Electronic device and matching detection method

Abstract

The application provides an electronic device and a matching detection method. The electronic device comprises a control chip, a first temperature detection unit, a second temperature detection unit and an identification unit. The first temperature detection unit is located at a first position, detects the temperature at the position and outputs a first actual voltage value. The second temperature detection unit is located at a second position, detects the temperature at the position and outputs a second actual voltage value. The control chip determines the current temperature of the second position according to the second actual voltage value, determines the current temperature of the first position according to the corresponding relationship between the current temperature of the second position, the temperature of the first position and the temperature of the second position, determines the theoretical voltage value corresponding to the current temperature of the first position according to the corresponding relationship between the temperature of the first position and the voltage, and determines whether the identification unit is a preset identification unit according to the first actual voltage value and the theoretical voltage value. The two detection links can complete three detections, i.e., the temperature of the first position, the temperature of the second position and whether the identification unit is matched, and the number of detection links is reduced.

Description

Technical Field

[0001] This application relates to the field of electronic product technology, and more particularly to an electronic device and a matching detection method. Background Technology

[0002] To ensure the stable and safe operation of electronic devices, multiple detection links are typically installed within them to perform tests on different functions. For example, a temperature detection link is used to detect the temperature inside the electronic device; another example is a compatibility detection link, used to check whether certain components within the electronic device are compatible.

[0003] However, multiple detection links occupy a large amount of space inside electronic devices, resulting in a tight internal space layout for electronic devices. Summary of the Invention

[0004] To address the aforementioned technical problems, this application provides an electronic device and a matching detection method to solve the problem that multiple detection links occupy a large amount of internal space in the electronic device.

[0005] In a first aspect, embodiments of this application provide an electronic device, including: a control chip, a first detection module, and a second detection module; the first detection module includes a first temperature detection unit and an identification unit, and the second detection module includes a second temperature detection unit; the first temperature detection unit is located at a first position of the electronic device, and the second temperature detection unit is located at a second position of the electronic device; the first temperature detection unit is used to detect the temperature at the first position and output a first actual voltage value; the second temperature detection unit is used to detect the temperature at the second position and output a second actual voltage value; the control chip is used to determine whether the identification unit is a preset identification unit based on the second actual voltage value; wherein, determining whether the identification unit is a preset identification unit based on the second actual voltage value includes: determining the current temperature of the second position based on the second actual voltage value; determining the current temperature of the first position based on the current temperature of the second position and the correspondence between the temperature of the first position and the temperature of the second position; determining the theoretical voltage value corresponding to the current temperature of the first position based on the correspondence between the temperature and voltage of the first position; and determining whether the identification unit is a preset identification unit based on the first actual voltage value and the theoretical voltage value.

[0006] In this application, two detection modules can be used to complete the detection of the temperature at the second position, the temperature at the first position, and the detection of whether the identification unit is a preset identification unit. That is, three functions are performed using two detection modules, reducing the number of detection modules. When the units in the detection modules are electrically connected through traces in the flexible circuit board, the number of traces on the flexible circuit board can be reduced. For example, when performing the detection of the temperature at the second position, the temperature at the first position, and the detection of whether the identification unit is a preset identification unit, the flexible circuit board needs to have at least three traces (e.g., three traces are used to transmit the detection data of the temperature at the second position, the detection data of the temperature at the first position, and the matching data, respectively). With the solution of this application, when performing the detection of the temperature at the second position, the temperature at the first position, and the detection of whether the identification unit is a preset identification unit, the flexible circuit board only needs at least two traces, reducing the number of traces on the flexible circuit board, thereby reducing the width of the flexible circuit board and facilitating the arrangement of other structures within the mobile phone.

[0007] For example, the identification unit can be disposed on a structure within an electronic device, and the type of the structure can be determined based on the identification unit. For instance, the identification unit can be an identification resistor disposed on a circuit board, and the type of the circuit board can be determined based on the resistance value of the resistor. Of course, the identification unit is not limited to an identification resistor; any device that can achieve the identification function is within the scope of protection of this application.

[0008] For example, the theoretical voltage value is the voltage value determined through calculation, table lookup, etc. The actual voltage value is the voltage value obtained through some devices or actual data acquisition by devices.

[0009] For example, the first actual voltage value is the voltage value collected by ADC1, and the second actual voltage value is the voltage value collected by ADC2.

[0010] For example, the first position and the second position are two different locations within an electronic device. For instance, the first position and the second position are two different locations on a circuit board (such as a sub-board) within the electronic device.

[0011] For example, the first detection module is the combined detection module described below, and the second detection module is the first temperature detection module described below.

[0012] According to the first aspect, determining the current temperature of the second position based on the second actual voltage value includes: determining the current resistance value of the second temperature detection unit based on the second actual voltage value; and determining the current temperature of the second position corresponding to the current resistance value of the second temperature detection unit based on the correspondence between temperature and resistance value.

[0013] For example, the temperature can be determined directly based on the correspondence between temperature and resistance stored in the electronic device, without the need for further calculations or processing, thus simplifying the calculation steps.

[0014] According to the first aspect, or any implementation of the first aspect above, the first temperature detection unit includes a first voltage divider unit and a first thermistor; the second temperature detection unit includes a second voltage divider unit and a second thermistor; the first terminal of the first voltage divider unit is used to receive a first fixed voltage, the second terminal of the first voltage divider unit is coupled to the first terminal of the first thermistor at a first node, the second terminal of the first thermistor is electrically connected to the first terminal of the identification unit, and the second terminal of the identification unit is grounded; the first terminal of the second voltage divider unit is used to receive a second fixed voltage, the second terminal of the second voltage divider unit is coupled to the first terminal of the second thermistor at a second node, and the second terminal of the first thermistor is grounded; the first thermistor detects the temperature at a first location and outputs a first actual voltage value through the first node according to the first fixed voltage; the second thermistor detects the temperature at a second location and outputs a second actual voltage value through the second node according to the second fixed voltage.

[0015] The first and second temperature detection units have simple structures, and the thermistors have high accuracy in detecting temperature, resulting in high detection accuracy for electronic devices.

[0016] For example, the first voltage divider unit may include a voltage divider resistor or other device capable of voltage division; the second voltage divider unit may include a voltage divider resistor or other device capable of voltage division.

[0017] For example, the first thermistor and the second thermistor can be the same type, specifications, etc.

[0018] According to the first aspect, or any implementation of the first aspect above, the electronic device further includes a first circuit board, a second circuit board, and a connection structure; the first circuit board and the second circuit board are spaced apart, one end of the connection structure is electrically connected to the first circuit board, and the second end of the connection structure is electrically connected to the second circuit board; a first voltage divider unit and a second voltage divider unit are located on the first circuit board, and a first thermistor, a second thermistor, and an identification unit are located on the second circuit board; the first end of the first thermistor is coupled to the second end of the first voltage divider unit at a first node through the second circuit board, the connection structure, and the first circuit board; the first end of the second thermistor is coupled to the second end of the second voltage divider unit at a second node through the second circuit board, the connection structure, and the first circuit board.

[0019] In this application, two detection modules can be used to detect the temperature at a second location on the second circuit board, the temperature at a first location on the second circuit board, and whether the first and second circuit boards match (based on the identification unit located on the second circuit board to determine whether the first and second circuit boards match), thus reducing the number of detection modules. That is, the first thermistor and the identification unit are connected in series and then electrically connected to the first voltage divider unit through at least one trace on the second circuit board, at least one trace on the flexible circuit board, and at least one trace on the first circuit board. This reduces the number of traces on the first circuit board, the second circuit board, and the flexible circuit board compared to the first thermistor being electrically connected to the voltage divider unit through at least one trace on the second circuit board, at least one trace on the flexible circuit board, and at least one trace on the first circuit board, and the identification unit being electrically connected to the voltage divider unit through at least one trace on the second circuit board, at least one trace on the flexible circuit board, and at least one trace on the first circuit board. This reduces the width of the flexible circuit board, which is beneficial for the arrangement of other structures within the mobile phone.

[0020] According to the first aspect, or any implementation of the first aspect above, determining whether the identification unit is a preset identification unit based on the first actual voltage value and the theoretical voltage value includes: determining the difference between the first actual voltage value and the theoretical voltage value based on the first actual voltage value and the theoretical voltage value; if the difference between the first actual voltage value and the theoretical voltage value is within a preset difference, then determining that the identification unit is a preset identification unit, so as to determine that the first circuit board and the second circuit board are matched.

[0021] Considering that actual voltage values ​​may fluctuate due to factors such as errors during actual testing, the accuracy of testing can be improved by determining the difference between the first actual voltage value and the theoretical voltage value.

[0022] For example, the preset difference can be 30mV. Of course, this does not constitute a limitation on this application. Those skilled in the art can select the specific value of the preset difference according to the actual situation.

[0023] According to the first aspect, or any implementation of the first aspect above, the electronic device further includes a USB interface located on the second circuit board, with the USB interface in a second position. Specifically, the second temperature detection unit is used to detect the temperature at the USB interface. When the temperature at the USB interface exceeds a temperature threshold (which may cause damage or burnout to the USB interface), the control chip can take measures such as stopping charging or reducing the charging power to lower the temperature at the USB interface.

