Third order pressure feedback mechanism for chip testing

Abstract

The application provides a third-order pressure feedback mechanism, which can provide appropriate force for the suction nozzle to contact the chip when the suction nozzle takes and places the chip, so that the chip is subjected to appropriate force, and the chip is conveniently sucked and placed on the carrier tape by the suction nozzle, and the chip is not subjected to excessive force to deviate from the carrier tape, and the force applied to the chip by the suction nozzle can be further increased when the chip is tested, so that the chip is firmly fixed on the test table of the chip testing mechanism, and the chip testing is ensured to be normal.

Description

Technical Field

[0001] This invention relates to a third-order pressure feedback mechanism for chip testing. Background Technology

[0002] Currently, there is usually no pressure feedback mechanism in the chip testing process. When the nozzle contacts the chip, the lack of pressure feedback will result in inaccurate downward pressure. If the pressure is too small, the chip will not be easily picked up by the nozzle or the downward pressure of the nozzle on the chip will be insufficient during chip testing. If the pressure is too large, the chip will be subjected to excessive force during chip picking and placing and will deviate from the carrier tape, thus causing abnormalities in chip picking and placing and chip testing. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a third-order pressure feedback mechanism for chip testing, which can provide a suitable force for the nozzle to contact the chip, so that the chip is subjected to a suitable force, thereby facilitating the nozzle to pick up and put down the chip and test the chip.

[0004] The present invention is implemented as follows: a third-order pressure feedback mechanism for chip testing includes a horizontally arranged mounting plate, a motor fixedly mounted on the mounting plate, the motor shaft being coaxial with and fixedly connected to a lead screw, the lead screw being threadedly connected to a lead nut, the lead nut being fixedly connected to a horizontally arranged pressure plate, and a vertically arranged bolt slidably connected to each of the four corners of the pressure plate, with a compression spring sleeved on each bolt, and the lower ends of the four bolts being fixedly connected to a first movable plate. The upper end of the first movable plate has a groove, and four threaded holes are provided at the four corners of the bottom of the groove. The four bolts are respectively threaded into the four threaded holes. A large circular hole is provided in the middle of the bottom of the groove, and the lead screw passes through the large circular hole. The upper end of the compression spring abuts against the lower surface of the pressure plate, and the lower end of the compression spring abuts against the bottom of the groove. A vertically arranged first light-blocking column is also fixed on the pressure plate. A vertically arranged first detection hole is opened on the upper front of the first movable plate, which allows the first light-blocking column to pass through. A first photoelectric detection switch is fixed in the first detection hole. The mounting plate is also fixedly connected to a vertically arranged back plate and two vertically arranged baffles. The two baffles are parallel and spaced apart. The back plate is located between the two baffles and is fixedly connected to the two baffles perpendicularly. The front of the back plate is fixed with two vertical and spaced first sliding grooves, and the back of the first movable plate is fixed with two vertical and spaced sliding rails, the upper part of which slides in the first sliding grooves. The back of the first movable plate is also slidably connected to a vertically arranged second movable plate. The front of the second movable plate is fixed with two vertically spaced second sliding grooves, and the lower part of the slide rail is slidably disposed in the second sliding grooves. A vertically arranged second light-blocking column is fixedly provided on the top of the second movable plate, and a vertically arranged second detection hole is provided on the lower part of the back of the first movable plate, which allows the second light-blocking column to pass through. A second photoelectric detection switch is fixedly provided in the second detection hole. A horizontally arranged baffle is fixedly provided in the lower middle part of the second movable plate. The baffle is spaced apart from the bottom of the first movable plate. A suction nozzle mounting plate is fixedly connected to the bottom of the second movable plate. A plurality of suction nozzles for picking up and putting down chips are fixedly provided on the suction nozzle mounting plate.

[0005] The three-stage pressure feedback mechanism of this invention can provide appropriate force for the nozzle to contact the chip when picking up and placing the chip and testing the chip. This ensures that the chip is subjected to appropriate force, making it easy for the nozzle to pick up and place the chip on the carrier tape. It prevents the chip from being subjected to excessive force and deviating from the carrier tape. During chip testing, it can further increase the force applied to the chip by the nozzle, thereby firmly fixing the chip on the test stage of the chip testing mechanism and ensuring that no abnormalities occur during chip testing. Attached Figure Description

