Laminating device of X-ray sensor

Abstract

The invention provides a laminating device of an X-ray sensor, the laminating device comprises an electric control base and a mounting plate arranged above the electric control base, an adsorption mechanism and a pressing mechanism are fixed on the mounting plate, the adsorption mechanism is used for adsorbing a fluorescent module and transferring the fluorescent module to a chip module, so that the fluorescent module and the chip module are aligned and laminated, and the pressing mechanism is used for pressing the fluorescent module onto the chip module. And the pressing mechanism is used for pressing and fixing the attached part. An adsorption plate of the adsorption mechanism and a pressing plate of the pressing mechanism are both provided with elastic assemblies, so that instantaneous impact force caused when the elastic assemblies make contact with the module is relieved, and the buffering protection effect is achieved. According to the application of the laminating device, the alignment precision of the fluorescent module and the chip module can be improved, precise laminating is ensured, the chip damage risk can be reduced through real-time pressure monitoring, the repair rate and the rejection rate are reduced, the product quality is improved, and the production efficiency can be improved and the labor cost can be saved through the automatic laminating and pressing integrated operation process.

Description

Technical Field

[0001] This invention relates to the field of X-ray imaging technology, and in particular to a bonding device for an X-ray sensor. Background Technology

[0002] Cesium iodide (CsI) is currently the primary scintillation material in X-ray sensors. After the scintillator or phosphor layer is exposed to X-rays, it converts X-ray photons into visible light, which is then converted into an image electrical signal by a photodetector that functions as a photodiode, thereby obtaining a digital image.

[0003] In the assembly process of X-ray sensors, it is necessary to bond a fluorescence module (e.g., an aluminum substrate covered with a cesium iodide scintillator layer) to a photodetector. The existing bonding process generally includes the following steps:

[0004] First, the large wafer is cut into individual photodetector chips, then the chips are bonded to the PCBA, and wire bonding is performed between the chips and the PCBA.

[0005] After the chips are assembled, aluminum substrate bonding is performed, and the phosphor module is bonded to the chip with adhesive. During the process, the adhesive needs to be manually applied to the cesium iodide surface first, then manually applied to the light-receiving surface of the chip, and then the phosphor module and chip are manually aligned and bonded together. A roller is used to press the phosphor module and chip together.

[0006] The manual application method has several drawbacks:

[0007] 1. Manual bonding relies on personal experience to place the aluminum base and press it together. It is impossible to accurately control the amount of adhesive, which may result in insufficient adhesive, causing abnormal black and bright spots in the image and affecting the yield.

[0008] 2. During operation, hands may touch the chip surface, causing stains and abnormal damage to the chip surface;

[0009] 3. During the manual pressing process with rollers, the protective adhesive on the gold wire may be accidentally touched, causing damage to the gold wire and abnormal channel issues;

[0010] 4. Manual bonding of aluminum base positioning is inaccurate and has low precision, which poses a risk of fluorescent module misalignment and affects the yield.

[0011] The aforementioned drawbacks limit the performance of manual bonding in terms of production efficiency and product quality, making it less competitive in production environments that require high efficiency and high quality. Summary of the Invention

[0012] In view of the shortcomings of the prior art described above, the present invention provides a bonding device for an X-ray sensor, the bonding device including an electrically controlled base, and a mounting plate fixed above the electrically controlled base by a support column;

[0013] The mounting plate is fixed with an adsorption mechanism and a pressing mechanism located in front of the adsorption mechanism. The adsorption mechanism is used to adsorb the fluorescent module and transfer the fluorescent module to the surface of the chip module, so that the fluorescent module and the chip module are aligned and bonded. The pressing mechanism is used to press and fix the bonding area.

[0014] The upper surface of the electronic control base is fixed with a slide rail in the front-to-back direction. The movable platform can move back and forth along the slide rail. A first positioning plate and a second positioning plate located in front of the first positioning plate are fixed on the movable platform. The first positioning plate is located below the adsorption mechanism and is used to place the fluorescent module. The second positioning plate is located below the pressing mechanism and is used to place the chip module.

[0015] Optionally, the phosphor module includes a metal substrate and a phosphor layer, with the lower surface of the phosphor layer away from the metal substrate coated with adhesive; the chip module includes a photodetector chip, with the upper surface of the photodetector chip coated with adhesive.

