Electronic device

Abstract

The application provides an electronic device for improving the assembly stability between a display screen and a shell and improving the use reliability of the electronic device. The electronic device comprises a shell, a display screen, first adhesive glue and second adhesive glue. The shell is provided with a mounting groove, and the opening of the mounting groove is located on the upper surface of the shell. The mounting groove comprises a groove bottom wall surface and a groove side wall surface. The groove bottom wall surface is arranged opposite to the opening of the mounting groove, the groove side wall surface is arranged around the groove bottom wall surface and connected with the groove bottom wall surface, and the groove side wall surface is provided with a boss. The display screen comprises a protective cover plate and a display panel. The protective cover plate is located on the side of the boss away from the groove bottom wall surface, the display panel is located on the side of the protective cover plate facing the groove bottom wall surface, and the display panel is located on the side of the boss away from the groove side wall surface. The first adhesive glue is bonded between the protective cover plate and the boss, and the second adhesive glue is bonded between the display panel and the groove bottom wall surface. The bonding strength of the second adhesive glue is less than that of the first adhesive glue.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to an electronic device. Background Technology

[0002] With the continuous development of science and technology, mobile phones and other electronic devices are widely used in people's daily lives and work, becoming indispensable daily necessities. People's requirements for electronic devices are getting higher and higher. Currently, electronic devices generally use displays to show text and images. The displays are often installed on the casing by adhesive bonding, which results in poor assembly stability between the display and the casing, reducing the reliability of the electronic devices. Summary of the Invention

[0003] This application provides an electronic device for improving the assembly stability between the display screen and the housing, thereby improving the reliability of the electronic device.

[0004] This application provides an electronic device, including a housing, a display screen, a first adhesive and a second adhesive. The housing is provided with a mounting groove, the opening of which is located on the upper surface of the housing. The mounting groove includes a bottom wall and a side wall. The bottom wall is opposite to the opening of the mounting groove, and the side wall surrounds and is connected to the bottom wall. The side wall is provided with a boss.

[0005] The display screen includes a protective cover and a display panel. The protective cover is located on the side of the protrusion away from the bottom wall of the groove, and the display panel is located on the side of the protective cover facing the bottom wall of the groove, and on the side of the protrusion away from the side wall of the groove.

[0006] The first adhesive is bonded between the protective cover and the boss, and the second adhesive is bonded between the display panel and the bottom wall of the groove, wherein the adhesive strength of the second adhesive is less than that of the first adhesive.

[0007] In the electronic device described in this application, the first adhesive is used to bond the protective cover plate and the boss, and the second adhesive is used to bond the display panel and the bottom wall of the mounting groove. The use of both the first and second adhesives improves the assembly stability between the display screen and the housing, effectively enhancing the reliability of the electronic device. Furthermore, because the adhesive strength of the second adhesive is less than that of the first adhesive, in the event of a drop, the second adhesive will not pull on the display panel, causing delamination between the display panel and the protective cover plate. This reduces the risk of damage to the display screen and ensures the reliability of the electronic device.

[0008] In one embodiment, the modulus of the second adhesive is less than that of the first adhesive, which can prevent the second adhesive from pressing against the display screen and causing under-screen spots.

[0009] In one embodiment, the display screen further includes a side sealant located between the display panel and the boss, bonded to the lower surface of the protective cover, and covering the peripheral side surface of the display panel.

[0010] During the process of the electronic device being dropped, the side sealant can bond and hold the protective cover and the display panel together, preventing the display panel from delaminating from the protective cover and ensuring the reliability of the display screen.

[0011] In one embodiment, the display screen further includes an optical adhesive layer and a back protective layer, the optical adhesive layer being located between the display panel and the protective cover, and the back protective layer being located on the side of the display panel facing away from the protective cover.

[0012] The side sealant also covers the peripheral surfaces of the optical adhesive layer and the peripheral surfaces of the back protective layer.

[0013] During the process of the electronic device being dropped, the side sealant can also bond and hold the optical adhesive layer and the back protective layer together, preventing the display screen from delaminating and ensuring the reliability of the display screen.

[0014] In one embodiment, the second adhesive is also bonded between the peripheral side of the display panel and the boss, and is disposed around the display panel to further increase the assembly stability between the display screen and the housing.

