System and method for accounting for carbon emissions of glass insulators throughout their life cycle

Abstract

The present application relates to the technical field of carbon accounting, in particular to a glass insulator full life cycle carbon emission accounting system and method, the system comprising a raw material composition module, a component path marking module, a structure response division module, a disassembly operation planning module and a life cycle carbon amount collection module.In the present application, by corresponding division of component structure position and raw material number, the correlation between assembly sequence and material matching information is established, combined with component processing sequence and structure behavior change in the manufacturing stage, the path chain covering the whole process of component evolution is constructed, the action position of the stress part is extracted according to the contact surface distribution and response sequence, the loading and unloading number sequence with contact interference judgment ability is refined, combined with the path behavior and structure response of the component during service, the classification nodes of the carbon emission process are collected, the multi-stage, type-based and dynamically traceable carbon emission behavior mapping model is constructed, and a structured and extensible support framework is provided.

Description

Technical Field

[0001] This invention relates to the field of carbon accounting technology, and in particular to a system and method for calculating carbon emissions throughout the entire life cycle of glass insulators. Background Technology

[0002] Carbon accounting technology involves methods and systems for quantifying, recording, and calculating greenhouse gas emissions generated by products, services, or organizations throughout their entire life cycle. Core aspects include setting carbon emission factors, collecting activity data, constructing carbon emission accounting models, developing carbon footprint assessment standards, and managing and reporting carbon emission information. This technology is widely used in environmental protection, energy management, industrial manufacturing, transportation, and construction, serving as a crucial foundation for supporting low-carbon development and the construction of green manufacturing systems. Traditional carbon emission accounting for glass insulators throughout their entire life cycle refers to a systematic approach that collects, summarizes, and calculates energy consumption and carbon emission data at each stage, from raw material extraction, processing and manufacturing, warehousing and transportation, installation and operation, to end-of-life recycling. This typically involves setting fixed carbon emission factors, manually entering and calculating data based on specific physical quantities such as material weight, energy consumption, and transportation distance using static tables or basic databases, and relying on engineers to periodically organize and statistically analyze the emission data.

[0003] Existing technologies use the entire component as the accounting unit, neglecting the positional characteristics of structural details during manufacturing and assembly. This makes it difficult to achieve a correlation mapping between raw materials and specific component parts. During manufacturing path tracking, the component behavior lacks temporal distinction and evolutionary state expression, resulting in the disconnection between different stages of the process. In the structural response stage, it is impossible to identify the sequence of structural actions and the location of stressed parts during the loading process, leading to unclear contact interference during disassembly and difficulty in forming an accurate loading and unloading sequence path. At the same time, the correspondence between carbon emission links and behavioral processes is missing, resulting in aggregation bias and path jump problems in the accounting data. This limits the accuracy and adaptability in multi-scenario applications. Summary of the Invention

[0004] To address the technical problems existing in the prior art, embodiments of the present invention provide a system and method for calculating carbon emissions throughout the entire life cycle of glass insulators. The present invention can combine the path behavior and structural response of components during service to collect classification nodes of the carbon emission process, construct a multi-stage, categorized, dynamically traceable carbon emission behavior mapping model, and provide a structured and scalable support framework.

[0005] To achieve the above technical objectives, the present invention provides a full life cycle carbon emission accounting system for glass insulators, which includes a raw material composition module, a component path labeling module, a structural response division module, a dismantling operation planning module, and a life cycle carbon collection module.

[0006] The raw material composition module obtains the position division of the insulating skirt, core rod and metal end piece in the glass insulator structure, retrieves the raw material information recorded in the production batch according to the component position, distinguishes the original source of silicon raw material, metal alloy raw material and composite adhesive raw material, corresponds the material number and structural position, and associates the material content and structural composition item by item according to the assembly sequence to obtain the component raw material allocation list.

[0007] The component path labeling module extracts the processing sequence corresponding to the component from the manufacturing record based on the mapping relationship between raw materials and components in the component raw material allocation list. According to the processing sequence, it traces the changes that the component undergoes in the manufacturing process and connects the component number and process in chronological order to obtain the component life cycle path map.

[0008] The structural response segmentation module retrieves structural contact surface information in the embedded region based on the behavior path of the metal end-piece connection segment in the component life cycle path map. It analyzes the response action of the structural segment according to the starting order of assembly pressure loading, and associates the position of the structural segment with the material condition to the corresponding position in the embedded region to obtain the embedded region response segmentation dataset.

[0009] The disassembly operation planning module extracts the structural features of the glued connection position and the end component interface in the glass insulator based on the response-first structural segment description in the embedded region response segment dataset. It simulates the contact changes in the disassembly sequence from the end to the middle, evaluates the structural contact interference differences of the embedded structure under the differentiated disassembly sequence, removes the interference difference diffusion area, and obtains the loading and unloading process sequence template group.

[0010] The lifecycle carbon collection module is based on the dismantling number sequence in the loading and unloading process sequence template group. According to the component lifecycle path map and the component raw material allocation list, it extracts the manufacturing and service process of the removable and retainable components during their use. Based on the component behavior sequence, it matches the carbon emission link participation type to obtain the full lifecycle carbon emission accounting list.

[0011] As a further aspect of the present invention, the component raw material allocation list is a data set indexed by the component number. The data set contains multiple component raw material allocation records, and each component raw material allocation record includes at least the component number, structural tag number, corresponding raw material number, and assembly sequence information.

[0012] The component lifecycle path map is a set of path data indexed by component number, which includes the processing sequence, process procedure and behavior path information corresponding to the component;

[0013] The embedded region response segment dataset includes information on the structural contact surface, assembly pressure loading sequence, response action location, and stress change corresponding to the component structural segment;

[0014] The loading and unloading process sequence template group includes information on response-preceding structural segments, adhesive connection positions, contact change characteristics, and structural contact interference segments determined based on the structural response sequence.

[0015] The full life cycle carbon emission accounting list includes a dismantling number sequence based on the component life cycle behavior, manufacturing and service processes, carbon emission stage types, and carbon emission data.

[0016] As a further aspect of the present invention, the response-first structural segment refers to the first structure to react during assembly and loading; the carbon emission stage refers to the stage to which the carbon emission behavior belongs, divided according to the life cycle.

[0017] As a further aspect of the present invention, the raw material composition module includes a component location identification submodule, a raw material source extraction submodule, and a material structure mapping submodule;

[0018] The component location identification submodule acquires the location data of the insulating skirt, core rod, and metal end piece in the glass insulator, extracts the corresponding structural location according to the coordinate number in the component drawing, and numbers each part of the component. The corresponding part number and the structural label sequence are compared with the labeling sequence of the structural labels in the original drawing to obtain the component location sequence.

[0019] The raw material source extraction submodule extracts the corresponding raw material number and source field from the production batch information based on the structural tag number in the component part positioning sequence, and connects the raw material number and structural tag number to obtain the component raw material source sequence.

[0020] The material structure mapping submodule, based on the raw material number and structural tag number in the component raw material source sequence, calls the assembly sequence number and sequentially associates the component number, structural tag number, and raw material number to obtain the component raw material allocation list.

[0021] As a further embodiment of the present invention, the component path labeling module includes a sequence extraction submodule, a process analysis submodule, and a numbered process matching submodule;

[0022] The sequential extraction submodule retrieves the component processing number sequence from the manufacturing record based on the correspondence between component number and material number in the component raw material allocation list, and assigns the component processing sequence according to the component number mapping to the material number sequence;

[0023] The process analysis submodule retrieves the process number and step label from the manufacturing process list based on the component number and processing sequence in the component processing sequence set, and matches the component sequence with the process step label sequence to obtain a component step sequence mapping table.

[0024] The numbering process matching submodule extracts the process timestamp and job number based on the process number and step label in the component link sequence mapping table, and arranges the component number and step label in chronological order to obtain the component life cycle path map.

[0025] As a further aspect of the present invention, the structural response division module includes a contact surface extraction submodule, a response action recognition submodule, and a structural segmentation assignment submodule;

[0026] The contact surface extraction submodule retrieves the structural surface contact information associated with the number of the metal end piece in the component life cycle path map, extracts the surface contact data between the contact nodes of the structural segment, and sequentially connects the region sequence and the corresponding contact surface according to the structural number order to obtain the embedded region contact surface parameter set.

