Strain self-compensating dielectric substrate, method of making and use thereof
By adding high-dielectric nanopowder to an elastomer polymer solution to form nanoparticle microsphere clusters, the problem of poor microstructure consistency in strain-adaptive dielectric materials was solved, and the frequency stability and energy receiving efficiency of dielectric materials under dynamic deformation environments were improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SICHUAN UNIV
- Filing Date
- 2026-04-28
- Publication Date
- 2026-05-29
AI Technical Summary
Existing methods produce strain-adaptive dielectric materials with poor microstructure consistency, which affects their application in flexible electronic systems.
By adding high dielectric constant nanoparticles to an elastomer polymer solution and adding them dropwise under continuous stirring, nanoparticle microsphere clusters are formed. The aggregation of nanoparticles is controlled by the two-phase incompatibility, and a strain-compensating dielectric substrate is prepared.
The size and distribution of nanoparticle microspheres can be controlled, improving the performance consistency and repeatability of dielectric materials and adapting to frequency stability and energy receiving efficiency under dynamic deformation environments.
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Figure CN122103901A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of flexible electronics and wireless communication technology, and relates to a strain self-compensating dielectric substrate, its preparation method and application. Background Technology
[0002] Flexible electronic devices have shown broad application prospects in fields such as health monitoring, human-computer interaction, and the Internet of Things, but their development has long been limited by energy supply issues. Traditional rigid batteries cannot meet the stringent requirements of devices for flexibility, lightweight design, and long battery life. Far-field radio frequency power transfer technology provides an ideal power supply solution for realizing fully wireless and battery-free flexible electronic systems. The core of this system is a flexible receiving antenna, which is responsible for capturing radio frequency electromagnetic energy in space and converting it into direct current, thereby powering the entire system.
[0003] However, to achieve reliable far-field power supply, the antenna must not only possess excellent initial electromagnetic properties, but more importantly, it must maintain stable performance under repeated stretching and deformation when attached to dynamic curved surfaces such as the human body. The resonant frequency of the antenna is determined by its physical dimensions and the dielectric constant of the substrate material. When the device is stretched due to human activity, the antenna size increases. If the dielectric constant of the substrate remains unchanged, the resonant frequency will shift, causing impedance mismatch between the antenna and the incident electromagnetic wave, significantly reducing energy transmission efficiency, and even causing system malfunction.
[0004] To address these issues, existing technologies often compensate through structural design (such as using serpentine or grid-like stretchable wire layouts) or the introduction of external tuning circuits. However, these methods often come at the cost of sacrificing antenna radiation efficiency, integration density, or reliability, without fundamentally solving the strain sensitivity problem inherent in the material itself. In recent years, research has proposed introducing high-dielectric-constant nanoparticles into elastomers to modulate their dielectric-mechanical coupling properties. For example, Kim et al. reported on "Dielectric Elastomer (DEE)" in *Strain-invariant stretchable radio-frequency electronics*. This material, through its micron-scale cluster structure of nanoparticles in a matrix, achieves a degree of strain-insensitive dielectric response, providing a new approach for strain-adaptive radio frequency devices.
[0005] Nevertheless, the preparation method reported in this paper lacks active and precise means to control the formation mechanism of micron-sized clusters, making it difficult to control the uniformity of cluster size, morphology and distribution. This, in turn, affects the uniformity and repeatability of the dielectric properties of the material, limiting its practical application in flexible electronic systems that require high consistency.
[0006] Therefore, there is an urgent need in this field for a method that can actively regulate the nanoparticle aggregation process and achieve controllable fabrication of microstructures in order to obtain strain-adaptive dielectric materials with uniform structure and stable performance, thereby laying a key material foundation for high-performance, highly reliable stretchable wireless power receiving devices and systems. Summary of the Invention
[0007] The technical problem to be solved by the present invention is the poor microstructure consistency of strain adaptive dielectric materials prepared by existing methods.
[0008] To achieve the above-mentioned objectives, the technical solution adopted in this application is as follows.
