Display panel, method of manufacturing same, and electronic device

Abstract

The invention provides a display panel, a method of manufacturing the same, and an electronic device. The display panel may include a first sub-pixel, a second sub-pixel, and a third sub-pixel emitting light of different colors, where the first sub-pixel and the third sub-pixel are arranged in a first direction in a plan view, and the first sub-pixel and the second sub-pixel are arranged in a second direction perpendicular to the first direction in the plan view, and a separation distance between the first sub-pixel and the third sub-pixel is different from a separation distance between the first sub-pixel and the second sub-pixel in a plan view.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2024-0165509, filed on November 19, 2024, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] One or more embodiments relate to a display panel, a method of manufacturing the display panel, and an electronic device including the display panel. Background Technology

[0004] Electronic devices have become widely used recently. They are used in various ways, including as mobile and stationary devices. To support various functions, electronic devices include display panels that can provide users with visual information such as images.

[0005] A display panel is a device configured to visually display data and is formed by depositing various layers such as organic layers and metal layers. Deposited materials can be deposited to form multiple layers of the display panel. For example, deposited materials from a deposition source can be sprayed and deposited onto a substrate using a mask assembly. Summary of the Invention

[0006] One or more embodiments include a display panel having reduced spot defects caused by brightness differences, a method of manufacturing the display panel, and an electronic device including the display panel. However, such technical objectives are merely examples, and this disclosure is not limited thereto.

[0007] Additional aspects will be set forth in part in the description which follows and will be apparent in part from the description, or may be learned by practicing the embodiments presented in this disclosure.

[0008] According to one or more embodiments, a display panel may include: a first sub-pixel, a second sub-pixel, and a third sub-pixel that emit light of different colors, wherein, in a plan view, the first sub-pixel and the third sub-pixel may be arranged in a first direction, and in a plan view, the first sub-pixel and the second sub-pixel may be arranged in a second direction perpendicular to the first direction, and in a plan view, the separation distance between the first sub-pixel and the third sub-pixel may be different from the separation distance between the first sub-pixel and the second sub-pixel.

[0009] In an embodiment, in a planar view, the separation distance between the first sub-pixel and the third sub-pixel can be smaller than the separation distance between the first sub-pixel and the second sub-pixel.

[0010] In an embodiment, in a planar view, the separation distance between the first sub-pixel and the second sub-pixel can be in the range of approximately 15.5µm to approximately 32µm.

[0011] In an embodiment, in a planar view, each of the first sub-pixel, the second sub-pixel, and the third sub-pixel may have a rectangular shape having a first side extending in a first direction and a second side extending in a second direction.

[0012] In an embodiment, the length of the first side of the first sub-pixel can be substantially equal to the length of the first side of the second sub-pixel, and the length of the second side of the first sub-pixel can be different from the length of the second side of the second sub-pixel.

[0013] In an embodiment, the length of the first side of the first sub-pixel can be greater than the length of the second side of the first sub-pixel, the length of the first side of the second sub-pixel can be greater than the length of the second side of the second sub-pixel, and the length of the first side of the third sub-pixel can be less than the length of the second side of the third sub-pixel.

[0014] In an embodiment, the third sub-pixel may correspond to the first sub-pixel and the second sub-pixel in the first direction.

[0015] In an embodiment, the area of ​​the first sub-pixel may be larger than the area of ​​the second sub-pixel, and the area of ​​the third sub-pixel may be larger than the area of ​​the first sub-pixel.

[0016] In an embodiment, each of the first sub-pixel, the second sub-pixel, and the third sub-pixel may include: a sub-pixel electrode; an emission layer disposed on the sub-pixel electrode; and a counter electrode disposed on the emission layer. Each of the first sub-pixel, the second sub-pixel, and the third sub-pixel may be defined by an opening in a dam disposed on the sub-pixel electrode. The dam may overlap with an edge portion of the sub-pixel electrode. The emission layer of the first sub-pixel may have a uniform thickness in the region where the emission layer of the first sub-pixel contacts the sub-pixel electrode of the first sub-pixel exposed by the opening in the dam.

[0017] According to one or more embodiments, a method of manufacturing a display panel may include preparing a display substrate; disposing the display substrate and a mask assembly inside a cavity, the mask assembly including a mask sheet; and spraying a deposition material onto the display substrate to form a display panel including a first sub-pixel, a second sub-pixel, and a third sub-pixel while moving a deposition source relative to the display substrate in a first direction, wherein, in a plan view, the first sub-pixel and the third sub-pixel may be arranged in the first direction, and in a plan view, the first sub-pixel and the second sub-pixel may be arranged in a second direction perpendicular to the first direction, and the separation distance between the first sub-pixel and the third sub-pixel in the plan view may be different from the separation distance between the first sub-pixel and the second sub-pixel.

[0018] In an embodiment, the deposition source may include a plurality of nozzles arranged in a second direction, and at least some of the nozzles may be tilted at a preset angle.

[0019] In an embodiment, each of the first sub-pixel, the second sub-pixel, and the third sub-pixel may include: a sub-pixel electrode; an emission layer disposed on the sub-pixel electrode; and a counter electrode disposed on the emission layer, wherein the spraying of the deposited material may include forming the emission layer of each of the first sub-pixel, the second sub-pixel, and the third sub-pixel.

[0020] In an embodiment, in a planar view, the separation distance between the first sub-pixel and the third sub-pixel can be smaller than the separation distance between the first sub-pixel and the second sub-pixel.

[0021] In an embodiment, in a planar view, the separation distance between the first sub-pixel and the second sub-pixel can be in the range of approximately 15.5µm to approximately 32µm.

[0022] In an embodiment, in a planar view, each of the first sub-pixel, the second sub-pixel, and the third sub-pixel may have a rectangular shape having a first side extending in a first direction and a second side extending in a second direction.

[0023] In an embodiment, the length of the first side of the first sub-pixel can be substantially equal to the length of the first side of the second sub-pixel, and the length of the second side of the first sub-pixel can be different from the length of the second side of the second sub-pixel.

[0024] In an embodiment, the length of the first side of the first sub-pixel can be greater than the length of the second side of the first sub-pixel, the length of the first side of the second sub-pixel can be greater than the length of the second side of the second sub-pixel, and the length of the first side of the third sub-pixel can be less than the length of the second side of the third sub-pixel.

[0025] In an embodiment, the third sub-pixel may correspond to the first sub-pixel and the second sub-pixel in the first direction.

[0026] According to one or more embodiments, the display panel can be manufactured by the same method used to manufacture a display panel.

[0027] According to one or more embodiments, an electronic device may include: a display panel manufactured by a method for manufacturing a display panel; and a lower cover that can form the appearance of the electronic device and may include an opening that exposes a portion of the display panel. Attached Figure Description

[0028] The above and other aspects, features, and advantages of certain embodiments of this disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0029] Figure 1 This is a schematic cross-sectional view of an apparatus for manufacturing a display panel according to an embodiment;

[0030] Figure 2 This is a schematic perspective view of a mask assembly according to an embodiment;

[0031] Figure 3A This is a schematic plan view of the mask sheet according to an embodiment;

[0032] Figure 3B It is according to the embodiment along Figure 3A A schematic cross-sectional view of the mask sheet taken from line III-III';

[0033] Figure 4A This is a schematic cross-sectional view of an apparatus for manufacturing a display panel according to an embodiment;

[0034] Figure 4B According to the embodiments Figure 4A Enlarged schematic cross-sectional view of region IV;

[0035] Figure 5 This is a schematic perspective view of the deposition source according to an embodiment;

[0036] Figure 6A It is according to the embodiment along Figure 5 A schematic cross-sectional view of the sedimentary source taken by line I-I';

[0037] Figure 6B It is according to the embodiment along Figure 5 A schematic cross-sectional view of the sedimentary source taken from line II-II';

[0038] Figure 7 It is a schematic perspective view of an electronic device including a display panel manufactured using an apparatus for manufacturing a display panel according to an embodiment;

[0039] Figure 8 yes Figure 7 A schematic exploded perspective view of an electronic device;

[0040] Figure 9 yes Figure 7 A schematic block diagram of an electronic device;

[0041] Figure 10 This is a schematic perspective view of the display panel according to an embodiment;

[0042] Figure 11This is a schematic cross-sectional view of a portion of the display area of ​​a display panel according to an embodiment;

[0043] Figure 12 This is a schematic plan view of the sub-pixel arrangement of a display panel according to an embodiment;

[0044] Figure 13 This is a schematic diagram illustrating the arrangement of sub-pixels of a display panel according to an embodiment;

[0045] Figure 14 This is a schematic diagram illustrating the arrangement of subpixels in a display panel according to a comparative example; and

[0046] Figure 15 It is according to the embodiment along Figure 13 A schematic cross-sectional view of the display panel taken by line VI-VI'. Detailed Implementation

[0047] In the following description, numerous specific details are set forth for illustrative purposes in order to provide a thorough understanding of various embodiments or implementations of this disclosure. As used herein, “embodiment” and “implementation” are interchangeable terms used as non-limiting examples of the devices or methods disclosed herein. However, it will be apparent, however, that various embodiments may be practiced without these specific details or using one or more equivalent arrangements. These various embodiments are not necessarily exclusive, nor are they intended to limit this disclosure. For example, a particular shape, configuration, and characteristic of an embodiment may be used or implemented in another embodiment.

[0048] Unless otherwise stated, the illustrated embodiments should be understood as providing features of this disclosure. Therefore, unless otherwise stated, features, components, modules, layers, films, panels, areas and / or aspects of various embodiments (hereinafter individually or collectively referred to as “elements”) may be combined, separated, interchanged and / or rearranged in other ways without departing from this disclosure.

[0049] The use of crosshairs and / or shading in accompanying drawings is typically provided to clarify boundaries between adjacent elements. Therefore, unless otherwise stated, the presence or absence of crosshairs or shading does not convey or indicate any preference or requirement for a particular material, material properties, size, scale, commonality between illustrated elements, or / or any other characteristic, attribute, property, etc. Furthermore, in the drawings, the dimensions and relative dimensions of elements may be exaggerated for clarity and / or descriptive purposes. A particular process sequence may be performed differently than the described sequence when embodiments can be implemented differently. For example, two consecutively described processes may be performed substantially simultaneously or in the reverse order of their description. Additionally, the same reference numerals and / or reference characters denote the same elements.

[0050] When a component or layer is referred to as being "on," "connected to," or "coupled to" another component or layer, it can be directly on, directly connected to, or directly coupled to the other component or layer, or an intermediary component or layer may be present. However, when a component or layer is referred to as being "directly on," "directly connected to," or "directly coupled to" another component or layer, an intermediary component or layer is not present. Therefore, the term "connection" can refer to a physical, electrical, and / or fluid connection with or without an intermediary component. Furthermore, the X-axis, Y-axis, and Z-axis are not limited to the three axes of a Cartesian coordinate system such as the x-axis, y-axis, and z-axis, and can be interpreted in a broader sense. For example, the X-axis, Y-axis, and Z-axis can be perpendicular to each other, or they can be different directions that are not perpendicular to each other.

[0051] For the purposes of this disclosure, "at least one of A and B" can be interpreted as only A, only B, or any combination of A and B. Furthermore, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0052] Although the terms “first,” “second,” etc., may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, without departing from the teachings of this disclosure, the first element discussed below may be referred to as the second element.

[0053] Spatial relative terms such as “below,” “under,” “below,” “lower part,” “above,” “upper part,” “above,” “higher,” and “side” (e.g., as in “sidewall”) may be used herein for descriptive purposes and thus to describe the relationship of one element to another(s) as illustrated in the accompanying drawings. In addition to the orientations depicted in the drawings, spatial relative terms are intended to cover different orientations of the device in use, operation, and / or manufacture. For example, if the device in the drawings is flipped, an element described as “below” or “under” other elements or features will subsequently be oriented “above” other elements or features. Thus, the term “below” can encompass both above and below orientations. Furthermore, the device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and therefore, the spatial relative descriptive terms used herein should be interpreted accordingly.

[0054] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, unless the context clearly indicates otherwise, the singular forms “a” and “the / said” are intended to also include the plural forms. Furthermore, when used in this specification, the terms “comprising,” “including,” and / or variations thereof specify the presence of stated features, integrals, steps, operations, elements, components, and / or groups thereof, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. It should also be noted that, as used herein, the terms “substantially,” “about,” and other similar terms are used as approximate terms rather than as terms of degree, and therefore, to explain the inherent biases in measured values, calculated values, and / or provided values ​​that will be recognized by one of ordinary skill in the art.

