Touch component, touch structure and electronic device

Abstract

The application discloses a touch assembly, a touch structure and an electronic device, and relates to the technical field of electronic devices. The touch assembly comprises a touch panel unit, a pull-tab adhesive unit and a carrier unit. The pull-tab adhesive unit comprises a first adhesive surface and a second adhesive surface. The first adhesive surface is provided with a first back adhesive, and the second adhesive surface is provided with a second back adhesive. The carrier unit is provided with a window. The first adhesive surface of the pull-tab adhesive unit is attached to the touch panel unit through the first back adhesive. The second adhesive surface of the pull-tab adhesive unit is attached to the first surface of the carrier unit through the second back adhesive, and is attached to the second surface of the carrier unit through the window. According to the application, the pull-tab adhesive unit can not only attach the touch panel unit to the carrier unit, but also can directly pull the pull-tab adhesive unit when disassembly is required, so that the touch panel unit and the carrier unit can be separated, without thermal deformation, fast and convenient disassembly, no adhesive residue, and greatly improved reassembly efficiency of the touch panel assembly.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, and more specifically, to a touch component, touch structure, and electronic device. Background Technology

[0002] With the advancement of technology, electronic devices have become widely used in people's daily lives. Examples include smartphones, tablets, and laptops. To facilitate user operation, electronic devices are generally equipped with touch controls, allowing users to control the device through these touch components.

[0003] In the assembly process of electronic devices, touchpads are typically bonded to the carrier component using silicone pads. When the touchpad or carrier component malfunctions and needs to be disassembled, the high viscosity of the silicone pads can damage the touchpad if removed directly. Therefore, heating is usually used to reduce the adhesiveness of the silicone pads before applying external force to remove the touchpad. However, heating often causes thermal deformation of the touchpad and carrier component, and external force can easily damage the touchpad. Furthermore, silicone pad residue remains after disassembly, affecting subsequent reassembly. This requires the use of a descaling agent to completely remove the silicone pad residue, significantly impacting the efficiency of reassembly and reuse of the touchpad.

[0004] Therefore, how to make the touchpad easy to disassemble and leave no silicone pad residue has become an urgent problem to be solved. Summary of the Invention

[0005] This application provides a touch component, touch structure, and electronic device. By using an easy-pull adhesive unit to bond the touch panel unit and the carrier unit, the touch panel unit and the carrier unit will not undergo thermal deformation, are easy to disassemble, and leave no adhesive residue, thereby effectively improving the reusability and assembly efficiency of the touch panel component.

[0006] To achieve the above objectives, this application adopts the following technical solution:

[0007] In a first aspect, a touch assembly is provided, including a touchpad unit, an adhesive strip unit, and a carrier unit. The adhesive strip unit includes a first adhesive surface and a second adhesive surface; the first adhesive surface has a first backing adhesive, and the second adhesive surface has a second backing adhesive. The carrier unit has a window. The first adhesive surface of the adhesive strip unit is bonded to the touchpad unit via the first backing adhesive. The second adhesive surface of the adhesive strip unit is bonded to the first surface of the carrier unit via the second backing adhesive, and also bonded to the second surface of the carrier unit through the window.

[0008] In this embodiment, the first adhesive surface of the easy-pull adhesive unit is bonded to the touch panel unit via a first adhesive backing, and the second adhesive surface of the easy-pull adhesive unit is bonded to the first and second surfaces of the carrier unit via a second adhesive backing. When disassembly is required, the easy-pull adhesive unit can be directly pulled tight on the second surface of the carrier unit to separate the touch panel unit from the carrier unit. This not only prevents thermal deformation and makes disassembly quick and convenient, but also leaves no adhesive residue on the touch panel unit and the carrier unit.

[0009] In conjunction with the first aspect, in some implementations of the first aspect, the second adhesive includes a first part of adhesive and a second part of adhesive, the first part of adhesive is bonded to the first surface of the carrier unit, and the second part of adhesive is bonded to the second surface of the carrier unit; the window is located in the projection area of ​​the second part of adhesive on the first surface of the carrier unit, so that the second part of adhesive is folded over and passes through the window to bond to the second surface of the carrier unit.

[0010] In this embodiment, the first part of the second adhesive backing is bonded to the first side of the carrier unit, and the second part of the second adhesive backing passes through the projection window on the carrier unit and folds over the second side of the carrier unit. This allows the easy-pull adhesive unit and the carrier unit to be bonded together with the second adhesive backing, while also providing a disassembly port so that workers can separate the carrier unit and the touchpad unit through the second part of the adhesive backing on the second side of the carrier unit.

[0011] In conjunction with the first aspect, in some implementations of the first aspect, the length of the first adhesive backing is less than the length of the second adhesive backing.

[0012] In this embodiment, since the first adhesive is used to bond the control panel unit and the second adhesive is used to bond both sides of the carrier unit, the length of the first adhesive is less than the length of the second adhesive.

[0013] In conjunction with the first aspect, in some implementations of the first aspect, the easy-pull adhesive unit includes multiple units, and the carrier unit also has multiple windows correspondingly.

[0014] In this implementation, multiple easy-pull adhesive units can be provided to adhere to multiple points on the control panel unit. Therefore, the carrier unit can also have multiple windows correspondingly, allowing the second adhesive backing of the easy-pull adhesive units to pass through the serial port and adhere to the second surface of the carrier unit.

[0015] In conjunction with the first aspect, in some implementations of the first aspect, the easy-pull adhesive unit has a tear handle on the second side of the carrier unit.

[0016] In this implementation, the easy-pull adhesive unit has a tear handle on the second side of the carrier unit, so that the operator can disassemble the easy-pull adhesive unit by tearing the handle, thereby separating the touch panel unit and the carrier unit.

[0017] In conjunction with the first aspect, in some implementations of the first aspect, the carrier unit includes an intermediate structural component and a first complete structural component. The touchpad unit is bonded to the intermediate structural component via an adhesive strip, and the intermediate structural component is secured to the first complete structural component by screws.

[0018] In this implementation, the intermediate structural component can be a small structural component. The touch panel unit is bonded to the intermediate structural component, which is then screwed to the first complete structural component, thereby facilitating the assembly and disassembly of the complete machine.

[0019] In conjunction with the first aspect, in some implementations of the first aspect, the carrier unit includes a second overall structural component, and the touch panel unit is bonded to the second overall structural component by an easy-pull adhesive unit.

[0020] In this embodiment, the touchpad unit is directly bonded to the second structural component via an easy-pull adhesive unit, thereby reducing intermediate connection structures and reducing the weight and thickness of the entire device.

[0021] In conjunction with the first aspect, in some implementations of the first aspect, the touchpad unit includes a printed circuit board and a touch sensor. The touch sensor is disposed on the side of the printed circuit board near the adhesive unit and is bonded to the first adhesive backing of the adhesive unit. The touch sensor is used to acquire a user's touch press operation; the printed circuit board is used to acquire a touch press command based on the touch press operation.

[0022] In this implementation, the user's touch press operation is acquired through a touch sensor. The printed circuit board is used to obtain the touch press command based on the user's touch press operation in order to perform the corresponding action.

[0023] Optionally, the touch sensor includes a touch sensor and a pressure sensor.

[0024] In conjunction with the first aspect, in some implementations of the first aspect, the touchpad unit further includes a vibration feedback unit; the vibration feedback unit is attached to the side of the printed circuit board near the adhesive unit. The vibration feedback unit is used to provide tactile vibration feedback.

[0025] In this implementation, when a user touches the touchpad unit, tactile vibration feedback is provided through a vibration feedback device to enhance the user experience.

[0026] Optionally, the vibration feedback device includes one or more of a motor or a piezoelectric ceramic vibrator.

[0027] In conjunction with the first aspect, in some implementations of the first aspect, the touchpad unit further includes a protective cover plate disposed on the side of the printed circuit board away from the adhesive strip unit. The protective cover plate serves to protect the printed circuit board and the touch sensor and provides a consistent aesthetic appearance with the overall device.

[0028] In this embodiment, the protective cover is used to protect the printed circuit board and touch sensor from external physical damage, dust and liquid intrusion, and to extend the service life of the printed circuit board and touch sensor.

