Adaptive load server liquid cooling heat dissipation method and device

By setting up an independent heat dissipation area and a thermal deformation element inside the server cold plate, the problem of uneven cooling in the liquid cooling system is solved, achieving efficient and reliable heat dissipation and improved energy efficiency.

CN122111191APending Publication Date: 2026-05-29JINENG NUCLEAR (NANJING) COMPUTER TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
JINENG NUCLEAR (NANJING) COMPUTER TECHNOLOGY CO LTD
Filing Date
2026-02-10
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

In existing server liquid cooling systems, the coolant flow channels are fixed and cannot adapt to the dynamic and uneven thermal loads of multiple chips in real time. This results in insufficient cooling in high-load areas, forming local hot spots, and deteriorating the overall energy efficiency ratio.

Method used

Multiple independent heat dissipation areas are set inside the cold plate, each area is equipped with a branch coolant flow path, and thermal deformation elements are embedded in the flow path. The flow rate is adjusted in real time by sensing the temperature change of the area, and adaptive cooling is achieved in combination with an intelligent control system.

Benefits of technology

It achieves precise flow regulation in each heat dissipation area, suppresses local hot spots, improves heat dissipation efficiency and reliability, reduces energy consumption, and enhances the overall energy efficiency ratio.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application relates to the technical field of server heat dissipation, and discloses a server liquid cooling heat dissipation method and device with self-adaptive load, which comprises the following steps: configuring independent branch cooling liquid flow paths for each heat dissipation area in a cold plate, and integrating a thermal deformation element which is thermally coupled with the heat dissipation area in each flow path; the deformation element directly senses the area temperature and generates deformation, independently adjusts the flow area of the flow path, realizes real-time and accurate matching between the cooling liquid flow and the chip heat load, realizes self-adaptive heat dissipation, effectively eliminates local hot spots, reduces the system pump power loss, improves the overall energy efficiency and reliability, and solves the problems of local overheating and low overall energy efficiency caused by the fact that the fixed flow channel cannot adapt to the dynamic heat load of the chip in the existing cold plate type liquid cooling.
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