Lighting device

Abstract

A lighting device disclosed in an embodiment of the present disclosure includes: a heat sink; the circuit board is arranged on the heat dissipation plate; a light source part disposed on the heat dissipation plate and including a light emitting device; and a plurality of connecting members connecting the circuit board and the light source portion, in which the light source portion includes a plurality of bonding pads, and the circuit board includes a plurality of pads, each of the plurality of connection members includes one end connected to a corresponding one of the plurality of bonding pads, the other end connected to the corresponding one of the plurality of bonding pads, and a connection portion connecting the one end and the other end, and the connection portion may include a convex portion protruding toward the heat dissipation plate.

Description

Technical Field

[0001] The embodiment relates to a lighting device. Background Technology

[0002] Lighting applications include vehicle lighting, backlighting for displays, and backlighting for signs. Compared to light sources such as fluorescent and incandescent lamps, light-emitting diodes (LEDs) offer advantages such as low power consumption, semi-permanent lifespan, fast response time, safety, and environmental friendliness. LEDs are used in various lighting devices, such as various display devices, indoor lights, and outdoor lights. Recently, lamps using LEDs as vehicle light sources have been proposed. Compared to incandescent lamps, LEDs have the advantage of low power consumption. In addition, the small size of LEDs increases the design freedom of lamps, and their semi-permanent lifespan offers economic benefits. However, because the emission angle of light emitted from LEDs is small, when LEDs are used as vehicle lights, it is necessary to increase the luminous area of ​​the lamps utilizing LEDs. As prior art related to lighting devices, Korean Patent Application Publication No. KR10-2023-0010550, published on January 19, 2023, has been disclosed. Summary of the Invention

[0003] Technical issues

[0004] The embodiment provides a lighting device with improved reliability.

[0005] Technical solution

[0006] The lighting device according to an embodiment of the present disclosure includes: a heat sink; a circuit board disposed on the heat sink; a light source disposed on the heat sink and including a light-emitting device; and a plurality of connecting members connecting the circuit board and the light source, wherein the light source includes a plurality of bonding pads, the circuit board includes a plurality of pads, and each of the plurality of connecting members includes: one end connected to a corresponding bonding pad among the plurality of bonding pads; another end connected to a corresponding pad among the plurality of pads; and a connecting portion connecting the one end and the other end, wherein the connecting portion may include a convex portion protruding toward the heat sink.

[0007] The lighting device according to an embodiment includes: a heat sink; a circuit board disposed on the heat sink; a light source portion disposed on the heat sink and including a light-emitting device; a plurality of connecting members connecting the circuit board and the light source portion; and a sealing portion surrounding at least a portion of the plurality of connecting members, wherein the light source portion includes a plurality of bonding pads, the circuit board includes a plurality of pads, and each of the plurality of connecting members includes: one end connected to a corresponding bonding pad among the plurality of bonding pads; another end connected to a corresponding pad among the plurality of pads; and a connecting portion connecting the one end and the other end, wherein the connecting portion may include a convex portion protruding toward the heat sink.

[0008] According to an embodiment, the light source includes a support member, the light-emitting device includes a plurality of light-emitting devices disposed on the support member, and the connecting part includes a central part, a first outer part and a second outer part. The central part is disposed in the region between the side surface of the support member and the side surface of the circuit board, and the first outer part and the second outer part can be disposed in regions other than the region between the side surface of the support member and the side surface of the circuit board.

[0009] According to an embodiment, the central portion protrudes in the direction toward the heat sink, and the first and second outer portions may protrude in the direction opposite to the direction toward the heat sink. The length of the central portion may be greater than the length of the first and second outer portions. The length of the central portion may be greater than the sum of the lengths of at least one of the first and second outer portions. The central portion may be 30% to 70% of the length of each of the plurality of connecting members, and at least one of the first and second outer portions may be 15% to 35% of the length of each of the plurality of connecting members.

[0010] According to an embodiment, the distance between the light source and the circuit board can be 60% to 90% of the length of each of the plurality of connecting members, and the minimum distance between each of the plurality of connecting members and the heat sink can be 0.1 mm to 2 mm. The center portion can include the center with the smallest distance between the center portion and the heat sink, and this center can be within 1 / 2 point ± 10% of the length from the center portion.

[0011] According to an embodiment, the heat sink includes a groove, and the groove can be disposed between the light source and the circuit board. The height of the upper surface of the support member can be 90% to 110% of the height of the upper surface of the circuit board. According to an embodiment, a sealing portion can be disposed between the light source and the circuit board.

[0012] According to an embodiment, the connecting portion includes a central portion, a first outer portion, and a second outer portion. The first outer portion is adjacent to a plurality of bonding pads, and the second outer portion is adjacent to a plurality of pads. The central portion is disposed in the region between the side surface of the support member and the side surface of the circuit board. The first and second outer portions are disposed in regions other than the region between the side surface of the support member and the side surface of the circuit board, and a sealing portion may surround the central portion. According to an embodiment, the sealing portion may further surround the second outer portion. The support member includes a first groove, the circuit board includes a second groove, a plurality of bonding pads are disposed inside the first groove, a plurality of pads are disposed inside the second groove, and the sealing portion may also surround the first outer portion, the second outer portion, one end, and the other end.

