Laser light emitting device, light emitting device package module, and light emitting device packaging method

Abstract

The application relates to the technical field of lasers, and particularly discloses a laser light-emitting device, a light-emitting device forming module and a light-emitting device packaging method. The laser light-emitting device comprises a support, an insulator and a packaging body. The support comprises a first electrode and a second electrode arranged at intervals, and the first electrode is fixed with an LD chip. The bottom of the insulator is located between the first electrode and the second electrode, the top of the insulator is formed with an annular protruding part, the annular protruding part faces at least three adjacent side surfaces of the LD chip, and a light-transmitting piece is arranged in the annular protruding part; the packaging body is located on the top surface of the insulator, and the packaging body covers the light-transmitting piece. The side surface of the support is provided with a cutting surface, the cutting surface extends to the light-transmitting piece and the packaging body, so as to form a light-out window between the support, the insulator and the packaging body, and the side light-out surface of the LD chip faces the light-out window. According to the application, the laser light-emitting device does not need to be arranged with a complex optical structure, the packaging process of the laser light-emitting device is effectively simplified, and large-scale production is realized.

Description

Technical Field

[0001] This invention relates to the field of laser technology, and in particular to a laser light-emitting device, a light-emitting device packaging module, and a light-emitting device packaging method. Background Technology

[0002] A laser diode (LD), also known as a semiconductor laser diode, is a semiconductor device that works based on the principle of stimulated emission. Its light-emitting element is an LD chip, which is usually an edge-emitting structure with the light emission direction parallel to the surface of the chip substrate, forming side-emitting light.

[0003] Currently, conventional packaging technologies for LD chips mainly employ vertical die bonding and horizontal die bonding. When the LD chip is vertically mounted within the package, a reflector or a 90° optical path deflection structure needs to be placed within the package to convert the side laser light into top light emission. When the LD chip is horizontally die bonded within the package, the package needs to have side optical windows and an integrated side lens.

[0004] However, the conventional packaging methods mentioned above require complex secondary optical structures and special mounting processes, which prevents LD chips from being mass-produced and limits their application in large-scale scenarios. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a laser light-emitting device, a light-emitting device packaging module, and a light-emitting device packaging method. This method eliminates the need for complex optical structures within the laser light-emitting device, effectively simplifying the packaging process and enabling large-scale production of laser light-emitting devices.

[0006] To solve the above-mentioned technical problems, the first aspect of the present invention provides a laser light-emitting device, including a support, an insulator and a package, wherein the support includes a first electrode and a second electrode arranged at intervals, the first electrode is die-bonded with an LD chip, and the LD chip is electrically connected to the second electrode. The bottom of the insulator is located between the first electrode and the second electrode, and the top of the insulator has an annular protrusion facing at least three adjacent sides of the LD chip. A light-transmitting element is disposed inside the annular protrusion. The package is located on the top surface of the insulator and covers the light-transmitting element. The side of the bracket is provided with a cut surface, which extends to the light-transmitting element and the package to form a light-emitting window between the bracket, the insulator and the package. At least one side of the LD chip is a light-emitting surface, which faces the light-emitting window so that the light from the LD chip is emitted from the light-emitting window.

[0007] As an improvement to the above solution, the insulator includes an integrally formed partition segment and an annular protrusion, the partition segment being located between the first electrode and the second electrode, and the annular protrusion being located at the top of the partition segment.

[0008] As an improvement to the above solution, the annular protrusion includes a first enclosure wall, a second enclosure wall, and a connecting wall. The connecting wall is connected to the partition segment. The first enclosure wall is located on one side of the connecting wall, and the second enclosure wall is located on the other side of the connecting wall. The first enclosure wall and the second enclosure wall are arranged opposite to each other. The first enclosure, the connecting wall, and the second enclosure are connected to form a U-shaped protrusion on the top surface of the bracket, and the cutting surface is located inside the U-shaped protrusion.

[0009] As an improvement to the above solution, the dividing segment extends along a first direction, which is the width direction of the bracket, and the dividing segment forms a preset length in the first direction; a die-bonding position is formed on the top surface of the first electrode, the LD chip is die-bonded to the die-bonding position, and a preset distance is formed between the die-bonding position and the inner wall of the annular protrusion, and the ratio between the preset distance and the preset length is 0.3~0.7.