[0027] The response action recognition submodule collects the loading order of the contact positions during the assembly stage based on the contact surface number and structure sequence in the embedded region contact surface parameter set, identifies the action time difference between the first and second response segments according to the loading start order, distinguishes the structure segment sequence according to the triggering order, and obtains the structure segment response timing data table.

[0028] The structural segment attribution submodule extracts the structural number and corresponding material information of the early response segment based on the structural segment response timing data table, maps the structural number to the spatial sequence of the embedded region, connects the response action position with the material data, and obtains the embedded region response segment dataset.

[0029] As a further embodiment of the present invention, the disassembly operation planning module includes a boundary structure extraction submodule, an interference path filtering submodule, and a process sequence output submodule;

[0030] The boundary structure extraction submodule collects the contact contours of the glass insulator adhesive connection area and the end piece based on the response-advance structure segments in the embedded region response segmentation dataset, divides the contact segment positions from the end to the middle, and corresponds them to the structural regions according to the front-to-back relationship to obtain the contact segment position distribution set.

[0031] The interference path filtering submodule extracts data on the changes in contact relationship with the action based on the contact segment location distribution and the disassembly sequence, removes path segments whose contact area change rate exceeds a preset threshold, and obtains the disassembly path interference segment.

[0032] The process sequence output submodule extracts data that does not include path interference from the action sequence based on the location where the contact change range expands in the disassembly path interference section, and obtains the loading and unloading process sequence template group.

[0033] As a further aspect of the present invention, the formula for calculating the contact area change rate is as follows:

[0034] ;

[0035] in, This represents the rate of change of contact area calculated during the interference path screening process. This represents the i-th path segment at the sampling time of the previous action. The actual contact area is measured by a contact detection device. This represents the same path segment at the time of sampling in the next action. The measured actual contact area, where i in the subscript represents the path segment index number, 4 in the subscript represents the calculation round number of the current interference path screening, and the superscript represents the actual contact area. and Represents the sampling time of different actions. This represents the baseline contact area calculated from the initial contact area of ​​the path segment in the current round. Represents the dynamic weighting factor calculated from the change in the contact area of ​​the i-th path segment, with the superscript indicating the weighting factor. This indicates that the weight is related to the amount of change. This represents the number of sequence difference counts generated by the i-th path segment before and after the disassembly order adjustment. This represents the number of reference meters used for sequential difference normalization processing. This represents the total number of path segments involved in the calculation of the contact area change rate.

[0036] As a further embodiment of the present invention, the life cycle carbon collection module includes a process sequence extraction submodule, a process behavior matching submodule, and a carbon emission data collection module;

[0037] The process sequence extraction submodule locates the behavior sequence of detachable components in the component life cycle path map based on the disassembly sequence in the loading and unloading process sequence template group, corresponds to the location of the structural segment, calls the corresponding content in the component raw material allocation list, extracts the manufacturing and service process, and obtains the set of behavior flow in the use stage.

[0038] The process behavior matching submodule, based on the behavior order of the components in the usage phase behavior process set, corresponds to the carbon emission process step, connects the phase action process with the carbon emission type, and obtains a carbon emission participation detail set.

[0039] The carbon emission data collection module collects associated carbon emission values ​​based on the behavior and operation methods of participating in the carbon emission details collection, allocates value segments within a time period, adds component attributes and operation fields, and obtains a full life cycle carbon emission accounting list.

[0040] On the other hand, a method for calculating the carbon emissions of glass insulators throughout their entire life cycle, wherein the method is executed based on the aforementioned system for calculating the carbon emissions of glass insulators throughout their entire life cycle, includes the following steps:

[0041] S1: Obtain the positions of insulating skirts, core rods and metal end pieces in glass insulators, retrieve raw material batch data according to regional component codes, distinguish the source of silicon, metal alloy and composite adhesive raw materials, correspond to material numbers and assembly order, and obtain the component raw material allocation list;

[0042] S2: Based on the correspondence between raw materials and components in the component raw material allocation list, extract the component processing sequence, advance the corresponding component number and manufacturing stage according to the process time, track the component processing path change process, and obtain the component life cycle path map;

[0043] S3: Based on the connection position and path order of the metal end pieces in the component life cycle path map, retrieve the embedded contact surface information, analyze the response action and material parts under the loading order according to the assembly load loading order, and obtain the embedded area response segment dataset.

[0044] S4: Based on the numbering order of the response components in the embedded area response segmentation data, extract the structural codes of the glued interface area and the junction of the end pieces, deduce the relationship between the disassembly order and contact interference, and obtain the loading and unloading process sequence template group.

[0045] S5: Based on the dismantling sequence number in the loading and unloading process sequence template group, according to the component life cycle path map and the component raw material allocation list, combined with the component full life cycle path index, trace the manufacturing and use behavior of detachable components, identify the carbon emission stage involved according to the behavior type in the path, and obtain the full life cycle carbon emission accounting list.

[0046] Compared with the prior art, the advantages and positive effects of the present invention are as follows:

[0047] In this invention, by corresponding the structural position of components with the raw material number, the association between assembly sequence and material usage information is established. Combining the component processing sequence and structural behavior changes during the manufacturing stage, a path chain covering the entire process of component evolution is constructed. Based on the distribution of contact surfaces and response sequence, the position of the stress-bearing parts is extracted, and the loading and unloading number sequence with contact interference judgment capability is refined. Combining the path behavior and structural response of components during service, the classification nodes of the carbon emission process are collected, and a multi-stage, categorized, dynamically traceable carbon emission behavior mapping model is constructed, providing a structured and scalable support framework. Attached Figure Description

[0048] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] Figure 1 This is a system flowchart of the present invention;

[0050] Figure 2 This is a system block diagram of the present invention;

[0051] Figure 3 This is a flowchart of the raw material composition module in this invention;

[0052] Figure 4 This is a flowchart of the component path labeling module in this invention;

[0053] Figure 5 This is a flowchart of the structural response partitioning module in this invention;

[0054] Figure 6 This is a flowchart of the disassembly operation planning module in this invention;

[0055] Figure 7 This is a flowchart of the life cycle carbon collection module in this invention;

[0056] Figure 8 This is a flowchart of the method steps of the present invention. Detailed Implementation

[0057] The technical solution of the present invention will now be described with reference to the accompanying drawings.

[0058] In embodiments of the present invention, words such as "exemplarily," "for example," etc., are used to indicate that something is an example, illustration, or description. Any embodiment or design described as "exemplary" in the present invention should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the word "exemplary" is intended to present the concept in a concrete manner. Furthermore, in embodiments of the present invention, the meaning expressed by "and / or" can be both, or either one.

[0059] In the embodiments of this invention, the terms "image" and "picture" may sometimes be used interchangeably. It should be noted that, without emphasizing the distinction between them, they convey the same meaning. Similarly, the terms "of," "corresponding (relevant)," and "corresponding" may sometimes be used interchangeably. It should be noted that, without emphasizing the distinction between them, they convey the same meaning.

[0060] In this embodiment of the invention, sometimes a subscript such as W1 may be written in a non-subscript form such as W1. When the difference is not emphasized, the meaning they express is the same.

[0061] To make the technical problems, technical solutions and advantages of the present invention clearer, a detailed description will be given below in conjunction with the accompanying drawings and specific embodiments.

[0062] This invention provides a system for calculating the carbon emissions of glass insulators throughout their entire life cycle, such as... Figure 1-2 As shown, the system includes a raw material composition module, a component path labeling module, a structural response classification module, a dismantling operation planning module, and a life cycle carbon collection module.

[0063] The raw material composition module obtains the position division of the insulating skirt, core rod and metal end piece in the glass insulator structure, retrieves the raw material information recorded in the production batch according to the component position, distinguishes the original source of silicon raw material, metal alloy raw material and composite adhesive raw material, corresponds the material number and structural position, and associates the material content and structural composition item by item according to the assembly sequence to obtain the component raw material allocation list.

[0064] The component path labeling module extracts the processing sequence corresponding to the component from the manufacturing record based on the mapping relationship between raw materials and components in the component raw material allocation list. According to the processing sequence, it traces the changes that the component undergoes in the manufacturing process and connects the component number and process in chronological order to obtain the component life cycle path map.