[0016] Optionally, the adsorption mechanism includes an adsorption cylinder fixed to the mounting plate. The movable end of the adsorption cylinder is connected downward to an adsorption assembly via a flange. The adsorption assembly includes a horizontally arranged connecting plate and an adsorption plate arranged parallel to the bottom of the connecting plate. Multiple buffer springs are connected between the adsorption plate and the connecting plate. A guide post fixed to the upper surface of the adsorption plate passes through the connecting plate upward. The lower surface of the adsorption plate is provided with multiple air holes for adsorbing the fluorescent module.

[0017] Optionally, the pressing mechanism includes a pressing cylinder fixed to the mounting plate. The movable end of the pressing cylinder is connected downward to a pressing assembly via a flange. The pressing assembly includes a horizontally arranged pressing plate. A plurality of spring bolts arranged in an array are fixed on the lower surface of the pressing plate. Each spring bolt includes a housing and a pressing head. The pressing head is installed in the housing by a spring.

[0018] Optionally, the flange connected below the pressure cylinder is connected to the upper surface of the pressure plate via a pressure sensor, which is used to measure the pressure applied at the contact point in real time.

[0019] Optionally, a heating rod is provided below the second positioning plate for heating the chip module placed on the second positioning plate.

[0020] Optionally, the edge of the second positioning plate is surrounded by multiple blocks, and the second positioning plate is drilled with multiple holes. By moving the position of the blocks to different holes, the position of the blocks can be changed to adapt to chip modules of different sizes.

[0021] Optionally, the first positioning plate is further provided with a carrier, and the fluorescent module is placed on the first positioning plate through the carrier; when the fluorescent module is placed on the carrier, the side of the fluorescent module coated with adhesive faces down.

[0022] Optionally, the electrical control base is equipped with a pressure gauge, heating switch, thermostat, timer, emergency stop button, and start button.

[0023] Optionally, a working area is formed between the electronic control base and the mounting plate, and an acrylic protective plate is provided around the left, right and rear sides of the working area, and a safety light curtain is installed on the front side of the working area.

[0024] As described above, this invention provides a bonding device for an X-ray sensor. The bonding device includes an electrically controlled base and a mounting plate disposed above the base. The mounting plate is fixed with an adsorption mechanism and a pressing mechanism. The adsorption mechanism adsorbs a fluorescent module and transfers it onto a chip module, aligning and bonding the fluorescent module with the chip module. The pressing mechanism presses and fixes the bonding area. Both the adsorption plate of the adsorption mechanism and the pressing plate of the pressing mechanism are equipped with elastic components to mitigate the instantaneous impact force caused when they contact the module, providing a buffering protection. The application of this bonding device can improve the alignment accuracy between the fluorescent module and the chip module, ensuring precise bonding. Real-time pressure monitoring can reduce the risk of chip damage, lower the rework rate and scrap rate, and improve product quality. The integrated bonding and pressing automated process can improve production efficiency and save labor costs. Attached Figure Description

[0025] Figure 1 The diagram shown is a three-dimensional structural schematic of the bonding device in Embodiment 1 of the present invention.

[0026] Figure 2 The diagram shown is a three-dimensional structural schematic of the adsorption mechanism in Embodiment 1 of the present invention.

[0027] Figure 3 The diagram shown is a three-dimensional structural schematic of the pressing mechanism in Embodiment 1 of the present invention.

[0028] Figure 4 The diagram shown is a three-dimensional structural schematic of the movable platform in Embodiment 1 of the present invention.

[0029] Figure 5 The diagram shows a structure in Embodiment 1 of the present invention in which a fluorescent module and a chip module are placed on a movable platform.

[0030] Figure 6 The diagram shown is a top view of the movable platform in Embodiment 1 of the present invention.

[0031] Component designation explanation

[0032] 1. Electrical control base; 2. Mounting plate; 3. Support column; 312. Fluorescent module; 322. Chip module; 11. Adsorption cylinder; 14. Flange; 15. Connecting plate; 16. Adsorption plate; 17. Buffer spring; 18. Guide column; 12. Guide bearing; 13. First positioning plate; 31. Pressing cylinder; 21. Pressing plate; 25. Flange; 24. Spring bolt; 26. Guide column; 22. Guide bearing; 23. Pressure sensor; 27. Moving platform; 30. Slide rail; 35. First positioning plate; 31. Second positioning plate; 32. Stop block; 33. Threaded hole; 34. Carrier; 311. Pressure gauge; 53. Heating switch; 51. Temperature controller; 52. Timer; 54. Emergency stop button; 55. Start button; 56. Level; 57. Vacuum negative pressure gauge; 58. Air pressure regulating valve; 59. Safety light curtain; 41. Detailed Implementation

[0033] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0034] In the detailed description of embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged and not to scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In actual fabrication, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0035] For ease of description, spatial relation terms such as “below,” “under,” “lower than,” “below,” “above,” and “upper” may be used herein to describe the relationship between one element or feature shown in the accompanying drawings and other elements or features. It will be understood that these spatial relation terms are intended to include directions other than those depicted in the drawings for the device in use or operation. Furthermore, when a layer is referred to as being “between” two layers, it can be the only layer between the two layers, or there may be one or more layers in between. The phrase “between” as used herein includes both endpoint values.