[0010] As an improvement to the above solution, the cutting surface is a plane.

[0011] As an improvement to the above solution, the cutting surface forms a first cutting segment and two second cutting segments, the first cutting segment being located between the two second cutting segments, and the first cutting segment protruding outward from the second cutting segments; The package body forms a third cutting segment and two fourth cutting segments on the side of the light-emitting window. The third cutting segment is located above the first cutting segment and has the same shape as the first cutting segment. The fourth cutting segment is located above the second cutting segment and has the same shape as the second cutting segment. Both the first cutting segment and the third cutting segment are arc-shaped bosses.

[0012] As an improvement to the above solution, the light-transmitting component is a transparent adhesive, and the bottom surface of the encapsulation body forms a preset height with the bracket, the preset height being equal to the thickness of the transparent adhesive.

[0013] Accordingly, a second aspect of the present invention provides a light-emitting device packaging module, which integrates a plurality of laser light-emitting devices as described in any one of the above claims. The light-emitting device packaging module includes an insulating layer, a packaging layer and a plurality of electrode strips. The plurality of electrode strips are arranged in an array, and an insulating gap is formed between two adjacent electrode strips. The bottom of the insulating layer fills the insulating gap, and the top of the insulating layer is higher than the electrode strips. The top of the insulating layer has a plurality of arrayed filling slots, each filling slot containing two adjacent electrode strips, one of which has an LD chip die bonded to it; and each filling slot is filled with transparent adhesive. The encapsulation layer is located on the top surface of the insulating layer, and the encapsulation layer is formed with a first cutting line and a second cutting line that are intersected, one of which is located above the filling groove.

[0014] As an improvement to the above solution, the filling groove is provided with an opening side facing the light-emitting surface of the LD chip, and the first cutting line is located above the opening side.

[0015] Accordingly, a third aspect of the present invention provides a method for packaging a light-emitting device, used to form a plurality of laser light-emitting devices as described in any one of the above claims, the method comprising: Multiple electrode strips are arranged in an array, and any two adjacent electrode strips are connected to form an electrode strip support; An insulator is filled on one side of the electrode strip support, and the bottom of the insulator is filled into the gap between two adjacent electrode strips. At the same time, multiple annular dams are formed on the top of the electrode strip support. Two electrode strips are arranged in each of the annular dams. An LD chip is die-bonded to one of the electrode strips, and the other electrode strip is electrically connected to the LD chip. After confirming that the LD chip is stably die-bonded, a transparent colloid is filled into the filling groove; Once the transparent colloid has cured, an encapsulating adhesive layer is applied to the top surface of the insulator to obtain an overall encapsulation module, wherein the length and width of the encapsulating adhesive layer are equal to the length and width of the electrode strip support. Once the encapsulating adhesive layer is cured, the specific positions of the first cutting line and the second cutting line are determined on the top surface of the encapsulating adhesive layer, wherein the first cutting line is located above the opening side of the filling groove; The overall packaging module is cut into multiple laser light-emitting devices by cutting along the first cutting line and the second cutting line, wherein the first cutting line is located within the annular dam.

[0016] Implementing this invention has the following beneficial effects: Specifically, when encapsulating a laser light-emitting device, an insulator can be used to insulate and connect the spaced-apart first and second electrodes, thereby ensuring a stable electrical connection between the LD chip and the first and second electrodes. Subsequently, after arranging a light-transmitting element on the annular protrusion, the entire laser light-emitting device is encapsulated by placing the package on the top surface of the insulator and covering the light-transmitting element.

[0017] Since the cut surface on the side of the bracket extends to the light-transmitting component and the package, by cutting along the cut surface of the entire packaged device, a light-emitting window can be formed on the side of the bracket, insulator and package, and the light-transmitting component is exposed in the light-emitting window. By utilizing the characteristic of the LD chip to excite light from the side, the laser light-emitting device can emit light from the side using the light-emitting window on the side, thus realizing the function of the laser light-emitting device.

