Silicon wafer swing acid corrosion device

Abstract

The invention relates to the technical field of wafer cleaning, and discloses a silicon wafer swing acid corrosion device which comprises a connecting block and a motor, the motor is installed at one end of the connecting block, the other end of the connecting block is rotationally connected with a first shaft, and an output shaft of the motor is connected with one end of the first shaft; one end of the first swing arm is connected with the other end of the first shaft, one side of the first swing arm is rotatably connected with a second shaft, one end of the second shaft is provided with a second swing arm, the storage frame is arranged at one end of the second swing arm, and the upper end of the storage frame is connected with a clamp frame in a buckled mode. According to the wafer cleaning device, the beating piece slides up and down, the beating piece is used for beating the liquid level of the pickling solution, so that water waves are formed on the liquid level, the wafer is impacted by the water waves layer by layer, the pickling solution can impact and wash the wafer, the impact force is proper, the wafer cannot be damaged, and therefore swing cleaning of the clamp frame is assisted, and the wafer is further better cleaned.

Description

Technical Field

[0001] This invention relates to the field of wafer cleaning technology, specifically to a silicon wafer oscillating acid etching device. Background Technology

[0002] Wet etching is a micromechanical structure manufacturing technology that selectively removes materials using liquid chemical etching solutions. This process utilizes anisotropic etching solutions, such as potassium hydroxide solution and TMAH, to form predetermined structures on materials with specific crystal orientations. It features low cost and high efficiency. The core process flow includes three stages: oxidation thinning, mask preparation, and etching shaping. It can achieve three-dimensional microstructure processing with nanometer-level precision. In MEMS device manufacturing, this process is widely used in bulk silicon processing and surface microstructure shaping of products such as micro sensors and micro actuators.

[0003] Existing wafers require acid etching to remove impurities from their surface. However, because wafers are thin and easily broken, cleaning methods with large vibration amplitudes can cause them to break. Therefore, a gentle yet effective cleaning method is needed. Summary of the Invention

[0004] This invention provides a silicon wafer oscillation acid etching device, which has the beneficial effect of good cleaning effect and solves the problem that the large vibration amplitude of the cleaning method mentioned in the background art will cause the wafer to break.

[0005] This invention provides the following technical solution: a silicon wafer oscillating acid etching device, comprising:

[0006] Connector block;

[0007] An electric motor is mounted on one end of a connecting block, and a first shaft is rotatably connected to the other end of the connecting block. The output shaft of the electric motor is connected to one end of the first shaft.

[0008] A first swing arm, one end of which is connected to the other end of a first shaft, and a second shaft is rotatably connected to one side of the first swing arm, with a second swing arm mounted on one end of the second shaft;

[0009] A storage frame is provided at one end of the second swing arm, and a clamp frame is snapped to the upper end of the storage frame.

[0010] The fixture frame has several slots for storing wafers inside, and a cleaning cavity is provided between every two slots.

[0011] The fixture frame is equipped with a V-shaped plate, which is used to spray dissolving gas upward to agitate the cleaning fluid inside the fixture frame and impact it onto the wafer.

[0012] The upper end of the fixture frame is also equipped with several tapping plates, which are located in each cleaning chamber. By sliding the tapping plates up and down, they tap the cleaning fluid inside the fixture frame to form water waves, which then impact the wafer.

[0013] As an optional embodiment of the silicon wafer oscillating acid etching device of the present invention, the upper end of the fixture frame is rotatably connected to a rotating shaft, and the two ends of the rotating shaft are provided with first spray holes, which are used to spray cleaning liquid onto the wafer.

[0014] As an optional embodiment of the silicon wafer oscillating acid etching device of the present invention, the upper end of the V-shaped plate is provided with two second spray holes, and the upper end of the V-shaped plate is also provided with a third spray hole, the third spray hole being located between the two second spray holes, and the distance between the two second spray holes being the same as the size of the cleaning chamber.

[0015] As an optional embodiment of the silicon wafer swing acid etching device of the present invention, wherein: a drive shaft cylinder is also installed inside the inner wall of the fixture frame, and a liquid storage chamber, a first gas chamber and a second gas chamber are sequentially arranged inside the drive shaft cylinder;

[0016] The lower end of the tapping plate is equipped with a connecting rod, the lower end of the connecting rod is slidably connected to the liquid storage cavity, and a third piston plate is also installed on the outer surface of the connecting rod. The third piston plate is slidably connected to the inside of the liquid storage cavity. One end of the drive shaft cylinder is also connected to a third hose, and one end of the third hose is connected to one end of the rotating shaft.

