Array suction nozzle device and closed-loop force control method thereof

Abstract

The invention relates to an array suction nozzle device and a closed-loop force control method thereof. The device comprises an integral frame, a plurality of groups of force control lifting assemblies, a suction nozzle assembly, a grating assembly and a Z-axis guide assembly, a plurality of containing cavities are formed in the frame, and all the components are installed in the containing cavities in a modularized and independent mode. The force control lifting assembly is of a series connection structure of a Z-axis driving piece, a lifting block, a connecting block and a cuboid strain type pressure sensor, the lifting block does not make direct contact with the connecting block, pressure is only transmitted through the sensor, and single-path independent closed-loop force control is achieved. The grating assembly realizes Z-direction height closed loop, and the Z-axis guide assembly ensures vertical motion precision. The control method comprises the steps of parameter presetting, synchronous material taking, independent height adjustment and closed-loop force control mounting. Independent program control and force control, height self-adaption and angle accurate correction of a single chip are achieved, a traditional spring structure is abandoned, the fatigue hidden danger is eliminated, the mounting precision, stability and yield are remarkably improved, and the multi-chip synchronous eutectic mounting device is suitable for multi-chip synchronous eutectic mounting.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device technology, and in particular to an array nozzle device and its closed-loop force control method. Background Technology

[0002] In high-end electronic manufacturing fields such as optical communication devices, eutectic bonding is a core technology for achieving highly reliable connections between photonic chips and substrates. For the mounting requirements of multiple photonic devices (PDs), existing technologies have been upgraded from the traditional "sequential placement, one-time eutectic bonding" process to a flexible array mounting solution. This solution uses floating modules composed of springs to compensate for Z-axis height differences, combined with a two-level force control strategy and intermediate reference visual attitude control, enabling simultaneous mounting of multiple PDs in a single operation. This significantly improves mounting efficiency, achieving positioning accuracy of ±3μm and rotation accuracy of ±0.5°.

[0003] However, existing flexible array mounting solutions have obvious technical defects, which have become bottlenecks restricting mounting accuracy, stability and process adaptability.

[0004] Chinese patent CN100579353C discloses a high-speed fully automatic chip and place machine array type placement head, which includes several cylinder modules distributed in a linear array. Each cylinder module can only control the extension and retraction by relying on the air pressure difference between the cylinders, but there is no closed-loop force control and the angle cannot be controlled independently. The array nozzle only supports overall rotation calibration, and the individual nozzles do not have an independent rotation mechanism, so they cannot compensate for the angle deviation of the individual PD and the individual posture error of the array assembly.

[0005] Chinese patent CN115442979B discloses a patch system and monitoring and control method for real-time pressure monitoring and feedback. It has only a single nozzle and can detect displacement and pressure through a grating and a pressure sensor. However, the pressure sensor is a miniature column pressure sensor. Although it is a strain gauge pressure sensor, its two ends are connected to a moving part and a connecting part, respectively. The moving part and the connecting part are L-shaped sheet metal parts. When under pressure, they will undergo elastic deformation, which makes the measured values ​​of displacement and pressure inaccurate and unable to truly reflect the magnitude of the pressure.

[0006] Chinese patent CN115866921B discloses a mounting module and its calibration method. The mounting module uses a first driving component to control the up-and-down movement of the driving head, a second driving component to control the rotation of the driving head, and an optical encoder in conjunction with an optical scale to detect the displacement changes of the mounting head. A compression spring provides compensation for the mounting pressure. In the calibration method, a pressure sensor detects the pressure of the mounting head, and the compression amount of the spring required to set the mounting pressure is obtained by combining this with the displacement changes obtained from the optical encoder, thus achieving calibration. This mounting module can only calibrate the mounting stroke before mounting. Force control is in an open-loop mode, lacking real-time force detection and closed-loop feedback. The mounting pressure is easily affected by mechanical wear and material height tolerances, making it unstable. If the product is changed, the mounting module needs to be recalibrated, consuming working time and lacking flexibility. Furthermore, after a period of operation, inaccuracies may occur due to spring wear, requiring recalibration again, further complicating its use.

[0007] Chinese patent CN121240428A discloses a flexible array nozzle module in which all flexible nozzle components are installed within a fixed mounting base, and the flexible nozzle components have no rotational freedom relative to the fixed mounting base. Each nozzle is elastically floated and installed using a first elastic element and a second elastic element. Force control adjustment is not programmable, relying on springs to achieve Z-axis floating and basic force control. The spring preload is fixed and requires manual mechanical adjustment, making it impossible to programmatically adjust the mounting pressure in real time. The springs have fatigue life risks; high-frequency reciprocating motion can easily cause metal fatigue, resulting in elastic decay, preload drift, jamming, or even breakage, reducing the long-term stability of the equipment and increasing maintenance costs and mass production risks.

