Welding methods applicable to multi-layer precision structures, radiators, and aircraft

Abstract

This invention discloses a welding method, heat sink, and aircraft applicable to multi-layer precision structures, belonging to the field of aircraft welding technology. The welding method includes: depositing a solder film on a first substrate to obtain a substrate to be etched; optimizing the laser scanning path according to a preset precision structure and solder pattern; placing the substrate to be etched at the laser etching location and performing integrated scanning etching using a laser to complete the preparation of the solder pattern and precision structure, obtaining a first substrate to be welded; vertically aligning a first welding cover plate with the first substrate to be welded and performing interlayer welding of the precision structure; repeating the above process to complete the interlayer welding of the double-layer precision structure. This invention achieves precise preparation of solder for small-scale complex pattern welding points and integrated interlayer welding of multi-layer precision structures through laser etching, meeting the stringent requirements of the aerospace field for high airtightness, high sealing performance, and high-precision welding.

Description

Technical Field

[0001] This invention relates to the field of aircraft welding technology, and in particular to a welding method, radiator and aircraft applicable to multi-layer precision structures. Background Technology

[0002] In the field of aerospace vehicles, radiators are mostly thin-walled fins, microchannels, honeycomb structures, and other highly precision structures that are extremely prone to deformation, burn-through, and collapse. These precision structures, due to their extremely thin walls and minute geometric features, are highly susceptible to deformation, burn-through, or collapse during manufacturing and use. Furthermore, the operation of spacecraft in extreme environments such as high temperature, high pressure, and vibration places stringent requirements on the airtightness, sealing, and dimensional accuracy of radiators. Ordinary welding techniques, due to concentrated heat input and excessive temperature gradients, are prone to structural damage and cannot meet practical application needs.

[0003] To manufacture and use this type of multi-layered, high-precision structure, brazing / TLP diffusion welding (Transient Liquid Phase Welding, TLP) is currently widely used. These components typically have numerous small-scale weld points (unit weld size ranging from tens of micrometers to millimeters). Therefore, precise addition of solder is a crucial prerequisite for achieving high-strength connections and meeting performance and functional requirements.

[0004] Traditional methods for preparing brazing / TLP diffusion solder mainly include amorphous solder cutting, electroplating, and screen printing. Cutting amorphous solder is difficult to achieve complex shapes, and is inefficient and inaccurate, especially for replicating small patterns. Electroplating, while producing a thinner interlayer, is difficult to manufacture with multi-component components, making it hard to guarantee high-strength connections. It also suffers from complex processes, difficulty in achieving localized patterned deposition, and significant material waste. Screen printing, while enabling patterned preparation, suffers from low printing precision, poor control over interlayer thickness, and is prone to edge overflow and uneven thickness, making it difficult to accurately add small-sized solder and meet the stringent requirements of high-end manufacturing for welding precision and joint quality.

[0005] These problems severely restrict the reliability and service life of aerospace heat sinks. Therefore, a new welding method is urgently needed to meet the stringent requirements of precision structures for welding accuracy and joint quality. Summary of the Invention

[0006] To address the aforementioned technical problems, this invention provides a welding method, radiator, and aircraft applicable to multi-layer precision structures. By using laser etching, it achieves precise preparation of solder for small-scale complex pattern welding points and interlayer welding of multi-layer precision structures, thus meeting the stringent requirements of the aerospace field for high airtightness, high sealing performance, and high-precision welding.

