A recovery device and method for beryllium material turning processing

Abstract

The application discloses a beryllium material turning processing recycling device and method, and relates to the technical field of beryllium material processing, and can improve the processing quality of beryllium material and the service life of a tool, realize efficient recycling of chips, avoid beryllium dust pollution, and promote green processing and resource recycling of beryllium material.

Description

Technical Field

[0001] This invention belongs to the field of cutting and chip recycling technology, and specifically relates to a recycling device and method for beryllium turning. Background Technology

[0002] Beryllium is a rare, lightweight metal with excellent properties, including low density, high melting point, high specific strength, high specific stiffness, high infrared reflectivity after polishing, and good dimensional stability. It possesses superior physical, nuclear, and thermal properties, making it a core strategic material in electronic equipment manufacturing, defense, and aerospace fields. It is widely used in critical components such as inertial navigation system structures, nuclear reactor moderators and reflectors, aerospace vehicle structures, and infrared reflectors in optical systems. Due to its high performance and reliability in critical applications, it is currently difficult to find alternative metallic materials.

[0003] Currently, beryllium materials are mostly formed using hot isostatic pressing (HIP). However, due to limitations in existing sintering technology, the shape of the sintered body deviates significantly from the final part design, leading to a substantial increase in material removal during subsequent machining and significant unnecessary material loss. Furthermore, the inherent brittleness of beryllium causes chips to easily become powdery and fragmented during conventional turning, making them difficult to collect and recycle, and generating harmful beryllium dust that threatens the health of operators. In addition, brittle cutting causes rapid tool wear and makes the workpiece surface prone to cracking, reducing the machining quality and yield rate of beryllium parts.

[0004] Currently, the industry lacks dedicated chip recycling technology for beryllium materials. Existing cutting methods cannot effectively recycle beryllium chips, resulting in a serious waste of the non-renewable strategic metal beryllium. They also significantly increase the manufacturing cost of high-performance aerospace devices, hindering the large-scale promotion and application of core components.

[0005] Therefore, developing a beryllium material turning and recycling device and method that can simultaneously improve the processing performance and quality of beryllium materials, efficiently recover chips, and prevent beryllium dust leakage has significant strategic value and industrial application significance. Summary of the Invention

[0006] To address the problems of high material brittleness, difficulty in chip recovery, beryllium dust hazards, rapid tool wear, and low machining quality in existing beryllium turning processes, this invention provides a recycling device and method for beryllium turning. It improves the machinability of beryllium through electric heating, achieves efficient chip recovery by combining negative pressure self-priming chip removal, and utilizes data acquisition, monitoring, and intelligent control to achieve closed-loop regulation of the heating process. Ultimately, this results in a high beryllium chip recovery rate, improved machining quality, and enhanced safety of the working environment.

[0007] The technical solution of this invention is: a recycling device for beryllium material turning, comprising a resistance heating system, a negative pressure self-priming chip removal system, a collection unit, and a control unit. These systems work together to achieve integrated electric heating assistance and chip recycling during beryllium material turning. The specific structure is as follows: The resistance heating system includes a DC power supply, a carbon brush device, and preferably an ammeter. One end of the carbon brush device is in contact with the beryllium material, and the other end is connected to either the positive or negative terminal of the DC power supply. The other terminal of the DC power supply is connected to the cutting tool. When the DC power supply is in operation, a series circuit is formed between the DC power supply, the cutting tool, the beryllium material, and the carbon brush device to heat the beryllium material. This raises the temperature of the cutting area, thereby changing the brittle properties of the beryllium material and transforming the chips from powder / fragments into continuous chips, creating conditions for chip recycling.

[0008] Preferably, the ammeter is connected in series between the DC power supply and the carbon brush device to monitor the current in the circuit in real time, provide timely feedback on the circuit continuity status, and avoid open circuit faults.

[0009] Preferably, the carbon brush device adopts a three-jaw structure and is equipped with spring chucks that are adapted to different workpiece diameters from 10mm to 80mm. The three-jaw structure contacts the beryllium material through the spring chucks. The multi-jaw redundancy design ensures the reliability of the contact between the carbon brush and the beryllium material workpiece and ensures the stable conduction of the current circuit.