[0015] In one embodiment, the housing is provided with a sound outlet, or the display screen is provided with a sound outlet, or the housing and the display screen are combined to form a sound outlet;

[0016] The electronic device also includes a third adhesive, which surrounds the sound outlet and is connected between the display panel and the bottom wall of the slot, and is connected to the second adhesive. This prevents external water or dust and other impurities from entering the interior of the electronic device through the sound outlet, thereby improving the sealing performance of the electronic device.

[0017] In one embodiment, the second adhesive includes two sub-adhesives, which are respectively connected to opposite sides of the third adhesive and are both connected to the third adhesive.

[0018] The third adhesive, the second adhesive, and the first adhesive can form a "handshake" structure at the sound outlet, which can prevent external water or dust and other impurities from entering the interior of the electronic device through the sound outlet, thereby improving the sealing performance of the electronic device.

[0019] In one embodiment, the display screen includes a display portion, a connecting portion, and a bending portion. The connecting portion is located on the non-display side of the display portion and is spaced apart from the display portion. The bending portion connects the display portion and the connecting portion. Along the thickness direction of the electronic device, the bending portion is offset from the second adhesive to avoid interference between the second adhesive and the bending portion, to prevent the second adhesive from affecting the bending portion, and to ensure the reliability of the display screen.

[0020] In one embodiment, the adhesive strength of the second adhesive is greater than or equal to 2 MPa and less than or equal to 3 MPa. That is, the second adhesive is made of a low-viscosity glue. When the electronic device is dropped, the second adhesive will not pull on the display screen, causing delamination, thus ensuring the reliability of the display screen. Furthermore, when the display screen needs to be disassembled, the low viscosity of the second adhesive not only reduces the difficulty of disassembly but also reduces the risk of damage during the disassembly process, ensuring a high yield rate for the disassembly of the display screen.

[0021] In one embodiment, the elastic modulus of the second adhesive is less than or equal to 5 MPa. That is, the second adhesive is made of a low-modulus adhesive. Because the second adhesive has a low modulus, it avoids the second adhesive from pressing against the display screen and causing under-screen defects.

[0022] In one embodiment, the housing includes a back cover and a middle frame, the middle frame being mounted inside the back cover, and the middle frame having the mounting groove. That is, the housing adopts a Uni architecture.

[0023] In one embodiment, the boss includes two first boss portions and a second boss portion, with the two first boss portions spaced apart. The second boss portion is located on the top of the housing and connected between the two first boss portions. The width of the second boss portion is greater than the width of the first boss portion. This allows for a narrow bezel design of the electronic device while ensuring the assembly stability of the housing and the display screen, thus improving the user experience of the electronic device. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below.

[0025] Figure 1 This is a schematic diagram of the structure of the electronic device provided in this application;

[0026] Figure 2 yes Figure 1 A partial structural schematic diagram of the electronic device shown in the first embodiment;

[0027] Figure 3 yes Figure 1 A schematic cross-sectional view of the electronic device shown in the first embodiment after being cut along point II.

[0028] Figure 4 yes Figure 1 A schematic cross-sectional view of the electronic device shown in the first embodiment after being cut along line II-II;

[0029] Figure 5 yes Figure 1 A schematic diagram of the cross-sectional structure of the display screen along line III-III in the electronic device shown;

[0030] Figure 6 yes Figure 1 A partial structural schematic diagram of the electronic device shown in the second embodiment;

[0031] Figure 7 yes Figure 1 The diagram shows a cross-sectional view of the electronic device after it has been cut along point II in the second embodiment. Detailed Implementation

[0032] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0033] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of the electronic device 1000 provided in this application.

[0034] The electronic device 1000 can be a mobile phone, tablet computer, laptop computer, in-vehicle infotainment system, smartwatch, smart bracelet, POS machine (point of sales terminal), or other electronic products. In the following description, this application will use a mobile phone as an example. For ease of description, the width direction of the electronic device 1000 is defined as the X-axis, the length direction as the Y-axis, and the thickness direction as the Z-axis. The X-axis, Y-axis, and Z-axis are mutually perpendicular. The X-axis and Y-axis form the XY plane, the X-axis and Z-axis form the XZ plane, and the Y-axis and Z-axis form the YZ plane.