[0024] According to the first aspect, or any implementation of the first aspect above, the first position is the center position of the second circuit board, or the distance between the first position and the position where the functional devices are set in the second circuit board is greater than a first preset distance. That is, the first temperature detection unit is used to detect the ambient temperature of the second circuit board. When the ambient temperature of the second circuit board exceeds the temperature threshold (this temperature value may cause damage or burnout to some devices on the second circuit board), the control chip can reduce the temperature of the second circuit board by reducing the operating speed of functional devices such as speakers and / or display panels.

[0025] For example, the first preset distance is 3mm, and the distance between the first position and the position where the functional device is set in the second circuit board may be 3.5mm, 4mm, 4.5mm, 5mm, 5.5mm or 6mm, etc.

[0026] According to the first aspect, or any implementation of the first aspect above, the electronic device further includes a first voltage acquisition unit and a second voltage acquisition unit; the first voltage acquisition unit is used to acquire a first actual voltage value output by the first node and send the first actual voltage value to the control chip; the second voltage acquisition unit is used to acquire a second actual voltage value output by the second node and send the second actual voltage value to the control chip.

[0027] The first voltage acquisition unit may include devices capable of acquiring voltage, such as analog-to-digital converters, and the second voltage acquisition unit may include devices capable of acquiring voltage, such as analog-to-digital converters.

[0028] The first and second voltage acquisition units are integrated into the control chip, meaning the voltage acquisition unit within the control chip is used directly. This eliminates the need for a separate voltage acquisition unit, simplifying the structure of the electronic device. Of course, the first and second voltage acquisition units can also be configured separately.

[0029] According to the first aspect, or any implementation of the first aspect above, the first fixed voltage and the second fixed voltage are the same; the electronic device further includes a fixed power supply for outputting the first fixed voltage; the first terminal of the first voltage divider unit and the first terminal of the second voltage divider unit are both electrically connected to the fixed power supply to receive the first fixed voltage output by the fixed power supply.

[0030] This setup reduces the number of fixed power supplies required.

[0031] According to the first aspect, or any implementation of the first aspect above, the connection structure includes a flexible circuit board. That is, the first circuit board and the second circuit board are connected via a flexible circuit board. The solution of this application can reduce the number of traces on the flexible circuit board, thereby reducing the size of the flexible circuit board. Of course, the connection structure is not limited to a flexible circuit board; any structure that can achieve an electrical connection between the first and second circuit boards is within the scope of protection of this application.

[0032] According to the first aspect, or any implementation of the first aspect above, one end of the flexible circuit board is electrically connected to the first circuit board via a first connector, and the other end of the flexible circuit board is electrically connected to the second circuit board via a second connector. The solution of this application can reduce the number of traces on the flexible circuit board, and correspondingly, can reduce the number of pins on the connector, avoiding the problem of poor connector reliability and easy occurrence of problems such as warping or detachment due to a large number of connector pins.

[0033] According to the first aspect, or any implementation of the first aspect above, the control chip stores the correspondence between the temperature of the first position and the temperature of the second position, and / or the correspondence between the temperature and voltage of the first position.

[0034] In this way, temperature, voltage, etc. can be determined directly based on the corresponding relationships stored in the electronic device, without the need for further calculations and processing, thus simplifying the calculation steps.

[0035] According to the first aspect, or any implementation of the first aspect above, the distance between the first position and the second position is less than or equal to the second preset distance; according to the correspondence between the temperatures of the first position and the temperatures of the second position, the current temperature of the first position corresponding to the current temperature of the second position is determined, including: determining the current temperature of the second position as the current temperature of the first position.

[0036] In other words, when the distance between the first position and the second position is very close, the temperatures of the first position and the second position are basically the same. Therefore, once the current temperature of the second position is determined, the current temperature of the first position (which is the current temperature of the second position) can be determined directly.

[0037] For example, the second preset distance can be 3mm, and the distance between the first position and the second position can be 3mm, 2.8mm, 2.5mm, 2.2mm, 2mm, 1.8mm, 1.5mm, 1mm or 0.5mm, etc.

[0038] Of course, the distance between the first and second positions can also be relatively large, such as greater than a second preset distance, i.e., greater than 3mm. For example, the distance between the first and second positions can include 3.5mm, 4mm, 4.5mm, 5mm, 5.5mm, or 6mm, etc. When the distance between the first and second positions is relatively large, the temperature relationship between the first and second positions can be obtained through a fitting method.

[0039] Secondly, this application provides a matching detection method, which is applied in the electronic device of the first aspect. The method includes: acquiring a first actual voltage value and a second actual voltage value; determining the current temperature of a second position based on the second actual voltage value; determining the current temperature of a first position based on the current temperature of the second position and the correspondence between the temperature of the first position and the temperature of the second position; determining the theoretical voltage value corresponding to the current temperature of the first position based on the correspondence between the temperature and voltage of the first position; and determining whether the identification unit is a preset identification unit based on the first actual voltage value and the theoretical voltage value.

[0040] The second aspect and any implementation thereof correspond to the first aspect and any implementation thereof, respectively. The technical effects of the second aspect and any implementation thereof are similar to those of the first aspect and any implementation thereof, and will not be repeated here.

[0041] According to the second aspect, determining the current temperature of the second position based on the second actual voltage value includes: determining the current resistance value of the second temperature detection unit based on the second actual voltage value; and determining the current temperature of the second position corresponding to the current resistance value of the second temperature detection unit based on the correspondence between temperature and resistance value.

[0042] According to the second aspect, or any implementation of the second aspect above, acquiring the first actual voltage value and the second actual voltage value includes: detecting a matching instruction for determining whether the identification unit is a preset identification unit; and acquiring the first actual voltage value and the second actual voltage value based on the matching instruction.

[0043] Thirdly, this application provides a computer-readable medium for storing a computer program, the computer program including instructions for performing the methods in the second aspect or any possible implementation of the second aspect.

[0044] The third aspect and any implementation thereof correspond to the second aspect and any implementation thereof, respectively. The technical effects of the third aspect and any implementation thereof can be found in the technical effects of the second aspect and any implementation thereof, as described above, and will not be repeated here.

[0045] Fourthly, this application provides a chip including a processing circuit and transceiver pins. The transceiver pins and the processing circuit communicate with each other via an internal connection path. The processing circuit executes the method in the second aspect or any possible implementation of the second aspect to control the receiving pin to receive signals and to control the transmitting pin to transmit signals.

[0046] The fourth aspect and any implementation thereof correspond to the second aspect and any implementation thereof, respectively. The technical effects of the fourth aspect and any implementation thereof can be found in the technical effects of the second aspect and any implementation thereof, as described above, and will not be repeated here.

[0047] Fifthly, this application provides a computer program including instructions for performing the methods in the second aspect or any possible implementation thereof.

[0048] The fifth aspect and any implementation thereof correspond to the second aspect and any implementation thereof, respectively. The technical effects of the fifth aspect and any implementation thereof are similar to those of the second aspect and any implementation thereof, and will not be repeated here. Attached Figure Description

[0049] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0050] Figure 2 This application provides a diagram illustrating the positional relationships between certain structures in an electronic device.

[0051] Figure 3 This application provides a diagram illustrating the positional relationships between certain structures in an electronic device.

[0052] Figure 4 This application provides a diagram illustrating the positional relationships between certain structures in an electronic device.

[0053] Figure 5 This is a flowchart of a matching detection method provided in an embodiment of this application. Detailed Implementation

[0054] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0055] In this article, the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0056] The terms "first" and "second," etc., used in the specification and claims of this application are used to distinguish different objects, not to describe a specific order of objects. For example, "first target object" and "second target object," etc., are used to distinguish different target objects, not to describe a specific order of target objects.

[0057] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0058] In the description of the embodiments in this application, unless otherwise stated, "multiple" means two or more. For example, multiple processing units means two or more processing units; multiple systems means two or more systems.

[0059] In the description of the embodiments of this application, "electrical connection" is used to indicate that two or more components can communicate with each other (i.e., can transmit and interact with signals).

[0060] With the development of electronic technology, smaller electronic devices are increasingly favored by users due to their portability. However, as the functions of electronic devices are upgraded, the number of functional components inside them is increasing, and their size is growing, making the internal space layout of smaller electronic devices even more congested. For example, in a mobile phone, two printed circuit boards (PCBs) are electrically connected by a flexible printed circuit board (FPC). When the number of functional components on the two PCBs increases, the amount of data that the functional components on the two PCBs need to exchange (such as detection data) increases. Correspondingly, the number of signal transmission traces on the FPC needs to be set up more (e.g., the number of traces corresponding to detection data increases). This results in a larger FPC size, which is not conducive to the arrangement of other structures inside the mobile phone.

[0061] Furthermore, in some embodiments, the FPC is connected to the PCB via connectors, such as board-to-board (BTB) connectors. For example, one end of the FPC is electrically connected to one PCB via a BTB connector, and the other end of the FPC is electrically connected to another PCB via a different BTB connector. When the number of signal transmission traces on the FPC needs to be increased, the number of pins on the BTB connector also needs to be increased. This can lead to poor reliability of the BTB connector, making it prone to problems such as warping and detachment.

[0062] The embodiments of this application will be described by way of example below with reference to the accompanying drawings.

