An electronic device

Abstract

The embodiment of the application provides an electronic device, the electronic device comprises a high-speed cable assembly, the high-speed cable assembly is used for transmitting a high-speed signal; the high-speed cable assembly comprises a first high-speed connector, a second high-speed connector, a high-speed cable and a circuit board assembly; the high-speed cable and the circuit board assembly are electrically connected; the first high-speed connector and the second high-speed connector are electrically connected through the high-speed cable and the circuit board assembly; the circuit board assembly is used for performing loss compensation processing on the high-speed signal, and the quality of data communication between different components through the high-speed cable can be improved.

Description

Technical Field

[0001] This application relates to the field of communication equipment technology, and more particularly to an electronic device. Background Technology

[0002] In electronic devices such as servers, different components need to be interconnected via high-speed signals to achieve data communication.

[0003] In related technologies, high-speed cable assemblies are typically used as standard connectors between different components. However, with the continuous increase in data transmission rates of electronic devices and the growing wiring distances within their chassis, the performance of electronic devices is severely constrained. Summary of the Invention

[0004] This application provides an electronic device that can improve the quality of data communication between different components via high-speed cables.

[0005] In a first aspect, embodiments of this application provide an electronic device, which includes a high-speed cable assembly for transmitting high-speed signals; The high-speed cable assembly includes a first high-speed connector, a second high-speed connector, a high-speed cable, and a circuit board assembly. Electrical connections between high-speed cables and circuit board assemblies; The first high-speed connector and the second high-speed connector are electrically connected via a high-speed cable and a circuit board assembly; the circuit board assembly is used for loss compensation processing of high-speed signals.

[0006] The electronic device provided according to the embodiments of this application introduces a circuit board assembly to perform loss compensation processing on high-speed signals transmitted via high-speed cables, thereby compensating for losses due to transmission distance and transmission rate, and improving the transmission quality of high-speed signals. Simultaneously, the circuit board assembly is electrically connected to the high-speed cable, allowing the first and second high-speed connectors to directly adopt industry-standard passive high-speed connectors without requiring modifications to the design of the first or second high-speed connectors for the circuit board assembly, thus simplifying the structure of the high-speed cable assembly.

[0007] In one implementation, the high-speed cable includes a first high-speed cable and a second high-speed cable. One end of the first high-speed cable is electrically connected to a first high-speed connector, and the other end is electrically connected to one end of a circuit board assembly. One end of the second high-speed cable is connected to a second high-speed connector, and the other end is electrically connected to the other end of the circuit board assembly. By using the circuit board assembly as an adapter, the high-speed cable is configured to include two high-speed cable segments. One segment, the first high-speed cable, is electrically connected between the circuit board assembly and the first high-speed connector, and the other segment, the second high-speed cable, is electrically connected between the circuit board assembly and the second high-speed connector. This achieves electrical connection between the high-speed cable and the circuit board assembly, as well as connection to both high-speed connectors, making the high-speed cable assembly more modular and easier to assemble.

[0008] In one implementation, the high-speed cable includes a first channel cable and a second channel cable, both of which are electrically connected to the circuit board assembly. The first high-speed connector and the second high-speed connector are electrically connected through a first channel cable and a circuit board assembly. The first channel cable is used to transmit the first high-speed signal emitted by the first high-speed connector to the second high-speed connector, and the circuit board assembly is used to perform loss compensation processing on the first high-speed signal. The first high-speed connector and the second high-speed connector are electrically connected via a second channel cable and a circuit board assembly. The second channel cable is used to transmit the second high-speed signal emitted by the second high-speed connector to the first high-speed connector. The circuit board assembly is used to perform loss compensation processing on the second high-speed signal.

[0009] This application embodiment achieves parallel and dedicated processing of bidirectional signals by configuring the high-speed cable to include a first channel cable, enabling the first high-speed connector to transmit a first high-speed signal to the second high-speed connector, and by configuring the high-speed cable to include a second channel cable, enabling the second high-speed connector to transmit a second high-speed signal to the first high-speed connector. This effectively avoids crosstalk between channels. Furthermore, the circuit board assembly enables loss compensation processing for both the first high-speed signal transmitted from the first high-speed connector to the second high-speed connector and the second high-speed signal transmitted from the second high-speed connector to the first high-speed connector. This loss compensation processing for bidirectional high-speed signals achieves high-speed and reliable bidirectional communication.

[0010] In one implementation, the circuit board assembly includes a signal processor and a circuit board, with the signal processor electrically connected to the circuit board and a high-speed cable electrically connected to the circuit board. Signal processors are used to perform loss compensation processing on high-speed signals.

[0011] In this embodiment, by configuring the circuit board assembly as including a circuit board and a signal processor electrically connected to the circuit board, the circuit board provides a stable and reliable mounting carrier for the signal processor. Simultaneously, by using the circuit board as an intermediate node electrically connected to the high-speed cable, the structure of the high-speed cable assembly becomes more modular.

[0012] In one implementation, the signal processor is configured to include a re-driver chip.

[0013] In one implementation, the circuit board assembly includes at least two signal processors, one of which is electrically connected to a first channel cable in the high-speed cable for processing first high-speed signal loss compensation; the other signal processor is electrically connected to a second channel cable in the high-speed cable for processing second high-speed signal loss compensation.

[0014] By using two independent signal processors to perform loss compensation processing on the corresponding high-speed signals, parallel and independent processing of the first and second high-speed signals can be achieved. This effectively avoids processing delays or mutual interference problems that may occur when a single processor processes bidirectional high-speed signals, further improving the real-time performance and stability of high-speed signal transmission. Each signal processor can be configured with targeted compensation parameters according to the characteristics of the high-speed signal in its corresponding channel cable (such as transmission rate, signal strength, loss, etc.), so that high-speed signals in different directions can obtain the best loss compensation effect, ensuring the high speed and reliability of bidirectional communication.

[0015] In one implementation, the high-speed cable assembly also includes: The power connector is electrically connected to the circuit board assembly and to an external power source for the high-speed cable assembly; the external power source is used to power the circuit board assembly.

[0016] In one implementation, the power connector is connected to the circuit board of the circuit board assembly to electrically connect the circuit board to the signal processor of the circuit board assembly.

