A tantalum capacitor and its preparation method

By using a split frame structure and electrochemical deposition of copper foil cathode internal connectors, the problems of volumetric efficiency and conductivity of tantalum capacitors have been solved, achieving higher capacitance density and lower equivalent series resistance, simplifying the manufacturing process, and improving the reliability and high-frequency filtering performance of capacitors.

CN122091402APending Publication Date: 2026-05-26NINGXIA KEPAISI ELECTRONIC TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
NINGXIA KEPAISI ELECTRONIC TECHNOLOGY CO LTD
Filing Date
2026-03-31
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

Existing tantalum capacitors face difficulties in improving volumetric efficiency. Iron-nickel alloy materials cannot meet the requirements for conductivity and support, while copper materials lead to decreased insulation and increased leakage current when at the anode. Combinations of heterogeneous materials also contradict the structure, and traditional packaging processes are complex and uneconomical.

Method used

It adopts a split frame structure, uses copper foil as the cathode internal connector, and forms the external electrode through electrochemical deposition. Combined with the positive electrode internal connector and the package, it simplifies the production process, omits the sandblasting process, and improves the compactness of the package.

Benefits of technology

It improves the volume utilization and capacitance density of capacitors, reduces the equivalent series resistance, enhances the reliability and sealing of capacitors, simplifies the manufacturing process, and improves the high-frequency filtering performance of capacitors.

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Abstract

This application provides a tantalum capacitor comprising: a capacitor element; a positive inner connector; a negative inner connector; a package, wherein the end faces of the positive and negative inner connectors are exposed at the end faces of the package; and an external electrode connected to the positive and negative inner connectors. A method for manufacturing the above-mentioned tantalum capacitor includes: connecting the anode lead of the capacitor element to a positive lead frame containing the positive inner connector; connecting the cathode layer of the capacitor element to a negative lead frame containing the negative inner connector; encapsulating the capacitor element, the positive inner connector, and the negative inner connector with an encapsulating material to form an encapsulation strip; removing excess material from both sides of the positive and negative lead frames of the encapsulation strip, exposing the positive and negative inner connectors at the end faces of the encapsulation strip; and forming an external electrode at the end faces of the encapsulation strip by electrochemical deposition, thereby connecting the positive and negative inner connectors to their respective external electrodes.
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