Iridium element reinforced palladium-gold-copper alloy, and preparation method and application thereof
By introducing iridium into palladium-copper alloy and performing specific heat treatment, an iridium-reinforced palladium-copper alloy with a stable single-phase structure was prepared. This solved the problem of unstable resistance and difficulty in achieving both hardness and oxidation resistance in contact materials under frequent insertion and removal, and achieved high hardness, low resistance and corrosion resistance, thus extending service life.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-02-02
- Publication Date
- 2026-05-29
AI Technical Summary
Existing contact materials are prone to forming oxide films under frequent insertion and removal, resulting in unstable contact resistance, difficulty in achieving both hardness and oxidation resistance, and weak resistance to arc erosion, which affects the long-term reliability of weak current systems.
By introducing iridium and combining it with specific solution treatment and aging treatment processes, an iridium-strength palladium-copper alloy was prepared, achieving infinite miscibility of Ir, Pd, Au, and Cu, forming a stable single-phase structure, and enhancing oxidation resistance and electrical stability.
Alloy materials maintain low contact resistance and high hardness during long-term use, improve corrosion resistance, extend service life, and ensure electrical performance stability and machinability.
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Figure CN122105177A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to an iridium-strengthened palladium-copper alloy, its preparation method and application, belonging to the field of electrical contact metal materials technology. Background Technology
[0002] In the field of low-voltage contact (such as precision connectors, relays, and test probes), contact components typically operate under low voltage, low current, and low contact pressure conditions. These devices require frequent contact-disconnection actions, and the transmitted current primarily serves as a signal carrier rather than a load driver. Therefore, specific requirements are placed on the performance of electrical contact materials: they must possess stable and low contact resistance. However, while existing commonly used contact materials (such as pure gold, gold alloys, or palladium-based alloys) exhibit certain corrosion resistance and conductivity under long-term frequent use, they still have key drawbacks: hardness and oxidation resistance are difficult to balance; alloying elements that increase hardness often impair the material's oxidation resistance, leading to the easy formation of oxide films on the surface; electrical stability is insufficient; under frequent contact-disconnection and the thermal effect of small currents, the alloy is prone to microstructural evolution and grain boundary element diffusion, causing contact resistance to drift over time; and resistance to arc erosion is weak, as the micro-arcs generated by frequent insertion and removal easily form deposits on the surface, further exacerbating the instability of contact resistance. Therefore, developing a contact material that can maintain low resistance and high stability under frequent insertion and removal is of urgent practical significance for ensuring the long-term reliable operation of low-voltage systems. Summary of the Invention
[0003] To address the shortcomings of related technologies, this invention provides an iridium-strengthened palladium-copper alloy, its preparation method, and its application. While balancing the strength, stability, and low contact resistance of the contact material, it also exhibits good processing performance. This solves the problems of difficulty in simultaneously achieving contact material hardness, oxidation resistance, and electrical stability, as well as the electrical property drift caused by microstructure evolution under long-term use.
[0004] One of the objectives of this invention is to provide an iridium-strengthened palladium-copper alloy, wherein the composition of the alloy raw material, by mass percentage, includes: 0.5-1.5% Ir, 9-16% Au, and 20-40% Cu, with the balance being Pd.
[0005] The second objective of this invention is to provide a method for preparing an iridium-strengthened palladium-copper alloy, specifically including the following steps: (1) Weigh the raw materials according to the proportion and mix them to obtain mixed raw material powder.
[0006] (2) The mixed raw material powder is vacuum melted under an inert atmosphere (preferably high-purity argon) (preferably in a vacuum high-frequency induction furnace) to obtain an alloy liquid.
[0007] (3) The alloy liquid is suction-cast to obtain an ingot.
[0008] (4) The ingot is subjected to multiple rolling, drawing, intermediate annealing, solution treatment and aging treatment to obtain iridium-strengthened palladium-copper alloy wire.
[0009] Preferably, the vacuum melting conditions in step (2) are: a vacuum degree of 1×10 -2 Pa~5×10 -2 Under Pa conditions, melt at a temperature of 2450~2550℃ for 20~40 minutes, followed by refining for 4~6 minutes.