[0017] In this embodiment, a power connector is used to connect the circuit board to an external power source, enabling the external power source to supply power to the circuit board and signal processor without the need for other structures such as a first high-speed connector or a second high-speed connector. This simplifies the design of the first high-speed connector and / or the second high-speed connector, and improves the flexibility and reliability of the power supply scheme for the circuit board assembly.

[0018] In one implementation, the high-speed cable assembly also includes a protective device that covers the circuit board assembly.

[0019] In this embodiment, the protective device is mounted on the circuit board assembly to protect the circuit board assembly, prevent the circuit board assembly from coming into contact with other devices located around it and causing a short circuit, and improve the reliability of the high-speed cable assembly.

[0020] In one implementation, the protective device is detachably attached to the circuit board of the circuit board assembly, or the protective device and the circuit board are constructed as a single injection-molded unit. The protection device and the circuit board form an enclosure space, and the signal processor of the circuit board assembly is housed within the enclosure space. Attached Figure Description

[0021] Figure 1 This is a partial structural schematic diagram of an electronic device provided in an embodiment of this application; Figure 2 This is a schematic diagram of the connection relationship of a high-speed cable assembly in an application scenario provided by an embodiment of this application. Figure 1 ; Figure 3 This is a schematic diagram of the structure of a high-speed cable assembly provided in an embodiment of this application. Figure 1 ; Figure 4 This is a schematic diagram of the connection relationship of a high-speed cable assembly in an application scenario provided by an embodiment of this application. Figure 2 ; Figure 5 This is a schematic diagram of the structure of a high-speed cable assembly provided in an embodiment of this application. Figure 2 .

[0022] Explanation of reference numerals in the attached figures: 100 - High-speed cable assembly; 200 - First component; 300 - Second component; 10-First high-speed connector; 20-Second high-speed connector; 30-High-speed cable; 40-Signal processor; 50-Power connector; 51-Power cord; 60-Circuit board; 70-Circuit board assembly; 31-First high-speed cable; 32-Second high-speed cable; 41-First signal processor; 42-Second signal processor; 80-Protection device. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will now be described with reference to the accompanying drawings. To facilitate a clear description of the technical solutions of the embodiments of this application, the use of terms such as "first," "second," etc., in the embodiments of this application is for illustrative purposes and to distinguish the objects being described. There is no particular order between them, nor does it indicate a specific limitation on the number of devices in the embodiments of this application, and they do not constitute any limitation on the embodiments of this application.

[0024] To enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of this application.

[0025] It should be noted that many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below.

[0026] In the description of this application, it should be understood that the terms "upper," "lower," "horizontal," "bottom," "inner," and "outer" (if any) indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In this application, unless otherwise expressly specified and limited, "upper" or "lower" of the first feature and the second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium.

[0027] In this application, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral unit; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. However, specifying a direct connection indicates that the two entities at the point of connection are not connected through a transitional structure, but are simply linked together to form a whole. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0028] In this application, the use of terms such as "first," "second," etc., is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0029] In this embodiment, the electronic device includes multiple different components such as a motherboard, hard disk, and optical module. These different components need to be interconnected via high-speed signals to achieve data communication.

[0030] In some implementations, different components are connected via high-speed cable assemblies. In other words, different components transmit high-speed signals via high-speed cables to achieve data communication.

[0031] In some implementations, the wiring length of high-speed cables connecting different components in the same electronic device can reach 990 mm.

[0032] This application provides a high-speed cable assembly that can improve the quality of data communication between different components via high-speed cables.

[0033] Figure 1 This is a partial structural diagram of an electronic device provided in an embodiment of this application. Figure 2 This is a schematic diagram of the connection relationship of a high-speed cable assembly in an application scenario provided by an embodiment of this application. Figure 1 . Figure 3 This is a schematic diagram of the structure of a high-speed cable assembly provided in an embodiment of this application. Figure 1 .

[0034] Reference Figures 1 to 3 As shown, this application embodiment provides an electronic device, such as a server, which may include a high-speed cable assembly 100, a first component 200 and a second component 300. The high-speed cable assembly 100 is used to communicate between the first component 200 and the second component 300, and the high-speed cable assembly 100 is used to realize the transmission of high-speed signals between the first component 200 and the second component 300.

[0035] The communication connection between the first component 200 and the second component 300 can be understood to include at least one of the following methods: In one manner, the first component 200 can transmit high-speed signals to the second component 300 and be received by the second component 300.

[0036] In one manner, the second component 300 can transmit high-speed signals to the first component 200 and be received by the first component 200.

[0037] To distinguish between the high-speed signal transmitted from the first component 200 to the second component 300 and the high-speed signal transmitted from the second component 300 to the first component 200, the high-speed signal transmitted from the first component 200 to the second component 300 is referred to as the first high-speed signal; and the high-speed signal transmitted from the second component 300 to the first component 200 is referred to as the second high-speed signal.

[0038] In some examples, the first component 200 can be the server's motherboard, and the second component 300 can be the server's hard drive. Specifically, the high-speed cable assembly 100 can be connected between the motherboard and the hard drive; for example, the high-speed cable assembly 100 can be connected between the backplane of the motherboard and the hard drive.

[0039] In some examples, the first component 200 can be the server's motherboard, and the second component 300 can be the server's optical module. In other words, the high-speed cable assembly 100 can communicatively connect the motherboard and the optical module.

[0040] It should be noted that the motherboard and hard drive, as well as the motherboard and optical module, are only examples of the combination of the first component 200 and the second component 300. The first component 200 and the second component 300 can also be other components in the server. This application embodiment does not impose specific restrictions on the types of the first component 200 and the second component 300.

[0041] In this embodiment, the high-speed cable assembly 100 includes a first high-speed connector 10. The first high-speed connector 10 is used for electrical connection with a first component 200 to receive a first high-speed signal from the first component 200.

[0042] Here, as mentioned above, the first high-speed signal is the high-speed signal transmitted from the first component 200 to the second component 300.

[0043] In some examples, the first component 200 has a pre-installed socket, and the first high-speed connector 10 is a wire-end plug. The wire-end plug is inserted into the socket to realize the electrical connection between the first component 200 and the first high-speed connector 10.

[0044] In other examples, the first high-speed connector 10 is provided with solder terminals that can be electrically connected to the first component 200.

[0045] It should be noted that the above example is only an example of the electrical connection between the first high-speed connector 10 and the first component 200. The embodiments of this application do not impose specific restrictions on the electrical connection method between the first high-speed connector 10 and the first component 200.