[0013] Beneficial effects

[0014] The lighting device according to an embodiment includes connecting members that electrically connect a light source unit and a circuit board. Specifically, each of the connecting members is connected between a bonding pad of the light source unit and a pad of the circuit board. Each of the connecting members includes one end, another end, and a connecting portion. The connecting portion connects one end and the other end. The connecting portion includes a central portion and an outer portion. The central portion occupies most of the area of ​​the connecting portion. The central portion is formed recessed. Specifically, the central portion is formed to bulge downwards. Therefore, the central portion is located in the area between the light source unit and the circuit board. Therefore, when an external impact is transmitted, the central portion of the connecting member can be protected by the light source unit and the circuit board. Therefore, damage to the connecting member due to external impact can be prevented. Therefore, the reliability of the lighting device can be improved.

[0015] The lighting device may also include a sealing portion. The sealing portion may be configured to surround at least one of the connecting portion, one end, and the other end of each of the connecting members. Therefore, corrosion of the connecting members can be prevented. Additionally, the fixing force of the connecting members can be improved. Furthermore, short circuits between the connecting members, the bonding pads, and the pads can be prevented. The light source portion includes a first recess, and the circuit board includes a second recess. The bonding pads are disposed inside the first recess, and the pads are disposed inside the second recess. The area of ​​the sealing portion is controlled by the first and second recesses. Therefore, movement of the sealing portion toward the light source portion can be prevented. Therefore, the brightness of the lighting device can be improved. Additionally, an increase in the border area of ​​the circuit board due to the sealing portion can be prevented. Therefore, the size of the lighting device can be reduced. Attached Figure Description

[0016] Figure 1 This is a perspective view of a lighting device according to an embodiment.

[0017] Figure 2 yes Figure 1 A side sectional view of the lighting device.

[0018] Figure 3 yes Figure 1 A close-up view of the lighting device.

[0019] Figure 4 yes Figure 3 A plan view of the lighting fixtures.

[0020] Figure 5 and Figure 6 It is along Figure 4 A sectional view taken by line A-A'.

[0021] Figure 7 Is Figure 3 An example of a plan view of a lighting device having a sealing part.

[0022] Figure 8 yes Figure 7 A sectional view of the lighting fixture taken along line B-B'.

[0023] Figure 9 yes Figure 3 Another plan view of the lighting fixture.

[0024] Figure 10 yes Figure 9 A sectional view of the lighting device taken along line C-C'.

[0025] Figure 11 yes Figure 3 Another plan view of the lighting fixture.

[0026] Figure 12 yes Figure 11 A sectional view of the lighting fixture taken along line D-D'. Detailed Implementation

[0027] Preferred embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. However, the technical concept of the present disclosure is not limited to the described embodiments, but can be implemented in various different forms, and one or more components may be selectively combined and substituted among embodiments if within the scope of the technical concept of the present disclosure. Furthermore, unless explicitly defined and described, the terminology used in the embodiments of the present disclosure (including technical and scientific terms) is to be interpreted in the sense that is generally understood by one of ordinary skill in the art to which this disclosure pertains, and common terms such as those defined in dictionaries may be interpreted in light of the context of the relevant art.

[0028] The terminology used in the embodiments of this disclosure is for describing embodiments and is not intended to limit this disclosure. In this specification, singular forms may include plural forms unless specifically described in a phrase, and when described as “at least one (or more than one) of A and / or B and C,” it may include at least one of all combinations of A, B, and C. Furthermore, terms such as first, second, A, B, (a), and (b) may be used to describe components of embodiments of this disclosure. These terms are intended only to distinguish components from other components and are not determined by their nature, order, or sequence. Furthermore, when a component is described as “connected,” “joined,” or “attached” to another component, this includes not only the case where the component is directly connected, joined, or attached to the other component, but also the case where the component is “connected,” “joined,” or “attached” to another component between the component and the other component. Furthermore, when each component is described as being formed or disposed “on top” or “bottom,” “on top” or “bottom” includes not only the case where two components are in direct contact with each other, but also the case where one or more components are formed or disposed between two components. Furthermore, when expressed as "above" or "below", it can include not only the upward direction based on a component but also the downward direction based on a component.

[0029] In the following description, a lighting device according to an embodiment will be described with reference to the accompanying drawings.

[0030] Reference Figures 1 to 12 The lighting device according to an embodiment includes a heat sink 101, a circuit board 110, a light source 130, and connecting members 141 and 142. The circuit board 110 is disposed on the heat sink 101. The light source 130 includes a light-emitting device 131. The light source 130 is disposed on the heat sink 101. Connecting members 141 and 142 connect the light source 130 and the circuit board 110. Connecting members 141 and 142 electrically connect the light source 130 and the circuit board 110.

[0031] Lighting devices are applied to various lamps that require illumination. For example, lighting devices can be applied to automotive lights, household lighting, or industrial lighting. For instance, lighting devices can be applied to automotive lights. Lighting devices can be applied to headlights, side mirror lights, side marker lights, fog lights, taillights, brake lights, daytime running lights, interior lights, door welcome lights, rear combination lights, or reversing lights. Preferably, lighting devices can be applied to headlights. Furthermore, lighting devices can be applied to indoor or outdoor advertising devices, display devices, and electric vehicles.