[0017] The second air chamber is slidably connected to a second piston plate, and a first hose is also installed at one end of the drive shaft cylinder. The first hose is connected to a V-shaped plate and is used to transmit a medium to the drive shaft cylinder.

[0018] The first piston plate is slidably connected inside the first air chamber, and a second hose is also installed at one end of the drive shaft cylinder. One end of the second hose is connected to a V-shaped plate, and the second hose is used to transmit the medium to the third nozzle.

[0019] As an optional embodiment of the silicon wafer oscillating acid etching device of the present invention, wherein: the lower end of the connecting rod is respectively equipped with a second piston column and a first piston column, and the lower end of the first piston column is connected to the upper end of the second piston plate;

[0020] The lower end of the second piston rod is slidably connected to a sliding column, and the lower end of the sliding column is connected to the upper end of the first piston plate.

[0021] As an optional embodiment of the silicon wafer oscillating acid etching device of the present invention, one end of the rotating shaft is further connected to a gear, and a rack plate is installed on one side of the connecting rod, the rack plate being used to mesh with the gear.

[0022] As an optional embodiment of the silicon wafer oscillating acid etching device of the present invention, wherein: one end of the rotating shaft is further connected to a torque spring, and one end of the torque spring is connected to one end of the clamp frame;

[0023] The rack plate includes a vertical bar and a plurality of racks, with a plurality of racks installed at one end of the vertical bar, and a distance between each pair of racks.

[0024] As an optional embodiment of the silicon wafer oscillating acid etching device of the present invention, a cylinder is further installed inside the inner wall of the fixture frame, the upper end of the cylinder is connected to the outer surface of the connecting rod, and the cylinder is used to drive the connecting rod to slide up and down.

[0025] As an optional embodiment of the silicon wafer swing acid etching device of the present invention, wherein: the lower end of the second swing arm is connected to a connecting frame, and the lower end of the connecting frame is rotatably connected to a rotating shaft;

[0026] One end of the storage frame is connected to one end of the rotating shaft.

[0027] As an optional embodiment of the silicon wafer oscillating acid etching device of the present invention, wherein: the lower end face of the clamp frame and the upper end face of the storage frame are provided with an angle;

[0028] One end of the clamp frame is tilted downwards.

[0029] The present invention has the following beneficial effects:

[0030] 1. The silicon wafer oscillating acid etching device uses a motor to rotate and oscillate a first shaft, which in turn drives a first swing arm to rotate and oscillate. The first swing arm drives a second shaft and a second swing arm to rotate and oscillate, and the second swing arm drives a storage frame and a clamp frame to oscillate. This allows the clamp frame to move the wafer within the acid etching tank, thereby allowing the liquid to wash the wafer and improve the cleaning effect.

[0031] 2. The silicon wafer oscillating acid etching device uses sliding striking plates to strike the surface of the pickling solution, thereby creating water waves on the surface. These water waves impact the wafer, ensuring that the pickling solution effectively washes the wafer with appropriate force to avoid damaging it. This, combined with the oscillating cleaning of the fixture frame, further improves the cleaning of the wafer.

[0032] 3. The silicon wafer oscillating acid etching device uses a second nozzle to spray dissolved gas to form bubbles. These bubbles fall to the liquid surface and then burst, creating a second layer of ripple effect. This, combined with the ripple effect created by the tapping of the tapping plate, helps to clean the wafer more effectively. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0034] Figure 2 This is a schematic diagram of the V-shaped plate and rotating shaft of the present invention.

[0035] Figure 3 This is a schematic diagram of the structure of the drive shaft cylinder of the present invention.

[0036] Figure 4 This is a side view of the V-shaped plate and the rotation axis of the present invention.

[0037] Figure 5 This is a schematic diagram of the fixture frame of the present invention.