[0018] Therefore, this embodiment provides a light-emitting channel for the lateral light of the LD chip by utilizing the light-emitting window formed by the side cutting and the exposed light-transmitting component. This eliminates the need to arrange complex optical structures inside the laser light-emitting device, simplifying the packaging process of the laser light-emitting device. At the same time, the die bonding process of the LD chip at the first electrode can be mass-produced using semiconductor packaging technology, effectively improving the utilization rate of the LD chip in large-scale scenarios. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural schematic diagram of a laser light-emitting device in one embodiment of the present invention; Figure 2 This is a cross-sectional view of a laser light-emitting device in one embodiment of the present invention; Figure 3 This is a top view of the structure of a laser light-emitting device in one embodiment of the present invention; Figure 4 This is a three-dimensional structural schematic diagram of a laser light-emitting device in another embodiment of the present invention; Figure 5 This is a cross-sectional view of a laser light-emitting device in another embodiment of the present invention; Figure 6 This is a top view of the laser light-emitting device in another embodiment of the present invention; Figure 7 This is a top view of the electrode strip support structure in this invention; Figure 8 This is a top view schematic diagram of the structure after the insulating layer is formed on the electrode strip support in this invention. Figure 9 This is a top view of the LD chip after it has been die-bonded to the filling groove in this invention. Figure 10 This is a three-dimensional structural diagram of the encapsulation body after being encapsulated on top of the insulating layer in this invention; Figure 11 This is a three-dimensional structural diagram of the package body after the first and second cutting lines are formed in this invention; Figure 12 This is a flowchart of the packaging method for light-emitting devices in this invention. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings. It is hereby declared that the directional terms such as up, down, left, right, front, back, inside, and outside used in this text are based solely on the accompanying drawings and are not intended to specifically limit the invention.

[0021] The first aspect of this invention provides a laser light-emitting device, such as... Figures 1 to 6 As shown, the laser light-emitting device includes a support 1, an insulator 2, and a package 3. The support 1 includes a first electrode 11 and a second electrode 12 arranged at intervals. An LD chip 13 is die-bonded to the first electrode 11, and the LD chip 13 is electrically connected to the second electrode 12. The bottom of the insulator 2 is located between the first electrode 11 and the second electrode 12, and an annular protrusion 22 is formed on the top of the insulator 2. The annular protrusion 22 faces at least three adjacent sides of the LD chip 13, and a light-transmitting element (not shown) is disposed inside the annular protrusion 22. The package 3 is located on the top surface of the insulator 2 and covers the light-transmitting element. A cut surface 14 is provided on the side of the support 1, extending to the light-transmitting element and the package 3 to form a light-emitting window 221 between the support 1, the insulator 2, and the package 3. At least one side of the LD chip 13 is a light-emitting surface facing the light-emitting window 221, so that the light from the LD chip 13 is emitted laterally from the light-emitting window 221.

[0022] Specifically, when encapsulating the laser light-emitting device, the insulator 2 can be used to insulate the spaced-apart first electrode 11 and second electrode 12, thereby ensuring that the LD chip 13 can be stably electrically connected between the first electrode 11 and the second electrode 12. Subsequently, after arranging the light-transmitting element on the annular protrusion 22, the overall encapsulation of the laser light-emitting device is completed by placing the encapsulation on the top surface of the insulator 2 and covering the light-transmitting element with the encapsulation.

[0023] Since the cut surface 14 on the side of the bracket 1 extends to the light-transmitting element and the package 3, by cutting the entire package device along the cut surface 14, a light-emitting window 221 can be formed on the side of the bracket 1, the insulator 2 and the package 3, and the light-transmitting element is exposed in the light-emitting window 221. Thus, by utilizing the characteristic of the side of the LD chip 13 to excite light, the laser light-emitting device can emit light from the side using the light-emitting window 221 on the side, thereby realizing the function of the laser light-emitting device.

[0024] Therefore, this embodiment provides a light-emitting channel for the lateral light of the LD chip 13 by utilizing the light-emitting window 221 formed by the side cutting and the exposed light-transmitting element. This eliminates the need to arrange complex optical structures inside the laser light-emitting device, simplifies the packaging process of the laser light-emitting device, and allows the LD chip 13 to be mass-produced using semiconductor packaging technology during the die bonding process of the first electrode 11, effectively improving the utilization rate of the LD chip 13 in large-scale scenarios.