[0032] The heat sink 101 supports the light source unit 130 and the circuit board 110. Heat generated from the light source unit 130 and the circuit board 110 is dissipated by the heat sink 101. The heat sink 101 comprises metal. For example, the heat sink 101 can be formed as a laminated structure of multiple metal layers. The heat sink 101 can be formed as a single layer or multiple layers. The heat sink 101 can comprise ceramic materials, AlN, and aluminum materials with an anodized surface layer. The metal layers can comprise at least one of Al, Ni, Mo, Cu, Cu alloys, Cu-W, Ag, and Au.

[0033] The heat sink 101 includes a heat dissipation section 102 and a side section 103. The heat dissipation section 102 includes a recess 108. A circuit board 110 is disposed inside the recess 108. The area of ​​the heat dissipation section 102 may be larger than the area of ​​the circuit board 110. The side section 103 bends backward from the edge of the heat dissipation section 102. One or more side sections 103 may be provided along the outside of the heat dissipation section 102. An empty space 109 may be provided inside the side section 103 and at the bottom of the heat dissipation section 102, or it may be combined with another structure. A heat sink may be disposed at the bottom of the heat dissipation section 102.

[0034] Circuit board 110 is disposed on heat sink 102. Circuit board 110 is disposed on the same plane as light source 130. Circuit board 110 is spaced apart from light source 130. Although not shown in the drawings, an adhesive may be disposed between circuit board 110 and heat sink 102. Circuit board 110 can be bonded to heat sink 102 by adhesive. Circuit board 110 may contain resin or metal. For example, circuit board 110 may contain any one of ceramic PCB, MCPCB (metal core PCB), FPCB (flexible PCB), and resin PCB.

[0035] The circuit board 110 may include a lower metal layer, an upper circuit layer including pads, a protective layer of insulating material for protecting the upper circuit layer, and an insulating layer between the metal layer and the circuit layer. The circuit board 110 may be configured as an MCPCB in which the metal layer is located at the bottom. Additionally, the circuit board 110 can transfer heat to the heat sink 101. The circuit board 110 can be fastened to the heat sink 102 by a fastening device 119. The fastening device 119 may include one or more screws. With the screws, the circuit board 110 and the heat sink 102 can be fastened and brought into close contact.

[0036] Circuit board 110 may include multiple pads. Pads 111 and 112 may include a first pad 111 and a second pad 112 spaced apart from each other. The first pad 111 and the second pad 112 are connected to a connector 115 disposed on the upper part of circuit board 110 via a circuit layer of circuit board 110. Connector 115 can receive drive signals and power from the outside. Pads 111 and 112 and connector 115 may be disposed at two edges of circuit board 110. Fastening device 119 may be disposed in the area between pads 111 and 112 and connector 115. The first pad 111 and the second pad 112 are configured to be adjacent to one side surface of circuit board 110. Pads 111 and 112 may be selected from Ti, Ru, Rh, Ir, Mg, Zn, Al, In, Ta, Pd, Co, Ni, Si, Ge, Ag, Au and their selective alloys.

[0037] A light source portion 130 is disposed on a heat dissipation portion 102. The light source portion 130 may be adjacent to a circuit board 110. The light source portion 130 may be adjacent to one side surface of the circuit board 110. One side surface of the circuit board 110 may be disposed between pads 111 and 112 and the light source portion 130. The light source portion 130 may include a support member 133 and at least one light-emitting device 131 disposed on the support member 133. The light-emitting device 131 may include multiple light-emitting devices. The multiple light-emitting devices 131 may be sealed by a resin member 132. The support member 133 may include a ceramic substrate or a semiconductor substrate. The support member 133 may support multiple light-emitting devices 131. Additionally, the support member 133 may include conductive patterns. The multiple light-emitting devices 131 may be electrically connected through the conductive patterns.

[0038] A protective element (not shown) for protecting the light-emitting device 131 can be disposed on the support member 133. The protective element can be implemented as a thyristor, Zener diode, or TVS (transient voltage suppressor). Therefore, the light-emitting device 131 can be protected from ESD (electrostatic discharge).

[0039] The support member 133 can be formed of ceramic material or MCPCB material. The light source unit 130 can transfer heat generated from the light-emitting device 131 to the heat sink 101 via the support member 133. The support member 133 and the heat sink 101 can be bonded together with an adhesive. The adhesive 138 can include a thermally conductive adhesive containing metal powder or inorganic powder in a resin material. For example, the adhesive 138 can contain a TIM (thermal interface material). The adhesive 138 can be disposed along the lower surface and lower portion of the side surfaces of the support member 133. The adhesive 138 can be disposed outside the side surfaces of the support member 133 and can contact each side surface of the support member 133.

[0040] Multiple light-emitting devices 131 are arranged in one direction or configured in at least one row. The multiple light-emitting devices 131 may be connected in series with each other. The multiple light-emitting devices 131 may include at least one of blue, green, and red LED chips. The multiple light-emitting devices 131 may be flip-chip or wire-bonded. The light-emitting devices 131 may include multiple semiconductor layers made of compound semiconductors of group II and VI elements and / or compound semiconductors of group III and V elements. At least one or all of the multiple semiconductor layers may contain a series of compound semiconductors such as AlInGaN, InGaN, AlGaN, GaN, GaAs, InGaP, AlInGaP, InP, and InGaAs.