[0055] Various embodiments are described herein with reference to schematic cross-sectional and / or exploded views that are schematic illustrations of embodiments and / or intermediate structures. Therefore, variations in the shape of the illustrations are contemplated as a result of, for example, manufacturing techniques and / or tolerances. Thus, the embodiments disclosed herein are not necessarily to be interpreted as limited to a specific illustrated shape of the area, but are to include deviations in shape caused, for example, by manufacturing processes. In this way, the areas illustrated in the figures may be schematic in nature, and the shapes of these areas may not reflect the actual shapes of the areas of the device, and are therefore not necessarily intended to be limiting.

[0056] In accordance with the conventions of the art, some embodiments are described and illustrated in the accompanying drawings according to functional blocks, portions, and / or modules. Those skilled in the art will understand that these blocks, portions, and / or modules are physically implemented by electronic (or optical) circuits, such as logic circuits, discrete components, microprocessors, hardwired circuits, memory elements, and wiring connections, which can be formed using semiconductor-based manufacturing techniques or other manufacturing techniques. Where blocks, portions, and / or modules are implemented by microprocessors or other similar hardware, they can be programmed and controlled using software (e.g., microcode) to perform the various functions discussed herein, and may optionally be driven by firmware and / or software. It is also contemplated that each block, portion, and / or module may be implemented by dedicated hardware, or may be implemented as a combination of dedicated hardware for performing some functions and processors (e.g., one or more programmed microprocessors and associated circuitry) for performing other functions. Furthermore, without departing from the scope of this disclosure, each block, portion, and / or module of some embodiments may be physically separated into two or more interactive and discrete blocks, portions, and / or modules. Furthermore, without departing from the scope of this disclosure, blocks, parts and / or modules of some embodiments may be physically combined into more complex blocks, parts and / or modules.

[0057] Unless otherwise defined or implied herein, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will be further understood that terms such as those defined in common dictionaries shall be interpreted as having a meaning consistent with their meaning in the relevant field and in the context of this disclosure, and shall not be interpreted in an ideal or overly formal sense unless clearly defined herein.

[0058] Figure 1 This is a schematic cross-sectional view of an apparatus 2 for manufacturing a display panel according to an embodiment.

[0059] refer to Figure 1 The apparatus 2 for manufacturing a display panel according to the embodiment can be used to manufacture the display panel 1 described below (see Figure 10 ).

[0060] The apparatus 2 for manufacturing a display panel may include a chamber 10, a first support 20, a second support 30, a mask assembly 40, a deposition source 50, a magnetic portion 60, a visual portion 70, and a pressure regulator 80.

[0061] A space can be formed inside the chamber 10. The display substrate DS and the mask assembly 40 can be inserted into this space. A portion of the chamber 10 may include an opening. A gate valve 11 can be installed in the opening of the chamber 10. The opening of the chamber 10 can be opened or closed according to the operation of the gate valve 11.

[0062] The display substrate DS may include materials deposited on substrate 100 during the manufacturing of the display panel (see [reference]). Figure 11 The display substrate DS may include at least one of an organic layer, an inorganic layer, and a metal layer on which any one of the organic layer, inorganic layer, and metal layer has not yet been deposited (see substrate 100). Figure 11 ).

[0063] The first support member 20 can be configured to support the display substrate DS. The first support member 20 can be in the form of a plate fixed inside the cavity 10. In an embodiment, the first support member 20 can be in the form of a shuttle, on which the display substrate DS rests and which is linearly movable within the cavity 10. In an embodiment, the first support member 20 can include an electrostatic chuck or an adhesive chuck disposed in the cavity 10 to be fixed or movable within the cavity 10.

[0064] The second support member 30 can be configured to support the mask assembly 40. The second support member 30 can be disposed inside the chamber 10. The second support member 30 can fine-tune the position of the mask assembly 40. The second support member 30 may separately include a driver or alignment part for moving the mask assembly 40 in different directions.

[0065] In one embodiment, the second support 30 may be in the form of a shuttle. The mask assembly 40 may rest on the second support 30. The second support 30 may be configured to transport the mask assembly 40. As an example, the second support 30 may be moved to the outside of the chamber 10, and after the mask assembly 40 is rested on the second support 30, the second support 30 may enter the chamber 10 from the outside of the chamber 10.

[0066] The first support member 20 and the second support member 30 may be integral with each other. The first support member 20 and the second support member 30 may include a movable shuttle. The first support member 20 and the second support member 30 may include a structure configured to fix the mask assembly 40 to the display substrate DS when the display substrate DS is placed on the mask assembly 40, and may be configured to simultaneously linearly move the display substrate DS and the mask assembly 40.

[0067] In the following description, for ease of description, the form in which the first support member 20 and the second support member 30 are formed to be distinct from each other and disposed in different positions, and the form in which the first support member 20 and the second support member 30 are disposed inside the chamber 10 are described.

[0068] The mask assembly 40 can be disposed inside the cavity 10 to face the display substrate DS. The deposition material M can pass through the mask assembly 40 and can be deposited on the display substrate DS.

[0069] The deposition source 50 can be positioned facing the mask assembly 40 and configured to supply deposition material M such that the deposition material M passes through the deposition area of ​​the mask assembly 40 and is deposited on the display substrate DS. The deposition source 50 can evaporate or sublimate the deposition material M by applying heat to it. The deposition source 50 can be positioned fixed inside the chamber 10, or it can be positioned inside the chamber 10 to be linearly movable in one direction (e.g., a single direction).

[0070] A magnetic portion 60 may be disposed within the cavity 10, facing the display substrate DS and / or the mask assembly 40. The magnetic portion 60 can apply magnetic force to the mask assembly 40 to press the mask assembly 40 against the display substrate DS. Specifically, the magnetic portion 60 not only prevents the mask sheet 42 from sagging but also allows the mask sheet 42 to be adjacent to the display substrate DS. The magnetic portion 60 can maintain a consistent spacing between the mask sheet 42 and the display substrate DS.

[0071] A vision section 70 may be disposed within the cavity 10 and may capture the positions of the display substrate DS and the mask assembly 40. The vision section 70 may include a camera for capturing the display substrate DS and the mask assembly 40. The positions of the display substrate DS and the mask assembly 40 may be determined, and the deformation of the mask assembly 40 may be determined based on the image captured by the vision section 70. A first support member 20 may be configured to fine-tune the position of the display substrate DS, or a second support member 30 may be configured to fine-tune the position of the mask assembly 40 based on the captured image.

[0072] Pressure regulator 80 can be connected to chamber 10 and can regulate the internal pressure of chamber 10. As an example, pressure regulator 80 can be configured to regulate the internal pressure of chamber 10 to be equal to (or substantially equal to) atmospheric pressure or approximately equal to atmospheric pressure. Pressure regulator 80 can also be configured to regulate the internal pressure of chamber 10 to be equal to or approximately equal to a vacuum state.

[0073] The pressure regulator 80 may include a connecting pipe 81 and a pump 82, with the connecting pipe 81 connected to the chamber 10 and the pump 82 mounted to the connecting pipe 81. Depending on the operation of the pump 82, external air may be introduced through the connecting pipe 81, or gas inside the chamber 10 may be guided to the outside through the connecting pipe 81.

[0074] A method for manufacturing a display panel is described using an apparatus 2 for manufacturing a display panel. First, a display substrate DS can be prepared.

[0075] The pressure regulator 80 can maintain the interior of chamber 10 at or similar atmospheric pressure. The gate valve 11 can be operated to open the opening portion of chamber 10.

[0076] Then, the display substrate DS can be loaded into the interior of the cavity 10 from the outside. Various methods can be used to load the display substrate DS into the cavity 10. As an example, the display substrate DS can be loaded from the outside of the cavity 10 into the interior of the cavity 10 using a robotic arm or the like positioned outside the cavity 10. In an embodiment, when the first support member 20 is formed in the form of a shuttle, the first support member 20 can be transported from the inside of the cavity 10 to the outside of the cavity 10. Then, the display substrate DS can be placed on the first support member 20 using a separate robotic arm or the like positioned outside the cavity 10, and the first support member 20 can be loaded into the interior of the cavity 10 from the outside of the cavity 10.

[0077] As described above, the mask assembly 40 can be disposed inside the cavity 10. In an embodiment, the mask assembly 40 can be loaded into the cavity 10 from the outside of the cavity 10 in the same or similar manner as the display substrate DS.

[0078] With the display substrate DS loaded into the cavity 10, the display substrate DS can rest on the first support 20. The visual portion 70 can be configured to capture the positions of the display substrate DS and the mask assembly 40. The positions of the display substrate DS and the mask assembly 40 can be determined based on the image captured by the visual portion 70. The apparatus 2 for manufacturing the display panel may include a separate controller (not shown) for determining the positions of the display substrate DS and the mask assembly 40.

[0079] Once the positions of the display substrate DS and the mask assembly 40 are determined, the second support 30 can fine-tune the position of the mask assembly 40.

[0080] Then, the deposition source 50 operates to supply deposition material M toward the mask assembly 40, and the deposition material M passing through the opening of the mask sheet 42 can be deposited on the display substrate DS. The deposition source 50 can move parallel to the display substrate DS and the mask assembly 40, or the display substrate DS and the mask assembly 40 can move parallel to the deposition source 50. For example, the deposition source 50 can move relative to the display substrate DS and the mask assembly 40. The pump 82 can maintain the pressure of the chamber 10 at a state equal to or similar to a vacuum by drawing in gas from inside the chamber 10 and expelling the gas to the outside.

[0081] The deposition material M supplied from the deposition source 50 can pass through the mask assembly 40 and can be deposited on the display substrate DS, thus forming at least one of a plurality of layers, such as organic layers, inorganic layers and metal layers, stacked on top of each other and stacked on the display panel described below.

[0082] Figure 2 This is a schematic perspective view of the mask assembly 40 according to an embodiment.

[0083] refer to Figure 2 The mask assembly 40 may include a mask frame 41, a mask sheet 42, and a support frame 43.

[0084] The mask frame 41 may be formed by multiple frames connected to each other, and may include openings. The mask frame 41 may include openings (e.g., a single opening), or may include multiple openings that are distinct from each other. The mask frame 41 may include a grid shape such as a window frame. In the following description, for ease of description, the case where the mask frame 41 includes an opening (e.g., a single opening) at its center is described.

[0085] In this embodiment, the mask frame 41 may be a quadrilateral frame. However, the shape of the mask frame 41 is not limited to this and may have various polygonal shapes.

[0086] Mask sheet 42 can be tensioned and mounted to mask frame 41. Mask sheet 42 may include openings through which deposited material passes. Mask sheet 42 (e.g., a single mask sheet) 42 may be provided, or multiple mask sheets 42 may be provided. When mask sheet 42 (e.g., a single mask sheet) 42 is provided, the mask sheet 42 may be disposed on mask frame 41 to cover the openings of mask frame 41. In embodiments where multiple mask sheets 42 are provided, the mask sheets 42 may be arranged adjacent to each other along an edge (e.g., a single edge) of mask frame 41 and may cover the openings of mask frame 41.

[0087] When multiple mask pieces 42 are provided, the mask pieces 42 can be arranged parallel to each other on the mask frame 41. As an example, each of the mask pieces 42 can have a shape that extends long in the x-direction. The mask pieces 42 can be arranged (or positioned) side by side in the y-direction intersecting the longitudinal direction. For example, the two opposite ends of the mask pieces 42 can be fixed to the mask frame 41 by welding.

[0088] The support frame 43 can be disposed on the opening of the mask frame 41 to shield the space between adjacent mask pieces 42, or it can extend in a second direction (e.g., the y-direction) intersecting the longitudinal direction (e.g., the x-direction) of the mask piece 42. Recesses can be provided in the mask frame 41 to accommodate the two opposite ends of the support frame 43. However, this is merely an example, and separate recesses may not be provided in the mask frame 41, and the support frame 43 may be disposed on the mask frame 41. The support frame 43 can support the mask piece 42 in the opening of the mask frame 41 to prevent the mask piece 42 from sagging.