[0065] The structural response segmentation module retrieves the structural contact surface description in the embedded region based on the behavior path of the metal end-piece connection segment in the component life cycle path map. It analyzes the response action of the structural segment according to the starting order of assembly pressure loading, and associates the position of the structural segment with the material condition to the corresponding position in the embedded region to obtain the embedded region response segmentation dataset.

[0066] The disassembly operation planning module extracts the structural features of the glued connection position and the end component interface in the glass insulator based on the response-first structural segment description in the embedded region response segment dataset. It simulates the contact changes in the disassembly sequence from the end to the middle, evaluates the structural contact interference differences of the embedded structure under the differentiated disassembly sequence, removes the interference difference diffusion area, and obtains the loading and unloading process sequence template group.

[0067] The lifecycle carbon collection module is based on the dismantling number sequence in the loading and unloading process sequence template group. According to the component lifecycle path map and the component raw material allocation list, it extracts the manufacturing and service process of the removable and retainable components during their use. Based on the component behavior sequence, it matches the carbon emission link participation type to obtain the full lifecycle carbon emission accounting list.

[0068] In this embodiment, the component raw material allocation list is a data set indexed by the component number. The data set contains multiple component raw material allocation records, and each component raw material allocation record includes at least the component number, structural tag number, corresponding raw material number, and assembly sequence information.

[0069] The component lifecycle path map is a set of path data indexed by component number, which includes the processing sequence, process procedure and behavior path information corresponding to the component;

[0070] The embedded region response segment dataset includes information on the structural contact surface, assembly pressure loading sequence, response action location, and stress change corresponding to the component structural segment;

[0071] The loading and unloading process sequence template group includes information on response-preceding structural segments, adhesive connection positions, contact change characteristics, and structural contact interference segments determined based on the structural response sequence.

[0072] The full life cycle carbon emission accounting list includes a dismantling number sequence based on the component life cycle behavior, manufacturing and service processes, carbon emission stage types, and carbon emission data.

[0073] In the embodiments, such as Figure 2 , 3 As shown, the raw material composition module includes a component location identification submodule, a raw material source extraction submodule, and a material structure mapping submodule;

[0074] The component location identification submodule acquires the location data of the insulating skirt, core rod, and metal end piece in the glass insulator, extracts the corresponding structural location based on the coordinate number in the component drawing, and obtains the component location sequence by matching the corresponding location number with the structural label.

[0075] First, the component drawings are imported into the digital processing environment. The content of the graphic elements in the drawings is analyzed, and the insulator parts represented in the drawings are extracted one by one. By scanning the closed areas of the boundary lines of each component in the drawing, the insulating skirt, core rod, metal end pieces, etc. are distinguished according to color fill, line type changes, or annotation information. After extraction, the coordinate numbers set in the drawing are processed one by one. The coordinate areas are divided using a grid scanning method, and the location label of each coordinate point is marked. The horizontal and vertical coordinate positions in the drawing are recorded. For example, for an insulator drawing, the scanning identifies the area corresponding to the number of the insulating skirt as the rectangular area enclosed by the coordinate points (x1=85, y1=130), (x2=140, y2=130), (x3=140, y3=180), and (x4=85, y4=180). The core rod is the linear center segment between the upper and lower metal end pieces. For example, the corresponding coordinate number is x5=110, y5=130. =180 to x6=110, y6=250, the metal end piece area is the gray block with anchoring holes at the top and bottom of the insulator, corresponding to coordinate numbers x7=90 to x8=130, y7=250 to y8=280. After the part data is extracted, the coordinate numbers in the component drawings are classified and grouped. The coordinate numbers belonging to the same part are summarized to form part code clusters, and arranged in ascending order according to the coordinate numbers. The numbers within the same part are sorted as a continuous sequence. For example, the coordinate numbers of the insulating skirt are 1 to 6, the core rod is 7 to 10, and the metal end piece is 11 to 15. Then, the sequence of each part number is compared with the labeling order of the structural labels in the original drawings. By traversing the annotation numbers corresponding to the structural labels below the structural labels in the drawings, according to their arrangement order from top to bottom or from left to right, the corresponding part numbering order is formed on this basis to form the component part positioning sequence, and finally the component part positioning sequence is obtained.

[0076] The raw material source extraction submodule extracts the corresponding raw material number and source field from the production batch information based on the structural tag number in the component location sequence, and connects the raw material number and structural tag number to obtain the component raw material source sequence.

[0077] First, each structural tag number in the component location sequence is traversed sequentially. The position label of the structural tag number in the component drawing is read. For example, when the structural tag numbers are A001 to A010, they represent the positions of different segments of the insulating skirt, corresponding to the coordinate numbers marked on the component drawing. Based on this, the production database is queried for matching fields. The corresponding field is the production batch number for each structural tag number. This batch number is obtained by recording the raw material registration information used in the component production process. For example, A001 uses silicone material with the number RM1003, and the production batch number is PBT005. All raw materials used in this batch are clearly registered in the raw material table. During matching, the structural tag number is compared with the batch production record in the database to confirm its uniqueness within the same component. The comparison fields are the combination of the structural tag number field and the component number field. After confirmation, the raw material field is extracted, and duplicate content in the raw material field is removed. In actual operation, if A002 and A003 are both the same raw material number RM... 1003. Only one record is retained for association. Then, the source field corresponding to the raw material number is read. This field indicates the purchaser number or supply channel corresponding to the raw material. For example, the source field corresponding to RM1003 is SR020, indicating that the material is provided by the supplier with the number SR020. If one structural tag number corresponds to multiple raw material numbers, the sorting is determined according to the order of entry time of the raw material numbers in the raw material table. For example, A004 corresponds to RM1004 and RM1005, so the one with the earlier entry time is placed first. After completion, the raw material numbers and structural tag numbers are bound to form a one-to-one correspondence. Each structural tag number is associated with one or more raw material numbers, and the raw material number is accompanied by its source field, forming a data pair. After all structural tag numbers and raw material fields are connected, according to the arrangement order of the structural tag numbers in the component, starting from A001 to the last structural tag number, all raw material numbers and their source fields are arranged in order to form an array or list, finally obtaining the component raw material source sequence.

[0078] The material structure mapping submodule, based on the raw material number and structural tag number in the component raw material source sequence, calls the assembly sequence number, and sequentially associates the component number, structural tag number, and raw material number to obtain the component raw material allocation list.

[0079] First, each structural tag number in the component raw material source sequence is extracted one by one. The component number information corresponding to the structural tag number is read. For example, when the structural tag number is A001 and A002, the corresponding component number is GZ001, and the raw material numbers are RM2001 and RM2002 respectively. This dataset is preprocessed to remove invalid records with missing raw material numbers or structural tag numbers. At the same time, the assembly sequence number is retrieved. This assembly sequence number comes from the list of process numbers recorded in the component manufacturing process. For example, the assembly sequence number corresponding to structural tag number A001 is S05, indicating that it is located in the 5th process in the overall component assembly. When extracting the assembly sequence number, an index retrieval is performed by reading the combination key of the component number and the structural tag number. The matching assembly sequence number in the index result is paired with the raw material number and the structural tag number in a ternary pair. The sequential association is achieved by sorting the assembly sequence numbers. If there are cases where different structural tag numbers under the same component number correspond to the same assembly sequence number, the structural tag numbers are sorted again. The sorting is based on the ASCII code of the letter part of the structural tag number from small to large, and the number part from small to large. The process begins with sorting by size, for example, A009 precedes B001, and B001 precedes B002. After sorting, the component number, structural tag number, and material number are combined into a single record. For example, component number GZ001, structural tag number A001, material number RM2001, and assembly sequence number S05 constitute a complete entry. Then, all paired records for structural tag numbers are processed sequentially. All combinations under each component number are arranged into a list queue according to the assembly sequence number from smallest to largest. Multiple list queues are generated for each component number. Each list queue independently corresponds to a data set of component numbers. For example, the structural tag numbers corresponding to component number GZ002 are C001 to C005, the raw material numbers are RM2006 to RM2010, and the assembly sequence numbers are S01 to S05. The pairing results form five lists of records, which are arranged from smallest to largest according to the assembly sequence as S01 to S05, and finally form the matching list for component number GZ002. Each record in this list consists of component number, structural tag number, and raw material number, and finally the component raw material matching list is obtained.