[0041] The resin component 132 may comprise silicone resin or epoxy resin. The resin component 132 may comprise a reflective material. A transparent layer and / or a phosphor layer (not shown) may be disposed on the light-emitting device 131. The phosphor layer may be disposed on each of the plurality of light-emitting devices 131, or may cover the upper surface region of the plurality of light-emitting devices 131. The upper surfaces of the plurality of light-emitting devices 131 or the phosphor layer may be exposed on the upper surface of the resin component 132. The transparent layer and / or the phosphor layer (not shown) may contact the resin component 132. The resin component 132 may serve as a reflective wall around the light-emitting devices 131 and the phosphor layer. The resin component 132 may also include a convex lens (not shown). The phosphor layer may comprise at least one or more of yellow phosphors, green phosphors, blue phosphors, and red phosphors.

[0042] Reference Figure 3 The light-emitting device 131 is disposed on the upper part of one side of the support member 133. Bonding pads 134 and 135 are exposed on the upper part of the other side of the support member 133. Bonding pads 134 and 135 may include a first bonding pad 134 connected to the cathodes of the plurality of light-emitting devices 131 and a second bonding pad 135 connected to the anodes of the plurality of light-emitting devices 131. The first bonding pad 134 and the second bonding pad 135 may be disposed at a height below the height of the upper surface of the resin member 132. As another example, the first bonding pad 134 and the second bonding pad 135 may be disposed at the same height as the upper surface of the resin member 132. The first bonding pad 134 may have an identification mark and may be used as a cathode terminal, and the second bonding pad 135 may be used as an anode terminal. The first bonding pad 134 and the second bonding pad 135 may be selected from Ti, Ru, Rh, Ir, Mg, Zn, Al, In, Ta, Pd, Co, Ni, Si, Ge, Ag, Au, and selective alloys thereof.

[0043] First bonding pad 134 and first pad 111 are connected by a first connecting member 141. Second bonding pad 135 and second pad 112 are connected by a second connecting member 142. The first connecting member 141 and the second connecting member 142 can be formed as wiring. The first connecting member 141 and the second connecting member 142 can contain at least one of Au, Al, Ag, and Ni. In the first connecting member 141 and the second connecting member 142, one end 41 is respectively bonded to the first bonding pad 134 and the second bonding pad 135, and the other end 43 is respectively bonded to the first pad 111 and the second pad 112. The first connecting member 141 and the second connecting member 142 include a connecting portion 42 extending from one end 41 toward the other end 43. The connecting portion 42 can extend from the other side of the light source portion 130 to one side of the circuit board 110. The height of one end 41 can be equal to or greater than the height of the other end 43. In addition, the height of the connecting portion 42 can be lower than one end 41 and the other end 43.

[0044] The light source unit 130 and the circuit board 110 are electrically connected via a first connecting member 141 and a second connecting member 142. Connecting members 141 and 142 include wiring. Therefore, connecting members 141 and 142 may be damaged by external impacts. Furthermore, when connecting members 141 and 142 are exposed to the outside, they may react with substances in the air and may corrode. Therefore, the electrical connection characteristics between the light source unit 130 and the circuit board 110 may be degraded. To solve the above problems, the lighting device according to the embodiment controls the shape of the connecting members.

[0045] Reference Figures 3 to 6 The connecting members 141 and 142 may have a concave shape. Specifically, the connecting members 141 and 142 may have a downwardly convex shape. Each of the connecting members 141 and 142 includes one end 41, another end 43, and a connecting portion 42. The connecting portion 42 may include a concave portion or a concave curved surface. Specifically, the connecting portion 42 may include a convex portion protruding toward the heat sink. The connecting portion 42 may include a central portion 42a and an outer portion. The outer portion may include a first outer portion 42b1 and a second outer portion 42b2. The first outer portion 42b1 may be adjacent to the bonding pads 134 and 135. The second outer portion 42b2 may be adjacent to the pads 111 and 112. The central portion 42a is the region disposed between the light source portion 130 and the circuit board 110. Specifically, the central portion 42a is the region disposed between the side surface of the support member 133 and the side surface of the circuit board 110. The first outer portion 42b1 and the second outer portion 42b2 are regions disposed in areas other than the region between the side surface of the support member 133 and the side surface of the circuit board 110. The central portion 42a may be concave. Specifically, the central portion 42a may convex downward. The central portion 42a may convex toward the heat sink 101.

[0046] In the connecting portion 42 of the connecting members 141 and 142, the outer portions 42b1 and 42b2 can be convex. Specifically, the outer portions 42b1 and 42b2 can protrude upwards. Specifically, the outer portions 42b1 and 42b2 can protrude in the direction opposite to that of the heat sink 101. Therefore, the connecting portion 42 can protrude upwards while extending from the bonding pads 134 and 135 to the pads 111 and 112, can become convex downwards, and can protrude upwards again. That is, the connecting portion 42 can be formed in a shape where an upwardly convex portion, a downwardly convex portion, and an upwardly convex portion are connected in sequence.