[0046] In some examples, the first high-speed connector 10 can be a standard general-purpose connector in the server field, such as a Slimline connector or an MCIO (Multi-purpose Channel I / O) connector. It should be noted that the embodiments of this application do not limit the type of the first high-speed connector 10.

[0047] In this embodiment, the high-speed cable assembly 100 further includes a second high-speed connector 20. The second high-speed connector 20 is used for electrical connection with the second component 300, enabling communication between the second high-speed connector 20 and the second component 300.

[0048] In some embodiments, the second high-speed connector 20 is also used to receive a second high-speed signal from the second component 300. Accordingly, the second high-speed signal received by the second high-speed connector 20 is transmitted to the first component 200 via the high-speed cable 30.

[0049] Here, the communication connection between the second high-speed connector 20 and the second component 300 can be understood to include at least one of the following: In one manner, the second high-speed connector 20 is able to transmit the first high-speed signal to the second component 300 and be received by the second component 300.

[0050] In one manner: the second component 300 is capable of transmitting a second high-speed signal to the second high-speed connector 20.

[0051] In some embodiments, the technical solution for electrically connecting the second high-speed connector 20 to the second component 300 can refer to the aforementioned embodiment for electrically connecting the first high-speed connector 10 to the first component 200, and will not be repeated here.

[0052] In some examples, the second high-speed connector 20 can be a standard general-purpose connector in the server field, such as a Slimline connector or an MCIO connector. It should be noted that the embodiments of this application do not limit the type of the second high-speed connector 20.

[0053] In this embodiment, the high-speed cable assembly 100 further includes a high-speed cable 30. The high-speed cable 30 is connected to the first high-speed connector 10 and the second high-speed connector 20. Thus, the first component 200 transmits a first high-speed signal to the first high-speed connector 10, the first high-speed connector 10 transmits the first high-speed signal to the second high-speed connector 20 via the high-speed cable, and the second high-speed connector 20 transmits the first high-speed signal to the second component 300, forming a data communication path between the first component 200 and the second component 300.

[0054] In some implementations, the high-speed cable 30 can be connected to the first high-speed connector 10 by crimping.

[0055] In other embodiments, the high-speed cable 30 can be connected to the first high-speed connector 10 by soldering.

[0056] It should be noted that crimping or welding is only an example of connecting the high-speed cable 30 and the first high-speed connector 10. The connection between the high-speed cable 30 and the first high-speed connector 10 can also be achieved by injection molding or other methods. This application embodiment does not limit the connection method between the high-speed cable 30 and the first high-speed connector 10.

[0057] In some embodiments, the technical solution for connecting the high-speed cable 30 to the second high-speed connector 20 can refer to the aforementioned embodiment for connecting the high-speed cable 30 to the first high-speed connector 10, and will not be repeated here.

[0058] In this embodiment, the high-speed cable assembly 100 further includes a circuit board assembly 70. The circuit board assembly 70 is electrically connected to the high-speed cable 30, and the first high-speed connector 10 and the second high-speed connector 20 are electrically connected through the high-speed cable 30 and the circuit board assembly 70; the circuit board assembly 70 is used to perform loss compensation processing on high-speed signals.

[0059] For example, the first high-speed signal transmitted via the high-speed cable 30 undergoes loss compensation processing, and the compensated first high-speed signal is transmitted to the second high-speed connector 20. After receiving the compensated first high-speed signal, the second high-speed connector 20 transmits the compensated first high-speed signal to the second component 300.

[0060] For example, the second high-speed signal transmitted via the high-speed cable 30 undergoes loss compensation processing, and the compensated second high-speed signal is transmitted to the first high-speed connector 10. After receiving the compensated second high-speed signal, the first high-speed connector 10 transmits the compensated second high-speed signal to the first component 200.

[0061] Here, loss compensation processing can be understood as: processing high-speed signals that have been attenuated or distorted due to high-speed cable transmission in order to restore the signal integrity of the high-speed signal, including but not limited to: one or more of the following methods: signal amplification, equalization, retiming, redriving, etc.

[0062] In some implementations, on the transmission path of the high-speed signal between the first high-speed connector 10 and the second high-speed connector 20, the first distance between the circuit board assembly 70 and the high-speed connector from which the signal originates is positively correlated with the degree of loss compensation of the circuit board assembly 70.

[0063] In some examples, the greater the initial distance, the higher the degree of loss compensation.

[0064] In other examples, the smaller the initial distance, the lower the degree of loss compensation.

[0065] For example, on the path of the first high-speed signal transmitted from the first high-speed connector 10 to the second high-speed connector 20, the first distance between the circuit board assembly 70 and the first high-speed connector 10 is positively correlated with the degree of loss compensation of the circuit board assembly 70.

[0066] For example, along the path of the second high-speed signal transmitted from the second high-speed connector 20 to the first high-speed connector 10, the first distance between the circuit board assembly 70 and the second high-speed connector 20 is positively correlated with the degree of loss compensation of the circuit board assembly 70. In some examples, the circuit board assembly 70 includes a signal processor 40 and a circuit board 60, with the signal processor 40 electrically connected to the circuit board 60 and the high-speed cable 30 electrically connected to the circuit board 60. The signal processor 40 is used to perform loss compensation processing on the high-speed signal.

[0067] In some examples, circuit board 60 can be a printed circuit board (PCB).

[0068] In some examples, circuit board 60 can be an integrated circuit board.

[0069] In some examples, circuit board 60 can be a flexible circuit board, which can be flexibly adapted to the spatial layout within electronic devices by utilizing the flat and bendable characteristics of flexible circuit boards.

[0070] It should be noted that the type of circuit board 60 is not limited in this application embodiment.

[0071] In some examples, the signal processor 40 includes a chip that is located on a printed circuit board and together with the printed circuit board forms a printed circuit board assembly (PCBA).

[0072] Here, the technical solution of the signal processor 40 being located on the circuit board 60 can refer to the implementation of the chip being located on the circuit board 60, and will not be repeated here.

[0073] In some implementations, the signal processor 40 may include a redrive chip for attenuation compensation processing of the first high-speed signal.

[0074] In some examples, the compensation value of the redrive chip can be set to 3dB, 5dB, 8dB, 10dB or other values. In this embodiment, the compensation value of the redrive chip is not specifically limited and can be determined according to the loss value of the high-speed signal on the high-speed cable 30.