[0029] Optionally, the protective cover may include one or more of the following: a glass cover, a Mylar membrane, and a fiberglass board.

[0030] Secondly, a touch structure is provided, including the aforementioned touch component and a housing module, wherein the touch component is disposed in the housing module.

[0031] In this embodiment, the housing module provides a supporting housing for the touch structure. The easy-pull adhesive unit of the touch component is used to bond the touch panel unit and the carrier unit, so that the touch panel unit and the carrier unit will not undergo thermal deformation, are easy to disassemble and have no adhesive residue, effectively improving the reusability and assembly efficiency of the touch structure.

[0032] Optionally, the housing module includes the palm rest portion of the laptop.

[0033] Thirdly, an electronic device is provided, including the aforementioned touch structure and a display module; the display module is connected to the touch structure. The display module is used to display the control content of the touch structure.

[0034] In this embodiment, a touch control terminal is provided for the electronic device through a touch structure, and a display port is provided for the electronic device through a display module. The touch control panel unit and the carrier unit are bonded by the easy-pull adhesive unit in the touch structure, so that the touch control panel unit and the carrier unit will not undergo thermal deformation, are easy to disassemble and have no adhesive residue, effectively improving the reusability and assembly efficiency of the electronic device. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of a scenario for a mobile communication system to which this application embodiment applies;

[0036] Figure 2 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0037] Figure 3 This is a schematic diagram of the structure of a touchpad provided in an embodiment of this application;

[0038] Figure 4 This is a schematic diagram of the structure of a silicone pad provided in an embodiment of this application;

[0039] Figure 5 This is a schematic diagram illustrating the disassembly of a touchpad provided in an embodiment of this application;

[0040] Figure 6 This is a schematic diagram of the structure of a touch component provided in an embodiment of this application;

[0041] Figure 7 This is a schematic diagram illustrating the disassembly of a touch component provided in an embodiment of this application;

[0042] Figure 8 This is a schematic diagram of the structure of an easy-pull adhesive unit provided in an embodiment of this application;

[0043] Figure 9 This is a schematic diagram of the bonding of an easy-pull adhesive unit provided in an embodiment of this application;

[0044] Figure 10 This is a schematic diagram of the structure of a carrier unit provided in an embodiment of this application;

[0045] Figure 11 This is a schematic diagram of the structure of a carrier unit provided in another embodiment of this application;

[0046] Figure 12 This is a schematic diagram of the structure of a carrier unit provided in another embodiment of this application;

[0047] Figure 13 This is a schematic diagram of the structure of a touchpad unit provided in an embodiment of this application;

[0048] Figure 14 This is a schematic diagram of the structure of a touchpad unit provided in another embodiment of this application;

[0049] Figure 15 This is a schematic diagram of the structure of a touchpad unit provided in another embodiment of this application;

[0050] Figure 16 This is a schematic diagram of a touch structure provided in an embodiment of this application;

[0051] Figure 17 This is a schematic diagram of the structure of another electronic device provided in this application embodiment. Detailed Implementation

[0052] The technical solutions in the embodiments of this application will be clearly and thoroughly described below with reference to the accompanying drawings. In the description of the embodiments of this application, unless otherwise stated, " / " means "or," for example, A / B can mean A or B; the word "and / or" in the text is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone.

[0053] The terms "first," "second," etc., are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0054] To facilitate understanding of the embodiments of this application, the relevant concepts involved in the embodiments of this application will be briefly explained first.

[0055] 1. Printed circuit board assembly (PCBA).

[0056] In the electronics field, PCBA refers to a type of printed circuit board assembly. In the manufacturing of electronic devices, the circuit board is not only a fundamental component but also embodies the design and structure of the entire device. PCBA encompasses the soldering and assembly of components such as printed circuit boards (PCBs), through-hole components, and surface mount technology (SMT) parts, completed through various processes such as solder paste printing, SMT, through-hole component insertion, and automatic optical inspection (AOI).

[0057] 2. Easy-pull adhesive.

[0058] Easy-pull adhesive tape is a high-performance, removable adhesive tape for securing and removing electronic devices. Also known as stretch adhesive tape, it reduces its stickiness by stretching, allowing it to be peeled off. Because it's commonly used in mobile phone battery components, it's also called battery adhesive. Easy-pull adhesive tape boasts extremely high bonding strength, and its excellent anti-pull and shock-resistant properties greatly ensure a secure battery bond. Its key features are: it firmly bonds the battery to the device body, and when the battery needs to be removed, the tape can be easily removed by stretching the end, leaving no residue.

[0059] The above is a brief introduction to the terms used in the embodiments of this application, and will not be repeated below.

[0060] Before providing a detailed explanation of the touch components provided in the embodiments of this application, the application scenarios and related technologies of the electronic devices will be described first.

[0061] Figure 1 This is a schematic diagram of a scenario for a mobile communication system to which an embodiment of this application applies. For example... Figure 1As shown, users can communicate with base station 20 using electronic device 10. This application does not specifically limit the type of electronic device 10. In some embodiments, electronic device 10 can be a mobile phone, wearable device (e.g., smart bracelet, smartwatch, earphones, etc.), tablet computer, laptop computer, handheld computer, ultra-mobile personal computer (UMPC), cellular phone, personal digital assistant (PDA), augmented reality (AR) / virtual reality (VR) device, or other IoT (Internet of Things) devices. It can also be a television, large screen, printer, projector, etc. For ease of understanding, the following embodiments use a mobile phone as an example for illustrative purposes.

[0062] Figure 2 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Figure 2 As shown in the embodiments of this application, the electronic device 10 may include a processor 110, an external memory interface 120, an internal memory 121, a universal serial bus (USB) interface 130, a charging management module 140, a power management module 141, a battery 142, a first antenna 1, a second antenna 2, a mobile communication module 150, a wireless communication module 160, an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, a headphone jack 170D, a sensor module 180, a button 190, a motor 191, an indicator 192, a camera 193, a display screen 194, and a subscriber identification module (SIM) card interface 195, etc. The sensor module 180 may include a pressure sensor 180A, a gyroscope sensor 180B, a barometric pressure sensor 180C, a magnetic sensor 180D, an accelerometer sensor 180E, a distance sensor 180F, a proximity sensor 180G, a fingerprint sensor 180H, a temperature sensor 180J, a touch sensor 180K, an ambient light sensor 180L, a bone conduction sensor 180M, etc.

[0063] It should be noted that, Figure 2 The structure shown does not constitute a specific limitation on the electronic device. In other embodiments of this application, the electronic device may include a... Figure 2 The components shown may include more or fewer components, or the electronic device may include... Figure 2The components shown may be a combination of certain components, or the electronic device may include... Figure 2 Sub-components of some of the components shown. Figure 2 The components shown can be implemented in hardware, software, or a combination of both.

[0064] Processor 110 may include one or more processing units. For example, processor 110 may include at least one of the following processing units: application processor (AP), modem processor, graphics processing unit (GPU), image signal processor (ISP), controller, video codec, digital signal processor (DSP), baseband processor, and neural network processing unit (NPU). These different processing units may be independent devices or integrated devices. The controller can generate operation control signals based on instruction opcodes and timing signals to control instruction fetching and execution.

[0065] The processor 110 may also include a memory for storing instructions and data. In some embodiments, the memory in the processor 110 is a cache memory. This memory can store instructions or data that the processor 110 has just used or that are used repeatedly. If the processor 110 needs to use the instruction or data again, it can retrieve it directly from the memory. This avoids repeated accesses, reduces the waiting time of the processor 110, and thus improves the efficiency of the system.

[0066] In some embodiments, processor 110 may include one or more interfaces. For example, processor 110 may include at least one of the following interfaces: an inter-integrated circuit (I2C) interface, an inter-integrated circuit sound (I2S) interface, a pulse code modulation (PCM) interface, a universal asynchronous receiver / transmitter (UART) interface, a mobile industry processor interface (MIPI), a general-purpose input / output (GPIO) interface, a SIM interface, and a USB interface.

[0067] USB interface pin 130 is used to connect with other devices, thereby enabling electronic device 10 to communicate with the outside world or perform charging functions. For example, it supports various charging protocols, On-the-Go (OTG) USB functionality, analog headset functionality, digital headset functionality, and DisplayPort (DP) projection functionality, etc. For instance, USB interface pin 130 can be a Type-C interface.