[0010] The negative pressure self-priming chip removal system has a discharge port corresponding to the tool position. It is used to collect chips generated during turning. The system includes at least a housing and a negative pressure component. The housing is a closed structure, covering the tool and beryllium material, completely enclosing the cutting area. The housing has a discharge port, and preferably a glass window for easy observation and monitoring of the cutting area. The negative pressure component is connected to the inside of the housing, providing continuous negative pressure. This allows chips generated during cutting to be discharged from the discharge port under negative pressure, achieving rapid chip collection. Simultaneously, the closed housing combined with the negative pressure environment effectively prevents beryllium dust from escaping into the work area, avoiding health hazards to operators.

[0011] Preferably, the enclosure adopts a double-layer structure to further improve the sealing and protection effect and enhance the barrier capability against beryllium dust.

[0012] The acquisition unit is used to acquire image and temperature data of the chips at the turning point in real time.

[0013] Preferably, the acquisition unit is a thermal imaging device, which is fixed on the housing and has a glass window corresponding to the housing. The glass window is preferably a germanium glass window to ensure the acquisition accuracy of the thermal imaging device and to avoid beryllium dust contaminating the detection lens of the acquisition unit.

[0014] More preferably, the acquisition unit is equipped with a support device, which can adjust the measurement area of ​​the acquisition unit so that it is precisely aligned with the chip generation area, thereby improving the accuracy of data acquisition.

[0015] The control unit is electrically connected to the acquisition unit and the DC power supply. It is used to receive and process the image data and temperature data acquired by the acquisition unit, and to precisely adjust the output current of the DC power supply according to the processing results, so as to realize closed-loop control of resistance heating.

[0016] Specifically, the control unit includes a receiving module, a data processing module, and an output module. The receiving module is electrically connected to the acquisition unit and is used to receive image data and temperature data of the chips, and transmit the data to the data processing module. The data processing module is electrically connected to the receiving module and is used to perform morphological recognition processing on the image data of the chips to determine whether the chips are in a continuous or fragmented state, and generate corresponding current adjustment commands based on the temperature data. The output module is electrically connected to the data processing module and the DC power supply and is used to transmit the current adjustment commands generated by the data processing module to the DC power supply to drive the DC power supply to adjust the output current.

[0017] Preferably, the data processing module incorporates a deep learning model, which can perform refined classification of chip image data, identifying specific forms of chips such as ribbons, segments, fragments, and powder, thereby improving the accuracy of morphology judgment. The deep learning model is specifically a YOLOv8 model.

[0018] This device is suitable for turning beryllium materials with a diameter range of 10mm to 80mm. It can be directly connected to conventional lathes without requiring large-scale modifications to the lathe. It is highly versatile and can meet the turning needs of most beryllium parts.

[0019] Based on the above-mentioned recycling device, the present invention also provides a recycling method for beryllium material turning, which utilizes the above-mentioned recycling device to recover chips from the turning section during beryllium material turning, including the following steps: Step 1: Clamping and Conductive Connection The beryllium material is fixed to the machine tool using an insulating clamp to ensure the coaxiality and stability of the beryllium material clamping; the position and contact pressure of the carbon brush device are adjusted to ensure stable contact between the carbon brush device and the beryllium material workpiece, ensuring the reliability of the current circuit conduction; the cutting tool is fixed on the insulating tool holder of the machine tool, and the electrical connection between the cutting tool and one pole of the DC power supply is completed.

[0020] Step 2: Debugging of the enclosure and acquisition unit The housing of the negative pressure self-priming chip removal system is placed outside the tool and beryllium material to ensure the sealing effect of the housing; the position of the acquisition unit is adjusted so that its measurement area is accurately aligned with the chip generation area, and the temperature threshold of the cutting area is set for the acquisition unit according to the processing performance parameters of the beryllium material. At the same time, the signal connection between the acquisition unit and the control unit is debugged.