[0075] In some examples, the expected loss value for the high-speed signal transmission between the first high-speed connector 10 and the second high-speed connector 20 is consistent with the compensation value of the redrive chip. For example, if the expected loss value is 3dB, then the compensation value of the redrive chip can be set to 3dB.

[0076] It should be noted that the redrive chip is only an example of signal processor 40 performing loss compensation processing on high-speed signals, and the embodiments of this application do not limit the type of signal processor 40.

[0077] An electronic device according to an embodiment of this application includes a circuit board assembly 70 for loss compensation processing of high-speed signals transmitted via a high-speed cable 30. This compensates for losses due to transmission distance and transmission rate, thereby improving the transmission quality of the high-speed signals. Simultaneously, the circuit board assembly 70 is electrically connected to the high-speed cable 30, allowing the first high-speed connector 10 and the second high-speed connector 20 to directly adopt industry-standard passive high-speed connectors. This eliminates the need for modifications to the design of the first high-speed connector 10 or the second high-speed connector 20 to accommodate the circuit board assembly 70, thus simplifying the structure of the high-speed cable assembly 100.

[0078] Furthermore, electrically connecting the circuit board assembly 70 to the high-speed cable 30 frees up space near the first component 200 and / or near the second component 300 and the second high-speed connector 20, which is beneficial to the flexibility of the layout of devices around the first component 200 and the second component 300.

[0079] In this embodiment, the circuit board assembly 70 is configured to include a circuit board 60 and a signal processor 40 electrically connected to the circuit board 60. The circuit board 60 provides a stable and reliable mounting carrier for the signal processor 40. Simultaneously, the circuit board 60 is used as an intermediate node electrically connected to the high-speed cable 30, making the structure of the high-speed cable assembly 100 more modular.

[0080] In some embodiments, the circuit board assembly 70 is disposed on the high-speed cable 30 and is fixedly connected to the high-speed cable 30.

[0081] In some examples, the circuit board assembly 70 may be located outside the high-speed cable 30.

[0082] In other examples, the circuit board assembly 70 may be embedded inside the high-speed cable 30.

[0083] In some implementations, the circuit board assembly 70 can be located at any position on the high-speed cable 30.

[0084] It should be noted that the location of the circuit board assembly 70 can be determined based on the wiring of the high-speed cable 30 of the electronic device. The principle is that the circuit board assembly 70 will not interfere with other structures in the electronic device.

[0085] In some embodiments, the high-speed cable 30 includes a first high-speed cable 31 and a second high-speed cable 32. One end of the first high-speed cable 31 is electrically connected to the first high-speed connector 10, and the other end of the first high-speed cable 31 is electrically connected to one end of the circuit board assembly 70. One end of the second high-speed cable 32 is electrically connected to the second high-speed connector 20, and the other end of the second high-speed cable 32 is electrically connected to the other end of the circuit board assembly 70.

[0086] For example, circuit board 60 is electrically connected between the first high-speed cable 31 and the second high-speed cable 32, and the first high-speed cable 31 is also electrically connected to the first high-speed connector 10, and the second high-speed cable 32 is also electrically connected to the second high-speed connector 20. Signal processor 40 is electrically connected to circuit board 60 so that signal processor 40 is electrically connected to the first high-speed cable 31 and the second high-speed cable 32 through circuit board 60. By using circuit board assembly 70 as an adapter, the high-speed cable 30 is configured to include two high-speed cable segments, one of which, the first high-speed cable 31, is electrically connected between circuit board assembly 70 and the first high-speed connector 10, and the other of which, the second high-speed cable 32, is electrically connected between circuit board assembly 70 and the second high-speed connector 20. This achieves electrical connection between high-speed cable 30 and circuit board assembly 70, and also enables connection to the two high-speed connectors, making the structure of high-speed cable assembly 100 more modular and easier to assemble.

[0087] In some embodiments, one end of the first high-speed cable 31 is connected to the first high-speed connector 10, and the other end of the first high-speed cable 31 is connected to one end of the circuit board assembly 70; one end of the second high-speed cable 32 is connected to the second high-speed connector 20, and the other end of the second high-speed cable 32 is connected to the other end of the circuit board assembly 70. Thus, the circuit board assembly 70 is connected between the first high-speed cable 31 and the second high-speed cable 32, allowing for more flexible placement of the circuit board assembly 70. It can accommodate larger heat sinks and even utilize the airflow within the electronic device for heat dissipation, which helps ensure the circuit board assembly 70's compensation effect for high-speed signals.

[0088] For example, one end of the first high-speed cable 31 is crimped or soldered to the conductive end of the first high-speed connector 10.

[0089] For example, one end of the second high-speed cable 32 is crimped or soldered to the conductive end of the second high-speed connector 20.

[0090] In some embodiments, the circuit board 60 and the first high-speed cable 31 can be electrically connected by soldering. Specifically, the circuit board 60 is provided with solder pads; the first high-speed cable is soldered to these solder pads.

[0091] In other embodiments, the circuit board 60 and the first high-speed cable 31 can be electrically connected via a connector. Specifically, a board-to-wire connector is integrated or soldered onto the circuit board 60, and this board-to-wire connector is used to achieve the electrical connection between the circuit board 60 and the first high-speed cable 31.

[0092] In some embodiments, the circuit board 60 and the first high-speed cable 31 can be electrically connected via wire bonding. Specifically, the wires of the first high-speed cable 31 are electrically connected to the bonding pads on the circuit board 60 via wire bonding. It should be noted that, in this case, the high-speed cable 30 is physically a single, continuous cable, but for high-speed signal transmission, it is divided into the first high-speed cable 31 and the second high-speed cable 32 by the circuit board 60.

[0093] In some embodiments, the technical solution for connecting the circuit board 60 to the second high-speed cable 32 can refer to the aforementioned embodiment for connecting the circuit board 60 to the first high-speed cable 31, and will not be repeated here.

[0094] In some embodiments, the high-speed cable assembly 100 further includes a waterproof layer covering the connection between the circuit board 60 and the first high-speed cable 31; and / or covering the connection between the circuit board 60 and the second high-speed cable 32, to adapt the electronic equipment to operation in high humidity environments and reduce failures caused by corrosion or contamination.