[0038] In the diagram: 1. Connecting block; 2. Motor; 3. First shaft; 4. First swing arm; 5. Second shaft; 6. Second swing arm; 7. Connecting frame; 8. Rotating shaft; 9. Storage frame; 10. Clamp frame; 11. Slot; 12. Cleaning chamber; 13. V-shaped plate; 14. Beating plate; 15. Rotating shaft; 16. First spray hole; 17. Second spray hole; 18. Third spray hole; 19. Drive shaft cylinder; 20. Liquid storage chamber; 21. First air chamber; 22. Second air chamber; 23. First piston plate; 24. Second piston plate; 25. First piston column; 26. Sliding column; 27. Second piston column; 28. First hose; 29. ​​Second hose; 30. Gear; 31. Torque spring; 32. Connecting rod; 33. Cylinder; 34. Third piston plate; 35. Third hose; 36. Rack plate. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] Example 1

[0041] Please see Figures 1-2 One type of silicon wafer oscillating acid etching device includes:

[0042] Connector block 1;

[0043] Motor 2 is mounted on one end of connecting block 1, and the other end of connecting block 1 is rotatably connected to first shaft 3. The output shaft of motor 2 is connected to one end of first shaft 3.

[0044] The first swing arm 4 has one end connected to the other end of the first shaft 3. The first swing arm 4 is rotatably connected to the second shaft 5, and the second swing arm 6 is installed at one end of the second shaft 5.

[0045] Storage frame 9 is located at one end of the second swing arm 6, and the upper end of the storage frame 9 is fastened with a clamp frame 10.

[0046] The fixture frame 10 has several slots 11 for storing wafers inside, and a cleaning chamber 12 is provided between every two slots 11.

[0047] A V-shaped plate 13 is installed inside the fixture frame 10. The V-shaped plate 13 is used to spray dissolving gas upward to agitate the cleaning fluid inside the fixture frame 10 and impact it onto the wafer.

[0048] Several tapping plates 14 are also installed at the upper end of the fixture frame 10. The tapping plates 14 are located at each cleaning chamber 12. By sliding the tapping plates 14 up and down, they tap the cleaning fluid inside the fixture frame 10 to form water waves, which then impact the wafer.

[0049] according to Figure 1 As shown, several wafers are inserted into slots 11, with a cleaning chamber 12 between every two wafers. This allows the cleaning solution to flow through the cleaning chambers 12, thus achieving flow cleaning of the wafers. Subsequently, the motor 2 rotates, driving the first shaft 3 to rotate and swing. The first shaft 3 drives the first swing arm 4 to rotate and swing. The first swing arm 4 drives the second shaft 5 and the second swing arm 6 to rotate and swing. The second swing arm 6 drives the storage frame 9 and the clamp frame 10 to swing, causing the clamp frame 10 to move the wafers within the pickling tank, thereby allowing the liquid to wash the wafers and improving the cleaning effect.

[0050] Furthermore, as the wafer oscillates within the pickling tank, it leaps out of the pickling solution surface, and then, through up-and-down sliding and tapping of wafer 14, according to... Figure 2 As shown, by sliding the tapping plate 14 up and down, the tapping plate 14 taps the surface of the pickling solution, thereby forming water waves on the surface of the solution. Through the impact of the water waves, the pickling solution can both impact and rinse the wafer, and the impact force is appropriate so as not to damage the wafer. This assists the swing cleaning of the fixture frame 10 to further clean the wafer better.

[0051] Furthermore, according to Figure 2As shown, a V-shaped plate 13 is also installed inside the fixture frame 10. A second nozzle 17 is provided at the upper end of the V-shaped plate 13. Dissolving gas is sprayed through the second nozzle 17 to form bubbles. The bubbles fall to the liquid surface and then burst, thus forming a second layer of ripple effect. This, together with the patting of the patting plate 14, forms ripples and helps to clean the wafer better.

[0052] It should be noted that each end of the fixture frame 10 is equipped with a striking plate 14. The striking plates 14, which are arranged opposite each other, strike the liquid surface to generate two opposing ripples. There is a gap between the movement of the two striking plates 14. This allows the first striking plate 14 to strike from left to right and generate ripples that impact the wafer. Then the second striking plate 14 strikes from right to left and generates ripples that impact the wafer. The two striking plates 14 strike alternately, thus forming a larger striking range and increasing the impact cleaning area.

[0053] It should be noted that the solubility of dissolved gases in pickling solutions is affected by temperature and pressure, resulting in a decrease in gas solubility and the precipitation of supersaturated gas as bubbles.