[0006] Figure 1 This is a three-dimensional assembly diagram of a third-order pressure feedback mechanism for chip testing provided in an embodiment of the present invention; Figure 2 This is an exploded view of a third-order pressure feedback mechanism for chip testing provided in an embodiment of the present invention; Figure 3 This is an exploded view of another perspective of the third-order pressure feedback mechanism for chip testing provided in an embodiment of the present invention. Detailed Implementation

[0007] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0008] like Figures 1-3 As shown in the figure, the third-order pressure feedback mechanism for chip testing provided by the present invention includes a horizontally arranged mounting plate 1, a motor 11 fixedly mounted on the mounting plate 1, the rotating shaft (not shown) of the motor 11 being coaxial with and fixedly connected to a lead screw 12, the lead screw 12 being threadedly connected to a lead screw nut 13, the lead screw nut 13 being fixedly connected to a horizontally arranged pressure plate 14, and a vertically arranged bolt 15 being slidably connected to each of the four corners of the pressure plate 14, a compression spring (not shown) being sleeved on the bolt 15, and the lower ends of the four bolts 15 being fixedly connected to a first movable plate 2; The upper end of the first movable plate 2 has a groove 21. Four threaded holes 22 are provided at the four corners of the bottom of the groove 21. Four bolts 15 are threadedly connected to the four threaded holes 22 respectively. A large round hole 23 is provided in the middle of the bottom of the groove 21. The lead screw 12 passes through the large round hole 23. The upper end of the compression spring sleeved on the bolt 15 abuts against the lower surface of the pressure plate 14, and the lower end of the compression spring sleeved on the bolt 15 abuts against the bottom of the groove 21. A vertically arranged first light-blocking column 16 is also fixed on the pressure plate 14. A vertically arranged first detection hole 24 is opened on the upper part of the front of the first movable plate 2, which can accommodate the first light-blocking column 16 to pass through. A first photoelectric detection switch 25 is fixed in the first detection hole 24. Mounting plate 1 is also fixedly connected to a vertically set back plate 3 and two vertically set baffles 4. The two baffles 4 are parallel and spaced apart. The back plate 3 is located between the two baffles 4 and is fixedly connected to the two baffles 4 perpendicularly. The front of the back plate 3 is fixed with two vertical and spaced first sliding grooves 31, and the back of the first movable plate 2 is fixed with two vertical and spaced sliding rails 26. The upper part of the sliding rails 26 slides in the first sliding grooves 31, thereby realizing the sliding connection between the first movable plate 2 and the back plate 3. The back of the first movable plate 2 is also slidably connected to a vertically arranged second movable plate 5. The front of the second movable plate 5 is fixed with two vertically arranged and spaced second slide grooves 51, and the lower part of the slide rail 26 is slidably disposed in the second slide grooves 51. A vertically arranged second light-blocking column 52 is fixedly installed on the top of the second movable plate 5. A vertically arranged second detection hole 27 is opened on the lower part of the back of the first movable plate 2, which can accommodate the second light-blocking column 52. A second photoelectric detection switch 28 is fixedly installed in the second detection hole 27. A horizontally arranged baffle 53 is fixedly provided in the lower middle part of the second movable plate 5. The baffle 53 is spaced apart from the bottom of the first movable plate 2. A suction nozzle mounting plate 54 is fixedly connected to the bottom of the second movable plate 5. Several suction nozzles 55 for picking up and putting down chips are fixedly provided on the suction nozzle mounting plate 54.