[0008] Therefore, it is necessary to improve the equipment to enhance the coupling accuracy of the photonic integrated sensing module. Summary of the Invention

[0009] A primary objective of this invention is to construct an array nozzle device with independent drive, independent closed-loop force control, and vertical guidance functions. By integrating the force control lifting component, nozzle component, grating component, and Z-axis guide component into a single frame, and employing a unique structure where force is transmitted between the lifting block and the connecting block solely through a pressure sensor, each nozzle component can achieve independent lifting, independent closed-loop force control, and interference-free pressure signal detection. This fundamentally overcomes the shortcomings of existing array mounting mechanisms, such as reliance on passive spring floating, unprogrammable force control, easy pressure drift, and inability to adjust individual chips independently. It provides a fundamental structural guarantee for high-precision, high-consistency, and high-reliability multi-chip synchronous mounting.

[0010] The present invention achieves the above objectives through the following technical solution: an array nozzle device, comprising an overall frame, multiple force-controlled lifting components, multiple nozzle components, multiple grating components, and multiple Z-axis guide components; The overall frame is provided with multiple accommodating cavities. The force-controlled lifting assembly, the suction nozzle assembly, the grating assembly, and the Z-axis guide assembly are grouped and arranged in the accommodating cavities. Each force-controlled lifting assembly independently drives the corresponding suction nozzle assembly to move vertically up and down. The grating assembly detects the vertical height of the suction nozzle assembly in real time. The Z-axis guide assembly is used to guide the suction nozzle assembly to move up and down in the vertical direction. The force-controlled lifting assembly includes a Z-axis drive, a lifting block, a connecting block, and a pressure sensor. The Z-axis drive is fixed inside the accommodating cavity and drives the lifting block to move up and down. The pressure sensor is connected between the lifting block and the connecting block. The connecting block is fixedly connected to the nozzle assembly. The Z-axis drive controls the mounting pressure in a closed loop based on the real-time signal from the pressure sensor. The pressure sensor is a cuboid strain gauge pressure sensor, which includes a front side and a rear side. The rear side is fixed to the lifting block, and the front side is fixed to the connecting block.

[0011] Specifically, the connecting block includes an integrally connected cylindrical part and a square part; the cylindrical part surrounds and fixes the suction nozzle assembly; the rear part of the square part has an embedding groove, and the front part of the pressure sensor is tightly embedded in the embedding groove and fixedly connected.

[0012] Specifically, the lifting block includes an integrally formed intermediate support part and a front mounting part; the front mounting part is located in front of the intermediate support part and has an overall L-shaped horizontal cross-section structure, with the inner corner of the corner used to install the Z-axis guide assembly, and the outer plane of its long side used to fix the rear part of the pressure sensor.

[0013] Furthermore, the Z-axis drive component is a shaft linear motor, which includes a fixed stator and a movable component that can move up and down. Both ends of the movable component extend outside the stator. The lifting block also includes two rear end clamping parts, which are symmetrically connected to the rear side of the intermediate support part and respectively clamp and fix the upper and lower ends of the movable component.

[0014] Furthermore, the outer side of the intermediate support is provided with several weight-reducing grooves.

[0015] Specifically, the grating assembly includes a grating scale and a grating reading head arranged opposite to each other, one of which is fixed to the side wall of the accommodating cavity, and the other is fixed to the side of the lifting block.

[0016] Specifically, the Z-axis guide assembly includes a Z-axis slider and a Z-axis slide rail that cooperate with each other. One of the Z-axis slider and the Z-axis slide rail is fixed to the side wall of the accommodating cavity, and the other is fixed to the side of the lifting block.

[0017] Specifically, the overall frame includes a frame body and a number of first protrusions set on the frame body, with each lifting block corresponding to one first protrusion; a second protrusion is fixed on the side of the lifting block, and the first protrusion and the second protrusion are connected by an elastic element, which applies an upward pulling force to the second protrusion.

[0018] Specifically, the suction nozzle assembly includes a material-picking suction nozzle, a small C-axis rotation mechanism that independently drives the material-picking suction nozzle to rotate around the Z-axis, and an angle detection mechanism for real-time detection of the rotation angle of the material-picking suction nozzle. The angle detection mechanism provides real-time feedback of the rotation angle signal, forming an angle closed-loop control with the small C-axis rotation mechanism.