[0095] Reference Figure 3 As shown, in some embodiments, the high-speed cable assembly 100 further includes a power connector 50. The power connector 50 is electrically connected to the circuit board assembly 70 and to an external power source (not shown) for the high-speed cable assembly 100; wherein the external power source is used to power the circuit board assembly 70.

[0096] Therefore, by placing the circuit board assembly 70 on the high-speed cable 30, a basic condition is provided for its independent power supply. Accordingly, the circuit board assembly 70 is connected to an external power source using the power connector 50, enabling the external power source to supply power to the circuit board assembly 70 without the need for a power supply structure on the first high-speed connector 10 or the second high-speed connector 20. This simplifies the design of the first high-speed connector 10 and / or the second high-speed connector 20, and improves the flexibility and reliability of the power supply scheme for the circuit board assembly 70, such as the signal processor 40.

[0097] In some implementations, the power supply voltage required by the signal processor 40 can be set to 3.3V, 5V, 12V or other voltages. This application embodiment does not limit the power supply voltage of the signal processor 40.

[0098] In some implementations, the power connector 50 may include, but is not limited to, a socket, a standard board-to-wire power connector, or a board-to-board connector. This application does not limit the type of power connector 50.

[0099] In some examples, the power connector 50 can be directly electrically connected to the signal processor 40.

[0100] In other examples, power connector 50 is electrically connected to an external power source and circuit board 60, so that signal processor 40 is electrically connected to power connector 50 via circuit board 60. Accordingly, the external power source can transmit power supply signals to signal processor 40 through power connector 50 and circuit board 60 to power signal processor 40. Thus, power is supplied to signal processor 40 via power connector 50, which in turn powers circuit board 60, enabling signal processor 40 to perform normal operation.

[0101] In some examples, the high-speed cable assembly 100 also includes a power cord 51. The power connector 50 can be electrically connected to the circuit board 60 via the power cord 51.

[0102] In some examples, the power connector 50 may be configured as a spring pin or a test pin, which is located on an external power source and is then crimped onto the spring pin or test pin via one end of a power cord 51, the other end of which is connected to the circuit board 60.

[0103] In other examples, the power connector 50 can be configured as a battery connector.

[0104] It should be noted that the connection method between the power connector 50 and the circuit board 60 and the external power supply can be determined according to the actual situation. This application embodiment does not limit the type of connection method.

[0105] In some embodiments, the electronic device also includes a motherboard with a power socket, and a power connector 50 can be electrically connected to the power socket to draw power from the motherboard to supply power to the circuit board assembly 70.

[0106] In other embodiments, the electronic device includes a hard disk backplane with a power output interface thereon, and a power connector 50 can be electrically connected to the power output interface to draw power to the circuit board assembly 70.

[0107] In other embodiments, the electronic device includes a power distribution board or power backplane with a power interface thereon, and a power connector 50 can be electrically connected to the power interface to draw power to the circuit board assembly 70.

[0108] It should be noted that the circuit board assembly 70 can determine the power supply method based on the location of the first component 200 and the second component 300 to which it is connected, which is beneficial to improving the layout flexibility of the circuit board assembly 70.

[0109] Figure 4 This is a schematic diagram of the connection relationship of a high-speed cable assembly in an application scenario provided by an embodiment of this application. Figure 2 .

[0110] Reference Figure 4 As shown, in some embodiments, the signal processor 40 includes a first signal processor 41, which performs loss compensation processing on the first high-speed signal to obtain a compensated first high-speed signal. Accordingly, the processed first high-speed signal is transmitted to the second component 300 through the second high-speed connector 20.

[0111] In some embodiments, the signal processor 40 further includes a second signal processor 42, which performs loss compensation processing on the second high-speed signal to obtain a compensated second high-speed signal. Accordingly, the processed second high-speed signal is transmitted to the second component 300 through the first high-speed connector 10.

[0112] In some examples, the first signal processor 41 is a redrive chip.

[0113] In some examples, the second signal processor 42 is a redrive chip.

[0114] It should be noted that the embodiments of this application do not limit the types of the first signal processor 41 and / or the second signal processor 42.

[0115] In the above scheme, when the first component 200 needs to output a first high-speed signal to the second component 300, the first component 200 outputs the first high-speed signal to the first high-speed connector 10. The first high-speed connector 10 receives the first high-speed signal and transmits it to the first signal processor 41 via the first high-speed cable 31 of the high-speed cable 30. The first signal processor 41 performs loss compensation processing on the first high-speed signal to obtain a compensated first high-speed signal. The compensated first high-speed signal is then transmitted to the second high-speed connector 20 via the second high-speed cable 32 of the high-speed cable 30. The second high-speed connector 20 receives the compensated first high-speed signal and transmits it to the second component 300.

[0116] When the second component 300 needs to output a second high-speed signal to the first component 200, the second component 300 outputs the second high-speed signal to the second high-speed connector 20. The second high-speed connector 20 receives the second high-speed signal and transmits it to the second signal processor 42 via the second high-speed cable 32 of the high-speed cable 30. The second signal processor 42 performs loss compensation processing on the second high-speed signal to obtain a compensated second high-speed signal. The compensated second high-speed signal is then transmitted to the first high-speed connector 10 via the first high-speed cable 31 of the high-speed cable 30. The first high-speed connector 10 receives the compensated second high-speed signal and transmits it to the first component 200.

[0117] Therefore, the signal processor 40 can perform loss compensation processing on the first high-speed signal transmitted from the first component 200 to the second component 300, and the first high-speed signal transmitted from the second component 300 to the first component 200, that is, perform loss compensation processing on the high-speed signal transmitted bidirectionally between the first component 200 and the second component 300, thereby realizing high-speed and reliable bidirectional communication.

[0118] In some embodiments, the circuit board assembly 70 further includes a diagnostic controller electrically connected to the electronic device's manager. The diagnostic controller generates current health parameters in diagnostic mode and sends these parameters to the manager. The health parameters contain information characterizing the compensation performance of the signal processor. Accordingly, personnel can promptly obtain information about the health parameters from the manager and take appropriate measures when the health parameters are abnormal.

[0119] In some implementations, the diagnostic controller includes a triggering unit, to which the manager writes a triggering instruction. In response to the triggering instruction, the triggering unit generates a control signal to configure the diagnostic controller into diagnostic mode.

[0120] In some examples, the trigger command can be entered by the staff into the manager, which then configures it into a trigger command that the trigger unit can recognize and sends it to the trigger unit.