[0068] Figure 2 The connection relationships between the modules shown are merely illustrative and do not constitute a limitation on the connection relationships between the modules of the electronic device 10. Optionally, the modules of the electronic device 10 may also adopt a combination of various connection methods described in the above embodiments.

[0069] The charging management module 140 receives power from the charger. While charging the battery 142, the charging management module 140 can also power electronic devices via the power management module 141. The power management module 141 connects the battery 142, the charging management module 140, and the processor 110. The power management module 141 receives input from the battery 142 and / or the charging management module 140, and powers the processor 110, internal memory 121, display screen 194, camera 193, and wireless communication module 160, etc. The power management module 141 can also monitor parameters such as battery capacity, battery cycle count, and battery health status (e.g., leakage current, impedance). Optionally, the power management module 141 can be located within the processor 110, or the power management module 141 and the charging management module 140 can be located in the same device.

[0070] The wireless communication function of electronic device 10 can be implemented through devices such as a first antenna 1, a second antenna 2, a mobile communication module 150, a wireless communication module 160, a modem processor, and a baseband processor. The first antenna 1 and the second antenna 2 are used to transmit and receive electromagnetic wave signals. Each antenna in electronic device 10 can be used to cover one or more communication frequency bands. Different antennas can also be reused to improve antenna utilization.

[0071] The mobile communication module 150 can provide a wireless communication solution for use in electronic devices, such as at least one of the following: a second-generation (2G) mobile communication solution, a third-generation (3G) mobile communication solution, a fourth-generation (5G) mobile communication solution, or a fifth-generation (5G) mobile communication solution.

[0072] The modem processor may include a modulator and a demodulator. The modulator modulates a low-frequency baseband signal to be transmitted into a mid-to-high frequency signal. The demodulator demodulates a received electromagnetic wave signal into a low-frequency baseband signal. The demodulator then transmits the demodulated low-frequency baseband signal to the baseband processor for processing. After processing by the baseband processor, the low-frequency baseband signal is transmitted to the application processor. The application processor outputs sound signals through audio devices (e.g., speaker 170A, receiver 170B) or displays images or videos through the display screen 194. In some embodiments, the modem processor may be a separate device. In other embodiments, the modem processor may be independent of the processor 110 and may be housed in the same device as the mobile communication module 150 or other functional modules.

[0073] Similar to the mobile communication module 150, the wireless communication module 160 can also provide wireless communication solutions for use in electronic devices, such as at least one of the following: wireless local area networks (WLAN), Bluetooth (BT), Bluetooth Low Energy (BLE), ultra-wideband (UWB), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), and infrared (IR) technology.

[0074] In some embodiments, the antenna 1 of the electronic device is coupled to the mobile communication module 150, and the antenna 2 of the electronic device is coupled to the wireless communication module 160, enabling the electronic device to communicate with the network and other electronic devices via wireless communication technology.

[0075] Electronic device 10 can implement display functions through a GPU, a display screen 194, and an application processor. The GPU is a microprocessor for image processing, connected to the display screen 194 and the application processor. The GPU is used to perform mathematical and geometric calculations and for graphics rendering. Processor 110 may include one or more GPUs, which execute program instructions to generate or modify display information.

[0076] In some embodiments, the first antenna 1 of the electronic device is coupled to the mobile communication module 150, and the second antenna 2 of the electronic device is coupled to the wireless communication module 160, enabling the electronic device to communicate with the network and other electronic devices via wireless communication technology.

[0077] The external storage interface 120 can be used to connect an external memory card, such as a secure digital (SD) card, to expand the storage capacity of the electronic device. The external memory card communicates with the processor 110 through the external storage interface 120 to perform data storage functions. For example, music, video, and other files can be saved on the external memory card.

[0078] Internal memory 121 can be used to store executable program code, including instructions. Internal memory 121 may include a program storage area and a data storage area. Internal memory 121 may be volatile memory or non-volatile memory, or both. Non-volatile memory may be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. Volatile memory may be random access memory (RAM), which serves as an external cache. By way of example, but not limitation, many forms of RAM are available, such as static random access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDR SDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous linked dynamic random access memory (SLDRAM), and direct rambus RAM (DR RAM).

[0079] The display screen 194 can be used to display images or videos. Optionally, the display screen 194 includes a display panel. The display panel can be a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode (AMOLED), a flexible light-emitting diode (FLED), a mini light-emitting diode (Mini LED), a micro light-emitting diode (Micro LED), a micro OLED, or a quantum dot light-emitting diode (QLED). In some embodiments, the electronic device 10 may include one or N displays 194, where N is a positive integer greater than 1.

[0080] In some embodiments, pressure sensor 180A may be disposed on display screen 194. Pressure sensor 180A can be of many types, such as resistive pressure sensor, inductive pressure sensor, or capacitive pressure sensor. A capacitive pressure sensor may include at least two parallel plates with conductive material. When force is applied to pressure sensor 180A, the capacitance between the electrodes changes, and the electronic device determines the pressure intensity based on the change in capacitance. When a touch operation is applied to display screen 194, the electronic device detects the touch operation based on pressure sensor 180A. The electronic device may also calculate the touch position based on the detection signal from pressure sensor 180A. In some embodiments, touch operations applied to the same touch position but with different touch operation intensities may correspond to different operation commands. For example, when a touch operation with an intensity less than a first pressure threshold is applied to the SMS application icon, a command to view an SMS message is executed; when a touch operation with an intensity greater than or equal to the first pressure threshold is applied to the SMS application icon, a command to create a new SMS message is executed.

[0081] The fingerprint sensor 180H is used to collect fingerprints. Electronic devices can use the collected fingerprint characteristics to unlock devices, access app locks, take photos, and answer calls.

[0082] Touch sensor 180K, also known as a touch device, can be disposed on display screen 194. The touch sensor 180K and display screen 194 together form a touchscreen, also known as a touch screen. Touch sensor 180K is used to detect touch operations applied to or near it. Touch sensor 180K can transmit the detected touch operation to the application processor to determine the type of touch event. Visual output related to the touch operation can be provided through display screen 194. In other embodiments, touch sensor 180K may also be disposed on the surface of the electronic device and in a different location from display screen 194.

[0083] Button 190 includes a power button and volume buttons. Button 190 can be a mechanical button or a touch button. The electronic device can receive button input signals and realize functions related to the button input signals.

[0084] The following is combined with Figures 3 to 5 This article provides a detailed explanation of the problems that traditional touchpads are prone to thermal deformation and silicone pad residue during disassembly.

[0085] Figure 3 This is a schematic diagram of the structure of a touchpad provided in an embodiment of this application. Figure 3 As shown, in one embodiment of this application, a touchpad 30 and a carrier 40 for a laptop computer are provided. The touchpad 30 includes a PCBA 301, a cover plate 302, a sensor 303, a actuator 304, and a silicone pad 305. The PCBA 301 is used to support various electronic components. The cover plate 302 is disposed on top of the PCBA 301. The cover plate 302 is used to protect the various electronic components below. The sensor 303 and the actuator 304 are disposed below the PCBA 301. Exemplarily, the sensor 303 may include a touch sensor, a pressure sensor, etc. The sensor 303 is used to detect user touch operations. The actuator 304 is used to provide vibration feedback when the user operates. The silicone pad 305 has adhesive on both sides. The adhesive on one side of the silicone pad 305 is bonded to the sensor 303. The adhesive on the other side of the silicone pad 305 is bonded to the carrier 40, thereby attaching the sensor 303 to the carrier 40.

[0086] Figure 4 This is a schematic diagram of the structure of a silicone pad provided in an embodiment of this application. Figure 4 As shown, in one embodiment of this application, the silicone pad 305 has adhesive backing on both sides. Figure 4 As shown in (a), the first side of the silicone pad 305 includes a silicone pad body 3051 and a first adhesive backing 3052. The first adhesive backing 3052 is bonded to the first side of the silicone pad body 3051, which can be used to bond the silicone pad body 3051 to the sensor 303. Figure 4As shown in (b), the second side of the silicone pad 305 includes a silicone pad body 3051 and a second adhesive backing 3053. The second side of the silicone pad body 3051 is bonded with the second adhesive backing 3053, which can be used to bond the silicone pad body 3051 to the carrier 40.

