A conductive polymer-derived ceramic and a method of making the same

Abstract

The application provides a conductive polymer-derived ceramic and a preparation method thereof, and relates to the technical field of ceramics.The preparation method comprises the following steps: uniformly mixing a silicon-containing polymer precursor, a silane coupling agent, a photosensitive monomer, a photoinitiator, a light absorber and an oxygen polymerization inhibitor to obtain a precursor slurry; performing light-curing printing on the precursor slurry to obtain a ceramic body; performing pyrolysis treatment on the ceramic body to obtain an intermediate sample; and performing sintering treatment on the intermediate sample under an inert gas protection atmosphere to obtain a polymer-derived ceramic; wherein the temperature of the sintering treatment is not lower than 1450 DEG C.For the preparation of the polymer-derived ceramic through the DLP molding technology, the method of the application can ensure that the volume shrinkage of the ceramic body obtained through light-curing molding is small, and the polymer-derived ceramic with good conductivity can be obtained.

Description

Technical Field

[0001] This invention relates to the field of ceramic technology, and more specifically, to a conductive polymer-derived ceramic and its preparation method. Background Technology

[0002] High-performance conductive ceramic components play an irreplaceable role in modern cutting-edge industrial fields. For example, in the aerospace field, they are used in high-temperature and corrosion-resistant electromagnetic shielding windows and sensors; in the new energy field, the bipolar plates of new batteries require both conductivity and corrosion resistance; and in the field of microelectromechanical systems (MEMS), conductive ceramics with complex three-dimensional structures are needed as functional substrates or actuators. These applications generally require components to have complex geometries, excellent mechanical strength, good thermal / chemical stability, and tunable conductivity.

[0003] Meanwhile, as functional devices evolve towards lightweight and highly integrated designs, traditional ceramic forming processes (such as compression molding, slip casting, and isostatic pressing) are gradually showing limitations in terms of structural design freedom, forming accuracy, and manufacturing cycle. Additive manufacturing technology, especially digital light processing (DLP) technology based on photopolymerization, offers a revolutionary solution for manufacturing such complex and delicate ceramic components due to its advantages such as high printing resolution (down to the micrometer level), good surface quality, and fast forming speed. Among various ceramic systems suitable for DLP forming, polymer-derived ceramics (PDCs) precursor systems have attracted widespread attention due to their characteristics of achieving uniform mixing of components at the molecular or polymer scale, good slurry stability, and no significant solid-phase separation. Compared with traditional ceramic systems (powder-organic carrier), PDCs systems are reactive ceramic systems. During pyrolysis and sintering, they form ceramic phases through chemical transformation, resulting in ceramics with significant advantages in terms of component uniformity and microstructural continuity. This makes PDCs slurries particularly suitable for DLP printing. Generally, ceramics made using PDC precursor systems typically exhibit insulators or semiconductors with extremely low intrinsic conductivity, severely limiting the application of DLP-printed PDC components in conductive functional devices. In existing applications combining DLP molding with PDC systems, conductivity is usually achieved by introducing conductive fillers. However, during photopolymerization, external conductive fillers often have a large specific surface area and a strong tendency to agglomerate, easily leading to a significant increase in the viscosity of the PDC slurry, uneven dispersion, and even sedimentation, thus affecting the photopolymerization performance and molding stability of the PDC slurry. Particularly in DLP molding, the uniformity and rheological properties of the PDC slurry have a significant impact on printing accuracy; the introduction of external conductive fillers can easily lead to decreased printing accuracy and even molding failure. Furthermore, for carbon-based PDC ceramic systems, although ceramic products with good conductivity can be obtained, the ceramic preforms obtained through photopolymerization experience significant volume shrinkage during subsequent pyrolysis and sintering, resulting in a high product defect rate. Therefore, for polymer-derived ceramics prepared by DLP molding technology, how to obtain polymer-derived ceramics with good conductivity while ensuring that the ceramic green body obtained by photopolymerization molding has a small volume shrinkage has become an urgent problem to be solved. Summary of the Invention

[0004] The problem this invention addresses is: how to obtain polymer-derived ceramics with good electrical conductivity while ensuring minimal volume shrinkage of the ceramic preform obtained by photopolymerization molding, when preparing polymer-derived ceramics using DLP molding technology.