[0007] In a first aspect of the present invention, a welding method applicable to multilayer precision structures is provided, comprising: depositing a solder film on a first substrate by physical vapor deposition, chemical deposition, or electroplating to obtain a substrate to be etched; the thickness of the solder film is 0.05±0.005mm; optimizing a laser scanning path according to a preset precision structure and solder pattern; placing the substrate to be etched at a laser etching location, and performing integrated scanning etching using a laser to complete the preparation of the solder pattern and precision structure, thereby obtaining a first substrate to be welded with a precision structure and solder pattern; and covering one side of a first welding cover plate onto the solder pattern of the first substrate to be welded. The solder pattern and precision structure are vertically aligned and interlayer welding of the precision structure is performed. The preparation process of the solder pattern and precision structure is repeated, and the solder pattern and precision structure are etched on the other side of the first welding cover plate to obtain the second substrate to be welded. One side of the second welding cover plate is vertically aligned with the solder pattern of the second substrate to be welded to complete the interlayer welding of the double-layer precision structure. The solder joints of the solder pattern and the solder joints of the precision structure are designed to match each other. The correspondence is: S1=k×S2, where S1 is the area of ​​the solder joint of the solder pattern; S2 is the area of ​​the solder joint of the precision structure; k is the density ratio of the solder after welding to the solder before welding, and k is 0.4-1.

[0008] Furthermore, the integrated scanning etching first etches the solder film to complete the preparation of the solder pattern, and then continues to etch the first substrate to complete the preparation of the precision structure.

[0009] Furthermore, the laser scanning route can be optimized by using path planning software to employ one or more of the following methods: region segmentation, changing the filling method, and path interleaving.

[0010] Furthermore, the laser source is selected from nanosecond pulsed lasers, femtosecond ultrafast lasers, and picosecond lasers.

[0011] Furthermore, the solder is selected from metals, alloys, and thermally and electrically conductive thin films.

[0012] Furthermore, precision structures include, but are not limited to, micropillar arrays, micropore arrays, microgroove arrays, mesh structures, and interconnected flow channels.

[0013] Furthermore, according to the requirements of a precision structure with three or more layers, the solder pattern and the preparation process of the precision structure are repeated, and welding cover plates are added in sequence to complete the interlayer welding of the precision structure with three or more layers.

[0014] Furthermore, interlayer welding employs one of the following methods: diffusion welding, brazing, or thermostatic welding.

[0015] In a second aspect of the invention, a heat sink is provided, wherein the heat dissipation structure is welded using the welding method described above.

[0016] In a third aspect of the invention, an aircraft is provided that uses the aforementioned heat sink for thermal control regulation.

[0017] The technical solution of the present invention can achieve the following technical effects:

[0018] Various precision structures can be precisely fabricated using integrated laser scanning etching, achieving the required dimensional accuracy and uniformity of distribution. This avoids problems such as dimensional deviations and irregular shapes that occur when fabricating precision structures using traditional processes, and is especially suitable for fabricating micron-level microstructures.

[0019] The superposition and welding of multi-layer precision structures can realize the integration of structural functions (such as heat dissipation, support, and airflow integration), improve the overall performance of components, meet the requirements of aircraft for multi-functional and high-performance precision components, and can significantly improve the heat dissipation efficiency of radiators.

[0020] Adapting to the design trends of lightweighting and miniaturization, various precision structures can reduce the weight of components while ensuring structural strength, which is in line with the design concept of lightweight aircraft, and at the same time improves the efficiency of components such as heat dissipation and airflow.

[0021] It should be understood that the description in the Summary of the Invention is not intended to limit the key or essential features of the embodiments of the present invention, nor is it intended to restrict the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments will be briefly described below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In the drawings, the same or similar reference numerals represent the same or similar elements, wherein:

[0023] Figure 1 This is a flowchart of the double-layer welding method in this embodiment;

[0024] Figure 2 This is a schematic diagram of the equipment structure for the brazing method in this embodiment;

[0025] Figure 3 This is a flowchart of the multi-layer welding process of the brazing method in this embodiment;

[0026] Figure 4 This is a top view of the structure of the first substrate to be welded in this embodiment;

[0027] Figure 5 This is a side view of the structure of the first substrate to be welded in this embodiment;

[0028] Figure 6 This is a side view of the interlayer welding of the first substrate to be welded in this embodiment;