[0036] In the context of this application, the structure described above the first feature may include embodiments in which the first and second features are formed in direct contact, or embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0037] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0038] Example 1

[0039] This embodiment provides a bonding device for an X-ray sensor, such as... Figures 1 to 6 As shown, the bonding device includes:

[0040] An electric control base 1 and a mounting plate 2 located above the electric control base, with a vertical support column 3 fixed between the electric control base 1 and the mounting plate 2;

[0041] The mounting plate 2 is fixed with an adsorption mechanism and a pressing mechanism. The adsorption mechanism is used to adsorb the fluorescent module 312 and transfer the fluorescent module 312 to the surface of the chip module 322, so that the fluorescent module 322 and the chip module 312 are aligned and bonded. The pressing mechanism is used to press and fix the bonding area.

[0042] The adsorption mechanism includes an adsorption cylinder 11 fixed to the mounting plate 2. The movable end of the adsorption cylinder 11 is connected downward to an adsorption assembly via a flange 14. The adsorption assembly includes a horizontally arranged connecting plate 15 and an adsorption plate 16 arranged parallel to the bottom of the connecting plate 15. Multiple buffer springs 17 are arranged side by side between the adsorption plate 16 and the connecting plate 15. A guide post 18 fixed to the upper surface of the adsorption plate 16 extends upward through the connecting plate 15 to prevent the buffer springs 17 from shifting or folding during extension and retraction. The guide post 18 provides additional support and stability. Similarly, a guide post 12 fixed to the upper surface of the connecting plate 15 extends upward through the mounting plate 2 to serve as a guide for the vertical movement of the adsorption assembly and prevent shifting. A guide bearing 13 is bushed at the opening in the mounting plate 2 through which the guide post 12 passes. As a basic mechanical component, the guide bearing mainly plays a supporting and positioning role, and can withstand axial and radial loads, thereby supporting the moving parts of the mechanical equipment and enabling it to operate smoothly and efficiently.

[0043] The lower surface of the adsorption plate 16 has multiple air holes for adsorbing fluorescent modules. The adsorption plate 16 is connected to a vacuum line, creating a negative pressure to adsorb the fluorescent modules located on the lower first positioning plate 31. The adsorption cylinder, driven by compressed air or other gas, produces linear motion at its movable end. The cylinder consists of a cylinder sleeve, piston, piston rod, and seals, etc., and existing technologies have mature solutions, which will not be elaborated here. A buffer spring is used to mitigate the instantaneous impact force caused by the fluorescent modules when the adsorption plate descends, protecting the equipment and products.

[0044] The pressing mechanism includes a pressing cylinder 21 fixed to the mounting plate 2. The movable end of the pressing cylinder 21 is connected downward to a pressing assembly via a flange 24. The pressing assembly includes a horizontally arranged pressing plate 25. Multiple arrayed spring bolts 26 are fixed to the lower surface of the pressing plate 25. Each spring bolt 26 includes a housing and a pressing head, with the pressing head mounted inside the housing by a spring. A guide post 22 fixed to the upper surface of the pressing plate 25 extends upward through the mounting plate 2 to serve as a guide for the up-and-down movement of the pressing assembly, preventing deviation. For the pressing mechanism, a guide bearing 23 is also bushed at the opening in the mounting plate through which the guide post passes.

[0045] Furthermore, the flange connected below the pressing cylinder 21 is connected to the upper surface of the pressing plate 25 via a pressure sensor 27. After the adsorption mechanism adsorbs the fluorescent module 322, it is placed on the chip module 312 located on the second positioning plate. The fluorescent module 322 and the chip module 312 are aligned and bonded. Then, the spring bolt 26 of the pressing mechanism is used to press the bonding area together. The spring bolt 26 is used to reduce the instantaneous impact force caused by the pressing plate descending to the bonding area, playing a buffering and protective role. At the same time, the pressure sensor 27 converts the pressure signal into an electrical signal to measure the pressure applied to the bonding area in real time, so as to monitor and make appropriate adjustments, such as adjusting the stroke of the pressing cylinder to increase or decrease the pressing force.

