Desorption device and method of electrostatic chuck, electronic equipment and storage medium

Abstract

The invention discloses a desorption device and method of an electrostatic chuck, electronic equipment and a storage medium. The desorption device of the electrostatic chuck comprises a controller and an auxiliary discharge module, the auxiliary discharge module comprises a controlled switch, a blocking capacitor and an adjustable damping resistance network which are connected in sequence; the controlled switch is connected with the controller and the electrostatic chuck, responds to a driving control signal sent by the controller, and connects or disconnects the auxiliary discharge path in a desorption stage; the blocking capacitor is used for blocking radio frequency energy from entering the auxiliary discharge path in the process stage; the adjustable damping resistance network is connected with a grounding reference point of the radio frequency matcher, and the adjustable damping resistance network is used for controlling the discharging speed of the blocking capacitor and avoiding oscillation; and the controller is used for controlling the controlled switch to be switched on or switched off in the desorption stage, optimizing the discharge parameters according to the feedback signal, sending a driving control signal and transmitting the driving control signal to the controlled switch. According to the invention, residual charges of the electrostatic chuck can be discharged quickly, controllably and safely.

Description

Technical Field

[0001] This invention relates to the field of semiconductor process technology, and in particular to a desorption device and method for an electrostatic chuck, an electronic device, and a storage medium. Background Technology

[0002] In semiconductor manufacturing processes, electrostatic chucks (ESCs) are widely used to fix and support wafers during processes such as plasma etching and deposition. ESCs achieve wafer clamping by applying a high-voltage direct current to generate an electrostatic attraction between the electrodes and the wafer.

[0003] After the process is complete, the wafer needs to be released from the electrostatic chuck, a process called dechuck. However, during the dechuck stage, residual charges often remain on the electrostatic chuck electrodes and the wafer surface. If these residual charges are not discharged promptly and completely, the wafer may not be able to be successfully lifted due to residual electrostatic attraction, resulting in wafer pick-up delays, pick-up failures, or even wafer breakage. In addition, latent residual charges may also cause electrical damage to the devices on the wafer, affecting the yield of the final product.

[0004] In the prior art, for example, patent publication number CN101872733A discloses a system and method for sensing and removing residual charge on a processed semiconductor device. This solution uses a rising ejector pin assembly to contact the back of the wafer, utilizes grounded ejector pins to conduct away residual charge, and measures the discharge current in real time using a residual charge sensor to control the reverse discharge voltage. However, the discharge efficiency of this solution heavily depends on the quality of the physical contact between the ejector pin and the wafer; poor contact can lead to discharge failure. Furthermore, improper control of the reverse voltage poses a risk of introducing new charge or causing electrical damage. Additionally, the discharge parameters may not be universally applicable to wafers with different processes or materials, resulting in poor adaptability.

[0005] Therefore, how to provide a desorption solution that can quickly, controllably, and safely discharge residual charge from electrostatic chucks without relying on physical contact with the wafer is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0006] This invention provides a desorption device and method for electrostatic chucks, an electronic device, and a storage medium to solve the problems of high impedance, slow speed, reliance on physical contact, and risk of electrical damage in the desorption stage of electrostatic chucks. It can quickly, controllably, and safely release the residual charge of electrostatic chucks.

[0007] According to one aspect of the present invention, a desorption device for an electrostatic chuck is provided, which is applied in a semiconductor process chamber. The desorption device for the electrostatic chuck includes: a controller and an auxiliary discharge module, wherein the controller is connected between the electrostatic chuck and the auxiliary discharge module, and the auxiliary discharge module is connected between the power output terminal of the electrostatic chuck and the ground reference point of the radio frequency matching device. The auxiliary discharge module includes: a controlled switch, a DC blocking capacitor, and an adjustable damping resistor network connected in sequence; The controlled switch is connected to the controller and the electrostatic chuck. The controlled switch responds to the drive control signal sent by the controller and turns on or off the auxiliary discharge path during the desorption stage. The DC blocking capacitor is used to block radio frequency energy from entering the auxiliary discharge path during the process stage; The adjustable damping resistor network is connected to the ground reference point of the RF matching unit. The adjustable damping resistor network is used to control the discharge rate of the DC blocking capacitor to avoid oscillation. The controller is used to control the controlled switch to be turned on or off during the desorption stage, optimize the discharge parameters according to the feedback signal, send the drive control signal and transmit it to the controlled switch.