[0121] In some implementations, the diagnostic controller further includes a diagnostic unit and a reporting unit. The diagnostic unit is electrically connected between the triggering unit and the reporting unit. The diagnostic unit is also connected to the signal processor. In diagnostic mode, the diagnostic unit generates a test signal and transmits the test signal to the signal processor. The signal processor compensates the test signal to obtain a compensated test signal. The signal processor transmits the compensated test signal to the diagnostic unit. The diagnostic unit compares the compensated test signal with the original test signal to obtain health parameters.

[0122] In some examples, the health parameter includes the potential bit error rate (BER). The diagnostic unit includes a bit error rate detection circuit electrically connected to the signal processor and the reporting unit. The signal processor transmits a compensation test signal to the BER, which compares the compensation test signal with the test signal bit by bit to obtain the BER, and then transmits the BER to the reporting unit. Correspondingly, the reporting unit transmits the BER to the manager for staff to access.

[0123] Here, the potential bit error rate characterizes the degree to which the signal processor 40 is close to the error boundary under the current link attenuation conditions.

[0124] In other examples, the health parameter may include eye diagram opening margin. The diagnostic unit includes an eye diagram analysis circuit electrically connected to the signal processor and the reporting unit. The signal processor transmits the compensation test signal to the eye diagram analysis circuit, which performs data analysis on the compensation test signal (e.g., high-speed sampling and statistics, constructing amplitude histograms and time jitter histograms, etc.) to obtain the eye diagram opening margin, and then transmits the eye diagram opening margin to the reporting unit. Accordingly, the reporting unit transmits the eye diagram opening margin to the manager for staff to access. Here, the eye diagram opening margin is used to characterize the remaining space between the compensated signal quality and the acceptable standard.

[0125] Based on this, staff can obtain the health parameters of the link from the manager. When the health parameters show abnormalities (such as a continuous decrease in eye opening margin), maintenance measures can be taken in advance to achieve predictive maintenance and avoid reactive repairs after abnormal interruptions of electronic equipment.

[0126] In some embodiments, the signal processor 40 includes a rate detection unit, a mode control unit, and a signal compensation circuit. The rate detection unit is electrically connected to the high-speed cable and is used to detect the transmission rate of the high-speed signal. The mode control unit is electrically connected between the rate detection unit and the signal compensation circuit, and is used to configure the operating mode of the signal compensation circuit according to the transmission rate; the operating parameters are different for different operating modes. Thus, the electronic device can adjust the operating mode of the signal processor 40 in the high-speed cable assembly 100 according to the load, ensuring data transmission reliability while reducing power consumption during system idle or low-load periods.

[0127] In some examples, the transmission rate includes multiple predefined rate levels, such as a first rate level, a second rate level, and a third rate level, wherein the first rate level is higher than the second rate level, and the second rate level is higher than the third rate level. The mode control unit has a preset set of operating parameters corresponding to each rate level. When the rate detection unit detects that the transmission rate has switched from the current rate level to another rate level, the mode control unit, in response to this switch, adjusts the operating parameters of the signal compensation circuit to the set of operating parameters corresponding to the other rate level.

[0128] In some implementations, the operating mode includes an energy-saving mode, and the mode control unit is electrically connected to the controller of the electronic device. When the electronic device is under low load, the controller of the electronic device sends an energy-saving command to the mode control unit. The energy-saving command contains information configuring the signal compensation circuit to operate in energy-saving mode.

[0129] In some examples, in response to the power-saving command, the mode control unit configures the core processing circuit into a power-saving mode, i.e., a low-power standby mode. In this low-power standby mode, some functional modules of the signal compensation circuit are shut down or operate at reduced frequencies, maintaining only the most basic signal transmission capability, thereby significantly reducing power consumption. When the rate detection unit detects that the transmission rate of the high-speed signal has returned to the normal operating range, or receives a command from the controller of the electronic device to exit the power-saving mode, the mode control unit controls the signal compensation circuit to return to an operating mode matching the current transmission rate.

[0130] In other examples, the energy-saving mode includes multiple sub-levels, such as a first energy-saving level and a second energy-saving level. At the first energy-saving level, some compensation functions in the signal compensation circuit are simplified; at the second energy-saving level, the bandwidth of the clock data recovery circuit in the signal compensation circuit is reduced. The mode control unit selects the appropriate energy-saving sub-level based on system load information provided by the controller of the electronic device or a preset power consumption strategy.

[0131] Therefore, by detecting the rate and switching the operating mode, the signal processor 40 can achieve refined power consumption management without affecting functionality. When the system transmission demand is low, it automatically enters an energy-saving state to reduce overall energy consumption; when a high-speed data transmission demand is detected, it can quickly resume high-performance operation to ensure signal integrity.

[0132] In some embodiments, the circuit board assembly 70 further includes a configuration memory electrically connected to the mode control unit, which stores operating parameter sets corresponding to each rate level supported by the signal processor 40 and operating parameter sets for each energy-saving level. When the mode control unit needs to switch modes, it reads the corresponding operating parameter set from the configuration memory and loads it into the signal compensation circuit.

[0133] In some examples, the set of operating parameters may include at least one of equalizer coefficients, gain settings, phase-locked loop bandwidth, and drive strength. For higher rate levels, the set of operating parameters is configured to provide stronger signal compensation and faster response characteristics; for lower rate levels or power-saving modes, the set of operating parameters is configured to minimize power consumption while maintaining basic signal quality.

[0134] Reference Figure 3 and Figure 4 As shown, in some embodiments, the high-speed cable 30 includes a first channel cable 301 and a second channel cable 302, both of which are electrically connected to the circuit board assembly 70.

[0135] The first high-speed connector 10 and the second high-speed connector 20 are electrically connected via a first channel cable 301 and a circuit board assembly 70. The first channel cable 301 is used to transmit the first high-speed signal emitted by the first high-speed connector 10 to the second high-speed connector 20, and the circuit board assembly 70 is used to perform loss compensation processing on the first high-speed signal.

[0136] The first channel cable 301 includes a first high-speed cable 31 and a second high-speed cable 32. The circuit board assembly 70 is connected between the first high-speed cable 31 and the second high-speed cable 32. The length of the first high-speed cable 31 is less than half the distance between the first high-speed connector 10 and the second high-speed connector 20.