[0009] The working principle of the third-order pressure feedback mechanism for chip testing provided in this embodiment of the invention is as follows: (1) First, the third-order pressure feedback mechanism of the present invention is sent to the set position above the chip carrier using a robotic arm (not shown); then, the controller (not shown) starts the motor 11 to rotate forward, the motor 11 drives the lead screw 12 to rotate forward in the original position, the lead screw 12 drives the lead screw nut 13 and the pressure plate 14 to move downward together, the compression spring sleeved on the bolt 15 is compressed, the elastic force generated by the compression of the compression spring drives the first movable plate 2 and the second movable plate 5 to move downward together, when the suction nozzle 55 on the suction nozzle mounting plate 54 contacts the chip, the chip generates an upward reaction force on the suction nozzle 55, the reaction force causes the second movable plate 5 to stop moving, at this time, the first movable plate 2 continues to move downward under the elastic force generated by the compression of the compression spring, when the bottom of the first movable plate 2 moves to the stop bar 53 of the second movable plate 5 and the bottom of the first movable plate 2 abuts against the stop bar 53, the second photoelectric detection switch 28 in the second detection hole 27 moves to the second light column 52, the second photoelectric detection switch 28 ... The light beam emitted by switch 28 is blocked by the second light column 52. The second photoelectric detection switch 28 sends a signal that the light beam is blocked to the controller. After receiving the signal, the controller shuts off motor 11. At this time, the suction nozzle 55 contacts the chip with appropriate force, so that the chip is subjected to appropriate force, making it easy for the chip on the carrier tape to be picked up by the suction nozzle 55. Then, the controller starts the vacuum pump (not shown) to evacuate the suction nozzle 55, so that the suction nozzle 55 firmly holds the chip. Next, the controller starts the motor 11 to reverse. The motor 11 drives the lead screw 12 to rotate and reverse in the original position. The lead screw 12 drives the lead screw nut 13 and the pressure plate 14 to move upward together to the initial position. After that, the controller shuts off motor 11. Finally, the robot arm sends the third-order pressure feedback mechanism of the present invention to the chip testing mechanism (not shown). Under the gravity of the second movable plate 5 and the suction nozzle 55, the second movable plate 5 drives the second light column 52 to move downward in the second detection hole 27. The second light column 52 moves away from the second photoelectric detection switch 28. (2) When the robotic arm sends the third-order pressure feedback mechanism of the present invention above the chip testing mechanism (not shown), the controller starts the motor 11 to rotate forward. The motor 11 drives the lead screw 12 to rotate forward in its original position. The lead screw 12 drives the lead screw nut 13 and the pressure plate 14 to move downward together. The compression spring sleeved on the bolt 15 is compressed. The elastic force generated by the compression of the compression spring drives the first movable plate 2 and the second movable plate 5 to move downward together. When the chip on the suction nozzle 55 contacts the detection stage of the chip detection device, the chip generates an upward reaction force on the suction nozzle 55. This reaction force causes the second movable plate 5 to stop moving. At this time, the first movable plate 2 continues to move downward under the elastic force generated by the compression of the compression spring. When the bottom of the first movable plate 2 moves to the stop bar 53 of the second movable plate 5 and the bottom of the first movable plate 2 abuts against the stop bar 53, the second photoelectric detection switch 28 in the second detection hole 27 moves to the second light blocking column 52. The light beam emitted by the second photoelectric detection switch 28 is blocked by the second light blocking column 52. When the beam is blocked by the column 52, the second photoelectric detection switch 28 sends a signal that the beam is blocked to the controller. After receiving the signal, the controller controls the motor 11 to continue rotating forward. The lead screw 12 drives the lead screw nut 13 and the pressure plate 14 to continue moving downward. The compression spring sleeved on the bolt 15 is further compressed. The elastic force generated by the compression of the spring is applied to the first movable plate 2 and the second movable plate 5. The suction nozzle 55 on the second movable plate 5 further presses the chip onto the detection stage of the chip detection device. At the same time, the pressure plate 14 drives the first beam blocking column 16 to move downward in the first detection hole 24. When the first beam blocking column 16 moves to the first photoelectric detection switch 25 in the first detection hole 24, the beam emitted by the first photoelectric detection switch 25 is blocked by the first beam blocking column 16. The first photoelectric detection switch 25 sends a signal that the beam is blocked to the controller. After receiving the signal, the controller shuts off the motor 11. At this time, the chip is firmly fixed on the detection stage of the chip detection device, and the chip testing mechanism can test the chip. (3) After the chip testing mechanism completes the chip testing, the controller starts the motor 11 to reverse, the motor 11 drives the lead screw 12 to rotate in reverse at the original position, the lead screw 12 drives the lead screw nut 13 and the pressure plate 14 to move upward together to the initial position, the controller turns off the motor 11, at the same time, the pressure plate 14 carries the first light column 16 to move upward in the first detection hole 24, the first light column 16 moves away from the first photoelectric detection switch 25; then, under the gravity of the second movable plate 5 and the suction nozzle 55, the second light column 52 moves downward in the second detection hole 27, the second movable plate 5 drives the second light column 52 to move away from the second photoelectric detection switch 28; then, the robot arm sends the third-order pressure feedback mechanism of the present invention to the top of the carrier belt, the controller starts the motor 11 to rotate forward, the motor 11 drives the lead screw 12 to rotate forward at the original position, the lead screw 12 drives the lead screw nut 13 and the pressure plate 14 to move downward together, the compression spring sleeved on the bolt 15 is compressed, the compression spring The compressed elastic force drives the first movable plate 2 and the second movable plate 5 to move downwards together. When the chip is placed on the chip carrier, the chip generates an upward reaction force on the nozzle 55, which stops the second movable plate 5 from moving. At this time, the first movable plate 2 continues to move downwards under the elastic force generated by the compression of the compression spring. When the bottom of the first movable plate 2 moves to the stop bar 53 of the second movable plate 5 and the bottom of the first movable plate 2 abuts against the stop bar 53, the second photoelectric detection switch 28 in the second detection hole 27 moves to the second light blocking column 52. The light beam emitted by the second photoelectric detection switch 28 is blocked by the second light blocking column 52. The second photoelectric detection switch 28 sends a signal that the light beam is blocked to the controller. After receiving the signal, the controller shuts off the motor 11. At this time, the chip is placed in place on the chip carrier. Finally, the controller controls the vacuum pump to release the vacuum to the nozzle 55 (i.e., the vacuum pump fills the nozzle 55 with air), and the nozzle 55 puts the chip down.