[0025] Furthermore, it should be noted that when using laser light-emitting devices, users can adjust the overall mounting angle of the laser light-emitting device to achieve the desired light emission angle relative to the user's equipment. For example, when side emission is required in the assembly equipment, the entire device can be mounted upright, so that the light emission window 221 is located outside the side of the device, thus achieving side emission; while when forward emission is required in the assembly equipment, the entire device can be mounted sideways, so that the light emission window 221 is located above the device, thus achieving forward emission and meeting practical application requirements.

[0026] It should be noted that insulator 2 is injection molded from insulating material, which can be PPA, PCT, and / or EMC, depending on the specific process. Encapsulation 3 can be a cured colloid, such as epoxy resin or silicone. Preferably, the color of encapsulation 3 is the same as that of insulator 2, for example, both insulator 2 and encapsulation 3 are white or black, so that while insulator 2 and encapsulation 3 reflect or absorb light from LD chip 13, the appearance of the laser reflector device remains consistent.

[0027] It should also be noted that when the LD chip 13 is die bonded, conductive adhesive or eutectic bonding can be used to fix the LD chip 13 to the top surface of the first electrode 11, and the bottom electrode of the LD chip 13 can be electrically connected to the first electrode 11. Then, gold wire or other electrical connectors can be used to electrically connect the top electrode of the LD chip 13 to the second electrode 12 to ensure the stability of the electrical connection between the LD chip 13 and the first electrode 11 and the second electrode 12.

[0028] It should also be noted that when the LD chip has a cuboid structure, the narrow side of the LD chip is the light-emitting surface.

[0029] As a preferred embodiment, such as Figure 2 and Figure 5As shown, the insulator 2 includes an integrally formed partition segment 21 and an annular protrusion 22. The partition segment 21 is located between the first electrode 11 and the second electrode 12, so as to insulate the first electrode 11 and the second electrode 12 and ensure the stability of the electrical connection of the LD chip 13. The annular protrusion 22 is located on top of the partition segment 21 and surrounds the LD chip 13. At the same time, the annular protrusion 22 provides a limit for the light-transmitting element and ensures the convenience of the light-transmitting element filling the interior of the annular protrusion 22.

[0030] Optionally, during the molding of the insulator 2, multiple first electrodes 11 and multiple second electrodes 12 can be arranged in an array to form an integral electrode support 1. The electrode support 1 can then be embedded into an injection mold with multiple bosses, ensuring that the multiple bosses of the mold abut against the top surface of the support 1. By filling the cavity of the mold with molten insulating material, a partition segment 21 can be formed in the gap between the first electrodes 11 and the second electrodes 12. At the same time, an annular protrusion 22 is formed on the top of the support 1, completing the batch molding of the insulator 2 on the top surface of the support 1, further ensuring the large-scale production of the laser light-emitting device.

[0031] More specifically, such as Figure 2 , Figure 3 , Figure 5 and Figure 6 As shown, the annular protrusion 22 includes a first enclosure wall 222, a second enclosure wall 223, and a connecting wall 224. The connecting wall 224 is connected to the partition section 21. The first enclosure wall 222 is located on one side of the connecting wall 224, and the second enclosure wall 223 is located on the other side of the connecting wall 224, with the first enclosure wall 222 and the second enclosure wall 223 arranged opposite to each other. The first enclosure wall 222, the connecting wall 224, and the second enclosure wall 223 are connected to form a U-shaped protrusion on the top surface of the bracket 1, with the cut surface 14 located inside the U-shaped protrusion.

[0032] It is understandable that when the LD chip 13 is die-bonded to the top surface of the first electrode 11, the first enclosure wall 222, the connecting wall 224, and the second enclosure wall 223 can be used to encapsulate the light-transmitting element while surrounding the LD chip 13 on three sides, providing a light emission channel for the LD chip 13 and ensuring the light utilization rate of the LD chip 13. Furthermore, by arranging the cutting surface 14 inside the U-shaped protrusion, when cutting the overall packaged device along the cutting surface 14, it is ensured that the cutting surface 14 of the insulator 2 is formed inside the first enclosure wall 222 and the second enclosure wall 223, avoiding cutting the connecting wall 224. This reduces the amount of cutting of the insulator 2 and lowers the cutting resistance when cutting the insulator 2. This reduces the problem of chipping or cracking at the edges of the cutting surface 14 of the first enclosure wall 222 and the cutting surface 14 of the second enclosure wall 223, effectively improving the flatness of the edge of the light emission window 221, avoiding the impact of chipping at the edge of the light emission window 221 on the shape of the light spot formed by the laser light-emitting device, and improving the optical quality of the light emission window 221.