[0010] Preferably, the cooling water inlet temperature for suction casting in step (3) is 15~20℃, and the cooling water flow rate is 10~30L / min.
[0011] Preferably, the conditions for multi-pass rolling in step (4) are: rolling at 800~900℃, deformation per rolling pass is 10~15%, and total deformation is 70~80%.
[0012] Preferably, the deformation amount of each drawing pass in step (4) is 5~10%, and the total deformation amount is 60~80%.
[0013] Preferably, the intermediate annealing conditions in step (4) are: annealing at 700~800℃ for 20~40 minutes.
[0014] Preferably, the solution treatment conditions in step (4) are: solution treatment at 750~860℃ for 90~150 min.
[0015] Preferably, the aging treatment conditions in step (4) are: aging treatment at 300~600℃ for 30~120min.
[0016] The third objective of this invention is to provide an iridium-strengthened palladium-copper alloy as a semiconductor test probe material for use in cantilever probes, vertical probes, and MEMS probes.
[0017] Mechanism of the invention: This invention successfully prepared a high-performance iridium-reinforced palladium-copper alloy by introducing iridium (Ir) into the palladium-copper alloy and combining it with specific solution treatment and aging treatment processes. The specific process flow diagram is shown below. Figure 1As shown, the alloy exhibits a uniform distribution of Ir element with stable content in each region, and is an age-hardening alloy. It achieves infinite mutual solubility of iridium, palladium, gold, and copper, ensuring a stable single-phase structure throughout subsequent rolling and drawing processes, thus possessing excellent processing performance and high hardness. Due to the synergistic effect of Ir element and the aging and solution treatment processes, the alloy exhibits low contact resistance and extremely high resistivity stability, primarily due to slow element diffusion at grain boundaries, ensuring reliable electrical properties during long-term use. Furthermore, the alloy's corrosion resistance is significantly improved, effectively reducing surface oxide formation, resisting corrosion from common contaminants, and enhancing resistance to arc erosion, thereby greatly extending its service life. In summary, this invention, through the synergistic effect of composition design and process control, enables the alloy's comprehensive performance to meet the stringent requirements of current semiconductor testing probes for high-end alloy base materials.
[0018] The beneficial effects of this invention are: (1) By introducing the element Ir and the synergistic effect of a specific heat treatment process, the four elements Ir, Pd, Au and Cu achieve infinite mutual solubility, resulting in a single-phase solid solution structure with highly uniform composition and stable structure.
[0019] (2) The iridium-strengthened palladium-copper alloy prepared by the present invention has low contact resistance and extremely high resistivity stability; thanks to the slow diffusion of elements at the grain boundaries, the electrical performance remains stable during long-term use, ensuring the accuracy and reliability of the test signal.
[0020] (3) The iridium-strengthened palladium-copper alloy prepared by the present invention has high hardness while maintaining excellent processing performance. The stable single-phase structure makes the alloy suitable for precision rolling and drawing processes, and facilitates the preparation of probe wires with precise dimensions.
[0021] (4) The iridium-strengthened palladium-copper alloy prepared by the present invention has significantly improved corrosion resistance, effectively inhibits surface oxidation and resists pollutant erosion; at the same time, it enhances the resistance to arc erosion and greatly extends the service life of the probe. Attached Figure Description
[0022] Figure 1 This is a process flow diagram of the present invention. Detailed Implementation
[0023] To better illustrate the purpose, technical solution, and advantages of this invention, the following detailed description will be provided in conjunction with specific embodiments. Unless otherwise specified, all chemical reagents used in the embodiments and comparative examples of this invention are of commercially available analytical grade. The purity of the Ir, Au, Cu, and Pd raw materials used in the embodiments and comparative examples of this invention is ≥99.99%. Refining in the embodiments and comparative examples of this invention refers to the process of further removing gases and inclusions from the melt and homogenizing its composition by increasing the vacuum degree and / or applying electromagnetic stirring at the melting temperature; this is a conventional operation in the art.