[0087] It should be noted that the dimensions of the first adhesive backing 3052 and the second adhesive backing 3053 are basically the same as the dimensions of the sensor 303.

[0088] It should be understood that before attaching the sensor 303 to the first adhesive backing 3052 and the carrier 40 to the second adhesive backing 3053, a backing film with a tear handle (e.g., release paper) can be attached to the first adhesive backing 3052 and the second adhesive backing 3053 so that the operator can remove the backing film by tearing it off. Then, the silicone pad 305 is bonded to the sensor 303 using the first adhesive backing 3052, and the silicone pad 305 is bonded to the carrier 40 using the second adhesive backing 3053.

[0089] When assembling the touchpad 30 and the carrier 40 of a laptop, due to the high requirements for the overall appearance, the process of gluing the touchpad 30 to the carrier 40 can easily lead to uneven gaps in the assembly, often requiring re-gluing and reassembling of the touchpad 30. Alternatively, if the touchpad 30 or the carrier 40 malfunctions, it is also necessary to disassemble the touchpad 30 and re-glu it.

[0090] Figure 5 This is a schematic diagram illustrating the disassembly of a touchpad provided in an embodiment of this application. Figure 5 As shown in one embodiment of this application, during the separation of the touchpad 30 from the carrier 40, due to the high viscosity of the silicone pad 305, it is usually necessary to use an air gun or heating rod on one side of the carrier 40, through a metal block 306 (e.g., a copper block), to reduce the adhesiveness of the backing of the silicone pad 305. Then, a suction cup 307 is used on one side of the touchpad 30 to apply external force to disassemble the touchpad 30. However, during the disassembly process, due to the heating effect, the touchpad 30 and the carrier 40 usually undergo thermal deformation, which leads to changes in the appearance and dimensions of the touchpad 30 and the carrier 40, and the external force can easily damage the touchpad 30. At the same time, after the touchpad 30 and the carrier 40 are separated, because there is still silicone pad 305 residue on the touchpad 30 and the carrier 40, the adhesive strength of the touchpad 30 and the carrier 40 is still high, affecting the subsequent reassembly process of the touchpad. Unless the silicone pad 305 is completely removed using a descaling agent (such as alcohol or acetone), the reusability and assembly efficiency of the touchpad 30 is greatly reduced.

[0091] In view of this, the present application provides a touch component that not only bonds the touch panel unit to the carrier unit through an easy-pull adhesive unit, but also allows the touch panel unit to be separated from the carrier unit simply by pulling the easy-pull adhesive unit when disassembly is required. The disassembly is quick, convenient and leaves no adhesive residue, which greatly improves the reusability and assembly efficiency of the touch panel component.

[0092] The following is combined with Figures 6 to 15 This paper provides a detailed introduction to the solution of using easy-pull adhesive unit to bond the control panel unit and the carrier unit.

[0093] Figure 6 This is a schematic diagram of the structure of a touch component provided in an embodiment of this application. Figure 7 This is a schematic diagram illustrating the disassembly of a touch component provided in an embodiment of this application. Figure 6 As shown, in one embodiment provided in this application, the touch component 50 includes a touchpad unit 501, an adhesive strip unit 502, and a carrier unit 503. The adhesive strip unit 502 includes a first adhesive surface and a second adhesive surface. The first adhesive surface is provided with a first adhesive backing 5021, and the second adhesive surface is provided with a second adhesive backing 5022. The carrier unit 503 has a window. The first adhesive surface of the adhesive strip unit 502 is bonded to the touchpad unit 501 via the first adhesive backing 5021. The second adhesive surface of the adhesive strip unit 502 is bonded to the first surface of the carrier unit 503 via the second adhesive backing 5022, and also bonded to the second surface of the carrier unit 503 through the window.

[0094] In this embodiment, the first adhesive 5021 on the first adhesive surface of the easy-pull adhesive unit 502 is used to bond the touch panel unit 501. The second adhesive 5022 on the second adhesive surface of the easy-pull adhesive unit 502 is used to bond the carrier unit 503, thereby bonding the touch panel unit 501 and the carrier unit 503 together through the easy-pull adhesive unit 502. Figure 7 As shown, when it is necessary to disassemble the touchpad unit 501, simply pull the adhesive unit 502 along the disassembly pulling direction to remove it completely, thus completing the separation process of the touchpad unit 501 and the carrier unit 503. This method of disassembling the touchpad unit 501 is not only quick and convenient, reducing disassembly difficulties caused by excessive adhesive strength, but also prevents thermal deformation of the touchpad unit 501 and the carrier unit 503. Furthermore, due to the characteristics of the adhesive unit 502, no adhesive residue remains on the touchpad unit 501 and the carrier unit 503, eliminating the need for adhesive remover. When reassembling the touchpad unit 501 or the carrier unit 503, this method can be used directly, greatly improving the efficiency of reassembly.

[0095] The structure of the easy-open adhesive unit will be described in detail below.

[0096] Figure 8 This is a schematic diagram of the structure of an easy-pull adhesive unit provided in an embodiment of this application. Figure 8 As shown, in one implementation of this application embodiment, the touch component 50 may include a touchpad unit 501, an adhesive strip unit 502, and a carrier unit 503. The adhesive strip unit 502 includes a first adhesive surface and a second adhesive surface. The first adhesive surface has a first adhesive backing 5021, and the second adhesive surface has a second adhesive backing 5022. The carrier unit 503 has a window. The first adhesive surface of the adhesive strip unit 502 is bonded to the touchpad unit 501 via the first adhesive backing 5021. The second adhesive surface of the adhesive strip unit 502 is bonded to the first surface of the carrier unit 503 via the second adhesive backing 5022, and also bonded to the second surface of the carrier unit 503 through the window. In this application embodiment, the first adhesive backing 5021 of the first adhesive surface of the adhesive strip unit 502 is used to bond the touchpad unit 501. The second adhesive 5022 on the second adhesive surface of the easy-pull adhesive unit 502 is used to bond the carrier unit 503, thereby bonding the touch panel unit 501 and the carrier unit 503 through the easy-pull adhesive unit 502.

[0097] It should be noted that the easy-pull adhesive unit 502 includes a first adhesive surface (Top) and a second adhesive surface (Bottom). The first adhesive surface and the second adhesive surface are located on two sides of the easy-pull adhesive unit, respectively. The first adhesive surface has a first adhesive backing 5021, and the second adhesive surface has a second adhesive backing 5022. The first adhesive backing 5021 is used to bond the easy-pull adhesive unit 502 to the touchpad unit 501. The second adhesive backing 5022 is used to bond the easy-pull adhesive unit 502 to the first surface of the carrier unit 503, and also passes through the window opened in the carrier unit 503 to bond to the second surface of the carrier unit 503. Therefore, when it is necessary to separate the touchpad unit 501 and the carrier unit 503, the easy-pull adhesive unit 502 can be pulled tightly on the second surface of the carrier unit 503 (i.e., the side where the touchpad unit 501 is not located) to separate the touchpad unit 501 and the carrier unit 503. The disassembly method is not only quick and convenient, reducing disassembly difficulties caused by excessive adhesive strength, but also prevents thermal deformation of the touchpad unit 501 and the carrier unit 503. Furthermore, due to the characteristics of the easy-pull adhesive unit 502, no adhesive residue remains on the touchpad unit 501 and the carrier unit 503, eliminating the need for adhesive remover. When the touchpad unit 501 or the carrier unit 503 is reused in assembly, this method can be used directly, significantly improving the efficiency of reusable assembly of the touchpad unit 501 or the carrier unit 503.

[0098] Optionally, the length of the first adhesive 5021 can be less than the length of the second adhesive 5022. Since the first adhesive 5021 is used to bond one side of the control panel unit 501, and the second adhesive 5022 is used to bond the first and second sides of the carrier unit 503, the length of the first adhesive 5021 can be less than the length of the second adhesive 5022.