[0033] Of course, in other embodiments, the annular protrusion 22 may also be semi-circular, in which case the cutting surface 14 is located inside the diameter section of the semi-circular annular protrusion 22.

[0034] As an optional embodiment, such as Figure 3 and Figure 6 As shown, the dividing segment 21 extends along a first direction, which is the width direction of the support 1. The dividing segment 21 forms a preset length L in the first direction. When the light-transmitting element is arranged inside the annular protrusion 22 and the side of the light-transmitting element is exposed through the light-emitting window 221, the width of the light-transmitting element in the first direction is the preset length L. A die-bonding position is formed on the top surface of the first electrode 11. The LD chip 13 is die-bonded to the die-bonding position. A preset distance D is formed between the die-bonding position and the inner wall of the annular protrusion 22. The ratio between the preset distance D and the preset length L is 0.3 to 0.7.

[0035] It is understandable that by setting the ratio of the preset spacing D to the preset length L to 0.3 to 0.7, sufficient spacing can be ensured between the LD chip 13 and the inner wall of the annular protrusion 22 after die bonding, avoiding contact between the LD chip 13 and the insulator 2 and preventing any impact on the heat dissipation of the LD chip 13. Simultaneously, by ensuring that the LD chip 13 is located within the surrounding space of the annular protrusion 22, the light emitted by the LD chip 13 can cover the edge of the light emission window 221. This allows the shape of the light spot emitted by the laser light-emitting device to be controlled using the edge shape of the light emission window 221, thereby ensuring that the beam emitted by the laser light-emitting device meets the user's requirements. Specifically, the ratio of the preset spacing D to the preset length L can be 0.3, 0.4, 0.5, 0.6, or 0.7, but is not limited to these values.

[0036] As one specific embodiment, such as Figures 1 to 3 As shown, the cutting surface 14 is a plane. After cutting the entire packaged device along the cutting surface 14 to form the light-emitting window 221, the edge of the light-emitting window 221 is a straight edge. When the light from the LD chip 13 is emitted through the edge of the light-emitting window 221, the laser light-emitting device can form a long rectangular light spot, so that the laser light-emitting device can be applied to application scenarios such as measurement, guidance or alignment, which meets the actual needs of users. At the same time, the light-emitting channel formed by the edge of the light-emitting window 221 and the light-transmitting element simplifies the optical system of the laser light-emitting device.

[0037] It should be noted that, in this embodiment, the ratio of the preset spacing D to the preset length L is preferably 0.6.

[0038] As another specific embodiment, such as Figures 4 to 6 As shown, the cutting surface 14 forms a first cutting segment 141 and two second cutting segments 142. The first cutting segment 141 is located between the two second cutting segments 142 and protrudes outward from the second cutting segments 142. The side of the light-emitting window 221 formed by the package body 3 forms a third cutting segment 31 and two fourth cutting segments 32. The third cutting segment 31 is located above the first cutting segment 141 and has the same shape as the first cutting segment 141. The fourth cutting segment 32 is located above the second cutting segment 142 and has the same shape as the second cutting segment 142. Both the first cutting segment 141 and the third cutting segment 31 are arc-shaped bosses.

[0039] After cutting the entire packaged device along the cutting surface 14 to form the light-emitting window 221, the edge shape of the light-emitting window 221 is determined by the corresponding shapes of the first cutting segment 141 and the third cutting segment 31. When the first cutting segment 141 and the third cutting segment 31 are arc-shaped protrusions, the edge of the light-emitting window 221 is an outwardly convex edge with an arc curve. At this time, the laser light-emitting device forms a light-emitting window 221 with a lens shape. When the light from the LD chip 13 is emitted through the outwardly convex edge of the light-emitting window 221, the light from the LD chip 13 can be intercepted by the outwardly convex edge with an arc curve, so that the laser light-emitting device can form a circular light spot, thereby ensuring that the laser light-emitting device can output a widely used laser shape to meet user needs.

[0040] It should be noted that, in this embodiment, the ratio of the preset spacing D to the preset length L is preferably 0.4.