[0047] In the connecting portion 42 of connecting members 141 and 142, the length of the central portion 42a may be greater than the length of at least one of the first outer portion 42b1 and the second outer portion 42b2. For example, the length of the central portion 42a may be greater than the length of the first outer portion 42b1. Alternatively, the length of the central portion 42a may be greater than the length of the second outer portion 42b2. Alternatively, the length of the central portion 42a may be greater than the sum of the lengths of the first outer portion 42b1 and the second outer portion 42b2. For example, the length of the central portion 42a may be more than 30% of the length of connecting members 141 and 142. Specifically, the length of the central portion 42a may be 30% to 70%, 35% to 65%, or 40% to 60% of the length of connecting members 141 and 142. When the length of the central portion 42a is less than 30% of the length of connecting members 141 and 142, the area protruding in the direction opposite to the heat sink may increase. Therefore, the connecting members may be damaged by external impacts.

[0048] In the connecting portion 42 of connecting members 141 and 142, when the length of the central portion 42a exceeds 70% of the length of connecting members 141 and 142, the curvature of the central portion 42a may increase. Therefore, cracks may form in the connecting member. Additionally, the connecting member and the heat dissipation portion may come into contact with each other. The length of at least one of the outer portions 42b1 and 42b2 may be more than 15% of the length of connecting members 141 and 142. Specifically, the length of at least one of the outer portions 42b1 and 42b2 may be 15% to 35%, 20% to 30%, or 22% to 28% of the length of connecting members 141 and 142. When the length of the outer portion is less than 15% of the length of connecting members 141 and 142, the connection characteristics between the connecting member and the bonding pad, as well as the connection characteristics between the connecting member and the pad, may decrease. When the length of the outer portion exceeds 30% of the length of connecting members 141 and 142, the length of the connecting member may increase. Therefore, the size of the lighting device may increase due to the connecting member.

[0049] In the connecting portion 42 of connecting members 141 and 142, within the length range of the central portion and the outer portions, the length of the central portion 42a may be greater than the length of at least one of the first outer portion 42b1 and the second outer portion 42b2. For example, the length of the central portion 42a may be greater than the length of the first outer portion 42b1. Alternatively, the length of the central portion 42a may be greater than the length of the second outer portion 42b2. Alternatively, the length of the central portion 42a may be greater than the sum of the lengths of the first outer portion 42b1 and the second outer portion 42b2.

[0050] Most areas of connecting members 141 and 142 can be formed in a downwardly convex shape. Therefore, areas of connecting members 141 and 142 can be positioned between the light source unit 130 and the circuit board 110. This protects connecting members 141 and 142. In other words, even when an impact is transmitted from the outside, connecting members 141 and 142 can be protected by the light source unit 130 and the circuit board 110. Specifically, since areas of connecting members 141 and 142 are positioned between the light source unit 130 and the circuit board 110, external impacts can be prevented from being transmitted to connecting members 141 and 142. Therefore, damage to connecting members 141 and 142 due to external impacts can be prevented.

[0051] The light source unit 130 and the circuit board 110 can be spaced apart from each other. The light source unit 130 and the circuit board 110 can be spaced apart from each other at a set distance. The distance d in the second direction Y between the light source unit 130 and the circuit board 110 can be 60% or more of the length of the connecting members 141 and 142. Here, the second direction Y is either the direction from the light source unit 130 toward the circuit board 110 or the length direction of the connecting members 141 and 142. The first direction X is either the direction in which the first connecting member 141 and the second connecting member 142 are arranged or a direction perpendicular to the second direction Y.

[0052] The distance d between the light source 130 and the circuit board 110 can be 60% to 90%, 65% to 85%, or 70% to 80% of the lengths of the connecting members 141 and 142. When the distance d between the light source 130 and the circuit board 110 is less than 60% of the lengths of the connecting members 141 and 142, the dimension of the distance d between the light source 130 and the circuit board 110 becomes narrower. Therefore, the curvature of the central portion 42a may increase. Therefore, cracks may form in the connecting members. In addition, the connecting members and the heat dissipation portion may come into contact with each other. When the distance d between the light source 130 and the circuit board 110 exceeds 80% of the lengths of the connecting members 141 and 142, the length of the connecting members may increase. Therefore, the size of the lighting device may increase due to the connecting members.

[0053] Connecting members 141 and 142 may be spaced apart from the heat sink 102. Connecting members 141 and 142, as well as the heat sink 101, may be spaced apart from each other at a predetermined distance. The minimum distance H in the third direction Z between connecting members 141 and 142 and the heat sink 102 may be 0.1 mm or more. The third direction Z is perpendicular to the first direction X and the second direction Y. The minimum distance H between connecting members 141 and 142 and the heat sink 102 may be less than the thickness of the supporting member 133 and the circuit board 110. For example, the minimum distance H between connecting members 141 and 142 and the heat sink 102 may be from 0.1 mm to 2 mm.

[0054] In connecting members 141 and 142, the center of the central portion 42a can be defined. Specifically, the center of the central portion 42a can be defined as the region where the distance between the central portion 42a and the heat dissipation portion is minimized. The center of the central portion 42a can be located at or adjacent to the half-point of its length. Specifically, the center of the central portion 42a can be located in a region within ±10% of the half-point of its length. Therefore, significant bending of the connecting portion 42 in one direction can be prevented. Therefore, breakage of the connecting member can be prevented.

[0055] Reference Figure 6 The heat sink 101 may include a groove. Specifically, the heat sink 102 may include a groove G. The groove G is disposed between the light source portion 130 and the circuit board 110. Therefore, the groove G may overlap with the connecting members 141 and 142. Specifically, the groove G may overlap with the center portion 42a. Therefore, contact between the connecting members 141 and 142 and the heat sink 101 can be prevented. The heat sink 101 may contain a conductive material. Therefore, when the connecting members 141 and 142 and the heat sink 101 come into contact with each other, a short circuit may occur between the circuit board 110 and the light source portion 130. Therefore, the reliability of the lighting device may be reduced.