[0046] Furthermore, the upper surface of the electronically controlled base 1 is fixed with a slide rail 35 along the front-to-back direction. The movable platform 30 can move back and forth along the slide rail 35. A first positioning plate 31 and a second positioning plate 32 located in front of the first positioning plate 31 are fixed on the movable platform 30. The first positioning plate 31 is located below the adsorption mechanism and is used to place the fluorescent module 312; the second positioning plate 32 is located below the pressing mechanism and is used to place the chip module 322. By moving the movable platform 30 back and forth, the operation flow of the adsorption mechanism or the pressing mechanism is matched. When the adsorption mechanism adsorbs the fluorescent module 312, the movable platform 30 makes the adsorption plate 16 face the fluorescent module 312 to achieve adsorption. Then, the movable platform 30 is controlled to move so that the adsorption mechanism faces the second positioning plate 32, and the fluorescent module 312 is attached to the chip module 322. The movable platform is controlled to move again so that the pressing mechanism faces the second positioning plate, and the fluorescent module 312 and the chip module 322 are pressed and fixed.

[0047] A heating rod is provided below the second positioning plate 32 to heat the chip module 322 placed on the second positioning plate 32, so as to prevent the adhesive coated on the surface of the chip module from solidifying due to low temperature.

[0048] Furthermore, the second positioning plate 32 is surrounded by multiple stops 33, and the second positioning plate 32 is drilled with multiple holes 34. By moving the positions of the stops 33 to different holes 34, the positions of the stops can be changed to accommodate chip modules of different sizes. In addition, the first positioning plate is also provided with a carrier 311, through which the fluorescent module is placed on the first positioning plate 31. When the fluorescent module 312 is placed on the carrier 311, the adhesive-coated side faces down. The fluorescent module includes a metal substrate and a phosphor layer (scintillator layer, such as cesium iodide). The metal substrate is preferably an aluminum substrate, which serves as a support. The chip module includes a photodetector chip and may also include a circuit board (such as a PCBA) bonded to the photodetector chip.

[0049] After the fluorescent module and the chip module are mounted, an X-ray sensor is formed. X-rays enter the scintillator layer through the aluminum substrate. After the scintillator layer is exposed to X-rays, the X-ray photons are converted into visible light. The photodetector converts the visible light into an image electrical signal, thereby obtaining a digital image.

[0050] The front side of the electrical control base 1 is equipped with a pressure gauge 53, a heating switch 51, a temperature controller 52, a timer 54, and an emergency stop button 55. The pressure gauge is used to monitor the pressure value of the pressure sensor; the heating switch is used to control the heating of the heating rod; the temperature controller is used to control and adjust the heating temperature of the heating rod, with a temperature measurement accuracy of within 2 degrees Celsius; the timer is used to control the pressure holding time of the pressing mechanism; the emergency stop button allows the operator to quickly press the emergency stop switch in case of an emergency to immediately stop the equipment operation and prevent further escalation of the accident. The left or right side of the electrical control base is also equipped with a start button 56 for controlling the operation of the entire bonding device. The upper surface of the mounting plate is equipped with a level 57, a vacuum negative pressure gauge 58, and a pressure regulating valve 59.

[0051] Furthermore, a working area is formed between the electrical control base 1 and the mounting plate 2. The left, right, and rear sides of the working area are surrounded by acrylic protective panels for safety protection. A safety light curtain 41, including an upper light curtain and a lower light curtain, is installed on the front side of the working area to prevent personnel from entering the working area. Once personnel enter the working area, the safety light curtain will promptly trigger an alarm, stop equipment operation, or implement other safety protection measures.

[0052] The operation process of the above bonding device is as follows:

[0053] 1. Place the coated phosphor module and chip module on the first positioning plate and the second positioning plate respectively; the phosphor module includes a metal substrate and a phosphor layer, with the coated surface facing down; the coated surface of the chip module faces up.

[0054] 2. Press the start button. The moving platform moves back and forth to make the adsorption plate face the fluorescent module to achieve adsorption. Then the moving platform moves to make the adsorption mechanism face the second positioning plate. The adsorption plate falls to attach the fluorescent module to the chip module. Control the moving platform to move again to make the pressing mechanism face the second positioning plate. The fluorescent module and the chip module are pressed and fixed by the spring bolt.

[0055] 3. After pressing and holding for a certain period of time, remove the sensor with the fluorescent module and chip module bonded together, and proceed to the next product.