[0063] This application provides an electronic device, which may be, for example, a smartphone, tablet computer, laptop computer, in-vehicle computer, personal digital assistant (PDA), smart wearable device, or smart home device. This application does not limit the form of the electronic device. The following description uses a mobile phone as an example.

[0064] See Figure 1 , Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. The electronic device 100 includes a display panel 10, a back cover 20, and a middle frame 30. The display panel 10 and the back cover 20 are disposed opposite to each other, and the middle frame 30 is located between the display panel 10 and the back cover 20. The display panel 10, the middle frame 30, and the back cover 20 can form a receiving cavity.

[0065] The display panel 10 may include a liquid crystal display (LCD) panel, an organic light-emitting diode (OLED) display panel, and an LED display panel, etc., wherein the LED display panel may include a micro-LED display panel, a mini-LED display panel, etc. This application embodiment does not limit the type of the display panel 10.

[0066] The material of the back cover 20 may include opaque materials such as plastic, vegan leather, and fiberglass; or it may include translucent materials such as glass. This application does not limit the material of the back cover 20.

[0067] See Figure 2 , Figure 2 This diagram illustrates the positional relationship between certain structures in an electronic device according to an embodiment of this application. A first PCB 40, a second PCB 50, an FPC 60, and functional devices are disposed within a receiving cavity. One of the first PCB 40 and the second PCB 50 can be referred to as the motherboard, and the other as a sub-board; for example, the first PCB 40 can be called the motherboard, and the second PCB 50 can be called the sub-board. Functional devices may include a control chip 70, a speaker 80, and a Universal Serial Bus (USB) interface 90, etc. The control chip 70 may include a System-on-Chip (SoC) and / or a Power Management Integrated Circuit (PMIC) chip, etc., which have control and processing functions.

[0068] A first PCB 40 and a second PCB 50 are spaced apart, and an FPC 60 is used to electrically connect the first PCB 40 and the second PCB 50. For example, one end of the FPC 60 is electrically connected to the first PCB 40 via a first BTB connector 61, and the other end of the FPC 60 is electrically connected to the second PCB 50 via a second BTB connector 62, so that the first PCB 40 and the second PCB 50 are electrically connected via the FPC 60.

[0069] A control chip 70 is mounted on and electrically connected to the first PCB 40. A Universal Serial Bus (USB) interface 90 is mounted on and electrically connected to the second PCB 50. A speaker 80 is disposed adjacent to and electrically connected to the second PCB 50. The display panel 10 includes a display terminal 11, which is electrically connected to the second PCB 50.

[0070] The first PCB 40 can realize electrical connections between functional devices on the first PCB 40, electrical connections between functional devices electrically connected to the first PCB 40, and electrical connections between functional devices on the first PCB 40 and functional devices electrically connected to the first PCB 40.

[0071] The second PCB 50 can be used to realize electrical connections between functional devices on the second PCB 50, electrical connections between functional devices electrically connected to the second PCB 50, and electrical connections between functional devices on the second PCB 50 and functional devices electrically connected to the second PCB 50.

[0072] FPC 60 can electrically connect the first PCB 40 and the second PCB 50. Thus, functional devices electrically connected to the first PCB 40 (including functional devices disposed on and / or electrically connected to the first PCB 40) and functional devices electrically connected to the second PCB 50 (including functional devices disposed on and / or electrically connected to the second PCB 50) can be electrically connected via FPC 60. In other words, data and signal transmission and interaction between various functional devices within the electronic device 100 can be achieved through the first PCB 40, the second PCB 50, and FPC 60.

[0073] For example, please continue to see Figure 2 The control chip 70 is electrically connected to the speaker 80 via at least one trace on the first PCB 40, at least one communication pin of the first BTB connector 61, at least one trace on the FPC 60, at least one communication pin of the second BTB connector 62, and at least one trace on the second PCB 50, to control the speaker 80 and process the signals acquired by the speaker 80. Similarly, the control chip 70 is electrically connected to the USB interface 90 via at least one trace on the first PCB 40, at least one communication pin of the first BTB connector 61, at least one trace on the FPC 60, at least one communication pin of the second BTB connector 62, and at least one trace on the second PCB 50, to control the USB interface 90 and process the signals acquired by the USB interface 90. Similarly, the control chip 70 is electrically connected to the display terminal 11 of the display panel 10 through at least one trace on the first PCB 40, at least one communication pin of the first BTB connector 61, at least one trace on the FPC 60, at least one communication pin of the second BTB connector 62, and at least one trace on the second PCB 50, so as to realize the control of the display panel 10 and the processing of the signals collected by the display panel 10.

[0074] It is understood that the structures illustrated in the embodiments of this application do not constitute a specific limitation on the electronic device. In other embodiments of this application, the electronic device may include more or fewer components than illustrated, or combine certain components, or change the position of components. The illustrated components may be implemented in hardware, software, or a combination of hardware and software.

[0075] See Figure 3 , Figure 3 This diagram illustrates the positional relationships between certain structures in another electronic device provided in this application embodiment. It should be noted that this diagram is designed to more clearly demonstrate the specific structure of the detection circuit. Figure 3 Only the structures related to the detection circuit are shown, while other structures (such as...) are not shown. Figure 2 The display panel 10, control chip 70, speaker 80, and Universal Serial Bus (USB) interface 90, as well as the signal traces electrically connecting the control chip 70 to the display panel 10, speaker 80, and USB interface 90, are described in the following examples and will not be repeated here. The electronic device 100 also includes a detection circuit, which includes a matching detection module 110, a first temperature detection module 120, and a second temperature detection module 130. The matching detection module 110 is used to detect whether the motherboard (i.e., the first PCB 40) and the sub-board (i.e., the second PCB 50) are matched. The first temperature detection module 120 is used to detect the temperature at the USB interface 90, and the second temperature detection module 130 is used to detect the ambient temperature of the sub-board (i.e., the second PCB 50). The configuration of the matching detection module 110, the first temperature detection module 120, and the second temperature detection module 130 makes the electronic device safer and more reliable during operation.

[0076] Please continue reading Figure 3 The matching detection module 110 may include a voltage divider resistor R1, an identification resistor R2, and a first voltage acquisition unit. The first voltage acquisition unit may include a device capable of acquiring voltage, such as an analog-to-digital converter (ADC). To distinguish the voltage acquisition unit from those described below, the ADC here is labeled ADC1. ADC1 may be integrated into the control chip 70 or may be set up separately. This application embodiment does not limit this; the description uses an example of ADC1 being set up separately.

[0077] Voltage divider resistor R1 and ADC1 are disposed on the first PCB 40, and identification resistor R2 is disposed on the second PCB 50. The first end of voltage divider resistor R1 is electrically connected to a fixed power supply, which is used to output a fixed voltage V0. The fixed power supply can be integrated into the PMIC or disposed separately; this embodiment does not limit this. The second end of voltage divider resistor R1 and ADC1 are coupled to node N1. The first end of identification resistor R2 is electrically connected to node N1 through at least one trace on the second PCB 50, at least one communication pin of the second BTB connector 62, at least one trace on the FPC 60, at least one communication pin of the first BTB connector 61, and at least one trace on the first PCB 40.

[0078] Sub-boards can be of various types. Different sub-board types have different configuration parameters for the components mounted on them. The main board can obtain the configuration parameters of at least one component on the sub-board and determine whether the sub-board is compatible with the main board based on these parameters.

[0079] In this embodiment, the matching of the first PCB 40 and the second PCB 50 can be determined by the resistance of the identification resistor R2. Specifically, since the resistance value of the identification resistor R2 is constant (i.e., a fixed value), the theoretical voltage value at node N1 can be determined based on the fixed voltage V0, the voltage divider resistor R1, and the identification resistor R2: V0×r2 / (r1+r2), where r1 is the resistance value of the voltage divider resistor R1 and r2 is the resistance value of the identification resistor R2. The ADC1 can collect the voltage at node N1 in real time, and the voltage at node N1 collected by the ADC1 is the actual voltage value of node N1. If the theoretical voltage value and the actual voltage value are the same, or if the theoretical voltage value and the actual voltage value are close (i.e., considering factors such as error, although the theoretical voltage value and the actual voltage value are not exactly the same, the difference is small), then the control chip 70 determines that the identification resistor R2 is the identification resistor R2 on the sub-board that matches the main board, and thus determines that the second PCB 50 is a sub-board that matches the first PCB 40.

[0080] Please continue reading Figure 3The first temperature detection module 120 may include a voltage divider resistor R3, a thermistor, and a second voltage acquisition unit. The thermistor here may include a positive temperature coefficient (PTC) thermistor or a negative temperature coefficient (NTC) thermistor, etc., whose resistance value changes with temperature. This embodiment uses an NTC thermistor as an example for illustration. To distinguish it from thermistors in other contexts, the NTC thermistor here is labeled NTC2. The second voltage acquisition unit may include a voltage acquisition device such as an ADC. To distinguish it from voltage acquisition units in other contexts, the ADC here is labeled ADC2. ADC2 may be integrated into the control chip 70 or may be set separately. This embodiment does not limit this; this embodiment uses a separate ADC2 setting as an example for illustration.