[0099] Figure 9 This is a schematic diagram illustrating the bonding of an easy-release adhesive unit according to an embodiment of this application. In one implementation of this application embodiment, the touch component 50 includes a touch panel unit 501, an easy-release adhesive unit 502, and a carrier unit 503. The easy-release adhesive unit 502 includes a first adhesive surface and a second adhesive surface. The first adhesive surface is provided with a first backing adhesive 5021, and the second adhesive surface is provided with a second backing adhesive 5022. The carrier unit 503 has a window. The first adhesive surface of the easy-release adhesive unit 502 is bonded to the touch panel unit 501 through the first backing adhesive 5021. The second adhesive surface of the easy-release adhesive unit 502 is bonded to the first surface of the carrier unit 503 through the second backing adhesive 5022, and is bonded to the second surface of the carrier unit 503 through the window. In this embodiment, the first backing adhesive 5021 of the first adhesive surface of the easy-release adhesive unit 502 is used to bond the touch panel unit 501. The second adhesive 5022 on the second adhesive surface of the easy-pull adhesive unit 502 is used to bond the carrier unit 503, thereby bonding the touch panel unit 501 and the carrier unit 503 through the easy-pull adhesive unit 502.

[0100] It should be noted that, as Figure 9 As shown in (a), the carrier unit 503 has a window. The easy-pull adhesive unit 502 is used to adhere to the carrier unit 503. Figure 9 As shown in (b), the second adhesive 5022 of the easy-pull adhesive unit 502 includes a first adhesive portion 50221 and a second adhesive portion 50222. It should be understood that both the first adhesive portion 50221 and the second adhesive portion 50222 are located on the side of the easy-pull adhesive unit 502 near the carrier unit 503. Specifically, the first adhesive portion 50221 is adhered to the first surface of the carrier unit 503, and the second adhesive portion 50222 is folded through a window in the carrier unit 503 and adhered to the second surface of the carrier unit 503. It should be noted that, to facilitate the folding of the second adhesive portion 50222 through the window in the carrier unit 503, the window in the carrier unit 503 is positioned within the projection area of ​​the second adhesive portion 50222 onto the first surface of the carrier unit 503, thus allowing the second adhesive portion 50222 to be folded and adhered to the second surface of the carrier unit 503 through the window.

[0101] like Figure 9As shown in (c), when the second part of the adhesive 50222 is folded over and adhered to the second side of the carrier unit 503 through the window, only the easy-pull adhesive unit 502 adhered to by the first part of the adhesive 50221 can be seen on the first side of the carrier unit 503. Figure 9 As shown in (d), when the second part of the adhesive 50222 is folded over and adhered to the second side of the carrier unit 503 through the window, the easy-pull adhesive unit 502 adhered to by the second part of the adhesive 50222 can be seen on the second side of the carrier unit 503. When it is necessary to disassemble the touch panel unit 501 and the carrier unit 503, simply pull the end of the easy-pull adhesive unit 502 exposed on the second side of the carrier unit 503 to completely remove the easy-pull adhesive unit 502 and separate the touch panel unit 501 and the carrier unit 503. The disassembly method is quick and convenient, reducing the disassembly difficulties caused by excessive adhesive strength, and preventing thermal deformation of the touch panel unit 501 and the carrier unit 503. At the same time, no adhesive residue is left on the touch panel unit 501 and the carrier unit 503, greatly improving the reusability and assembly efficiency of the touch panel unit 501 or the carrier unit 503.

[0102] It should be noted that the easy-pull adhesive unit 502 may also be provided with a tear handle on the second side of the carrier unit 503, so as to facilitate the operation of the staff to pull and remove the easy-pull adhesive unit 502.

[0103] The structure of the load-bearing unit will be described in detail below.

[0104] Figure 10 This is a schematic diagram of the structure of a carrier unit provided in an embodiment of this application. Figure 10 As shown, in one implementation of this application embodiment, the touch component 50 includes a touchpad unit 501, an adhesive strip unit 502, and a carrier unit 503. The adhesive strip unit 502 includes a first adhesive surface and a second adhesive surface. The first adhesive surface has a first backing adhesive 5021, and the second adhesive surface has a second backing adhesive 5022. The carrier unit 503 has a window. The first adhesive surface of the adhesive strip unit 502 is bonded to the touchpad unit 501 via the first backing adhesive 5021. The second adhesive surface of the adhesive strip unit 502 is bonded to the first surface of the carrier unit 503 via the second backing adhesive 5022, and also bonded to the second surface of the carrier unit 503 through the window. In this application embodiment, the first backing adhesive 5021 of the first adhesive surface of the adhesive strip unit 502 is used to bond the touchpad unit 501. The second adhesive 5022 on the second adhesive surface of the easy-pull adhesive unit 502 is used to bond the carrier unit 503, thereby bonding the touch panel unit 501 and the carrier unit 503 through the easy-pull adhesive unit 502.

[0105] It should be noted that, in order to more securely attach the touchpad unit 501, or to attach multiple sensors on the touchpad unit 501, multiple adhesive units 502 may be included, and the carrier unit 503 also has correspondingly multiple windows. The first adhesive 5021 of each adhesive unit 502 is used to adhere to the touchpad unit 501. The first portion of the second adhesive 50221 of each adhesive unit 502 is adhered to the first surface of the carrier unit 503. The second portion of the second adhesive 50222 of each adhesive unit 502 is used to fold over from the window and adhere to the second surface of the carrier unit 503.

[0106] It should be understood that when the adhesive strip unit 502 is located at the edge of the carrier unit 503, the carrier unit 503 can be folded directly from its edge to its second side without needing to open a window. When it is necessary to disassemble the touchpad unit 501 and the carrier unit 503, simply pull the end of the adhesive strip unit 502 protruding from the second side of the carrier unit 503 to remove the adhesive strip unit 502 completely, thus separating the touchpad unit 501 and the carrier unit 503. This disassembly method is quick and convenient, reducing disassembly difficulties caused by excessive adhesive strength and preventing thermal deformation of the touchpad unit 501 and the carrier unit 503. Furthermore, no adhesive residue is left on the touchpad unit 501 and the carrier unit 503, greatly improving the reusability and assembly efficiency of either the touchpad unit 501 or the carrier unit 503.

[0107] Figure 11This is a schematic diagram of the structure of a carrier unit provided in another embodiment of this application. In one implementation of this application embodiment, the touch component 50 includes a touch panel unit 501, an easy-pull adhesive unit 502, and a carrier unit 503. The touch component 50 includes a touch panel unit 501, an easy-pull adhesive unit 502, and a carrier unit 503. The easy-pull adhesive unit 502 includes a first adhesive surface and a second adhesive surface. The first adhesive surface is provided with a first backing adhesive 5021, and the second adhesive surface is provided with a second backing adhesive 5022. The carrier unit 503 has a window. The first adhesive surface of the easy-pull adhesive unit 502 is bonded to the touch panel unit 501 through the first backing adhesive 5021. The second adhesive surface of the easy-pull adhesive unit 502 is bonded to the first surface of the carrier unit 503 through the second backing adhesive 5022, and is bonded to the second surface of the carrier unit 503 through the window. In this embodiment, the first adhesive 5021 on the first adhesive surface of the easy-pull adhesive unit 502 is used to bond the touch panel unit 501. The second adhesive 5022 on the second adhesive surface of the easy-pull adhesive unit 502 is used to bond the carrier unit 503, thereby bonding the touch panel unit 501 and the carrier unit 503 together through the easy-pull adhesive unit 502. When it is necessary to disassemble the touch panel unit 501, simply pull the easy-pull adhesive unit 502 tightly in the disassembly pulling direction to completely remove the easy-pull adhesive unit 502, completing the disassembly process of the touch panel unit 501 and the carrier unit 503. The disassembly method of the touch panel unit 501 is not only fast and convenient, reducing the disassembly difficulties caused by excessive adhesive strength, but also prevents thermal deformation of the touch panel unit 501 and the carrier unit 503. Moreover, due to the characteristics of the easy-pull adhesive unit 502, no adhesive residue remains on the touch panel unit 501 and the carrier unit 503, and there is no need to use an adhesive remover to remove adhesive residue. When the touchpad unit 501 or the carrier unit 503 is reused and assembled, it can be used directly, which greatly improves the reuse and assembly efficiency of the touchpad unit 501 or the carrier unit 503.