[0008] Optionally, the desorption device of the electrostatic chuck also includes: a voltage sensor; The voltage sensor is connected between the output end of the electrostatic chuck and the controller. The voltage sensor is used to monitor the residual charge level on the electrostatic chuck in real time and feed the monitoring results back to the controller.

[0009] Optionally, the controller is further configured to dynamically adjust the conduction duration or conduction frequency of the controlled switch or the resistance value of the adjustable damping resistor network based on the residual charge level fed back by the voltage sensor, so as to achieve on-demand discharge.

[0010] Optionally, the controlled switch is a high-voltage fast switch, which is used to complete the conduction or disconnection operation within milliseconds.

[0011] Optionally, the withstand voltage of the DC blocking capacitor is higher than the maximum residual voltage that the electrostatic chuck exhibits during the process.

[0012] Optionally, the ground reference point of the RF matching unit is reused as the discharge ground of the auxiliary discharge path.

[0013] According to another aspect of the present invention, a method for desorption of an electrostatic chuck is provided, applicable to a desorption apparatus for an electrostatic chuck as described in any one of the preceding aspects, the desorption method comprising: During the desorption stage, the auxiliary discharge path is activated by the controlled switch, connecting the power output terminal of the electrostatic chuck to the ground reference point of the radio frequency matching device. The discharge rate of the DC blocking capacitor is controlled by the adjustable damping resistor network. The voltage sensor monitors the residual charge level on the electrostatic chuck in real time and feeds it back to the controller. The controller dynamically adjusts the discharge parameters based on the monitoring results until the residual charge on the electrostatic chuck is completely discharged. After the DC blocking capacitor has discharged, the auxiliary discharge path is disconnected by the controlled switch.

[0014] Alternatively, the desorption method for electrostatic chucks may also include: The controller records the current-voltage curve during the discharge process of the DC blocking capacitor; By analyzing the characteristics of the current-voltage curve using the controller, potential faults such as insulation aging, electrode contamination, or grounding circuit deterioration of the electrostatic chuck can be inferred and warned of.

[0015] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising: At least one processor; and A memory communicatively connected to the at least one processor; wherein, The memory stores a computer program that can be executed by the at least one processor, which enables the at least one processor to perform the desorption method of the electrostatic chuck according to any embodiment of the present invention.

[0016] According to another aspect of the present invention, a computer-readable storage medium is provided, the computer-readable storage medium storing computer instructions for causing a processor to execute and implement the desorption method of the electrostatic chuck according to any embodiment of the present invention.

[0017] The technical solution of this invention provides an auxiliary discharge path that reuses the grounding reference point of the RF matching unit, realizing an efficient, controllable, and safe desorption device. By using the RF matching unit grounding reference point with the lowest and most stable internal impedance as the discharge ground, a green channel is established for residual charge, effectively reducing desorption waiting time and increasing equipment productivity without relying on physical contact. The controlled switch connects or disconnects the discharge path within milliseconds, providing not only a forced physical conductive path but also enabling on-demand triggering, reducing dependence on complex external grounds. The DC blocking capacitor is in a high-resistance state during the process stage, completely isolating RF energy and ensuring that the process is not interfered with. The adjustable damping resistor network controls the discharge speed, avoiding the risk of oscillation and electrical damage during the discharge process. In summary, this invention solves the technical problems of high impedance, slow speed, reliance on physical contact, and risk of electrical damage in the residual charge discharge path during the desorption stage of electrostatic chucks in the prior art, achieving the effect of quickly, controllably, and safely discharging residual charge from electrostatic chucks.