[0005] To address the above problems, this invention provides a method for preparing conductive polymer-derived ceramics, comprising: Step S1: Mix the silicon-containing polymer precursor, silane coupling agent, photosensitive monomer, photoinitiator, light absorber and oxygen inhibition agent evenly to obtain the precursor slurry; Step S2: The precursor slurry is photocured and printed to obtain a ceramic green body; Step S3: Under an inert gas protective atmosphere, the ceramic green body is subjected to pyrolysis treatment to obtain an intermediate sample; Step S4: Under an inert gas protective atmosphere, the intermediate sample is sintered to obtain polymer-derived ceramics; wherein the sintering temperature is not lower than 1450℃.

[0006] Optionally, the silicon-containing polymer precursor includes polysiloxane.

[0007] Optionally, the photosensitive monomer includes monofunctional acrylic resins and polyfunctional acrylic resins; the monofunctional acrylic resin is selected from at least one of isoborneol acrylate, isooctyl acrylate, butyl acrylate, hydroxyethyl acrylate, hydroxypropyl acrylate, and 2-hydroxyethyl acrylate; the polyfunctional acrylic resin is selected from at least one of 1,6-hexanediol diacrylate, trimethylolpropane triacrylate, polyethylene glycol diacrylate, and tripropylene glycol diacrylate.

[0008] Optionally, the mass ratio of the multifunctional acrylic resin to the monofunctional acrylic resin is (1 to 8):1.

[0009] Optionally, the mass ratio of the multifunctional acrylic resin to the monofunctional acrylic resin is 5:1.

[0010] Optionally, in the precursor slurry, the mass ratio of the silicon-containing polymer precursor, the silane coupling agent, the photosensitive monomer, the photoinitiator, the light absorber, and the oxygen inhibitor is (30 to 60): (5 to 15): (25 to 50): (1.5 to 2.5): (0.04 to 0.06): (0.08 to 0.12).

[0011] Optionally, in step S2, the exposure intensity of the photopolymerization printing is 25 mW / cm². 2 Up to 35mW / cm 2 The exposure time is 4 to 12 seconds.

[0012] Optionally, in step S3, the ceramic blank is subjected to pyrolysis treatment, which includes: heating at a heating rate of 0.2℃ / min to 0.3℃ / min to first heat to 370℃ to 390℃ and hold for 1.5h to 2.5h, then heating to 470℃ to 490℃ and holding for 1.5h to 2.5h, and finally heating to 640℃ to 660℃ and holding for 1.5h to 2.5h.

[0013] Optionally, in step S4, the sintering temperature is 1500℃ to 1750℃ and the time is 2.5h to 3.5h.

[0014] The present invention also provides a conductive polymer-derived ceramic, which is prepared by the method described above for preparing conductive polymer-derived ceramics.

[0015] Compared with related technologies, this invention introduces a silicon-containing polymer precursor and a silane coupling agent into the precursor slurry, enabling the ceramic green body obtained by photopolymerization printing to gradually form an inorganic phase framework structure containing Si-OC and SiC during pyrolysis and high-temperature sintering, effectively reducing the volume shrinkage of the ceramic green body during pyrolysis and sintering. Furthermore, in this invention, without the introduction of conductive fillers, by controlling the sintering temperature at a relatively high level (not lower than 1450℃) under an inert gas protective atmosphere, the carbon structure in the resulting ceramic transforms from disordered to ordered, and from sp... 3 The structure transforms into a graphitized structure, forming a conductive structure where SiC and carbon phases coexist. This results in polymer-derived ceramics with good conductivity and avoids many problems caused by the introduction of conductive fillers. In summary, for the preparation of polymer-derived ceramics using DLP molding technology, the method of this invention can obtain polymer-derived ceramics with good conductivity while ensuring minimal volume shrinkage of the ceramic preform obtained by photopolymerization molding. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the preparation method of conductive polymer-derived ceramics in an embodiment of the present invention; Figure 2 This is a schematic diagram illustrating the mechanism by which differences in conductivity arise at different sintering temperatures in embodiments of the present invention; Figure 3 The image shows the ceramic blank obtained in Example 1 of this invention; Figure 4 The image shows the ceramic blank obtained in Example 4 of this invention; Figure 5 The image shows the ceramic blank obtained in Example 5 of this invention; Figure 6 Image of the polymer-derived ceramic obtained in Example 1 of this invention; Figure 7 Image of the polymer-derived ceramic prepared in Comparative Example 1 of this invention; Figure 8 This is an image of the polymer-derived ceramic prepared in Comparative Example 2 of the present invention. Detailed Implementation