[0035] Electronic device 1000 includes a housing 100, a display screen 200, a processor (not shown), a speaker module (not shown), and a camera module 300. The display screen 200 is mounted on one side of the housing 100. The processor (not shown), speaker module (not shown), and camera module 300 are all mounted inside the housing 100. The processor may be a central processing unit (CPU). The speaker module and camera module 300 are both electrically connected to the processor. The speaker module operates according to audio signals sent by the processor, and the sound emitted by the speaker module can be transmitted to the external environment through the sound outlet 101 to enable the electronic device 1000 to produce sound. The camera module 300 operates according to camera signals sent by the processor, and the camera module 300 can receive external light through the light-transmitting hole 202 to achieve image capture.

[0036] Please see Figures 2 to 4 , Figure 2 yes Figure 1 The schematic diagram shown is a partial structural diagram of the electronic device 1000 in the first embodiment. Figure 3 yes Figure 1 The diagram shows a cross-sectional view of the electronic device 1000 after being cut along point II in the first embodiment. Figure 4 yes Figure 1 The illustrated electronic device 1000 is shown as a cross-sectional view of its structure after being cut along line II-II in the first embodiment. Figure 2 The display screen 200 of the electronic device 1000 is not shown. It should be understood that when cut along point II, it means cut along the plane containing line II, and other similar descriptions in this document can be understood in the same way.

[0037] The housing 100 is provided with a mounting groove 102. The mounting groove 102 is located in the middle of the housing 100. The opening of the mounting groove 102 is located on the upper surface 1001 of the housing 100. The mounting groove 102 is recessed from the upper surface 1001 of the housing 100 to the lower surface 1002 (in the negative Z-axis direction shown in the figure). The mounting groove 102 includes a bottom wall surface 1021 and a side wall surface 1022. The bottom wall surface 1021 is disposed opposite to the opening of the mounting groove 102. The side wall surface 1022 is disposed around the bottom wall surface 1021 and connects the bottom wall surface 1021 and the upper surface 1001 of the housing 100.

[0038] It should be noted that the directional terms such as "up" and "down" used in this application are descriptions based on the orientation shown in the accompanying drawings, with "up" referring to the positive direction of the Z-axis and "down" referring to the negative direction of the Z-axis. They do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application.

[0039] The housing 100 also includes a boss 103. The boss 103 is located on the side wall 1022 of the groove and protrudes from the side wall 1022 towards the mounting groove 102, connecting with the bottom wall 1021 of the groove. The upper surface 103a of the boss 103 is located between the bottom wall 1021 of the groove and the upper surface 1001 of the housing 100, and is spaced apart from both the bottom wall 1021 and the upper surface 1001 of the housing 100. That is, the boss 103 is recessed relative to the upper surface 1001 of the housing 100.

[0040] In this embodiment, the boss 103 may be annular and is disposed around the bottom wall 1021 of the groove. The boss 103 includes two first boss portions 1031, a second boss portion 1032, and a third boss portion 1033. The two first boss portions 1031 are spaced apart along the width direction of the housing 100. The second boss portion 1032 is located at the top of the housing 100 and is connected between the two first boss portions 1031. The third boss portion 1033 is located at the bottom of the housing 100 and is connected to the two first boss portions 1031, and is spaced apart from the second boss portion 1032. The width of the first boss portion 1031 is a first width W1, the width of the second boss portion 1032 is a second width W2, and the width of the third boss portion 1033 is a third width W3. The first width W1 is smaller than the second width W2, and the second width W2 is smaller than the third width W3. For example, W1 = 0.5mm, W2 = 0.4mm, and W3 = 0.65mm. With this setting, a narrow bezel design of the electronic device 1000 can be achieved while ensuring the assembly stability of the housing 100 and the display screen 200, which helps to improve the user experience of the electronic device 1000.

[0041] It should be noted that the directional terms such as "top" and "bottom" used in this application are descriptions based on the orientation shown in the accompanying drawings, with "top" referring to the positive Y-axis direction and "bottom" referring to the negative Y-axis direction. They do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application.

[0042] In this embodiment, the housing 100 adopts a uni architecture. The housing 100 includes a rear cover 110 and a middle frame 120, with the middle frame 120 mounted inside the rear cover 110. The rear cover 110 is provided with a mounting groove 1101, the opening of which is located on the upper surface 1102 of the rear cover 110. The mounting groove 1101 is recessed from the upper surface 1102 of the rear cover 110 towards the lower surface 1103 (in the negative Z-axis direction shown in the figure). The lower surface 1103 of the rear cover 110 is the lower surface 1002 of the housing 100. For example, the rear cover 110 may be a battery cover for an electronic device 1000.