[0056] In summary, this invention provides a bonding device for an X-ray sensor. The bonding device includes an electrically controlled base and a mounting plate positioned above the base. The mounting plate is fixed with an adsorption mechanism and a pressing mechanism. The adsorption mechanism adsorbs a fluorescent module and transfers it onto a chip module, ensuring alignment and bonding between the fluorescent module and the chip module. The pressing mechanism presses and secures the bonding area. Both the adsorption plate of the adsorption mechanism and the pressing plate of the pressing mechanism are equipped with elastic components to mitigate the instantaneous impact force caused when they contact the module, providing a buffering protection. The application of this bonding device improves the alignment accuracy between the fluorescent module and the chip module, ensuring precise bonding. Real-time pressure monitoring reduces the risk of chip damage, lowers the rework rate and scrap rate, and improves product quality. The integrated bonding and pressing automated process increases production efficiency and saves labor costs.

[0057] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A bonding device for an X-ray sensor, characterized in that, The bonding device includes an electrically controlled base, and a mounting plate is fixed on the top of the electrically controlled base by a support column; The mounting plate is fixed with an adsorption mechanism and a pressing mechanism located in front of the adsorption mechanism. The adsorption mechanism is used to adsorb the fluorescent module and transfer the fluorescent module to the surface of the chip module, so that the fluorescent module and the chip module are aligned and bonded. The pressing mechanism is used to press and fix the bonding area. The upper surface of the electronic control base is fixed with a slide rail along the front-to-back direction. The movable platform can move back and forth along the slide rail. A first positioning plate and a second positioning plate located in front of the first positioning plate are fixed on the movable platform. The first positioning plate is located below the adsorption mechanism and is used to place the fluorescent module. The second positioning plate is located below the pressing mechanism and is used to place the chip module.

2. The bonding device for an X-ray sensor according to claim 1, characterized in that: The fluorescent module includes a metal substrate and a phosphor layer, with adhesive coating on the lower surface of the phosphor layer away from the metal substrate; the chip module includes a photodetector chip, with adhesive coating on the upper surface of the photodetector chip.

3. The bonding device for an X-ray sensor according to claim 1, characterized in that: The adsorption mechanism includes an adsorption cylinder fixed to the mounting plate. The movable end of the adsorption cylinder is connected downward to an adsorption assembly via a flange. The adsorption assembly includes a horizontally arranged connecting plate and an adsorption plate arranged parallel to the bottom of the connecting plate. Multiple buffer springs are connected between the adsorption plate and the connecting plate. A guide post fixed to the upper surface of the adsorption plate passes through the connecting plate upward. The lower surface of the adsorption plate is provided with multiple air holes for adsorbing fluorescent modules.

4. The bonding device for an X-ray sensor according to claim 1, characterized in that: The pressing mechanism includes a pressing cylinder fixed to the mounting plate. The movable end of the pressing cylinder is connected downward to a pressing assembly via a flange. The pressing assembly includes a horizontally arranged pressing plate. Multiple arrayed spring bolts are fixed on the lower surface of the pressing plate. Each spring bolt includes a housing and a pressing head. The pressing head is installed in the housing via a spring.

5. The bonding device for an X-ray sensor according to claim 1, characterized in that: The flange connected below the lower pressure cylinder is connected to the upper surface of the lower pressure plate via a pressure sensor, which is used to measure the pressure applied to the mating area in real time.

6. The bonding device for an X-ray sensor according to claim 1, characterized in that: A heating rod is provided below the second positioning plate for heating the chip module placed on the second positioning plate.

7. The bonding device for an X-ray sensor according to claim 1, characterized in that: The second positioning plate is surrounded by multiple blocks, and the second positioning plate is drilled with multiple holes. By moving the position of the blocks to different holes, the position of the blocks can be changed to adapt to chip modules of different sizes.

8. The bonding device for an X-ray sensor according to claim 1, characterized in that: The first positioning plate is also provided with a carrier, and the fluorescent module is placed on the first positioning plate through the carrier; when the fluorescent module is placed on the carrier, the side of the fluorescent module coated with adhesive faces down.

9. The bonding device for an X-ray sensor according to claim 1, characterized in that: The electrical control base is equipped with a pressure gauge, heating switch, temperature controller, timer, emergency stop button, and start button.

10. The bonding device for an X-ray sensor according to claim 1, characterized in that: The working area is formed between the electrical control base and the mounting plate. Acrylic protective plates are provided on the left, right and rear sides of the working area, and a safety light curtain is installed on the front side of the working area.

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