[0041] In this embodiment, the light-transmitting element is transparent adhesive, which can completely encapsulate the LD chip 13, isolating the LD chip 13 from the external environment to improve the service life of the LD chip 13. The bottom surface of the package 3 and the support 1 form a preset height, which is equal to the thickness of the transparent adhesive. Thus, when the package 3 covers the top surface of the insulator 2, the transparent adhesive can support the package 3, preventing the package 3 from drooping into the annular protrusion 22. This effectively avoids the package 3 drooping and blocking the light transmission of the LD chip 13, further ensuring the light emission quality of the laser light-emitting device.

[0042] Furthermore, the length and width dimensions of the package 3 are preferably equal to the length and width dimensions of the outer wall of the annular protrusion 22, so as to ensure that the package 3 can cover the transparent adhesive inside the annular protrusion 22, and at the same time ensure the appearance consistency of the laser light-emitting device after packaging.

[0043] Accordingly, a second aspect of the present invention provides a light-emitting device packaging module, such as... Figures 7 to 11 As shown, the light-emitting device packaging module integrates multiple laser light-emitting devices as described in any of the above embodiments. The light-emitting device packaging module includes an insulating layer 42, a packaging layer 43, and multiple electrode strips 41. The multiple electrode strips 41 are arranged in an array, and an insulating gap 411 is formed between two adjacent electrode strips 41. The bottom of the insulating layer 42 fills the insulating gap 411, and the top of the insulating layer 42 is higher than the electrode strips 41.

[0044] The top of the insulating layer 42 has a plurality of arrayed filling grooves 421, each filling groove 421 having two adjacent electrode strips 41 arranged therein, and one of the electrode strips 41 having an LD chip 13 die bonded therein, and each filling groove 421 being filled with transparent adhesive; the encapsulation layer 43 is located on the top surface of the insulating layer 42, and the encapsulation layer 43 has a first cutting line 431 and a second cutting line 432 arranged in a cross pattern, one of the first cutting line 431 and the second cutting line 432 being located above the filling groove 421.

[0045] Using the light-emitting device packaging module of this embodiment, multiple electrode strips 41 can be arranged in an array and then connected into a whole by the bottom of the insulating layer 42. Subsequently, the LD chip 13 is die-bonded in multiple filling slots 421 at the same time, and transparent adhesive is also applied at the same time. This allows multiple optical structures to be arranged in the insulating layer 42 at the same time, and the electrode strips 41, LD chip 13 and transparent adhesive are encapsulated at the same time by the encapsulation layer 43, realizing the large-scale integration of multiple laser light-emitting devices and effectively improving the mounting efficiency of laser light-emitting devices.

[0046] Furthermore, by cutting the entire light-emitting device packaging module along the first cutting line 431 and the second cutting line 432, an independent laser light-emitting device can be obtained. Since one of the first cutting line 431 and the second cutting line 432 is located above the filling groove 421, when cutting the light-emitting device packaging module, the transparent adhesive in the filling groove 421 can be exposed to the side of the laser light-emitting device, realizing the side emission of the laser light-emitting device. There is no need to arrange complex optical structures inside the laser light-emitting device, which effectively simplifies the packaging process of the laser light-emitting device.

[0047] Specifically, such as Figure 8 and Figure 9 As shown, the filling groove 421 is provided with an opening side 422 facing the light-emitting surface of the LD chip 13. The first cutting line 431 is located above the opening side 422. Therefore, when cutting the light-emitting device packaging module along the first cutting line 431, the cutting surface 14 of the insulator 2 is located at the opening side 422 of the filling groove 421, so that the middle of the cutting position is empty, reducing the cutting amount of the insulator 2, thereby reducing the problem of chipping or cracking at the edge of the cutting surface 14 of the insulator 2, ensuring the flatness of the edge of the light-emitting window 221, avoiding the impact of chipping at the edge of the light-emitting window 221 on the shape of the light spot formed by the laser light-emitting device, and improving the optical quality of the light-emitting window 221.

[0048] Accordingly, a third aspect of the present invention provides a method for packaging a light-emitting device, used to form a plurality of laser light-emitting devices as described in any of the above embodiments, such as... Figures 7 to 12 As shown, the packaging method for light-emitting devices includes: S1, arrange multiple electrode strips 41 in an array, and connect any two adjacent electrode strips 41 to form an electrode strip support, such as Figure 7 As shown. Specifically, after multiple electrode strips 41 are arranged in an array, narrow metal ribs can be used to temporarily connect any two adjacent electrode strips 41 to ensure the relative positions of the electrode strips 41.

