Microdevice integration and transparency

Abstract

The optoelectronic system used in this invention is fabricated to seamlessly integrate microdevices into a transparent substrate, thereby allowing for more complex display technology features. The substrate with electrodes and the integration area housing one or more microdevices are part of the system; portions of the substrate allow light to enter from both sides. Configuration provides dynamic adjustment of visibility and privacy through selective transparency control. Applications requiring both transparency and content display can also be supported by light modulation layers, which can be placed on either side of the substrate and can change the transparency level in response to user or environmental conditions. This concept provides adaptive display systems with significant energy management efficiency and customizable transparency, making them useful for a variety of industries, including wearable technology, automotive, and construction.

Description

Technical Field

[0001] This disclosure relates to microdevice integration and optoelectronic systems, as well as methods for manufacturing optoelectronic systems. Summary of the Invention

[0002] The present invention relates to an optoelectronic system comprising: a system substrate having electrodes; an integration region; at least one microdevice controlled by the system substrate; and a portion of the system substrate that is transparent, thereby allowing light to pass through both sides of the optoelectronic system.

[0003] The present invention relates to a method for manufacturing an optoelectronic system, the method comprising the steps of: selecting and cleaning a transparent system substrate; depositing a transparent conductive layer of indium tin oxide on the system substrate; defining an integration region on the system substrate and applying a conductive adhesive to enable placement of at least one microdevice in the integration region; and positioning a light modulation layer on the back side of the system substrate to control transparency.

[0004] The present invention relates to a method for manufacturing an optoelectronic system, the method comprising the steps of: selecting and cleaning a transparent system substrate; depositing a transparent conductive layer of indium tin oxide on the system substrate; defining an integration region on the system substrate and applying a conductive adhesive to enable placement of at least one microdevice in the integration region; and positioning a light modulation layer on the back side of the system substrate to control transparency.

[0005] The present invention relates to a method for manufacturing an optoelectronic system, the method comprising the steps of: selecting a transparent system substrate and depositing a thin layer of indium tin oxide on the front side of the system substrate; defining pixelated light modulation elements on the indium tin oxide layer by using photolithography, inkjet printing or laser ablation; and applying a light modulation layer over the pixelated elements to achieve selective transparency control. Attached Figure Description

[0006] The foregoing and other advantages of this disclosure will become apparent from reading the following detailed description and referring to the accompanying drawings.

[0007] Figure 1 An optoelectronic system with a system substrate is shown.

[0008] Figure 2A Another related embodiment is shown, in which the light modulation element is located on both the back and front sides of the optoelectronic system.

[0009] Figure 2B Another related embodiment is shown, wherein the optoelectronic system has at least one optical modulation element on the front side of the system substrate.

[0010] Figure 3 A method for fabricating a substrate for an optoelectronic system is described.

[0011] Figure 4 It shows the production of things such as Figure 2A A method for using light modulation elements located on both the back and front sides of an optoelectronic system.

[0012] Figure 5 It shows the production of things such as Figure 2B A method for constructing an optoelectronic system having at least one optical modulation element on the front side of a system substrate.

[0013] While this disclosure is open to various modifications and alternatives, specific embodiments or implementations have been illustrated by way of example in the accompanying drawings and will be described in detail herein. However, it should be understood that this disclosure is not intended to be limited to the forms disclosed. Rather, this disclosure will cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims. Detailed Implementation

[0014] Transparent display and smart glasses technologies have made significant progress in recent years due to the demand for flexible, interactive displays that blend digital information with real-world visibility. These technologies have numerous applications in wearables, automotive, and architecture, where data can be smoothly integrated into transparent surfaces to enhance usability, security, and functionality. However, standard display technologies are not well-suited for a wide range of real-world applications due to significant limitations in adjusting transparency, limiting the exposure of certain content, and adapting to environmental conditions.

[0015] A core challenge with existing transparent displays is the lack of flexibility in switching between transparent and opaque states. Many displays rely on simple backlighting or static transparency layers, which cannot adapt to changing lighting conditions or user needs. This limitation is particularly evident in automotive and wearable applications, where ambient lighting can change rapidly and visibility control is critical for safety. Furthermore, traditional displays often lack the ability to provide selective transparency, meaning they may not reveal specific information to one user while hiding that same information from another, thus limiting their use in privacy-sensitive environments.

[0016] Integrating sensors and microdevices into a substrate without sacrificing transparency or introducing visual distortion is another challenge in modern transparent display technology. Many designs have found it difficult to strike a trade-off between maintaining a clear, unobstructed view and interactive features, including LEDs, sensors, or light-modulating materials. This issue is particularly critical for applications requiring high levels of transparency, such as smart windows or augmented reality (AR) displays, where even minute distortions or visual noise can negatively impact the user experience.

[0017] Effectively controlling energy consumption while maintaining high display versatility is challenging for current technology. Applications such as wearable technology and solar-powered smart glasses, where low power consumption is crucial, frequently utilize transparent displays. However, the lack of bistable or energy-efficient transparency control technologies in many existing systems leads to excessive power consumption, especially when periodically maintaining or changing display states.