[0043] The middle frame 120 is mounted in the mounting slot 1101, and at least a portion of the middle frame 120 protrudes relative to the upper surface 1102 of the rear cover 110. Specifically, the middle frame 120 can be detachably mounted to the rear cover 110 to facilitate the repair and replacement of internal components or modules of the electronic device 1000. The middle frame 120 includes the upper surface 1001 of the housing 100 and is provided with a sound outlet 101 and a mounting slot 102. In some other embodiments, the housing 100 may not employ a uni architecture; in this case, the housing 100 does not include the rear cover 110 and the middle frame 120, and this application does not impose specific limitations on this.

[0044] The display screen 200 is mounted in the mounting slot 102. The display screen 200 can be an LCD (liquid crystal display) or an OLED (organic light-emitting diode) display screen. The display screen 200 has a sound outlet 201 and a light-transmitting hole 202, both of which extend through the display screen 200 along its thickness direction (Z-axis direction in the diagram). Specifically, the sound outlet 201 is located at the top of the display screen 200 and extends through its peripheral side. Along the length direction of the display screen 200 (Y-axis direction in the diagram), the light-transmitting hole 202 is located to one side of the sound outlet 201 and is spaced apart from it. For example, the sound outlet 201 serves as the earpiece hole of the electronic device 1000, and the light-transmitting hole 202 serves as the camera hole of the electronic device 1000, and is positioned opposite to the camera module 300. The width of the sound outlet 201 is a fourth width W4. For example, W4 = 21 mm.

[0045] In some other embodiments, the display screen 200 may not have a sound outlet 201, but the housing 100 may have a sound outlet 201. The sound outlet 201 penetrates the housing 100 along the thickness direction of the housing 100. Alternatively, the housing 100 and the display screen 200 may jointly enclose and form the sound outlet 201. This application does not impose specific restrictions on the formation method of the sound outlet 201.

[0046] In this embodiment, the display screen 200 includes a protective cover plate 210, a display panel 220, an optical adhesive layer 230, a back protective layer 240, and a side sealant 250. The protective cover plate 210 is located on the side of the boss 103 facing away from the bottom wall surface 1021 of the groove. The display panel 220, the optical adhesive layer 230, the back protective layer 240, and the side sealant 250 are all located on the side of the protective cover plate 210 facing the bottom wall surface 1021 of the groove, and are all located on the side of the boss 103 facing away from the side wall surface 1022 of the groove, and are spaced apart from the boss 103. The side sealant 250 is disposed around the display panel 220, the optical adhesive layer 230, and the back protective layer 240.

[0047] The protective cover 210 has an upper surface 211 and a lower surface 212. The upper surface 211 is the surface of the protective cover 210 facing the outside of the electronic device 1000. Along the thickness direction of the protective cover 210 (the Z-axis direction in the figure), the lower surface 212 is disposed opposite to the upper surface 211. The peripheral side surface 213 of the protective cover 210 is connected between the upper surface 211 and the lower surface 212 of the protective cover 210. The protective cover 210 includes a light-transmitting portion 214 and a black edge portion 215. The light-transmitting portion 214 is located in the middle of the protective cover 210. The black edge portion 215 is located at the edge of the protective cover 210, surrounds the light-transmitting portion 214, is connected to the light-transmitting portion 214, and is also spaced apart from the upper surface 103a of the boss 103.

[0048] The display panel 220, optical adhesive layer 230, and back protective layer 240 are all disposed on the side of the lower surface 212 of the protective cover 210 opposite to the upper surface 211. Specifically, the display panel 220 is disposed on the lower surface 212 of the protective cover 210. The display panel 220 is located in the middle region of the lower surface 212 of the protective cover 210. The peripheral side surface 221 of the display panel 220 is located inside the peripheral side surface 213 of the protective cover 210 and is spaced apart from the peripheral side surface 213 of the protective cover 210.

[0049] Please refer to the following: Figure 5 , Figure 5 yes Figure 1 A schematic diagram of the cross-sectional structure of the display screen 200 along line III-III in the electronic device 1000 shown.