[0024] Example 1 A method for preparing an iridium-strengthened palladium-copper alloy, specifically including the following steps: (1) Weigh the raw materials according to the mass percentage of 0.8% Ir, 10% Au, 34% Cu and 55.4% Pd and mix them evenly to obtain mixed raw material powder.
[0025] (2) Place the mixed raw material powder in a vacuum high-frequency induction furnace, and heat it at a vacuum degree of 1×10⁻⁶. -2 Under a high-purity argon atmosphere, the alloy was melted at 2450℃ for 30 minutes, followed by refining for 5 minutes to obtain the alloy liquid.
[0026] (3) The alloy liquid is suction-cast into a water-cooled copper mold to obtain a round bar ingot, wherein the cooling water inlet temperature is 15℃ and the cooling water flow rate is 20L / min.
[0027] (4) Place the round bar ingot in a hollow iron tube and heat it to 850°C for multi-pass rolling. The deformation amount of each rolling pass is 10% and the total deformation amount is 75%. Then cool it to room temperature to obtain an alloy bar. Remove the iron sheet on the surface of the alloy bar to obtain an alloy bar with a diameter of 7 mm. Then draw it at room temperature. The deformation amount of each drawing pass is 8%. Draw it to a deformation amount of 60%. Then perform intermediate annealing treatment at 750°C for 30 min. Then continue drawing until the total deformation amount is 80% to obtain the drawn wire. Tightly wrap the drawn wire with copper foil and perform solution treatment at 800°C for 120 min. Then perform aging treatment at 400°C for 60 min to obtain iridium-strengthened palladium-copper alloy wire.
[0028] Table 1 The performance of the iridium-reinforced palladium-copper alloy wire prepared in this embodiment was tested, and the test results are shown in Table 1. The test results show that the yield strength of the iridium-reinforced palladium-copper alloy wire prepared in this embodiment is 1104 MPa, the elongation is 9.8%, and the Hv... 0.1 The resistance is 448, the resistivity is 10.5 μΩ·cm, and the temperature coefficient of resistance at 20℃ is 2.7 × 10⁻⁶.-4 K -1 The elastic modulus is 116 GPa. In this embodiment, due to the synergistic effect of the introduction of Ir element and specific heat treatment process, a contact material with hardness, oxidation resistance and electrical stability is prepared. Moreover, the microstructure of the alloy material does not change under long-term use and the electrical properties are stable.
[0029] Example 2 A method for preparing an iridium-strengthened palladium-copper alloy, specifically including the following steps: (1) Weigh the raw materials according to the mass percentage of 0.8% Ir, 12% Au, 35% Cu and 52.2% Pd and mix them evenly to obtain mixed raw material powder.
[0030] (2) Place the mixed raw material powder in a vacuum high-frequency induction furnace, and heat it at a vacuum degree of 1×10⁻⁶. -2 Under a high-purity argon atmosphere, the alloy was melted at 2450℃ for 30 minutes, followed by refining for 5 minutes to obtain the alloy liquid.
[0031] (3) The alloy liquid is suction-cast into a water-cooled copper mold to obtain a round bar ingot, wherein the inlet temperature of the cooling water for suction casting is 20℃ and the flow rate of the cooling water is 30L / min.
[0032] (4) Place the round bar ingot in a hollow iron tube and heat it to 850°C for multi-pass rolling. The deformation amount of each rolling pass is 10% and the total deformation amount is 75%. Then cool it to room temperature to obtain an alloy bar. Remove the iron sheet on the surface of the alloy bar to obtain an alloy bar with a diameter of 7 mm. Then draw it at room temperature. The deformation amount of each drawing pass is 8%. Draw it to a deformation amount of 60%. Then perform intermediate annealing treatment at 750°C for 30 min. Then continue drawing until the total deformation amount is 80% to obtain the drawn wire. Tightly wrap the drawn wire with copper foil and perform solution treatment at 800°C for 120 min. Then perform aging treatment at 400°C for 60 min to obtain iridium-strengthened palladium-copper alloy wire.