[0009] In a first aspect, the present invention provides a method for preparing a strain-compensating dielectric substrate, comprising the following steps:
[0010] S1. Add the elastomer polymer to the organic solvent and stir thoroughly to dissolve it, forming an elastomer polymer solution;
[0011] S2. Add the high dielectric constant nanoparticles to deionized water and stir thoroughly to disperse them evenly, forming a high dielectric constant nanoparticle dispersion solution;
[0012] S3. Under continuous stirring at a speed of 300~1500 rpm, a high dielectric constant powder dispersion solution is added dropwise to the elastomer polymer solution at a rate of 0.5~2 mL / min using a precision injection pump until the addition is complete, to obtain an intermediate mixture;
[0013] S4. The intermediate mixture is shaped and cured to obtain a strain-compensated dielectric substrate.
[0014] In step S1 above, the mass-to-volume ratio of the elastomer polymer to the organic solvent is 1g:1~3mL.
[0015] In step S1 above, the elastomer polymer is silicone rubber (Smooth-On Ecoflex), styrene-ethylene-butene-styrene block copolymer (SEBS), polydimethylsiloxane (PDMS), or thermoplastic polyurethane (TPU); the organic solvent is dichloromethane (DCM), chloroform, cyclohexane, tetrahydrofuran (THF), or toluene.
[0016] In step S2 above, the amount of the high dielectric constant nanopowder is 5-20% of the mass of the elastomer polymer in step S1; the concentration of the high dielectric constant powder dispersion solution is 1-2 g / mL.
[0017] In step S2 above, the high dielectric constant nanopowder is barium titanate (BaTiO3), strontium titanate (SrTiO3), titanium oxide (TiO2), or aluminum oxide (Al2O3); the particle size of the high dielectric constant nanopowder is 50~200nm.
[0018] In step S3 above, the molding and curing includes: pouring the intermediate mixture into a mold, letting it stand at room temperature for 12-36 hours to allow the solvent to evaporate, and then heating and curing.
[0019] In a second aspect, the present invention provides a strain-compensating dielectric substrate prepared by the above-described preparation method, the dielectric substrate comprising an elastic polymer matrix and a plurality of nanoparticle microspheres dispersed therein.
[0020] Thirdly, the present invention provides the application of the strain self-compensating dielectric substrate prepared by the above-described preparation method in the preparation of stretchable radio frequency antennas.
[0021] Furthermore, the application is as follows: using the strain-compensating dielectric substrate as the dielectric substrate, a stretchable conductor pattern is formed on the surface of the dielectric substrate by means of printing, spraying or transfer of conductor material to obtain the stretchable radio frequency antenna.
[0022] Furthermore, the conductor material includes silver paste, AgNW, PEDOT:PSS, or EGaIn.
[0023] The beneficial effects of this invention are as follows: This invention provides a process-controllable and highly repeatable method for preparing strain-compensating dielectric substrates. By pre-dispersing high-dielectric nanoparticles in an aqueous phase, and then dropwise adding them to an organic polymer solution under controlled shear conditions, the immiscibility of the two phases allows the nanoparticles to aggregate within the formed micron-sized aqueous droplets, creating spherical structures. This method can actively control the size and distribution of the nanoparticle microsphere clusters, effectively solving the problem of poor microstructure consistency in existing technologies. The process parameters of this invention are clear, the process flow is straightforward, the operation is simple, and the repeatability is high, significantly improving the consistency of the performance of strain-compensating dielectric substrates and laying a solid foundation for their large-scale production. Attached Figure Description
[0024] Figure 1 A schematic diagram illustrating the dielectric modulation principle of a strain-self-compensating dielectric substrate;
[0025] Figure 2 Optical micrographs of strain-compensating dielectric substrates before stretching were obtained in Example 1-1;
[0026] Figure 3 Optical micrographs of strain-compensating dielectric substrates obtained in Examples 1-2 before stretching;