[0050] In this embodiment, the display panel 220 includes a display portion 222, a connecting portion 223, and a bending portion 224. The display portion 222 is disposed on the lower surface 212 of the protective cover plate 210. Along the thickness direction of the display panel 220, the connecting portion 223 is located on the side of the display portion 222 away from the protective cover plate 210 and is spaced apart from the display portion 222. The connecting portion 223 is electrically connected to the processor to realize the electrical connection between the display screen 200 and the processor. The bending portion 224 is located on the same side of the display portion 222 and the connecting portion 223 and is connected between the display portion 222 and the connecting portion 223. The bending portion 224 is located at the bottom of the electronic device 1000. It should be noted that the display screen 200 is often packaged using COF (Chip On Film) or COP (Chip On Pi) technology, and the bending portion 224 shown above can also be referred to as the COF area or COP area of ​​the display panel 220.

[0051] The optical adhesive layer 230 is located between the protective cover plate 210 and the display panel 220, and is bonded between the protective cover plate 210 and the display panel 220. Specifically, the optical adhesive layer 230 is located between the lower surface 212 of the protective cover plate 210 and the display panel 220, and is connected between the lower surface 212 of the protective cover plate 210 and the display panel 220.

[0052] The back protective layer 240 is located on the side of the display panel 220 facing away from the protective cover plate 210 to protect the display panel 220. Specifically, the back protective layer 240 is provided on the surface of the display panel 220 facing away from the protective cover plate 210 and on the peripheral side surface 221 of the display panel 220 to protect the display panel 220. The back protective layer 240 may include an iron frame made of iron.

[0053] Side sealant 250 is disposed on the lower surface 212 of the protective cover 210 and covers the peripheral side surface 221 of the display panel 220, the peripheral side surface 231 of the optical adhesive layer 230, and the peripheral side surface 241 of the back protective layer 240 to effectively protect the display panel 220. Specifically, side sealant 250 is bonded to the lower surface 212 of the protective cover 210 and to the peripheral side surface 221 of the display panel 220, the peripheral side surface 231 of the optical adhesive layer 230, and the peripheral side surface 241 of the back protective layer 240. The peripheral side surface 251 of side sealant 250 is located between the peripheral side surface 213 of the protective cover 210 and the peripheral side surface 221 of the display panel 220 to reduce the impact of side sealant 250 on the screen-to-body ratio of the display screen 200, thus helping to improve the screen-to-body ratio and achieve a narrow bezel design for the display screen 200. For example, the thickness of side sealant 250 is 0.3mm.

[0054] In this embodiment, the adhesive strength of the side sealant 250 is greater than or equal to 3 MPa to ensure sufficient adhesive strength. During a drop of the electronic device 1000, the side sealant 250 can bond and hold the protective cover 210, display panel 220, optical adhesive layer 230, and back protective layer 240 together, preventing delamination of the display screen 200 and ensuring its reliability. Furthermore, the side sealant 250 is grease-resistant. Even after prolonged use or in oily environments, the side sealant 250 maintains stable adhesion, ensuring the reliability of the display screen 200.

[0055] For example, the side sealant 250 is formed by a dispensing process. At a temperature of 110°C, the viscosity of the side sealant 250 is 850 cP (110°C). This ensures that the viscosity of the side sealant 250 is low enough to cover the peripheral side surface 221 of the display panel 220, the peripheral side surface 231 of the optical adhesive layer 230, and the peripheral side surface 241 of the back protective layer 240 during its formation.

[0056] In addition, the electronic device 1000 also includes a first adhesive 400, a second adhesive 500, and a third adhesive 600. The first adhesive 400 is located between the protective cover plate 210 and the boss 103, and is bonded between the lower surface of the protective cover plate 210 and the upper surface 103a of the boss 103 to mount the display screen 200 in the mounting groove 102. Specifically, the first adhesive 400 is located between the black border portion 215 and the upper surface 103a of the boss 103, and is bonded between the black border portion 215 and the upper surface 103a of the boss 103. The first adhesive 400 is also located on the side of the side sealant 250 facing away from the display panel 220, and is spaced apart from and surrounds the side sealant 250. For example, the first adhesive 400 may be a hot melt adhesive.

[0057] Please see Figure 3 The second adhesive 500 is located between the display panel 220 and the bottom wall surface 1021 of the mounting groove 102, and is bonded between the display panel 220 and the bottom wall surface 1021 of the mounting groove 102 to enhance the assembly stability between the display screen 200 and the housing 100. Specifically, the second adhesive 500 is located between the back protective layer 240 and the bottom wall surface 1021 of the mounting groove 102, and is bonded between the back protective layer 240 and the bottom wall surface 1021 of the mounting groove 102. The second adhesive 500 is located below the side sealant 250 and is spaced apart from both the side sealant 250 and the boss 103.