[0017] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Although some embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the present invention. It should be understood that the accompanying drawings and embodiments of the present invention are for illustrative purposes only and are not intended to limit the scope of protection of the present invention.

[0018] Unless otherwise defined, all technical and scientific terms used in this invention have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0019] The term "comprising" and its variations as used herein are open-ended, meaning "including but not limited to"; the term "based on" means "at least partially based on"; the term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments"; and the term "optionally" means "optional embodiments". Definitions of other terms will be given in the following description. It should be noted that the concepts of "first," "second," etc., mentioned in this invention are used to distinguish different objects, not to describe a specific order or hierarchy. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0020] like Figure 1 As shown in the figure, an embodiment of the present invention provides a method for preparing a conductive polymer-derived ceramic, comprising: Step S1: Mix the silicon-containing polymer precursor, silane coupling agent, photosensitive monomer, photoinitiator, light absorber and oxygen inhibition agent evenly to obtain the precursor slurry; Step S2: The precursor slurry is photocured and printed to obtain a ceramic green body; Step S3: Under an inert gas protective atmosphere, the ceramic green body is subjected to pyrolysis treatment to obtain an intermediate sample; Step S4: Under an inert gas protective atmosphere, the intermediate sample is sintered to obtain polymer-derived ceramics; wherein the sintering temperature is not lower than 1450℃.

[0021] This invention, through the introduction of a silicon-containing polymer precursor and a silane coupling agent into the precursor slurry, enables the ceramic green body obtained by photopolymerization printing to gradually form an inorganic phase framework structure containing Si-OC and SiC during pyrolysis and high-temperature sintering, effectively reducing the volume shrinkage of the ceramic green body during pyrolysis and sintering. Furthermore, in this invention, without the introduction of conductive fillers, by controlling the sintering temperature at a relatively high level (not lower than 1450℃) under an inert gas protective atmosphere, the carbon structure in the resulting ceramic transforms from disordered to ordered, and from sp... 3 The structure transforms into a graphitized structure, forming a conductive structure where SiC and carbon phases coexist. This results in polymer-derived ceramics with good conductivity and avoids many problems caused by the introduction of conductive fillers. In summary, for the preparation of polymer-derived ceramics using DLP molding technology, the method of this invention can obtain polymer-derived ceramics with good conductivity while ensuring high strength and low volume shrinkage of the ceramic preform obtained by photopolymerization molding.

[0022] In the technical solution of this invention, as the sintering temperature increases, the carbon structure in the sample undergoes the following changes: At room temperature, the main source of carbon is the polymer chains in the polymer. During the initial pyrolysis process (approximately 380°C to 650°C), the polymer chains begin to break down, the internal hydrogen and oxygen elements gradually disappear, while carbon remains in the system; When the sintering temperature is raised to 800℃, sp... 3 A carbon-dominant amorphous carbon structure; sp appears in the system at a sintering temperature of approximately 1100℃. 2 The carbon structure is formed, accompanied by the formation of a small amount of silicon carbide (SiC). At sintering temperatures above approximately 1500℃, the carbon structure in SiC and its adjacent regions undergoes further rearrangement. Due to differences in boiling points, Si atoms readily volatilize and disappear with the flowing atmosphere, while the remaining carbon atoms, along with the original surface carbon atoms (sp...), remain. 3 sp 2 The graphitized structures tend to arrange themselves in an ordered manner, thus forming a multi-layered graphitized structure. The mechanism by which differences in conductivity arise at different sintering temperatures is as follows: Figure 2 As shown.

