玻璃载板的制备方法、玻璃载板及封装结构
By introducing a buffer layer and a redistribution layer isolation structure into the glass substrate, the stress concentration problem caused by the difference in thermal expansion coefficients between the glass and metal trace layers is solved, which improves the mechanical reliability and electrical performance of the glass substrate and extends its service life.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SUZHOU GUOXIAN INNOVATION TECHNOLOGY CO LTD
- Filing Date
- 2026-04-23
- Publication Date
- 2026-07-17
AI Technical Summary
In high-density, high-performance interconnect glass substrate packaging, the thermal stress concentration caused by the difference in thermal expansion coefficients between the glass and metal wiring layers can easily lead to microcracks on the glass surface and interface delamination, affecting the mechanical integrity and long-term reliability of the packaging structure.
During the fabrication of the glass substrate, a buffer layer is introduced, and the redistribution layer is electrically connected only to the protrusions to create a physical isolation structure. The buffer layer material has a low elastic modulus and good stress relaxation characteristics, which absorb and disperse thermal stress, and prevent the glass from directly contacting the redistribution layer.
It effectively absorbs and disperses thermal stress, avoids glass microcracks and interface delamination, improves the mechanical reliability and service life of the glass substrate, and maintains the stability of electrical performance and high-frequency characteristics.
Smart Images
Figure CN122070026B_ABST