[0080] In the embodiments, such as Figure 2 , 4 As shown, the component path labeling module includes a sequence extraction submodule, a process analysis submodule, and a numbered process matching submodule. The sequence extraction submodule retrieves the component processing number sequence from the manufacturing record based on the correspondence between component number and raw material number in the component raw material allocation list, and assigns the component processing sequence according to the component number mapping the raw material number sequence.

[0081] First, extract all records from the component material allocation list. Establish a mapping relationship between the component number and material number in each record, constructing an index table with the component number as the primary key. Arrange all material numbers corresponding to each component number according to the assembly sequence. For example, component number GZ100 corresponds to material numbers RM001, RM002, and RM003, with assembly sequence numbers S01, S02, and S03. Based on this, query the manufacturing record database for processing number records. The search field is set to the combination of the component number and material number fields. Compare the actual component number and material number combinations in the processing record table with the allocation list. If there are missing records, mark them as "unprocessed" and record their position for subsequent processing. If the combination matches perfectly, extract the sequence number value from the processing number field. This number is generally a processing serial number; for example, processing numbers MZ0101 to MZ0103 correspond to RM001 to RM003 respectively. After reading the sequence number value, extract the numerical part and discard... Prefix characters, retaining only the numeric suffix as the sorting criterion, perform numerical sorting on all processing numbers, sorting by numerical part from smallest to largest, for example, MZ0101 before MZ0102. After sorting, the sorting result is re-bound with the original component number, that is, all raw material numbers under each component number are re-sorted according to the actual processing order. If a raw material number is used repeatedly in the processing record, it is checked whether there is a structural position number field record. If so, it is classified in parallel according to the structural position number. The same raw material number is allowed to appear more than twice under the same component number and must correspond to different structural position numbers. For example, under component GZ101, RM005 appears in both B001 and B003, corresponding to processing numbers MZ0205 and MZ0207, and is still listed in the corresponding order. After all processing order numbers are determined, the processing order index table is mapped by combining the original component number and the processing order number. Classified by component number, the processing order list is exported to form a set data structure, and finally the component processing order set is obtained.

[0082] The process analysis submodule retrieves the process number and step label from the manufacturing process list based on the component number and processing sequence in the component processing sequence set, and matches the component sequence with the process step label sequence to obtain the component step sequence mapping table.

[0083] First, extract all sequence number records under each component number from the processing sequence set, constructing a sequence group with the component number as the primary key. For example, the processing sequence numbers under component number GZ300 are arranged sequentially as P001 to P005, corresponding to raw material numbers RM101 to RM105 respectively. Based on this, retrieve matching fields from the manufacturing process list data source, setting the search conditions to complete matching of the component number field and consistent processing sequence number field. Locate the corresponding process number field value through the sequence number. This field records the process path code to which the processing task belongs. For example, the process number corresponding to processing sequence number P002 is GC12. After reading, extract the step label corresponding to the process number. This step label is a text mark in the process execution sequence, such as "cleaning", "drying", "positioning", "pressing", "testing", etc. The extraction method establishes a mapping between the process number and the step label to ensure that each process number corresponds to only one clear step label. If there are multiple labels, sort their label sequence number fields and take the smallest one as the primary label. For example, GC12 corresponds to both "initial pressing" and "final pressing", with a sequence number of S. For S04 and S08, select the label "Initial Pressing" corresponding to S04. Then, bind the sequence number and step label in pairs using the component number as the primary key. If there are duplicate processing sequence numbers under the same component number, determine whether they correspond to different raw material number fields. If the raw material numbers are different, retain all records and archive them in order of sequence number. For example, under component GZ301, P006 and P007 correspond to RM110 and RM111 respectively, the process numbers are GC13 and GC14, and the corresponding labels are "Spraying" and "Curing". In this case, both sequences should be included in the mapping table to complete all the steps. After mapping the component number to the sequence number and the step label, the three records of component number, sequence number, and step label are processed in parallel. The records under each component number are arranged in ascending order of sequence number to form a sequence set based on the component. Each record in the set clearly indicates the process flow label corresponding to a certain processing sequence of the component. For example, component number GZ302 contains sequences P010 to P015, which are mapped to "loading", "inspection", "adjustment", "bonding", "edge sealing" and "removal from shelf" in sequence. They are combined in sequence according to the number to finally obtain the component process sequence mapping table.

[0084] The numbering process matching submodule extracts the process timestamp and job number based on the process number and step label in the component link sequence mapping table, and arranges the component number and step label in chronological order to obtain the component life cycle path map.

[0085] First, extract the corresponding process number value and step label field content from each record. Then, sequentially read the component number and all its subordinate process number fields, grouping them by component number for traversal. Perform an index retrieval operation on each process number, entering the process execution record table in the manufacturing execution database. Locate the data row using the process number as the search key, and extract the fields "process timestamp" and "job number". The process timestamp records the precise time point of the actual operation for that process number, formatted as an integer value in time units. The job number field records the operator or machine number information; for example, the timestamp for process number GC501 is 834725, and the job number is JX009. Write the obtained timestamp records into the mapping row corresponding to the current component number and step label. After all records are completed, proceed to the sorting stage. Sort all records under the same component number in ascending order based on the process timestamp field, with the sorting logic being to arrange each process step from smallest to largest process timestamp value. For example, under component number GZ600, step "up..." The timestamps corresponding to "material loading", "bonding", "pressurizing", and "curing" are 831200, 831450, 831700, and 831950, respectively. After sorting, the step labels are arranged in the above order, while retaining their corresponding process number and job number. After sorting, a serialization operation is performed on the sorting results, and the step labels are sequentially formed into a linear ordered set. Each element records three items: step label, process number, and job number. For example, the first item in the sequence is "material loading-GC501-JX009", the second item is "bonding-GC502-JX012", and so on. Each component number establishes an independent sequence set, and finally forms a serialization binding relationship between the component number and the step sequence. All serialization results are combined to generate a path map set. Each path in the path map is guided by the component number. The path nodes sequentially record the label and execution unit of each step in the manufacturing process of the component. Each path has no time overlap, ensuring that the timestamps monotonically increase throughout the entire process, and finally obtains the component life cycle path map.

[0086] In the embodiments, such as Figure 2 , 5 As shown, the structural response segmentation module includes a contact surface extraction submodule, a response action recognition submodule, and a structural segmentation and attribution submodule;

[0087] The contact surface extraction submodule retrieves the structural surface contact information associated with the number of the metal end component in the component life cycle path map, extracts the surface contact data between the contact nodes of the structural segment, and connects the region sequence and the corresponding contact surface in sequence according to the structural number order to obtain the embedded region contact surface parameter set.

[0088] First, the full path records corresponding to each component number in the path map are filtered. For each processing step node in the path, a field determination is performed. If the step label contains keywords such as "crimping," "anchoring," or "riveting," the corresponding structural segment is identified as a metal end piece. The connection number bound to that node is extracted as the primary search key. For example, the connection number bound to the crimping node in component number GZ700 is LNK089. This number is used as the index item to enter the embedded region database for field retrieval. The search field is set as "connection number," and the value LNK089 is matched. The search results retrieve the structural surface contact information field bound to this number. This field contains multiple dimensions of data such as contact type, contact area, contact angle, and contact pressure. The contact type can be one of point contact, line contact, or surface contact. If the type field is marked as "surface contact," it proceeds to the next processing step. The start and end point numbers of the structural segment contact nodes are extracted from this field and sorted in ascending order to form contact pairs. For example, there is a contact pair between numbered points N015 and N019. For surface contact, the contact pairs are recorded as N015-N019. Simultaneously, the contact area field value within this region is read, for example, an area of ​​42 square millimeters, a contact angle of 86 degrees, and a contact pressure of 9 MPa. All contact pair records are grouped and archived according to component numbers, storing the set of all surface contact records under the same component. Next, the embedded region sequence is sequentially processed according to the structure number. The contact region list is arranged according to the starting sequence of each structure number. The surface contact information within each structure number is bound, constructing a mapping table. Each structure number in this table serves as the primary key, corresponding to multiple contact surface information items. Each item records the specific contact point number range, area value, angle value, and pressure value. If multiple contact surfaces connect to adjacent structure numbers, a number merging operation is performed. For example, if numbers SN013 and SN014 share contact pairs N022-N025, they are uniformly labeled as SN013, and marked "cross-number contact" in the annotation field. After all contact pairs are merged, a complete dataset is formed, ultimately yielding the embedded region contact surface parameter set.