[0029] in, Figure 1-6 The correspondence between the reference numerals and component names in the attached drawings is as follows:

[0030] 1. Laser; 2. Optical shutter; 3. Processing head; 4. CCD vision positioning; 5. Welding sample; 6. Machine tool; 7. Control terminal. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0032] The terminology used in this invention is for the purpose of describing particular embodiments only and is not intended to limit the embodiments of the invention. The singular forms “a,” “the,” and “the” as used in the embodiments of the invention and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0033] As one of the objectives of this invention, this invention provides a welding method applicable to multi-layer precision structures, such as... Figure 1 As shown, it includes:

[0034] S1: Solder film deposition: A solder film is deposited on the first substrate to obtain the substrate to be etched;

[0035] S2: Laser scanning path optimization: Optimize the laser scanning path based on the preset precision structure and solder pattern;

[0036] S3: Integrated scanning etching: The substrate to be etched is placed at the laser etching area, and integrated scanning etching is performed using a laser to complete the preparation of solder patterns and precision structures, resulting in a first substrate to be welded with the precision structures and solder patterns.

[0037] S4: Interlayer welding: Cover one side of the first welding cover plate onto the solder pattern of the first substrate to be welded, align them vertically, and perform interlayer welding of the precision structure;

[0038] S5: Preparation of the second substrate to be welded: Repeat the preparation process of the solder pattern and the precision structure, and etch the solder pattern and the precision structure on the other side of the first welding cover plate to obtain the second substrate to be welded;

[0039] S6: Double-layer precision structure welding: Align one side of the second welding cover plate vertically with the solder pattern of the second substrate to be welded to complete the interlayer welding of the double-layer precision structure.

[0040] In some specific implementations, the substrate to be etched needs to be clamped and positioned when placed in the laser etching process to ensure the accuracy of the etching process. In the scanning path optimization, according to the solder pattern of the precision structure, the path planning software can be used to reduce or avoid heat accumulation by adopting methods such as regional segmentation, changing the filling method, and path interleaving to ensure the uniformity of laser etching.

[0041] In some specific embodiments, integrated scanning etching first etches the solder film to prepare the solder pattern, and then continues to etch the first substrate to prepare the precision structure. Specifically, the laser first etches the solder film on the surface of the substrate to be etched, removing excess solder film according to the preset solder pattern, and precisely retaining the solder joints, weld beads, and other solder patterns required for welding, ensuring that the size and shape of the solder pattern meet the design requirements. After the solder film etching is completed, the laser continues to etch the first substrate along the optimized scanning path, removing excess parts of the substrate according to the preset precision structure design, and preparing precision structures such as micropillar arrays and microvia arrays, ultimately completing the preparation of the first substrate to be welded. During the etching process, by precisely controlling the laser energy density and scanning speed, it is ensured that the first substrate below is not damaged during solder film etching, and that the already formed solder pattern is not destroyed during substrate etching. In this method, the etching energy of the solder film can be appropriately reduced, used only to remove excess solder; the substrate etching energy can be adjusted according to the substrate material and thickness to ensure that the etching depth and accuracy meet the standards. Simultaneously, the non-contact processing characteristics of laser etching are utilized to avoid mechanical stress damage to the substrate. The solder film is etched first and can serve as a positioning reference for subsequent substrate etching, reducing positioning errors and ensuring precise alignment between the precision structure and the solder pattern. This provides a guarantee for accurate interlayer welding and reduces the risk of interlayer misalignment. This method is suitable for intermediate layer welding of precision structures. Compared to the method of using a mask to deposit solder on precision structures, this method offers higher precision, accurate solder application, and no solder seepage, ensuring the functionality of the precision structure.