[0054] Furthermore, the lower end of the second swing arm 6 is connected to a connecting frame 7, and the lower end of the connecting frame 7 is rotatably connected to a rotating shaft 8;

[0055] One end of the storage box 9 is connected to one end of the rotating shaft 8;

[0056] An angle is provided between the lower end face of the clamp frame 10 and the upper end face of the storage frame 9;

[0057] One end of the clamp frame 10 is tilted downward.

[0058] Example 2

[0059] This embodiment is an improvement upon embodiment 1. For details, please refer to [link / reference]. Figures 1-2 The upper end of the fixture frame 10 is also rotatably connected to a rotating shaft 15, and the two ends of the rotating shaft 15 are provided with first spray holes 16, which spray cleaning fluid onto the wafer.

[0060] according to Figure 2 As shown, a rotating shaft 15 is rotatably connected to the upper end of the fixture frame 10. Cleaning fluid is sprayed through the first nozzle 16, thereby using the cleaning fluid sprayed from the first nozzle 16 to rinse the wafer. When the cleaning fluid falls to the upper part of the liquid surface, the bubbles on the liquid surface will be washed and broken by the cleaning fluid, thereby causing all the bubbles to break and generate ripples that impact the wafer.

[0061] Example 3

[0062] This embodiment is an improvement upon embodiment 2. For details, please refer to [link / reference]. Figures 1-4The upper end of the V-shaped plate 13 is provided with two second spray holes 17, and the upper end of the V-shaped plate 13 is also provided with a third spray hole 18. The third spray hole 18 is located between the two second spray holes 17, and the distance between the two second spray holes 17 is the same as the size of the cleaning chamber 12.

[0063] according to Figure 4 As shown, its V-shaped plate 13 is V-shaped, and the second nozzles 17 on both sides of the V-shaped plate 13 are spaced at the same distance as the width of the cleaning chamber 12. This allows the bubbles generated by the second nozzles 17 to float upwards as close to the wafer as possible, so that the broken bubbles can impact and clean the wafer to the maximum extent.

[0064] Example 4

[0065] This embodiment is an improvement upon embodiment 3. For details, please refer to [link / reference]. Figures 1-5 The inner wall of the clamp frame 10 is also equipped with a drive shaft cylinder 19, and the drive shaft cylinder 19 is provided with a liquid storage chamber 20, a first air chamber 21 and a second air chamber 22 in sequence.

[0066] A connecting rod 32 is installed at the lower end of the tapping plate 14. The lower end of the connecting rod 32 is slidably connected to the liquid storage chamber 20. A third piston plate 34 is also installed on the outer surface of the connecting rod 32. The third piston plate 34 is slidably connected to the inside of the liquid storage chamber 20. A third hose 35 is also connected to one end of the drive shaft cylinder 19. One end of the third hose 35 is connected to one end of the rotating shaft 15.

[0067] The second piston plate 24 is slidably connected inside the second air chamber 22. A first hose 28 is also installed at one end of the drive shaft cylinder 19. The first hose 28 is connected to the V-shaped plate 13 and is used to transmit the medium to the drive shaft cylinder 19.

[0068] The first piston plate 23 is slidably connected inside the first air chamber 21. A second hose 29 is also installed at one end of the drive shaft cylinder 19. One end of the second hose 29 is connected to the V-shaped plate 13. The second hose 29 is used to transmit the medium to the third nozzle 18.

[0069] The lower end of the connecting rod 32 is respectively equipped with a second piston rod 27 and a first piston rod 25, and the lower end of the first piston rod 25 is connected to the upper end of the second piston plate 24.

[0070] The lower end of the second piston rod 27 is slidably connected to a sliding rod 26, and the lower end of the sliding rod 26 is connected to the upper end of the first piston plate 23.

[0071] Driver: According to Figure 2 and Figure 3 As shown, the cylinder 33 drives the connecting rod 32 to slide up or down, thereby causing the connecting rod 32 to drive the beater 14 to beat the liquid surface and form ripples;

[0072] according to Figure 2 and Figure 3 As shown, when the connecting rod 32 slides upward, the connecting rod 32 drives the third piston plate 34 to slide upward. The upward sliding of the third piston plate 34 squeezes the inside of the liquid storage chamber 20, thereby squeezing the liquid inside the liquid storage chamber 20 to the third hose 35, and then the liquid is transmitted to the first nozzle 16 through the third hose 35 and sprayed out.