[0089] The response action recognition submodule collects the loading order of the contact positions during the assembly stage based on the contact surface number and structure sequence in the embedded region contact surface parameter set, identifies the action time difference between the first and second response segments according to the loading start order, distinguishes the structure segment sequence according to the triggering order, and obtains the structure segment response timing data table.

[0090] First, all records in the embedded region contact surface parameter set are expanded one by one. For each record, the contact surface number, corresponding structural segment number, and the sequence position of the structural segment within the overall component are extracted. A mapping table is constructed using the contact surface number as the index key. Simultaneously, the structural sequence number is associated for subsequent order determination. Based on this, the data acquisition phase of the assembly stage begins. The actual loading record corresponding to each contact surface number is retrieved. The loading record comes from the loading log during the assembly process. This log records the loading start marker values ​​for each contact position in sequence. These marker values ​​are expressed as incremental values ​​to indicate the loading order. For example, the loading start sequence value for contact surface number CM021 is 12, CM022 is 15, and CM023 is 18. After reading, the loading start sequence value is bound to the contact surface number one by one. Then, the response segment identification stage begins. All contact surface numbers under the same component number are sorted in ascending order of loading start sequence value. After sorting, the structural segment containing the contact surface with the smallest sequence value is marked as the first response segment, and subsequent sequence values ​​correspond to the next response segments. During this process, the loading action trigger time point value corresponding to each contact surface is extracted synchronously. This time point is represented by an integer in milliseconds, for example, CM02... The trigger times are 3050 for CM022, 3120 for CM023, and 3200 for CM023. Then, a difference calculation is performed on the trigger times of adjacent contact surfaces to calculate the action time difference between the later response segment and the earlier response segment. For example, the time difference between CM022 and CM021 is 70, and the time difference between CM023 and CM022 is 80. This difference is written into the record as an action time difference parameter. Next, the order of the response segments is verified based on the action time difference. According to the structural segment number corresponding to the contact surface number, the earlier and later response segments are mapped back to the structural segment sequence, and a response marker is generated for each structural segment. The fields, marked with five data items, include the structural segment number, contact surface number, loading start sequence value, trigger time point, and action time difference. For example, structural segment SN010 corresponds to CM021, with a loading sequence of 12, a trigger time of 3050, and an action time difference of 0. Structural segment SN011 corresponds to CM022, with a loading sequence of 15, a trigger time of 3120, and an action time difference of 70. After all structural segments are processed in sequence, the structural segment response records are rearranged in ascending order according to the structural sequence number to form a time sequence arrangement table with the structural segments as the main line. The arrangement result is summarized and output to finally obtain the structural segment response time sequence data table.

[0091] The structural segment attribution submodule extracts the structural number and corresponding material information of the early response segment based on the structural segment response timing data table, maps the structural number and the spatial sequence of the embedded region, connects the response action position and the material data, and obtains the embedded region response segment dataset.

[0092] First, all structural segment records are extracted from the data table. Structural segment numbers with response time differences of zero or within the minimum range are selected as early response segments. The criterion is to take the minimum value of the action time difference field under the same component number and compare it with whether it is less than a set threshold. For example, if the threshold is set to 30, and the time difference of a structural segment is 25, then the structural segment is considered an early response segment. Next, the structural numbers corresponding to these early response segments are extracted and linked to the original bill of materials table. The material field content is retrieved by using the structural number as the index key to obtain basic data such as material number, material type, and material density. For example, structural number SN008 corresponds to material number RM209, material type is aluminum alloy, and density value is 2.7. Then, the structural number is matched with the embedded area spatial sequence. The spatial sequence is the arrangement order of structural segments defined on the component drawings. The spatial number of each structural segment is marked according to the arrangement relationship of the embedded position. For example, the number of SN008 in the spatial sequence is EP015. Further, the response action position and the... The connection between material information is specifically performed by assembling the structure number SN008 of the early response segment with its loading time, trigger contact surface number, embedding location number EP015, material number RM209, etc., into a single record. If there are multiple early response segments in the same component, they are arranged in ascending order of spatial number. For example, EP011, EP015, and EP019 correspond to SN006, SN008, and SN010, respectively, and are connected to their respective material fields and loading times. After completion, these records are drawn in a schematic diagram. The component axis is used as a reference line, and the boundaries of the structural segments are drawn according to the spatial number distribution. The structural number, material type, and response time label are marked within each structural segment area. If the response time difference is less than the set minimum threshold of 10, it is marked in red to indicate the earliest loaded segment. After all structural segments are drawn, they are merged into an embedding area graphic view. All early response segments in the figure are presented uniformly with structural segment boundaries, numbers, response information, and material properties, ultimately resulting in the embedded area response segment dataset.

[0093] Specifically, such as Figure 2 , 6 As shown, the disassembly operation planning module in this embodiment includes a boundary structure extraction submodule, an interference path filtering submodule, and a process sequence output submodule.

[0094] The boundary structure extraction submodule collects the contact contours of the glass insulator adhesive connection area and the end piece based on the response-advance structure segments in the embedded region response segmentation dataset, divides the contact segment positions from the end to the middle, and corresponds them to the structural regions according to the front-to-back relationship to obtain the contact segment position distribution set.

[0095] First, extract the set of structural segment numbers with the smallest response time from the embedded area. The filtering method is to judge the minimum action time difference among all response records. If the action time difference is less than 10, it is marked as a response-preceding structural segment. After extracting these structural segment numbers, locate their corresponding illustrated areas and determine their spatial embedding position numbers. For example, structural segment SN012 is located in area EP023. Then, enter the connection area description information in the drawing and perform graphic recognition on the glass insulator connection structure. The recognition element range is defined by the boundary of the glued area. Read the grayscale change data within the boundary for contour delineation. By scanning the edge abrupt points of the grayscale curve in the area, determine the contact contour position between the end piece and the glued area. For example, in area EP023, the edge change curve identified has multiple abrupt points between x-coordinates 65 and 85, and this range is determined to be the end piece contour boundary. Then, divide the contour area into several contact segments. The division method is to start from the end direction and advance the segments towards the center at equal intervals. For example, starting from the outermost port, each... The contact segments are divided into 5 segments of 5 units each, with a total length of 25 units. Each segment is numbered CS001 to CS005. The positions of these contact segments are then compared according to the structural numbering layout in the drawings. The corresponding structural regions are sorted in ascending order of number, such as EP020, EP021, EP022, and EP023. If contact segments CS001 to CS005 fall within EP020 to EP023 respectively, a one-to-one mapping between contact segments and structural regions is established. If some contact segments are located across region boundaries, they are assigned to structural numbers with a proportion greater than 60% based on the area ratio. For example, CS004 spans EP022 and EP023. After measurement, it is found that the area covered in EP022 is 3.6 square units and in EP023 is 2.4 square units. Therefore, CS004 belongs to EP022. Finally, all contact segments are sequentially assigned to their corresponding structural numbers, and the four items of structural number, contact segment number, location coordinates, and attribution relationship are summarized to obtain the final set of contact segment location distribution.

[0096] The interference path filtering submodule extracts data on the changes in contact relationship with the action based on the contact segment location distribution and disassembly sequence, removes path segments whose contact area change rate exceeds a preset threshold, and obtains the disassembly path interference segment.