[0021] Step 3: Processing and Resistance Heating Start-up When the lathe is turned, the beryllium material is machined. When the tool comes into contact with the beryllium material, the DC power supply, the tool, the beryllium material, and the carbon brush device are connected in series to form a closed current circuit, which realizes the resistance heating of the beryllium material. The beryllium material generates heat due to its own resistance, which raises the temperature of the cutting area and changes it from brittle to ductile, so that the chips change from powder / fragments to continuous chips.

[0022] Step 4: Simultaneous activation of negative pressure recovery At the same time as the lathe starts machining, the negative pressure component of the negative pressure self-priming chip removal system is activated, creating a continuous negative pressure environment inside the housing. The chips generated during the cutting process move towards the discharge port under the action of negative pressure, achieving synchronous chip recovery. At the same time, the negative pressure environment, combined with the closed housing, effectively prevents beryllium dust from escaping.

[0023] Step 5: Data Acquisition and Current Closed-Loop Regulation During the machining process, the acquisition unit collects image data and temperature data of the chips at the turning point in real time and transmits the data to the control unit. After receiving the data, the receiving module of the control unit performs morphological recognition on the image data, threshold judgment on the temperature data, and generates a current adjustment command. The output module transmits the adjustment command to the DC power supply, and the DC power supply adjusts the output current in real time according to the command, so that the cutting area is always kept in the optimal temperature range and the chips are stable in a continuous state of ribbon or segment.

[0024] Step Six: Finishing Processing and Chip Collection After the beryllium material is machined, first stop the DC power supply output, then shut down the lathe and the negative pressure components; disassemble the housing, collect the chips from the outlet and collect them in a unified manner, and clean the inside of the housing, the collection unit and the cutting tools to remove residual beryllium chips and dust, thus completing the entire processing and recycling process.

[0025] Furthermore, the current adjustment command generated by the control unit is to increase the output current or decrease the output current.

[0026] The triggering condition for increasing the current is as follows: when the image data of the chips collected in real time is in a fragmented state, it indicates that the temperature in the cutting area is insufficient and the beryllium material has not completely transformed into plasticity. The control unit controls the DC power supply to increase the output current until the image data of the chips at the turning point is in a continuous state, specifically in the form of strips or segments.

[0027] The triggering condition for reducing the output current is as follows: when the image data of the chips collected in real time is continuous and the temperature data of the turning area exceeds the preset temperature threshold, it indicates that the temperature of the cutting area is too high, which is likely to cause workpiece burn-out or excessive tool wear. The control unit controls the DC power supply to reduce the output current until the temperature of the chips is less than the preset threshold.

[0028] Preferably, the automated control of current output can be achieved by setting the M command of the machine tool. The control logic of the M command is as follows: after the tool contacts the beryllium workpiece, the DC power supply is controlled to automatically turn on the current output. Before the tool separates from the beryllium workpiece or before the lathe spindle stops, the DC power supply is controlled to automatically stop the current output, thereby improving the safety and automation of the device operation.

[0029] Compared with the prior art, the beneficial effects of the present invention are as follows: This invention uses a resistance heating system to generate heat in the cutting area of ​​beryllium material, transforming the beryllium material from brittle to ductile. This effectively reduces the wear rate of the machining tools, decreases the generation of surface cracks in the workpiece, and improves the machining accuracy, surface quality, and yield of beryllium parts. Furthermore, resistance heating is achieved through the material's own heat generation, resulting in high heating efficiency and precise temperature control. Compared to external heating methods, it is lower in cost and easier to synchronize with cutting processes.

[0030] This invention transforms the chips from powder / shavings into continuous chips through resistance heating. Combined with the continuous negative pressure of the negative pressure self-priming chip removal system, it achieves synchronous and efficient chip recovery, significantly improving the resource utilization rate of beryllium materials, reducing the waste of the non-renewable strategic metal beryllium, and lowering the raw material cost of beryllium material processing, thus laying the foundation for the recycling of beryllium materials.

[0031] The closed enclosure of this invention, combined with a negative pressure environment, effectively prevents beryllium dust from escaping, avoiding its health hazards to operators, thus solving the operational safety problem of beryllium material processing from the source and improving the operational safety of turning.