[0081] Voltage divider resistor R3 and ADC2 are mounted on the first PCB 40; NTC2 is mounted on the second PCB 50, adjacent to the USB interface 90. "Adjacent" can be understood as the device on the second PCB 50 closest to the USB interface 90, allowing for more accurate real-time monitoring of the USB interface 90's temperature. Of course, those skilled in the art can also set the specific location of NTC2 according to the actual situation on the second PCB 50 (such as the placement of other devices). The first terminal of voltage divider resistor R3 is electrically connected to a fixed power supply, which can be a fixed power supply electrically connected to the first terminal of voltage divider resistor R1, thus reducing the number of fixed power supplies. The second terminal of voltage divider resistor R3 and ADC2 are coupled to node N2. The first terminal of thermistor NTC2 is electrically connected to node N2 through at least one trace on the second PCB 50, at least one communication pin of the second BTB connector 62, at least one trace on the FPC 60, at least one communication pin of the first BTB connector 61, and at least one trace on the first PCB 40. The second terminal of thermistor NTC2 is grounded.

[0082] ADC2 is used to acquire the voltage at node N2. Based on this voltage, control chip 70 can determine the voltage drop across the thermistor NTC2, then determine its resistance, and finally determine the temperature at USB interface 90. This is because thermistor NTC2 exhibits different resistance values ​​at different temperatures. When the temperature at USB interface 90 changes, the resistance of thermistor NTC2 changes, thus changing its voltage drop. Therefore, control chip 70 can determine the voltage drop across the thermistor NTC2 and its resistance based on the voltage acquired at node N2 by ADC2, and then determine the temperature at USB interface 90 based on this resistance. When the temperature at USB interface 90 exceeds a temperature threshold (which may cause damage or burnout to USB interface 90), control chip 70 can take measures such as stopping charging or reducing charging power to lower the temperature at USB interface 90.

[0083] Please continue reading Figure 3 The second temperature detection module 130 may include a voltage divider resistor R4, a thermistor, and a third voltage acquisition unit. The thermistor here may be a PTC thermistor or an NTC thermistor, or a device whose resistance value changes with temperature. This embodiment uses an NTC thermistor as an example. To distinguish it from thermistors mentioned in other contexts, the NTC thermistor here is labeled NTC1. The third voltage acquisition unit may include an ADC or other device capable of acquiring voltage. To distinguish it from voltage acquisition units mentioned in other contexts, the ADC here is labeled ADC3. ADC3 may be integrated into the control chip 70 or may be set separately. This embodiment does not limit this; this embodiment uses an example of ADC3 being set separately.

[0084] Voltage divider resistor R4 and ADC3 are mounted on the first PCB 40. NTC1 is mounted on the second PCB 50 and located in the middle of the second PCB 50; or, NTC1 is mounted on the second PCB 50 and the distance between it and the location of functional devices (e.g., heat-generating devices that generate heat during operation) on the second PCB 50 is greater than a first preset distance, where the first preset distance can be 3mm, etc. This setting allows NTC1 to better monitor the ambient temperature of the second PCB 50 without being affected by some heat-generating devices.

[0085] The first terminal of voltage divider resistor R4 is electrically connected to a fixed power supply, which can be the same fixed power supply connected to the first terminal of voltage divider resistor R1, thus reducing the number of fixed power supplies. The second terminal of voltage divider resistor R4 is coupled to ADC3 at node N3. The first terminal of thermistor NTC1 is electrically connected to node N3 through at least one trace on the second PCB 50, at least one communication pin of the second BTB connector 62, at least one trace on the FPC 60, at least one communication pin of the first BTB connector 61, and at least one trace on the first PCB 40. The second terminal of thermistor NTC1 is grounded.

[0086] ADC3 is used to acquire the voltage at node N3. Based on this voltage, control chip 70 can determine the voltage division of thermistor NTC1, determine the resistance of thermistor NTC1, and then determine the temperature of the second PCB 50 based on the resistance of thermistor NTC1. This is because thermistor NTC1 exhibits different resistance values ​​at different temperatures. When the temperature of the second PCB 50 changes, the resistance of thermistor NTC1 changes, thus causing a change in the voltage division of thermistor NTC1. Therefore, control chip 70 can determine the voltage division of thermistor NTC1 and its resistance based on the voltage acquired at node N3 by ADC3, and then determine the temperature of the second PCB 50 based on the resistance of thermistor NTC1. When the temperature of the second PCB 50 exceeds a temperature threshold (which may cause damage to components on the second PCB 50), control chip 70 can reduce the operating speed of speaker 80 and / or display panel 10, etc., to lower the temperature of the second PCB 50.

[0087] The detection circuit has been briefly described above. As can be seen from the above, when it is necessary to detect whether the first PCB 40 and the second PCB 50 match, whether the ambient temperature of the sub-board (i.e., the second PCB 50) meets the requirements, and whether the temperature at the USB interface 90 meets the requirements, at least three paths are required. Correspondingly, the number of traces on the FPC 60 transmitting the aforementioned detection signals needs to be at least three. Furthermore, from... Figure 2As can be seen, in addition to the traces for transmitting the aforementioned detection signals, the FPC 60 also has traces connecting the control chip 70 to the display terminal 11 of the display panel 10, the speaker 80, and the USB interface 90. This necessitates a large number of traces on the FPC 60, resulting in a larger size and thus occupying more internal space in the electronic device. This is detrimental to the design of other internal structures and / or to the miniaturization of the electronic device. Correspondingly, the number of pins on the BTB connector also needs to be increased, leading to poorer reliability and a higher likelihood of the BTB connector warping or detaching.

[0088] Based on this, this application embodiment also provides a detection circuit that can reduce the number of FPC 60 traces and the number of BTB connector pins. The specific structure of this detection circuit is described below.

[0089] See Figure 4 , Figure 4 This is a diagram showing the positional relationship between certain structures in an electronic device provided in this application embodiment. Figure 3 The detection circuit shown in the example differs from that in the detection circuit of this application embodiment, where... Figure 3 The matching detection module 110 and the second temperature detection module 130 are combined into one circuit, and then the voltage at the second end of the voltage divider resistor R1 is acquired through a voltage acquisition unit. Specifically, the detection circuit includes a combined detection module 140 and a first temperature detection module 120. The combined detection module 140 includes a voltage divider resistor (also called a first voltage divider unit) R1, an identification resistor R2, a thermistor (also called a first thermistor) NTC1, and an ADC1. The voltage divider resistor R1 and ADC1 are located on the first PCB 40, and the identification resistor R2 and NTC1 are located on the second PCB 50, with NTC1 located in the middle of the second PCB 50; or, the distance between NTC1 and the location of functional devices (e.g., heat-generating devices that generate heat during operation) on the second PCB 50 is greater than a first preset distance, where the first preset distance can be 3mm, etc. This setting allows NTC1 to better monitor the ambient temperature of the second PCB 50 without being affected by some heat-generating devices. For distinction, the location of NTC1 on the second PCB 50 is also called the first position.

[0090] The first terminal of the voltage divider resistor R1 is electrically connected to a fixed power supply, which outputs a fixed voltage V0. The second terminal of the voltage divider resistor R1 is coupled to ADC1 at node N4. The first terminal of NTC1 is electrically connected to node N4 through at least one trace on the second PCB 50, at least one communication pin of the second BTB connector 62, at least one trace on the FPC 60, at least one communication pin of the first BTB connector 61, and at least one trace on the first PCB 40. The second terminal of NTC1 is electrically connected to the first terminal of the identification resistor R2, and the second terminal of the identification resistor R2 is grounded. That is, ... Figure 3 The thermistor NTC1 and the identification resistor R2 are connected in series to form a path, and the voltage of node N4 can be acquired by an ADC (such as ADC1). The structure of the first temperature detection module 120 is similar to... Figure 3 The structure and connection relationship of the first temperature detection module 120 shown are the same, that is, the first temperature detection module 120 may include a voltage divider resistor (also called the second voltage divider unit) R3, a thermistor (also called the second thermistor) NTC2 and ADC2. The connection relationship of the voltage divider resistor R3, the thermistor NTC2 and ADC2 can be found in [reference]. Figure 3 The description of the location is omitted here. For distinction, the position of NTC2 on the second PCB 50 is also referred to as the second position. This embodiment uses the example where the first thermistor NTC1 and the second thermistor NTC2 are of the same type and specifications. This reduces computation and improves detection accuracy. Of course, the first thermistor NTC1 and the second thermistor NTC2 can also be of different types and specifications. Those skilled in the art can select the first thermistor NTC1 and the second thermistor NTC2 according to the actual situation.

[0091] The following three detection methods can be completed through two detection links (the link corresponding to the combined detection module 140 and the link corresponding to the first temperature detection module 120): detecting whether the motherboard (i.e., the first PCB 40) and the sub-board (i.e., the second PCB 50) are compatible, detecting the temperature at the USB interface 90, and detecting the ambient temperature of the sub-board (i.e., the second PCB 50). Based on the structure of the above detection circuit, the principle of how the combined detection module 140 and the first temperature detection module 120 complete these three detections will be explained below in two illustrative ways.