[0097] The formula for calculating the rate of change of contact area is as follows:

[0098] ;

[0099] in, This represents the rate of change of contact area calculated during the interference path screening process. This represents the i-th path segment at the sampling time of the previous action. The actual contact area is measured by a contact detection device. This represents the same path segment at the time of sampling in the next action. The measured actual contact area, where i in the subscript represents the path segment index number, 4 in the subscript represents the calculation round number of the current interference path screening, and the superscript represents the actual contact area. and Represents the sampling time of different actions. This represents the baseline contact area calculated from the initial contact area of ​​the path segment in the current round. Represents the dynamic weighting factor calculated from the change in the contact area of ​​the i-th path segment, with the superscript indicating the weighting factor. This indicates that the weight is related to the amount of change. This represents the number of sequence difference counts generated by the i-th path segment before and after the disassembly order adjustment. This represents the number of reference meters used for sequential difference normalization processing. This represents the total number of path segments involved in the calculation of the contact area change rate. Contact area , How to obtain:

[0100] In application, the pixel distribution of the contact area is collected by the area array pressure sensor arranged at the assembly station, and the number of pixels is converted into the actual contact area based on the unit pixel area obtained by system calibration.

[0101] For the three path segments in The number of contact pixels collected at different times were 420, 460, and 400, respectively, and the area per pixel was... Then the three path segments are in The contact areas below are calculated as follows:

[0102] Path segment 1: ;

[0103] Path segment 2: ;

[0104] Path segment 3: ;

[0105] exist At times 480, 420, and 440, the number of contact pixels for the corresponding path segments is 480, 420, and 440, respectively. Therefore, the contact area is: , , ;

[0106] The reference contact area is determined by the path segment in The contact area at any given time is obtained by taking the arithmetic mean. The reference contact area corresponding to the above three path segments is calculated as follows:

[0107] ;

[0108] Changes in disassembly sequence Quantification method

[0109] The disassembly order is represented by discrete integer indices. The position numbers of the path segments in the original disassembly sequence and the adjusted indices are as follows:

[0110] Path segment 1: Adjusted from position 2 to position 3, then ;

[0111] Path segment 2: Adjusted from position 1 to position 3, then ;

[0112] Path segment 3: Adjusted from the 3rd position to the 4th position, then ;

[0113] The sequence baseline count is obtained by statistically analyzing the maximum sequence change in the currently participating path segment. The maximum change is 2, therefore... ;

[0114] The dynamic weight is calculated as a proportion of the change in the contact area of ​​the path segment to the baseline contact area:

[0115] Path segment 1: ;

[0116] Path segment 2: ;

[0117] Path segment 3: ;

[0118] The aforementioned ratio values ​​serve as the dynamic weights for the corresponding path segments. .

[0119] The known parameter set is as follows:

[0120]

[0121] Calculation of contact area change:

[0122] Path segment 1: ;

[0123] Path segment 2: ;

[0124] Path segment 3: ;

[0125] Summation and square root: ;

[0126] Calculation of changes in disassembly order: ;

[0127] Calculation of contact area change rate: ;

[0128] This result indicates that, when the system's preset reference range for the rate of change of contact area is 0 to 1, the calculated... Located in the middle to high range of the interval, the results show that the corresponding path segment set has obvious changes in both contact relationship and disassembly order disturbance. The numerical value is used as the discrimination input in the interference path screening step to determine whether the path segment set should be classified into the disassembly path interference segment.

[0129] The advantage of the formula lies in the introduction of dynamic weights calculated based on the proportion of change in contact area. The path segment makes a differentiated contribution to the calculation of the overall contact area change rate, thus forming a more discriminative and stable discrimination result in the process of interference path screening.

[0130] The process sequence output submodule extracts data that does not include path interference from the action sequence based on the location where the contact change range is expanded in the disassembly path interference section, and obtains the loading and unloading process sequence template group.

[0131] First, for each path segment in the interference section record set, a contact change amplitude extraction operation is performed. The extracted fields are the starting contact segment number, the ending contact segment number, and the number of span structures in between. By traversing in ascending order of structure numbers, the number of structure numbers jumping between the start and end points of the path is counted. If the count is greater than or equal to a preset threshold of three, it is determined to be an area of ​​expanded contact change range. For example, if path segment P008 jumps from CS004 to CS001, crossing CS003 and CS002, the span count is two, which does not meet the elimination condition, so it is retained. If path segment P009 jumps from CS007 to CS002, the span count is four, which is determined to be an area of ​​expanded contact change. Its path segment number, structure start and end numbers, and corresponding action sequence number are recorded. Then, the standard action sequence table is entered, and the numbers of all action nodes in the action sequence are compared. Records with action numbers that match the corresponding action numbers of the interference path segments are filtered out, and a mapping index between action numbers and path segment numbers is established. Then, the action dataset in the complete action sequence, after removing these interference numbers, is rearranged. The rearrangement logic is to sort by assembly number in ascending order and retain the original... The start and end point data structure remains unchanged. The rearranged action sequence is the standard process path after removing interfering path segments. Based on this, a grouping operation is performed, grouping data segments that do not contain interfering paths by component number. For example, if the action sequence in component GZ900 is A01 to A10, and the interfering action numbers are A03 and A06, then the retained actions are A01, A02, A04, A05, A07 to A10, forming the removal set T1. Then, using T1 as a template identifier, a template group number TMP_GZ900_ is generated. T1 further registers and numbers the non-interference action sequence templates corresponding to all component numbers, generating a structure with five fields: template number, action number list, start action number, end action number, and component number. If a component has multiple independent non-interference sequence segments, template numbers TMP_GZ900_T2 and TMP_GZ900_T3 are assigned in sequence to ensure that the segmented templates do not overlap. After all templates are combined, they are summarized and exported to the template structure table, finally obtaining the loading and unloading process sequence template group.

[0132] Specifically, such as Figure 2 , 7 As shown in the embodiment, the periodic carbon collection module includes a process sequence extraction submodule, a process behavior matching submodule, and a carbon emission data collection module;

[0133] The process sequence extraction submodule is based on the disassembly sequence in the loading and unloading process sequence template group. It locates the behavior sequence of detachable components in the component life cycle path map, corresponds to the location of the structural segment, calls the corresponding content in the component raw material allocation list, extracts the manufacturing and service process, and obtains the set of behavior flow in the use stage.

[0134] First, each template record in the template group is read sequentially, and the fields "Template Number" and "Action Number List" are extracted. From these, the set of structural numbers corresponding to the action numbers is extracted to confirm the range of structural segments of detachable components. For example, template TMP_GZ301_T1 corresponds to structural numbers SN011 to SN015. These numbers are used as the set of detachable component identifiers. Then, the component lifecycle path map is entered, and the component number and structural number are matched. The position where the structural segment first appears in the lifecycle path is retrieved. Its behavior label and timestamp are extracted from the path node set. For example, SN011 first appears in the "Welding" node at time 3120. The path nodes of all structural numbers under this component are sorted in ascending order to form a behavior sequence record. Each node is labeled with a behavior label, process number, execution time, and action number. After the structural segment behavior sorting is completed, the location number of the area where the structural segment is located is read from the structural drawing. The structural number and spatial number are bound through a spatial number mapping table. For example, SN012 corresponds to EP0. In area 25, the component raw material allocation list is accessed. Using the structure number as the search field, information such as the corresponding raw material number, supply number, and production batch number is extracted to ensure a one-to-one correspondence between structural behavior and raw material records. The extracted raw material data is used for manufacturing process matching. The manufacturing process field records the stage labels of the raw materials entering the assembly process, such as "cutting," "grinding," "glue injection," and "assembly," which are sequentially bound to the raw material number and structure number. Next, the service record database is accessed, and historical records are retrieved by combining component number and structural segment number. The service status change time point and event type are extracted, such as "running," "in inspection," and "fault pending repair." These fields are arranged in ascending order of time and combined with life cycle path nodes to form a complete time sequence. Finally, the five items of manufacturing stage label, service stage event, action number, raw material number, and structure number are combined into a complete record and output in the order of structure number. After all structural segments are processed, the results are assembled into a component behavior process set, ultimately obtaining the service stage behavior process set.

[0135] The process behavior matching submodule is based on the behavior order of the components in the usage phase behavior process set, corresponding to the carbon emission process steps, connecting the phase action process with the carbon emission type, and obtaining a carbon emission participation detail set.