[0010] In summary, the three-stage pressure feedback mechanism of the present invention can provide appropriate force for the nozzle 55 to contact the chip when the nozzle picks up and places the chip and when testing the chip. This ensures that the chip is subjected to appropriate force, making it easy for the nozzle 55 to pick up and place the chip onto the carrier tape. It prevents the chip from being subjected to excessive force and deviating from the carrier tape. During chip testing, it can further increase the force applied to the chip by the nozzle 55, thereby firmly fixing the chip on the test stage of the chip testing mechanism and ensuring that no abnormalities occur during chip testing.

[0011] The above description represents the preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A third-order pressure feedback mechanism for chip testing, characterized in that, The device includes a horizontally mounted mounting plate (1), on which a motor (11) is fixedly mounted. The rotating shaft of the motor (11) is coaxial with and fixedly connected to a lead screw (12). The lead screw (12) is threadedly connected to a lead screw nut (13). The lead screw nut (13) is fixedly connected to a horizontally mounted pressure plate (14). A vertically mounted bolt (15) is slidably connected to each of the four corners of the pressure plate (14). A compression spring is fitted on each bolt (15). The lower ends of the four bolts (15) are all fixedly connected to a first movable plate (2). The upper end of the first movable plate (2) has a groove (21), and four threaded holes (22) are provided at the four corners of the bottom of the groove (21). The four bolts (15) are threadedly connected to the four threaded holes (22) respectively. A large round hole (23) is provided in the middle of the bottom of the groove (21), and the lead screw (12) passes through the large round hole (23). The upper end of the compression spring abuts against the lower surface of the pressure plate (14), and the lower end of the compression spring abuts against the bottom of the groove (21). A vertically arranged first light-blocking column (16) is also fixed on the pressure plate (14). A vertically arranged first detection hole (24) is opened on the upper front of the first movable plate (2) and the first light-blocking column (16) can pass through it. A first photoelectric detection switch (25) is fixed in the first detection hole (24). The mounting plate (1) is also fixedly connected to a vertically arranged back plate (3) and two vertically arranged baffles (4). The two baffles (4) are parallel and spaced apart. The back plate (3) is located between the two baffles (4) and is fixedly connected to the two baffles (4) vertically. The back plate (3) has two vertical and spaced first slide grooves (31) fixed on its front side, and the back of the first movable plate (2) has two vertical and spaced slide rails (26) fixed on its back side, with the upper part of the slide rails (26) sliding in the first slide grooves (31). The back of the first movable plate (2) is also slidably connected to a vertically arranged second movable plate (5). The front of the second movable plate (5) is fixed with two vertically arranged and spaced second slide grooves (51). The lower part of the slide rail (26) is slidably disposed in the second slide grooves (51). The top of the second movable plate (5) is fixed with a vertically arranged second light-blocking column (52), and the lower part of the back of the first movable plate (2) is provided with a vertically arranged second detection hole (27) that allows the second light-blocking column (52) to pass through. A second photoelectric detection switch (28) is fixed inside the second detection hole (27). A horizontally arranged baffle (53) is fixedly provided in the lower middle part of the second movable plate (5). The baffle (53) is spaced apart from the bottom of the first movable plate (2). A suction nozzle mounting plate (54) is fixedly connected to the bottom of the second movable plate (5). A plurality of suction nozzles (55) for picking up and putting down chips are fixedly provided on the suction nozzle mounting plate (54).

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