[0018] Therefore, flexible transparent display systems are needed to overcome these constraints by providing fine-grained transparency control, selective content visibility, and real-time illumination adaptation. Microdevices should be easily integrated into the substrate of such systems to enable dynamic interaction while maintaining transparency and consuming minimal power. Two-way viewing features are also necessary to allow users on opposite sides of the screen to view specific content on demand or protect their privacy. This invention addresses these needs by providing an optoelectronic display system with a flexible light modulation layer, movable control mechanisms, and advanced microdevice integration, paving the way for next-generation wearable, automotive, and architectural technologies.

[0019] The integration of microdevices into the system substrate enables advanced features such as high transparency. This opens up new applications, such as smart glasses in automotive, transportation, retail, office, or other buildings, as well as structural / architectural glass.

[0020] This invention describes having in Figure 1 , Figure 2A , Figure 2B , Figure 3 , Figure 4 and Figure 5 The detailed optoelectronic system configurations provide different settings for transparency control, microdevice integration, and light modulation. The systems and methods utilize substrates with electrodes and dedicated layers to produce a variety of display functions suitable for applications requiring both transparency and digital content display.

[0021] exist Figure 1In this system 100, a transparent system substrate 102 is included, which houses an integration region 106 and at least one microdevice 104. The system substrate 102 has built-in electrodes and components for controlling the microdevice 104 while remaining generally transparent, allowing light to pass through from both sides of the system 100. The integration region 106 acts as a bonding site or reflector for the microdevice 104 and may also include electrodes or adhesive materials for enhancing functionality. To adjust the transparency of the display, a light modulation layer 108 is positioned on the back side of the system substrate 102. These layers 108 may require additional substrates or backplanes 110 to support control circuitry and additional components. In one configuration, common electrodes may be added to the back side of the substrate 102, or alternatively, patterned into rows or columns to manage specific portions. Flexible electrodes can connect the two substrates to a driving system that controls image display, data extraction from the microdevice, or transparency adjustment.

[0022] The system substrate 102 can be made of durable, transparent glass that provides high optical clarity or lightweight, breakable polycarbonate that allows good light transmittance. Another option for the substrate 102 is indium tin oxide (ITO) on a flexible polymer, which combines conductivity with transparency, making it ideal for applications requiring flexible displays.

[0023] The microdevice 104 integrated into the substrate can be a light sensor designed to detect ambient light levels and adjust the brightness of the display accordingly. Another possibility for the microdevice 104 is a microLED that can generate digital content in specific areas of the display, thereby enhancing the interactivity of the display. Alternatively, the microdevice can be a photodiode array that allows the system to detect light intensity or capture image data across the display area.

[0024] Integration region 106 serves as a connection point for microdevice 104 and can be made of silver or copper bonding material to ensure electrical connection between the substrate and the microdevice. Region 106 may also include a reflective aluminum film that enhances brightness by reflecting light back through the display. Another suitable option for integration region 106 is a conductive adhesive, which serves a dual purpose of bonding and electrically connecting the microdevice to the substrate.

[0025] A light modulation layer 108 is attached to the back side of the system substrate 102 to modify the transparency of the display. These layers may consist of an electrochromic polymer film (which changes its color or transparency in response to voltage) or an LCD film (which adjusts transparency by aligning liquid crystals to block or allow light to pass through). An electronic ink layer that can alternate between reflective and transparent modes is another option for the light modulation layer 108. This layer is helpful for displays that alternate between transparent and static graphics.

[0026] The system may also require an additional substrate or backplane 110 to support the control circuitry and enhance the functionality of the light modulation layer. This backplane 110 may be a thin-film transistor (TFT) layer that provides precise control over individual pixels within the display. Another option is a flexible plastic substrate with printed circuitry, which is ideal for applications where the display needs to be flexible. Alternatively, the backplane 110 may be a glass substrate with printed electrodes, providing both stability and high precision for controlling light modulation across the display.

[0027] Figure 1 An optoelectronic system 100 is shown, comprising a system substrate 102, an integration region 106, and at least one microdevice 104. The system substrate 102 controls the microdevice and includes electrodes and other necessary components. A significant portion (or pixel region) of the substrate 102 is transparent, allowing light to pass through from both sides of the system 100. The integration region 106 may be an electrode, an adhesive material, or a reflector.

[0028] To control the transparency of system 100, a light modulation layer (film) 108 is added to the back side of system main substrate 102. The light modulation layer 108 may require an additional substrate or backplate 110. Here, a portion of the required control circuitry or electrodes may be formed on the back side of system substrate 102. Furthermore, other layers or electrodes may be formed on the surface of the new additional substrate 110. In one related embodiment, a common electrode may be formed on the back side of system substrate 102. In another related embodiment, the electrodes may be patterned into rows or columns. To connect the two substrates to the driving system, flexible electrodes may be bonded to each substrate. The driving system provides images to microdevices, extracts / reads information from microdevices, or adjusts the transparency of the light modulation elements.

[0029] In one related embodiment, the optical modulation element and the microdevice are formed on the same surface of the system substrate 100. The system substrate 100 has elements for controlling both the microdevice and the optical modulation element. Here, electrodes are formed to connect the microdevice to the control element. Individual or identical electrodes are used to connect the optical modulation element to the control element. The optical modulation element is formed on the substrate. Another electrode is formed to connect to the optical modulation element or to the microdevice. The second electrode may be a common electrode. The second electrode may be part of a second substrate.