[0018] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of a desorption device for an electrostatic chuck according to an embodiment of the present invention; Figure 2 This is a flowchart of a desorption method for an electrostatic chuck according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of an electronic device that implements the method of the embodiments of the present invention. Detailed Implementation

[0021] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0022] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0023] Figure 1 This is a schematic diagram of the structure of a desorption device for an electrostatic chuck according to an embodiment of the present invention. (Refer to...) Figure 1 The present invention provides a desorption device for an electrostatic chuck, which is applied in a semiconductor process chamber. The desorption device for the electrostatic chuck includes a controller 10 and an auxiliary discharge module 20. The controller 10 is connected between the electrostatic chuck 30 and the auxiliary discharge module 20. The auxiliary discharge module 20 is connected between the power output terminal of the electrostatic chuck 30 and the ground reference point of the radio frequency matching device 40. The auxiliary discharge module 20 includes: a controlled switch 21, a DC blocking capacitor 22, and an adjustable damping resistor network 23 connected in sequence; The controlled switch 21 is connected to the controller 10 and the electrostatic chuck 30. The controlled switch 21 responds to the drive control signal sent by the controller 10 to turn on or off the auxiliary discharge path during the desorption stage. DC blocking capacitor 22 is used to block radio frequency energy from entering the auxiliary discharge path during the process stage; The adjustable damping resistor network 23 is connected to the ground reference point of the RF matching unit 40. The adjustable damping resistor network 23 is used to control the discharge speed of the DC blocking capacitor to avoid oscillation. The controller 10 is used to control the controlled switch 21 to be turned on or off during the desorption stage, optimize the discharge parameters according to the feedback signal, send the drive control signal and transmit it to the controlled switch 21.

[0024] Specifically, the auxiliary discharge path includes the auxiliary discharge module 20, which is actually a path from the bottom of the electrostatic chuck 30 to the auxiliary discharge module and then to the RF matching unit 40. One end of the controlled switch 21 is connected to the power output terminal of the controller 10 and the electrostatic chuck 30, and the other end is connected to the DC blocking capacitor 22. The controlled switch 21 is a high-voltage fast switch, which can respond to the drive control signal sent by the controller 10 within milliseconds, quickly connecting the auxiliary discharge path during the desorption stage, or quickly disconnecting the auxiliary discharge path during the process stage and after the discharge is completed.

[0025] A DC blocking capacitor 22 is connected in series between the controlled switch 21 and the adjustable damping resistor network 23. During the plasma process, the controlled switch 21 is open, and the DC blocking capacitor 22 blocks radio frequency energy from entering the auxiliary discharge path, ensuring that the process is not interfered with. One end of the adjustable damping resistor network 23 is connected to the DC blocking capacitor 22, and the other end is connected to the ground reference point of the radio frequency matching unit 40. This ground reference point is the optimal low impedance ground designed in the equipment to ensure radio frequency stability. In this embodiment, it is reused as the discharge ground of the auxiliary discharge path, providing the lowest impedance discharge path for residual charge. The adjustable damping resistor network 23 is used to control the rate of current change during the discharge process to avoid overvoltage or electrical damage caused by LC oscillation. The controller 10 is used to control the on or off of the controlled switch 21 during the desorption stage, optimize the discharge parameters according to the feedback signal, and send corresponding drive control signals to the controlled switch 21.

[0026] Traditional desorption methods lack real-time monitoring of residual charge and employ fixed-duration discharge, which can easily lead to insufficient discharge. The auxiliary discharge module in this embodiment is an intelligent module comprising a high-voltage fast-controlled switch, a DC blocking capacitor, and an adjustable damping resistor network. This module operates in a high-resistance state during the process phase, completely isolating the radio frequency; it only momentarily switches to an ultra-low-resistance state during the desorption phase, establishing a green channel for charge; ensuring thorough charge discharge, reducing the desorption failure rate related to residual charge to near zero, and eliminating subsequent process defects caused by latent charges, thereby improving overall yield.