[0033] Table 2 The performance of the iridium-reinforced palladium-copper alloy wire prepared in this embodiment was tested, and the test results are shown in Table 2. The test results show that the yield strength of the iridium-reinforced palladium-copper alloy wire prepared in this embodiment is 1090 MPa, the elongation is 9.3%, and the Hv is... 0.1 The value is 459, the resistivity is 10.8 μΩ·cm, and the temperature coefficient of resistance at 20℃ is 2.9 × 10⁻⁶. -4 K -1The elastic modulus is 108 GPa. In this embodiment, due to the synergistic effect of the introduction of Ir element and specific heat treatment process, a contact material with hardness, oxidation resistance and electrical stability is prepared. Moreover, the microstructure of the alloy material does not change under long-term use and the electrical properties are stable.
[0034] Example 3 A method for preparing an iridium-strengthened palladium-copper alloy, specifically including the following steps: (1) Weigh the raw materials according to the mass percentage of 1.5% Ir, 16% Au, 40% Cu and 42.5% Pd and mix them evenly to obtain mixed raw material powder.
[0035] (2) Place the mixed raw material powder in a vacuum high-frequency induction furnace, and heat it at a vacuum degree of 2×10 -2 Under a high-purity argon atmosphere, the alloy was melted at 2500℃ for 40 minutes, followed by refining for 6 minutes to obtain the alloy liquid.
[0036] (3) The alloy liquid is suction-cast into a water-cooled copper mold to obtain a round bar ingot, wherein the inlet temperature of the cooling water for suction casting is 18℃ and the flow rate of the cooling water is 10L / min.
[0037] (4) Place the round bar ingot in a hollow iron tube, heat it to 800°C and roll it in multiple passes. The deformation amount of each rolling pass is 15% and the total deformation amount is 70%. Then cool it to room temperature to obtain an alloy bar. Remove the iron sheet on the surface of the alloy bar to obtain an alloy bar with a diameter of 7 mm. Then draw it at room temperature. The deformation amount of each drawing pass is 5%. Draw it until the deformation amount is 50%. Then perform intermediate annealing treatment at 700°C for 40 min. Then continue to draw until the total deformation amount is 60% to obtain the drawn wire. Wrap the drawn wire tightly with copper foil, perform solution treatment at 750°C for 150 min, and then perform aging treatment at 300°C for 120 min to obtain iridium-strengthened palladium-copper alloy wire.
[0038] Table 3 The performance of the iridium-reinforced palladium-copper alloy wire prepared in this embodiment was tested, and the test results are shown in Table 3. The test results show that the yield strength of the iridium-reinforced palladium-copper alloy wire prepared in this embodiment is 1098 MPa, the elongation is 9.9%, and the Hv... 0.1 The value is 467, the resistivity is 10.1 μΩ·cm, and the temperature coefficient of resistance at 20℃ is 2.7 × 10⁻⁶. -4 K -1The elastic modulus is 109 GPa. In this embodiment, due to the synergistic effect of the introduction of Ir element and specific heat treatment process, a contact material with hardness, oxidation resistance and electrical stability is prepared. Moreover, the microstructure of the alloy material does not change under long-term use and the electrical properties are stable.
[0039] Example 4 A method for preparing an iridium-strengthened palladium-copper alloy, specifically including the following steps: (1) Weigh the raw materials according to the mass percentage of 0.5% Ir, 9% Au, 20% Cu and 70.5% Pd and mix them evenly to obtain mixed raw material powder.
[0040] (2) Place the mixed raw material powder in a vacuum high-frequency induction furnace, and heat it at a vacuum degree of 5×10 -2 Under a high-purity argon atmosphere, the alloy was melted at 2550℃ for 20 minutes, followed by refining for 4 minutes to obtain the alloy liquid.
[0041] (3) The alloy liquid is suction-cast into a water-cooled copper mold to obtain a round bar ingot, wherein the inlet temperature of the cooling water for suction casting is 20℃ and the flow rate of the cooling water is 30L / min.