[0032] This invention forms a closed-loop heating control system with the acquisition unit and the control unit. It adjusts the DC power supply output current in real time according to the chip shape and temperature to ensure that the cutting area is always at the optimal processing temperature and that the chips are stable in a continuous state that is easy to recover. This avoids workpiece burn-out due to excessive temperature and improves the stability and consistency of the processing. Attached Figure Description

[0033] Figure 1 This is an overall module diagram of the present invention; Figure 2 This is a schematic diagram of the structure of the recycling device and lathe in an application example of the present invention. Figure 3 This is a top view of the recycling device and lathe, which are examples of applications of the present invention. Figure 4This is a schematic diagram of the external structure of the recycling device in an application example of the present invention. Among them, 1-resistance heating system, 11-DC power supply, 12-carbon brush device, 13-ammeter, 2-negative pressure self-priming chip removal system, 20-box, 3-acquisition unit, 4-control unit, 41-receiving module, 42-data processing module, 43-output module. Detailed Implementation

[0034] The following is combined with Figures 1 to 4 The specific embodiments of the present invention will be described in detail below. In the description of the present invention, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0035] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; in the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0036] Currently, there is a lack of dedicated chip recovery technology for beryllium materials. However, electric heating-assisted cutting technology offers a solution to this problem. This technology heats the material during the cutting process, changing its machinability and transforming beryllium from brittle to ductile. This transforms the chips from powder / fragments into continuous chips, creating conditions for beryllium chip recovery. However, there is currently no dedicated device or method that integrates electric heating-assisted cutting with beryllium chip recovery, which cannot meet the actual needs of beryllium turning.

[0037] Therefore, this embodiment proposes a beryllium material turning and recycling device and method that can simultaneously improve the processing performance of beryllium materials, enhance processing quality, efficiently recover chips, and prevent beryllium dust leakage.

[0038] It should be noted that the circuit connections involved in this invention all adopt conventional circuit connection methods and do not involve any innovation.

[0039] Example like Figure 1 The device shown is a recycling unit for beryllium material turning, comprising a resistance heating system 1, a negative pressure self-priming chip removal system 2, a collection unit 3, and a control unit 4, with the specific structure as follows: The resistance heating system 1 includes a DC power supply 11, a carbon brush device 12, and preferably an ammeter 13. One end of the carbon brush device 12 is in contact with the beryllium material, and the other end is connected to either the positive or negative terminal of the DC power supply 11. The other terminal of the DC power supply 11 is connected to the cutting tool. When the cutting tool turns the beryllium material, the DC power supply 11, the cutting tool, the beryllium material, and the carbon brush device 12 are connected in series to form a circuit to electrically heat the beryllium material, thereby increasing the temperature of the cutting area and changing the brittle properties of the beryllium material, turning the chips from powder / fragments into continuous chips, and creating conditions for chip recycling.

[0040] Preferably, the ammeter 13 is connected in series between the DC power supply 11 and the carbon brush device 12 to monitor the current in the circuit in real time, provide timely feedback on the circuit continuity status, and avoid open circuit faults.

[0041] Preferably, the carbon brush device 12 adopts a three-jaw structure and is equipped with spring collets adapted to different workpiece diameters from 10mm to 80mm. The three-jaw structure contacts the beryllium material through the spring collets. The multi-jaw redundancy design ensures the reliability of contact between the carbon brush and the beryllium workpiece, ensuring stable conduction of the current circuit. In this embodiment, the carbon brush device 12 specifically adopts a JX-3Z three-jaw conductive carbon brush, which adopts a three-jaw chuck structure and is equipped with multiple specifications of spring collets as standard.

[0042] The negative pressure self-priming chip removal system 2 includes a housing 20 and a negative pressure component. The housing 20 is a closed structure that covers the outside of the cutting tool and beryllium material, completely enclosing the cutting area. The housing 20 has a discharge port, and a glass window can also be provided for convenient observation and monitoring of the cutting area. The negative pressure component is connected to the inside of the housing 20, providing continuous negative pressure conditions for the housing 20. This allows the chips generated during the cutting process to be discharged from the discharge port under negative pressure, achieving rapid chip collection. At the same time, the closed housing combined with the negative pressure environment can effectively prevent beryllium dust from escaping into the operating workshop, avoiding health hazards to operators.