[0027] The technical solution of this invention provides an auxiliary discharge path that reuses the grounding reference point of the RF matching unit, realizing an efficient, controllable, and safe desorption device. By using the RF matching unit grounding reference point with the lowest and most stable internal impedance as the discharge ground, a green channel is established for residual charge, effectively reducing desorption waiting time and increasing equipment productivity without relying on physical contact. The controlled switch connects or disconnects the discharge path within milliseconds, providing not only a forced physical conductive path but also enabling on-demand triggering, reducing dependence on complex external grounds. The DC blocking capacitor is in a high-resistance state during the process stage, completely isolating RF energy and ensuring that the process is not interfered with. The adjustable damping resistor network controls the discharge speed, avoiding the risk of oscillation and electrical damage during the discharge process. In summary, this invention solves the technical problems of high impedance, slow speed, reliance on physical contact, and risk of electrical damage in the residual charge discharge path during the desorption stage of electrostatic chucks in the prior art, achieving the effect of quickly, controllably, and safely discharging residual charge from electrostatic chucks.

[0028] Continue to refer to Figure 1 Optionally, the desorption device of the electrostatic chuck also includes: a voltage sensor 50; Voltage sensor 30 is connected between the output terminal of electrostatic chuck 30 and controller 10. Voltage sensor 50 is used to monitor the residual charge level on electrostatic chuck 30 in real time and feed the monitoring results back to controller 10.

[0029] Specifically, the voltage sensor 50 can be a high-impedance voltage sensor that feeds back the residual charge level on the electrostatic chuck 30 to the controller 10, ensuring complete voltage release. By monitoring the residual charge level in real time through the voltage sensor 50, the controller 10 dynamically adjusts the discharge parameters based on the feedback signal to achieve closed-loop feedback control, ensuring complete charge discharge and reducing the desorption failure rate related to residual charge to near zero.

[0030] This embodiment does not directly modify the main RF path, but adds a controlled auxiliary discharge path connected to the ground of the RF matching unit 40 between the power output terminal of the electrostatic chuck 30 and the ground reference point of the RF matching unit 40. At the same time, the DC blocking capacitor 22 and the adjustable damping resistor network 23 are connected in series in the auxiliary discharge path, which can also increase the feedback charge residual level of the high impedance voltage sensor.

[0031] Continue to refer to Figure 1 Optionally, the controller 10 is also used to dynamically adjust the conduction time or conduction frequency of the controlled switch 21 or the resistance value of the adjustable damping resistor network 23 according to the residual charge level fed back by the voltage sensor 30, so as to realize on-demand discharge.

[0032] Specifically, the controller 10 adjusts the conduction time of the controlled switch 21 based on the residual charge level fed back by the voltage sensor 30. In some cases, due to the insulation characteristics of the electrostatic chuck 30 or the influence of the wafer material, the discharge curve may exhibit slow decay or tailing. To address this, the controller 10 introduces a dynamic adjustment mechanism: if the residual voltage still does not drop to the safe voltage threshold within the preset maximum discharge time, the controller 10 determines that the current discharge efficiency is insufficient, automatically extends the conduction time of the controlled switch 21, and continues to monitor the voltage during the extended period. If the voltage still cannot be met after the extension, other adjustment strategies are switched (e.g., adjusting the resistance or increasing the number of conductions).

[0033] In some processes, a single long-duration discharge may introduce additional charge migration risks, or result in localized residues due to uneven charge distribution inside the electrostatic chuck 30. To address this, the controller 10 can employ a pulsed discharge strategy, which involves repeatedly and briefly turning on the controlled switch 21, then turning it off for a certain period after each turn to allow charge redistribution before continuing the discharge.

[0034] The controller 10 dynamically adjusts the resistance value of the adjustable damping resistor network 23 based on the real-time voltage and its rate of change fed back by the voltage sensor 30, so as to achieve the optimal discharge curve.

[0035] In practical applications, the controller 10 can comprehensively utilize the above three adjustment methods to achieve optimal discharge effect and realize intelligent control of on-demand discharge. Based on the actual residual charge level, the discharge parameters are adaptively optimized to achieve true on-demand discharge, ensuring both the thoroughness of discharge and controlling the discharge time within the optimal range, thereby improving production capacity while ensuring device safety.