[0042] (4) Place the round bar ingot in a hollow iron tube, heat it to 800°C and roll it in multiple passes. The deformation of each rolling pass is 12% and the total deformation is 80%. Then cool it to room temperature to obtain an alloy bar. Remove the iron sheet from the surface of the alloy bar to obtain an alloy bar with a diameter of 7 mm. Then draw it at room temperature. The deformation of each drawing pass is 10%. Draw it until the deformation is 70%. Then perform intermediate annealing at 800°C for 20 min. Then continue drawing until the total deformation is 80% to obtain the drawn wire. Wrap the drawn wire tightly with copper foil, perform solution treatment at 860°C for 90 min, and then perform aging treatment at 600°C for 30 min to obtain iridium-strengthened palladium-copper alloy wire.
[0043] Table 4 The performance of the iridium-reinforced palladium-copper alloy wire prepared in this embodiment was tested, and the test results are shown in Table 4. The test results show that the yield strength of the iridium-reinforced palladium-copper alloy wire prepared in this embodiment is 1073 MPa, the elongation is 10.4%, and the Hv is... 0.1 The value is 485, the resistivity is 11.1 μΩ·cm, and the temperature coefficient of resistance at 20℃ is 2.7 × 10⁻⁶. -4 K -1The elastic modulus is 104 GPa. In this embodiment, due to the synergistic effect of the introduction of Ir element and specific heat treatment process, a contact material with hardness, oxidation resistance and electrical stability is prepared. Moreover, the microstructure of the alloy material does not change under long-term use and the electrical properties are stable.
[0044] Comparative Example 1 A method for preparing palladium-copper alloy specifically includes the following steps: (1) Weigh the raw materials according to the mass percentage of 12% Au, 35% Cu and 53% Pd and mix them evenly to obtain mixed raw material powder.
[0045] (2) Place the mixed raw material powder in a vacuum high-frequency induction furnace, and heat it at a vacuum degree of 1×10⁻⁶. -2 Under a high-purity argon atmosphere, the alloy was melted at 2450℃ for 30 minutes, followed by refining for 5 minutes to obtain the alloy liquid.
[0046] (3) The alloy liquid is suction-cast into a water-cooled copper mold to obtain a round bar ingot, wherein the inlet temperature of the cooling water for suction casting is 20℃ and the flow rate of the cooling water is 30L / min.
[0047] (4) Place the round bar ingot in a hollow iron tube and heat it to 850°C for multi-pass rolling. The deformation amount of each rolling pass is 10% and the total deformation amount is 75%. Then cool it to room temperature to obtain an alloy bar. Remove the iron sheet on the surface of the alloy bar to obtain an alloy bar with a diameter of 7 mm. Then draw it at room temperature. The deformation amount of each drawing pass is 8%. Draw it to a deformation amount of 60%. Then perform intermediate annealing treatment at 750°C for 30 min. Then continue drawing until the total deformation amount is 80% to obtain the drawn wire. Wrap the drawn wire tightly with copper foil and perform solution treatment at 800°C for 120 min. Then perform aging treatment at 400°C for 60 min to obtain palladium-copper alloy wire.
[0048] Table 5 The performance of the palladium-copper alloy wire prepared in this comparative example was tested, and the test results are shown in Table 5. The test results show that the yield strength of the palladium-copper alloy wire prepared in this comparative example is 960 MPa, the elongation is 12.3%, and the Hv is... 0.1 The value is 384, the resistivity is 10.5 μΩ·cm, and the temperature coefficient of resistance at 20℃ is 2.7 × 10⁻⁶. -4 K -1The elastic modulus is 91 GPa. This comparative example lacks the microscopic pinning and solid solution strengthening core provided by Ir. Due to the lack of strong suppression of grain boundaries and dislocations by Ir atoms, the grains of this alloy tend to coarsen and the microstructure is unstable under the same processing and heat treatment. This results in weak solid solution strengthening effect, low basic hardness and strength, and the work hardening effect is easily diminished in subsequent annealing, leading to poor creep resistance and softening resistance. At the same time, the unstable microstructure accelerates atomic diffusion at grain boundaries, and resistivity is prone to drift during long-term use, resulting in decreased electrical contact stability. The oxidation resistance and arc erosion resistance of the material surface are also weakened due to insufficient microstructure uniformity and strength. Therefore, the alloy system without added Ir has poor strength and stability.