[0027] Figure 4 Optical micrographs of strain-compensating dielectric substrates obtained in Examples 1-3 before stretching;
[0028] Figure 5 Optical micrographs of strain-compensating dielectric substrates obtained in Examples 1-4 before stretching;
[0029] Figure 6 Optical micrographs of strain-compensated dielectric substrates after stretching, obtained in Example 1-1;
[0030] Figure 7 Optical micrographs of strain-compensated dielectric substrates after stretching, obtained in Examples 1-2;
[0031] Figure 8 Optical micrographs of strain-compensated dielectric substrates after stretching, obtained in Examples 1-3;
[0032] Figure 9 Optical micrographs of strain-compensated dielectric substrates after stretching, obtained in Examples 1-4;
[0033] Figure 10 Optical micrograph of a strain-compensating dielectric substrate before stretching, obtained in Example 2-1;
[0034] Figure 11 Optical micrographs of strain-compensating dielectric substrates before stretching were obtained in Example 2-2;
[0035] Figure 12 Optical micrographs of strain-compensating dielectric substrates before stretching were obtained in Examples 2-3;
[0036] Figure 13 Optical micrographs of strain-compensated dielectric substrates after stretching, obtained in Example 2-1;
[0037] Figure 14 Optical micrographs of strain-compensated dielectric substrates after stretching were obtained in Example 2-2;
[0038] Figure 15 Optical micrographs of strain-compensated dielectric substrates after stretching, obtained in Examples 2-3;
[0039] Figure 16 This is a photograph of macroscopic aggregates formed by the BaTiO3 aqueous dispersion in the polymer solution under the experimental conditions of Comparative Example 1. Detailed Implementation
[0040] To make the technical problems, solutions, and beneficial effects of this application clearer, the following detailed description is provided in conjunction with the embodiments. Unless otherwise defined, all technical terms used herein have the same meaning as understood by one of ordinary skill in the art.
[0041] I. This invention provides a method for preparing a strain-compensating dielectric substrate, which specifically includes the following steps.
[0042] Step 1: Preparation of polymer solution and nanopowder dispersion: At room temperature, the elastomer polymer is dissolved in an organic solvent and stirred thoroughly to form a homogeneous polymer solution. Simultaneously, high dielectric constant nanopowder is added to deionized water and thoroughly dispersed to form a stable aqueous dispersion of the nanopowder.
[0043] In one specific embodiment of the present invention, the mass-to-volume ratio (g / ml) of the elastomeric polymer to the organic solvent is 1:1 to 1:3; the amount of the high dielectric constant nanopowder is 5% to 20% of the mass of the elastomeric polymer, and an appropriate amount of deionized water is added to prepare a high dielectric constant powder dispersion solution with a concentration of 1~2 g / mL. The elastomeric polymer is preferably Smooth-On Ecoflex, SEBS, PDMS, or TPU; the high dielectric constant nanopowder is preferably BaTiO3, SrTiO3, TiO2, or Al2O3 nanoparticles with a particle size range of 50 nm to 200 nm; the organic solvent is a good solvent for the elastomeric polymer, such as DCM or chloroform for silicone rubber, or cyclohexane, THF, or toluene for SEBS, PDMS, and TPU.
[0044] Step 2, Controlled drop-shear mixing to construct microsphere clusters: Under continuous stirring, the aqueous dispersion of nanopowder obtained in Step 1 is added dropwise to the polymer solution at a controllable rate using a precision injection pump to obtain an intermediate mixture.
[0045] In one specific embodiment of the invention, the stirring speed is 300 rpm to 1500 rpm, and the dropping rate is 0.5 mL / min to 2 mL / min. Since deionized water and organic solvents are immiscible, and the nanoparticles are insoluble in the organic phase, under continuous shear force, the added aqueous dispersion is broken into micron-sized droplets, and the nanoparticles are confined within these droplets. As the solvent evaporates in subsequent processes, the nanoparticles aggregate within the confined space, thereby forming microspheres with controllable size and morphology in the final polymer matrix.
[0046] Step 3, molding and curing: Pour the intermediate mixture obtained in step 2 into a mold for molding, and then cure it to obtain a strain self-compensating dielectric substrate.