[0058] The second adhesive 500 has a lower bonding strength than the first adhesive 400. For example, the bonding strength of the second adhesive 500 is greater than or equal to 2 MPa and less than or equal to 3 MPa. That is, the second adhesive 500 is made of a low-viscosity adhesive. When the electronic device 1000 is dropped, the second adhesive 500 will not pull on the display panel 220, causing delamination between the display panel 220 and the protective cover 210, thus ensuring the reliability of the display screen 200. Moreover, when the display screen 200 needs to be disassembled, the low viscosity of the second adhesive 500 not only reduces the difficulty of disassembling the display screen 200 but also reduces the risk of damage during the disassembly process, ensuring a high yield rate for the disassembly of the display screen 200.

[0059] The modulus of the second adhesive 500 is less than that of the first adhesive 400. For example, the modulus of the second adhesive 500 is less than or equal to 5 MPa. That is, the second adhesive 500 is made of a low-modulus adhesive. Because the second adhesive 500 has a lower modulus, it avoids the second adhesive 500 from pressing against the display screen 200, thus preventing under-screen defects. Furthermore, the volume resistivity of the second adhesive 500 is 2.0E + 16 ohms*cm. That is, the second adhesive 500 also has a high volume resistivity, providing good anti-static breakdown capability.

[0060] In this embodiment, the second adhesive 500 is offset from the bent portion 224 of the display panel 220 along the thickness direction of the electronic device 1000. That is, the projection of the second adhesive 500 on the display panel 220 is spaced apart from the bent portion 224. In other words, the second adhesive 500 and the bent portion 224 do not overlap along the thickness direction of the electronic device 1000 to avoid interference between them, prevent the second adhesive 500 from affecting the bent portion 224, and ensure the reliability of the display screen 200. The second adhesive 500 includes two sub-adhesives 510. Along the width direction of the electronic device 1000, the two sub-adhesives 510 are located on opposite sides of the bent portion 224 of the display panel 220, and are spaced apart from the bent portion 224. For example, one sub-adhesive 510 is located on the left side of the electronic device 1000, and another sub-adhesive 510 is located on the right side of the electronic device 1000.

[0061] Please see Figure 4 The third adhesive 600 is located between the display panel 220 and the bottom wall 1021 of the mounting groove 102, and is bonded between the display panel 220 and the bottom wall 1021 of the mounting groove 102 to enhance the assembly stability between the display screen 200 and the housing 100. Specifically, the third adhesive 600 is located between the back protective layer 240 and the bottom wall 1021 of the mounting groove 102, and is bonded between the back protective layer 240 and the bottom wall 1021 of the mounting groove 102.

[0062] Please see Figure 2The third adhesive 600 is located on the top of the electronic device 1000, surrounding the sound outlet 201 and spaced apart from it, and opposite to the light-transmitting hole 202. Specifically, the third adhesive 600 is connected to the second adhesive 500. The third adhesive 600 is connected between two sub-adhesives 510. For example, the third adhesive 600 can be U-shaped. In this case, the third adhesive 600, the second adhesive 500, the side sealing adhesive 250, and the first adhesive 400 form a "handshake" structure at the sound outlet 201, preventing external water or dust and other impurities from entering the interior of the electronic device 1000 through the sound outlet 201, thereby improving the sealing performance of the electronic device 1000. It should be noted that the third adhesive 600 can be a double-sided adhesive foam or other adhesive structural component.

[0063] Please see Figure 6 and Figure 7 , Figure 6 yes Figure 1 A partial structural schematic diagram of the electronic device 1000 in the second embodiment is shown. Figure 7 yes Figure 1 The diagram shows a cross-sectional view of the electronic device 1000 after being cut along point II in the second embodiment. Figure 6 The display screen 200 of the electronic device 1000 is not shown.

[0064] The difference between the electronic device 1000 shown in this embodiment and the electronic device 1000 shown in the first embodiment is that the second adhesive 500 is also located between the peripheral side surface 221 of the display panel 220 and the boss 103, and is bonded between the peripheral side surface 221 of the display panel 220 and the boss 103. It is also provided around the display panel 220, the optical adhesive layer 230 and the back protective layer 240, and also covers the peripheral side surface 241 of the back protective layer 240 and the peripheral side surface 251 of the side sealing adhesive 250, so as to further improve the assembly stability between the display screen 200 and the housing 100.