[0043] Preferably, the housing 20 adopts a double-layer structure to further improve the sealing and protection effect and enhance the barrier capability against beryllium dust.

[0044] The acquisition unit 3 is used to acquire image data and temperature data of the chips at the turning point in real time.

[0045] Preferably, the acquisition unit 3 is a thermal imaging device. In this embodiment, a commercially available online infrared thermal imager, model FLIR A310, is used. The acquisition unit 3 is fixed on the housing 20 and is set with a glass window corresponding to the housing 20. The glass window is preferably a germanium glass window to ensure the acquisition accuracy of the thermal imaging device and to avoid beryllium dust contaminating the detection lens of the acquisition unit 3.

[0046] More preferably, the acquisition unit 3 is equipped with a support device, which allows adjustment of the measurement area of ​​the acquisition unit 3 to ensure precise alignment with the chip generation area, thereby improving the accuracy of data acquisition. Specifically, the support device is a commercially available three-dimensional adjustable support frame, which allows adjustment of the actual position of the acquisition unit to align the acquisition port of the acquisition unit with the chip area.

[0047] The control unit 4 is electrically connected to the acquisition unit 3 and the DC power supply 11. It is used to receive and process the image data and temperature data acquired by the acquisition unit 3, and to precisely adjust the output current of the DC power supply 11 according to the processing results, so as to realize the closed-loop control of resistance heating.

[0048] Specifically, the control unit 4 includes a receiving module 41, a data processing module 42, and an output module 43. The receiving module 41 is electrically connected to the acquisition unit 3 and is used to receive image data and temperature data of the chips, and transmit the data to the data processing module 42. The data processing module 42 is electrically connected to the receiving module 41 and is used to perform morphological recognition processing on the image data of the chips, determine whether the chips are in a continuous state or a fragmented state, and generate corresponding current adjustment commands in combination with the temperature data. The output module 43 is electrically connected to the data processing module 42 and the DC power supply 11 and is used to transmit the current adjustment commands generated by the data processing module 42 to the DC power supply 11 to drive the DC power supply 11 to adjust the output current.

[0049] Preferably, the data processing module 42 has a built-in deep learning model, such as the YOLOv8 model, which can perform fine classification of chip image data and identify the specific forms of chips, such as strips, segments, fragments, and powder, thereby improving the accuracy of morphology judgment.

[0050] This device is suitable for turning beryllium materials with a diameter range of 10mm to 80mm. It can be directly connected to conventional lathes without requiring large-scale modifications to the lathe. It is highly versatile and can meet the turning needs of most beryllium parts.

[0051] A recycling method for beryllium material turning, comprising the following steps, using the recycling device of this embodiment to recover chips from the turning section during beryllium material turning: Step 1: Clamping and Conductive Connection The beryllium material is fixed to the machine tool using an insulating clamp to ensure the coaxiality and stability of the beryllium material clamping; the position and contact pressure of the carbon brush device 12 are adjusted to ensure stable contact between the carbon brush device 12 and the beryllium material workpiece, ensuring the reliability of the current circuit conduction; the cutting tool is fixed on the insulating tool holder of the machine tool, and the electrical connection between the cutting tool and one pole of the DC power supply 11 is completed.

[0052] Step 2: Debugging of the enclosure and acquisition unit The housing 20 of the negative pressure self-priming chip removal system 2 is placed over the outside of the cutting tool and beryllium material to ensure the sealing effect of the housing 20; the position of the acquisition unit 3 is adjusted so that its measurement area is accurately aligned with the chip generation area, and the temperature threshold of the cutting area is set for the acquisition unit 3 according to the processing performance parameters of the beryllium material, while the signal connection debugging between the acquisition unit 3 and the control unit 4 is completed.

[0053] Step 3: Processing and Resistance Heating Start-up When the lathe is turned, the beryllium material is machined. When the tool comes into contact with the beryllium material, the DC power supply 11, the tool, the beryllium material, and the carbon brush device 12 are connected in series to form a closed current circuit, which realizes the resistance heating of the beryllium material. The beryllium material generates heat due to its own resistance, which raises the temperature of the cutting area and changes it from brittle to plastic, so that the chips change from powder / fragments to continuous chips.