[0030] In one related embodiment, the light modulation element is an LCD layer. In another embodiment, the light modulation element is an electrochromic polymer. In yet another embodiment, the light modulation element is electrophoretic particles (with capsules or freestanding).

[0031] Here, depending on the application, user request, or environmental factors, the control / drive system may adjust a portion of the display's transparency or reflectivity. In one case, sensors are assigned to different segments of the display system. These sensors detect ambient light associated with their respective areas, and a controller in the drive system adjusts the transparency of that segment based on the sensor readings. In another related implementation, transparency may be adjusted based on content. For example, if the display is highlighting a real-world object, one area may be made opaque while the area associated with that object is transparent.

[0032] Figure 2A An advanced configuration is presented in which the optoelectronic system 200 has light modulation layers on both the back and front sides of the system substrate 202. This dual-layer configuration allows the system to not only control transparency but also selectively block light from one side, thus functioning as a bidirectional display. This means, for example, that a user on one side can view sensitive information that remains hidden from the opposite side, and vice versa. In this configuration, microdevices 204 are embedded on the front side of the system substrate 202. The light modulation layer 208 on the back side is similar to... Figure 1 The light modulation layer has an additional backplate 210 for control. Another light modulation layer 218 is added to the front side of the substrate 202, wherein a planarization layer 214 is typically formed on the front surface before the integration layer 218. This dual modulation setup allows for selective viewing, wherein the backplate 220 independently controls the transparency and light-blocking characteristics on both sides of the display.

[0033] Here, the microdevice 204 is integrated into the front surface of the system substrate 202. An optical modulation element 208 is integrated into the back surface of the system substrate 202. Similar to... Figure 1 The structure may include a separate backplane 210 for controlling the first optical modulation element 208. A second optical modulation element 218 may be coupled to the front side of the system substrate 202. In this case, a planarization layer 214 may be formed on the front surface of the system substrate 202 before the integration of the optical modulation element 218. Similar to the first optical modulation element 208, a separate backplane 220 may be present for controlling the optical modulation function.

[0034] Here, the microdevice 204 can be exposed on any surface of the system 200. The light modulation elements 208 and 218 can control the transparency of the optoelectronic system and the viewing surface.

[0035] The system substrate 202 can be made of transparent materials such as borosilicate glass (known for its durability and high optical clarity) or flexible polymers such as PET (polyethylene terephthalate) (which provides transparency and flexibility). Another option for the substrate 202 can be sapphire glass, which provides extremely high hardness and scratch resistance, making it suitable for demanding applications.

[0036] The microdevice 204 embedded on the front side of the system substrate can be a photodiode that senses ambient light levels and adjusts display settings based on the ambient light. Another option for the microdevice 204 can be a micro-LED display element that allows a small portion of the display to selectively display digital information or graphics. Alternatively, the microdevice can be an RFID chip for interactive applications, allowing the display to respond to marked objects or devices.

[0037] The back-side light modulation layer 208 can be an electrochromic layer that changes its opacity in response to an applied voltage, thereby providing a smooth transition between a transparent and opaque state. Another option for the back-side light modulation layer 208 is a liquid crystal film that provides high-speed switching and can be controlled to precisely adjust transparency. A third possibility is a polymer-dispersed liquid crystal (PDLC) layer that can scatter light to achieve a frosted glass effect or transition to transparency upon application of voltage.

[0038] The additional backplane 210 for controlling the backlight modulation layer 208 can be a thin-film transistor (TFT) backplane, which provides precise control over each segment of the layer to achieve responsive transparency modulation. Another option for the backplane 210 can be a silicon backplane with integrated circuits, which allows for the handling of complex signal processing to achieve transparency control. A third option is a flexible plastic backplane with printed circuitry, suitable for applications requiring flexibility.

[0039] The front light modulation layer 218 can be a suspended particle device (SPD) film, which adjusts transparency by aligning particles with an applied voltage. Another material option for the front layer 218 can be an electrophoretic film such as "electronic ink," which provides high contrast and can switch between black-and-white or grayscale modes. A third option is a cholesteric liquid crystal display (ChLCD), which can maintain an image without power and provide a color-tunable reflective display.

[0040] The planarization layer 214 formed on the front surface of the system substrate prior to the addition of the front light modulation layer can be a spin-coated polymer that produces a smooth, uniform surface for use with the light modulation layer. Another option for the planarization layer 214 can be an oxide layer (such as silicon dioxide) that provides a stable insulating substrate that can be chemically and mechanically polished to achieve planarity. A third alternative is a self-leveling resin that fills any surface irregularities, thereby producing a smooth layer that minimizes optical distortion.

[0041] The second backplane 220 controlling the front light modulation layer 218 can be a transparent oxide backplane (such as indium tin oxide (ITO)), which allows it to provide electrical control without obstructing visibility. Another option for the second backplane 220 is a metal oxide TFT array, which can drive the front layer with high precision. A third option is a glass backplane with micropatterned circuitry, which provides stable, long-term performance for high-quality display control.

[0042] Figure 2A Another related embodiment is shown, in which the light modulation element is located on both the back and front of the optoelectronic system 200. Here, not only can transparency be controlled, but the optoelectronic system can also be used to block light from one side. For example, the optoelectronic system can be a two-way monitor or display. When a user is in front of the display, the display can control certain areas containing sensitive content or data that should be visible to the other side. If a user is present at the back of the display, that user can set which parts of the display are visible to each side or both sides. In this way, the display can control some privacy when these users can interact and share data.