[0056] The heat dissipation portion 102 includes a groove G. Therefore, contact between the center portion 42a and the heat dissipation portion 102 can be prevented during the process of forming the connecting members 141 and 142. That is, the minimum distance H between the connecting members 141 and 142 and the heat dissipation portion 102 can be increased. Alternatively, after forming the connecting members 141 and 142, contact between the center portion 42a and the heat dissipation portion 102 due to external impact can be prevented. Therefore, the reliability of the lighting device is improved.

[0057] The height of the upper surface of the light source unit 130 may differ from the height of the upper surface of the circuit board 110. The height H1 of the upper surface of the light source unit 130 is the height from the heat dissipation unit 102 to the upper surface of the support member 133. The height H2 of the upper surface of the circuit board 110 is the height from the heat dissipation unit 102 to the upper surface of the circuit board 110.

[0058] The height H1 of the upper surface of the light source unit 130 and the height H2 of the upper surface of the circuit board 110 can be the same or similar. Specifically, the height H1 of the upper surface of the light source unit 130 can be 90% to 110% of the height H2 of the upper surface of the circuit board 110.

[0059] When the height H1 of the upper surface of the light source 130 and the height H2 of the upper surface of the circuit board 110 exceed the range, the lengths of the outer portions 42b1 and 42b2 may increase. Therefore, the lengths of the connecting members 141 and 142, which are located in areas other than the region between the side surfaces of the light source 130 and the circuit board 110, may increase. Consequently, the connecting members 141 and 142 may be damaged by external impacts.

[0060] Connecting members 141 and 142 are made of metal. Therefore, connecting members 141 and 142 may be corroded by external moisture. In addition, connecting members 141 and 142 may separate from the bonding pads 134 and 135 or pads 111 and 112 due to external impact. Alternatively, after the connecting members 141 and 142 are formed, the central portion 42a and the heat dissipation portion 102 may come into contact with each other due to external impact.

[0061] To address the above problems, the lighting device according to the embodiment may further include a sealing portion 200. (See also...) Figure 7 and Figure 8 The lighting device may include a sealing portion 200. The sealing portion 200 is disposed between the light source portion 130 and the circuit board 110. The sealing portion 200 may surround the connecting members 141 and 142. Specifically, the sealing portion 200 may surround a portion of the connecting members 141 and 142.

[0062] Specifically, the sealing portion 200 can surround the connecting portion 42. Specifically, the sealing portion 200 can surround a portion of the connecting portion 42. Specifically, the sealing portion 200 can surround the central portion 42a. The outer portions 42b1 and 42b2 can be provided outside the sealing portion 200. The central portion 42a occupies most of the area of ​​the connecting members 141 and 142. Therefore, the sealing portion 200 can surround most of the area of ​​the connecting members 141 and 142. Therefore, the connecting members 141 and 142 can be prevented from being corroded by external moisture. Specifically, the corrosion rate of the connecting members 141 and 142 can be reduced. In addition, the connection members 141 and 142 can be prevented from breaking from the bonding pads 134 and 135 or the pads 111 and 112 due to external impact. Therefore, the reliability of the lighting device is improved.

[0063] After forming the connecting members 141 and 142, contact between the central portion 42a and the heat dissipation portion 102 due to external impact can be prevented. Therefore, the electrical characteristics of the lighting device can be improved.

[0064] Reference Figure 9 and Figure 10 The lighting device may include a sealing portion 200. The sealing portion 200 is disposed between the light source portion 130 and the circuit board 110. In addition, the sealing portion 200 is disposed on the circuit board 110. Specifically, the sealing portion 200 is disposed on pads 111 and 112.

[0065] The sealing portion 200 can surround the connecting members 141 and 142. Specifically, the sealing portion 200 can surround a portion of the connecting members 141 and 142. Specifically, the sealing portion 200 can surround the connecting portion 42. Specifically, the sealing portion 200 can surround a portion of the connecting portion 42. Specifically, the sealing portion 200 can surround the central portion 42a and the second outer portion 42b2. The first outer portion 42b1 can be disposed outside the sealing portion 200. The central portion 42a occupies most of the area of ​​the connecting members 141 and 142. Therefore, the sealing portion 200 can surround most of the area of ​​the connecting members 141 and 142.

[0066] Therefore, corrosion of connecting members 141 and 142 by external moisture can be prevented. Specifically, the corrosion rate of connecting members 141 and 142 can be reduced. Additionally, disconnection between connecting members 141 and 142 and bonding pads 134 and 135 or pads 111 and 112 due to external impact can be prevented. Thus, the reliability of the lighting device is improved.

[0067] After forming the connecting members 141 and 142, contact between the central portion 42a and the heat dissipation portion 102 due to external impact can be prevented. Therefore, the electrical characteristics of the lighting device can be improved. The sealing portion 200 surrounds the second outer portion 42b2. The second outer portion 42b2 is located in an area other than the area between the light source portion 130 and the circuit board 110. Therefore, compared with the central portion 42a, the second outer portion 42b2 may be more susceptible to external impact. Since the sealing portion 200 is configured to surround the second outer portion 42b2, damage to the second outer portion due to external impact can be prevented.