[0089] Figure 3A This is a schematic plan view of the mask sheet 42 according to an embodiment. Figure 3B It is according to the embodiment along Figure 3A A schematic cross-sectional view of the mask 42 taken by line III-III' is shown, and the corresponding portions of the mask 42 and the display substrate DS are also shown.

[0090] refer to Figure 3A and Figure 3B The mask sheet 42 may include a main body portion 421 and an opening 422.

[0091] The main body portion 421 can form the appearance of the mask sheet 42. The main body portion 421 can be formed into the shape of a thin plate. As an example, such as Figure 3A As shown, the main body 421 can have a rectangular shape. However, Figure 3A The shape of the main body 421 shown is merely an example, and the shape of the main body 421 can be modified in various ways depending on its purpose and use.

[0092] An opening 422 may be provided in the body portion 421 to transfer deposited material. The opening 422 may be formed to extend through the body portion 421 in the thickness direction (e.g., the -z direction) from a surface of the body portion 421 (e.g., a single surface facing the +z direction). At least one opening 422 may be provided. The planar shape of at least one of the openings 422 may be quadrilateral. As an example, the planar shape of each of the openings 422 may be quadrilateral. Because the planar shape of the opening 422 is quadrilateral, the area on the display substrate DS in which the deposited material is deposited may be quadrilateral. However, this disclosure is not limited to this. In embodiments, the planar shape of the opening 422 may be circular, elliptical, or polygonal, such as a pentagon.

[0093] In a cross-section parallel to the thickness direction (e.g., the z-direction) of the mask 42, the inner surface 422A of the opening 422 may include a sloped surface. As an example, the sloped surface (e.g., a single sloped surface) included in the inner surface 422A of the opening 422 may be sloped to face the deposition source 50. Figure 3A In the plan view shown, when the planar shape of opening 422 is quadrilateral, the planar shape of the inclined surface can also be quadrilateral.

[0094] The cross-sectional shape of the opening 422 can vary depending on the method used to form it. As an example, the opening 422 can be formed by an etching solution or a laser beam, etc. In an embodiment, such as... Figure 3B As shown, when the opening 422 is formed by an etching solution, the inner surface 422A of the opening 422 may include a curved surface. However, Figure 3B The shape of the opening 422 shown is merely an example, and the cross-sectional shape of the opening 422 is not necessarily limited to this. In the following text, based on the opening 422 having… Figure 3B The assumptions of the cross-sectional structure are described.

[0095] refer to Figure 3B The inner surface 422A of the opening 422 may include an inclined portion facing the display substrate DS and a portion facing the deposition source 50 (see [reference]). Figure 1 The inclined portion of the main body 421. As an example, the inclined portion facing the deposition source 50 may include a curved surface. The portion where two inclined portions intersect each other may correspond to the protrusion TP. Here, the protrusion TP of the main body 421 may be a portion that protrudes in the direction facing the center of the opening 422. The planar shape of the protrusion TP may be the same as the planar shape of the opening 422.

[0096] As described above, the deposition material ejected from the deposition source 50 and passing through the opening 422 of the mask 42 can be deposited on the display substrate DS. The deposition material ejected from the deposition source 50 can be incident on the display substrate DS at a preset incident angle.

[0097] The area of ​​the display substrate DS corresponding to the opening 422 may be an area requiring deposition, and the area of ​​the display substrate DS corresponding to the body portion 421 may be an area where deposition is not required. Areas where the deposition material cannot be rapidly reached due to being covered (or overlapping) by the body portion 421 may be formed in the area corresponding to the opening 422. For example, during the process of supplying deposition material from the deposition source 50 to the display substrate DS, areas may be formed where the deposition material cannot pass through the opening 422 due to the body portion 421 (e.g., the protrusion TP of the body portion 421). Areas where the deposition material can additionally reach due to the inclined portion of the inner surface 422A of the opening 422 (e.g., the inclined portion facing the display substrate DS) may be formed in the area of ​​the mask 42 corresponding to the body portion 421.

[0098] refer to Figure 3B The first region A1 can be a region where the deposited material is deposited to its normal thickness, and the second region A2 and the third region A3 can be regions where the deposited material is not deposited to its normal thickness (hereinafter referred to as "shaded regions"). Here, the shaded regions can include outer shaded regions and inner shaded regions. The outer shaded region represents a region where the deposited material is deposited in a region where deposition is not required, and the inner shaded region represents a region where only a portion of the deposited material is deposited in a region where deposition is required. The second region A2 can be an inner shaded region, and the third region A3 can be an outer shaded region.

[0099] The areas of the second region A2 and the third region A3 can be varied by the cross-sectional shape of the mask 42 (e.g., the shape of the protrusion TP of the main body portion 421 and / or the shape of the inner surface 422A of the opening 422). The areas of the second region A2 and the third region A3 can be varied not only by the cross-sectional shape of the mask 42, but also by the separation distance t1 between the mask 42 and the display substrate DS and / or the minimum incident angle α of the deposited material incident on the display substrate DS. As an example, as the separation distance t1 between the mask 42 and the display substrate DS increases, the areas of the second region A2 and the third region A3 can increase. As the minimum incident angle α of the deposited material incident on the display substrate DS increases, the areas of the second region A2 and the third region A3 can decrease.

[0100] Figure 4A This is a schematic cross-sectional view of an apparatus for manufacturing a display panel according to an embodiment, and Figure 4B According to the embodiments Figure 4A Enlarged schematic cross-sectional view of region IV.

[0101] For ease of description, Figure 4A and Figure 4B Mask assembly 40 and magnetic portion 60 are shown, while support frame 43 is omitted. Figure 4A and Figure 4B The magnetic force acting on the mask sheet 42 is shown.

[0102] The magnetic portion 60 can be configured to face the display substrate DS. As an example, the magnetic portion 60 can be configured to face the surface of the display substrate DS (e.g., a single surface facing the +z direction).

[0103] The display substrate DS can be located between the magnetic portion 60 and the mask assembly 40. The mask sheet 42 of the mask assembly 40 can be disposed on the mask frame 41. The mask sheet 42 can be configured to face the other surface of the display substrate DS (e.g., the surface facing the -z direction). The display substrate DS can be disposed adjacent to the mask sheet 42. The magnetic portion 60 can apply a magnetic force, causing the mask sheet 42 to contact the display substrate DS or be positioned close to the display substrate DS.

[0104] The magnetic component 60 may include a magnet 61 and a support plate 62. Multiple magnets 61 may be provided. As an example, although... Figure 4A As shown, nine magnets 61 can be provided, but the embodiment is not limited to this. The number of magnets 61 can be varied depending on the size of the display substrate DS and the corresponding mask 42.

[0105] Magnet 61 can be housed in support plate 62. For example, support plate 62 can be a plate that supports magnet 61. In an embodiment, magnet 61 supported by support plate 62 can be arranged in a plane substantially parallel to mask sheet 42. Each of magnets 61 can extend in one direction. Magnets 61 can be arranged apart from each other in a direction perpendicular to the longitudinal direction (e.g., y-direction) of magnet 61 (e.g., x-direction). The separation distance S0 between magnets 61 can be equal to each other.

[0106] The longitudinal direction of the magnet 61 may intersect the longitudinal direction of the mask 42. The direction in which the magnet 61 is arranged may intersect the direction in which the mask 42 is arranged. In an embodiment, the longitudinal direction of the magnet 61 and the arrangement direction of the mask 42 may be the same in the y-direction, and the arrangement direction of the magnet 61 and the longitudinal direction of the mask 42 may be the same in the x-direction.

[0107] In an embodiment, magnet 61 may include a magnet 61 having an N pole on the side facing mask 42 and a magnet 61 having an S pole on the side facing mask 42, and the magnets 61 with N poles and magnets 61 with S poles may be alternately arranged. The magnetic force applied to mask 42 may follow a sine curve (or cosine curve) along the longitudinal direction (e.g., the x-direction) of mask 42.

[0108] refer to Figure 4B The magnet 61 may include a first magnet 611, a second magnet 612, and a third magnet 613. The second magnet 612 may be disposed adjacent to the first magnet 611 and (e.g., in the x direction) on one side of the first magnet 611, and the third magnet 613 may be disposed adjacent to the first magnet 611 and (e.g., in the -x direction) on the opposite side away from the second magnet 612.

[0109] As described above, a magnetic force following a sine (or cosine) curve can be applied to the mask 42 in the longitudinal direction (e.g., the x-direction). Specifically, the maximum magnetic force can be applied to points on the mask 42 that correspond in the longitudinal direction to the magnets 61, such as the first point P1 below the first magnet 611, the second point P2 below the second magnet 612, and the third point P3 below the third magnet 613. The minimum magnetic force can be applied to points on the mask 42 that do not correspond in the longitudinal direction to the magnets 61, such as the midpoint MP between the first point P1 and the second point P2, and the midpoint MP between the first point P1 and the third point P3. Accordingly, the magnetic force applied in the longitudinal direction (e.g., the x-direction) of the mask 42 can represent a sine curve whose period is the separation distance S0 between the first magnet 611 and the second magnet 612 (in other words, the separation distance S0 between the first point P1 and the second point P2).

[0110] Typically, when the magnetic portion 60 is fixed in a stationary position, the adhesion between the mask 42 and the display substrate DS may be poor at the midpoint MP where the minimum magnetic force is applied. Separation between the mask 42 and the display substrate DS may occur at the midpoint MP, or the separation distance t1 may increase.

[0111] For reference Figure 3B As the separation distance t1 between the mask 42 and the display substrate DS increases, the inner shadow area (e.g., Figure 3B The second region (A2) can be enlarged. For example, compared to the first point P1 to the third point P3, the inner shadow region can be enlarged at the midpoint MP. Accordingly, the deposition material of the emitting layer, etc., may not be properly deposited at the midpoint MP. Due to this magnetic pattern, spot defects caused by periodic brightness differences may appear on the display panel.

[0112] Figure 5 This is a schematic perspective view of the deposition source 50 according to an embodiment. Figure 6A It is according to the embodiment along Figure 5 A schematic cross-sectional view of the sediment source 50 taken by line I-I', and Figure 6B It is according to the embodiment along Figure 5 A schematic cross-sectional view of sediment source 50 taken from line II-II'.

[0113] refer to Figure 5 In an embodiment, the deposition source 50 may include a housing 51, a cover portion 52, a nozzle 53, and an angle limiting plate 54.

[0114] The outer shell 51 is a rigid body with an internal space, in which deposited material can be contained. In an embodiment, the outer shell 51 may be formed in a rectangular shape, but is not limited thereto, and may be formed in various shapes such as a cylindrical shape.

[0115] The housing 51 may have an open shape in which its surface (e.g., the surface facing the +z direction) is open. The deposited material may be contained within the interior space of the housing 51. A heater may be disposed within the housing 51. The heater can evaporate or sublimate the deposited material contained within the interior space of the housing 51.

[0116] The cover portion 52 may be disposed on an open surface (e.g., a single open surface) of the housing 51. The cover portion 52 may close the housing 51 by covering the open surface (e.g., a single open surface) (or overlapping the open surface (e.g., a single open surface) of the housing 51).

[0117] A nozzle 53 may be disposed within a cover portion 52. The nozzle 53 may be connected to the cover portion 52 in various shapes. As an example, the nozzle 53 and the cover portion 52 may be integral with each other. In an embodiment, the nozzle 53 may be formed separately from and coupled to the cover portion 52. The nozzle 53 may be connected to the interior space of the housing 51 via the cover portion 52. The nozzle 53 may be disposed within an opening provided in the cover portion 52. Deposited material may be sprayed through the nozzle 53.

[0118] The nozzle 53 can be formed in various shapes. As an example, the nozzle 53 can have a cylindrical shape or a polygonal prism shape.

[0119] Nozzle 53 can be provided in multiple ways. As an example, although... Figure 5 and Figure 6A The illustration shows six nozzles 53, but the embodiment is not limited to this. The number of nozzles 53 can be varied depending on the size of the display substrate DS and the mask 42.

[0120] The nozzles 53 can be arranged side by side in a direction parallel to the edge (e.g., a single edge) of the display substrate DS. The nozzles 53 can also be arranged apart from each other at equal intervals.

[0121] The deposition source 50 can perform deposition continuously while moving relative to the display substrate DS. For example, the deposition source 50 can perform deposition in a scanning manner while moving relative to the display substrate DS in the direction of arrow A (hereinafter referred to as the "movement direction of the deposition source"). Although in Figure 5 and Figure 6B The illustration shows deposition source 50 performing deposition while moving in the x-direction relative to the display substrate DS inside the cavity; however, this disclosure is not limited to this. In an embodiment, deposition source 50 is fixed, and deposition can be performed while the display substrate DS itself moves in the x-direction.