[0042] In some specific implementations, the solder joints of the solder pattern are designed to correspond and match the solder joints of the precision structure. The position, size, and number of each solder joint in the solder pattern correspond one-to-one with the solder joints (or key connection parts of the precision structure) of the precision structure. This ensures that during interlayer welding, the solder joints can accurately cover the connection area of ​​the precision structure, achieving coordinated stress distribution between the precision structure and the welded joint. This guarantees welding strength without obstructing the functional areas of the precision structure, providing dual protection for structural function and welding performance. It avoids problems such as localized stress concentration and structural loosening caused by solder joint misalignment, making it particularly suitable for the use requirements of aircraft in extreme vibration environments.

[0043] In some specific implementations, during laser scanning path optimization, the solder joints (i.e., the solder joints) of the solder pattern are pre-defined based on the specific pattern of the precision structure. The theoretical basis for this is to obtain the correspondence between the area S1 of the solder residue area and the area S2 of the solder joint: S1 = k × S2. Here, k is the density ratio of the solder after soldering to the solder before soldering, and the value of k ranges from 0.4 to 1. The value of k varies depending on the brazing process and the composition of the solder.

[0044] In some specific embodiments, a solder film is deposited and prepared by physical vapor deposition, chemical deposition, or electroplating, with a thickness of 0.05 ± 0.005 mm. All three deposition methods can achieve uniform and precise solder film deposition with strong thickness control, avoiding problems such as uneven thickness and edge overflow associated with traditional solder addition methods (e.g., screen printing). This provides a high-quality solder base for subsequent laser etching and interlayer welding. Different deposition methods can be adapted to different substrate materials, solder types, and precision structural requirements, improving versatility and solving the problem of limited applicability of traditional deposition methods. This allows for the manufacturing needs of various precision components, such as aircraft heat sinks.

[0045] In some specific implementations, the laser source is selected from nanosecond pulsed lasers, femtosecond ultrafast lasers, and picosecond lasers. Due to their extreme pulse width, ultra-high peak power density, and "cold processing" characteristics, lasers can achieve high-precision microstructure fabrication of ultrathin materials within a minimal heat-affected zone, making them suitable for ultrathin solders and high-precision manufacturing of complex images. The laser's wavelength, energy density, scanning speed, and other parameters must be compatible with the thickness of the deposited solder film and the substrate material to ensure thorough etching without residue.

[0046] In some specific embodiments, the solder is selected from metals, alloys, and thermally and electrically conductive thin films. Metals can be selected from aluminum, copper, etc., and alloys can be selected from titanium alloys, aluminum alloys, nickel-based high-temperature alloys, etc. The solder must have good welding performance and thermal and electrical conductivity. The appropriate solder type can be selected based on the functional requirements of the precision structure, the substrate material, the deposition method, the laser etching process, and the operating environment to ensure strong adhesion between the solder film and the substrate, good etching results, and high joint strength after welding. This solves the problems of poor thermal and electrical conductivity and weak connections of traditional solders, meeting the functional requirements of precision components in aircraft radiators. The solder density ratio between the solder after welding and the solder before welding must be 0.4-1 to ensure stable deformation, no solder seepage, and guaranteed joint strength during welding. Based on the correspondence between the area of ​​the residual solder region and the area of ​​the welded joint, it can be seen that in actual operation, when the k value is 0.8±0.05, the welding effect is best when the area of ​​the residual solder region is approximately 0.8 times the area of ​​the welded joint.

[0047] In some specific implementations, the precision structure includes, but is not limited to, micropillar arrays, micropore arrays, microgroove arrays, mesh structures, and interconnected flow channels. The precision structure can be a common type of precision structure found in the aircraft field (such as heat sinks and electronic component supports), addressing the problem that existing welding methods can only adapt to a single type of precision structure and have poor versatility. This method adapts to a wide range of precision structures commonly found in the aircraft field, improving the applicability and practicality of the welding method.