[0092] The first scenario involves the proximity of NTC1 and NTC2. For example, the distance between the positions of NTC1 (the first position) and NTC2 (the second position) is less than or equal to a second preset distance, which can be 3mm. Exemplary examples include distances of 3mm, 2.8mm, 2.5mm, 2.2mm, 2mm, 1.8mm, 1.5mm, 1mm, or 0.5mm. Since the proximity of NTC1 and NTC2 means that the temperatures of NTC1 and NTC2 are essentially the same, the temperature of NTC1 can be directly determined once the temperature of NTC2 is known. Similarly, the temperature of the second thermistor NTC2 can be directly determined once the temperature of NTC1 is known.

[0093] Specifically, ADC2 is used to acquire the voltage at the second node N2 in real time or at a preset frequency, and the voltage acquired by ADC2 is the actual voltage value at the second node N2. ADC1 is used to acquire the voltage at the first node N4 in real time or at a preset frequency, and the voltage acquired by ADC1 is the actual voltage value at the first node N4.

[0094] When the voltage at the second node N2 is known, according to the formula: V2=V0×r NTC2 / (r3+r NTC2 ), where V2 represents the voltage at the second node N2, V0 is a fixed voltage value (known), and r NTC2 The resistance value of the second thermistor (unknown) is represented by r1, and the resistance value of the voltage divider resistor R3 (known) is represented by r2. The resistance value r of the second thermistor NTC2 can then be determined. NTC2 .

[0095] When the resistance value of the second thermistor NTC2 is r NTC2 Once determined, the temperature of the second thermistor NTC2 can be determined based on the correspondence between its temperature and resistance value. The control chip 70 stores this temperature-resistance correspondence, meaning different temperatures correspond to different resistance values.

[0096] It should be noted here that the relationship between temperature and resistance can be calculated based on the parameters of the second thermistor NTC2 before the electronic device leaves the factory. For example, if the parameters of the second thermistor NTC2 are that the resistance is 100KΩ at a typical temperature of 25℃, then it can be calculated according to the formula: R 求=R0exp(B(1 / T1-1 / T0)), determines the resistance value of the second thermistor NTC2 at different temperatures, where T0 represents the Kelvin at the typical temperature, T1 represents the Kelvin at the desired temperature, B represents a constant, R0 represents the resistance value at the typical temperature, and R... 求 The resistance value corresponding to the desired temperature is given. Since the Kelvin corresponding to the typical temperature, the Kelvin corresponding to the desired temperature, B, and the resistance value corresponding to the typical temperature are known, the resistance value corresponding to the desired temperature can be determined, thus obtaining the correspondence between the temperature and resistance value of the second thermistor NTC2. This relationship is then stored in the control chip 70. The correspondence between temperature and resistance value stored in the control chip 70 is shown in Table 1. Table 1 is only one example and does not constitute a limitation of this application. The following tables are the same (i.e., only one example), and will not be repeated below.

[0097] Table 1. Correspondence between temperature and resistance.

[0098]

[0099]

[0100] After obtaining the temperature of the second thermistor NTC2 from the table, the current temperature of the first thermistor NTC1 can be determined based on the temperature of the second thermistor NTC2. That is, the current temperature of the first thermistor NTC1 is the current temperature of the second thermistor NTC2.

[0101] If the current temperature of the first thermistor NTC1 is determined, the theoretical voltage value at the first node N4 corresponding to the current temperature of the first thermistor NTC1 can be determined based on the correspondence between the temperature and voltage of the first thermistor NTC1 (since the first thermistor NTC1 is located at the first position of the second PCB 50, the correspondence between the temperature and voltage of the first thermistor NTC1 is the same as the correspondence between the temperature and voltage of the first position). The control chip 70 stores the correspondence between the temperature and voltage of the first position, meaning different temperatures correspond to different voltage values.

[0102] It should be noted here that the relationship between the temperature and voltage at the first location can be calculated based on the temperature of the first thermistor NTC1 before the electronic device leaves the factory. For example, according to the formula: V1=V0×(r NTC1 +r2) / (r1+r2+r NTC1 ), where V1 is the theoretical voltage value (unknown) at the first node N4, V0 is the fixed voltage value (known), and r NTC1The resistance value of the first thermistor NTC1 is represented by r2 (which can be determined based on the temperature of the first thermistor NTC1, as shown in Table 1), the resistance value of the identification resistor R2 is known, and the resistance value of the voltage divider resistor R1 is also known. The theoretical voltage value at the first node N4 can be determined. When the resistance value of the first thermistor NTC1 is different (i.e., the temperature is different), the theoretical voltage value at the first node N4 is different, thus obtaining the correspondence between temperature and voltage at the first location. This relationship is then stored in the control chip 70.

[0103] It should also be noted that, as mentioned above, the matching of the first PCB 40 and the second PCB 50 can be determined by the resistance of the identification resistor R2. Considering that the corresponding sub-boards differ when the electronic device is used in different regions, the resistance value of the identification resistor R2 will also change accordingly; that is, the resistance value of the identification resistor R2 is not unique. For example, when the electronic device is used domestically, the resistance value of the identification resistor R2 is a first preset resistance value, which can be 0KΩ (this is just an example and does not constitute a limitation of this application); when the electronic device is used overseas and located in a first overseas region, the resistance value of the identification resistor R2 is a second preset resistance value, which can be 100KΩ (this is just an example and does not constitute a limitation of this application); when the electronic device is used overseas and located in a second overseas region, the resistance value of the identification resistor R2 is a third preset resistance value, which can be 200KΩ (this is just an example and does not constitute a limitation of this application). In other words, the resistance value of the identification resistor R2 will change, and correspondingly, the correspondence between temperature and voltage at the first location obtained by the above formula also needs to include multiple sets. For example, when the resistance value of the identification resistor R2 is the first preset resistance value (e.g., 0KΩ), there is a corresponding temperature and voltage relationship for the first position, as shown in Table 2; when the resistance value of the identification resistor R2 is the second preset resistance value (e.g., 100KΩ), there is another corresponding temperature and voltage relationship for the first position, as shown in Table 3; and when the resistance value of the identification resistor R2 is the second preset resistance value (e.g., 200KΩ), there is yet another corresponding temperature and voltage relationship for the first position, as shown in Table 4. These three sets of temperature and voltage relationships for the first position are stored in the control chip 70.

[0104] Table 2 shows the correspondence between temperature and voltage at the first location.

[0105]

[0106]

[0107] Table 3 shows the correspondence between temperature and voltage at the first location.

[0108]

[0109]

[0110] Table 4 shows the correspondence between temperature and voltage at the first location.

[0111]

[0112]

[0113] The control chip 70 compares the actual voltage value at the first node N4 acquired by the ADC1 with the theoretical voltage value obtained by looking up the table. For example, if the actual voltage value at the first node N4 acquired by the ADC1 is equal to the voltage obtained by looking up the table (Table 2, Table 3 or Table 4), then the identification resistor R2 is determined to be the preset identification resistor. If the theoretical voltage value obtained by referring to Table 2 is equal to the actual voltage value at the first node N4 acquired by ADC1, then the resistance value of the identification resistor is considered to be 0KΩ, thus determining that the second PCB 50 matches the first PCB 40, and that the second PCB 50 is used as a sub-board in the domestic region; if the theoretical voltage value obtained by referring to Table 3 is equal to the actual voltage value at the first node N4 acquired by ADC1, then the resistance value of the identification resistor is considered to be 100KΩ, thus determining that the second PCB 50 matches the first PCB 40, and that the second PCB 50 is used as a sub-board in the first overseas region; if the theoretical voltage value obtained by referring to Table 4 is equal to the actual voltage value at the first node N4 acquired by ADC1, then the resistance value of the identification resistor is considered to be 200KΩ, thus determining that the second PCB 50 matches the first PCB 40, and that the second PCB 50 is used as a sub-board in the second overseas region.

[0114] Considering the inherent errors in voltage and / or resistance, the actual voltage value at the first node N4 acquired by ADC1 may not be exactly the same as the theoretical voltage value obtained by looking up a table. Therefore, in some embodiments, the control chip 70 can calculate the difference between the actual voltage value at the first node N4 acquired by ADC1 and the theoretical voltage value obtained by looking up a table, and determine whether the difference is within a preset range. If it is within the preset range, then the identification resistor R2 is determined to be the preset identification resistor. This further improves the detection accuracy and prevents misjudgments where, although the identification resistor R2 is the preset identification resistor, the actual voltage value at the first node N4 acquired by ADC1 is not equal to the theoretical voltage value obtained by looking up a table due to errors, leading to the conclusion that the identification resistor R2 is not the preset identification resistor.

[0115] The preset range can be determined by those skilled in the art based on practical experience. The preset range can be between -30mV and 30mV.

[0116] For example, if the resistance of the identification resistor R2 is 0KΩ and the temperature of the first thermistor NTC1 is 25℃, then by referring to Table 2, the theoretical voltage at the first node N4 is 0.9V. If the voltage acquired by ADC1 is between 0.87V and 0.93V, then the identification resistor R2 is determined to be the preset identification resistor, and thus the first PCB 40 and the second PCB 50 are determined to be matched; if the voltage acquired by ADC1 is not between 0.87V and 0.93V, then the identification resistor R2 is determined to be not the preset identification resistor, and thus the first PCB 40 and the second PCB 50 are determined to be mismatched.

