the overcurrent protection mechanism, thus avoiding equipment startup interruption or abnormal operation due to overcurrent protection. At the same time, the precise control mode can dynamically adjust the heating power according to the real-time temperature, without always maintaining full power heating. Under the premise of meeting the heating requirements of the components, it minimizes the power consumption of the heating device. Combined with the independent control of each component, it further optimizes the overall power consumption distribution of the equipment, realizes energy-saving operation of the equipment, and conforms to the current development trend of low power consumption and high performance of electronic equipment. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of the present invention;

[0024] Figure 2 This is a schematic diagram of a traditional heating method.

[0025] Figure 3 This is a schematic diagram of the heating method structure of the present invention;

[0026] Figure 4 This is a circuit diagram for the independent control heating of this invention;

[0027] Figure 5 This is a PWM waveform diagram of the present invention;

[0028] Figure 6 This is a schematic diagram of the thermal simulation curve for a traditional solution;

[0029] Figure 7 This is a schematic diagram of the thermal simulation curve of the present invention;

[0030] Figure 8 This is a schematic diagram of the device structure of the present invention;

[0031] Figure 9 This is a schematic diagram of the heating unit of the present invention;

[0032] Figure 10 This is a schematic diagram of the control unit of the present invention;

[0033] Figure 11 This is a schematic diagram of the functional units of the present invention. Detailed Implementation

[0034] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0035] like Figures 1 to 11 As shown, the embodiment of the present invention provides a system including a heating unit 101, a control unit 102, and a functional unit 103;

[0036] Heating unit 101: Its core function is to heat the various onboard components in functional unit 103 to ensure that the components operate at a suitable temperature.

[0037] Control Unit 102: As the control core of the device, it mainly performs the following functions: When the device is powered on, it collects the ambient temperature of the module through a temperature sensor; it communicates with the functional unit 103 through the low-speed data interface of the Baseboard Management Controller (BMC) to obtain the operating mode and temperature information of other onboard components; it adjusts the output power of the power control component through the general-purpose input / output interface (GPIO) of the BMC, thereby adjusting the operating mode of the heating unit 101; at the same time, it collects the device operating current through a current sensor to prevent the device from triggering overcurrent protection.

[0038] Functional Unit 103: Through various onboard components, it completes the core functions of data calculation and data processing specified by the device.

[0039] The control unit 102 and the functional unit 103 may be located on the same carrier plate or on different carrier plates. This invention will be described with the example of both being located on the same carrier plate.

[0040] The heating unit 101 consists of two parts: a heater 1011 and a structural component 1012. The structure and function of each component are as follows:

[0041] Heater 1011: It generates heat by its own resistance and is installed inside the structural component 1012. The heat generated is conducted through the structural component to the target component in the functional unit that needs to be heated. The type of heater is not limited and can be a heating film, heating wire or ceramic heating rod.

[0042] Structural component 1012: Its core function is to provide a stable mounting carrier for heater 1011, while also achieving efficient heat conduction; aluminum alloy is the preferred material for structural components.

[0043] The control unit 102 consists of a BMC 1021, an onboard temperature sensor 1022, a current sensor 1023, and a power control circuit. The structure and function of each component are as follows:

[0044] BMC1021, the substrate management controller: As the control core, it is responsible for collecting temperature information from the onboard temperature sensor 1022 and the embedded temperature sensors in the components, as well as current information from the current sensor 1023, and constraining the operating status of the power control circuit in real time, thereby accurately monitoring the operation of the heating device; specific requirements and selection are as follows:

[0045] As a control chip, the BMC needs to meet the low-temperature start-up requirements (it needs to support the first-level low-temperature start-up), so it needs to be adapted to the low-temperature working environment (e.g., the low-temperature working temperature is -60℃).

[0046] Since most temperature sensors output analog signals, the BMC must be a chip with an analog-to-digital converter (AD) function, and must communicate with the functional unit 103 in real time through a low-speed interface such as a universal asynchronous receiver / transmitter (UART) or an integrated circuit bus (IIC) to obtain the operating mode and temperature information of other onboard components;

[0047] BMC's selection range includes, but is not limited to, microcontroller units (MCUs) and Zynq-7000 all-programmable SOCs (ZYNQ: Zynq-7000 All programmable SOC, a system-on-a-chip that integrates programmable logic (FPGA) and processing systems).

[0048] Onboard temperature sensor 1022: Specifically designed to acquire the overall ambient temperature of the equipment, providing an ambient temperature reference for BMC control decisions.