[0036] Optionally, the controlled switch is a high-voltage fast switch, which is used to complete the on or off operation within milliseconds.

[0037] Specifically, a millisecond-level controlled switch is added between the power output of the electrostatic chuck and the ground reference point of the RF matching unit, and the ground reference point of the RF matching unit is reused to provide a near-optimal discharge loop to turn the auxiliary discharge path on or off within milliseconds. This not only provides a forced physical conductive path, but also enables on-demand triggering and reduces dependence on complex external grounding.

[0038] Continue to refer to Figure 1 Optionally, the withstand voltage of the DC blocking capacitor 22 is higher than the maximum residual voltage of the electrostatic chuck 30 during the process.

[0039] Specifically, the withstand voltage of the DC blocking capacitor 22 is designed to be higher than the maximum residual voltage that the electrostatic chuck 30 may have during the process, in order to ensure absolute safety and ensure that radio frequency energy cannot enter this auxiliary discharge path during the process.

[0040] Optionally, the ground reference point of the RF matching unit can be reused as the bleed ground of the auxiliary bleed path.

[0041] Specifically, the ground reference point of the RF matching unit is the ground point with the lowest impedance and the most stable ground point in the equipment. It is reused as the discharge ground for auxiliary discharge path and can provide a near-optimal discharge loop for residual charge.

[0042] Traditional grounding paths are not optimized for rapid discharge, resulting in long desorption times for high-resistivity wafers and becoming a bottleneck in production capacity. The grounding reference point of the RF matching unit in this embodiment is an optimal low-impedance ground designed to ensure RF stability, effectively reducing desorption waiting time and improving equipment productivity.

[0043] Embodiments of the present invention also provide a method for desorption of electrostatic chucks, applicable to the desorption device for electrostatic chucks in any embodiment of the present invention. Figure 2This is a flowchart of a method for de-adhesion of an electrostatic chuck according to an embodiment of the present invention. This embodiment is applicable to the de-adhesion of electrostatic chucks in the case of multiplexing RF matching ground. The method can be executed by a de-adhesion device for the electrostatic chuck, which can be implemented in hardware and / or software and can be configured in an electronic device. Figure 2 As shown, the method includes: S110. During the desorption stage, the auxiliary discharge path is opened by a controlled switch to connect the power output terminal of the electrostatic chuck to the ground reference point of the RF matching unit.

[0044] Specifically, during the process phase, the controller controls the controlled switch to disconnect the auxiliary discharge path. At this time, the DC blocking capacitor is in a high-resistance state, completely blocking radio frequency energy from entering the auxiliary discharge path, ensuring the normal operation of the plasma process. After the process ends, the desorption phase begins. The controller sends a conduction control signal to the controlled switch according to a preset program or an external trigger signal. The controlled switch quickly turns on, connecting the power output of the electrostatic chuck to the ground reference point of the RF matching unit, forming the auxiliary discharge path.

[0045] S120: The discharge rate of the DC blocking capacitor is controlled by an adjustable damping resistor network.

[0046] Specifically, residual charge on the electrostatic chuck is discharged through an auxiliary discharge path. During the discharge process, an adjustable damping resistor network adjusts the discharge speed according to the controller settings to avoid oscillation and overshoot.

[0047] S130: The residual charge level on the electrostatic chuck is monitored in real time by a voltage sensor and fed back to the controller.

[0048] Specifically, the voltage sensor monitors the residual charge level on the electrostatic chuck in real time and feeds back the monitored voltage value to the controller.

[0049] S140 The controller dynamically adjusts the discharge parameters based on the monitoring results until the residual charge on the electrostatic chuck is completely discharged.

[0050] Specifically, the controller compares the received voltage value with a preset safety threshold. If the residual voltage is higher than the safety threshold, it returns to step S120 to continue discharging. The controller can also dynamically adjust the discharge parameters (such as extending the conduction time, adjusting the damping network resistance, etc.) based on the feedback voltage change trend until the residual charge is completely discharged.