[0043] Here, the microdevice 204 is integrated into the front surface of the system substrate 202. An optical modulation element 208 is integrated into the back surface of the system substrate 202. Similar to... Figure 1 The structure may include a separate backplane 210 for controlling the first optical modulation element 208. A second optical modulation element 218 may be coupled to the front side of the system substrate 202. In this case, a planarization layer 214 may be formed on the front surface of the system substrate 202 before the integration of the optical modulation element 218. Similar to the first optical modulation element 208, a separate backplane 220 may be present for controlling the optical modulation function.

[0044] Here, the microdevice 204 can be exposed on any surface of the system 200. The light modulation elements 208 and 218 can control the transparency of the optoelectronic system and the viewing surface.

[0045] Figure 2BA variation of system 200 is shown, wherein at least one light modulation layer 218 is present on the front side of system substrate 202. This layer can form pixelated light modulation elements 212 controlled by signals within system substrate 202, thereby enabling specific areas to display content while other areas remain transparent. The light modulation layer 218 can be patterned to avoid overlapping with microdevices 204, thus allowing the microdevices to remain visible or active within the system. This pixelation control provides precise transparency adjustment, allowing portions of the display to remain sharp while other portions show digital content, which is ideal for applications such as augmented reality or targeted information display.

[0046] The system substrate 202 can be made of borosilicate glass (known for its durability and transparency), making it suitable for high-definition displays. Another possible material is PMMA (polymethyl methacrylate), a lightweight and transparent plastic commonly used as an alternative to glass. A third option could be polycarbonate, which is both durable and provides high impact resistance, making it suitable for displays requiring flexibility and resilience.

[0047] The light modulation layer 218, in which pixelated light modulation elements are formed on the front side of the substrate, can be made of a liquid crystal display (LCD) film that allows individual pixels to switch between transparent and opaque states to display content. Another option for the light modulation layer 218 is an electrochromic polymer film that changes its opacity with the applied voltage, thereby achieving selective transparency control. A third option could be an organic LED (OLED) layer that emits light and can be pixelated, thus providing vivid display capabilities without backlighting.

[0048] The pixelated light modulation element 212 can be composed of individual liquid crystal cells within an LCD film, each forming a pixel that can be individually controlled to be transparent or opaque. Another example of the pixelated element 212 could be electrophoretic particles used in electronic ink technology, where each pixel can be independently adjusted to produce grayscale images or text. A third option could be a micromirror array, where each micromirror in the array reflects light individually, thereby providing high contrast and pixel-level control for clear content display.

[0049] The microdevice 204, which avoids overlapping of the light modulation layer, can be a proximity sensor that allows the system to detect user interaction or movement near the display. Another option for the microdevice 204 is a camera sensor that enables augmented reality functionality by capturing visual data that can be overlaid on the display. Alternatively, the microdevice can be a fingerprint sensor for secure, user-specific interactions with the display.

[0050] Figure 2B This configuration enables high precision in transparency and content control, making it ideal for applications where one part of the display needs to show digital information while other parts remain clear.

[0051] Each attached figure illustrates the unique adaptation of the transparent optoelectronic system. Figure 1 Direct transparency is provided through back-side modulation. Figure 2A Bidirectional privacy is achieved through two-sided modulation, and Figure 2B It provides pixel-level control for selective transparency, which is ideal for enhanced displays.

[0052] Figure 2B Another related embodiment is shown, wherein the optoelectronic system 200 has at least one light modulation element 218 on the front side of the system substrate 202. Signals in the system substrate 202 at least partially control the light modulation element. These signals may be formed into pixels 212 to produce pixelated light modulation elements. The light modulation element 218 may be patterned to remove it from the surface of the microdevice 204.

[0053] In one implementation, the display can be dual-purpose: transparent or opaque. In another related implementation, the transparency of the display can be controlled by integrating electrochromic, LCD, or other light modulation films / layers.

[0054] In one related implementation, the light modulation film or layer is located on the back side of the main display substrate.

[0055] In another related embodiment, the light modulation film or layer is located on the front surface of the display.

[0056] In another related implementation, the light modulation film is patterned to allow microdevices to be exposed.

[0057] In another related implementation, the light modulation film / film controls the reflectivity of a pixel or a set of pixels.

[0058] In one embodiment, the system substrate includes a transparent material, such as glass or polycarbonate, in which electrodes and integrated regions for microdevices are embedded. A portion of the substrate is designed to remain transparent, thereby allowing light to pass through from both sides. This arrangement is suitable for see-through displays in applications such as vehicle windshields or shop windows, where maintaining visibility while selectively displaying information is essential.

[0059] Another implementation focuses on direct control of microdevices embedded in a system substrate. Here, the substrate is designed to manage these microdevices, allowing them to be selectively exposed or concealed. This configuration enables features such as interactive display areas within a larger transparent panel, making it ideal for applications where specific information, such as enhanced display overlay or sensor data, needs to be visible only in certain areas.

[0060] Another implementation includes light modulation layers, such as LCDs, electrochromic polymers, or electrophoretic particles, on one or both sides of the system substrate. These layers allow the display to switch between transparent and opaque states to adapt to ambient light conditions or specific content requirements. This configuration can be used in applications such as smart windows or automotive head-up displays, where controlled opacity and privacy options enhance the user experience by dynamically adjusting visibility.