[0049] Current sensor 1023: collects the operating current of heating unit 101 and functional unit 103 respectively. The core purpose is to prevent the total current from exceeding the specified index when the equipment is operating at low temperature due to the simultaneous operation of the two units, thereby triggering the equipment's overcurrent protection mechanism.

[0050] The core of functional unit 103 consists of various onboard components, which complete the core functions specified by the equipment. All components in this unit are target components that need to be heated. The components used mainly include: Field Programmable Gate Array (FPGA), Central Processing Unit (CPU), Digital Signal Processor (DSP), Neural Processing Unit (NPU), and Graphics Processing Unit (GPU).

[0051] The various components in the functional unit typically have embedded temperature sensors and operating mode management modules. The junction temperature and operating mode of the components can be queried in real time through low-speed interfaces such as UART or IIC, providing data support for the control decision of the control unit 102.

[0052] This solution involves heating the top structural component of the component, and then conducting the heat to the target component through the structural component.

[0053] This solution addresses the heating modes as follows: 1) Independent control: After the equipment PCB design is completed (i.e., the position of each component that needs to be heated in the equipment is confirmed), the heater of each component is placed in the corresponding position of the structural component, and the power of each heater is controlled by the output of the GPIO pin of the BMC, so as to realize the individual heating control of each component.

[0054] 2) Precise control: During the equipment design, based on the device's operating mode and ambient temperature, a lookup table of heating power consumption, component temperature, and operating mode is accurately drawn through thermodynamic simulation, and the lookup table is stored in the onboard flash.

[0055]

[0056] Table 1 Temperature and Operating Mode Lookup Table

[0057] After the module is powered on, it collects the ambient temperature and chip temperature in real time through the onboard temperature sensor and the internal temperature sensor of the components. The BMC controls the duty cycle of the PWM output of the GPIO pin according to the chip temperature information, and controls the output power of the heating device in real time.

[0058] Advantages of improved heating methods:

[0059] Save PCB space and improve PCB resource utilization;

[0060] The improved heating method proposed in this solution significantly reduces PCB space requirements compared to traditional resistance heating. Traditional heating devices rely on resistance heating as their core principle, and their heating power satisfies the formula: P (power) = I²R; where I is the current of the heating device, R is the resistance of the heating device, the heating current is constant, and the heating power is determined by the resistance value R; the resistance value R satisfies the formula: R = ρL / S, where ρ is the resistivity, L is the length of the resistor, and S is the cross-sectional area of ​​the resistor. Due to material limitations in engineering applications, ρ and S are usually constant. Therefore, the resistance length L (since the minimum spacing between resistors is constant, the resistance length L is equivalent to the heater area) determines the heating power. That is, the higher the heating requirement of the components, the larger the required heater area.

[0061] With the continuous upgrading of equipment functions and performance, the dimensions of core components such as FPGAs, NPUs, GPUs, and CPUs are constantly increasing, with some components reaching or exceeding 50mm x 50mm. When heating the area around these components, traditional heating methods require PCB space matching the component dimensions. This equipment has dimensions of 150mm x 200mm, with the GPU measuring 55mm x 55mm, the FPGA 47.5mm x 47.5mm, and the CPU 45mm x 45mm. Each component's heating device occupies PCB space according to its own dimensions. Calculations show that this can save 73cm² of heating device space, accounting for 24.3% of the usable equipment area, effectively reducing PCB resource waste and alleviating the PCB space shortage problem in multi-component heating scenarios.

[0062] It has high heating efficiency and good heating uniformity. Traditional heating methods rely on the copper plating inside the PCB to conduct heat when heating the area around the components. However, the heat conduction efficiency of the PCB substrate is low. Even with a large copper plating design, the heating device that is far away from the components still has very limited heating capacity for the components, especially the central area of ​​the components, and is prone to localized insufficient heating.

[0063] The heating is conducted through structural components, which are made of aluminum alloy. Aluminum alloy has excellent thermal conductivity, and heat can be quickly and evenly transferred to the entire component through the structural components. This not only improves the overall heating efficiency, but also ensures that the components are heated evenly in all areas, avoiding excessive local temperature differences that may affect the performance of the components.