[0108] It should be noted that, as Figure 11As shown in (a), the carrier unit 503 includes an intermediate structural component 5031 and a first complete structural component 5032. During the assembly of the complete machine, the touch panel unit 501 is bonded to the small-sized intermediate structural component 5031 via an adhesive strip 502. The small-sized intermediate structural component 5031 is secured to the first complete structural component 5032 by screws 5033 or positioning pins. Exemplarily, during the process of bonding the touch panel unit 501 (e.g., PCBA, glass cover, pressure sensor, etc. can be assembled in the touch panel unit 501) to the small-sized intermediate structural component 5031 via the adhesive strip 502, due to the high dimensional accuracy requirements of the assembly of multiple electronic components (e.g., PCBA, glass cover, pressure sensor), misalignment problems are prone to occur, requiring reassembly. At the same time, multiple electronic components are also prone to malfunctions and need to be replaced. Therefore, using the adhesive strip 502 during the assembly of the small-sized intermediate structural component 5031 can improve disassembly efficiency. Therefore, a small-sized intermediate structural component 5031 is used to bond with the easy-pull adhesive unit 502, which not only improves the assembly efficiency of the whole machine, but also facilitates the disassembly process of the whole machine.

[0109] In addition, such as Figure 11 As shown in (b), in order to facilitate the fastening of the small-sized intermediate structural component 5031 to the first complete structural component 5032 using screws 5033 or positioning pins, threaded holes are generally required in both the small-sized intermediate structural component 5031 and the first complete structural component. It should also be noted that when the easy-pull adhesive unit 502 is close to the edge of the small-sized intermediate structural component 5031, it can be directly folded over and bonded to the other side of the small-sized intermediate structural component 5031 without the need for holes.

[0110] Figure 12This is a schematic diagram of the structure of a carrier unit provided in another embodiment of this application. In one implementation of this application embodiment, the touch component 50 includes a touch panel unit 501, an easy-pull adhesive unit 502, and a carrier unit 503. The touch component 50 includes a touch panel unit 501, an easy-pull adhesive unit 502, and a carrier unit 503. The easy-pull adhesive unit 502 includes a first adhesive surface and a second adhesive surface. The first adhesive surface is provided with a first backing adhesive 5021, and the second adhesive surface is provided with a second backing adhesive 5022. The carrier unit 503 has a window. The first adhesive surface of the easy-pull adhesive unit 502 is bonded to the touch panel unit 501 through the first backing adhesive 5021. The second adhesive surface of the easy-pull adhesive unit 502 is bonded to the first surface of the carrier unit 503 through the second backing adhesive 5022, and is bonded to the second surface of the carrier unit 503 through the window. In this embodiment, the first adhesive 5021 on the first adhesive surface of the easy-pull adhesive unit 502 is used to bond the touch panel unit 501. The second adhesive 5022 on the second adhesive surface of the easy-pull adhesive unit 502 is used to bond the carrier unit 503, thereby bonding the touch panel unit 501 and the carrier unit 503 together through the easy-pull adhesive unit 502. When it is necessary to disassemble the touch panel unit 501, simply pull the easy-pull adhesive unit 502 tightly in the disassembly pulling direction to completely remove the easy-pull adhesive unit 502, completing the disassembly process of the touch panel unit 501 and the carrier unit 503. The disassembly method of the touch panel unit 501 is not only fast and convenient, reducing the disassembly difficulties caused by excessive adhesive strength, but also prevents thermal deformation of the touch panel unit 501 and the carrier unit 503. Moreover, due to the characteristics of the easy-pull adhesive unit 502, no adhesive residue remains on the touch panel unit 501 and the carrier unit 503, and there is no need to use an adhesive remover to remove adhesive residue. When the touchpad unit 501 or the carrier unit 503 is reused and assembled, it can be used directly, which greatly improves the reuse and assembly efficiency of the touchpad unit 501 or the carrier unit 503.

[0111] It should be noted that, as Figure 12 As shown in (a), the carrier unit 503 includes a second overall structural component 5034. During the assembly of the entire machine, the touch panel unit 501 is directly bonded to the second overall structural component 5034 via an easy-pull adhesive unit 502. This direct bonding of the second overall structural component 5034 to the easy-pull adhesive unit 502 reduces intermediate structural components and is more conducive to thinning and weight reduction of the entire machine. Meanwhile, as... Figure 12 As shown in (b), when the easy-pull adhesive unit 502 is close to the edge of the second complete structural component 5034, it is not necessary to open a window; the edge of the second complete structural component 5034 can be directly folded over and glued to the other side of the second complete structural component 5034. It should be noted that the number of easy-pull adhesive units 502 can also be adjusted according to the actual needs of the touch panel unit 501.

[0112] The structure of the touchpad unit will be described in detail below.

[0113] Figure 13 This is a schematic diagram of the structure of a touchpad unit provided in an embodiment of this application. Figure 13 As shown, in one implementation of this application embodiment, the touch component 50 includes a touchpad unit 501, an adhesive strip unit 502, and a carrier unit 503. The adhesive strip unit 502 includes a first adhesive surface and a second adhesive surface. The first adhesive surface has a first backing adhesive 5021, and the second adhesive surface has a second backing adhesive 5022. The carrier unit 503 has a window. The first adhesive surface of the adhesive strip unit 502 is bonded to the touchpad unit 501 via the first backing adhesive 5021. The second adhesive surface of the adhesive strip unit 502 is bonded to the first surface of the carrier unit 503 via the second backing adhesive 5022, and also bonded to the second surface of the carrier unit 503 through the window. In this application embodiment, the first backing adhesive 5021 of the first adhesive surface of the adhesive strip unit 502 is used to bond the touchpad unit 501. The second adhesive 5022 on the second adhesive surface of the easy-pull adhesive unit 502 is used to bond the carrier unit 503, thereby bonding the touch panel unit 501 and the carrier unit 503 together through the easy-pull adhesive unit 502. When it is necessary to disassemble the touch panel unit 501, simply pull the easy-pull adhesive unit 502 tightly in the disassembly pulling direction to completely remove the easy-pull adhesive unit 502, completing the disassembly process of the touch panel unit 501 and the carrier unit 503. The disassembly method of the touch panel unit 501 is not only fast and convenient, reducing the disassembly difficulties caused by excessive adhesive strength, but also prevents thermal deformation of the touch panel unit 501 and the carrier unit 503. Moreover, due to the characteristics of the easy-pull adhesive unit 502, no adhesive residue will remain on the touch panel unit 501 and the carrier unit 503, and there is no need to use an adhesive remover to remove adhesive residue. When the touchpad unit 501 or the carrier unit 503 is reused and assembled, it can be used directly, which greatly improves the reuse and assembly efficiency of the touchpad unit 501 or the carrier unit 503.

[0114] It should be noted that the touchpad unit 501 includes a printed circuit board 5011 and a touch sensor 5012. The touch sensor 5012 is disposed on the side of the printed circuit board 5011 near the adhesive unit 502 and is bonded to the first adhesive backing 5021 of the adhesive unit 502. The touch sensor 5012 is used to acquire the user's touch press operation. The printed circuit board 5011 is used to obtain the touch press command based on the touch press operation. Optionally, the touch sensor 5012 can be soldered to the printed circuit board 5011 using surface mount technology (SMT) via reflow soldering.

[0115] In this embodiment, the printed circuit board 5011 typically uses a touch sensor 5012 to detect the user's touch point and applied pressure in real time, and performs signal processing in conjunction with a microcontroller to ensure the accuracy and sensitivity of the touch operation. The printed circuit board 5011 also connects to the main control system to achieve rapid data transmission and feedback, enhancing the user's interactive experience.

[0116] Optionally, the touch sensor may include a touch sensor and a pressure sensor. The touch sensor may be a capacitive touch sensor, which, during user actions such as clicking, tapping, and swiping, detects changes in capacitance in the touched area using the principle of self-capacitance / mutual capacitance to identify the specific location of the finger. The pressure sensor senses the pressure applied by the user's finger during a pressing operation. By monitoring changes in strain, deformation, capacitance, or inductance of the printed circuit board 5011, it converts these analog signals into digital signals, calculates the pressure value, and sends it to the microcontroller in the printed circuit board 5011. Optionally, when the pressure value reaches a set threshold, the system triggers vibration feedback.