[0048] In some specific embodiments, depending on the need for a precision structure with three or more layers, the solder pattern and the fabrication process of the precision structure are repeated, and welding cover plates are added sequentially to complete the interlayer welding of the precision structure with three or more layers. Interlayer welding is performed using diffusion welding, brazing, thermocompression welding, etc., to ensure welding requirements. Specifically, the process of "solder thin film deposition - laser scanning route optimization - integrated scanning etching - interlayer welding" is repeated, and welding cover plates are added sequentially to complete the interlayer welding of three or more multi-layer precision structures. This method ensures the consistency of each layer and the alignment accuracy between layers, avoiding problems such as misalignment, deformation, and weak welding caused by the increase in the number of layers, thus improving the overall reliability and stability of the multi-layer precision structure. The fabrication of multi-layer precision structures allows for further integration and optimization of functions (such as multi-layer heat dissipation and multi-stage airflow), improving component performance and meeting the stringent requirements for high performance and multi-functionality of precision components in extreme environments of aircraft. Simultaneously, the number of layers can be flexibly adjusted according to needs to adapt to different scenarios.

[0049] As a second objective of this invention, a heat sink is provided, employing the aforementioned welding method to weld the heat dissipation structure. This multi-layered precision heat dissipation structure significantly increases the heat dissipation area and improves heat dissipation efficiency, adapting to the high heat flux density heat dissipation requirements of aircraft electronic equipment, engines, and other components, thus solving the problem of insufficient heat dissipation efficiency in existing heat sinks. The heat sink prepared using this welding method solves the problems of low welding precision, easy deformation, burn-through, and collapse in existing aircraft heat sinks. The dimensional accuracy and interlayer alignment accuracy of the heat dissipation structure meet standards, ensuring stable heat dissipation efficiency, and the heat transfer coefficient meets the stringent requirements of aerospace heat exchangers.

[0050] As a third objective of this invention, it provides an aircraft that employs the aforementioned heat sink for thermal control regulation. The aircraft includes, but is not limited to, aircraft, rockets, satellites, and other aerospace vehicles. By using the high-performance heat sink of this invention for thermal control regulation, the problems of low heat dissipation efficiency, poor reliability, and inability to adapt to extreme environments in existing aircraft thermal control systems are solved, thereby improving the thermal control regulation capability and operational reliability of the aircraft. The lightweight and high-precision design of the heat sink of this invention conforms to the design philosophy of lightweight and high-performance aircraft, reducing the overall weight of the aircraft, improving its endurance and carrying capacity, while also adapting to the installation requirements of the confined space inside the aircraft.

[0051] The present invention will be further illustrated below through specific embodiments. It should be noted that the following embodiments are merely illustrative and not intended to limit the scope of the invention. All other embodiments obtained by those skilled in the art based on the embodiments shown below without inventive effort are within the scope of protection of the embodiments of the present invention.

[0052]

Example

[0053] The welding method for the multi-layer precision structure of the present invention employs, as follows: Figure 2 The processing system structure diagram shown comprises a laser (1), a shutter (2), a processing head (3), a CCD vision positioning system (4), a welding sample (5), a machine tool (6), and a control terminal (7). These components are arranged sequentially along the laser beam path, working together to complete the laser etching and welding of multi-layered precision structures. The system workflow is as follows:

[0054] 1. Clamping and positioning: The welded sample 5 with the deposited solder film is clamped on the worktable of the machine tool 6. The position image of the welded sample 5 is acquired by the CCD vision positioning 4, and the control terminal 7 completes the coordinate calibration to determine the processing datum.

[0055] 2. Parameter settings: Input the design parameters of the preset precision structure and solder pattern into the control terminal 7, and set the processing parameters such as the power of laser 1, the opening and closing sequence of optical shutter 2, and the motion trajectory of machine tool 6;

[0056] 3. Laser processing: The laser beam output by laser 1 enters the processing head 3 after being controlled by the on / off state of the optical shutter 2. After being focused, it acts on the surface of the welding sample 5. At the same time, the machine tool 6 drives the welding sample 5 to move according to the preset trajectory, realizing integrated scanning etching and simultaneously completing the preparation of the solder pattern and precision structure.