[0049] S2, insulator 2 is filled on one side of the electrode strip support, and the bottom of the insulator 2 is filled into the gap between two adjacent electrode strips 41. At the same time, multiple annular dams are formed on the top of the electrode strip support, such as... Figure 8 As shown.

[0050] Specifically, after the electrode strip support is formed, it can be embedded into the injection mold. Multiple bosses are provided in the cavity of the injection mold. When the electrode strip support is embedded into the injection mold, each boss needs to abut against two adjacent electrode strips 41 so that when the molten insulating material is filled in the cavity, the dividing section 21 at the bottom of the insulator 2 can be formed between two adjacent electrode strips 41, and multiple annular dams can be formed on the top of the electrode strips 41.

[0051] S3, determine that two electrode strips 41 are arranged in each annular dam, die bond the LD chip 13 to one of the electrode strips 41, and electrically connect the other electrode strip 41 to the LD chip 13, such as... Figure 9 As shown.

[0052] S4, confirm that the LD chip 13 is stably die bonded, and fill the filling groove 421 with transparent colloid.

[0053] S5, confirm the curing of the transparent colloid, and apply an encapsulating adhesive layer to the top surface of the insulator 2 to obtain the overall encapsulation module, wherein the length and width of the encapsulating adhesive layer are equal to the length and width of the electrode strip support, such as Figure 10 As shown.

[0054] S6, confirm the curing of the encapsulating adhesive layer, and determine the specific positions of the first cutting line 431 and the second cutting line 432 on the top surface of the encapsulating adhesive layer, wherein the first cutting line 431 is located above the opening side 422 of the filled groove 421, such as... Figure 11 As shown.

[0055] S7, cut along the first cutting line 431 and the second cutting line 432 to cut the overall packaging module into multiple laser light-emitting devices. Among them, the first cutting line 431 is located inside the annular dam so that the transparent adhesive body is exposed outside the annular dam after cutting, ensuring that the exposed position of the transparent adhesive body can form a light-emitting window 221 to facilitate the emission of light from the laser light-emitting device.

[0056] The light-emitting device packaging method of this embodiment can arrange multiple electrode strips 41 in an array and connect them into a whole using the bottom of the insulator 2. Then, die-bonded LD chips 13 are simultaneously placed in multiple filling slots 421, and transparent adhesive is simultaneously arranged. This can realize the simultaneous arrangement of multiple optical structures in the insulating layer 42, and the electrode strips 41, LD chips 13 and transparent adhesive are simultaneously encapsulated using the encapsulation layer 43, thereby realizing the large-scale integration of multiple laser light-emitting devices and effectively improving the mounting efficiency of laser light-emitting devices.

[0057] Furthermore, by cutting the entire light-emitting device packaging module along the first cutting line 431 and the second cutting line 432, an independent laser light-emitting device can be obtained. Since one of the first cutting line 431 and the second cutting line 432 is located above the filling groove 421, when cutting the light-emitting device packaging module, the transparent adhesive in the filling groove 421 can be exposed to the side of the laser light-emitting device, realizing the side emission of the laser light-emitting device. There is no need to arrange complex optical structures inside the laser light-emitting device, which effectively simplifies the packaging process of the laser light-emitting device.

[0058] The above description represents the preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A laser light-emitting device, characterized in that, The package includes a support, an insulator, and a package. The support includes a first electrode and a second electrode arranged at intervals. An LD chip is die-bonded to the first electrode, and the LD chip is electrically connected to the second electrode. The bottom of the insulator is located between the first electrode and the second electrode, and the top of the insulator has an annular protrusion facing at least three adjacent sides of the LD chip. A light-transmitting element is disposed inside the annular protrusion. The package is located on the top surface of the insulator and covers the light-transmitting element. The side of the bracket is provided with a cut surface, which extends to the light-transmitting element and the package to form a light-emitting window between the bracket, the insulator and the package. At least one side of the LD chip is a light-emitting surface, which faces the light-emitting window so that the light from the LD chip is emitted from the light-emitting window.