[0061] In another embodiment, the system includes light modulation elements located on both the front and back of the display, enabling bidirectional viewing control. This setup allows users on different sides of the display to view selective content, thus providing privacy or targeted information sharing. For example, an office partition could allow employees on one side to view information while presenting it opaquely to employees on the other side, making the partition useful for privacy-conscious applications.

[0062] In another implementation, sensors and control systems are integrated into the display to adjust transparency and brightness in response to ambient light or specific content. This dynamic adaptation improves readability and visual comfort, especially in environments with changing lighting conditions. The addition of sensors can support applications such as energy-efficient building windows that automatically adjust transparency based on sunlight, or smart glasses that enhance visibility by controlling opacity under specific lighting conditions.

[0063] In another embodiment, the invention supports applications across fields such as automotive, architecture, and wearable technology. In automotive displays, the invention can present information on the windshield while maintaining visibility. In architecture, the invention acts as smart glass controlling light and energy efficiency within the building. For wearable devices such as smart glasses, the system enhances interaction by overlaying digital content onto transparent lenses. This broad applicability demonstrates the potential of these embodiments for privacy-sensitive panels, interactive screens, and augmented reality applications, thereby supporting a range of next-generation display technologies.

[0064] Figure 3 A method for fabricating a substrate for an optoelectronic system is described.

[0065] In step 300, a transparent material is selected for the system substrate (102), such as borosilicate glass for its rigidity and optical clarity, or a transparent polymer such as polycarbonate or PET for its flexibility. The substrate (102) is cleaned using acetone and isopropanol, followed by rinsing with deionized water and drying with nitrogen to ensure a contaminant-free surface.

[0066] In step 301, sputtering is used to deposit a transparent conductive layer of indium tin oxide (ITO) on one side of the system substrate (102). This layer will form the electrodes required for controlling the microdevice (104).

[0067] In step 302, photolithography is used to pattern the ITO layer. A photoresist layer is applied via spin coating, and then a photomask is used to expose the desired electrode pattern. The photoresist is developed to reveal the electrode structure, and then unwanted ITO is etched away using a suitable etchant (such as hydrochloric acid (HCl)). The remaining photoresist is removed by solvent or plasma ashing to complete the electrode pattern on the substrate (102).

[0068] In step 303, an integration region (106) is defined on the system substrate (102) in which microdevices (104) will be placed. Specific regions are designated to facilitate adhesion and electrical connectivity.

[0069] In step 304, a micro-dispensing system is used to apply a thin layer of conductive adhesive (such as silver epoxy resin) to the integration region (106) for precise application. This conductive layer enables electrical connection between the microdevice (104) and the substrate (102).

[0070] In step 305, the microdevice (104) is embedded within the integration region (106). Using a high-precision pick-and-place machine, the microdevice (104) is aligned onto the adhesive layer to ensure optimal functionality. Examples of the microdevice (104) include miniature LEDs, photodiodes, or sensor chips. The conductive adhesive is then cured to secure the microdevice (104) in place.

[0071] In step 306, a light modulation layer (108) is positioned on the back side of the system substrate (102). Materials such as LCD films, electrochromic polymers, or electronic ink layers are selected based on the transparency and modulation requirements of the application. A vacuum laminator is used to uniformly place the film onto the substrate (102), ensuring uniform contact and eliminating air bubbles.

[0072] In step 307, an additional substrate or backplate (110) is added to support the light modulation layer (108) and the control circuitry. A suitable material is selected for the backplate (110), such as thin-film transistor (TFT) material, flexible plastic, or glass with printed circuitry. A UV-curable adhesive is applied and cured under UV light for up to 30 seconds to firmly bond the backplate (110) to the substrate (102).

[0073] In step 308, a common electrode is formed on the back side of the system substrate (102) by depositing a continuous ITO layer or patterning the electrodes into rows and columns to achieve segmented control. If a segmented electrode configuration is required, photolithography is used to define these patterns.

[0074] In step 309, (optionally) an ultrathin conductive tape (10µm thick) or an anisotropic conductive film is used to connect flexible electrodes between the main substrate (102) and the additional backplane (110) to establish a connection. These flexible connections enable data signals and power to be transmitted from the backplane (110) to the microdevice (104) and the optical modulation layer (108).

[0075] In step 310, the entire component is encapsulated with a transparent encapsulant (such as polyurethane or epoxy) to protect it from environmental factors such as moisture and dust. The encapsulant is applied evenly across the surface, ensuring it does not interfere with transparency.

[0076] In step 311, the edges of the encapsulated components are sealed with a moisture-proof material to prevent environmental degradation and ensure the durability of the display.

[0077] In step 312, a multimeter is used to perform electrical tests to verify the continuity and functionality of the electrodes and microdevices (104) to check for any open or short circuits.

[0078] In step 313, an optical test is performed by measuring the transparency and modulation capability of the light modulation layer (108) with a spectrophotometer to confirm that these layers can effectively switch between transparent and opaque states.

[0079] In step 314, the completed components are connected to the drive system for functional testing, verification of image display, microdevice operation, and transparency adjustment under operating conditions.