[0023] For polymer-derived ceramics obtained through DLP molding technology, it is often difficult to form a sufficiently dense and stable three-dimensional cross-linked network structure during the photocuring process, resulting in insufficient strength of the ceramic green body obtained by photocuring molding.

[0024] To address the above-mentioned problems, in some embodiments of the present invention, the photosensitive monomer includes monofunctional acrylic resins and polyfunctional acrylic resins; the monofunctional acrylic resin is selected from at least one of isoborneol acrylate, isooctyl acrylate, butyl acrylate, hydroxyethyl acrylate, hydroxypropyl acrylate, and 2-hydroxyethyl acrylate; the polyfunctional acrylic resin is selected from at least one of 1,6-hexanediol diacrylate, trimethylolpropane triacrylate, polyethylene glycol diacrylate, and tripropylene glycol diacrylate; the mass ratio of the polyfunctional acrylic resin to the monofunctional acrylic resin is (1 to 8):1, preferably, the mass ratio of the polyfunctional acrylic resin to the monofunctional acrylic resin is 5:1.

[0025] In this embodiment, a specific ratio (5:1) of multifunctional acrylic resin and monofunctional acrylic resin is introduced into the precursor slurry. Because the multifunctional acrylic resin contains multiple functional groups that can participate in photopolymerization, it can effectively promote the formation of a cross-linked network during photocuring, thereby significantly improving the strength and molding stability of the ceramic green body. Because the monofunctional acrylic resin has a longer molecular chain and higher flexibility, it helps to alleviate shrinkage stress during subsequent pyrolysis and sintering, further reducing the volume shrinkage of the ceramic green body.

[0026] In some embodiments of the present invention, the polysiloxane, exemplarily, includes at least one of SILRES® MK, SILRES® 604, SILRES® 610, and SIRES® H44.

[0027] In some embodiments of the present invention, in step S1, the photoinitiator comprises (2,4,6-trimethylbenzoyl)diphenylphosphine oxide, ethyl 2,4,6-trimethylbenzoylphenylphosphine acid, phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide, and 2-benzyl-2-dimethylamino-1-(4... At least one of morpholine phenyl methyl ethyl ketone; the light absorber includes at least one of curcumin and Sudan Orange G; the oxygen inhibition agent includes pentaerythritol tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]; the silane coupling agent is at least one of 3-mercaptopropyltrimethoxysilane and γ-mercaptopropyltrimethoxysilane, bis-[3-(triethoxysilane)propyl]tetrasulfide, γ-aminopropyltriethoxysilane, N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane, p-aminophenyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, vinyltriethoxysilane, γ-methacryloyloxypropyltrimethoxysilane, and β-cyanoethyltriethoxysilane.

[0028] In some embodiments of the present invention, the mass ratio of the silicon-containing polymer precursor, the silane coupling agent, the photosensitive monomer, the photoinitiator, the light absorber and the oxygen inhibitor in the precursor slurry is (30 to 60): (5 to 15): (25 to 50): (1.5 to 2.5): (0.04 to 0.06): (0.08 to 0.12).

[0029] In some embodiments of the present invention, in step S2, the exposure intensity of the photopolymerization printing is 25 mW / cm². 2 Up to 35mW / cm 2 The exposure time is 4 to 12 seconds.

[0030] In some embodiments of the present invention, step S3, wherein the pyrolysis treatment of the ceramic green body includes: first heating the ceramic green body to 370°C to 390°C at a preset heating rate, holding it at that temperature for 1.5h to 2.5h, then heating it to 470°C to 490°C, holding it at that temperature for 1.5h to 2.5h, and then heating it to 640°C to 660°C, holding it at that temperature for 1.5h to 2.5h; wherein the preset heating rate is 0.2°C / min to 0.3°C / min.

[0031] In some embodiments of the present invention, in step S4, the sintering process is carried out under an inert gas protective atmosphere, and the sintering temperature is 1500°C to 1750°C, and the time is 2.5h to 3.5h.

[0032] This invention also provides a conductive polymer-derived ceramic, which is prepared using the method described above.

[0033] The present invention will be further described below with reference to specific embodiments.