[0047] In one specific embodiment of the present invention, the molding and curing process can be carried out according to the following steps: First, the intermediate mixture is poured into a mold of a predetermined shape and left to stand at room temperature for 12 to 36 hours to allow the organic solvent to fully evaporate; then, a heat curing treatment is performed to allow the polymer matrix to complete crosslinking. For example, for a silicone rubber system, the sample can be placed in an oven at 60°C to 80°C and heated for 1 to 2 hours to achieve complete curing, forming a stable three-dimensional network structure, and firmly encapsulating the nanoparticle microsphere clusters therein.
[0048] II. The present invention provides a strain self-compensating dielectric substrate prepared by the above-described preparation method.
[0049] The substrate comprises an elastic polymer matrix and multiple nanoparticle microsphere clusters dispersed therein. The high-dielectric nanoparticles are not dispersed as single particles, but rather aggregated to form microsphere clusters that function as functional units, embedded within the elastic polymer network.
[0050] The core mechanism by which strain-compensating dielectric substrates achieve the strain self-compensation effect lies in the dynamic deformation of their microstructure. For example... Figure 1 As shown, when the substrate is subjected to macroscopic stretching, the internal microsphere clusters undergo geometric deformation from a spherical shape to an ellipsoidal shape. This shape change produces a significant depolarization effect, which in turn drives an adaptive decrease in the overall equivalent dielectric constant of the material, thereby compensating for the frequency shift.
[0051] This invention provides a composite material with the deformable microstructure and a controllable preparation method thereof. The core of this invention lies in the construction method of the deformable microsphere cluster structure and the corresponding structural features themselves, rather than the specific numerical value of the dielectric properties. Those skilled in the art will understand that, based on achieving this deformable structure, the fundamental dielectric properties of the material can be adjusted through conventional material selection (such as adjusting the type, particle size, or content of high-dielectric nanopowders) to adapt to different application scenarios.
[0052] III. The present invention provides the application of the above-mentioned strain self-compensating dielectric substrate.
[0053] In one specific embodiment of the present invention, the aforementioned strain-compensating dielectric substrate can be used as a dielectric substrate to fabricate wireless communication devices such as stretchable radio frequency antennas. Specifically, stretchable conductor patterns can be formed on the surface of the substrate through processes such as printing, spraying, or transfer printing. For example, silver paste, AgNW, PEDOT:PSS, or EGaIn can be used as conductor materials to fabricate an antenna with strain-adaptive characteristics.
[0054] Furthermore, the aforementioned dielectric substrate can be used as a core functional unit, combined with functional circuits using known integration techniques in the art, to construct a complete stretchable wireless energy harvesting system. Specifically, after forming a conductor pattern on the substrate surface, a low-loss barrier layer or adhesive layer can be added between the conductor and the substrate to optimize interface performance, depending on the actual application requirements. Subsequently, the substrate with integrated conductors is co-packaged with rectifier circuits, power management modules, energy storage units, and rigid-flexible interconnect structures to ultimately form a flexible receiver system that can be used for far-field wireless energy transmission.
[0055] Through the above-described application methods, the strain-compensating dielectric substrate of the present invention can ensure the frequency stability and energy reception efficiency of the antenna and even the entire system in a dynamic deformation environment from the material level, and has broad application prospects in wearable devices, electronic skin and the Internet of Things.
[0056] The following specific embodiments will be provided to explain the solution of the present invention. Those skilled in the art will understand that the following embodiments are for illustrative purposes only and should not be considered as limiting the scope of the invention. Where specific techniques or conditions are not specified in the embodiments, they are performed according to the techniques or conditions described in the literature in the field or according to the product instructions. Reagents or instruments whose manufacturers are not specified are all conventional products that can be obtained commercially.
[0057] Example 1: Fabrication of BaTiO3 / Ecoflex strain-compensating dielectric substrate.