[0065] In the electronic device 1000 shown in this application, a first adhesive 400 is used to bond the protective cover 210 and the boss 103, and a second adhesive 500 is used to bond the display panel 220 and the bottom wall 1021 of the mounting groove 102. The first adhesive 400 and the second adhesive 500 are used to improve the assembly stability between the display screen 200 and the housing 100, effectively improving the reliability of the electronic device 1000. Furthermore, because the second adhesive 500 has low viscosity, it will not pull on the display panel 220 and cause delamination between the display panel 220 and the protective cover 210 when the electronic device 1000 is dropped, reducing the risk of delamination of the display screen 200 and ensuring its reliability. Moreover, because the second adhesive 500 has low modulus, it will not push against the display screen 200, thus preventing under-screen defects. In addition, the display screen 200 also uses side sealant 250 to bond and hold the display panel 220 and the protective cover 210 together. This not only protects the display panel 220, but also holds the display panel 220 and the protective cover 210 together in the event of a drop of the electronic device 1000, preventing them from delaminating and further ensuring the reliability of the display screen 200.

[0066] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Where there is no conflict, the embodiments and features in the embodiments of this application can be combined with each other. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device, characterized in that, The device includes a housing, a display screen, a first adhesive, and a second adhesive. The housing has a mounting groove with an opening on its upper surface. The mounting groove includes a bottom wall and a side wall. The bottom wall is opposite to the opening of the mounting groove, and the side wall surrounds and connects to the bottom wall. The side wall has a boss. The display screen includes a protective cover and a display panel. The protective cover is located on the side of the protrusion away from the bottom wall of the groove, and the display panel is located on the side of the protective cover facing the bottom wall of the groove, and on the side of the protrusion away from the side wall of the groove. The first adhesive is bonded between the protective cover and the boss, and the second adhesive is bonded between the display panel and the bottom wall of the groove, wherein the adhesive strength of the second adhesive is less than that of the first adhesive.

2. The electronic device according to claim 1, characterized in that, The modulus of the second adhesive is less than that of the first adhesive.

3. The electronic device according to claim 1 or 2, characterized in that, The display screen also includes a side sealant located between the display panel and the boss, and bonded to the lower surface of the protective cover, covering the peripheral side of the display panel.

4. The electronic device according to claim 3, characterized in that, The display screen also includes an optical adhesive layer and a back protective layer. The optical adhesive layer is located between the display panel and the protective cover, and the back protective layer is located on the side of the display panel away from the protective cover. The side sealant also covers the peripheral surfaces of the optical adhesive layer and the peripheral surfaces of the back protective layer.

5. The electronic device according to any one of claims 1 to 4, characterized in that, The second adhesive is also bonded between the peripheral side surface of the display panel and the protrusion, and is disposed around the display panel.

6. The electronic device according to any one of claims 1 to 5, characterized in that, The housing is provided with a sound outlet, or the display screen is provided with a sound outlet, or the housing and the display screen are combined to form a sound outlet; The electronic device further includes a third adhesive, which surrounds the sound outlet and is connected between the display panel and the bottom wall of the slot, and is connected to the second adhesive.

7. The electronic device according to claim 6, characterized in that, The second adhesive includes two sub-adhesives, which are respectively connected to opposite sides of the third adhesive and are both connected to the third adhesive.

8. The electronic device according to any one of claims 1 to 7, characterized in that, The display screen includes a display part, a connecting part, and a bending part. The connecting part is located on the non-display side of the display part and is spaced apart from the display part. The bending part is connected between the display part and the connecting part. Along the thickness direction of the electronic device, the bending part is misaligned with the second adhesive.

9. The electronic device according to any one of claims 1 to 8, characterized in that, The adhesive strength of the second adhesive is greater than or equal to 2 MPa and less than or equal to 3 MPa.

10. The electronic device according to any one of claims 1 to 9, characterized in that, The modulus of the second adhesive is less than or equal to 5 MPa.

11. The electronic device according to any one of claims 1 to 10, characterized in that, The housing includes a rear cover and a middle frame, the middle frame being installed inside the rear cover, and the middle frame having the mounting groove.

12. The electronic device according to any one of claims 1 to 11, characterized in that, The boss includes two first boss portions and a second boss portion. The two first boss portions are spaced apart. The second boss portion is located on the top of the housing and connected between the two first boss portions. The width of the second boss portion is greater than the width of the first boss portion.

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