[0051] S150. After the DC blocking capacitor has discharged, the auxiliary discharge path is disconnected by the controlled switch.

[0052] Specifically, when the residual voltage fed back by the voltage sensor is lower than the safety threshold, the controller sends a disconnection control signal to the controlled switch to cut off the auxiliary discharge path and end the desorption process.

[0053] The electrostatic chuck desorption method provided in this embodiment of the invention is used to control the electrostatic chuck desorption device provided in this embodiment of the invention. Therefore, the above-mentioned electrostatic chuck desorption method and electrostatic chuck desorption device have the same beneficial effects, and will not be described again here.

[0054] Alternatively, the desorption method for electrostatic chucks may also include: The current-voltage curve during the discharge process of the DC blocking capacitor is recorded by the controller; By analyzing the characteristics of the current-voltage curve through the controller, potential faults such as insulation aging, electrode contamination, or grounding circuit deterioration of the electrostatic chuck can be inferred and warned.

[0055] Specifically, during the discharge process of the DC blocking capacitor, the controller synchronously records the current-voltage curve of the discharge circuit. The controller's built-in analysis module performs feature analysis on the recorded current-voltage curve using algorithms, extracting parameters such as time constant, peak value, and attenuation characteristics. The extracted feature parameters are compared with a pre-stored database of normal discharge curve features. If the feature parameters deviate from the normal range, such as a significant increase in the discharge time constant or abnormal oscillations, the controller can determine that the electrostatic chuck's insulation layer may have aging, electrode contamination, or deterioration of the grounding circuit, indicating a potential fault. Based on the analysis results, the controller outputs fault warning information, prompting equipment maintenance personnel to perform predictive maintenance, transforming reactive maintenance into predictive maintenance, thereby avoiding production losses caused by sudden failures.

[0056] Figure 3 A schematic diagram of an electronic device 1, which can be used to implement embodiments of the present invention, is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices (e.g., helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the invention described and / or claimed herein.

[0057] like Figure 3As shown, the electronic device 1 includes at least one processor 11 and a memory, such as a read-only memory (ROM) 12 or a random access memory (RAM) 13, communicatively connected to the at least one processor 11. The memory stores computer programs executable by the at least one processor. The processor 11 can perform various appropriate actions and processes based on the computer program stored in the ROM 12 or loaded into the RAM 13 from storage unit 18. The RAM 13 can also store various programs and data required for the operation of the electronic device 1. The processor 11, ROM 12, and RAM 13 are interconnected via a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0058] Multiple components in electronic device 1 are connected to I / O interface 15, including: input unit 16, such as keyboard, mouse, etc.; output unit 17, such as various types of monitors, speakers, etc.; storage unit 18, such as disk, optical disk, etc.; and communication unit 19, such as network card, modem, wireless transceiver, etc. Communication unit 19 allows electronic device 1 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0059] Processor 11 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. Processor 11 performs the various methods and processes described above, such as the de-adhesion method of an electrostatic chuck.

[0060] In some embodiments, the method for de-attaching the electrostatic chuck can be implemented as a computer program tangibly contained in a computer-readable storage medium, such as storage unit 18. In some embodiments, part or all of the computer program can be loaded and / or installed on the electronic device 1 via ROM 12 and / or communication unit 19. When the computer program is loaded into RAM 13 and executed by processor 11, one or more steps of the method for de-attaching the electrostatic chuck described above can be performed. Alternatively, in other embodiments, processor 11 can be configured to perform the method for de-attaching the electrostatic chuck by any other suitable means (e.g., by means of firmware).

[0061] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), payload-programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.

[0062] Computer programs used to implement the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when executed by the processor, the computer programs cause the functions / operations specified in the flowcharts and / or block diagrams to be performed. The computer programs may be executed entirely on a machine, partially on a machine, or as a standalone software package, partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0063] In the context of this invention, a computer-readable storage medium can be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, apparatus, or device. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination thereof. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0064] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0065] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as data servers), or middleware components (e.g., application servers), or frontend components (e.g., user computers with graphical user interfaces or web browsers through which users can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., communication networks). Examples of communication networks include local area networks (LANs), wide area networks (WANs), blockchain networks, and the Internet.

