An integrated energy storage chip module assembly

By combining the sliding push base and the limiting clamp base, along with the design of the heat-absorbing copper plate, heat-conducting rod, and cooling fan, the problems of easy tearing of pin connections and low heat dissipation efficiency are solved, achieving stable connection and efficient heat dissipation of the energy storage chip, which is suitable for high-performance and high-power-density scenarios.

CN122094553APending Publication Date: 2026-05-26JIANGSU RUIYUAN HOLDING GROUP CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
JIANGSU RUIYUAN HOLDING GROUP CO LTD
Filing Date
2025-12-31
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

Existing integrated energy storage chip module components are susceptible to solder joint tearing due to external impact at the pin connection points, and have low heat dissipation efficiency, which limits their application in high-performance, high-power-density scenarios.

Method used

The device employs a combination structure of a sliding push base and a limiting clamping base, and is fixed by a rubber extrusion base and bolts to prevent the pins from shifting laterally; combined with a heat-absorbing copper plate, a heat-conducting rod and a cooling fan, it achieves active air cooling.

Benefits of technology

It effectively prevents pin solder joint breakage, enhances connection stability, and efficiently dissipates chip heat through active air cooling, ensuring stable operation of the component in high-performance scenarios.

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Abstract

This invention relates to the field of modular component technology and discloses an integrated energy storage chip module component. It includes a packaging box containing an integrated energy storage chip. Pins are provided on both the front and rear surfaces of the packaging box. Limiting plates are fixedly connected to both the front and rear surfaces of the packaging box, with the limiting plates positioned above the pins. In this invention, because the width of the limiting clamp is greater than the pin, the limiting clamp can form a wrap-around limiting from both sides of the pin, preventing lateral displacement of the pin due to external force and protecting the solder joints from tearing. The heat generated by the integrated energy storage chip during operation is quickly conducted to the heat-absorbing metal plate through heat-absorbing copper plates attached to its front and rear surfaces, achieving initial heat transfer from the chip to the heat dissipation structure. After the fan starts, airflow is generated, accelerating the airflow within the groove. The flowing air carries away the heat from the heat-conducting rod and the side surface of the heat-absorbing metal plate, ensuring stable operation.
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