[0058] (1) Raw materials and proportions: In this embodiment, two-component silicone rubber Ecoflex 00-30 (components A and B are premixed in a 1:1 mass ratio) is used as the elastomer polymer, cubic phase BaTiO3 nanoparticles with an average particle size of 100 nm are used as high dielectric constant nanoparticles, DCM is used as the organic solvent, and deionized water is used as the dispersion medium.
[0059] To investigate the influence of process parameters, four sets of experiments were set up, with the following raw material ratios:
[0060] Experiments 1-1 and 1-2: Take 10g Ecoflex prepolymer, 10mL DCM, 1g BaTiO3 and an appropriate amount of deionized water.
[0061] Experiments 1-3 and 1-4: Take 10g Ecoflex prepolymer, 10mL DCM, 1.5g BaTiO3 and an appropriate amount of deionized water.
[0062] (2) Preparation process:
[0063] ① Add Ecoflex prepolymer to DCM and stir at 500 rpm for 30 minutes under mechanical stirring to form a uniform and transparent polymer solution.
[0064] ② Add BaTiO3 nanoparticles to the corresponding volume of deionized water and stir at 1000 rpm for 60 minutes to obtain a uniform and stable BaTiO3 aqueous dispersion with a concentration of 1 g / mL.
[0065] ③ Under continuous stirring, the BaTiO3 aqueous dispersion was slowly added to the polymer solution at a constant rate of 1 mL / min using a micro-injection pump; the stirring speeds used in the four groups of experiments were 600 rpm, 1000 rpm, 1000 rpm, and 800 rpm, respectively.
[0066] During the droplet addition process, the system gradually became opaque, and BaTiO3 nanoparticles aggregated in the aqueous microdroplets to form a large number of milky white BaTiO3 nanoparticle clusters. After the droplet addition was completed, stirring was continued for 5 minutes to obtain a homogeneous intermediate mixture.
[0067] ④ Pour the intermediate mixture into a polytetrafluoroethylene mold and let it stand at room temperature for 24 hours to allow the DCM to completely evaporate. Then, place it in an 80°C oven to cure for 2 hours to finally obtain a BaTiO3 / Ecoflex strain-compensated dielectric substrate with a thickness of about 700μm.
[0068] (3) Microscopic morphology analysis: The products of the four groups of experiments were observed by optical microscopy, and the results are as follows: Figures 2-5 As shown.
[0069] It can be seen that the diameter of the microspheres formed in Experiment 1-1 (600 rpm) is about 50~230 μm; the size of the microspheres formed in Experiment 1-2 (1000 rpm) is about 90~125 μm; the diameter of the microspheres formed in Experiment 1-3 (1000 rpm, with increased filler content) is about 90~135 μm; and the diameter of the microspheres formed in Experiment 1-4 (800 rpm, with increased filler content) is about 90~145 μm.
[0070] The results show that, under the same raw material ratio, increasing the stirring speed can significantly reduce the size distribution range of the microspheres, making the clusters more uniform; while at the same stirring speed, increasing the amount of BaTiO3 and water leads to a slight increase in the size of the microspheres. All samples exhibited well-formed spherical microspheres, uniformly distributed within the elastomer network, demonstrating the effective control of the microstructure by the preparation process of this invention.
[0071] (4) Verification of the strain self-compensation mechanism: A large uniaxial tensile strain of over 100% was applied to the BaTiO3 / Ecoflex strain self-compensating dielectric substrates prepared in Examples 1-1 to 1-4, and optical microscopic observation was performed. The results are as follows: Figures 6-9 As shown.
[0072] It is evident that under tensile strain, the microspheres within the substrate undergo significant geometric deformation, with their outlines gradually extending from an initial approximate spherical shape to an ellipsoidal shape and even a strip shape along the stretching direction. The spacing and orientation of the microspheres also adaptively adjust simultaneously. These results demonstrate that macroscopic tensile strain can achieve adaptive adjustment of the internal structure through controllable deformation and orientation reconstruction of the microspheres, providing a clear microstructural basis for the strain self-compensation behavior of dielectric properties.