[0117] The resistance of the identification resistor R2 is 100KΩ, and the temperature of the first thermistor NTC1 is 25℃. According to Table 3, the theoretical voltage at the first node N4 is 1.2V. If the voltage acquired by ADC1 is between 1.17V and 1.23V, then the identification resistor R2 is determined to be the preset identification resistor, thus confirming that the first PCB 40 and the second PCB 50 are matched. If the voltage acquired by ADC1 is not between 1.17V and 1.23V, then the identification resistor R2 is determined not to be the preset identification resistor, thus confirming that the first PCB 40 and the second PCB 50 are mismatched.

[0118] The resistance of the identification resistor R2 is 200KΩ, and the temperature of the first thermistor NTC1 is 25℃. According to Table 2, the theoretical voltage at the first node N4 is 1.35V. If the voltage acquired by ADC1 is between 1.32V and 1.38V, then the identification resistor R2 is determined to be the preset identification resistor, thus confirming that the first PCB 40 and the second PCB 50 are matched. If the voltage acquired by ADC1 is not between 1.32V and 1.38V, then the identification resistor R2 is determined not to be the preset identification resistor, thus confirming that the first PCB 40 and the second PCB 50 are mismatched.

[0119] Of course, the preset range can also be between -10mV and 10mV, etc.

[0120] The selection of the preset range can also be determined based on the actual error of the voltage and / or resistance. For example, the detection circuit provided in this application embodiment, in addition to the original circuit (i.e.... Figure 3Based on the detection circuit shown, the number of path resistors is increased from two (voltage divider resistor R1 and identification resistor R2) to three (voltage divider resistor R1, identification resistor R2, and first thermistor NTC1). Without considering the original circuit error, the accuracy error of a single resistor is typically 1%, meaning the error increases by approximately 1%. If both voltage and resistance have errors, calculations show that the maximum error of this path is 1.5%. For example, when the resistance value of identification resistor R2 is 100KΩ, the resistance value of identification resistor R2 may have an error; it may deviate upwards or downwards, meaning it may be less than 100KΩ (e.g., 99KΩ) or greater than 100KΩ (e.g., 101KΩ). Similarly, when the fixed voltage V0 is 1.8V, the fixed voltage V0 may have an error; it may deviate upwards or downwards, meaning it may be less than 1.8V (e.g., 1.782KΩ) or greater than 1.8V (e.g., 1.818KΩ).

[0121] Based on this, according to the voltage formula at the first node N1: V1=V0×(r NTC1 +r2) / (r1+r2+r NTC1 Substituting the maximum and minimum values ​​of V0, and the maximum and minimum values ​​of the resistances of each resistor, into this formula, the theoretical voltage value at the first node N4 can be adjusted upwards (i.e., increased accuracy deviation) and downwards (i.e., decreased accuracy deviation) from the original values ​​(i.e., Tables 2, 3, and 4). The increased and decreased values ​​constitute the preset range. See Tables 5 and 6 for details. Table 5 shows the accuracy deviation analysis when the resistance of resistor R2 is 0KΩ; Table 6 shows the accuracy deviation analysis when the resistance of resistor R2 is 100KΩ. Similarly, when the resistance of resistor R2 is 200KΩ, the corresponding upper and lower accuracy deviations can also be determined using this method, which will not be listed here. To more clearly display the accuracy deviation values, Table 6 does not show the Kelvin, NTC1 resistance values, and voltage divider resistor R1 values ​​compared to Table 5. However, the Kelvin, NTC1 resistance values, and voltage divider resistor R1 values ​​in Table 6 correspond one-to-one with those in Table 5. Tables 5 and 6 can be set separately or combined into one table. This application embodiment uses Tables 5 and 6 set separately as an example for illustration.

[0122] Table 5 Accuracy Analysis Table

[0123]

[0124]

[0125] Table 6 Voltage Accuracy Analysis Table

[0126]

[0127]

[0128] The second scenario involves a significant distance between the positions of NTC1 and NTC2. For example, the distance between the positions of NTC1 (the first position) and NTC2 (the second position) is greater than a second preset distance, which can be 3mm. Exemplarily, the distance between NTC1 and NTC2 can be 3.5mm, 4mm, 4.5mm, 5mm, 5.5mm, or 6mm. Since the distance between NTC1 and NTC2 is large, a linear relationship exists between the temperatures at NTC1 and NTC2. This correspondence can be determined using a fitting method, meaning each temperature at NTC2 corresponds to a temperature at NTC1, and this correspondence is stored in the control chip 70. Thus, once the temperature at NTC2 is known, the temperature at NTC1 can be determined by looking up a table.

[0129] Specifically, ADC2 is used to acquire the voltage at the second node N2 in real time or at a preset frequency, and the voltage acquired by ADC2 is the actual voltage value at the second node N2. ADC1 is used to acquire the voltage at the first node N4 in real time or at a preset frequency, and the voltage acquired by ADC1 is the actual voltage value at the first node N4.

[0130] When the voltage at the second node N2 is known, according to the formula: V2=V0×r NTC2 / (r3+r NTC2 ), where V2 represents the voltage at the second node N2, V0 is a fixed voltage value (known), and r NTC2 The resistance value of the second thermistor (unknown) is represented by r1, and the resistance value of the voltage divider resistor R3 (known) is represented by r2. The resistance value r of the second thermistor NTC2 can then be determined. NTC2 .

[0131] When the resistance value of the second thermistor NTC2 is r NTC2 Once determined, the temperature of the second thermistor NTC2 can be determined based on the correspondence between its temperature and resistance value. The control chip 70 stores this temperature-resistance correspondence, meaning different temperatures correspond to different resistance values.

[0132] The relationship between temperature and resistance is determined in the same way as in the first case, which can be found in the description in the first case, and will not be repeated here.

[0133] After obtaining the temperature of the second thermistor NTC2 from the table, the current temperature of the first thermistor NTC1 can be obtained by looking up the table again (a table showing the correspondence between the temperatures at the positions of NTC1 and NTC2).

[0134] After determining the current temperature of the first thermistor NTC1, the theoretical voltage value at the first node N4 corresponding to the current temperature of the first thermistor NTC1 is determined based on the correspondence between the temperature and voltage of the first thermistor NTC1. The specific process is basically the same as the first case, and can be found in the description of the first case, which will not be repeated here.

[0135] In summary, two detection modules can be used to detect the ambient temperature of the second PCB 50, the temperature at the USB interface 90 on the second PCB 50, and the compatibility between the first PCB 40 and the second PCB 50. This reduces the number of detection modules, and consequently, the number of traces on the second PCB 50, the first PCB 40, and the FPC 60 can be reduced. Furthermore, the number of communication pins on the first BTB connector 61 and the second BTB connector 62 can be reduced. This is beneficial for the arrangement of other structures within the electronic device, and / or for the miniaturization design of the electronic device. Additionally, it significantly reduces the likelihood of BTB connectors warping or detaching.

[0136] This application also provides a matching detection method, which can be applied, for example, to the detection circuit in this embodiment, and has the same beneficial effects. Details not described in detail in this embodiment can be found in the embodiments of the detection circuit described above. The following is in conjunction with... Figure 4 The detection circuit shown illustrates the matching temperature detection method.

[0137] like Figure 5 As shown, the matching detection method can be implemented through the following steps:

[0138] S101, the control chip 70 detects a matching command used to determine whether the identification resistor R2 is a preset identification resistor.

[0139] The matching instructions can include input instructions, power-on instructions when the electronic device is turned on, maintenance instructions during repair, and test instructions that require matching tests between two circuit boards before leaving the factory.

[0140] The input matching command can be understood as follows: when the user or maintenance personnel input a series of numbers, codes or commands through the display panel 10, and the control chip 70 detects the numbers, codes or commands, the matching test begins.

[0141] The power-on command when an electronic device is powered on can be understood as follows: when electronic device 100 is powered on, and control chip 70 detects that electronic device 100 has changed from a power-off state to a power-on state, it begins to perform matching detection.

[0142] The test instruction that requires matching tests on two circuit boards before leaving the factory can be understood as follows: During the early testing and verification process before the electronic device leaves the factory, the tester will insert a test device into the electronic device. When the control chip 70 detects the test device, it will automatically perform matching tests.

[0143] S102. Based on the matching instruction, the control chip 70 acquires the actual voltage value acquired by ADC1 and the actual voltage value acquired by ADC2.

[0144] ADC1 collects the actual voltage value at the first node N4 in real time or at a preset frequency, and sends the collected actual voltage value to the control chip 70.

[0145] ADC2 collects the actual voltage value at the second node N2 in real time or at a preset frequency, and sends the collected actual voltage value to the control chip 70.

[0146] S103, the control chip 70, based on the actual voltage value acquired by ADC2 and the formula V2=V0×r NTC2 / (r3+r NTC2 Determine the resistance value of the second thermistor NTC2.

[0147] When the voltage at the second node N2 (i.e., the actual voltage value acquired by ADC2) is known, according to the formula: V2 = V0 × r NTC2 / (r3+r NTC2 ), where V2 represents the voltage at the second node N2, V0 is a fixed voltage value (known), and r NTC2 The resistance value of the second thermistor (unknown) is represented by r1, and the resistance value of the voltage divider resistor R3 (known) is represented by r2. The resistance value r of the second thermistor NTC2 can then be determined. NTC2 .