[0019] Specifically, it also includes a large C-axis rotation mechanism, which is an electric angular stage, comprising a servo motor, an arc-shaped base, an arc-shaped slide, and a worm gear mechanism. The arc-shaped slide is fixedly connected to the overall frame. The servo motor is mounted horizontally. The arc-shaped slide and the arc-shaped base are slidably fitted together via a circular arc guide rail. The worm gear mechanism is encapsulated inside the arc-shaped slide and the arc-shaped base, and converts the rotational motion of the servo motor into the rotational motion of the arc-shaped slide around the Z-axis.

[0020] Furthermore, the arc-shaped interface between the arc-shaped base and the arc-shaped slide is provided with a vernier scale, which is used to display the rotation angle of the arc-shaped slide relative to the arc-shaped base.

[0021] Another major objective of this invention is to provide a closed-loop force control method that matches the array nozzle device. Through the complete process of parameter preset, synchronous material picking, independent height adjustment, and closed-loop force control mounting, it realizes the collaborative operation of "single-channel independent control, global synchronous operation, and pressure closed-loop throughout" when mounting multiple chips.

[0022] This invention achieves the above objective through the following technical solution: a closed-loop force control method using the array nozzle device, characterized by the following steps: S1. Parameter preset: Based on the mounting height and mounting force at each position, the preset stroke and preset pressure of each lifting block can be set independently; S2. Synchronous material handling: The overall frame is moved, and each nozzle assembly synchronously picks up the chip under the control of the stress-controlled lifting assembly; S3. Independent height adjustment: With the assistance of the grating assembly, the Z-axis displacement data of the corresponding lifting block is collected in real time and fed back to the control system. The Z-axis drive unit drives the lifting block to move down according to the preset stroke, so as to realize the adaptive compensation of the height of a single chip and match their respective mounting height. S4. Closed-loop force control mounting: During the mounting process, each pressure sensor collects the Z-axis mounting pressure in real time and uploads it to the control system. The control system independently controls each Z-axis drive component to slightly adjust the extension and retraction based on the real-time pressure signal, so that the mounting pressure is stable within the set pressure range, realizing high-precision closed-loop force control. After holding the pressure for a preset time, the mounting is completed.

[0023] Specifically, before the synchronous material handling step, an overall posture pre-calibration is required: the vision mechanism acquires the current substrate image information and uploads it to the control system, and the large C-axis rotation mechanism drives the overall frame to rotate around the vertical axis according to the substrate image information, completing the overall angle coarse calibration of the array, so that the arrangement direction of all nozzle components is consistent with the substrate mounting position direction.

[0024] Specifically, independent height adjustment is performed simultaneously with independent angle fine-tuning: the vision mechanism acquires the current chip image information and uploads it to the control system. Each small C-axis rotation mechanism independently drives the corresponding pick-up nozzle to rotate according to the chip image information, and relies on the feedback signal from the angle detection mechanism to compensate for the deviation of the incoming angle of a single chip and the array assembly error.

[0025] The beneficial effects of the technical solution of this invention are: 1. The device uses a cuboid strain gauge pressure sensor and a Z-axis drive for closed-loop pressure control. The pressure is programmable and can be corrected in real time, with a chip breakage rate approaching zero. The all-electric structure replaces the traditional spring float, significantly improving equipment stability and service life, and reducing maintenance costs by more than 90%. The grating assembly detects displacement in real time, accurately compensating for material thickness differences, resulting in higher consistency in placement positions. Multiple nozzles are independently controlled, and the overall frame is uniformly installed, adapting to simultaneous placement of multiple chips, significantly improving efficiency.

[0026] 2. The closed-loop force control method utilizes this device to achieve collaborative operation of "single-channel independent control, global synchronous operation, and pressure closed loop throughout" when mounting multiple chips. While ensuring the efficiency of synchronous mounting of multiple chips, it significantly improves mounting accuracy, pressure stability, and chip yield. Attached Figure Description

[0027] Figure 1 This is a three-dimensional structural diagram of the array nozzle device in the embodiments of this application; Figure 2 This is a three-dimensional structural diagram of the large vertical axis rotation mechanism in the embodiments of this application; Figure 3 This is a diagram showing the connection relationship between the grating reading head, the Z-axis slide rail, and the overall frame in an embodiment of this application. Figure 4 This is a diagram showing the connection relationship between the force-controlled lifting assembly, the suction nozzle assembly, and the grating scale in the embodiments of this application; Figure 5This is a diagram showing the connection relationship between the force-controlled lifting assembly, the suction nozzle assembly, and the grating scale in the embodiments of this application; Figure 6 This is a top view of a single force-controlled lifting assembly, suction nozzle assembly, grating assembly, and Z-axis guide assembly in an embodiment of this application. Figure 7 This is a three-dimensional structural diagram of the nozzle assembly in the embodiments of this application; Figure 8 This is a three-dimensional structural diagram of the lifting block in an embodiment of this application; Figure 9 This is a three-dimensional structural diagram of the connecting block in an embodiment of this application.