[0122] In other words, the deposition source 50 can jet deposited material while moving relative to the display substrate DS in the x-direction. The nozzles 53 can be arranged side by side in a direction perpendicular to the moving direction A of the deposition source 50 (hereinafter referred to as the "nozzle direction of the deposition source"). The deposition source 50 with this configuration can deposit deposited material on the entire surface of the display substrate DS.

[0123] refer to Figure 5 and Figure 6A The nozzle 53 may include a first nozzle 531, a second nozzle 532, and a third nozzle 533. In an embodiment, at least some of the nozzles 53 may be tilted at a preset angle. As an example, at least some of the nozzles 53 may be tilted at a preset angle in the yz plane. As an example, the second nozzle 532 may be disposed on one side of the first nozzle 531 (e.g., in the -y direction), and the third nozzle 533 may be disposed on the other side of the first nozzle 531 (e.g., in the +y direction). The central axis AXa of the first nozzle 531 may be parallel to the z-axis in the yz plane. The second nozzle 532 and the third nozzle 533 may be tilted at a preset angle in the yz plane. For example, the central axis AXb of the second nozzle 532 and the central axis AXc of the third nozzle 533 may be tilted at a preset angle relative to the z-axis in the yz plane.

[0124] In embodiments, some of the nozzles 53 may be tilted at different angles and / or in different directions relative to others. As an example, the second nozzle 532 and the third nozzle 533 may be tilted in opposite directions. The central axis AXb of the second nozzle 532 may be tilted in the -y direction relative to the z-axis on the yz plane. The central axis AXc of the third nozzle 533 may be tilted in the +y direction relative to the z-axis. However, this disclosure is not limited thereto. In embodiments, the second nozzle 532 and the third nozzle 533 may be tilted so that they face each other.

[0125] Each of the nozzles 53 can spray deposited material toward the display substrate DS at a preset spray angle θ1. The minimum incident angle α1 of the deposited material incident on the display substrate DS can vary depending on the degree to which each of the nozzles 53 is tilted. As an example, as the degree of tilting of some of the nozzles 53 increases, the minimum incident angle α1 of the deposited material incident on the display substrate DS can decrease.

[0126] Because the deposition source 50 includes nozzles 53 and some of the nozzles 53 are tilted at a preset angle, the deposition material can be completely deposited on the display substrate DS in the nozzle direction (e.g., the y-direction) of the deposition source 50. The deposition material can be deposited on the display substrate DS with a uniform thickness in the nozzle direction (e.g., the y-direction) of the deposition source 50.

[0127] refer to Figure 5 and Figure 6B The deposition source 50 may include angle limiting plates 54. Angle limiting plates 54 may be disposed on the cover portion 52. Angle limiting plates 54 may be disposed on opposite sides of the opening where the nozzle 53 is disposed. Angle limiting plates 54 may extend parallel to the direction in which the nozzle 53 is disposed side-by-side thereon. For example, angle limiting plates 54 may extend in the nozzle direction (e.g., the y-direction) of the deposition source 50. Angle limiting plates 54 may be separated from each other in a direction perpendicular to the nozzle direction of the deposition source 50. For example, angle limiting plates 54 may be separated from each other in the movement direction (e.g., the x-direction) of the deposition source 50.

[0128] Angle limiting plate 54 can limit the spray angle of the deposited material sprayed from nozzle 53 onto display substrate DS. Unlike the nozzle direction of deposition source 50, since deposition is performed on display substrate DS while deposition source 50 moves relative to display substrate DS in the moving direction A of deposition source 50, angle limiting plate 54 can be introduced to improve the straightness of the deposited material.

[0129] The spray angle of the deposited material can vary depending on the height of the angle limiting plate 54. As the height of the angle limiting plate 54 increases, the spray angle θ2 of the deposited material can decrease. As an example, the spray angle θ2 of the nozzle 53 in the moving direction A (e.g., the x-direction) of the deposition source 50 can be smaller than the preset spray angle θ1 of the nozzle 53 in the nozzle direction (e.g., the y-direction) of the deposition source 50. Since the spray angle θ2 of the deposited material is small, the minimum incident angle α2 of the deposited material incident on the display substrate DS can be increased.

[0130] refer to Figure 5 , Figure 6A and Figure 6B The minimum incident angle α1 of the deposited material incident on the display substrate DS in the nozzle direction (e.g., y direction) of the deposition source 50 can be smaller than the minimum incident angle α2 of the deposited material incident on the display substrate DS in the moving direction A (e.g., x direction) of the deposition source 50.

[0131] As referenced above Figure 3B The inner shadow area (e.g., Figure 3B The second region A2 can vary depending on the minimum incident angle α of the deposited material incident on the display substrate DS. Because the minimum incident angle α1 of the deposited material in the nozzle direction (e.g., y direction) of the deposition source 50 is smaller than the minimum incident angle α2 of the deposited material in the moving direction A (e.g., x direction) of the deposition source 50, the inner shadow region can appear larger in the nozzle direction (e.g., y direction) of the deposition source 50 than in the moving direction A (e.g., x direction) of the deposition source 50.

[0132] The deviation of the inner shadow area between the movement direction A (e.g., x direction) of the deposition source 50 and the nozzle direction (e.g., y direction) of the deposition source 50 can be referenced by the mask plate 42. Figure 4B The midpoint MP, where the minimum magnetic force acts, appears significant.

[0133] According to this disclosure, by taking into account the deviation of the inner shadow region, the spacing between sub-pixels in the moving direction A of the deposition source 50 and the spacing between sub-pixels in the nozzle direction of the deposition source 50 can be designed to be different. Accordingly, deposition consistency in the moving direction A (e.g., x-direction) and the nozzle direction (e.g., y-direction) of the deposition source 50 can be improved. Accordingly, spot defects in the display panel due to magnetic modes can be reduced. The arrangement structure of the sub-pixels according to an embodiment is described in detail below.

[0134] Figure 7 This is a schematic perspective view of an electronic device ED according to an embodiment. Figure 8 yes Figure 7A schematic exploded perspective view of the electronic device ED, and Figure 9 yes Figure 7 A schematic block diagram of an electronic device ED.

[0135] refer to Figure 7 and Figure 8 According to embodiments, the electronic device ED can be a device for displaying moving or still images, and can be various products including televisions, laptop computers, monitors, billboards, Internet of Things (IoT) devices, and portable electronic devices including mobile phones, smartphones, tablet PCs, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigators, and ultra-mobile personal computers (UMPCs). The electronic device ED according to embodiments can include wearable devices comprising smartwatches, watch phones, glasses displays, or head-mounted displays (HMDs). In embodiments, the electronic device ED can be a vehicle's dashboard, a vehicle's central dashboard or a central information display (CID) mounted on the dashboard, a vehicle's interior rearview mirror display replacing side mirrors, and a display arranged on the back of the front seats as entertainment for the rear seats of the vehicle.

[0136] For ease of description, Figure 7 and Figure 8 The electronic device ED shown according to an embodiment is a smartphone. The electronic device ED may include a cover window CW, a display panel 1, a data driver 120, a display circuit board 130, a component 400, a bracket 600, a main circuit board 500, a battery 800, and / or a bottom cover 900.

[0137] In a plan view, the electronic device ED can appear as having an approximately rectangular shape. For example, as... Figure 7 As shown, the electronic device ED can appear to have an approximately rectangular shape, having a shorter side in the u direction and a longer side in the v direction on the uv plane. The edge where the shorter side in the u direction intersects the longer side in the v direction can form a right angle, or it can have a circular shape with a predetermined curvature. In the planar view, the electronic device ED can have a polygonal shape instead of a rectangular shape, and can also have an elliptical or irregular shape.

[0138] A cover window CW can be positioned on the display panel 1 (in the w direction) to cover the upper surface of the display panel 1. The cover window CW can be configured to protect the upper surface of the display panel 1.

[0139] The cover window CW may include a transmissive cover portion DACW and a light-shielding cover portion PACW, wherein the transmissive cover portion DACW may correspond to the display panel 1, and the light-shielding cover portion PACW surrounds the transmissive cover portion DACW. The light-shielding cover portion PACW may include an opaque material (e.g., a colored opaque material) that blocks light. The light-shielding cover portion PACW may include a pattern that can be observed by the user when no image is displayed.

[0140] Display panel 1 can be disposed below cover window CW. Display panel 1 can overlap with the transmissive cover portion DACW of cover window CW. Display panel 1 can include display area DA. Display area DA can be an area in which an image is displayed, and can include an area (hereinafter referred to as the component area) that transmits light emitted from component 400 disposed below display panel 1. Components can include sensors and cameras that use visible light, infrared light, and sound, etc.

[0141] Display panel 1 can be a light-emitting display panel including light-emitting diodes (LEDs). The LEDs can include organic light-emitting diodes (OLEDs) containing an organic emitting layer or inorganic light-emitting diodes containing inorganic materials. Inorganic LEDs can include PN junction diodes containing inorganic semiconductor materials. When a forward voltage is applied to the PN junction diode, holes and electrons are injected, and the energy generated by the recombination of holes and electrons is converted into light energy, emitting light of a preset color. Inorganic LEDs can have widths ranging from a few micrometers to several hundred micrometers. Inorganic LEDs can be represented by miniature LEDs.

[0142] Display panel 1 can be a rigid display panel that is rigid and therefore not easily bent, or a flexible display panel that is flexible and therefore easily bent, folded, or rolled. As an example, display panel 1 may include a foldable display panel that can be folded and unfolded, a curved display panel with a curved display surface, a flexible display panel in which areas other than the display surface are bent, a rollable display panel that can be rolled and unfolded, or a stretchable display panel.

[0143] Display panel 1 can be made transparent, and can be a transparent display panel, so that objects or backgrounds placed below display panel 1 can be observed from the upper surface of display panel 1. Display panel 1 can also be a reflective display panel that reflects objects or backgrounds onto the upper surface of display panel 1.

[0144] The data driver 120 may be mounted on the display panel 1 in the form of an integrated circuit (IC). However, this disclosure is not limited thereto, and for example, the data driver 120 may be mounted on the display circuit board 130.

[0145] The display circuit board 130 can be attached to one side of the display panel 1. The display circuit board 130 can be a flexible printed circuit board (FPCB) that can be bent, a rigid printed circuit board (PCB) that is strong and not easily bent, or a composite printed circuit board including both rigid and flexible printed circuit boards. A touch sensor driver can be mounted on the display circuit board 130. The touch sensor driver may include an integrated circuit. The touch sensor driver can be electrically connected to the touch electrodes of the touch sensor layer of the display panel 1 via the display circuit board 130.

[0146] The touch sensor layer of display panel 1 can sense user touch input using at least one of various touch methods, such as resistive layer method and capacitive method. When the touch sensor layer of display panel 1 senses user touch input using capacitive method, the touch sensor driver can determine whether the user has touched the touch sensor layer by applying a drive signal to the drive electrode in the touch electrode and sensing the voltage charged in the mutual capacitance between the drive electrode and the sensing electrode through the sensing electrode in the touch electrode.

[0147] User touches can include contact touches and proximity touches. A contact touch indicates that an object, such as a user's finger or pen, is in direct contact with an overlay window (CW) disposed on the touch sensor layer. A proximity touch, like a hover, indicates that an object, such as a user's finger or pen, is located above or near the overlay window (CW) and moves away from it. The touch sensor driver can be configured to transmit sensor data to the main processor (5100) based on the sensed voltage, and the main processor (5100) can be configured to calculate the touch coordinates at which the touch input occurred by analyzing the sensor data.

[0148] The controller can be located on the display circuit board 130 and can be configured to supply driving voltages for driving the gate driver, data driver 120 and / or the pixels of the display panel 1.

[0149] A bracket 600 for supporting the display panel 1 may be disposed below the display panel 1. The bracket 600 may include plastic, metal, or both. The bracket 600 may include a first camera hole CMH1 into which the camera device 5310 is inserted, a battery hole BH in which the battery 800 is disposed, a cable hole CAH through which cables connected to the display circuit board 130 pass, and a component hole CPH corresponding to component 400. When viewed in the third direction (w direction), the component hole CPH may overlap with component 400 of the main circuit board 500. For reference, when viewed in the third direction (w direction), the display area DA of the display panel 1 may overlap with component 400 of the main circuit board 500. The bracket 600 may not include the component hole CPH when necessary.