[0068] The sealing portion 200 can surround the pads 111 and 112. Specifically, the sealing portion 200 can surround the mating area between the connecting members 141 and 142 and the pads 111 and 112. Therefore, it is possible to prevent the connecting members 141 and 142 from disconnecting from the pads 111 and 112.

[0069] Reference Figure 11 and Figure 12The lighting device may include a sealing portion 200. The sealing portion 200 is disposed between the light source portion 130 and the circuit board 110. Additionally, the sealing portion 200 is disposed on the circuit board 110. Specifically, the sealing portion 200 is disposed on pads 111 and 112. Additionally, the sealing portion 200 is disposed on the light source portion 130. Specifically, the sealing portion 200 is disposed on the support member 133. Specifically, the sealing portion 200 is disposed on the bonding pads 134 and 135. The sealing portion 200 can surround connecting members 141 and 142. Specifically, the sealing portion 200 can surround the entire area of ​​connecting members 141 and 142. Specifically, the sealing portion 200 can surround the connecting portion 42. Specifically, the sealing portion 200 can surround the entire area of ​​the connecting portion 42. Specifically, the sealing portion 200 can surround the central portion 42a, the first outer portion 42b1, and the second outer portion 42b2. Therefore, the connecting members 141 and 142 can be prevented from being corroded by external moisture. Specifically, the corrosion rate of connecting members 141 and 142 can be reduced. Additionally, it can prevent the connecting members 141 and 142 from breaking off from the bonding pads 134 and 135 or pads 111 and 112 due to external impact. Therefore, the reliability of the lighting device is improved.

[0070] After forming the connecting members 141 and 142, contact between the central portion 42a and the heat dissipation portion 102 due to external impact can be prevented. Therefore, the electrical characteristics of the lighting device can be improved. The sealing portion 200 surrounds the first outer portion 42b1. The first outer portion 42b1 is located in an area other than the area between the light source portion 130 and the circuit board 110. Therefore, compared with the central portion 42a, the first outer portion 42b1 may be more susceptible to external impact. Since the sealing portion 200 is configured to surround the first outer portion 42b1, damage to the first outer portion due to external impact can be prevented.

[0071] A sealing portion 200 surrounds a second outer portion 42b2. The second outer portion 42b2 is located in an area other than the region between the light source portion 130 and the circuit board 110. Therefore, compared to the central portion 42a, the second outer portion 42b2 may be more susceptible to external impacts. Since the sealing portion 200 is configured to surround the second outer portion 42b2, damage to the second outer portion due to external impacts can be prevented. The light source portion 130 and the circuit board 110 may include recesses. Specifically, the light source portion 130 may include a first recess G1. The first recess G1 may be formed on the upper surface of the support member 133. The circuit board 110 may include a second recess G2. Bonding pads 134 and 135 may be provided inside the first recess G1. Bonding pads 111 and 112 may be provided inside the second recess G2.

[0072] The sealing portion 200 can surround the bonding pads 134 and 135. Specifically, the sealing portion 200 can surround one end 41. Specifically, the sealing portion 200 can surround the bonding area between the connecting members 141 and 142 and the bonding pads 134 and 135. Therefore, disconnection between the connecting members 141 and 142 and the bonding pads 134 and 135 can be prevented. The bonding pads 134 and 135 are disposed inside the first groove G1. Therefore, movement of the sealing portion 200 toward the light-emitting device 131 can be prevented. That is, the sealing portion 200 can only contact the lower part of the side surface of the light-emitting device 131 facing the circuit board 110, or it can be configured to be spaced apart from the side surface of the light-emitting device 131. Therefore, interference between the light emitted from the light-emitting device 131 and the sealing portion 200 can be prevented. Therefore, the brightness of the lighting device can be improved.

[0073] The sealing portion 200 can surround pads 111 and 112. Specifically, the sealing portion 200 can surround the other end 43. Specifically, the sealing portion 200 can surround the mating area between the connecting members 141 and 142 and the pads 111 and 112. Therefore, disconnection between the connecting members 141 and 142 and the pads 111 and 112 can be prevented. The pads 111 and 112 are disposed inside the second recess G2. Therefore, the size of the sealing portion moving toward the circuit board 110 can be controlled. Therefore, the border area of ​​the circuit board is reduced. Therefore, the size of the lighting device can be reduced.

[0074] The lighting device according to an embodiment includes a connecting member. The connecting member connects a light source unit and a circuit board. Specifically, the connecting member connects between bonding pads and solder pads. The connecting member is electrically connected to the bonding pads and solder pads. The connecting member includes one end, another end, and a connecting portion. The connecting portion connects one end and the other end. The connecting portion includes a central portion and an outer portion. The central portion occupies most of the area of ​​the connecting portion. The central portion is formed recessed. Specifically, the central portion is formed to bulge downwards. Therefore, the central portion is disposed in the area between the light source unit and the circuit board.

[0075] Therefore, when an external impact is transmitted from the outside, the central part can be protected by the light source and the circuit board. This prevents damage to the connecting components due to external impacts, thus improving the reliability of the lighting device. Additionally, the lighting device may include a sealing part. The sealing part may be configured to surround at least one of the connecting part, one end, and the other end.