[0034] Example 1 A1. Mix polysiloxane and silane coupling agent evenly, then add photosensitive monomer, photoinitiator, light absorber and oxygen inhibitor in sequence, and stir evenly to obtain precursor slurry; wherein, the photosensitive monomer is composed of 1,6-hexanediol diacrylate and butyl acrylate in a mass ratio of 5:1; the silane coupling agent is 3-mercaptopropyltrimethoxysilane, the photoinitiator is (2,4,6-trimethylbenzoyl)diphenylphosphine oxide, the light absorber is Sudan Orange G, and the oxygen inhibitor is pentaerythritol tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]; in the precursor slurry, the mass ratio of polysiloxane, silane coupling agent, photosensitive monomer, photoinitiator, light absorber and oxygen inhibitor is 50:7.85:40:2:0.05:0.1.

[0035] A2. The precursor slurry is photocured and printed to obtain a ceramic green body; the exposure intensity of the photocuring printing is 30mW / cm. 2 The exposure time is 4 seconds.

[0036] A3. Under an inert gas protective atmosphere, the ceramic green body is first heated to 380℃ and held for 2 hours at a preset heating rate, then heated to 480℃ and held for 2 hours, and then heated to 650℃ and held for 2 hours to obtain an intermediate sample; the preset heating rate is 0.25℃ / min.

[0037] A4. Under an inert gas protective atmosphere, the intermediate sample is sintered to obtain polymer-derived ceramics; wherein the sintering temperature is 1500℃ and the time is 3h.

[0038] Example 2 The difference from Example 1 is that the sintering temperature is 1625°C.

[0039] Example 3 The difference from Example 1 is that the sintering temperature is 1750°C.

[0040] Example 4 The difference from Example 1 is that in step A1, the photosensitive monomer is composed of 1,6-hexanediol diacrylate and butyl acrylate in a mass ratio of 1:1.

[0041] Example 5 The difference from Example 1 is that in step A1, the photosensitive monomer is composed of 1,6-hexanediol diacrylate and butyl acrylate in a mass ratio of 3:1.

[0042] Comparative Example 1 The difference from Example 1 is that the sintering temperature is 800°C.

[0043] Comparative Example 2 The difference from Example 1 is that the sintering temperature is 1100°C.

[0044] Comparative Example 3 The difference from Example 1 is that step A1 is as follows: silane coupling agent, photosensitive monomer, photoinitiator, light absorber, and oxygen inhibitor are stirred evenly to obtain a precursor slurry; wherein the photosensitive monomer is composed of 1,6-hexanediol diacrylate and butyl acrylate in a mass ratio of 5:1; the silane coupling agent is 3-mercaptopropyltrimethoxysilane; and the photoinitiator is (2,4,6... The light absorber is Sudan Orange G, and the oxygen inhibition agent is pentaerythritol tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]; in the precursor slurry, the mass ratio of the silane coupling agent, the photosensitive monomer, the photoinitiator, the light absorber, and the oxygen inhibition agent is 7.85:90:2:0.05:0.1.

[0045] Effect Example Testing of the precursor slurries prepared in Examples 1 to 3 during a 21-day storage period revealed that the viscosity of the precursor slurries prepared in Examples 1 to 3 changed relatively slowly. The ceramic green bodies prepared in Examples 1, 4, and 5, as shown... Figures 3 to 5 As shown, from Figure 3 It can be seen that the ceramic green body prepared in Example 1 has a better printing effect, and no gel overflow phenomenon occurred in the ceramic green body. From Figure 4 It can be seen that the ceramic green body prepared in Example 4 exhibits a large amount of gel exudation, and the strength of the ceramic green body is relatively low. From Figure 5 It can be seen that the ceramic green body prepared in Example 5 exhibits partial gel exudation, and the strength of the ceramic green body is relatively low. The polymer-derived ceramics prepared in Example 1, Comparative Example 1, and Comparative Example 2 are as follows: Figures 6 to 8 As shown. It should be noted that, Figures 3 to 8 The length of each ruler represents 2mm.