[0054] Step 4: Simultaneous activation of negative pressure recovery At the same time as the lathe starts machining, the negative pressure component of the negative pressure self-priming chip removal system 2 is activated, so that a continuous negative pressure environment is formed inside the housing 20. The chips generated during the cutting process move towards the discharge port under the action of negative pressure, realizing the synchronous recovery of chips. At the same time, the negative pressure environment, together with the closed housing, effectively prevents beryllium dust from escaping.

[0055] Step 5: Data Acquisition and Current Closed-Loop Regulation During the machining process, the acquisition unit 3 acquires image data and temperature data of the chips at the turning point in real time and transmits the data to the control unit 4. After receiving the data, the receiving module 41 of the control unit 4 performs morphological recognition on the image data and threshold judgment on the temperature data by the data processing module 42, and generates a current adjustment command. The output module 43 transmits the adjustment command to the DC power supply 11. The DC power supply 11 adjusts the output current in real time according to the command, so that the cutting area is always kept in the optimal temperature range and the chips are stable in a continuous state of band or segment.

[0056] Step Six: Finishing Processing and Chip Collection After the beryllium material is machined, first stop the current output of the DC power supply 11, then turn off the lathe and the negative pressure component; disassemble the housing 20, collect the chips collected at the outlet and collect them in a unified manner, and clean the inside of the housing 20, the collection unit 3 and the cutting tools to remove residual beryllium chips and dust, thus completing the entire processing and recycling process.

[0057] Preferably, the automated control of current output can be achieved by setting the M command of the machine tool. The control logic of the M command is as follows: after the tool contacts the beryllium workpiece, the DC power supply 11 is controlled to automatically turn on the current output. Before the tool separates from the beryllium workpiece or before the lathe spindle stops, the DC power supply 11 is controlled to automatically stop the current output, thereby improving the safety and automation of the device operation.

[0058] Furthermore, the current regulation command is to increase or decrease the output current, and the specific triggering conditions are as follows: Triggering conditions for increasing current: When the image data of the chip acquired in real time is in the state of fragments, and the state of fragments is broken or powdery, it indicates that the temperature of the cutting area is insufficient and the beryllium material has not completely transformed into plasticity. The control unit 4 controls the DC power supply 11 to increase the output current until the image data of the chip at the turning point is in the continuous state, and the continuous state is specifically in the form of strips or segments.

[0059] Triggering conditions for reducing output current: When the image data of the chip collected in real time is continuous and the temperature data of the turning area exceeds the preset temperature threshold, it indicates that the temperature of the cutting area is too high, which is likely to cause workpiece burn-out or excessive tool wear. The control unit 4 controls the DC power supply 11 to reduce the output current until the temperature of the chip is less than the preset threshold.

[0060] Application examples The recycling device proposed in the embodiment is used for turning and chip recovery of a 20mm diameter beryllium alloy workpiece.

[0061] The recycling device includes a resistance heating system 1, a negative pressure self-priming chip removal system 2, a collection unit 3, and a control unit 4.

[0062] The resistance heating system 1 uses a DC power supply 11 with adjustable output current. An ammeter 13 is connected in series in the current circuit. The carbon brush device 12 adopts a three-jaw structure and is equipped with a spring collet adapted to a 20mm workpiece to ensure stable contact with the beryllium alloy workpiece. The cutting tool is a carbide turning tool, which is fixed on the machine tool's insulated tool post and electrically connected to the positive terminal of the DC power supply 11. The carbon brush device 12 is electrically connected to the negative terminal of the DC power supply 11. The beryllium alloy workpiece is fixed on the lathe spindle chuck by insulated jaws and forms a closed circuit with the carbon brush device 12.

[0063] The housing 20 of the negative pressure self-priming chip removal system 2 is a double-layer stainless steel enclosed structure with germanium glass windows and a discharge port. The negative pressure component is a rotary vane vacuum pump, which is connected to the housing 20 and the negative pressure value is set to -0.08MPa.