[0057] 4. Process monitoring and correction: During the processing, the CCD vision positioning 4 acquires images of the processing area in real time, and the control terminal 7 compares them with the design parameters to correct the processing path or compensate for errors, ensuring processing accuracy.

[0058] 5. Result Observation: After processing, the surface morphology of the sample is observed by CCD vision positioning to verify the forming quality of the precision structure and solder pattern, and to provide a qualified substrate for subsequent interlayer welding.

[0059] The specific welding steps are as follows: Figure 3 As shown, specifically:

[0060] Step 1: Solder film preparation: Clean and remove impurities from the interface to be soldered on the substrate. Place the prepared substrate in anhydrous ethanol and deionized water for ultrasonic cleaning for 10 min each to remove surface oil, oxide scale and dust impurities. Prepare a uniform, dense and well-adhesive solder film with a thickness of 0.05 mm by physical vapor deposition, chemical deposition or electroplating.

[0061] Step 2: Clamping and positioning: Fix the solder substrate coated with solder film onto the machine tool 6 with a three-axis precision motion platform, and use CCD vision positioning 4 for observation to ensure flatness and no warping;

[0062] Step 3: Scan Path Optimization: Based on theoretical calculations, the correspondence between the area of ​​the residual solder region and the area of ​​the weld joint is obtained. The specific relationship is approximately: S1 = k × S2. Where S1 is the area of ​​the residual solder region, S2 is the area of ​​the weld joint, and k is the density ratio of the solder after welding to the solder before welding. Based on the selected solder product, the value of k is approximately 0.8. In this embodiment, the residual solder area is approximately 0.8 times the area of ​​the weld joint.

[0063] Based on the solder pattern and substrate structure of the pre-defined precision structure required for welding, the femtosecond laser scanning path is optimized. For example... Figure 4 As shown, the white area represents the solder residue area, with a rectangle length of 6mm and a width of 5mm, processed using a galvanometer scanning method. The black area represents the remaining area of ​​the precision-structured welded joint, and the gray area represents the area where the weld substrate has been removed, with a rectangle length of 7mm and a width of 6mm. For each independent rectangular structure, a linear cross-fill scanning method is used, with a fill interval of 20μm, to generate femtosecond laser scanning paths for the solder and weld substrate patterns, respectively.

[0064] Step 4: Femtosecond Laser Etching: A femtosecond laser is used to perform selective scanning etching on the solder film and the substrate. The parameters are set as follows: laser wavelength: 1030 nm, pulse width: 300 fs, single pulse energy: 200 μJ, repetition rate: 100 kHz, scanning speed: 1 m / s, focused spot diameter: 40 μm. While removing the solder from the non-soldering areas, the precision structure of the substrate is simultaneously etched. A CCD vision positioning system is used to observe the removal status of the solder and substrate, ensuring accurate processing of the solder and precision structure, thus completing the integrated fabrication of high-precision solder patterns and the precision structure of the substrate. Figure 5 As shown, gray represents the solder film, and black represents the solder substrate and its precision structure.

[0065] Step 5: Multilayer Interlayer Soldering: The position of the welding substrate and welding cover plate is controlled by a robotic arm or machine tool 6. A CCD vision positioning device 4 is used to ensure that the solder pattern matches and aligns with the welding position. The CCD vision positioning device 4 uses the reference holes on the welding substrate and welding cover plate to complete the precise alignment of the welding substrate and welding cover plate, and completes the interlayer soldering. Figure 6 This is the state after the layer welding is completed. Repeating this process allows for the welding of multi-layer precision structures.