[0066] A computing system can include clients and servers. Clients and servers are generally located far apart and typically interact through communication networks. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. The server can be a cloud server, also known as a cloud computing server or cloud host, which is a hosting product within the cloud computing service system to address the shortcomings of traditional physical hosts and VPS services, such as high management difficulty and weak business scalability.

[0067] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0068] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A desorption device for an electrostatic chuck, used in a semiconductor process chamber, characterized in that, include: A controller and an auxiliary discharge module are provided, wherein the controller is connected between the electrostatic chuck and the auxiliary discharge module, and the auxiliary discharge module is connected between the power output terminal of the electrostatic chuck and the ground reference point of the RF matching device. The auxiliary discharge module includes: a controlled switch, a DC blocking capacitor, and an adjustable damping resistor network connected in sequence; The controlled switch is connected to the controller and the electrostatic chuck. The controlled switch responds to the drive control signal sent by the controller and connects or disconnects the auxiliary discharge path during the desorption stage. The DC blocking capacitor is used to block radio frequency energy from entering the auxiliary discharge path during the process stage; The adjustable damping resistor network is connected to the ground reference point of the RF matching unit. The adjustable damping resistor network is used to control the discharge rate of the DC blocking capacitor to avoid oscillation. The controller is used to control the controlled switch to be turned on or off during the desorption stage, optimize the discharge parameters according to the feedback signal, send the drive control signal and transmit it to the controlled switch.

2. The apparatus according to claim 1, characterized in that, Also includes: Voltage sensor; The voltage sensor is connected between the output end of the electrostatic chuck and the controller. The voltage sensor is used to monitor the residual charge level on the electrostatic chuck in real time and feed the monitoring results back to the controller.

3. The apparatus according to claim 2, characterized in that, The controller is also used to dynamically adjust the conduction duration or conduction frequency of the controlled switch or the resistance value of the adjustable damping resistor network based on the residual charge level fed back by the voltage sensor, so as to achieve on-demand discharge.

4. The apparatus according to claim 1, characterized in that, The controlled switch is a high-voltage fast switch, which is used to complete the conduction or disconnection operation within milliseconds.

5. The apparatus according to claim 1, characterized in that, The withstand voltage of the DC blocking capacitor is higher than the maximum residual voltage that the electrostatic chuck exhibits during the process.

6. The apparatus according to claim 1, characterized in that, The ground reference point of the RF matching unit is reused as the discharge ground of the auxiliary discharge path.

7. A method for desorption from an electrostatic chuck, characterized in that, The desorption device applied to the electrostatic chuck according to any one of claims 2-6, wherein the desorption method comprises: During the desorption stage, the auxiliary discharge path is activated by the controlled switch, connecting the power output terminal of the electrostatic chuck to the ground reference point of the radio frequency matching device. The discharge rate of the DC blocking capacitor is controlled by the adjustable damping resistor network. The voltage sensor monitors the residual charge level on the electrostatic chuck in real time and feeds it back to the controller. The controller dynamically adjusts the discharge parameters based on the monitoring results until the residual charge on the electrostatic chuck is completely discharged. After the DC blocking capacitor has discharged, the auxiliary discharge path is disconnected by the controlled switch.

8. The method according to claim 7, characterized in that, Also includes: The controller records the current-voltage curve during the discharge process of the DC blocking capacitor; By analyzing the characteristics of the current-voltage curve using the controller, potential faults such as insulation aging, electrode contamination, or grounding circuit deterioration of the electrostatic chuck can be inferred and warned of.

9. An electronic device, characterized in that, include: One or more processors; Memory, used to store one or more programs; When the one or more programs are executed by the one or more processors, the one or more processors implement the desorption method for the electrostatic chuck as described in any one of claims 7-8.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When executed by a processor, the computer program implements the desorption method for the electrostatic chuck as described in any one of claims 7-8.

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