[0028] The numbers in the diagram represent: 1-Large C-axis rotation mechanism, 11-Servo motor, 12-Arc-shaped base, 13-Arc-shaped slide, 14-Vernier scale; 2-Overall frame, 21-Frame body, 22-First protrusion; 3-Force-controlled lifting assembly, 31-Z-axis drive component, 311-Stator, 312-Motor, 32-Lifting block, 321-Intermediate support, 3211-Weight reduction groove, 322-Front-end mounting part, 323-Rear-end clamping part, 33-Connecting block, 331-Cylindrical part, 332-Square part, 333-Embedded groove, 34-Pressure sensor, 35-Second protrusion, 36-Elastic element; 4- Suction nozzle assembly, 41- Material handling suction nozzle, 42- Small C-axis rotation mechanism, 43- Angle detection mechanism; 5- Grating assembly, 51- Grating scale, 52- Grating reading head; 6-Z axis guide assembly, 61-Z axis slider, 62-Z axis slide rail. Detailed Implementation

[0029] The present invention will be further described in detail below with reference to specific embodiments.

[0030] Example: like Figure 1As shown, this invention discloses an array nozzle device, mainly used in optical communication and semiconductor chip eutectic bonding fields. It includes a large C-axis rotation mechanism 1, an overall frame 2, multiple force-controlled lifting components 3, multiple nozzle components 4, multiple grating components 5, and multiple Z-axis guide components 6. The large C-axis rotation mechanism 1 drives the overall frame 2 to rotate around a vertical axis. The overall frame 2 has multiple receiving cavities 211. The force-controlled lifting components 3, nozzle components 4, grating components 5, and Z-axis guide components 6 are grouped and arranged within the receiving cavities 211. The power output end of the large C-axis rotation mechanism 1 is fixedly connected to the overall frame 2, used to drive the overall frame 2 to rotate around a first vertical axis, achieving coarse calibration and angle compensation of the overall attitude of the array nozzles. The overall frame 2 has multiple receiving cavities 211 arranged horizontally. Each group of force-controlled lifting components 3, nozzle components 4, grating components 5, and Z-axis guide components 6 is matched with each other and independently installed within the corresponding receiving cavity 211, forming a modular independent control unit.

[0031] Each force-controlled lifting component 3 can independently drive the corresponding nozzle component 4 to move up and down along the Z-axis. The grating component 5 detects the vertical displacement of the nozzle component 4 relative to the overall frame 2 in real time and forms a position closed loop. The Z-axis guide component 6 provides high-precision vertical guidance for the nozzle component 4 to ensure the linearity of the movement. In this embodiment, the overall frame 2 is provided with three accommodating cavities 211. The middle accommodating cavity 211 can accommodate two sets of force-controlled lifting components 3, and the two side accommodating cavities 211 each accommodate one set of force-controlled lifting components 3, forming a four-nozzle side-by-side layout. In other embodiments, the size of each accommodating cavity 211 can be set to be the same to adapt to the chip mounting requirements of different numbers and different spacings, improving the versatility of the device.

[0032] like Figure 2 As shown, the large C-axis rotation mechanism 1 adopts a high-precision electric angle stage structure, specifically including a servo motor 11, an arc-shaped base 12, an arc-shaped slide 13, a worm gear transmission mechanism, and a vernier scale 14. The arc-shaped slide 13 is fixedly connected to the overall frame 2. The servo motor 11 is installed in a horizontal axial manner. The arc-shaped slide 13 and the arc-shaped base 12 form a sliding fit through an arc-shaped guide rail. The worm gear mechanism is encapsulated inside the arc-shaped slide 13 and the arc-shaped base 12, converting the rotational motion of the servo motor 11 into the rotational motion of the arc-shaped slide 13 around the Z-axis, realizing high torque and high-precision angle drive.

[0033] The vernier scale 14 is located at the arc-shaped interface between the arc-shaped base 12 and the arc-shaped slide 13, used to visually display the rotation angle of the arc-shaped slide 13 relative to the arc-shaped base 12, facilitating equipment debugging and accuracy verification. This mechanism can achieve closed-loop calibration of the overall angle of the array nozzles, compensating for overall installation errors and substrate alignment deviations. After each pick-up nozzle 41 picks up each chip and adjusts its own angle, the large C-axis rotation mechanism 1 can rotate together around the vertical axis while keeping the relative positions of all chips unchanged, thereby matching the relative position of the substrate. With the assistance of the vision mechanism, the servo motor 11 can automatically control the rotation angle of the large C-axis; the vernier scale 14 can also provide a visual angle indicator for manual control of this rotation angle.