[0049] Comparative Example 2 A method for preparing an iridium-strengthened palladium-copper alloy, specifically including the following steps: (1) Weigh the raw materials according to the mass percentage of 0.8% Ir, 12% Au, 35% Cu and 52.2% Pd and mix them evenly to obtain mixed raw material powder.
[0050] (2) Place the mixed raw material powder in a vacuum high-frequency induction furnace, and heat it at a vacuum degree of 1×10⁻⁶. -2 Under a high-purity argon atmosphere, the alloy was melted at 2450℃ for 30 minutes, followed by refining for 5 minutes to obtain the alloy liquid.
[0051] (3) The alloy liquid is suction-cast into a water-cooled copper mold to obtain a round bar ingot, wherein the inlet temperature of the cooling water for suction casting is 20℃ and the flow rate of the cooling water is 30L / min.
[0052] (4) Place the round bar ingot in a hollow iron tube and heat it to 850°C for multi-pass rolling. The deformation amount of each rolling pass is 10% and the total deformation amount is 75%. Then cool it to room temperature to obtain an alloy bar. Remove the iron sheet on the surface of the alloy bar to obtain an alloy bar with a diameter of 7 mm. Then draw it at room temperature. The deformation amount of each drawing pass is 8%. Draw it to a deformation amount of 60%. Then perform intermediate annealing treatment at 750°C for 30 min. Then continue drawing until the total deformation amount is 80% to obtain the drawn wire. Wrap the drawn wire tightly with copper foil and perform solution treatment at 800°C for 120 min to obtain iridium-strengthened palladium-copper alloy wire.
[0053] Table 6 The performance of the iridium-reinforced palladium-copper alloy wire prepared in this comparative example was tested, and the test results are shown in Table 6. The test results show that the yield strength of the iridium-reinforced palladium-copper alloy wire prepared in this comparative example is 994 MPa, the elongation is 9.3%, and the Hv is... 0.1The value is 463, the resistivity is 13.1 μΩ·cm, and the temperature coefficient of resistance at 20℃ is 2.7 × 10⁻⁶. -4 K -1 The elastic modulus is 104 GPa. In this comparative example, due to the lack of aging treatment, the solution was directly subjected to solid solution treatment and then rapidly cooled. The resulting supersaturated solid solution was in a metastable state with a large number of vacancies and distortions. Although it had a certain strength, the microstructure was unstable. Due to the lack of aging treatment, the supersaturated solute atoms (especially iridium and copper) could not precipitate uniformly and dispersedly in the matrix, and could not form an effective precipitation strengthening phase. This resulted in the alloy's final strength, hardness, and creep resistance not being fully improved, micro-stress not being effectively eliminated, high electrical resistance, and long-term stability of electrical properties being affected. The alloy failed to achieve the comprehensive performance optimization brought about by aging precipitation, resulting in poor overall performance.
[0054] Comparative Example 3 A method for preparing an iridium-strengthened palladium-copper alloy, specifically including the following steps: (1) Weigh the raw materials according to the mass percentage of 0.8% Ir, 12% Au, 35% Cu and 52.2% Pd and mix them evenly to obtain mixed raw material powder.
[0055] (2) Place the mixed raw material powder in a vacuum high-frequency induction furnace, and heat it at a vacuum degree of 1×10⁻⁶. -2 Under a high-purity argon atmosphere, the alloy was melted at 2450℃ for 30 minutes, followed by refining for 5 minutes to obtain the alloy liquid.
[0056] (3) The alloy liquid is suction-cast into a water-cooled copper mold to obtain a round bar ingot, wherein the inlet temperature of the cooling water for suction casting is 20℃ and the flow rate of the cooling water is 30L / min.
[0057] (4) Place the round bar ingot in a hollow iron tube and heat it to 850°C for multi-pass rolling. The deformation amount of each rolling pass is 10% and the total deformation amount is 75%. Then cool it to room temperature to obtain an alloy bar. Remove the iron sheet on the surface of the alloy bar to obtain an alloy bar with a diameter of 7 mm. Then draw it at room temperature. The deformation amount of each drawing pass is 8%. Draw it to a deformation amount of 60%. Then perform intermediate annealing treatment at 750°C for 30 min. Then continue to draw it to a total deformation amount of 80% to obtain the drawn wire. Wrap the drawn wire tightly with copper foil and perform aging treatment at 400°C for 60 min to obtain iridium-strengthened palladium-copper alloy wire.
