Laminating device of X-ray sensor

The bonding device, consisting of an electronically controlled base and a mounting plate, enables precise alignment and bonding of the fluorescent module and the chip module. This solves the problems of inaccurate glue control, chip damage, and inaccurate positioning that exist in manual bonding, thereby improving production efficiency and product quality.

CN122073885APending Publication Date: 2026-05-22IRAY IMAGE TECH TAICANG CO LTD
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Patent Information

Application Number
CN202411673915.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-21
Publication Date
2026-05-22

AI Technical Summary

Technical Problem

In the existing X-ray sensor bonding process, manual operation leads to inaccurate glue control, chip damage, gold wire damage, and inaccurate positioning, affecting yield and production efficiency.

Method used

The bonding device, consisting of an electronically controlled base and a mounting plate, uses an adsorption mechanism to adsorb the fluorescent module and transfer it to the surface of the chip module for alignment and bonding. A pressing mechanism then presses and fixes the module, and elastic components and pressure sensors are used for real-time monitoring and adjustment.

Benefits of technology

This improved the alignment accuracy between the fluorescent module and the chip module, reduced the risk of chip damage, lowered the rework rate and scrap rate, improved product quality and increased production efficiency, and saved labor costs.

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Abstract

The invention provides a laminating device of an X-ray sensor, the laminating device comprises an electric control base and a mounting plate arranged above the electric control base, an adsorption mechanism and a pressing mechanism are fixed on the mounting plate, the adsorption mechanism is used for adsorbing a fluorescent module and transferring the fluorescent module to a chip module, so that the fluorescent module and the chip module are aligned and laminated, and the pressing mechanism is used for pressing the fluorescent module onto the chip module. And the pressing mechanism is used for pressing and fixing the attached part. An adsorption plate of the adsorption mechanism and a pressing plate of the pressing mechanism are both provided with elastic assemblies, so that instantaneous impact force caused when the elastic assemblies make contact with the module is relieved, and the buffering protection effect is achieved. According to the application of the laminating device, the alignment precision of the fluorescent module and the chip module can be improved, precise laminating is ensured, the chip damage risk can be reduced through real-time pressure monitoring, the repair rate and the rejection rate are reduced, the product quality is improved, and the production efficiency can be improved and the labor cost can be saved through the automatic laminating and pressing integrated operation process.
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