[0034] like Figures 1 to 4 As shown, the force control lifting assembly 3 is the core structure for realizing independent programmable force control of a single chip. It includes a Z-axis drive 31 fixedly installed in the accommodating cavity 211, a lifting block 32 driven by the Z-axis drive 31 to move up and down, a connecting block 33 fixedly connected to the suction nozzle assembly 4, and a pressure sensor 34 connected in series between the lifting block 32 and the connecting block 33.

[0035] The Z-axis drive unit 31 drives the lifting block 32 to move, which in turn indirectly drives the nozzle assembly 4 to complete the lifting action via the pressure sensor 34 and the connecting block 33. Since the lifting block 32 and the connecting block 33 do not directly contact each other, all contact forces during the placement process are collected individually by the pressure sensor 34. Combined with the high sensitivity and high linearity characteristics of the cuboid strain gauge structure, it can accurately reflect the real pressure changes in the Z-axis, effectively avoiding interference from lateral forces and torsional forces on the detection results. The control system adjusts the movement speed and displacement of the Z-axis drive unit 31 in real time based on the feedback signal from the pressure sensor 34, so that the placement pressure can be quickly stabilized at the set threshold, realizing high-precision and high-response closed-loop force control, fundamentally solving the technical problems of uncontrollable pressure and easy overpressure damage to chips in traditional spring structures. The pressure sensor 34 is a cuboid strain gauge pressure sensor with a front and rear section arranged opposite each other. The rear section is fixedly attached to the lifting block 32, and the front section is fixedly attached to the connecting block 33. This ensures that the lifting block 32 and the connecting block 33 transmit force signals only through the pressure sensor 34, without any other mechanical contact, forming a cantilever structure that ensures interference-free and offset-free force detection. The Z-axis drive 31 dynamically adjusts the output thrust and downward displacement based on the real-time force value signal fed back by the pressure sensor 34 within the same accommodating cavity 211, realizing real-time closed-loop control of the mounting pressure.

[0036] like Figure 5 and Figure 8As shown, the lifting block 32 is an integrated precision machined structure, including an integrally formed intermediate support part 321, a front mounting part 322, and two rear clamping parts 323. The front mounting part 322 is located in front of the intermediate support part 321 and has an overall L-shaped horizontal cross-section structure. The inner corner of its corner is used to install the Z-axis guide assembly 6 to guide the lifting motion; the outer plane of its long side is used to fix the rear part of the pressure sensor 34, ensuring that the pressure sensor 34 is installed flat and the force is even. The Z-axis drive component 31 is a shaft linear motor, which includes a fixed stator 311 and a mover 312 that can move up and down. Both ends of the mover 312 extend outside the stator 311; the two rear clamping parts 323 are symmetrically connected to the rear of the intermediate support part 321, respectively clamping the upper and lower ends of the fixed mover 312 to form a double-end clamping structure, which improves the transmission rigidity and motion stability. This structure of the lifting block 32 allows the parts that would normally be arranged sequentially along the axial (vertical) direction of the suction nozzle assembly 4 to be distributed side by side, reducing the height space required for the entire force-controlled lifting assembly 3. Several weight-reducing grooves 3211 are provided on the outer side of the intermediate support 321 to reduce the moment of inertia and improve dynamic response speed while ensuring structural strength. A grating scale 51 and a second protrusion 35 are fixedly installed on the inner side of the intermediate support 321 to ensure accurate positioning of the displacement detection and elastic reset structure.

[0037] like Figure 9 As shown, the connecting block 33 is an integrated rigid structure, including an integrally connected cylindrical part 331 and a square part 332. The cylindrical part 331 is a hollow sleeve structure used to surround and fix the suction nozzle assembly 4, and also functions as a mounting base and a protective shell; the square part 332 has an embedding groove 333 at the rear, and the front part of the pressure sensor 34 is tightly embedded in the embedding groove 333 and fixedly connected to achieve positioning installation and surface contact force.

[0038] The cylindrical part 331 and the square part 332 are combined to form a three-dimensional rigid connection structure, which has higher structural strength and resistance to deformation compared with traditional sheet metal parts, and can significantly reduce the force detection error caused by component deformation. The positioning and assembly method of the embedded groove 333 can improve the coaxiality and fit of the pressure sensor 34, reduce the detection deviation caused by assembly gaps and looseness, and further improve the force control accuracy.

[0039] like Figure 7 As shown, the suction nozzle assembly 4 includes a pick-up nozzle 41 for adsorbing chips, a small C-axis rotation mechanism 42 that independently drives the pick-up nozzle 41 to rotate around the Z-axis, and an angle detection mechanism 43 for real-time detection of the rotation angle of the pick-up nozzle 41.