[0136] First, each record in the usage phase behavior flow set is sequentially expanded, reading fields such as component number, structural segment number, behavior label, and behavior sequence number one by one. All behavior records under the same component number are arranged in ascending order of behavior sequence number to form a clear behavior chain. For example, the behavior sequence corresponding to component number GZ1200 is B01 to B08, and the behavior labels are "raw material cutting," "component forming," "assembly," "inspection," "operation," "inspection," "maintenance," and "retirement." Based on this, a carbon emission process link list is introduced. This list predefines the correspondence between various behavior labels and carbon emission links, with the corresponding field being the behavior label. The signature field and carbon emission stage number field are compared one by one to map each behavior node in the behavior process set to the corresponding carbon emission stage. For example, "raw material cutting" corresponds to emission stage CE01, "assembly" to CE03, and "operation" to CE06. A completely consistent matching rule is used during the mapping process. If synonymous tags exist, they are replaced using a preset lookup table before matching, completing the basic correspondence between behavior and carbon emission stage. Then, the carbon emission type connection stage begins, reading the associated emission type field for each carbon emission stage number. This field distinguishes between electricity consumption emissions, material consumption emissions, transportation emissions, and maintenance emissions. The emission type is categorized into categories such as protection emissions, for example, CE03 corresponds to electricity consumption emissions, and CE06 corresponds to operational energy consumption emissions. This emission type field is written into the current component behavior record. Next, the stage action process is refined and connected. The stage action process field describes the stage position of this behavior in the component's life cycle. The extraction rule is based on the interval of the behavior sequence number. For example, behavior sequence numbers less than or equal to B04 are marked as the manufacturing stage, B05 to B07 as the service stage, and B08 as the decommissioning stage. A stage identifier field is added to each behavior node according to this rule. Subsequently, the component number, structural segment number, behavior sequence number, behavior label, and other information are entered into the record. The seven data items, namely stage identifier, carbon emission link number, and carbon emission type, are merged into a complete participation record. If multiple structural segments occur simultaneously under the same behavior sequence, multiple records are generated and the behavior sequence number is shared. For example, if SN021 and SN022 participate simultaneously in the assembly stage, two carbon emission participation information records are recorded respectively. After the single component processing is completed, the same operation is performed on all component numbers in sequence to map the behavior chain of all components to the carbon emission process system, forming a detailed list of behaviors and carbon emission types covering the entire process of manufacturing, service and decommissioning. The list is sorted and summarized according to the component number and behavior sequence number to finally obtain the carbon emission participation detail set.

[0137] The carbon emission data collection module collects associated carbon emission values ​​based on the behavior and operation methods of carbon emission participation in the detailed collection, allocates value segments within a time period, adds component attributes and operation fields, and obtains a full life cycle carbon emission accounting list.

[0138] First, all records in the carbon emission details database are read one by one. For each record, the component number, structural segment number, behavior sequence number, behavior label, carbon emission type, and stage identifier fields are extracted. Records under the same component number are arranged in ascending order of behavior sequence number, forming a continuous lifecycle behavior chain. Based on this, the operation method field is extracted for each behavior record. The operation method field is derived from the correspondence between behavior labels and work records. For example, when the behavior label is "raw material shearing," the operation method is marked as mechanical cutting; when it is "assembly," it is marked as electric assembly; and when it is "operation," it is marked as continuous load operation. Then, based on the operation method, the corresponding data is retrieved from the carbon emission basic data table. The carbon emission range table records reference values ​​for carbon emissions per unit time or per unit of work condition for different operating methods. For example, the carbon emission range for mechanical cutting is 5 to 8, for electric assembly it is 3 to 6, and for continuous load operation it is 10 to 15. After the retrieval is complete, the time span field contained in the behavior record is read. The time span field is represented by the numerical difference between the start and end markers of the behavior. For example, if the time span of an assembly behavior is 4, this time span is used to allocate specific carbon emission values ​​within the corresponding range. The allocation rule is to linearly take values ​​between the lower and upper limits of the range according to the time span ratio. For example, if the assembly range is 3 to 6 and the time span is 4, the allocation value is 4.2. After configuration, the carbon emission value is written to the current behavior record. Next, all behavior records under the same component number are segmented by time period, assigning behaviors in the manufacturing, service, and decommissioning stages to different time period identifiers. For example, the manufacturing stage corresponds to time period T01, the service stage to T02, and the decommissioning stage to T03, ensuring that each carbon emission record has a clearly defined time period field. Then, component attribute data is introduced, supplementing each record with attribute fields such as component type, rated specifications, and environmental level. For example, if the component type is glass insulator, the rated specification is 220, and the environmental level is level three, these attribute fields are stored alongside the carbon emission value. Finally, the operation... The operation fields are further refined, including operation methods, operation frequency, and single-time duration markers. For example, during the operation phase, a certain behavior may have an operation method of continuous load, an operation frequency of once a day, and a single-time duration marker of long duration. After all fields are completed, the nine items of component number, structural segment number, behavior sequence number, stage identifier, operation method, time period identifier, carbon emission value, component attribute, and operation field are merged into a complete accounting record. The records are then sorted and summarized according to component number and behavior sequence number. The same processing flow is executed on all components in sequence, and finally, a carbon emission data list covering the entire process of manufacturing, use, and decommissioning is formed, resulting in a full life cycle carbon emission accounting list.

[0139] Please see Figure 8The method for calculating the carbon emissions of glass insulators throughout their entire life cycle is based on the aforementioned system for calculating carbon emissions of glass insulators throughout their entire life cycle, and includes the following steps:

[0140] S1: Obtain the positions of insulating skirts, core rods and metal end pieces in glass insulators, retrieve raw material batch data according to regional component codes, distinguish the source of silicon, metal alloy and composite adhesive raw materials, correspond to material numbers and assembly order, and obtain the component raw material allocation list;

[0141] S2: Based on the correspondence between raw materials and components in the component raw material allocation list, extract the component processing sequence, advance the corresponding component number and manufacturing stage according to the process time, track the changes in the component processing path, and obtain the component life cycle path map;

[0142] S3: Based on the connection position and path order of metal end parts in the component life cycle path map, retrieve the embedded contact surface information, analyze the response action and material parts under the loading sequence according to the assembly load loading sequence, and obtain the embedded area response segment dataset.

[0143] S4: Based on the numbering order of the response components in the embedded region response segmentation data, extract the structural codes of the glued interface area and the junction of the end pieces, deduce the relationship between the disassembly order and contact interference, and obtain the loading and unloading process sequence template group;

[0144] S5: Based on the dismantling sequence number in the loading and unloading process sequence template group, according to the component life cycle path map and component raw material allocation list, combined with the component full life cycle path index, trace the manufacturing and use behavior of detachable components, identify the carbon emission stage involved according to the behavior type in the path, and obtain the full life cycle carbon emission accounting list.

[0145] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A carbon emission accounting system for the entire life cycle of glass insulators, characterized in that, The system includes a raw material composition module, a component path labeling module, a structural response classification module, a disassembly operation planning module, and a life cycle carbon collection module. The raw material composition module obtains the position division of the insulating skirt, core rod and metal end piece in the glass insulator structure, retrieves the raw material information recorded in the production batch according to the component position, distinguishes the original source of silicon raw material, metal alloy raw material and composite adhesive raw material, corresponds the material number and structural position, and associates the material content and structural composition item by item according to the assembly sequence to obtain the component raw material allocation list. The component path labeling module extracts the processing sequence corresponding to the component from the manufacturing record based on the mapping relationship between raw materials and components in the component raw material allocation list. According to the processing sequence, it traces the changes that the component undergoes in the manufacturing process and connects the component position and process in chronological order to obtain the component life cycle path map. The structural response segmentation module retrieves structural contact surface information in the embedded region based on the behavior path of the metal end-piece connection segment in the component life cycle path map. It analyzes the response action of the structural segment according to the starting order of assembly pressure loading, and associates the position of the structural segment with the material condition to the corresponding position in the embedded region to obtain the embedded region response segmentation dataset. The disassembly operation planning module extracts the structural features of the glued connection position and the end component interface in the glass insulator based on the response-first structural segment description in the embedded region response segment dataset. It simulates the contact changes in the disassembly sequence from the end to the middle, evaluates the structural contact interference differences of the embedded structure under the differentiated disassembly sequence, removes the interference difference diffusion area, and obtains the loading and unloading process sequence template group. The lifecycle carbon collection module is based on the dismantling number sequence in the loading and unloading process sequence template group. According to the component lifecycle path map and the component raw material allocation list, it extracts the manufacturing and service process of the removable and retainable components during their use. Based on the component behavior sequence, it matches the carbon emission link participation type to obtain the full lifecycle carbon emission accounting list.