[0080] In step 315, the final component is installed into its intended housing or frame (if it is part of a larger system), thereby ensuring that all parts are securely held in place and correctly aligned for optimal function.

[0081] In step 316, the device is packaged for transport or storage, using protective materials to prevent damage to the components and to maintain environmental protection for long-term reliability.

[0082] This step-by-step process ensures that the optoelectronic system (100) is manufactured with high transparency, dynamic control over the transparency of the display, and efficient integration of microdevices (104), light modulation layer (108), and backplane (110) for use in a variety of display applications.

[0083] Figure 4 Described as being used for, for, etc. Figure 2A The method of photoelectric system in, Figure 2A Another related embodiment is shown, in which the light modulation element is located on both the back and front sides of the optoelectronic system.

[0084] In step 400, a transparent material is selected for the system substrate (202), such as borosilicate glass for its durability and high optical clarity, flexible polymers such as PET (polyethylene terephthalate) for their flexibility, or sapphire glass for its extremely high hardness and scratch resistance. The substrate (202) is thoroughly cleaned using acetone and isopropanol, followed by rinsing with deionized water and drying with nitrogen.

[0085] In step 401, sputtering is used to deposit a transparent conductive layer, such as indium tin oxide (ITO), about 100 nm thick on the back side of the system substrate (202). This conductive layer will form part of the electrode structure required for controlling the back light modulation layer (208).

[0086] In step 402, photolithography is used to pattern the ITO layer on the back side. A photoresist layer is applied to the substrate via spin coating, and then a photomask is used to expose the desired electrode pattern. The photoresist is developed to expose the electrode structure, unwanted ITO is etched away with a suitable etchant (such as HCl), and the remaining photoresist is removed by solvent or plasma ashing.

[0087] In step 403, an integration region (106) is defined on the front side of the system substrate (202) to serve as a bonding site for the microdevice (204). This region will provide both structural support and electrical connectivity for the microdevice.

[0088] In step 404, a micro-dispensing system is used to apply a thin layer of conductive adhesive (such as silver epoxy resin) to the integration region (106). This adhesive layer achieves electrical bonding between the microdevice (204) and the substrate (202).

[0089] In step 405, a microdevice (204) is embedded within an integration area (106) on the front side of the system substrate (202). A high-precision pick-and-place machine is used to align the microdevice, which may be a photodiode, a micro LED, or an RFID chip. The adhesive is cured at 80°C for 15 minutes to secure the microdevice in place.

[0090] In step 406, a planarization layer (214) is applied to the front surface of the substrate (202) to create a smooth substrate for the light modulation layer (218). Options for this layer include spin-coated polymers, silica, or self-leveling resins. The planarization layer is cured or dried according to material specifications to ensure a uniform surface.

[0091] In step 407, a front light modulation layer (218) is deposited onto the planarization layer (214). Materials are selected, such as suspended particle device (SPD) films, electrophoretic films, or cholesteric liquid crystal displays (ChLCDs). A vacuum laminator is used to uniformly apply the film to avoid bubbles and ensure a smooth finish.

[0092] In step 408, an additional backplate 210 is added for use with the back light modulation layer (208) on the control system substrate 202. The backplate may be a thin-film transistor (TFT) array, silicon, or a flexible plastic substrate with printed circuitry. The backplate (210) is firmly bonded to the light modulation layer (208) using a UV-curable adhesive and cured under UV light.

[0093] In step 409, a back-side light modulation layer (208) is positioned on the back side of the substrate (202). This layer may be made of an electrochromic polymer, a liquid crystal film, or a polymer-dispersed liquid crystal (PDLC) material. Vacuum lamination is used to apply the film to ensure uniform contact and transparency control.

[0094] In step 410, a second backplate (220) for controlling the front light modulation layer (218) is added to the front side. This backplate can be a transparent oxide backplate, such as ITO, a metal oxide TFT array, or a glass substrate with micropatterned circuitry. An optically transparent adhesive is used to bond the backplate to the light modulation layer (218).

[0095] In step 411, flexible electrodes are connected between the main substrate (202) and the two backplanes (210 and 220) to establish data and power paths. Ultra-thin conductive tape or anisotropic conductive film is used to connect the backplanes to the drive system.

[0096] In step 412, the entire component is encapsulated to protect it from environmental factors such as moisture and dust. A transparent encapsulant (such as epoxy resin) is used to ensure a uniform layer that does not interfere with the display's transparency or functionality.

[0097] In step 413, the edges of the components are sealed with a moisture-proof material to protect them from environmental degradation and maintain the durability of the display.

[0098] In step 414, a multimeter is used to perform electrical tests to verify the continuity and functionality of the electrodes and microdevices (204) and to ensure that each component responds as expected.

[0099] In step 415, an optical test is performed using a spectrophotometer to confirm that the light modulation layers (208 and 218) can effectively switch between transparent and opaque states.

[0100] In step 416, the assembled display is connected to the drive system and its functionality is tested under real-world conditions. The bidirectional transparency control is verified to function, where selective content is visible only from one side of the display if desired.

[0101] In step 417, the final component is installed into its housing or frame as part of the larger system, thereby ensuring that all parts are aligned and secured for optimal function.

[0102] In step 418, the assembled display is packaged for transport or storage, using protective materials to prevent damage and maintaining an environmental seal for long-term reliability.