[0076] Therefore, corrosion of the connecting components can be prevented. Additionally, the fixing force of the connecting components can be improved. Furthermore, short circuits between the connecting components, bonding pads, and solder pads can be prevented. The light source section includes a first recess, and the circuit board includes a second recess. Bonding pads are disposed inside the first recess, and solder pads are disposed inside the second recess. The area of ​​the sealing portion is controlled by the first and second recesses. Therefore, movement of the sealing portion toward the light source section can be prevented. Therefore, the brightness of the lighting device can be improved. Furthermore, the increase in the border area of ​​the circuit board due to the sealing portion can be prevented. Therefore, the size of the lighting device can be reduced.

[0077] The features, structures, effects, etc., described in the above embodiments are included in at least one embodiment of this disclosure, and are not necessarily limited to a single embodiment. Furthermore, the features, structures, effects, etc., shown in each embodiment can be combined or modified by those skilled in the art relative to other embodiments. Therefore, content related to such combinations and modifications should be interpreted as being included within the scope of this disclosure.

[0078] Although embodiments have been described above with reference to specific examples, these are merely illustrative and not intended to limit the scope of this disclosure. Those skilled in the art will understand that various modifications and applications, not specifically illustrated above, can be made without departing from the essential characteristics of the embodiments. For example, each component specifically shown in the embodiments may be implemented in a modified form. Differences associated with such modifications and applications should be interpreted as being included within the scope of this disclosure as defined by the appended claims.

Claims

1. A lighting device, comprising: Heat sink; A circuit board, which is disposed on the heat sink; A light source unit is disposed on the heat sink and includes a light-emitting device; as well as Multiple connecting components connect the circuit board and the light source unit. The light source section includes multiple bonding pads. The circuit board includes multiple solder pads. Each of the plurality of connecting members includes one end connected to a corresponding bonding pad among the plurality of bonding pads, another end connected to a corresponding pad among the plurality of bonding pads, and a connecting portion connecting the one end and the other end. The connecting portion includes a convex portion that protrudes toward the heat sink.

2. A lighting device, comprising: Heat sink; A circuit board, which is disposed on the heat sink; A light source unit is disposed on the heat sink and includes a light-emitting device; Multiple connecting members connect the circuit board and the light source unit; as well as A sealing portion, the sealing portion surrounding at least a portion of the plurality of connecting members, The light source section includes multiple bonding pads. The circuit board includes multiple solder pads. Each of the plurality of connecting members includes one end connected to a corresponding bonding pad among the plurality of bonding pads, another end connected to a corresponding pad among the plurality of bonding pads, and a connecting portion connecting the one end and the other end. The connecting portion includes a convex portion that protrudes toward the heat sink.

3. The lighting device according to claim 1 or 2, in, The light source unit includes a support member. The light-emitting device is disposed on the supporting member. The connecting portion includes a central portion, a first outer portion, and a second outer portion. The central portion is located in the region between the side surface of the support member and the side surface of the circuit board, and The first outer portion and the second outer portion are disposed in a region other than the region between the side surface of the support member and the side surface of the circuit board.

4. The lighting device according to claim 3, in, The central portion protrudes in the direction toward the heat sink, and The first outer portion and the second outer portion protrude in a direction opposite to that toward the heat sink.

5. The lighting device according to claim 4, in, The length of the central portion is greater than the lengths of the first outer portion and the second outer portion.

6. The lighting device according to claim 4, in, The length of the central portion is greater than the sum of the lengths of at least one of the first outer portion and the second outer portion.

7. The lighting device according to claim 4, in, The central portion is 30% to 70% of the length of each of the plurality of connecting members, and Wherein, at least one of the first outer portion and the second outer portion is 15% to 35% of the length of each of the plurality of connecting members.

8. The lighting device according to claim 4, in, The distance between the light source and the circuit board is 60% to 90% of the length of each of the plurality of connecting members, and The minimum distance between each of the plurality of connecting members and the heat sink is 0.1 mm to 2 mm.

9. The lighting device according to claim 4, in, The central portion includes the center where the distance between the central portion and the heat sink is the smallest, and The center is located within 1 / 2 of the distance from the center point ± 10%.

10. The lighting device according to claim 4, in, The heat sink includes grooves, and The groove is disposed between the light source and the circuit board.

11. The lighting device according to claim 4, in, The height of the upper surface of the support member is 90% to 110% of the height of the upper surface of the circuit board.

12. The lighting device according to claim 2, in, The sealing part is disposed between the light source part and the circuit board.

13. The lighting device according to claim 12, in, The connecting portion includes a central portion, a first outer portion, and a second outer portion. The first outer portion is adjacent to the plurality of bonding pads. The second outer portion is adjacent to the plurality of pads. The central portion is located in the region between the side surface of the support member and the side surface of the circuit board. The first outer portion and the second outer portion are disposed in a region other than the area between the side surface of the support member and the side surface of the circuit board, and The sealing portion surrounds the central portion.

14. The lighting device according to claim 13, in, The sealing portion further surrounds the second outer portion.

15. The lighting device according to claim 13, in, The support member includes a first groove. The circuit board includes a second recess. The plurality of bonding pads are disposed inside the first groove. The plurality of pads are disposed inside the second groove, and The sealing portion further surrounds the first outer portion, the second outer portion, one end, and the other end.

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