[0064] The acquisition unit 3 uses an infrared thermal imager, which is fixed on the outside of the housing 20 and set in accordance with the germanium glass window. It is equipped with a support device and the temperature threshold is set to 250℃. It is used to acquire images and temperature data of the chips in real time.

[0065] The data processing module 42 of the control unit 4 has a built-in YOLOv8 deep learning model, which can identify four types of chip morphology: strip, segment, fragment, and powder. The receiving module 41 is electrically connected to the infrared thermal imager, and the output module 43 is electrically connected to the DC power supply 11 to realize closed-loop regulation of the current.

[0066] This paper classifies chip states based on a YOLOv8 deep learning model. First, the collected chips are photographed using a super-depth-of-field microscope and categorized into types such as ribbon-like, segmented, fragmented, and powdery chips. These chips are then labeled and divided into training, validation, and test sets. A YOLOv8-based classification model architecture is used, configuring network parameters such as input size, learning rate, and number of iterations. The model is trained using the labeled dataset, and the test set is used to evaluate metrics such as accuracy, recall, and F1 score to optimize the parameters. Finally, the model is exported and applied to a real-world scenario, performing inference on input chip images and outputting classification results.

[0067] The steps of the recycling method are as follows: Step 1: Clamping and Conductive Connection like Figure 2 , Figure 3 As shown, the beryllium alloy workpiece is fixed on the lathe spindle chuck by insulating jaws, and the coaxiality error is controlled within 0.02mm; the contact pressure of the three-jaw carbon brush device 12 is adjusted to 5N to make it stably contact the outer circle of the workpiece; the carbide turning tool is fixed on the insulating tool holder, with an extension length of 20mm, to complete the electrical connection between the tool and the positive terminal of the DC power supply 11.

[0068] Step 2: Debugging of the enclosure and acquisition unit like Figure 2 , Figure 3 , Figure 4 As shown, a double-layer stainless steel housing 20 is placed over the outside of the cutting tool and the workpiece, and a sealing gasket is installed at the flange connection to ensure airtightness; the infrared thermal imager is adjusted by the support device to make its measurement area accurately aligned with the chip generation location, the temperature threshold is set to 250℃, and the signal connection between the thermal imager and the control unit 4 is completed.

[0069] Step 3: Processing and Resistance Heating Start-up Set the lathe spindle speed to 800 r / min and the feed rate to 0.1 mm / r. Start the lathe machining program. After the tool contacts the workpiece, the DC power supply 11 is turned on, with an initial output current of 50 A, forming a closed current loop. The workpiece cutting area generates heat due to its own resistance.

[0070] Step 4: Simultaneous activation of negative pressure recovery. When the lathe is turned on, the rotary vane vacuum pump is started to create a negative pressure environment of -0.08MPa inside the housing 20. The chips move towards the discharge port under the action of negative pressure, achieving synchronous recovery.

[0071] Step 5: Data Acquisition and Current Closed-Loop Regulation The infrared thermal imager collects images and temperature data of the chips in real time and transmits them to the control unit 4. During the initial processing, the data processing module 42 identifies the chips as fragmented, and the control unit 4 issues an increase current command. The DC power supply 11 increases the output current to 80A, and the temperature of the cutting area rises to 220°C, and the chips change into continuous ribbon-like chips. In the later stage of processing, the thermal imager detects that the temperature has risen to 260°C, exceeding the 250°C threshold. The control unit 4 issues a decrease current command, and the DC power supply 11 reduces the current to 70A. The temperature drops back to 240°C, and the chips remain in a continuous ribbon-like state.

[0072] Step 6: Finishing Process and Chip Collection After processing, the DC power supply 11 is controlled by the machine tool M05 command to stop the current output 1 second in advance, and then the lathe and vacuum pump are turned off; the box 20 is disassembled, and the strip-shaped chips from the discharge port and a small amount of powder chips from the vacuum pump dust collection box are collected. The total recovery rate of beryllium chips is over 95%; the inside of the box 20, the infrared thermal imager lens and the cutting tool are cleaned with a high-pressure air gun to complete the processing and recycling.