[0150] Component 400 included in the electronic device ED may include a first component 410, a second component 420, a third component 430, and a fourth component 440 overlapping with the display panel 1. Each of the first component 410, the second component 420, the third component 430, and the fourth component 440 may include at least one of a proximity sensor, an illuminance sensor, an iris sensor, a face recognition sensor, and a camera (or image sensor). The proximity sensor, using infrared light, can detect objects located near the upper surface of the electronic device ED, and the illuminance sensor can detect the brightness of light incident on the upper surface of the electronic device ED. The iris sensor can capture the iris of a person located on the upper surface of the electronic device ED, and the camera can acquire image data of objects positioned on the upper surface of the electronic device ED. Component 400 is not limited to a proximity sensor, an illuminance sensor, an iris sensor, a face recognition sensor, and / or a camera. Component 400 may include another type of sensor.

[0151] The main circuit board 500 and the battery 800 can be disposed below the bracket 600. The main circuit board 500 can be a rigid printed circuit board or a flexible printed circuit board.

[0152] The main circuit board 500 may include a main processor 5100, a camera device 5310, a main connector 550, and a component 400. The main processor 5100 may include an integrated circuit. When needed, the electronic device ED may include not only the camera device 5310 disposed on the upper surface of the main circuit board 500, but also a camera device disposed below the lower surface of the main circuit board 500. Each of the main processor 5100 and the main connector 550 may be disposed on one of the upper and lower surfaces of the main circuit board 500. The main circuit board 500 may be electrically connected to the display circuit board 130 via the main connector 550, etc.

[0153] The main processor 5100 can be configured to control all functions of the electronic device ED. As an example, the main processor 5100 can be configured to output digital video data to the data driver 120 via the display board 130, causing the display panel 1 to display an image. The main processor 5100 can be configured to receive sensed data from a touch sensor driver. The main processor 5100 can determine whether a user has touched the touchscreen based on the sensed data and perform an operation corresponding to a direct touch or proximity touch by the user. The main processor 5100 can be an application processor including an integrated circuit, a central processing unit, or a system-on-a-chip.

[0154] Camera device 5310 processes image frames, such as still images or moving images, acquired by an image sensor in camera mode, and outputs the image frames to main processor 5100. Camera device 5310 may include at least one of a camera sensor (e.g., a charge-coupled device (CCD) or complementary metal-oxide-semiconductor (CMOS), a light sensor (or image sensor), and a laser sensor.

[0155] A cable passing through the cable hole CAH of the bracket 600 can be connected to the main connector 550, and the main circuit board 500 can be electrically connected to the display circuit board 130 through the cable.

[0156] Electronic device ED can be represented as Figure 9 The block diagram shown is as follows. Figure 9 As shown, the electronic device ED may include not only the main processor 5100, but also a wireless communication unit 5200, an input unit 5300, a sensor unit 5400, an output unit 5500, an interface unit 5600, a memory 5700, and / or a power supply unit 5800.

[0157] The wireless communication unit 5200 may include at least one of the following: a broadcast receiving module 5210, a mobile communication module 5220, a wireless internet module 5230, a short-range communication module 5240, and a location information module 5250.

[0158] The broadcast receiving module 5210 can be configured to receive broadcast signals and / or broadcast-related information from an external broadcast management server via a broadcast channel. The broadcast channel may include a satellite channel or a ground wave channel.

[0159] The mobile communication module 5220 can be configured to transmit radio signals to / receive radio signals from at least one of the following: base stations, external terminals, and servers on a mobile communication network established according to mobile communication technology standards or communication schemes (e.g., Global System for Mobile Communications (GSM), Code Division Multiple Access (CDMA), Code Division Multiple Access 2000 (CDMA2000), Enhanced Voice Data Optimized or Enhanced Voice Data Only (EV-DO), Wideband CDMA (WCDMA), High-Speed ​​Downlink Packet Access (HSDPA), High-Speed ​​Uplink Packet Access (HSUPA), Long Term Evolution (LTE), and Advanced Long Term Evolution (LTE-A), etc.). The radio signals may include voice call signals, image communication call signals, or various types of data corresponding to text / multimedia message transmission / reception.

[0160] Wireless Internet module 5230 represents a module for wireless Internet access. Wireless Internet module 5230 can be configured to transmit / receive radio signals over a communication network according to wireless Internet technologies. Examples of wireless Internet technologies may include Wireless Local Area Network (WLAN), Wi-Fi, Wi-Fi Direct, and / or Digital Living Network Alliance (DLNA).

[0161] The short-range communication module 5240 can be used for short-range communication and can be used via Bluetooth. TM The short-range communication module 5240 supports at least one of the following technologies: Radio Frequency Identification (RFID), Infrared Data Association (IRDA), IrDA (Infrared Data Association), Ultra Wideband (UWB), ZigBee, Near Field Communication (NFC), Wi-Fi, Wi-Fi Direct, and Wireless Universal Serial Bus (Wireless USB). The short-range communication module 5240 can support wireless communication between the electronic device ED and a wireless communication system, between the electronic device ED and another electronic device, or between the electronic device ED and a network in which another electronic device (or an external server) is located, via a short-range wireless local area network (WLAN). The short-range WLAN can be a wireless personal area network (WLAN). The other electronic device can be a wearable device that can exchange data with or operate alongside the electronic device ED.

[0162] The location information module 5250 can be a module for obtaining the location of the electronic device ED, and may include a Global Positioning System (GPS) module or a Wi-Fi module.

[0163] The input unit 5300 may include an image input unit such as a camera device 5310 for inputting image signals, an audio input unit such as a microphone 5320 for inputting audio signals, and an input device 5330 for receiving information from a user. The camera device 5310 processes image frames, such as still images or moving images, acquired by the image sensor in image communication mode or shooting mode. The processed image frames may be displayed on the display panel 1 or stored in the memory 5700. The microphone 5320 processes external audio signals into electronic voice data. The processed voice data may be utilized differently depending on the function (or application) being performed in the electronic device ED.

[0164] The main processor 5100 can control the operation of the electronic device ED to correspond to information input via the input device 5330. The input device 5330 may include mechanical input devices such as buttons, dome switches, microwheels, and microswitches, or touch input devices located on the lower or side surface of the electronic device ED. The touch input device may include the touch sensor layer of the display panel 1.

[0165] The sensor unit 5400 may include at least one sensor that senses at least one of the following: information inside the electronic device ED, information about the surrounding environment of the electronic device ED, and user information, and generates a corresponding sensing signal. The main processor 5100 may control the driving or operation of the electronic device ED based on the sensing signal, or perform data processing, functions, or operations related to applications installed in the electronic device ED. The sensor unit 5400 may be a proximity sensor, illuminance sensor, or face recognition sensor as described above in conjunction with component 400. The sensor unit 5400 may include an accelerometer, a magnetic sensor, a gravity sensor, a gyroscope sensor, a motion sensor, an RGB sensor, an infrared (IR) sensor, a finger scanning sensor, an ultrasonic sensor, an optical sensor, and / or a battery level sensor. The sensor unit 5400 may include an environmental sensor or a chemical sensor. The environmental sensor may include, for example, a barometer, a hygrometer, a thermometer, a radiation detection sensor, a thermal detection sensor, and / or a gas detection sensor. The chemical sensor may include, for example, an electronic nose, a health sensor, and / or a biometric sensor.

[0166] The output unit 5500 is used to generate outputs related to vision, hearing or touch, and may include at least one of the display panel 1, the sound output unit 5510, the haptic module 5520 and the light output unit 5530.

[0167] Display panel 1 displays (outputs) information processed by the electronic device ED. As an example, display panel 1 may display execution screen information of an application driven by the electronic device ED, a user interface (UI), or a graphical user interface (GUI) corresponding to the execution screen information. Display panel 1 may include a display layer and a touchscreen layer, wherein the display layer may display images and the touch sensor layer may sense user touch input. Accordingly, display panel 1 may act as one of the input devices 5330 providing an input interface between the electronic device ED and the user, and simultaneously as one of the output units 5500 providing an output interface between the electronic device ED and the user.

[0168] The sound output unit 5510 can output sound data received by the wireless communication unit 5200 or stored in the memory 5700 in call receiving mode, communication mode, recording mode, voice recognition mode, and broadcast receiving mode, etc. The sound output unit 5510 can output sound signals related to functions performed by the electronic device ED (e.g., call signal receiving tone and message receiving tone). The sound output unit 5510 may include a receiver and a speaker. At least one of the receiver and speaker may be a sound generator attached to the display panel 1 and vibrating the display panel 1 to output sound. The sound generator may be a piezoelectric element or piezoelectric actuator that contacts and expands according to an electrical signal, or an exciter that generates magnetic force to vibrate the display panel 1 by using a voice coil.

[0169] The haptic module 5520 generates various tactile effects that can be felt by the user. The haptic module 5520 can provide vibrations as a tactile effect to the user. The haptic module 5520 can not only transmit tactile effects through direct contact, but also realize tactile effects, allowing the user to perceive tactile effects through the muscles in their fingers or arms.

[0170] The light output unit 5530 outputs a signal to notify of an event by using light from a light source. Examples of events generated in the electronic device ED may include message reception, call signal reception, missed call, alarm, schedule notification, email reception, and / or information reception via an application. The signal output by the light output unit 5530 can be realized when the electronic device ED emits monochromatic or multicolor light to its front or rear surface. Signal output may cease when the electronic device ED detects a user confirmation event.

[0171] Interface section 5600 serves as a pathway for various external devices connected to the electronic device ED. Interface section 5600 may include at least one of a wired / wireless headset port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting a device with an identification module, an audio input / output (I / O) port, a video I / O port, and a headphone port. When an external device is connected to interface section 5600, the electronic device ED can perform appropriate control related to the connected external device.

[0172] The memory 5700 stores data supporting various functions of the electronic device ED. The memory 5700 may store multiple applications driven in the electronic device ED, data and / or commands for the operation of the electronic device ED. At least some of the applications can be downloaded from an external server wirelessly. The memory 5700 may store applications for the operation of the main processor 5100, and temporarily store input / output data such as phone books, messages, still images and / or moving images. The memory 5700 may store tactile data of various vibration modes provided to the tactile module 5520, and audio data regarding various sounds provided to the sound output unit 5510.

[0173] The memory 5700 may include at least one type of storage medium selected from flash memory, hard disk, solid-state drive (SSD), silicon disk drive (SDD), multimedia card micro, card memory (e.g., secure digital (SD) or extreme digital (XD) memory), random access memory (RAM), static random access memory (SRAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), programmable read-only memory (PROM), magnetic storage, magnetic disk, and optical disk.

[0174] The power supply unit 5800, under the control of the main processor 5100, receives external and / or internal power and supplies power to various components included in the electronic device ED. The power supply unit 5800 may include a battery 800. The power supply unit 5800 may include a connection port. The connection port may be an example of an interface unit 5600 to which an external charger is electrically connected, and the external charger may provide power to charge the battery 800. The power supply unit 5800 may wirelessly charge the battery 800. The battery 800 may be arranged so as not to overlap with the main circuit board 500 in the third direction (w direction). The battery 800 may overlap with the battery hole BH of the bracket 600.

[0175] The lower cover 900 can form the appearance of the electronic device ED and has an opening that exposes a portion of the display panel 1. The lower cover 900 has an opening shape corresponding to the display panel 1 and can be fastened to the display panel 1. The lower cover 900 can be located on the opposite side of the cover window CW with the display panel 1 between the lower cover 900 and the cover window CW. The lower cover 900 can be disposed below the main circuit board 500 and the battery 800. The lower cover 900 can be fastened and fixed to the bracket 600. The lower cover 900 can form the lower appearance of the electronic device ED. The lower cover 900 can include plastic, metal, or both plastic and metal.

[0176] A second camera hole CMH2, which exposes the lower surface of the camera device 5310, can be formed in the lower cover 900. The positions of the camera device 5310 and the corresponding first and second camera holes CMH1 and CMH2 are not limited to... Figure 8 and Figure 9 The embodiments shown are not applicable and can be modified in various ways.