[0040] The pick-up nozzle 41 is located at the bottom of the nozzle assembly 4 and uses vacuum adsorption to reliably pick up chips. The small C-axis rotation mechanism 42 is fixedly mounted on the connecting block 33 and can independently fine-tune the angle of a single chip to compensate for incoming angle deviations and array assembly errors. The angle detection mechanism 43 provides real-time feedback of the rotation angle signal, forming a closed-loop angle control with the small C-axis rotation mechanism 42 to ensure the accuracy of single chip angle adjustment. The pressure sensor 34 is independent of the nozzle assembly 4, so the coaxiality error of the small C-axis rotation mechanism 42 will not affect the measurement value of the pressure sensor 34, making the closed-loop force control more precise.

[0041] like Figure 4 and Figure 5 As shown, the grating assembly 5 employs a high-resolution grating displacement detection structure, including a grating scale 51 and a grating reading head 52 arranged opposite to each other. The grating scale 51 is fixed vertically to the side of the lifting block 32 and moves synchronously with the lifting block 32; the grating reading head 52 is fixedly installed on the side wall of the accommodating cavity 211 and remains stationary. The positions of the grating scale 51 and the grating reading head 52 can be interchanged.

[0042] During operation, the grating reading head 52 reads the displacement information of the grating scale 51 in real time and feeds it back to the control system. The Z-axis drive 31 accurately controls the pressing depth and dwell position of the nozzle assembly 4 according to the displacement signal, realizing closed-loop control of Z-axis height and compensating for chip material thickness tolerance and substrate flatness error.

[0043] like Figure 3 , Figure 4 and Figure 6 As shown, the Z-axis guide assembly 6 includes a Z-axis slider 61 and a Z-axis slide rail 62 that cooperate with each other. The Z-axis slide rail 62 is fixed vertically to the side wall of the receiving cavity 211, and the Z-axis slider 61 is fixed to the side wall of the lifting block 32 and slides in cooperation with the Z-axis slide rail 62, providing high-precision vertical linear guidance for the lifting block 32 and the suction nozzle assembly 4, ensuring coaxiality of Z-axis movement, reducing wobble and lateral clearance, and further improving the accuracy of the mounting position and the stability of force control. The mounting positions of the Z-axis slider 61 and the Z-axis slide rail 62 are interchangeable without affecting the guiding function, thus improving the flexibility of the structural design.

[0044] like Figure 3 , Figure 4 and Figure 6As shown, the overall frame 2 includes a frame body 21 and several first protrusions 22 disposed on the frame body 21. Each lifting block 32 corresponds to a first protrusion 22. A second protrusion 35 is fixed to the side of the lifting block 32. The first protrusion 22 and the second protrusion 35 are connected by an elastic member 36. The elastic member 36 applies an upward pulling force to the second protrusion 35 to provide a reset preload, eliminate transmission gap, and assist the lifting block 32 to quickly return to its original position when the Z-axis drive 31 resets, thereby improving the mechanism's response speed and reset accuracy. It also prevents the Z-axis slider 61 from completely disengaging from the Z-axis slide rail 62. In this embodiment, the elastic member 36 is a tension spring, so the first protrusion 22 is located above the second protrusion 35. If the elastic member 36 is a compression spring, the first protrusion 22 can be located below the second protrusion 35.

[0045] In this embodiment, four sets of nozzle assemblies 4 are arranged side by side in the horizontal direction. The pick-up nozzles 41 all extend downward from the same side of the overall frame 2. The layout is compact and the movement is free from interference, which can meet the process requirements of simultaneous picking and mounting of multiple chips and greatly improve the mounting efficiency.

[0046] In summary, this device has the following advantages: 1. A cuboid strain gauge pressure sensor and a Z-axis drive are used for closed-loop pressure control. The pressure is programmable and can be corrected in real time, with a chip breakage rate approaching zero. 2. Each nozzle is equipped with a small C-axis rotation mechanism and an angle detection closed loop, which can compensate for individual incoming material angle errors and significantly improve the placement yield. 3. The all-electric structure replaces the traditional spring floating structure, which greatly improves the stability and service life of the equipment and reduces maintenance costs by more than 90%. 4. The grating assembly 5 detects displacement in real time, accurately compensates for material thickness differences, and achieves higher consistency in mounting position; 5. Multiple nozzle assemblies are independently controlled, and the overall frame is installed in a unified manner, which can be adapted to the synchronous mounting of multiple chips, resulting in a significant improvement in efficiency.