[0073] When the connecting rod 32 slides downward, it drives the second piston column 27 and the first piston column 25 to slide downward. The first piston column 25 drives the second piston plate 24 to slide downward, and the second piston plate 24 compresses the dissolved gas inside the second gas chamber 22 to the first hose 28. The dissolved gas is then transmitted to the second nozzle 17 through the first hose 28, whereby bubbles are ejected. The second piston column 27 drives the first piston plate 23 to slide downward, and the first piston plate 23 compresses the dissolved gas inside the first gas chamber 21 into the second hose 29. The dissolved gas is then transmitted to the V-shaped plate 13 through the second hose 29, and ejected through the third nozzle 18. Since the third nozzle 18 is located between the two second nozzles 17, the bubbles ejected from the third nozzle 18 compress the bubbles ejected from the second nozzles 17 on both sides, bringing them closer to the wafer. This allows a large number of bubbles to better impact and clean the wafer.

[0074] It should be noted that a sliding column 26 is slidably connected to the lower end of the second piston column 27. Therefore, when the connecting rod 32 drives the second piston column 27 to slide downward, its first piston plate 23 remains temporarily stationary. At this time, the connecting rod 32 will drive the first piston column 25 and the second piston plate 24 to squeeze the inside of the second gas chamber 22, so that the second nozzle 17 will first spray bubbles and float to the liquid surface. Then, when the second piston column 27 touches the sliding column 26, the second piston column 27 pushes the sliding column 26 to squeeze the gas inside the first gas chamber 21, so that the third nozzle 18 sprays bubbles to the middle of the bubbles sprayed by the two second nozzles 17, thus pushing the bubbles sprayed by the second nozzles 17 closer to the wafer.

[0075] It should be noted that three check valves are also installed at the other end of the drive shaft cylinder 19, and one end of each check valve is connected to a transmission hose. The transmission hose is connected to the storage medium cylinder. The three check valves are respectively connected to the liquid storage chamber 20, the first air chamber 21, and the second air chamber 22. Thus, when the first piston plate 23, the second piston plate 24, and the third piston plate 34 are reset, the medium can be drawn from the check valves through the first piston plate 23, the second piston plate 24, and the third piston plate 34 to replenish the medium.

[0076] One-way valves are also installed inside the second hose 29, the first hose 28, and the third hose 35.

[0077] Example 5

[0078] This embodiment is an improvement upon embodiment 4. For details, please refer to [link / reference]. Figures 1-5 One end of the rotating shaft 15 is also connected to a gear 30, and a rack plate 36 is installed on one side of the connecting rod 32. The rack plate 36 is used to mesh with the gear 30.

[0079] One end of the rotating shaft 15 is also connected to a torque spring 31, and one end of the torque spring 31 is connected to one end of the clamp frame 10.

[0080] The rack plate 36 includes a vertical bar and a number of racks. A number of racks are installed at one end of the vertical bar, and there is a distance between each pair of racks.

[0081] A cylinder 33 is also installed inside the inner wall of the clamp frame 10. The upper end of the cylinder 33 is connected to the outer surface of the connecting rod 32. The cylinder 33 is used to drive the connecting rod 32 to slide up and down.

[0082] according to Figure 3 and Figure 4 As shown, when the cylinder 33 slides upward, the connecting rod 32 will also drive the rack plate 36 to slide upward. The rack plate 36 meshes with the gear 30, thereby causing the gear 30 to drive the rotating shaft 15 to rotate, which in turn causes the rotating shaft 15 to drive the first spray hole 16 to rotate and spray the cleaning fluid.

[0083] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0084] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A silicon wafer oscillating acid etching device, characterized in that, include: Connector block (1); Motor (2), the motor (2) is installed at one end of the connecting block (1), and the other end of the connecting block (1) is rotatably connected to the first shaft (3), and the output shaft of the motor (2) is connected to one end of the first shaft (3); First swing arm (4), one end of the first swing arm (4) is connected to the other end of the first shaft (3), and a second shaft (5) is rotatably connected to one side of the first swing arm (4), and a second swing arm (6) is installed at one end of the second shaft (5). Storage frame (9), the storage frame (9) is set at one end of the second swing arm (6), and the upper end of the storage frame (9) is fastened to a clamp frame (10). The fixture frame (10) has a plurality of slots (11) for storing wafers inside, and a cleaning cavity (12) is provided between every two slots (11). The fixture frame (10) is equipped with a V-shaped plate (13), which is used to spray dissolved gas upward to agitate the cleaning fluid inside the fixture frame (10) and impact it onto the wafer. The upper end of the fixture frame (10) is also equipped with several tapping plates (14), which are located at each cleaning chamber (12). By sliding the tapping plates (14) up and down, they tap the cleaning fluid inside the fixture frame (10) to form water waves, which then impact the wafer.