[0177] Figure 10 This is a schematic perspective view of a display panel 1 manufactured by an apparatus for manufacturing a display panel 1 according to an embodiment.

[0178] refer to Figure 10 The display panel 1 manufactured according to the embodiment may include a display area DA and a peripheral area PA outside the display area DA. The display panel 1 may be configured to display an image by means of an array of a plurality of sub-pixels arranged in two dimensions in the display area DA.

[0179] The peripheral area PA can be an area where no image is displayed, and can completely or partially surround the display area DA. Drivers, etc., configured to provide electrical signals or power to the sub-pixel circuits corresponding to the sub-pixels, can be arranged in the peripheral area PA. Pads can be provided in the peripheral area PA, and pads can be areas where electronic components or printed circuit boards can be electrically connected.

[0180] The display panel 1 can be provided in various shapes; for example, it can be provided as a rectangular plate shape with two pairs of parallel sides. When the display panel 1 is provided as a rectangular plate shape, one pair (e.g., a single pair) of sides can be provided longer than the other pair. In embodiments, for ease of description, a rectangular shape is provided, having a pair of first sides and a pair of second sides, wherein the extending direction of the first side is represented by a first direction (u direction), the extending direction of the second side is represented by a second direction (v direction), and a direction perpendicular to the extending directions of the first and second sides is represented by a third direction (w direction). Figure 10 The diagram shows a rectangular shape of display panel 1 with a short side and a long side. In an embodiment, the first side of the rectangular shape of display panel 1 can be a long side and the second side can be a short side. In an embodiment, display panel 1 can be, for example, a circular shape, an elliptical shape, a polygonal shape including a portion with a circular shape, or a polygonal shape excluding a quadrilateral shape.

[0181] Although the display panel 1 described below includes an organic light-emitting diode (OLED) as a display element, the display panel 1 according to this disclosure is not necessarily limited thereto. In embodiments, the display panel 1 may be a light-emitting display panel including an inorganic light-emitting diode, i.e., an inorganic light-emitting display panel. The inorganic light-emitting diode may include a PN junction diode comprising an inorganic semiconductor material. When a forward voltage is applied to the PN junction diode, holes and electrons are injected, and light of a predetermined color can be emitted while the energy generated by the recombination of holes and electrons is converted into light energy. The inorganic light-emitting diode may have a width in the range of several micrometers to several hundred micrometers. In embodiments, the inorganic light-emitting diode may be represented by a micro-light-emitting diode. In embodiments, the display panel 1 may be a quantum dot light-emitting display panel.

[0182] As described above, the display panel 1 can be used as a display screen in various products including televisions, laptop computers, monitors, billboards, Internet of Things (IoT) devices, and portable electronic devices including mobile phones, smartphones, tablet PCs, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigators, and ultra-mobile personal computers (UMPCs). According to embodiments, the display panel 1 can be used in wearable devices including smartwatches, watch phones, glasses displays, and head-mounted displays (HMDs). Additionally, in embodiments, the display panel 1 is used as a display screen in a car's dashboard, a car's central dashboard or a central information display (CID) arranged on the dashboard, a car's interior rearview mirror display replacing side mirrors, and a display arranged on the back of the front seats as entertainment for the rear seats of the car.

[0183] Figure 11 This is a schematic cross-sectional view of a portion of the display area DA of the display panel 1 according to an embodiment.

[0184] refer to Figure 11 The display panel 1 may include a stacked structure of substrate 100, sub-pixel circuit layer PCL, display element layer DEL and encapsulation layer 300.

[0185] The substrate 100 may have a multilayer structure comprising a base layer containing a polymer resin and an inorganic layer. As an example, the substrate 100 may include a base layer containing a polymer resin and a barrier layer containing an inorganic insulating layer. As an example, the substrate 100 may include a first base layer 101, a first barrier layer 102, a second base layer 103, and a second barrier layer 104 sequentially stacked on top of each other. The first base layer 101 and the second base layer 103 may each comprise polyimide (PI), polyethersulfone (PES), polyarylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polycarbonate (PC), cellulose triacetate (TAC), and / or cellulose acetate propionate (CAP). The first barrier layer 102 and the second barrier layer 104 may each comprise an inorganic insulating material such as silicon oxide, silicon oxide nitride, and / or silicon nitride. The substrate 100 may be flexible.

[0186] A sub-pixel circuit layer (PCL) is disposed on the substrate 100. For example, in Figure 11 The diagram shows that the sub-pixel circuit layer PCL includes a thin-film transistor (TFT), a buffer layer 111, a first gate insulating layer 112, a second gate insulating layer 113, an interlayer insulating layer 114, a first planarization insulating layer 115, and a second planarization insulating layer 116 below and / or on the elements of the thin-film transistor (TFT).

[0187] The buffer layer 111 can reduce or block the penetration of foreign matter, moisture or external air from under the substrate 100 and can provide a substantially flat surface on the substrate 100. The buffer layer 111 may include inorganic insulating materials such as silicon nitride, silicon oxide nitride and silicon oxide, and may include a single-layer structure or a multi-layer structure containing the above materials.

[0188] The thin-film transistor (TFT) on the buffer layer 111 may include a semiconductor layer Act, and the semiconductor layer Act may include polycrystalline silicon. The semiconductor layer Act may include amorphous silicon, oxide semiconductor, organic semiconductor, or a combination thereof. The semiconductor layer Act may include a channel region C, a drain region D and a source region S respectively disposed on two opposite sides of the channel region C. The gate electrode GE may overlap with the channel region C.

[0189] The gate electrode GE may include a low-resistance metallic material. The gate electrode GE may include a conductive material comprising molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti), and may have a single-layer or multi-layer structure comprising the above materials.

[0190] The first gate insulating layer 112 between the semiconductor layer Act and the gate electrode GE may comprise an inorganic insulating material such as silicon oxide, silicon nitride, silicon nitride, aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, or combinations thereof. The zinc oxide may be zinc oxide and / or zinc peroxide.

[0191] The second gate insulating layer 113 may cover (or overlap with) the gate electrode GE. Similar to the first gate insulating layer 112, the second gate insulating layer 113 may comprise an inorganic insulating material such as silicon oxide, silicon nitride, silicon nitride, aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, or combinations thereof. The zinc oxide may be zinc oxide and / or zinc peroxide.

[0192] The upper electrode Cst2 of the storage capacitor Cst can be disposed on the second gate insulating layer 113. The upper electrode Cst2 can overlap with the gate electrode GE disposed below the upper electrode Cst2. The gate electrode GE and the upper electrode Cst2, which overlap each other and are located between the second gate insulating layer 113, can constitute the storage capacitor Cst. For example, the gate electrode GE can serve as the lower electrode Cst1 of the storage capacitor Cst.

[0193] As described above, the storage capacitor Cst can overlap with the thin-film transistor TFT. In an embodiment, the storage capacitor Cst can be formed so as not to overlap with the thin-film transistor TFT.

[0194] The upper electrode Cst2 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), copper (Cu), or combinations thereof, and may include a single layer or multiple layers containing the above materials.

[0195] Interlayer insulation layer 114 may cover (or overlap with) the upper electrode Cst2. Interlayer insulation layer 114 may comprise an inorganic insulating material such as silicon oxide, silicon nitride, silicon nitride, aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, or combinations thereof. The zinc oxide may be zinc oxide and / or zinc peroxide. Interlayer insulation layer 114 may comprise a single layer or multiple layers containing this inorganic insulating material.

[0196] The drain electrode DE and the source electrode SE can each be disposed on the interlayer insulating layer 114. The drain electrode DE and the source electrode SE can be connected to the drain region D and the source region S respectively through contact holes disposed in the insulating layer below the drain electrode DE and the source electrode SE. The drain electrode DE and the source electrode SE can each comprise a highly conductive material. The drain electrode DE and the source electrode SE can each comprise a conductive material comprising molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), or combinations thereof, and can comprise a single layer or multiple layers comprising the above materials. In an embodiment, the drain electrode DE and the source electrode SE can each have a Ti / Al / Ti multilayer structure.

[0197] The first planarization insulating layer 115 may cover (or overlap with) the drain electrode DE and the source electrode SE. The first planarization insulating layer 115 may include an organic insulating material comprising a general polymer such as polymethyl methacrylate (PMMA) or polystyrene (PS), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorinated polymers, p-xylene polymers, vinyl alcohol polymers, and mixtures thereof.

[0198] The second planarization insulation layer 116 may be disposed on the first planarization insulation layer 115. The second planarization insulation layer 116 and the first planarization insulation layer 115 may comprise the same material and may comprise organic insulating materials comprising general polymers such as polymethyl methacrylate (PMMA) or polystyrene (PS), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorinated polymers, p-xylene polymers, vinyl alcohol polymers, and mixtures thereof.

[0199] The display element layer (DEL) can be disposed on the sub-pixel circuit layer (PCL) having the above structure. The display element layer (DEL) can include an organic light-emitting diode (OLED) as a display element (e.g., a light-emitting element). The OLED can have a stacked structure of sub-pixel electrodes 210, an intermediate layer 220, and a common electrode 230. The OLED can emit, for example, red, green, or blue light, or it can emit red, green, blue, or white light. The OLED can be configured to emit light through an emission region EA. The emission region EA can be defined as a sub-pixel (PX).

[0200] The sub-pixel electrode 210 of the organic light-emitting diode (OLED) can be electrically connected to the thin-film transistor (TFT) through contact holes formed in the second planarization insulating layer 116 and the first planarization insulating layer 115 and the connection electrode CM disposed on the first planarization insulating layer 115.

[0201] The sub-pixel electrode 210 may include conductive oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), zinc aluminum oxide (AZO), or combinations thereof. In embodiments, the sub-pixel electrode 210 may include a reflective layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), compounds thereof, or combinations thereof. In embodiments, the sub-pixel electrode 210 may further include a layer above / below the reflective layer, which may include ITO, IZO, ZnO, In2O3, or combinations thereof.

[0202] A dam layer 117 may be disposed on the sub-pixel electrode 210. The dam layer 117 includes an opening 117OP that exposes the central portion of the sub-pixel electrode 210, and the dam layer 117 overlaps with the edge portion of the sub-pixel electrode 210. The dam layer 117 may comprise an organic insulating material and / or an inorganic insulating material. The opening 117OP of the dam layer 117 may define an emission region EA of light emitted from an organic light-emitting diode (OLED). As an example, the size and / or width of the opening 117OP may correspond to the size and / or width of the emission region EA. Accordingly, the size and / or width of the sub-pixel PX may depend on the size and / or width of the opening 117OP of the dam layer 117.

[0203] The intermediate layer 220 may include an emission layer 222 formed corresponding to the sub-pixel electrode 210. The emission layer 222 may include a polymeric organic material or a low molecular weight organic material that emits light of a preset color. The emission layer 222 may include an inorganic emission material or quantum dots. The sub-pixel PX may be configured to emit red, blue, green, or white light depending on the color of the light emitted by the emission layer 222.

[0204] In an embodiment, the intermediate layer 220 may include a first functional layer 221 and a second functional layer 223 disposed below and on the emitter layer 222, respectively. The first functional layer 221 may include, for example, a hole transport layer (HTL), or may include an HTL and a hole injection layer (HIL). The second functional layer 223 may be elements disposed on the emitter layer 222 and may include an electron transport layer (ETL) and / or an electron injection layer (EIL). Like the common electrode 230 described below, the first functional layer 221 and / or the second functional layer 223 may be a common layer that completely covers (or overlaps with) the substrate 100.

[0205] A common electrode 230 may be disposed on and overlap with the sub-pixel electrode 210. The common electrode 230 may include a conductive material having a low work function. As an example, the common electrode 230 may include a (semi-)transparent layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), alloys thereof, or combinations thereof. The common electrode 230 may further include a layer on the (semi-)transparent layer comprising ITO, IZO, ZnO, or In2O3, or combinations thereof. The common electrode 230 may be formed as a host (e.g., a single host) to completely cover (or overlap with) the substrate 100.

[0206] The encapsulation layer 300 can be disposed on the display element layer DEL and can cover (or overlap with) the display element layer DEL. The encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. In an embodiment, in... Figure 11 The diagram shows that the encapsulation layer 300 includes a first inorganic encapsulation layer 310, an organic encapsulation layer 320, and a second inorganic encapsulation layer 330 that are sequentially stacked on top of each other.