[0073] Example 2: Fabrication of TiO2 / SEBS strain self-compensating dielectric substrate.
[0074] (1) Raw materials and proportions: In this embodiment, SEBS is used as the elastomer polymer, TiO2 nanoparticles with an average particle size of 200 nm are used as high dielectric constant nanoparticles, cyclohexane is used as the organic solvent, and deionized water is used as the dispersion medium.
[0075] To investigate the influence of process parameters, three sets of experiments were set up, with the following raw material ratios:
[0076] Experiment 2-1: Take 10g SEBS, 20mL cyclohexane, 1g TiO2 and an appropriate amount of deionized water.
[0077] Experiment 2-2: Take 10g SEBS, 20mL cyclohexane, 2g TiO2 and an appropriate amount of deionized water.
[0078] Experiment 2-3: Take 10g SEBS, 20mL cyclohexane, 2g TiO2 and an appropriate amount of deionized water.
[0079] (2) Preparation process:
[0080] ① Add SEBS to cyclohexane and stir at 200 rpm for 240 minutes under mechanical stirring to form a uniform and transparent polymer solution.
[0081] ② Add TiO2 nanoparticles to the corresponding volume of deionized water and stir at 1000 rpm for 10 minutes to obtain a uniform and stable TiO2 aqueous dispersion; the concentrations of the TiO2 aqueous dispersions obtained in the three groups of experiments were 1 g / mL, 1.33 g / mL, and 1.33 g / mL, respectively.
[0082] ③ Under continuous stirring, the TiO2 aqueous dispersion was slowly added dropwise to the polymer solution at a constant rate using a micro-injection pump; the dropping rate and stirring speed used in the three sets of experiments were:
[0083] Experiment 2-1: Dropping rate 1 mL / min, stirring speed 800 rpm;
[0084] Experiment 2-2: Dropping rate 0.5 mL / min, stirring speed 300 rpm;
[0085] Experiments 2-3: Dropping rate 2 mL / min, stirring speed 500 rpm.
[0086] After the addition is complete, continue stirring for 5 minutes to obtain a homogeneous intermediate mixture.
[0087] ④ The intermediate mixture is cast into a film and dried at 60°C for 12 hours to completely remove the solvent, thus obtaining a TiO2 / SEBS strain-compensated dielectric substrate.
[0088] (3) Microscopic morphology analysis: The products of the three sets of experiments were observed by optical microscopy, and the results are as follows. Figures 10-12 As shown.
[0089] It can be seen that the diameter of the microsphere clusters formed in Experiment 2-1 is about 20~120μm; the diameter of the microsphere clusters formed in Experiment 2-2 is about 65~170μm; and the diameter of the microsphere clusters formed in Experiment 2-3 is about 20~65μm.
[0090] The results show that the preparation method described in this invention is applicable to different polymer-filler systems. Comparison of morphologies under different parameters reveals that a faster dropping rate combined with medium-to-high intensity stirring is beneficial for forming microspheres with the most uniform size and most concentrated distribution; while a too-slow dropping rate and low shear force easily lead to the formation of clusters with large size ranges and excessively large local areas. These results further confirm that by controlling key process parameters such as the dropping rate and stirring speed, the size and uniformity of microspheres in different material systems can be effectively controlled, highlighting the good universality and controllability of the method in different polymer-filler combinations.
[0091] (4) Verification of the strain self-compensation mechanism: A large uniaxial tensile strain of over 100% was applied to the TiO2 / SEBS strain self-compensating dielectric substrates prepared in Examples 2-1 to 2-3, and optical microscopic observation was performed. The results are as follows: Figures 13-15 As shown.
[0092] As shown in the figure, the microspheres inside the substrate undergo significant geometric deformation under strain, with their outlines changing from an initial approximately spherical shape to an elongated strip structure extending along the stretching direction. This confirms that the microspheres undergo observable and directional geometric deformation under macroscopic stretching. This geometric deformation provides a direct microstructural basis for the adaptive change of the material's dielectric constant with strain, and is the foundation for its strain self-compensation function.