[0058] Table 7 The performance of the iridium-reinforced palladium-copper alloy wire prepared in this comparative example was tested, and the test results are shown in Table 7. The test results show that the yield strength of the iridium-reinforced palladium-copper alloy wire prepared in this comparative example is 973 MPa, the elongation is 10.2%, and the Hv is... 0.1 The value is 403, the resistivity is 11.2 μΩ·cm, and the temperature coefficient of resistance at 20℃ is 2.7 × 10⁻⁶. -4 K -1 The elastic modulus is 94 GPa. This comparative example did not undergo solution treatment, resulting in high-density dislocations and work-hardened structures within the wire after large deformation drawing, leading to extremely uneven composition and stress distribution. The alloy failed to first obtain a uniformly composed, stress-relieved supersaturated single-phase solid solution matrix, causing disordered and uneven diffusion and precipitation of solute atoms during subsequent aging. The precipitated phase could not form effectively and diffusely in the overall matrix, significantly weakening the precipitation strengthening effect. The alloy's strength, hardness, and structural stability did not reach ideal levels, and the uniformity and long-term stability of resistivity were also affected. Consequently, the material's overall performance could not be fully realized through the complete solution-aging synergistic mechanism.
[0059] The various embodiments of the present invention have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.
Claims
1. An iridium-strengthened palladium-copper alloy, characterized in that, The composition of the alloy raw material, by mass percentage, includes: 0.5-1.5% Ir, 9-16% Au, and 20-40% Cu, with the balance being Pd.
2. The method for preparing the iridium-strengthened palladium-copper alloy according to claim 1, characterized in that, Specifically, the following steps are included: (1) Weigh the raw materials according to the proportion and mix them to obtain mixed raw material powder; (2) The mixed raw material powder is vacuum melted under an inert atmosphere to obtain an alloy liquid; (3) The alloy liquid is suction-cast to obtain an ingot; (4) The ingot is subjected to multiple rolling, drawing, intermediate annealing, solution treatment and aging treatment to obtain iridium-strengthened palladium-copper alloy wire.
3. The method for preparing iridium-strengthened palladium-copper alloy according to claim 2, characterized in that, The vacuum melting conditions in step (2) are: a vacuum degree of 1×10 -2 Pa~5×10 -2 Under Pa conditions, melt at a temperature of 2450~2550℃ for 20~40 minutes, followed by refining for 4~6 minutes.
4. The method for preparing the iridium-strengthened palladium-copper alloy according to claim 2, characterized in that, The cooling water inlet temperature for step (3) suction casting is 15~20℃, and the cooling water flow rate is 10~30L / min.
5. The method for preparing iridium-strengthened palladium-copper alloy according to claim 2, characterized in that, The conditions for multi-pass rolling in step (4) are: rolling at 800~900℃, deformation per rolling pass is 10~15%, and total deformation is 70~80%.
6. The method for preparing the iridium-strengthened palladium-copper alloy according to claim 2, characterized in that, In step (4), the deformation of each drawing pass is 5-10%, and the total deformation is 60-80%.
7. The method for preparing the iridium-strengthened palladium-copper alloy according to claim 2, characterized in that, The conditions for intermediate annealing in step (4) are: annealing at 700~800℃ for 20~40 minutes.
8. The method for preparing the iridium-strengthened palladium-copper alloy according to claim 2, characterized in that, The conditions for solution treatment in step (4) are: solution treatment at 750~860℃ for 90~150 min.
9. The method for preparing the iridium-strengthened palladium-copper alloy according to claim 2, characterized in that, The aging conditions in step (4) are: aging at 300~600℃ for 30~120min.
10. The application of the iridium-strengthened palladium-copper alloy of claim 1 as a semiconductor test probe material in cantilever probes, vertical probes, and MEMS probes.