[0148] S104, the control chip 70 determines the current temperature of the second thermistor NTC2 based on the resistance value of the second thermistor NTC2 and the corresponding relationship between the temperature and resistance value of the second thermistor NTC2.

[0149] The control chip 70 stores the relationship between the temperature and resistance value of the second thermistor NTC2, that is, different temperatures correspond to different resistance values.

[0150] The relationship between the temperature and resistance of the second thermistor NTC2 can be established before the electronic device leaves the factory, based on the parameters of the second thermistor NTC2 and the formula R. 求=R0exp(B(1 / T1-1 / T0)) is calculated, where T0 represents the Kelvin corresponding to the typical temperature, T1 represents the Kelvin corresponding to the desired temperature, B represents a constant, R0 represents the resistance value corresponding to the typical temperature, and R 求 The resistance value corresponding to the desired temperature is given. Since the Kelvin corresponding to the typical temperature, the Kelvin corresponding to the desired temperature, B, and the resistance value corresponding to the typical temperature are known, the resistance value corresponding to the desired temperature can be determined, and thus the relationship between the temperature and resistance value of the second thermistor NTC2 can be obtained, as shown in Table 1 above. This relationship is then stored in the control chip 70.

[0151] Here, the control chip 70 can not only determine whether the first PCB 40 and the second PCB 50 are matched based on the current temperature of the second thermistor NTC2 (i.e., in subsequent steps), but also compare the current temperature of the second thermistor NTC2 (i.e., the temperature at the USB interface 90) with a temperature threshold (which may cause damage or burnout to the USB interface 90). When the temperature at the USB interface 90 exceeds the temperature threshold, the control chip 70 can take measures such as stopping charging or reducing the charging power to reduce the temperature at the USB interface 90.

[0152] S105, the control chip 70 determines the current temperature of the first thermistor NTC1 based on the current temperature of the second thermistor NTC2 and the correspondence between the temperatures of the second thermistor NTC2 and the first thermistor NTC1.

[0153] Specifically, when the positions of the first thermistor NTC1 and the second thermistor NTC2 are very close—for example, when the distance between the positions of the first thermistor NTC1 and the second thermistor NTC2 is less than or equal to a second preset distance (the second preset distance can be 3mm, etc.)—the temperature of the second thermistor NTC2 corresponds to the temperature of the first thermistor NTC1. For instance, when the temperature of the second thermistor NTC2 is 25℃, the temperature of the first thermistor NTC1 is 25℃; when the temperature of the second thermistor NTC2 is 26℃, the temperature of the first thermistor NTC1 is 26℃; and when the temperature of the second thermistor NTC2 is 35℃, the temperature of the first thermistor NTC1 is 35℃.

[0154] When the positions of the first thermistor NTC1 and the second thermistor NTC2 are far apart, for example, the distance between the positions of the first thermistor NTC1 and the second thermistor NTC2 is greater than a second preset distance (the second preset distance can be 3mm, etc.), the correspondence between the temperatures of the second thermistor NTC2 and the first thermistor NTC1 can be determined by a fitting method. That is, before the electronic device leaves the factory, multiple sets of temperatures of the second thermistor NTC2 and the first thermistor NTC1 are measured. These multiple sets of temperatures of the second thermistor NTC2 and the first thermistor NTC1 are then fitted to obtain a fitting relationship. Using this fitting relationship, when different temperatures of the second thermistor NTC2 are input, different temperatures of the first thermistor NTC1 can be obtained, thus revealing the correspondence between the temperatures of the second thermistor NTC2 and the first thermistor NTC1.

[0155] The control chip 70 stores the correspondence between the temperatures of the second thermistor NTC2 and the first thermistor NTC1. Therefore, when the current temperature of the second thermistor NTC2 is known, the current temperature of the first thermistor NTC1 can be determined by looking up the table.

[0156] Here, the control chip 70 can not only determine whether the first PCB 40 and the second PCB 50 are matched based on the current temperature of the first thermistor NTC1 (i.e., in subsequent steps), but also compare the current temperature of the first thermistor NTC1 (i.e., the ambient temperature of the second PCB 50) with a temperature threshold (which may cause damage to components on the second PCB 50). When the temperature of the second PCB 50 exceeds the temperature threshold, the control chip 70 can reduce the operating speed of the speaker 80 and / or the display panel 10, etc., to reduce the temperature of the second PCB 50.

[0157] S106, the control chip 70 determines the theoretical voltage value at the first node N4 corresponding to the current temperature of the first thermistor NTC1 based on the current temperature of the first thermistor NTC1 and the correspondence between the temperature and voltage (voltage at the first node N4) of the first thermistor NTC1.

[0158] The relationship between the temperature and voltage of the first thermistor NTC1 can be calculated based on the temperature of the first thermistor NTC1 before the electronic device leaves the factory. Specifically, according to the formula: V1=V0×(r NTC1 +r2) / (r1+r2+r NTC1 ), where V1 is the theoretical voltage value (unknown) at the first node N4, V0 is the fixed voltage value (known), and r NTC1The resistance value of the first thermistor NTC1 is represented by r2 (which can be determined based on the temperature of the first thermistor NTC1, as shown in Table 1), the resistance value of the identification resistor R2 is known, and the resistance value of the voltage divider resistor R1 is also known. The theoretical voltage value at the first node N4 can be determined. When the resistance value of the first thermistor NTC1 is different (i.e., the temperature is different), the theoretical voltage value at the first node N4 is different, thus obtaining the correspondence between the temperature and voltage of the first thermistor NTC1, and then storing this relationship in the control chip 70.

[0159] It should be noted that when the electronic device is used in different regions, its corresponding sub-board will also be different, and correspondingly, the resistance value of the identification resistor R2 will also change accordingly; that is, the resistance value of the identification resistor R2 is not unique. For example, when the electronic device is used domestically, the resistance value of the identification resistor R2 is a first preset resistance value, which can be 0KΩ; when the electronic device is used overseas, and located in the first overseas region, the resistance value of the identification resistor R2 is a second preset resistance value, which can be 100KΩ; when the electronic device is used overseas, and located in the second overseas region, the resistance value of the identification resistor R2 is a third preset resistance value, and the second preset resistance value can be 200KΩ. In other words, the resistance value of the identification resistor R2 will change, and accordingly, the temperature and voltage correspondence of the first thermistor NTC1 obtained by the above formula also needs to include multiple sets. For example, when the resistance of the identification resistor R2 is the first preset resistance value (e.g., 0KΩ), the corresponding temperature and voltage relationship of the first thermistor NTC1 is shown in Table 2; when the resistance of the identification resistor R2 is the second preset resistance value (e.g., 100KΩ), the corresponding temperature and voltage relationship of the first thermistor NTC1 is shown in Table 3; when the resistance of the identification resistor R2 is the second preset resistance value (e.g., 200KΩ), the corresponding temperature and voltage relationship of the first thermistor NTC1 is shown in Table 4. The three sets of temperature and voltage relationships of the first thermistor NTC1 are stored in the control chip 70.

[0160] When the current temperature of the first thermistor NTC1 is known, the theoretical voltage value at the first node N4 can be determined by referring to Table 2, Table 3 or Table 4.

[0161] S107. Determine whether the difference between the actual voltage value and the theoretical voltage value acquired by ADC1 at the first node N4 is within the preset range. If yes, determine that the first PCB 40 and the second PCB 50 are matched; if no, determine that the first PCB 40 and the second PCB 50 are not matched.

[0162] If the difference between the actual voltage value and the theoretical voltage value at the first node N4 acquired by ADC1 is within a preset range, it indicates that the resistance value of the identification resistor R2 is the expected resistance value. This is because the theoretical voltage value at the first node N4 is determined based on the resistance value of the identification resistor R2 (such as 0, 100, and 200KΩ). Therefore, when the difference between the actual voltage value and the theoretical voltage value at the first node N4 is within the preset range, it indicates that the resistance value of the identification resistor R2 is 0, 100, or 200KΩ.

[0163] The specific value of the preset range can be obtained from experience or determined based on error analysis.

[0164] When determined based on error analysis, the voltage formula at the first node N1 can be used: V1=V0×(r NTC1 +r2) / (r1+r2+r NTC1 The maximum and minimum values ​​of V1 are determined by considering the voltage value V0 in the formula (including upper and lower deviations) and the deviations of each resistor (including upper and lower deviations). Furthermore, based on the voltage formula at the first node N1: V1 = V0 × (r... NTC1 +r2) / (r1+r2+r NTC1 The theoretical voltage value of V1 is determined by taking the theoretical voltage value of V0 in the formula and the theoretical resistance value of each resistor. The preset range is obtained by subtracting the theoretical voltage value of V1 from the maximum value of V1 and subtracting the theoretical voltage value of V1 from the minimum value of V1.

[0165] It should be noted that the embodiments of this application use the first thermistor NTC1 to detect the ambient temperature of the second PCB 50 and the second thermistor NTC2 to detect the temperature at the USB interface 90 on the second PCB 50 as examples for illustration. However, this does not constitute a limitation of this application. The first thermistor NTC1 can also detect the temperature of other devices or locations on the second PCB 50, and the second thermistor NTC2 can also detect the temperature of other devices or locations on the second PCB 50.