2. The laser light-emitting device as described in claim 1, characterized in that, The insulator includes an integrally formed partition segment and an annular protrusion, the partition segment being located between the first electrode and the second electrode, and the annular protrusion being located at the top of the partition segment.

3. The laser light-emitting device as described in claim 2, characterized in that, The annular protrusion includes a first enclosure wall, a second enclosure wall, and a connecting wall. The connecting wall is connected to the dividing section. The first enclosure wall is located on one side of the connecting wall, and the second enclosure wall is located on the other side of the connecting wall. The first enclosure wall and the second enclosure wall are arranged opposite to each other. The first enclosure, the connecting wall, and the second enclosure are connected to form a U-shaped protrusion on the top surface of the bracket, and the cutting surface is located inside the U-shaped protrusion.

4. The laser light-emitting device as described in claim 2, characterized in that, The dividing segment extends along a first direction, which is the width direction of the bracket, and the dividing segment forms a preset length in the first direction; a die-bonding position is formed on the top surface of the first electrode, and the LD chip is die-bonded to the die-bonding position, and a preset distance is formed between the die-bonding position and the inner wall of the annular protrusion, and the ratio between the preset distance and the preset length is 0.3~0.

7.

5. The laser light-emitting device as described in claim 4, characterized in that, The cutting surface is a plane.

6. The laser light-emitting device as described in claim 4, characterized in that, The cutting surface forms a first cutting segment and two second cutting segments, the first cutting segment being located between the two second cutting segments and protruding outward from the second cutting segments; The package body forms a third cutting segment and two fourth cutting segments on the side of the light-emitting window. The third cutting segment is located above the first cutting segment and has the same shape as the first cutting segment. The fourth cutting segment is located above the second cutting segment and has the same shape as the second cutting segment. Both the first cutting segment and the third cutting segment are arc-shaped bosses.

7. The laser light-emitting device as described in claim 1, characterized in that, The light-transmitting component is a transparent adhesive, and the bottom surface of the encapsulation body forms a preset height with the bracket, the preset height being equal to the thickness of the transparent adhesive.

8. A light-emitting device packaging module, integrating multiple laser light-emitting devices as described in any one of claims 1 to 7, characterized in that, The light-emitting device packaging module includes an insulating layer, a packaging layer, and multiple electrode strips. The multiple electrode strips are arranged in an array, and an insulating gap is formed between two adjacent electrode strips. The bottom of the insulating layer fills the insulating gap, and the top of the insulating layer is higher than the electrode strips. The top of the insulating layer has a plurality of arrayed filling slots, each filling slot containing two adjacent electrode strips, one of which has an LD chip die bonded to it; and each filling slot is filled with transparent adhesive. The encapsulation layer is located on the top surface of the insulating layer, and the encapsulation layer is formed with a first cutting line and a second cutting line that are intersected, one of which is located above the filling groove.

9. The light-emitting device packaging module as described in claim 8, characterized in that, The filling groove is provided with an open side facing the light-emitting surface of the LD chip, and the first cutting line is located above the open side.

10. A method for packaging a light-emitting device, used to form a plurality of laser light-emitting devices according to any one of claims 1 to 7, characterized in that, The light-emitting device packaging method includes: Multiple electrode strips are arranged in an array, and any two adjacent electrode strips are connected to form an electrode strip support; An insulator is filled on one side of the electrode strip support, and the bottom of the insulator is filled into the gap between two adjacent electrode strips. At the same time, multiple annular dams are formed on the top of the electrode strip support. Two electrode strips are arranged in each of the annular dams. An LD chip is die-bonded to one of the electrode strips, and the other electrode strip is electrically connected to the LD chip. After confirming that the LD chip is stably die-bonded, a transparent colloid is filled into the filling groove; Once the transparent colloid has cured, an encapsulating adhesive layer is applied to the top surface of the insulator to obtain an overall encapsulation module, wherein the length and width of the encapsulating adhesive layer are equal to the length and width of the electrode strip support. Once the encapsulating adhesive layer is cured, the positions of a first cutting line and a second cutting line are determined on the top surface of the encapsulating adhesive layer, wherein the first cutting line is located above the opening side of the filling groove. The overall packaging module is cut into multiple laser light-emitting devices by cutting along the first cutting line and the second cutting line, wherein the first cutting line is located within the annular dam.

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