[0047] The closed-loop force control method using the above-mentioned array nozzle device includes the following steps: S1, Parameter Preset Based on the process requirements of the chip to be mounted, the Z-axis stroke and target mounting pressure are independently preset for each force-controlled lifting component 3, so as to realize independent programmable parameters for each channel and adapt to the different mounting requirements of multiple chips.

[0048] S2, Overall Attitude Pre-calibration The vision mechanism acquires the substrate alignment image and transmits it to the control system. The control system drives the large C-axis rotation mechanism 1 to rotate the overall frame 2, completing the overall angle calibration of the array nozzles, so that the arrangement direction of all nozzle components 4 is consistent with the substrate mounting position direction.

[0049] This step targets the overall angle adjustment of the device, which is independent of the closed-loop force control. Therefore, it is not a necessary technical feature and can be omitted or replaced by other angle adjustment methods.

[0050] S3, Synchronous Material Handling The overall frame 2 moves to the material picking position, and each set of force-controlled lifting components 3 moves synchronously. The suction nozzle component 4 completes the synchronous picking of chips, ensuring the efficiency and positional consistency of multi-chip picking.

[0051] S4, Independent Height Adjustment Each group of grating components 5 collects the Z-direction displacement of the lifting block 32 in real time and feeds it back to the control system. The Z-axis drive component 31 independently drives the lifting block 32 to move down according to the preset stroke, so that each chip reaches the corresponding mounting height, and adaptively compensates for the difference in material thickness and height deviation.

[0052] S5, Independent Angle Fine Adjustment While adjusting the height, the vision mechanism collects chip posture information, and the control system drives each group of small C-axis rotation mechanisms 42 to independently rotate the pick-up nozzle 41. The angle detection mechanism 43 realizes closed-loop angle correction to compensate for the angle deviation of a single chip and the array assembly error.

[0053] This step targets the angle adjustment of a single chip, which is independent of the closed-loop force control. Therefore, it is not a necessary technical feature and can be omitted or replaced by other angle adjustment methods.

[0054] S6, Closed-Loop Force Control Mounting During the placement process, each group of pressure sensors 34 collects the Z-axis placement pressure in real time and uploads it to the control system. The control system independently adjusts the extension and retraction of the corresponding Z-axis drive component based on the difference between the real-time pressure and the preset pressure, so that the placement pressure is stabilized within the target range, achieving high-precision closed-loop force control. After the pressure holding time is set, the chip placement is completed.

[0055] By using the closed-loop force control method described above, this device enables collaborative operation of "single-channel independent control, global synchronous operation, and pressure closed loop throughout the entire process" when mounting multiple chips. While ensuring the efficiency of synchronous mounting of multiple chips, it significantly improves mounting accuracy, pressure stability, and chip yield.

[0056] The above descriptions are merely some embodiments of the present invention. Those skilled in the art can make various modifications and improvements without departing from the inventive concept of the present invention, and these all fall within the scope of protection of the present invention.

Claims

1. An array nozzle device, characterized in that: It includes an overall frame, multiple force-controlled lifting components, multiple suction nozzle components, multiple grating components, and multiple Z-axis guide components; The overall frame is provided with multiple accommodating cavities. The force-controlled lifting assembly, the suction nozzle assembly, the grating assembly, and the Z-axis guide assembly are grouped and arranged in the accommodating cavities. Each force-controlled lifting assembly independently drives the corresponding suction nozzle assembly to move vertically up and down. The grating assembly detects the vertical height of the suction nozzle assembly in real time. The Z-axis guide assembly is used to guide the suction nozzle assembly to move up and down in the vertical direction. The force-controlled lifting assembly includes a Z-axis drive, a lifting block, a connecting block, and a pressure sensor. The Z-axis drive is fixed inside the accommodating cavity and drives the lifting block to move up and down. The pressure sensor is connected between the lifting block and the connecting block. The connecting block is fixedly connected to the nozzle assembly. The Z-axis drive controls the mounting pressure in a closed loop based on the real-time signal from the pressure sensor. The pressure sensor is a cuboid strain gauge pressure sensor, which includes a front side and a rear side. The rear side is fixed to the lifting block, and the front side is fixed to the connecting block.

2. The array suction nozzle device according to claim 1, characterized in that: The connecting block includes an integrally connected cylindrical part and a square part; the cylindrical part surrounds and fixes the nozzle assembly; the rear part of the square part has an embedding groove, and the front part of the pressure sensor is tightly embedded in the embedding groove and fixedly connected.

3. The array suction nozzle device according to claim 1, characterized in that: The lifting block includes an integrally formed intermediate support part and a front mounting part; the front mounting part is located in front of the intermediate support part and has an overall L-shaped horizontal cross-section structure. The inner corner of the front mounting part is used to install the Z-axis guide assembly, and the outer side of the long side is used to fix the rear part of the pressure sensor.