[0166] This application also provides a chip, which includes a processor and a memory. The memory is used to store a computer program, and the processor is used to run the computer program so that the electronic device in which the chip is located can implement the above-described matching detection method.

[0167] Optionally, the chip further includes a memory connected to the processor via a circuit or wire, the processor being used to read and execute computer programs stored in the memory. Further optionally, the chip includes a communication interface to which the processor is connected. The communication interface is used to receive data and / or information that needs to be processed, the processor obtaining the data and / or information from the communication interface and processing the data and / or information. The communication interface can be an input / output interface.

[0168] The memory can be read-only memory (ROM), other types of static storage devices that can store static information and instructions, random access memory (RAM), or other types of dynamic storage devices that can store information and instructions. It can also be electrically erasable programmable read-only memory (EEPROM), compact disc read-only memory (CD-ROM) or other optical disc storage, optical disc storage (including compressed optical discs, laser discs, optical discs, digital universal optical discs, Blu-ray discs, etc.), magnetic disk storage media, or other magnetic storage devices. Alternatively, it can be any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer.

[0169] For example, in the embodiments of this application, the memory can store the various correspondences in the above contents, such as the correspondence between temperature and resistance, the correspondence between the temperature of the first position and the temperature of the second position, and / or the correspondence between the temperature of the first position and the voltage, etc.

[0170] This application also provides a chip system, which includes a processor and a memory. The memory is used to store a computer program, and the processor is used to run the computer program so that the electronic device in which the chip system is located implements the above-described matching detection method.

[0171] This application also provides a computer-readable storage medium storing instructions that, when executed on an electronic device, cause the electronic device to perform the matching detection method of this application.

[0172] This application also provides a computer program product containing instructions that, when run on a computer or any at least one processor, cause the computer to execute the matching detection method of this application.

[0173] The electronic devices, computer storage media, or computer program products provided in the embodiments of this application are all used to execute the corresponding methods provided above. Therefore, the beneficial effects they can achieve can be referred to the beneficial effects in the corresponding methods provided above, and will not be repeated here.

[0174] Through the above description of the embodiments, those skilled in the art will understand that, for the sake of convenience and brevity, only the division of the above functional modules is used as an example. In actual applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above.

[0175] Any content in the various embodiments of this application, as well as any content in the same embodiment, can be freely combined. Any combination of the above content is within the scope of this application.

[0176] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. An electronic device, characterized in that, include: Control chip, first detection module, and second detection module; The first detection module includes a first temperature detection unit and an identification unit, and the second detection module includes a second temperature detection unit; the first temperature detection unit is located at a first position of the electronic device, and the second temperature detection unit is located at a second position of the electronic device; The first temperature detection unit is used to detect the temperature at the first location and output a first actual voltage value; The second temperature detection unit is used to detect the temperature at the second location and output a second actual voltage value; The control chip is used to determine whether the identification unit is a preset identification unit based on the second actual voltage value; Determining whether the identification unit is a preset identification unit based on the second actual voltage value includes: The current temperature at the second location is determined based on the second actual voltage value; Based on the current temperature at the second position and the correspondence between the temperatures at the first and second positions, the current temperature at the first position is determined. Based on the correspondence between temperature and voltage at the first location, determine the theoretical voltage value corresponding to the current temperature at the first location; The identification unit is determined as a preset identification unit based on the first actual voltage value and the theoretical voltage value.

2. The electronic device according to claim 1, characterized in that, Determining the current temperature at the second location based on the second actual voltage value includes: The current resistance value of the second temperature detection unit is determined based on the second actual voltage value; Based on the correspondence between temperature and resistance, the current temperature of the second position corresponding to the current resistance value of the second temperature detection unit is determined.

3. The electronic device according to claim 1 or 2, characterized in that, The first temperature detection unit includes a first voltage divider unit and a first thermistor; the second temperature detection unit includes a second voltage divider unit and a second thermistor. The first terminal of the first voltage divider unit is used to receive a first fixed voltage. The second terminal of the first voltage divider unit is coupled to the first terminal of the first thermistor at a first node. The second terminal of the first thermistor is electrically connected to the first terminal of the identification unit. The second terminal of the identification unit is grounded. The first end of the second voltage divider unit is used to receive the second fixed voltage, the second end of the second voltage divider unit is coupled to the first end of the second thermistor at the second node, and the second end of the first thermistor is grounded; The first thermistor detects the temperature at the first position and outputs the first actual voltage value through the first node according to the first fixed voltage; The second thermistor detects the temperature at the second location and outputs the second actual voltage value through the second node according to the second fixed voltage.

4. The electronic device according to claim 3, characterized in that, The electronic device also includes a first circuit board, a second circuit board, and a connection structure; The first circuit board and the second circuit board are spaced apart, one end of the connecting structure is electrically connected to the first circuit board, and the second end of the connecting structure is electrically connected to the second circuit board; The first voltage divider unit and the second voltage divider unit are located on the first circuit board, and the first thermistor, the second thermistor and the identification unit are located on the second circuit board; The first end of the first thermistor is coupled to the second end of the first voltage divider unit at the first node through the second circuit board, the connection structure, and the first circuit board; The first end of the second thermistor is coupled to the second node via the second circuit board, the connection structure, and the first circuit board to the second end of the second voltage divider unit.

5. The electronic device according to claim 4, characterized in that, Determining whether the identification unit is a preset identification unit based on the first actual voltage value and the theoretical voltage value includes: The difference between the first actual voltage value and the theoretical voltage value is determined based on the first actual voltage value and the theoretical voltage value. If the difference between the first actual voltage value and the theoretical voltage value is within a preset difference, then the identification unit is determined to be a preset identification unit, so as to determine that the first circuit board and the second circuit board are matched.

6. The electronic device according to claim 4 or 5, characterized in that, The electronic device also includes a USB interface located on the second circuit board, and the USB interface is located at the second position.

7. The electronic device according to any one of claims 4-6, characterized in that, The first position is the center position of the second circuit board, or the distance between the first position and the position where the functional device is set in the second circuit board is greater than a first preset distance.

8. The electronic device according to claim 3, characterized in that, The electronic device further includes a first voltage acquisition unit and a second voltage acquisition unit; The first voltage acquisition unit is used to acquire the first actual voltage value output by the first node and send the first actual voltage value to the control chip; The second voltage acquisition unit is used to acquire the second actual voltage value output by the second node and send the second actual voltage value to the control chip.

9. The electronic device according to claim 8, characterized in that, The first voltage acquisition unit and the second voltage acquisition unit are integrated into the control chip.

10. The electronic device according to claim 3, characterized in that, The first fixed voltage and the second fixed voltage are the same; The electronic device further includes a fixed power supply for outputting the first fixed voltage; the first terminal of the first voltage divider unit and the first terminal of the second voltage divider unit are both electrically connected to the fixed power supply to receive the first fixed voltage output by the fixed power supply.

11. The electronic device according to claim 4, characterized in that, The connection structure includes a flexible circuit board.

12. The electronic device according to claim 11, characterized in that, One end of the flexible circuit board is electrically connected to the first circuit board via a first connector, and the other end of the flexible circuit board is electrically connected to the second circuit board via a second connector.

13. The electronic device according to any one of claims 1-12, characterized in that, The control chip stores the correspondence between the temperature at the first position and the temperature at the second position, and / or the correspondence between the temperature and voltage at the first position.

14. The electronic device according to any one of claims 1-11, characterized in that, The distance between the first position and the second position is less than or equal to a second preset distance; Based on the correspondence between the temperatures at the first and second locations, determine the current temperature at the first location corresponding to the current temperature at the second location, including: The current temperature at the second location is determined to be the current temperature at the first location.

15. A matching detection method, characterized in that, Applied to an electronic device as described in any one of claims 1-14, the method comprises: Collect the first and second actual voltage values; The current temperature at the second location is determined based on the second actual voltage value; Based on the current temperature at the second position and the correspondence between the temperatures at the first and second positions, the current temperature at the first position is determined. Based on the correspondence between temperature and voltage at the first location, determine the theoretical voltage value corresponding to the current temperature at the first location; The identification unit is determined as a preset identification unit based on the first actual voltage value and the theoretical voltage value.

16. The matching detection method according to claim 15, characterized in that, Determining the current temperature at the second location based on the second actual voltage value includes: The current resistance value of the second temperature detection unit is determined based on the second actual voltage value; Based on the correspondence between temperature and resistance, the current temperature of the second position corresponding to the current resistance value of the second temperature detection unit is determined.

17. The matching detection method according to claim 16, characterized in that, Collect the first and second actual voltage values, including: A matching instruction for determining whether the identification unit is a preset identification unit is detected; Based on the matching instruction, the first actual voltage value and the second actual voltage value are collected.

18. A chip, characterized in that, include: Processor and memory, the memory being used to store computer programs; The processor is used to run the computer program to enable the electronic device in which the chip is located to implement the matching detection method as described in any one of claims 15-17.

19. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when run on an electronic device, causes the electronic device to perform the matching detection method as described in any one of claims 15-17.

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