[0103] This manufacturing process can produce, for example Figure 2A The described advanced bidirectional optoelectronic system (200) includes integrated microdevices, dual-sided light modulation layers, and independently controlled backplanes, thereby allowing selective transparency and controlled light-blocking functionality.

[0104] Figure 5 It shows the production of things such as Figure 2B A method for an optoelectronic system having optical modulation elements on a system substrate.

[0105] In step 500, a transparent material is selected for the system substrate (202), such as borosilicate glass for its high clarity and durability, PMMA (polymethyl methacrylate) as a lightweight alternative, or polycarbonate for its impact resistance and flexibility. The substrate is thoroughly cleaned with acetone and isopropanol, rinsed with deionized water, and dried with nitrogen.

[0106] In step 501, sputtering is used to deposit a thin transparent conductive layer of indium tin oxide (ITO) or another transparent conductor on the front side of the system substrate (202). This conductive layer will enable signal control of the optical modulation layer (218).

[0107] In step 502, a pixelated light modulation element (212) is defined on the conductive layer. This step may include photolithography and chemical etching, inkjet printing, laser ablation, microcontact printing, electron beam lithography, template masking and deposition, screen printing, nanoimprint lithography, direct laser writing, and focused ion beam (FIB) milling.

[0108] In step 503, a light modulation layer (218) is prepared by selecting a suitable material (such as a liquid crystal display (LCD) film, an electrochromic polymer film, or an organic LED (OLED) layer). This layer will enable pixel-level control, thereby switching between a transparent state and an opaque state.

[0109] In step 504, a light modulation layer (218) is applied over the pixelated conductive element (212). A vacuum laminator is used to ensure uniform application, remove air bubbles, and ensure a strong bond between the layer and the substrate.

[0110] In step 505, if necessary, the light modulation layer (218) is patterned to avoid overlapping with the microdevice (204) on the system substrate (202). This patterning allows the microdevice to remain active and not be blocked by the light modulation layer.

[0111] In step 506, the microdevice (204) is embedded on the front side of the system substrate (202), outside the pixelated light modulation area. A pick-and-place machine is used to accurately position the microdevice. Depending on the application, possible microdevices include proximity sensors, camera sensors, or fingerprint sensors. The microdevice is bonded to the substrate with conductive adhesive and cured according to specifications.

[0112] In step 507, a flexible conductive tape or anisotropic conductive film is used to form an electrical connection between the conductive layer and the driving circuit. These connections allow the pixelated elements (212) within the light modulation layer (218) to be individually controlled.

[0113] In step 508, if additional surface leveling is required, any desired planarization layer (214) is added below the light modulation layer (218). Options for this layer include spin-coated polymers, silica, or self-leveling resins to ensure a smooth, flat surface for the light modulation layer.

[0114] In step 509, the entire component is encapsulated with a transparent protective material (such as polyurethane or epoxy resin) to protect it from moisture, dust and other environmental factors while maintaining transparency and durability.

[0115] In step 510, a moisture-proof material is used to seal the edges of the encapsulated component to ensure environmental protection and long-term stability of the display.

[0116] In step 511, a multimeter is used to perform electrical tests to verify the continuity of the pixelation elements (212) and microdevices (204) and the control over them, thereby ensuring that each pixel can switch independently between states.

[0117] In step 512, an optical test is performed using a spectrophotometer to evaluate the transparency and modulation capability of the pixelated light modulation layer (218), thereby confirming that the pixelated light modulation layer provides a clear and accurate transition between transparent and opaque states.

[0118] In step 513, the functional integration of the test and drive system is verified to validate image display, pixel-level control, and appropriate transparency adjustment across displays. Ensure that only designated areas display content, while other areas remain transparent, as required by the application.

[0119] In step 514, the final component is installed into its intended housing or frame (if it is part of a larger system), thereby ensuring that all parts are aligned and securely attached for reliable operation.

[0120] In step 515, the optoelectronic system is packaged for transport or storage, and protective materials are used to maintain its integrity and prevent damage during transport.

[0121] This process achieves the following: Figure 2B The described optoelectronic system (200) is manufactured in a manner in which pixel-level control is achieved via a light modulation layer (218) on the front side of a system substrate (202). This configuration is ideal for applications requiring selective transparency and digital content display, such as augmented reality or interactive information panels.

[0122] In one implementation, designing a mask layout to achieve an ideal balance between transparency and usability is a primary goal of AI-driven optimization. For example, AI techniques such as evolutionary algorithms or simulated annealing can simulate various mask configurations in automotive head-up displays by examining light transmittance, reflection control, and microdevice alignment. The AI ​​then determines the optimal arrangement that supports integrated sensors and devices and improves transparency, thereby ensuring that the display meets the performance and visibility requirements for comfort and safety.

[0123] In another implementation, AI dynamically adjusts the size and shape of mask elements in response to real-time display requirements. For example, AI can employ reinforcement learning in an augmented reality (AR) system to examine environmental elements such as user proximity, ambient light levels, and viewing angle. To maintain optimal clarity of the AR overlay while preserving visibility of the surrounding world, the AI ​​then modifies the mask structure in real time. Through continuous learning and adaptation, the display enhances the user experience by responding smoothly to changing circumstances.