[0207] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may comprise at least one inorganic material selected from aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon nitride. The organic encapsulation layer 320 may comprise a polymeric material. The polymeric material may comprise acrylic resins, epoxy resins, polyimides, polyethylene, or combinations thereof. In an embodiment, the organic encapsulation layer 320 may comprise an acrylate. The organic encapsulation layer 320 may be formed by curing monomers or coating a polymer. The organic encapsulation layer 320 may be transparent.

[0208] Although not shown, a touch sensor layer may be disposed on the encapsulation layer 300. An optical functional layer may be disposed on the touch sensor layer. The touch sensor layer may obtain coordinate information corresponding to external input, such as a touch event. The optical functional layer may be configured to reduce the reflectivity of light incident from the outside toward the display panel (external light) and / or increase the color purity of light emitted from the display panel. In embodiments, the optical functional layer may include a phase retarder and / or a polarizer. The phase retarder may include a film-type retarder or a liquid crystal coated retarder. The phase retarder may include a λ / 2 phase retarder and / or a λ / 4 phase retarder. The polarizer may include a film-type polarizer or a liquid crystal coated polarizer. The film-type polarizer may include a stretchable synthetic resin film, and the liquid crystal coated polarizer may include liquid crystals arranged in an array. Each of the retarder and polarizer may further include a protective film.

[0209] The adhesive component can be disposed between the touch sensor layer and the optical functional layer. There are no limitations on the use of general components in the art for the adhesive component.

[0210] Figure 12 This is a schematic plan view of the sub-pixel arrangement of the display panel 1 according to an embodiment.

[0211] refer to Figure 12 The display area DA may include multiple sub-pixels PX. The sub-pixels PX can be arranged two-dimensionally in a first direction (u direction) and a second direction (v direction). In an embodiment, the first direction (u direction) may be the same as the movement direction of the deposition source 50 (e.g., ...). Figure 1 The second direction (x-direction) corresponds to the direction of the nozzle of the deposition source 50 (e.g., the x-direction), and the second direction (v-direction) can correspond to the direction of the nozzle of the deposition source 50 (e.g., the x-direction). Figure 1 The third direction (w direction) corresponds to the y-direction. Figure 1 The -z direction corresponds to this.

[0212] Sub-pixels PX may include a first sub-pixel PX1 of a first color, a second sub-pixel PX2 of a second color, and a third sub-pixel PX3 of a third color. In an embodiment, for example, the first sub-pixel PX1 may be a green sub-pixel emitting green light, the second sub-pixel PX2 may be a red sub-pixel emitting red light, and the third sub-pixel PX3 may be a blue sub-pixel emitting blue light. In the following description, it is based on the assumption that the first sub-pixel PX1 is a green sub-pixel, the second sub-pixel PX2 is a red sub-pixel, and the third sub-pixel PX3 is a blue sub-pixel. Figure 12 As shown, the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 configure pixels as the smallest unit for repeated display. Multiple pixels can be provided as the smallest unit, and they are arranged repeatedly in a first direction (e.g., the u direction) and a second direction (e.g., the v direction).

[0213] The first sub-pixel PX1 and the second sub-pixel PX2 can be alternately arranged in the first column C1, and the third sub-pixel PX3 can be arranged in the second column C2 adjacent to the first column C1. Two of the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 can be arranged to correspond to the remaining one. As an example, the third sub-pixel PX3 can be arranged to correspond to the first sub-pixel PX1 and the second sub-pixel PX2 in a first direction (e.g., the u direction).

[0214] In the planar diagram, the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 can each have a quadrilateral shape. Here, the quadrilateral can include a quadrilateral with rounded vertices. However, the embodiment is not limited to this. In the embodiment, in the planar diagram, the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 can each have a polygonal shape, a circular shape, or an elliptical shape other than a quadrilateral shape. Here, the polygon can include a polygon with rounded vertices.

[0215] In an embodiment, in a planar view, the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 may have a rectangular shape, having a first side extending in a first direction (e.g., the u direction) and a second side extending in a second direction (e.g., the v direction). As an example, the first sub-pixel PX1 and the second sub-pixel PX2 may have a rectangular shape in which their first side is greater than their second side. The third sub-pixel PX3 may have a rectangular shape in which its second side is greater than its first side. The length of the second side of the third sub-pixel PX3 may be greater than the sum of the lengths of the second sides of the first sub-pixel PX1 and the second sub-pixel PX2.

[0216] At least some of the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 may have different sizes. In an embodiment, the size of the third sub-pixel PX3 may be larger than the size of the first sub-pixel PX1 and the size of the second sub-pixel PX2. As an example, the size of the third sub-pixel PX3 may be larger than the size of the first sub-pixel PX1, and the size of the first sub-pixel PX1 may be larger than the size of the second sub-pixel PX2. However, this disclosure is not limited to this. In an embodiment, the size of the third sub-pixel PX3 may be larger than the size of the first sub-pixel PX1, and the size of the second sub-pixel PX2 may be larger than the size of the first sub-pixel PX1. The size of the sub-pixel mentioned above can also be understood as the area of ​​the sub-pixel.

[0217] Here, the size of the subpixel PX can represent the display element that implements each subpixel PX (e.g., Figure 11 The emission region EA of an organic light-emitting diode (OLED) (see Figure 11 The planar dimensions of the emission area EA. (See also: ) Figure 11 The dimensions can be defined by the embankment 117 (see...). Figure 11 Opening 117OP in ) (see Figure 11 )limited.

[0218] Figure 13 This is a layout diagram showing the arrangement of sub-pixels of the display panel 1 according to an embodiment, and Figure 14 This is a schematic diagram showing the arrangement of subpixels of a display panel according to a comparative example. Figure 15 It is according to the embodiment along Figure 13 A schematic cross-sectional view of display panel 1 taken by line VI-VI'. Figure 13 The sub-pixels can have Figure 12 The arrangement structure of sub-pixels.

[0219] refer to Figure 13 Within a pixel (e.g., a single pixel), first sub-pixel PX1 and third sub-pixel PX3 may be arranged in a first direction (e.g., the u direction), second sub-pixel PX2 and third sub-pixel PX3 may be arranged in the first direction (e.g., the u direction), and first sub-pixel PX1 and second sub-pixel PX2 may be arranged in a second direction (e.g., the v direction). The first direction (u direction) may be the same as the direction of movement of the deposition source 50 (e.g., Figure 1 The second direction (x-direction) corresponds to the direction of the nozzle of the deposition source 50 (e.g., the x-direction), and the second direction (v-direction) can correspond to the direction of the nozzle of the deposition source 50 (e.g., the x-direction). Figure 1 (corresponding to the y-direction).

[0220] In a planar graph, the separation distance S1 between adjacent first sub-pixels PX1 and third sub-pixels PX3 can be different from the separation distance S2 between adjacent first sub-pixels PX1 and second sub-pixels PX2. The separation distance S1 between adjacent first sub-pixels PX1 and third sub-pixels PX3 can be smaller than the separation distance S2 between adjacent first sub-pixels PX1 and second sub-pixels PX2.

[0221] Similarly, the separation distance S3 between adjacent second sub-pixels PX2 and third sub-pixels PX3 can be different from the separation distance S2 between adjacent first sub-pixels PX1 and second sub-pixels PX2. The separation distance S3 between adjacent second sub-pixels PX2 and third sub-pixels PX3 can be smaller than the separation distance S2 between adjacent first sub-pixels PX1 and second sub-pixels PX2.

[0222] Here, the separation distance between sub-pixels PX can represent the separation distance between the emission regions EA of sub-pixels PX. For example, the separation distance between sub-pixels PX can represent the separation distance between embankment 117 (see...). Figure 11 The openings 117OP corresponding to the sub-pixels PX (see) Figure 11The planar separation distance between sub-pixels PX1 and PX2 can be represented as the separation distance between the first emission region EA1 of the first sub-pixel PX1 and the second emission region EA2 of the second sub-pixel PX2. Similarly, the separation distance between the second sub-pixel PX2 and PX3 can be represented as the separation distance between the second emission region EA2 of the second sub-pixel PX2 and the third emission region EA3 of the third sub-pixel PX3. Finally, the separation distance between the first sub-pixel PX1 and the third sub-pixel PX3 can be represented as the separation distance between the first emission region EA1 of the first sub-pixel PX1 and the third emission region EA3 of the third sub-pixel PX3.

[0223] The separation distance S1 between the first sub-pixel PX1 and the third sub-pixel PX3 in a pixel can be substantially equal to the separation distance between the first sub-pixel PX1 and the third sub-pixel PX3 that are adjacent to each other in a first direction (e.g., the u direction) and are respectively included in different pixels.

[0224] The separation distance S3 between the second sub-pixel PX2 and the third sub-pixel PX3 in a pixel can be substantially equal to the separation distance between the second sub-pixel PX2 and the third sub-pixel PX3 that are adjacent to each other in a first direction (e.g., the u direction) and are respectively included in different pixels.

[0225] The separation distance S2 between the first sub-pixel PX1 and the second sub-pixel PX2 in a pixel can be substantially equal to the separation distance between the first sub-pixel PX1 and the second sub-pixel PX2 that are adjacent to each other in a second direction (e.g., the v direction) and are respectively included in different pixels.

[0226] The separation distance S4 between adjacent third sub-pixels PX3 can be greater than the separation distance S2 between adjacent first sub-pixels PX1 and second sub-pixels PX2.

[0227] The separation distance S1 between the first sub-pixel PX1 and the third sub-pixel PX3 that are adjacent to each other can be substantially equal to the separation distance S3 between the second sub-pixel PX2 and the third sub-pixel PX3 that are adjacent to each other.

[0228] In an embodiment, the length d11 of the first side of the first sub-pixel PX1 can be greater than the length d12 of the second side. The length d21 of the first side of the second sub-pixel PX2 can be greater than the length d22 of the second side. The length d31 of the first side of the third sub-pixel PX3 can be less than the length d32 of the second side. The length d32 of the second side of the third sub-pixel PX3 can be greater than or substantially equal to the sum of the lengths d12 and d22 of the second side of the first sub-pixel PX1 and the second side of the second sub-pixel PX2. The length d31 of the first side of the third sub-pixel PX3 can be less than the lengths d21 and d11 of the first side of the second sub-pixel PX2. In an embodiment, the length d11 of the first side of the first sub-pixel PX1 can be substantially equal to the length d21 of the first side of the second sub-pixel PX2. In an embodiment, the length d12 of the second side of the first sub-pixel PX1 can be different from the length d22 of the second side of the second sub-pixel PX2.

[0229] The emission layer 222 of each of the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 having a planar arrangement structure (see...) Figure 11 (This can be done during the deposition process using a reference) Figures 1 to 6B The apparatus 2 described for manufacturing a display device is formed. As an example, during an operation in which a deposition source jets deposition material while moving relative to a substrate and a mask assembly in one direction (e.g., a single direction), an emission layer 222 of each of the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 can be formed. The first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 can be formed using different deposition materials.

[0230] For reference Figures 5 to 6B As described, during the process of depositing the emission layer 222 of each of the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3, a shadow region may be present in the nozzle direction of the deposition source (e.g., Figure 13 The direction of movement of the sediment source (v direction) is greater than that in the direction of movement of the sediment source (e.g., Figure 13 It is more obvious in the u direction.

[0231] However, in embodiments, the separation distance between sub-pixels PX can be designed differently in the movement direction of the deposition source (e.g., the u direction) and the nozzle direction of the deposition source (e.g., the v direction), where the shadow area appears more pronounced in the nozzle direction of the deposition source. The separation distance between sub-pixels PX can be based on... Figure 14The comparative example shown is designed with the separation distance between the first sub-pixel PX1 and the third sub-pixel PX3, and the separation distance between the first sub-pixel PX1 and the second sub-pixel PX2, substantially equal to L. When the lengths of the second sides of the first sub-pixel PX1 and the second sub-pixel PX2 arranged in the nozzle direction (e.g., v direction) of the deposition source are reduced, the separation distance between the first sub-pixel PX1 and the second sub-pixel PX2 arranged in the nozzle direction (e.g., v direction) of the deposition source can be increased. In order to maintain the areas of each of the first sub-pixel PX1 and the second sub-pixel PX2 as equal as possible while increasing the lengths of the first sides of the first sub-pixel PX1 and the second sub-pixel PX2, the separation distance between the first sub-pixel PX1 and the third sub-pixel PX3 and / or the separation distance between the second sub-pixel PX2 and the third sub-pixel PX3 arranged in the movement direction (e.g., u direction) of the deposition source can be reduced.