[0117] Figure 14 This is a schematic diagram of the structure of another touchpad unit provided in this application embodiment. Figure 14As shown, in one implementation of this application embodiment, the touch component 50 includes a touchpad unit 501, an adhesive strip unit 502, and a carrier unit 503. The adhesive strip unit 502 includes a first adhesive surface and a second adhesive surface. The first adhesive surface has a first backing adhesive 5021, and the second adhesive surface has a second backing adhesive 5022. The carrier unit 503 has a window. The first adhesive surface of the adhesive strip unit 502 is bonded to the touchpad unit 501 via the first backing adhesive 5021. The second adhesive surface of the adhesive strip unit 502 is bonded to the first surface of the carrier unit 503 via the second backing adhesive 5022, and also bonded to the second surface of the carrier unit 503 through the window. In this application embodiment, the first backing adhesive 5021 of the first adhesive surface of the adhesive strip unit 502 is used to bond the touchpad unit 501. The second adhesive 5022 on the second adhesive surface of the easy-pull adhesive unit 502 is used to bond the carrier unit 503, thereby bonding the touch panel unit 501 and the carrier unit 503 together through the easy-pull adhesive unit 502. When it is necessary to disassemble the touch panel unit 501, simply pull the easy-pull adhesive unit 502 tightly in the disassembly pulling direction to completely remove the easy-pull adhesive unit 502, completing the disassembly process of the touch panel unit 501 and the carrier unit 503. The disassembly method of the touch panel unit 501 is not only fast and convenient, reducing the disassembly difficulties caused by excessive adhesive strength, but also prevents thermal deformation of the touch panel unit 501 and the carrier unit 503. Moreover, due to the characteristics of the easy-pull adhesive unit 502, no adhesive residue will remain on the touch panel unit 501 and the carrier unit 503, and there is no need to use an adhesive remover to remove adhesive residue. When the touchpad unit 501 or the carrier unit 503 is reused and assembled, it can be used directly, which greatly improves the reuse and assembly efficiency of the touchpad unit 501 or the carrier unit 503.

[0118] It should be noted that the touchpad unit 501 includes a printed circuit board 5011, a touch sensor 5012, and a vibration feedback unit 5013. The touch sensor 5012 is disposed on the side of the printed circuit board 5011 near the adhesive unit 502 and is bonded to the first adhesive backing 5021 of the adhesive unit 502. The touch sensor 5012 is used to acquire the user's touch press operation. The printed circuit board 5011 is used to obtain the touch press command based on the touch press operation. The vibration feedback unit 5013 is attached to the side of the printed circuit board 5011 near the adhesive unit 502. The vibration feedback unit 5013 is used to provide tactile vibration feedback to the user.

[0119] In this embodiment, the printed circuit board 5011 typically uses a touch sensor 5012 to detect the user's touch point and applied pressure in real time, and combines this with a microcontroller for signal processing to ensure the accuracy and sensitivity of the touch operation. The printed circuit board 5011 also connects to the main control system to achieve rapid data transmission and feedback, enhancing the user's interactive experience. The vibration feedback device 5013 is generally used to provide tactile feedback, enhancing the user's operating experience. The main principle of the vibration feedback device 5013 is to use a specific excitation voltage to induce fixed starting and braking of the mover and stator, or to control the piezoelectric ceramic to produce fixed Z-axis vibration through the inverse piezoelectric effect. Optionally, the vibration feedback device 5013 includes a motor or a piezoelectric ceramic vibrator.

[0120] It should be noted that the vibration feedback device 5013 is usually attached to the printed circuit board 5011 by adhesive backing or dispensing to ensure that the vibration of the vibration feedback device 5013 can be transmitted to the entire touch component and thus be felt by the user's finger.

[0121] Figure 15 This is a schematic diagram of the structure of another touchpad unit provided in this application embodiment. Figure 15As shown, in one implementation of this application embodiment, the touch component 50 includes a touchpad unit 501, an adhesive strip unit 502, and a carrier unit 503. The adhesive strip unit 502 includes a first adhesive surface and a second adhesive surface. The first adhesive surface has a first adhesive backing 5021, and the second adhesive surface has a second adhesive backing 5022. The carrier unit 503 has a window. The first adhesive surface of the adhesive strip unit 502 is bonded to the touchpad unit 501 via the first adhesive backing 5021. The second adhesive surface of the adhesive strip unit 502 is bonded to the first surface of the carrier unit 503 via the second adhesive backing 5022, and also bonded to the second surface of the carrier unit 503 through the window. In this application embodiment, the first adhesive backing 5021 of the first adhesive surface of the adhesive strip unit 502 is used to bond the touchpad unit 501. The second adhesive 5022 on the second adhesive surface of the easy-pull adhesive unit 502 is used to bond the carrier unit 503, thereby bonding the touch panel unit 501 and the carrier unit 503 together through the easy-pull adhesive unit 502. When it is necessary to disassemble the touch panel unit 501, simply pull the easy-pull adhesive unit 502 tightly in the disassembly pulling direction to completely remove the easy-pull adhesive unit 502, completing the disassembly process of the touch panel unit 501 and the carrier unit 503. The disassembly method of the touch panel unit 501 is not only fast and convenient, reducing the disassembly difficulties caused by excessive adhesive strength, but also prevents thermal deformation of the touch panel unit 501 and the carrier unit 503. Moreover, due to the characteristics of the easy-pull adhesive unit 502, no adhesive residue will remain on the touch panel unit 501 and the carrier unit 503, and there is no need to use an adhesive remover to remove adhesive residue. When the touchpad unit 501 or the carrier unit 503 is reused and assembled, it can be used directly, which greatly improves the reuse and assembly efficiency of the touchpad unit 501 or the carrier unit 503.

[0122] It should be noted that the touch assembly 50 includes a touchpad unit 501, an adhesive strip unit 502, and a carrier unit 503. The touchpad unit 501 includes a printed circuit board 5011, a touch sensor 5012, a vibration feedback unit 5013, and a protective cover 5014. The touch sensor 5012 is disposed on the side of the printed circuit board 5011 near the adhesive strip unit 502 and is bonded to the first adhesive backing 5021 of the adhesive strip unit 502. The touch sensor 5012 is used to acquire the user's touch press operation. The printed circuit board 5011 is used to obtain the touch press command based on the touch press operation. The vibration feedback unit 5013 is attached to the side of the printed circuit board 5011 near the adhesive strip unit 502. The vibration feedback unit 5013 is used to provide tactile vibration feedback to the user. The protective cover 5014 is disposed on the side of the printed circuit board 5011 away from the adhesive strip unit 502. The protective cover 5014 is used to protect the printed circuit board 5011, the touch sensor 5012 and the vibration feedback device 5013 and to provide a matching appearance to the whole device.

[0123] In this embodiment, the printed circuit board 5011 typically uses a touch sensor 5012 to detect the user's touch point and applied pressure in real time, and combines this with a microcontroller for signal processing to ensure the accuracy and sensitivity of the touch operation. The printed circuit board 5011 also connects to the main control system to achieve rapid data transmission and feedback, enhancing the user's interactive experience. The vibration feedback device 5013 is generally used to provide tactile feedback, enhancing the user's operating experience. The main principle of the vibration feedback device 5013 is to use a specific excitation voltage to excite the mover and stator of the vibration feedback device 5013 to produce fixed starting and braking, or to control the piezoelectric ceramic to produce fixed Z-axis vibration through the inverse piezoelectric effect. The protective cover 5014, as the outermost layer of the touchpad unit 501, provides structural support for the entire touchpad unit 501 and effectively protects internal components (such as the printed circuit board 5011, touch sensor 5012, and vibration feedback device 5013) from external physical damage, dust, and liquid intrusion, thereby extending the service life of the touchpad unit 501. In addition, the protective cover 5014 can enhance the user's touch experience through special surface treatments, making touch-sensitive operations smoother and reducing the adhesion of fingerprints and dirt. For example, the surface treatment can be an anti-fingerprint (AF) coating, an anti-glare (AG) coating, etc.

[0124] Alternatively, the protective cover can be a glass cover, Mylar film, or fiberglass board, etc.