[0066] Using this method, because the solder pattern and substrate structure are processed as a single unit, the alignment accuracy between the solder pattern and the substrate structure is improved by at least 20%, thus increasing the solder joint strength by approximately 20%. Furthermore, there is almost no overflow at the edges. In addition, assembly efficiency is significantly improved. Compared to the method of applying solder directly, this method can improve assembly efficiency by approximately 50%.

[0067] This invention first obtains a tightly bonded solder layer on a welding plate through coating or spraying, and then uses laser etching to complete the integrated etching of the welding points and solder structure, obtaining a pre-weld solder and precision structure that can be used for welding. This method can achieve precise preparation of solder for complex pattern welding points on a small scale (unit welding size is from tens of micrometers to millimeters). The device is independent, the process is stable, and there is no thermal damage. It is suitable for the preparation of solder patterns for welding multi-layer high-precision structures, and is especially suitable for the manufacturing of components such as aerospace vehicle heat sinks with stringent requirements for airtightness, sealing, and high precision, thereby ensuring the overall performance and service life of the components.

[0068] In the description of this invention, the terms "connection," "installation," and "fixation," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0069] In the description of this invention, the terms "one embodiment," "some embodiments," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0070] The above are merely preferred embodiments of the present invention and are not intended to limit the invention. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the invention should be included within the scope of protection of the present invention.

Claims

1. A welding method for a multi-layer precision structure, characterized by, include: A solder film is deposited on a first substrate by physical vapor deposition, chemical deposition, or electroplating to obtain the substrate to be etched. The thickness of the solder film is 0.05 ± 0.005 mm; Optimize the laser scanning path based on the preset precision structure and solder pattern; The substrate to be etched is placed in the laser etching area, and integrated scanning etching is performed using a laser to complete the preparation of solder pattern and precision structure, thereby obtaining a first substrate to be welded with the precision structure and solder pattern. One side of the first welding cover plate is placed over the solder pattern on the first substrate to be welded, so that they are vertically aligned, and interlayer welding of the precision structure is performed. Repeat the process of preparing the solder pattern and the precision structure, and etch the solder pattern and the precision structure on the other side of the first welding cover plate to obtain the second substrate to be welded. One side of the second welding cover plate is perpendicularly aligned with the solder pattern of the second substrate to be welded, completing the interlayer welding of the double-layer precision structure; wherein, The solder joints of the solder pattern are designed to correspond and match with the solder joints of the precision structure, and the correspondence is: S1 = k × S2. Wherein, S1 is the solder joint area of ​​the solder pattern; S2 is the solder joint area of ​​the precision structure; k is the density ratio of the solder after soldering to the solder before soldering, and k is 0.4-1; The integrated scanning etching first etches the solder film to complete the preparation of the solder pattern, and then continues to etch the first substrate to complete the preparation of the precision structure.

2. The welding method according to claim 1, characterized in that, The optimized laser scanning route is achieved through path planning software using one or more of the following methods: region segmentation, changing the filling method, and path interleaving.

3. The welding method according to claim 1, characterized in that, The laser source is selected from one of nanosecond pulsed laser, femtosecond ultrafast laser, and picosecond laser.

4. The welding method according to claim 1, characterized in that, The solder is selected from one of the following: metal, alloy, or thermally and electrically conductive thin film.

5. The welding method according to claim 1, characterized in that, The precision structure includes micropillar arrays, micropore arrays, microgroove arrays, mesh structures, and connecting channels.

6. The welding method of claim 1, wherein, Also includes: According to the requirements of a precision structure with three or more layers, repeat the solder pattern and the preparation process of the precision structure, add welding cover plates in sequence, and complete the interlayer welding of the precision structure with three or more layers.

7. The welding method according to claim 6, characterized in that, The interlayer welding is performed using one of diffusion welding, brazing, or thermostatic welding.

8. A heat sink, characterized by The heat dissipation structure is welded using any of the welding methods described in claims 2-7.

9. An aircraft, characterized in that Thermal control is performed using the radiator described in claim 8.

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