[0046] The sheet resistance of the polymer-derived ceramics prepared in Examples 1 to 3, Comparative Example 1, and Comparative Example 2 was tested, and the results are shown in Table 1. As can be seen from Table 1, compared with Comparative Example 1 and Comparative Example 2, the sheet resistance of the polymer-derived ceramics prepared in Examples 1 to 3 is smaller, indicating that the polymer-derived ceramics in Examples 1 to 3 have better conductivity.

[0047] Table 1

[0048] The volume shrinkage rate of the ceramic green bodies prepared in Examples 1 to 3 and Comparative Example 3 during the pyrolysis and sintering process was tested. The results are shown in Table 2. As can be seen from Table 1, compared with Comparative Example 3, the volume shrinkage rate of the ceramic green bodies prepared in Examples 1 to 3 during the pyrolysis and sintering process is smaller.

[0049] Table 2

[0050] While the present invention has been disclosed above, its scope of protection is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, and all such changes and modifications will fall within the scope of protection of the present invention.

Claims

1. A method for preparing conductive polymer-derived ceramics, characterized in that, include: Step S1: Mix the silicon-containing polymer precursor, silane coupling agent, photosensitive monomer, photoinitiator, light absorber and oxygen inhibition agent evenly to obtain the precursor slurry; Step S2: The precursor slurry is photocured and printed to obtain a ceramic green body; Step S3: Under an inert gas protective atmosphere, the ceramic green body is subjected to pyrolysis treatment to obtain an intermediate sample; Step S4: Under an inert gas protective atmosphere, the intermediate sample is sintered to obtain polymer-derived ceramics; wherein the sintering temperature is not lower than 1450℃.

2. The method for preparing conductive polymer-derived ceramics according to claim 1, characterized in that, The silicon-containing polymer precursor includes polysiloxane.

3. The method for preparing conductive polymer-derived ceramics according to claim 1, characterized in that, The photosensitive monomer includes monofunctional acrylic resins and polyfunctional acrylic resins; the monofunctional acrylic resin is selected from at least one of isoborneol acrylate, isooctyl acrylate, butyl acrylate, hydroxyethyl acrylate, hydroxypropyl acrylate, and 2-hydroxyethyl acrylate; the polyfunctional acrylic resin is selected from at least one of 1,6-hexanediol diacrylate, trimethylolpropane triacrylate, polyethylene glycol diacrylate, and tripropylene glycol diacrylate.

4. The method for preparing conductive polymer-derived ceramics according to claim 3, characterized in that, The mass ratio of the polyfunctional acrylic resin to the monofunctional acrylic resin is (1 to 8):

1.

5. The method for preparing conductive polymer-derived ceramics according to claim 4, characterized in that, The mass ratio of the polyfunctional acrylic resin to the monofunctional acrylic resin is 5:

1.

6. The method for preparing conductive polymer-derived ceramics according to claim 1, characterized in that, In the precursor slurry, the mass ratio of the silicon-containing polymer precursor, the silane coupling agent, the photosensitive monomer, the photoinitiator, the light absorber, and the oxygen inhibitor is (30 to 60): (5 to 15): (25 to 50): (1.5 to 2.5): (0.04 to 0.06): (0.08 to 0.12).

7. The method for preparing conductive polymer-derived ceramics according to claim 1, characterized in that, In step S2, the exposure intensity of the photopolymerization printing is 25 mW / cm². 2 Up to 35mW / cm 2 The exposure time is 4 to 12 seconds.

8. The method for preparing conductive polymer-derived ceramics according to claim 1, characterized in that, In step S3, the ceramic blank is subjected to pyrolysis treatment, which includes: heating at a rate of 0.2℃ / min to 0.3℃ / min to first heat to 370℃ to 390℃ and hold for 1.5h to 2.5h, then heating to 470℃ to 490℃ and holding for 1.5h to 2.5h, and finally heating to 640℃ to 660℃ and holding for 1.5h to 2.5h.

9. The method for preparing conductive polymer-derived ceramics according to claim 1, characterized in that, In step S4, the sintering temperature is 1500℃ to 1750℃, and the time is 2.5h to 3.5h.

10. A conductive polymer-derived ceramic, characterized in that, It is prepared by the method for preparing conductive polymer-derived ceramics as described in any one of claims 1 to 9.

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