[0125] It should be noted that, in this embodiment, the adhesive unit 502 can also be used to ensure that the touchpad unit 501 is in a partially supported state. During the user's finger pressing the screen of the touchpad unit 501, the adhesive unit 502 helps to generate greater deformation or stress, ensuring that the touchpad unit 501 has sufficient pressure change signal and improving pressure detection accuracy. The adhesive unit 502 can also be used to bond the touchpad unit 501 to small structural components or external structural components, ensuring the bonding reliability of the touchpad unit 501. The adhesive unit 502 can also be used to isolate vibration. During vibration, the vibration feedback device 5013 will drive the entire touchpad unit 501 to vibrate. The adhesive unit 502 ensures that the touchpad unit 501 itself is in a vibrating state, while preventing vibration from being transmitted to external structural components, thus avoiding problems such as overall resonance / abnormal noise. In practical applications, users can achieve various functions by applying different pressure levels. For example, in drawing applications, a light press can draw a thin line, while a heavy press can draw a thick line. Alternatively, it can detect the movement trajectory and pressure of the fingers in real time, and obtain different user commands by judging different pressing behaviors of the fingers in different areas. Through the vibration feedback device 5013, different vibration feedback effects are provided. These diverse interaction methods greatly enhance the user experience.

[0126] The following section provides a detailed introduction to solutions for touch structures and electronic devices that utilize touch components.

[0127] Figure 16 This is a schematic diagram of a touch structure provided in an embodiment of this application. Figure 16 As shown, in one implementation of this application embodiment, a touch structure 60 is provided. The touch structure 60 includes a touch component 50 and a housing module 601. The touch component 50 is disposed in the housing module 601. The housing 601 provides an external protective cover for the touch component 50.

[0128] For example, housing module 601 can be the shell structure of the palm rest portion of a laptop computer.

[0129] Optionally, the touch structure 60 can be used for scenarios such as pressure-sensitive touchpads for mobile portable laptops that require bonding, tablet keyboard cases, and portable mobile touchpads.

[0130] Figure 17 This is a schematic diagram of the structure of another electronic device provided in this application embodiment. Figure 17 As shown, the electronic device 10 may include a touch structure 60 composed of the aforementioned touch components 50 and a display module 70, etc. These devices can be coupled through various interconnect buses or other electrical connection methods. The display module 70 is connected to the touch structure 60. The display module 70 is used to display the control content of the touch structure 60.

[0131] For example, the electronic device 10 can be a laptop computer, which receives the user's touch press operation signal through the touch structure 60 and displays the control content of the touch structure 60 through the display module 70.

[0132] It should be understood that the above is only an example of the structure of electronic device 10. Electronic device 10 may also include other subsystems or devices, which can be set and modified as needed. This application embodiment does not impose any restrictions on this.

[0133] The beneficial effects that the electronic device provided in the above-described embodiments of this application can achieve can be referred to the beneficial effects corresponding to the modules provided above, and will not be repeated here.

[0134] It should be understood that the above description is merely to help those skilled in the art better understand the embodiments of this application, and is not intended to limit the scope of the embodiments of this application. Based on the examples given above, those skilled in the art can obviously make various equivalent modifications or changes. For example, some steps in the various embodiments of the above detection method may be unnecessary, or new steps may be added. Alternatively, any combination of two or more of the above embodiments may be used. Such modifications, changes, or combinations also fall within the scope of the embodiments of this application. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interfaces, devices, or units, and may be electrical, mechanical, or other forms.

[0135] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0136] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0137] It should also be understood that the above description of the embodiments of this application focuses on highlighting the differences between the various embodiments. Any similarities or differences not mentioned can be referred to each other. For the sake of brevity, they will not be repeated here.

[0138] It should also be understood that, in the various embodiments of this application, the sequence number of each process does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0139] It should also be understood that in the embodiments of this application, "pre-setting" or "pre-defining" can be achieved by pre-saving the corresponding code, table or other means that can be used to indicate relevant information in the device (e.g., including electronic devices), and this application does not limit the specific implementation method.

[0140] It should also be understood that the methods, situations, categories, and classifications of embodiments in this application are for the convenience of description only and should not constitute a special limitation. Various methods, categories, situations, and features in embodiments can be combined without contradiction.

[0141] It should also be understood that, in the various embodiments of this application, unless otherwise specified or in case of logical conflict, the terms and / or descriptions between different embodiments are consistent and can be referenced by each other, and the technical features in different embodiments can be combined to form new embodiments according to their inherent logical relationships.

[0142] Finally, it should be noted that the above descriptions are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims. In conclusion, the above descriptions are merely preferred embodiments of the technical solutions of this application and are not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A touch component, characterized in that, It includes a touchpad unit, an easy-pull adhesive unit, and a carrier unit; the easy-pull adhesive unit includes a first adhesive surface and a second adhesive surface; the first adhesive surface is provided with a first backing adhesive, and the second adhesive surface is provided with a second backing adhesive; the carrier unit has a window. The first adhesive surface of the easy-pull adhesive unit is bonded to the touch panel unit via the first backing adhesive; the second adhesive surface of the easy-pull adhesive unit is bonded to the first surface of the carrier unit via the second backing adhesive, and also passes through the window to bond to the second surface of the carrier unit.

2. The touch component as claimed in claim 1, characterized in that, The second adhesive backing includes a first part of adhesive backing and a second part of adhesive backing. The first part of adhesive backing is bonded to the first surface of the carrier unit, and the second part of adhesive backing is bonded to the second surface of the carrier unit. The window is located in the projection area of ​​the second part of adhesive backing on the first surface of the carrier unit, so that the second part of adhesive backing is folded over and passes through the window to bond to the second surface of the carrier unit.

3. The touch component as described in claim 1, characterized in that, The length of the first adhesive backing is less than the length of the second adhesive backing.

4. The touch component as claimed in claim 1, characterized in that, The easy-pull adhesive unit includes multiple units, and the carrier unit also has multiple windows corresponding to it.

5. The touch component as claimed in claim 1, characterized in that, The easy-pull adhesive unit has a tear handle on the second side of the carrier unit.

6. The touch component as described in any one of claims 1-5, characterized in that, The load-bearing unit includes an intermediate structural component and a first complete machine structural component; The touch panel unit is bonded to the intermediate structural component via the easy-pull adhesive unit, and the intermediate structural component is secured to the first complete structural component by screws.

7. The touch component as described in any one of claims 1-5, characterized in that, The carrier unit includes a second overall structural component, and the touch panel unit is bonded to the second overall structural component by the easy-pull adhesive unit.

8. The touch component as described in any one of claims 1-7, characterized in that, The touch panel unit includes a printed circuit board and a touch sensor; The touch sensor is located on the side of the printed circuit board near the easy-pull adhesive unit and is bonded to the first adhesive backing of the easy-pull adhesive unit; The touch sensor is used to acquire the user's touch press operation; the printed circuit board is used to obtain the touch press command based on the touch press operation.

9. The touch component as claimed in claim 8, characterized in that, The touch sensor includes a touch sensor and a pressure sensor.

10. The touch component as claimed in claim 8 or 9, characterized in that, The touchpad unit also includes a vibration feedback device; the vibration feedback device is attached to the side of the printed circuit board near the easy-pull adhesive unit; The vibration feedback device is used to provide tactile vibration feedback.

11. The touch component as claimed in claim 10, characterized in that, The vibration feedback device includes one or more of a motor or a piezoelectric ceramic vibrator.

12. The touch component as described in any one of claims 8-11, characterized in that, The touch panel unit also includes a protective cover plate, which is disposed on the side of the printed circuit board away from the easy-pull adhesive unit; The protective cover is used to protect the printed circuit board and the touch sensor and to provide a matching appearance with the overall device.

13. The touch component as claimed in claim 12, characterized in that, The protective cover includes one or more of the following: glass cover, Mylar film, and fiberglass board.

14. A touch structure, characterized in that, The device includes a touch component as described in any one of claims 1 to 13, and a housing module, wherein the touch component is disposed on the housing module.

15. An electronic device, characterized in that, include: The touch structure as described in claim 14, and the display module; The display module is connected to the touch structure; The display module is used to display the control content of the touch structure.

Images