2. The glass insulator full life cycle carbon emission accounting system according to claim 1, characterized in that: The component material allocation list is a data set indexed by component number. The data set contains multiple component material allocation records. Each component material allocation record includes at least the component number, structural tag number, corresponding material number, and assembly sequence information. The component lifecycle path map is a set of path data indexed by component number, which includes the processing sequence, process procedure and behavior path information corresponding to the component; The embedded region response segment dataset includes information on the structural contact surface, assembly pressure loading sequence, response action location, and stress change corresponding to the component structural segment; The loading and unloading process sequence template group includes information on response-preceding structural segments, adhesive connection positions, contact change characteristics, and structural contact interference segments determined based on the structural response sequence. The full life cycle carbon emission accounting list includes a dismantling number sequence based on the component life cycle behavior, manufacturing and service processes, carbon emission stage types, and carbon emission data.

3. The glass insulator full life cycle carbon emission accounting system according to claim 1, characterized in that: The response-first structural segment refers to the first structure to react during assembly and loading; the carbon emission stage refers to the stage to which carbon emission behavior belongs, categorized by life cycle.

4. The glass insulator full life cycle carbon emission accounting system according to claim 1, characterized in that: The raw material composition module includes a component location identification submodule, a raw material source extraction submodule, and a material structure mapping submodule; The component location identification submodule acquires the location data of the insulating skirt, core rod, and metal end piece in the glass insulator, extracts the corresponding structural location according to the coordinate number in the component drawing, and numbers each part of the component. The corresponding part number and the structural label sequence are compared with the labeling sequence of the structural labels in the original drawing to obtain the component location sequence. The raw material source extraction submodule extracts the corresponding raw material number and source field from the production batch information based on the structural tag number in the component part positioning sequence, and connects the raw material number and structural tag number to obtain the component raw material source sequence. The material structure mapping submodule, based on the raw material number and structural tag number in the component raw material source sequence, calls the assembly sequence number and sequentially associates the component number, structural tag number, and raw material number to obtain the component raw material allocation list.

5. The glass insulator full life cycle carbon emission accounting system according to claim 4, characterized in that: The component path labeling module includes a sequence extraction submodule, a process analysis submodule, and a numbered process matching submodule; The sequential extraction submodule retrieves the component processing number sequence from the manufacturing record based on the correspondence between component number and material number in the component raw material allocation list, and assigns the component processing sequence according to the component number mapping to the material number sequence; The process analysis submodule retrieves the process number and step label from the manufacturing process list based on the component number and processing sequence in the component processing sequence set, and matches the component sequence with the process step label sequence to obtain a component step sequence mapping table. The numbering process matching submodule extracts the process timestamp and job number based on the process number and step label in the component link sequence mapping table, and arranges the component number and step label in chronological order to obtain the component life cycle path map.

6. The glass insulator full life cycle carbon emission accounting system according to claim 5, characterized in that, The structural response segmentation module includes a contact surface extraction submodule, a response action recognition submodule, and a structural segmentation and attribution submodule. The contact surface extraction submodule retrieves the structural surface contact information associated with the number of the metal end component connection segment in the component life cycle path map, extracts the surface contact data between the contact nodes of the structural segment, and sequentially connects the region sequence and the corresponding contact surface according to the structural number order to obtain the embedded region contact surface parameter set. The response action recognition submodule collects the loading order of the contact positions during the assembly stage based on the contact surface number and structure sequence in the embedded region contact surface parameter set, identifies the action time difference between the first and second response segments according to the loading start order, distinguishes the structure segment sequence according to the triggering order, and obtains the structure segment response timing data table. The structural segment attribution submodule extracts the structural number and corresponding material information of the early response segment based on the structural segment response timing data table, maps the structural number to the spatial sequence of the embedded region, connects the response action position with the material data, and obtains the embedded region response segment dataset.

7. The glass insulator full life cycle carbon emission accounting system according to claim 6, characterized in that, The disassembly operation planning module includes a boundary structure extraction submodule, an interference path filtering submodule, and a process sequence output submodule. The boundary structure extraction submodule collects the contact contours of the glass insulator adhesive connection area and the end piece based on the response-advance structure segments in the embedded region response segmentation dataset, divides the contact segment positions from the end to the middle, and corresponds them to the structural regions according to the front-to-back relationship to obtain the contact segment position distribution set. The interference path filtering submodule extracts data on the changes in contact relationship with the action based on the contact segment location distribution and the disassembly sequence, removes path segments whose contact area change rate exceeds a preset threshold, and obtains the disassembly path interference segment. The process sequence output submodule extracts data that does not include path interference from the action sequence based on the location where the contact change range expands in the disassembly path interference section, and obtains the loading and unloading process sequence template group.

8. The glass insulator life-cycle carbon emission accounting system according to claim 7, characterized in that, The formula for calculating the rate of change of contact area is as follows: ； in, This represents the rate of change of contact area calculated during the interference path screening process. This represents the i-th path segment at the sampling time of the previous action. The actual contact area is measured by a contact detection device. This represents the same path segment at the time of sampling in the next action. The measured actual contact area, where i in the subscript represents the path segment index number, 4 in the subscript represents the calculation round number of the current interference path screening, and the superscript represents the actual contact area. and Represents the sampling time of different actions. This represents the baseline contact area calculated from the initial contact area of ​​the path segment in the current round. Represents the dynamic weighting factor calculated from the change in the contact area of ​​the i-th path segment, with the superscript indicating the weighting factor. This indicates that the weight is related to the amount of change. This represents the number of sequence difference counts generated by the i-th path segment before and after the disassembly order adjustment. This represents the number of reference meters used for sequential difference normalization processing. This represents the total number of path segments involved in the calculation of the contact area change rate.

9. The glass insulator life-cycle carbon emission accounting system according to claim 7 or 8, characterized in that, The lifecycle carbon collection module includes a process sequence extraction submodule, a process behavior matching submodule, and a carbon emission data collection module; The process sequence extraction submodule locates the behavior sequence of detachable components in the component life cycle path map based on the disassembly sequence in the loading and unloading process sequence template group, corresponds to the location of the structural segment, calls the corresponding content in the component raw material allocation list, extracts the manufacturing and service process, and obtains the set of behavior flow in the use stage. The process behavior matching submodule, based on the behavior order of the components in the usage phase behavior process set, corresponds to the carbon emission process step, connects the phase action process with the carbon emission type, and obtains a carbon emission participation detail set. The carbon emission data collection module collects associated carbon emission values ​​based on the behavior and operation methods of participating in the carbon emission details collection, allocates value segments within a time period, adds component attributes and operation fields, and obtains a full life cycle carbon emission accounting list.

10. A method for calculating carbon emissions throughout the entire life cycle of glass insulators, characterized in that, The implementation of the glass insulator life-cycle carbon emission accounting system according to any one of claims 1-9 includes the following steps: S1: Obtain the positions of insulating skirts, core rods and metal end pieces in glass insulators, retrieve raw material batch data according to regional component codes, distinguish the source of silicon, metal alloy and composite adhesive raw materials, correspond to material numbers and assembly order, and obtain the component raw material allocation list; S2: Based on the correspondence between raw materials and components in the component raw material allocation list, extract the component processing sequence, advance the corresponding component number and manufacturing stage according to the process time, track the component processing path change process, and obtain the component life cycle path map; S3: Based on the connection position and path order of the metal end pieces in the component life cycle path map, retrieve the embedded contact surface information, analyze the response action and material parts under the loading order according to the assembly load loading order, and obtain the embedded area response segment dataset. S4: Based on the numbering order of the response components in the embedded area response segmentation data, extract the structural codes of the glued interface area and the junction of the end pieces, deduce the relationship between the disassembly order and contact interference, and obtain the loading and unloading process sequence template group. S5: Based on the dismantling sequence number in the loading and unloading process sequence template group, according to the component life cycle path map and the component raw material allocation list, combined with the component full life cycle path index, trace the manufacturing and use behavior of detachable components, identify the carbon emission stage involved according to the behavior type in the path, and obtain the full life cycle carbon emission accounting list.

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