[0064] The heating time is short, meeting the requirements for rapid equipment startup. The equipment needs to operate in a low-temperature environment. When the difference between the operating temperature of the components and the ambient temperature is large, traditional heating methods have obvious limitations: if the heating power is reduced, the heating time will increase significantly, and the heating power and heat dissipation power may even reach thermal equilibrium, making it impossible to heat the components to the operating temperature; if the heating power is increased, the PCB board may crack due to heat, damaging the integrity of the PCB structure and affecting the electrical performance of the PCB.

[0065] By employing structural component conduction heating, this method can be adapted to high-power heating modes, achieving rapid and uniform heating of target components and effectively shortening equipment startup time. To verify the effect, a thermal simulation test was conducted: the ambient temperature was set to 58℃, the target operating temperature of the module to 35℃, the heating power to 70W, and the heating area dimensions to 55mm*55mm. The heating time of the two heating methods was compared. The simulation results show that the structural component heating method of this solution can heat up to 35℃ in no more than 69s, while the traditional component-surround heating method requires 232s to heat up to the same temperature. This solution can save 163s of startup time, fully meeting the requirements for rapid startup of equipment in low-temperature environments.

[0066] Easy to install and highly reliable fit; traditional heating devices are designed based on the principle of heat conduction, which requires the heating device to be tightly fitted to the PCB surface. When there are multiple components that need to be heated, multiple heating devices need to be installed accordingly, making it difficult to ensure that all heating devices are flat and fitted to the PCB, resulting in poor fit reliability.

[0067] The heating device adopts an integrated design and relies on structural components to achieve conductive heating, which can ensure the flatness of the heating device and the target contact surface. The installation and operation are simple and convenient, while improving the reliability of the contact and reducing the installation and subsequent maintenance costs.

[0068] Advantages of improved power control methods:

[0069] Avoid the risk of overcurrent protection triggering and ensure stable equipment operation;

[0070] The equipment has a preset overcurrent protection threshold of 30%. Taking the typical operating conditions of the module as an example: the normal operating power of the module is 400W (of which the GPU operates at 200W, the FPGA operates at 70W, the CPU operates at 120W, and the BMC operates at 10W), and the full power of the heating device is 200W (of which the GPU heating power is 80W, the FPGA heating power is 60W, and the CPU heating power is 65W). After calculation, the overcurrent protection threshold of the equipment is 520W.

[0071] In traditional power control, if the FPGA enters low-power mode (low-power mode power is calculated as 10W), the total power of the device will exceed 540W, exceeding the overcurrent protection threshold, triggering the overcurrent protection mechanism, causing the device to shut down, and affecting normal operation.

[0072] The dynamic power regulation method using BMC collaborative control effectively avoids the risk of overcurrent protection triggering. The specific control logic is as follows: After the module is powered on, the BMC collects the ambient temperature through the onboard temperature sensor. When the ambient temperature is 58℃, the BMC controls the PWM duty cycle to 100% through GPIO, and the heating device starts heating at full power of 200W. At this time, the core functional components of the module are not working, and the total power consumption of the device is only 210W, which is far below the overcurrent protection threshold. As heating continues, the module temperature gradually rises. When the module temperature is higher than 35℃, the BMC dynamically adjusts the working power of the heating device to 30% (i.e., 60W), and then enables the core functions of the GPU, FPGA, CPU, etc. When the components are powered on, the total power of the device is 460W, and overcurrent protection is not triggered. During device operation, the BMC collects the internal temperature and operating mode of each component in real time through the BIT interface. If a component enters a low-power mode, the power of the heating device corresponding to that component is adjusted synchronously (the maximum power of the heating device corresponding to the FPGA is reduced to 30W, and the total power of the component operation plus the heating power is 40W). At this time, the total power of the device can be reduced to 370W. In addition, the BMC collects the total current of the device in real time through the current sensor. If the total current approaches or exceeds the preset threshold, the power of the heating device will be adjusted immediately. This multi-dimensional approach ensures that the total power of the device does not trigger overcurrent protection, ensuring stable and continuous operation of the device.

[0073] This solution reduces device power consumption and improves energy efficiency. Through dynamic power adjustment, it can effectively save device power consumption. Taking the FPGA in low-power mode at low temperature as an example: at this time, the core functional components operate at 340W, and the power of the corresponding heating device for the FPGA is adjusted to 30W, resulting in a total device power consumption of only 370W. Under traditional power control and heating methods, the total device power consumption is as high as 540W. This solution can save 170W of power consumption compared to traditional solutions. The energy-saving effect is particularly significant in scenarios where the device operates for a long time. At the same time, it can reduce device heat generation and extend the service life of components.