[0232] The emission layer 222 of the sub-pixel PX can be formed in the opening 117OP of the embankment layer 117. The emission layer 222 needs to be uniformly formed to a normal thickness in the opening 117OP of the embankment layer 117. As described above, the planar shape of the sub-pixel PX can be the same as the planar shape of the opening 117OP of the embankment layer 117 that defines the emission region EA of the sub-pixel PX. Accordingly, since the length of the second side of each of the first sub-pixel PX1 and the second sub-pixel PX2 arranged in the nozzle direction (e.g., v direction) of the deposition source is reduced, the area of ​​the opening 117OP of the first sub-pixel PX1 and the second sub-pixel PX2, in which the emission layer 222 needs to be deposited to a normal thickness in the nozzle direction (e.g., v direction) of the deposition source is reduced, the inner shadow area can also be reduced.

[0233] Accordingly, according to this disclosure, because the separation distance between the first sub-pixel PX1 and the third sub-pixel PX3 in the direction of movement of the deposition source (e.g., the u direction) and the separation distance between the first sub-pixel PX1 and the second sub-pixel PX2 in the direction of nozzle of the deposition source (e.g., the v direction) are designed to be different from each other, the deposition consistency in the direction of movement of the deposition source (e.g., the u direction) and the direction of nozzle of the deposition source (e.g., the v direction) can be improved. Consequently, spot defects in the display panel due to magnetic modes can be reduced.

[0234] Compared to the case where the separation distance between the first sub-pixel PX1 and the third sub-pixel PX3, and the separation distance between the first sub-pixel PX1 and the second sub-pixel PX2, are equal to L according to the comparative example, the separation distance S2 between the first sub-pixel PX1 and the second sub-pixel PX2 arranged in the nozzle direction (e.g., v direction) of the deposition source can be L+X1, which is an extension of X1. X1 can satisfy the following equation 1.

[0235] [Equation 1]

[0236] X1 = (arctangent (α1) - arctangent (α2)) × (t1+t2)

[0237] Here, α1 is the direction of the deposition material incident on the display substrate DS in the nozzle direction of the deposition source 50 (e.g., Figure 13 The minimum incident angle in the v direction, α2 is the incident deposition material on the display substrate DS in the moving direction of the deposition source 50 (e.g., the direction of v). Figure 13 The minimum incident angle in the u direction, t1 is the separation distance between the mask 42 and the display substrate DS, and t2 can represent the distance from the surface of the mask 42 facing the display substrate DS (e.g., facing the u direction). Figure 3B The vertical distance from a single surface in the +z direction to the protrusion TP.

[0238] In the embodiments, L can be in the range of approximately 15µm to approximately 30µm.

[0239] In an embodiment, X1 can be in the range of about 0.5µm to about 3µm. Preferably, X1 can be in the range of about 0.5µm to about 2µm.

[0240] Compared to the case where the separation distance between the first sub-pixel PX1 and the third sub-pixel PX3, and the separation distance between the first sub-pixel PX1 and the second sub-pixel PX2, are equal to L according to the comparative example, the separation distance S1 between the first sub-pixel PX1 and the third sub-pixel PX3 arranged in the movement direction of the deposition source (e.g., the u direction) can be a reduction of L-X2 by X2. X2 can be designed to be a value that complements the area of ​​the emission region of each of the first sub-pixel PX1 and the second sub-pixel PX2. As an example, when the length of the second side of each of the first sub-pixel PX1 and the second sub-pixel PX2 arranged in the nozzle direction of the deposition source (e.g., the v direction) is reduced, the length of the first side of each of the first sub-pixel PX1 and the second sub-pixel PX2 can be increased to complement the area of ​​the first sub-pixel PX1 and the second sub-pixel PX2 as much as possible. By taking into account the increased length of the first side of the first sub-pixel PX1, the separation distance between the first sub-pixel PX1 and the third sub-pixel PX3 arranged in the movement direction of the deposition source (e.g., the u direction) can be reduced.

[0241] In an embodiment, X2 can be 2µm or less. Preferably, X2 can be in the range of about 0.5µm to about 2µm. More preferably, X2 can be in the range of about 0.5µm to about 1µm. Because X2 is a reduced value of the separation distance between sub-pixels (e.g., first sub-pixel PX1 and third sub-pixel PX3), X2 can represent a reduction in process margin. When X2 is greater than about 2µm, defects due to process errors may increase when depositing the emitter layer of the sub-pixels, etc.

[0242] In an embodiment, the separation distance S2 between the first sub-pixel PX1 and the second sub-pixel PX2 can be in the range of approximately 15.5µm to approximately 32µm.

[0243] In an embodiment, the separation distance S1 between the first sub-pixel PX1 and the third sub-pixel PX3 can be in the range of approximately 14.5µm to approximately 28µm.

[0244] As an example, Figure 15 A schematic cross-section of the first sub-pixel PX1 in the nozzle direction (e.g., v direction) of the deposition source is shown, and for ease of description, the display element of the first sub-pixel PX1 is shown.

[0245] refer to Figure 15 The emission layer 222 of the first sub-pixel PX1 can be formed in the opening 117OP of the embankment layer 117 that defines the first emission region EA1. The emission layer 222 of the first sub-pixel PX1 may include a first portion 222a and a second portion 222b, and the first portion 222a may contact the sub-pixel electrode 210 exposed by the opening 117OP of the embankment layer 117, and the second portion 222b extends laterally from the first portion 222a and contacts the embankment layer 117.

[0246] In an embodiment, the thickness of the first portion 222a of the emission layer 222 of the first sub-pixel PX1 can be formed uniformly. The thickness of the second portion 222b of the emission layer 222 of the first sub-pixel PX1 can be inconsistent. As an example, the second portion 222b of the emission layer 222 of the first sub-pixel PX1 can have a thickness that decreases toward its outer portion. However, this disclosure is not limited to this. In an embodiment, the first sub-pixel PX1 can be formed with a uniform thickness over the entire emission layer 222 including the first portion 222a and the second portion 222b.

[0247] Similarly, although not in Figure 15 As shown, however, the emission layer 222 of each of the second sub-pixel PX2 and the third sub-pixel PX3 can be formed to a uniform thickness in the area that is in contact with the sub-pixel electrode 210 and exposed by the opening 117OP of the embankment layer 117.

[0248] Here, the thickness of the emission layer 222 can represent the vertical distance between the surface (e.g., a single surface) of the emission layer 222 in contact with its lower layer (e.g., the first functional layer 221) and another surface located in the opposite direction of the lower layer.

[0249] With the emitter layer 222 having a consistent thickness, this means that the same thickness will be measured regardless of the point at which the emitter layer 222 is measured. With the emitter layer 222 having a consistent thickness, this means that the thickness will be measured within an error range of approximately 5%. The emitter layer 222 can have a consistent thickness within an error range of approximately 5%.

[0250] According to embodiments, a display panel with reduced spot defects caused by brightness differences, a method for manufacturing the display panel, and an electronic device including the display panel can be realized. However, the scope of this disclosure is not limited to these effects.

[0251] It should be understood that the embodiments described herein should be considered in a descriptive sense only and not for limiting purposes. The description of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the figures, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope defined by the claims.

Claims

1. A display panel, comprising: The first, second, and third sub-pixels emit light of different colors, among which... In the planar view, the first sub-pixel and the third sub-pixel are arranged in a first direction. In the plan view, the first sub-pixel and the second sub-pixel are arranged in a second direction perpendicular to the first direction, and In the planar diagram, the separation distance between the first sub-pixel and the third sub-pixel is different from the separation distance between the first sub-pixel and the second sub-pixel.

2. The display panel according to claim 1, wherein, In the planar diagram, the separation distance between the first sub-pixel and the third sub-pixel is less than the separation distance between the first sub-pixel and the second sub-pixel.

3. The display panel according to claim 1, wherein, In the planar view, the separation distance between the first sub-pixel and the second sub-pixel is in the range of 15.5µm to 32µm.

4. The display panel according to claim 1, wherein, In the planar diagram, each of the first sub-pixel, the second sub-pixel, and the third sub-pixel has a rectangular shape, the rectangular shape having a first side extending in the first direction and a second side extending in the second direction.

5. The display panel according to claim 4, wherein, The length of the first side of the first sub-pixel is equal to the length of the first side of the second sub-pixel, and The length of the second side of the first sub-pixel is different from the length of the second side of the second sub-pixel.

6. The display panel according to claim 4, wherein, The length of the first side of the first sub-pixel is greater than the length of the second side of the first sub-pixel. The length of the first side of the second sub-pixel is greater than the length of the second side of the second sub-pixel, and The length of the first side of the third sub-pixel is less than the length of the second side of the third sub-pixel.

7. The display panel according to claim 1, wherein, The third sub-pixel corresponds to the first sub-pixel and the second sub-pixel in the first direction.

8. The display panel according to claim 1, wherein, The area of ​​the first sub-pixel is larger than the area of ​​the second sub-pixel, and The area of ​​the third sub-pixel is greater than the area of ​​the first sub-pixel.

9. The display panel according to claim 1, wherein, Each of the first sub-pixel, the second sub-pixel, and the third sub-pixel includes: Sub-pixel electrode; An emission layer is disposed on the sub-pixel electrode; and The electrodes are disposed on the emission layer. Each of the first sub-pixel, the second sub-pixel, and the third sub-pixel is defined by an opening in a dam layer disposed on the sub-pixel electrode. The embankment overlaps with the edge portion of the sub-pixel electrode, and The emission layer of the first sub-pixel has a uniform thickness in the region where the emission layer of the first sub-pixel contacts the sub-pixel electrode exposed by the opening of the dam layer.

10. A method for manufacturing a display panel, comprising: Prepare the display substrate; The display substrate and mask assembly are disposed inside the cavity, and the mask assembly includes a mask sheet; as well as While moving the deposition source relative to the display substrate in a first direction, deposition material is sprayed onto the display substrate to form the display panel including a first sub-pixel, a second sub-pixel, and a third sub-pixel, wherein, The first sub-pixel and the third sub-pixel are arranged in the first direction. The first sub-pixel and the second sub-pixel are arranged in a second direction perpendicular to the first direction, and In a planar diagram, the separation distance between the first sub-pixel and the third sub-pixel is different from the separation distance between the first sub-pixel and the second sub-pixel.

11. The method according to claim 10, wherein, The deposition source includes a plurality of nozzles arranged in the second direction, and At least some of the nozzles are tilted at a preset angle.

12. The method according to claim 10, wherein, Each of the first sub-pixel, the second sub-pixel, and the third sub-pixel includes: Sub-pixel electrode; An emission layer is disposed on the sub-pixel electrode; and The electrodes are disposed on the emitter layer, and The spraying of the deposited material includes forming the emission layer of each of the first sub-pixel, the second sub-pixel, and the third sub-pixel.

13. The method according to claim 10, wherein, In the planar diagram, the separation distance between the first sub-pixel and the third sub-pixel is less than the separation distance between the first sub-pixel and the second sub-pixel.

14. The method of claim 10, wherein, In the planar view, the separation distance between the first sub-pixel and the second sub-pixel is in the range of 15.5µm to 32µm.

15. The method according to claim 10, wherein, In the planar diagram, each of the first sub-pixel, the second sub-pixel, and the third sub-pixel has a rectangular shape, the rectangular shape having a first side extending in the first direction and a second side extending in the second direction.

16. The method according to claim 15, wherein, The length of the first side of the first sub-pixel is equal to the length of the first side of the second sub-pixel, and The length of the second side of the first sub-pixel is different from the length of the second side of the second sub-pixel.

17. The method according to claim 15, wherein, The length of the first side of the first sub-pixel is greater than the length of the second side of the first sub-pixel. The length of the first side of the second sub-pixel is greater than the length of the second side of the second sub-pixel, and The length of the first side of the third sub-pixel is less than the length of the second side of the third sub-pixel.

18. The method according to claim 10, wherein, The third sub-pixel corresponds to the first sub-pixel and the second sub-pixel in the first direction.

19. A display panel manufactured by the method according to any one of claims 10 to 18.

20. An electronic device comprising: The display panel according to claim 19; as well as The lower cover forms the exterior of the electronic device and has an opening that exposes a portion of the display panel.

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