[0137] In some examples, the ratio of the length of the first high-speed cable 31 to the length of the second high-speed cable 32 is less than 1 / 3.

[0138] Here, the first high-speed cable 31 is connected between the first high-speed connector 10 and the circuit board assembly 70. The length of the first high-speed cable 31 can be understood as the distance between the first high-speed connector 10 and the circuit board assembly 70.

[0139] It should be noted that the distance between the first high-speed connector 10 and the second high-speed connector 20, as well as the distance between the first high-speed connector 10 and the circuit board assembly 70, can both be understood as the trace distance between the two.

[0140] Through the above scheme, in the first channel cable 301, the length of the first high-speed cable 31 is limited to less than half the distance between the first high-speed connector 10 and the second high-speed connector 20, so that the circuit board assembly 70 is physically closer to the first high-speed connector 10. Thus, after the first high-speed signal is emitted from the first high-speed connector 10, it can enter the circuit board assembly 70 for loss compensation processing earlier, thereby effectively reducing the cumulative attenuation and distortion caused by the signal transmission before compensation. This ensures that the first high-speed signal maintains a high signal-to-noise ratio and integrity when input to the circuit board assembly 70, allowing the signal processor 40 to perform compensation more accurately and efficiently, ultimately improving the overall quality and stability of signal transmission from the first component 200 to the second component 300. In some embodiments, the first high-speed connector 10 and the second high-speed connector 20 are electrically connected to the circuit board assembly 70 via a second channel cable 302. The second channel cable 302 is used to transmit the second high-speed signal emitted by the second high-speed connector 20 to the first high-speed connector 10; the circuit board assembly 70 is used to perform loss compensation processing on the second high-speed signal.

[0141] The second channel cable 302 includes a first high-speed cable 31 and a second high-speed cable 32. The circuit board assembly 70 is connected between the first high-speed cable 31 and the second high-speed cable 32. The length of the second high-speed cable 32 is less than half the distance between the first high-speed connector 10 and the second high-speed connector 20.

[0142] In some examples, the ratio of the length of the second high-speed cable 32 to the length of the first high-speed cable 31 is less than 1 / 3.

[0143] Here, the second high-speed cable 32 is connected between the second high-speed connector 20 and the circuit board assembly 70. The length of the second high-speed cable 32 can be understood as the distance between the second high-speed connector 20 and the circuit board assembly 70.

[0144] It should be noted that the distance between the first high-speed connector 10 and the second high-speed connector 20, as well as the distance between the second high-speed connector 20 and the circuit board assembly 70, can both be understood as the trace distance between them.

[0145] Through the above scheme, in the second channel cable 302, the length of the second high-speed cable 32 is limited to less than half the distance between the first high-speed connector 10 and the second high-speed connector 20, so that the circuit board assembly 70 is physically closer to the second high-speed connector 20. Thus, after the second high-speed signal is emitted from the second high-speed connector 20, it can enter the circuit board assembly 70 for loss compensation processing earlier, thereby effectively reducing the cumulative attenuation and distortion caused by the signal transmission before compensation. This ensures that the second high-speed signal maintains a high signal-to-noise ratio and integrity when input to the circuit board assembly 70, allowing the signal processor 40 to perform compensation more accurately and efficiently, ultimately improving the overall quality and stability of signal transmission from the second component 300 to the first component 200.

[0146] For example, multiple cables extending along the high-speed signal transmission direction can be provided between the first high-speed connector 10 and the second high-speed connector 20. At least a portion of these cables can serve as a first channel cable 301, used to transmit the first high-speed signal output from the first high-speed connector 10 to the second high-speed connector 20. This first channel cable 301 can be electrically connected to a first signal processor 41 in the circuit board assembly 70, through which the first signal processor 41 performs loss compensation processing on the first high-speed signal. The remaining portion of the cable can serve as a second channel cable 302, used to transmit the second high-speed signal output from the second high-speed connector 20 to the first high-speed connector 10. This second channel cable 302 can be electrically connected to a second signal processor 42 in the circuit board assembly 70, through which the second signal processor 42 performs loss compensation processing on the second high-speed signal.

[0147] Figure 4 Solid arrows indicate the transmission path of the first high-speed signal from the first component to the second component. Dashed arrows indicate the transmission path of the second high-speed signal from the second component to the first component.

[0148] Reference Figure 4 In the example shown by the solid arrow, when the first component 200 needs to output a first high-speed signal to the second component 300, the first high-speed signal output by the first component 200 is transmitted to the first channel cable 301 of the first high-speed cable 31 via the first high-speed connector 10. The first signal processor 41, located on the first channel cable 301, performs loss compensation processing on the first high-speed signal to obtain a compensated first high-speed signal. The compensated first high-speed signal is then transmitted to the second component 300 via the first channel cable 301 and the second high-speed connector 20 of the second high-speed cable 32.

[0149] Reference Figure 3In the example shown by the dashed arrow, when the second component 300 needs to output a second high-speed signal to the first component 200, the second high-speed signal output by the second component 300 is transmitted via the second high-speed connector 20 to the second channel cable 302 of the second high-speed cable 32. The second signal processor 42, located on the second channel cable 302, performs loss compensation processing on the second high-speed signal to obtain a compensated second high-speed signal. The compensated second high-speed signal is then transmitted to the first component 200 via the second channel cable 302 of the first high-speed cable 31 and the first high-speed connector 10.

[0150] According to an embodiment of this application, a high-speed cable assembly 100 is provided: a first channel cable 301 is provided for the transmission direction from the first component 200 to the second component 300, and a second channel cable 302 is provided for the transmission direction from the second component 300 to the first component 200, thereby realizing parallel and dedicated processing of bidirectional signals and effectively avoiding crosstalk between channels. Figure 5 This is a schematic diagram of the structure of a high-speed cable assembly provided in an embodiment of this application. Figure 2 .

[0151] Reference Figure 5 As shown, in some embodiments, the high-speed cable assembly 100 also includes a protection device 80, which covers the circuit board assembly 70 to protect the circuit board 60 and the signal processor 40 thereon, preventing the circuit board 60 or the signal processor 40 from coming into contact with other devices located around it and causing a short circuit, thereby improving the reliability of the high-speed cable assembly 100.

[0152] For example, the protective device 80 is detachably attached to the circuit board 60 of the circuit board assembly 70, or the protective device 80 and the circuit board 60 are constructed as a single injection-molded integral part; The protection device 80 and the circuit board 60 form an enclosure space, and the signal processor 40 is housed within this enclosure space.