[0074] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A dynamic adjustment and protection system for low-temperature heating power of high-power equipment, characterized in that: The system includes a heating unit (101), a control unit (102), and a functional unit (103). The control unit (102) has a built-in BMC (1021), an onboard temperature sensor (1022), and a current sensor (1023). The heating unit (101) is used to heat the onboard components of the functional unit (103). The control unit (102) collects the ambient temperature through the onboard temperature sensor (1022) and obtains the working mode and component temperature information of the functional unit (103) in real time through the low-speed data interface of the BMC (1021). Based on the ambient temperature, working mode, and component temperature information, the control unit adjusts the output power of the power control component through the GPIO interface, thereby adjusting the working state of the heating unit (101). At the same time, the current sensor (1023) collects the total operating current of the device in real time to realize current monitoring. The heating unit (101) conducts heat to the target heating element through structural components; the control unit (102) has a lookup table of heating power consumption, element temperature and working mode obtained based on thermodynamic simulation, and dynamically adjusts the heating power of the heating unit (101) by adjusting the PWM duty cycle to avoid the device triggering overcurrent protection.

2. The high-power equipment low-temperature heating power dynamic adjustment and protection system according to claim 1, characterized in that: The heating unit (101) includes a heater (1011) and a structural component (1012); the structural component (1012) is made of aluminum alloy, and the heater (1011) is selected from heating film, heating wire or ceramic heating rod; the heater (1011) is embedded in the structural component (1012) and heat conduction is achieved through the structural component (1012).

3. The high-power equipment low-temperature heating power dynamic adjustment and protection system according to claim 1, characterized in that: The BMC (1021) of the control unit (102) meets the low temperature operation requirement of -60℃ and is a chip with AD conversion function; the BMC (1021) establishes a real-time communication connection with the functional unit (103) through UART or IIC low-speed data interface.

4. The high-power equipment low-temperature heating power dynamic adjustment and protection system according to claim 1, characterized in that: The working mode lookup table is stored in the onboard flash of the device. The lookup table contains a one-to-one correspondence between ambient temperature, functional unit working mode and PWM duty cycle. The BMC (1021) of the control unit (102) queries the working mode lookup table based on the collected ambient temperature and functional unit (103) working mode information to determine the corresponding PWM duty cycle.

5. A dynamic adjustment and protection system for low-temperature heating power of high-power equipment according to claim 1, characterized in that: The key parameters in the working mode lookup table correspond as follows: When the ambient temperature is -58℃, the device cannot start normally, and the PWM duty cycle of the heating unit (101) is set to 100%; when the ambient temperature is -35℃, the functional unit (103) is in normal working mode 3, and the PWM duty cycle of the heating unit (101) is set to 30%; when the ambient temperature is -30℃, the functional unit (103) is in normal working mode 3, and the PWM duty cycle of the heating unit (101) is set to 0%.

6. The high-power equipment low-temperature heating power dynamic adjustment and protection system according to claim 1, characterized in that: For each component that needs to be heated in the functional unit (103), the heating unit (101) is configured with a separate heater (1011); the BMC (1021) independently controls the output power of each heater (1011) through different GPIO pins.

7. The high-power equipment low-temperature heating power dynamic adjustment and protection system according to claim 1, characterized in that: The overcurrent protection current threshold of the device is a preset value, and 30% of it is the overcurrent warning threshold. The current sensor (1023) collects the working current of the heating unit (101) and the functional unit (103) respectively. When the total current of the two exceeds the overcurrent warning threshold, the BMC (1021) immediately reduces the output power of the heating unit (101).

8. A dynamic adjustment and protection system for low-temperature heating power of high-power equipment according to claim 1, characterized in that: When the initial ambient temperature is -58℃, the heating power of the heating unit (101) is 70W, and the outer dimensions of the heater (1011) are 55mm×55mm, the target component temperature can be raised to -35℃ through conduction heating via the structural component (1012), and the heating process takes no more than 69s.

9. A dynamic adjustment and protection system for low-temperature heating power of high-power equipment according to claim 1, characterized in that: The BMC (1021) is selected as an MCU chip or a ZYNQ chip; the functional unit (103) includes at least one of the following components: FPGA, CPU, DSP, NPU, GPU, and each component has an embedded temperature sensor and working mode management module.

10. A dynamic adjustment and protection system for low-temperature heating power of high-power equipment according to claim 1, characterized in that: The equipment has external dimensions of 150mm × 200mm.

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