[0093] Comparative Example 1
[0094] To verify the necessity of the stirring step, the raw material ratio and preparation steps of Experiments 1-2 in Example 1 were used as references, with the only difference being that in step ③, no mechanical stirring was performed during and after the addition of the BaTiO3 aqueous dispersion.
[0095] After the addition was completed and allowed to stand, the BaTiO3 aqueous dispersion was visibly aggregated into a large number of white spherical particles in the polymer solution, suspended in the transparent system (e.g., Figure 16 (As shown). This is because, due to the lack of stirring and shearing action, the added aqueous droplets cannot be broken down and refined, causing the BaTiO3 nanoparticles to aggregate within the droplets, forming macroscopic agglomerates visible to the naked eye. Under these conditions, it is impossible to obtain a dielectric substrate with controllable microsphere size and uniform distribution.
[0096] The results show that without the continuous stirring conditions specified in this invention, the BaTiO3 aqueous dispersion cannot be broken into micron-sized microsphere clusters, thus failing to achieve the strain self-compensation function, further confirming the necessity and role of the stirring step in this invention.
Claims
1. A method for fabricating a strain-compensating dielectric substrate, characterized in that, Includes the following steps: S1. Add the elastomer polymer to the organic solvent and stir thoroughly to dissolve it, forming an elastomer polymer solution; S2. Add the high dielectric constant nanopowder to deionized water and stir thoroughly to disperse it evenly, forming a high dielectric constant powder dispersion solution; S3. Under continuous stirring at a speed of 300~1500 rpm, a high dielectric constant powder dispersion solution is added dropwise to the elastomer polymer solution at a rate of 0.5~2 mL / min using a precision injection pump until the addition is complete, to obtain an intermediate mixture; S4. The intermediate mixture is shaped and cured to obtain a strain-compensated dielectric substrate.
2. The method for preparing a strain-compensating dielectric substrate according to claim 1, characterized in that: In step S1, the mass-to-volume ratio of the elastomer polymer to the organic solvent is 1g:1~3mL.
3. The method for preparing a strain-compensating dielectric substrate according to claim 1, characterized in that: In step S1, the elastomer polymer is silicone rubber, styrene-ethylene-butene-styrene block copolymer, polydimethylsiloxane, or thermoplastic polyurethane; the organic solvent is dichloromethane, chloroform, cyclohexane, tetrahydrofuran, or toluene.
4. The method for preparing a strain-compensating dielectric substrate according to claim 1, characterized in that: In step S2, the amount of the high dielectric constant nanopowder is 5-20% of the mass of the elastomer polymer in step S1; the concentration of the high dielectric constant powder dispersion solution is 1-2 g / mL.
5. The method for preparing a strain-compensating dielectric substrate according to claim 1, characterized in that: In step S2, the high dielectric constant nanopowder is barium titanate, strontium titanate, titanium oxide, or aluminum oxide; the particle size of the high dielectric constant nanopowder is 50~200 nm.
6. The method for preparing a strain-compensating dielectric substrate according to claim 1, characterized in that, In step S3, the molding and curing includes: pouring the intermediate mixture into a mold, allowing it to stand at room temperature for 12-36 hours to allow the solvent to evaporate, and then heating and curing it.
7. The strain-compensating dielectric substrate prepared by the method according to any one of claims 1 to 6, characterized in that: The dielectric substrate comprises an elastic polymer matrix and a plurality of nanoparticle microspheres dispersed therein.
8. The application of the strain-compensating dielectric substrate prepared by the method according to any one of claims 1 to 6 in the preparation of a stretchable radio frequency antenna.
9. The application according to claim 8, characterized in that: Using the strain-compensating dielectric substrate as the dielectric substrate, a stretchable conductor pattern is formed on the surface of the dielectric substrate by means of printing, spraying or transfer of conductor material to obtain the stretchable radio frequency antenna.
10. The application according to claim 9, characterized in that: The conductor material includes silver paste, AgNW, PEDOT:PSS, or EGaIn.