[0153] In some embodiments, the protection device 80 can be injection molded together with the circuit board 60 and its signal processor 40 after manufacturing, forming an inseparable whole. In other words, the protection device 80 and the circuit board 60 are constructed as a single injection-molded structure.

[0154] In some examples, the circuit board 60 is a PCB, and the signal processor 40 is mounted on the PCB to form a PCBA. In this case, the protection device 80 and the PCBA are formed into an inseparable whole through injection molding.

[0155] In other embodiments, the protection device 80 is snapped onto the circuit board 60 so that the signal processor 40 is housed within the protection device 80.

[0156] In some examples, the protection device 80 is configured as a housing structure with a certain degree of elasticity, which can be fastened to the circuit board 60 by applying a certain external force, and the signal processor 40 is located inside the housing structure.

[0157] In some implementations, the protective device 80 may be made of metal to form electromagnetic shielding and ensure the operational performance of the circuit board assembly 70.

[0158] In some embodiments, the circuit board assembly 70 further includes a thermal pad sandwiched between the signal processor 40 and the protection device 80, so that the heat from the signal processor 40 can be transferred to the protection device 80 through the thermal pad. Accordingly, the airflow of the electronic device is used to exchange heat with the protection device 80, thereby cooling the signal processor 40 and ensuring its operating performance.

[0159] In some examples, the outer wall of the protective device 80 is also provided with heat dissipation protrusions to increase the heat exchange area between the air-cooled airflow and the protective device 80 and improve the heat dissipation effect.

[0160] In some implementations, the circuit board assembly 70 is pluggable between the first high-speed cable 31 and the second high-speed cable 32, facilitating subsequent independent repair and replacement of the circuit board assembly 70.

[0161] In some examples, the circuit board 60 is provided with a first connector and a second connector, the first high-speed cable 31 is provided with a third connector, and the second high-speed cable 32 is provided with a fourth connector. The first connector is plugged into the third connector, and the second connector is plugged into the fourth connector, so that the circuit board assembly 70 can be plugged into and detached between the first high-speed cable 31 and the second high-speed cable 32.

[0162] In some embodiments, the sidewall of the protective device 80 is provided with a first opening and a second opening, with the first connector exposed in the first opening and the second connector exposed in the second opening, so as to realize the insertion of the first connector with the third connector and the second connector with the fourth connector. This is beneficial to improve the modularity of the circuit board assembly 70 and facilitate the disassembly, assembly and replacement of the circuit board assembly 70. Based on the same concept, embodiments of this application also provide a server, which includes a first component 200, a second component 300 and the high-speed cable assembly 100 described in any of the foregoing embodiments. The first component 200 and the second component 300 are communicatively connected through the high-speed cable assembly 100.

[0163] It should be noted that this server is designed in accordance with the aforementioned electronic device concept and has the same technical effects as the aforementioned electronic device. Technical features and implementation methods not described in this embodiment can be referred to the technical solutions of the aforementioned electronic device, and will not be repeated here.

[0164] The above embodiments are merely specific embodiments of this application and are not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made based on the technical solution of this application should be included within the scope of protection of this application.

Claims

1. An electronic device, characterized in that, The electronic device includes a high-speed cable assembly for transmitting high-speed signals; The high-speed cable assembly includes a first high-speed connector, a second high-speed connector, a high-speed cable, and a circuit board assembly; The high-speed cable and the circuit board assembly are electrically connected; The first high-speed connector and the second high-speed connector are electrically connected via the high-speed cable and the circuit board assembly; the circuit board assembly is used to perform loss compensation processing on the high-speed signal.

2. The electronic device according to claim 1, characterized in that, The high-speed cable includes a first high-speed cable and a second high-speed cable. One end of the first high-speed cable is electrically connected to a first high-speed connector, and the other end of the first high-speed cable is electrically connected to one end of the circuit board assembly. One end of the second high-speed cable is connected to the second high-speed connector, and the other end of the second high-speed cable is electrically connected to the other end of the circuit board assembly.

3. The electronic device according to claim 1 or 2, characterized in that, The high-speed cable includes a first channel cable and a second channel cable, both of which are electrically connected to the circuit board assembly. The first high-speed connector and the second high-speed connector are electrically connected via the first channel cable and the circuit board assembly. The first channel cable is used to transmit the first high-speed signal emitted by the first high-speed connector to the second high-speed connector, and the circuit board assembly is used to perform loss compensation processing on the first high-speed signal. The first high-speed connector and the second high-speed connector are electrically connected to the circuit board assembly via the second channel cable. The second channel cable is used to transmit the second high-speed signal emitted by the second high-speed connector to the first high-speed connector. The circuit board assembly is used to perform loss compensation processing on the second high-speed signal.

4. The electronic device according to claim 2 or 3, characterized in that, The circuit board assembly includes a signal processor and a circuit board, wherein the signal processor is electrically connected to the circuit board. The signal processor is used to perform loss compensation processing on the high-speed signal.

5. The electronic device according to claim 4, characterized in that, The signal processor is configured to include a re-driver chip.

6. The electronic device according to claim 4, characterized in that, The circuit board assembly includes at least two signal processors, one of which is electrically connected to a first channel cable in the high-speed cable for processing first high-speed signal loss compensation; the other signal processor is electrically connected to a second channel cable in the high-speed cable for processing second high-speed signal loss compensation.

7. The electronic device according to any one of claims 1 to 6, characterized in that, The high-speed cable assembly also includes: A power connector is electrically connected to the circuit board assembly and to an external power source for the high-speed cable assembly; the external power source is used to supply power to the circuit board assembly.

8. The electronic device according to claim 7, characterized in that, The power connector is connected to the circuit board of the circuit board assembly to be electrically connected to the signal processor of the power connector circuit board assembly via the circuit board.

9. The electronic device according to any one of claims 1 to 8, characterized in that, The high-speed cable assembly also includes a protective device that covers the circuit board assembly.

10. The electronic device according to claim 9, characterized in that, The protective device can be detachably fastened to the circuit board of the circuit board assembly, or the protective device and the circuit board can be constructed as an integral injection molded part; The protection device and the circuit board form an accommodating space, and the signal processor of the circuit board assembly is housed within the accommodating space.

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