[0073] In this application example, the surface roughness Ra of the beryllium alloy workpiece after machining is ≤1.6μm, with no surface cracks. The tool wear is reduced by 60% compared to traditional cutting methods, and no beryllium dust is detected in the workshop. This achieves multiple goals, including improving the quality of beryllium material processing, efficient chip recovery, and ensuring operational safety.

[0074] The specific models of the above electronic components are not specifically specified; any commercially available ordinary products can be selected, as long as they can meet the usage requirements of this invention.

[0075] The above specific embodiments further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above are merely specific embodiments of the present invention and do not limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention are included within the protection scope of the present invention.

Claims

1. A recycling device for beryllium material turning, characterized in that, include: The resistance heating system includes a DC power supply and a carbon brush device. One end of the carbon brush device is in contact with beryllium material, and the other end is connected to either the positive or negative terminal of the DC power supply. The other terminal of the DC power supply is connected to the cutting tool. When the DC power supply is in operation, it can form a series circuit for heating the beryllium material between the DC power supply, the cutting tool, the beryllium material, and the carbon brush device. The negative pressure self-priming chip removal system has a discharge port that corresponds to the tool position. The negative pressure self-priming chip removal system is used to collect chips generated during turning. The acquisition unit is used to acquire image data and temperature data of the chips at the turning point in real time. The control unit is electrically connected to the acquisition unit and the DC power supply. It is used to receive and process the image data and temperature data acquired by the acquisition unit, and to regulate the output current of the DC power supply.

2. The recycling device for beryllium material turning as described in claim 1, characterized in that, The resistance heating system also includes an ammeter connected in series between the DC power supply and the carbon brush device.

3. The recycling device for beryllium material turning as described in claim 1, characterized in that, The carbon brush device adopts a three-jaw structure with a spring chuck. The three-jaw structure contacts the beryllium material through the spring chuck.

4. The recycling device for beryllium material turning as described in claim 1, characterized in that, The acquisition unit employs a thermal imaging device.

5. A recycling device for beryllium material turning as described in claim 1, characterized in that, The control unit includes: The receiving module, electrically connected to the acquisition unit, is used to receive image data and temperature data of the chips. The data processing module, electrically connected to the receiving module, is used to perform morphological recognition processing on the image data of the chips, determine whether the chips are in a continuous state or a fragmented state, and generate current adjustment commands in combination with temperature data. The output module is electrically connected to the data processing module and the DC power supply, and is used to transmit the current regulation command generated by the data processing module to the DC power supply.

6. A method for recycling beryllium materials during turning, characterized in that, The recovery of chips from the turning section during beryllium turning using the recovery device described in any one of claims 1-5 includes the following steps: Install a carbon brush assembly so that it comes into contact with the beryllium material; When one of the poles of the DC power supply is connected to the cutting tool, the DC power supply is in operation. When the cutting tool comes into contact with the beryllium material, the DC power supply, cutting tool, beryllium material, and carbon brush device are connected in series to form a circuit, thereby achieving electric heating of the beryllium material. The beryllium material changes from brittle to plastic when heated, and the chips change from powder / chips to continuous chips. During this process, the acquisition unit collects image data and temperature data of the chips at the turning point in real time; the control unit receives and processes the image data and temperature data collected by the acquisition unit, and transmits the generated current adjustment command to the DC power supply to adjust the output current of the DC power supply.

7. A method for recycling beryllium materials used in turning processes as described in claim 6, characterized in that, The current adjustment command is to increase the output current or decrease the output current.

8. A method for recycling beryllium materials used in turning processes as described in claim 7, characterized in that, The trigger condition for increasing the current is as follows: when the image data of the chips acquired in real time is in a fragmented state, the control unit controls the DC power supply to increase the output current until the image data of the chips at the turning point is in a continuous state.

9. A method for recycling beryllium materials used in turning as described in claim 7, characterized in that, The trigger condition for reducing the output current is as follows: when the image data of the chip collected in real time is continuous and the temperature data at the turning point exceeds the threshold, the control unit controls the DC power supply to reduce the output current until the temperature of the chip is less than the threshold.

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