[0124] Another implementation involves using AI during the manufacturing process to automate the accurate generation of mask plans. Convolutional neural networks (CNNs) can generate high-resolution mask patterns for conductive layers, microdevices, and pixelated light modulation elements in the fabrication of transparent substrates with pixelated electrodes. By learning from datasets of successful designs, CNN models enhance mask size and location, resulting in more consistent performance across devices and more efficient generation with fewer errors. This automation improves overall reliability and reduces design iteration duration.

[0125] In another implementation, AI helps reduce energy usage by proactively modifying the mask size and shape based on power requirements. For example, gradient-based optimization AI algorithms can examine power consumption trends in wearable smart glasses applications and precisely identify areas where transparency modulation can be reduced without compromising functionality. Because the AI ​​modifies the mask layout to ensure that only critical areas use energy, the device is more power-efficient. In wearable applications, this approach preserves battery life, which is essential for long-term use in outdoor or mobile environments.

[0126] In another implementation, AI uses real-time performance data and user feedback to iteratively improve mask placement. For example, an AI algorithm employing reinforcement learning continuously learns from user interactions and environmental data in privacy-sensitive office partitions, modifying the mask pattern to meet visibility and privacy requirements. The AI ​​uses each iteration to adjust the layout to enhance functionality and visual clarity, thus matching the mask pattern to a specific use case. With this adaptive technology, the display can change based on user selection, thereby improving the display's responsiveness and usefulness in practical applications.

Claims

1. A photoelectric system, the system comprising: A system substrate having electrodes; Integration area; At least one microdevice, said at least one microdevice being controlled by the system substrate; and A portion of the system substrate is transparent, thereby allowing light to pass through from both sides of the optoelectronic system.

2. The system of claim 1, wherein the integrated region is an electrode, a bonding material, or a reflector.

3. The system of claim 1, wherein the optical modulation layer is added to the back side of the system substrate.

4. The system of claim 3, wherein the optical modulation layer has an additional substrate.

5. The system of claim 4, wherein a portion of the control circuitry or electrodes is formed on the back side of the system substrate.

6. The system of claim 4, wherein a common electrode is formed on the back side of the system substrate.

7. The system of claim 6, wherein the common electrode is patterned into rows or columns.

8. The system of claim 3, wherein the light modulation layer is an LCD layer, an electrochromic polymer, or an electrophoretic particle layer.

9. The system of claim 1, wherein the optical modulation element is located on both the back and front sides of the optoelectronic system.

10. The system of claim 1, wherein the microdevice is integrated into the front surface of the system substrate, an optical modulation element is integrated into the back surface of the system substrate, a separate substrate controls the first optical modulation element with a second optical modulation element coupled to the front surface of the system substrate, and a planarization layer is formed on the front surface of the system substrate prior to the integration of the optical modulation element.

11. The system of claim 10, wherein a separate backplane is provided for controlling the optical modulation function.

12. The method of claim 11, wherein the microdevice is exposed on any surface of the optoelectronic system, and the two light modulation elements control the transparency and viewing surface of the optoelectronic system.

13. A method for manufacturing an optoelectronic system, the method comprising the following steps: Select and clean the transparent system substrate; A transparent conductive layer of indium tin oxide is deposited on the system substrate; An integration region is defined on the system substrate and a conductive adhesive is applied to enable the placement of at least one microdevice within the integration region; as well as A light modulation layer is positioned on the back side of the system substrate to control transparency.

14. The method of claim 13, further comprising the step of using photolithography to pattern the indium tin oxide layer into rows and columns to achieve segmented control of transparency.

15. The method of claim 13, further comprising curing the conductive adhesive to fix the microdevice in place.

16. The method of claim 13, wherein the light modulation layer is laminated onto the system substrate using vacuum lamination to eliminate air bubbles and ensure uniform adhesion.

17. A method for manufacturing a bidirectional photoelectric display, the method comprising the following steps: Select a transparent system substrate and deposit an indium tin oxide conductive layer on the back side of the substrate; An integration region is defined on the front side of the system substrate for bonding microdevices; A planarization layer is applied to the front side of the substrate, and a front light modulation layer is deposited on the planarization layer; as well as A backplate for controlling the light modulation layer is added to the back side of the system substrate.

18. The method of claim 17, further comprising the step of encapsulating the component with a transparent encapsulant to protect it from moisture and dust.

19. The method of claim 17, wherein the front light modulation layer is applied as an electrophoretic membrane using vacuum lamination to achieve uniform application.

20. The method of claim 17, further comprising the step of curing the planarization layer to form a smooth substrate for the optical modulation layer.

21. A method for manufacturing an optoelectronic display having pixelated light modulation elements, the method comprising the following steps: A transparent system substrate is selected and a thin layer of indium tin oxide is deposited on the front side of the system substrate; Pixelated optical modulation elements are defined on the indium tin oxide layer by patterning it using photolithography, inkjet printing, or laser ablation. as well as A light modulation layer is applied over pixelated elements to achieve selective transparency control.

22. The method of claim 21, wherein the light modulation layer is an organic LED layer applied using a vacuum laminator to ensure a strong bond.

23. The method of claim 21, further comprising the step of embedding the proximity sensor as a microdevice outside the pixelated light modulation region.

24. The method of claim 21, further comprising performing optical tests using a spectrophotometer to confirm the transparency and modulation capability of the light modulation layer.

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