4. The array suction nozzle device according to claim 3, characterized in that: The Z-axis drive is a linear motor with a shaft, which includes a fixed stator and a movable part that can move up and down. Both ends of the movable part extend outside the stator. The lifting block also includes two rear end clamping parts, which are symmetrically connected to the rear side of the middle support part and clamp the upper and lower ends of the movable part respectively.

5. The array suction nozzle device according to claim 3, characterized in that: The outer side of the intermediate support is provided with several weight-reducing grooves.

6. The array suction nozzle device according to claim 1, characterized in that: The grating assembly includes a grating scale and a grating reading head arranged opposite each other. One of the grating scale and the grating reading head is fixed to the side wall of the accommodating cavity, and the other is fixed to the side of the lifting block.

7. The array suction nozzle device according to claim 1, characterized in that: The Z-axis guide assembly includes a Z-axis slider and a Z-axis slide rail that cooperate with each other. One of the Z-axis slider and the Z-axis slide rail is fixed to the side wall of the accommodating cavity, and the other is fixed to the side of the lifting block.

8. The array suction nozzle device according to claim 1, characterized in that: The overall frame includes a frame body and a number of first protrusions set on the frame body, with each lifting block corresponding to one first protrusion; a second protrusion is fixed on the side of the lifting block, and the first protrusion and the second protrusion are connected by an elastic element, which applies an upward pulling force to the second protrusion.

9. The array suction nozzle device according to claim 1, characterized in that: The suction nozzle assembly includes a material-picking suction nozzle, a small C-axis rotation mechanism that independently drives the material-picking suction nozzle to rotate around the Z-axis, and an angle detection mechanism for real-time detection of the rotation angle of the material-picking suction nozzle. The angle detection mechanism provides real-time feedback of the rotation angle signal, forming an angle closed-loop control with the small C-axis rotation mechanism.

10. The array suction nozzle device according to claim 1, characterized in that: It also includes a large C-axis rotation mechanism, which is an electric angular stage, comprising a servo motor, an arc-shaped base, an arc-shaped slide, and a worm gear mechanism. The arc-shaped slide is fixedly connected to the overall frame. The servo motor is mounted horizontally. The arc-shaped slide and the arc-shaped base are slidably fitted together by a circular arc guide rail. The worm gear mechanism is encapsulated inside the arc-shaped slide and the arc-shaped base, and converts the rotational motion of the servo motor into the rotational motion of the arc-shaped slide around the Z-axis.

11. The array suction nozzle device according to claim 10, characterized in that: The arc-shaped base and the arc-shaped slide have a vernier scale on their arc-shaped mating interface, which is used to display the rotation angle of the arc-shaped slide relative to the arc-shaped base.

12. A closed-loop force control method using the array nozzle device according to any one of claims 1 to 11, characterized in that the steps are as follows: include: S1. Parameter preset: Based on the mounting height and mounting force at each position, the preset stroke and preset pressure of each lifting block can be set independently; S2. Synchronous material handling: The overall frame is moved, and each nozzle assembly synchronously picks up the chip under the control of the stress-controlled lifting assembly; S3. Independent height adjustment: With the assistance of the grating assembly, the Z-axis displacement data of the corresponding lifting block is collected in real time and fed back to the control system. The Z-axis drive unit drives the lifting block to move down according to the preset stroke, so as to realize the adaptive compensation of the height of a single chip and match their respective mounting height. S4. Closed-loop force control mounting: During the mounting process, each pressure sensor collects the Z-axis mounting pressure in real time and uploads it to the control system. The control system independently controls each Z-axis drive component to slightly adjust the extension and retraction based on the real-time pressure signal, so that the mounting pressure is stable within the set pressure range, realizing high-precision closed-loop force control. After holding the pressure for a preset time, the mounting is completed.

13. The closed-loop force control method according to claim 12, characterized in that: Before the synchronous material handling step, an overall posture pre-calibration is required: the vision mechanism acquires the current substrate image information and uploads it to the control system. The large C-axis rotation mechanism drives the overall frame to rotate around the vertical axis according to the substrate image information, completing the overall angle coarse calibration of the array, so that the arrangement direction of all nozzle components is consistent with the substrate mounting position direction.

14. The closed-loop force control method according to claim 12, characterized in that: Independent height adjustment is performed simultaneously with independent angle fine-tuning: the vision mechanism acquires the current chip image information and uploads it to the control system. Each small C-axis rotation mechanism independently drives the corresponding pick-up nozzle to rotate according to the chip image information, and relies on the feedback signal from the angle detection mechanism to compensate for the single chip incoming angle deviation and array assembly error.

Images