2. The silicon wafer oscillating acid etching apparatus according to claim 1, characterized in that: The upper end of the fixture frame (10) is also rotatably connected to a rotating shaft (15), and the two ends of the rotating shaft (15) are provided with first spray holes (16), which spray cleaning fluid onto the wafer.

3. The silicon wafer oscillating acid etching apparatus according to claim 2, characterized in that: The upper end of the V-shaped plate (13) is provided with two second spray holes (17), and the upper end of the V-shaped plate (13) is also provided with a third spray hole (18). The third spray hole (18) is located between the two second spray holes (17), and the distance between the two second spray holes (17) is the same as the size of the cleaning chamber (12).

4. The silicon wafer oscillating acid etching apparatus according to claim 3, characterized in that: The inner wall of the clamp frame (10) is also equipped with a drive shaft cylinder (19), and the drive shaft cylinder (19) is provided with a liquid storage chamber (20), a first air chamber (21) and a second air chamber (22) in sequence. The lower end of the striking plate (14) is equipped with a connecting rod (32), the lower end of the connecting rod (32) is slidably connected to the liquid storage chamber (20), and a third piston plate (34) is also installed on the outer surface of the connecting rod (32), the third piston plate (34) is slidably connected to the inside of the liquid storage chamber (20), and a third hose (35) is also connected to one end of the drive shaft cylinder (19), one end of the third hose (35) is connected to one end of the rotating shaft (15); The second air chamber (22) is slidably connected to a second piston plate (24), and a first hose (28) is also installed at one end of the drive shaft cylinder (19). The first hose (28) is connected to a V-shaped plate (13) and is used to transmit a medium to the drive shaft cylinder (19). The first air chamber (21) is slidably connected to a first piston plate (23), and a second hose (29) is also installed at one end of the drive shaft cylinder (19). One end of the second hose (29) is connected to a V-shaped plate (13), and the second hose (29) is used to transmit the medium to the third nozzle (18).

5. The silicon wafer oscillating acid etching apparatus according to claim 4, characterized in that: The lower end of the connecting rod (32) is respectively equipped with a second piston rod (27) and a first piston rod (25), and the lower end of the first piston rod (25) is connected to the upper end of the second piston plate (24); The lower end of the second piston rod (27) is slidably connected to a slide rod (26), and the lower end of the slide rod (26) is connected to the upper end of the first piston plate (23).

6. The silicon wafer oscillating acid etching apparatus according to claim 4, characterized in that: One end of the rotating shaft (15) is also connected to a gear (30), and a rack plate (36) is installed on one side of the connecting rod (32), the rack plate (36) being used to mesh with the gear (30).

7. The silicon wafer oscillating acid etching apparatus according to claim 6, characterized in that: One end of the rotating shaft (15) is also connected to a torque spring (31), and one end of the torque spring (31) is connected to one end of the clamp frame (10); The rack plate (36) includes a vertical bar and a plurality of racks, with a plurality of racks installed at one end of the vertical bar, and a distance between each pair of racks.

8. The silicon wafer oscillating acid etching apparatus according to claim 7, characterized in that: A cylinder (33) is also installed inside the inner wall of the clamp frame (10). The upper end of the cylinder (33) is connected to the outer surface of the connecting rod (32). The cylinder (33) is used to drive the connecting rod (32) to slide up and down.

9. The silicon wafer oscillating acid etching apparatus according to claim 8, characterized in that: The lower end of the second swing arm (6) is connected to a connecting frame (7), and the lower end of the connecting frame (7) is rotatably connected to a rotating shaft (8). One end of the storage frame (9) is connected to one end of the rotating shaft (8).

10. The silicon wafer oscillating acid etching apparatus according to claim 9, characterized in that: The lower end face of the clamp frame (10) and the upper end face of the storage frame (9) are provided with an angle; One end of the clamp frame (10) is tilted downward.

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