A power device connection structure
By designing a hollow heat-conducting cylinder, heat dissipation fins, a cooling fan, and an auxiliary welding mechanism, the problems of difficult local maintenance, welding fume accumulation, and contaminant intrusion in the connection structure of traditional power devices are solved, enabling rapid fault repair and efficient heat dissipation, and improving the convenience of equipment maintenance and operational reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- GUANGDONG LEEHOM MICROELECTRONICS CO LTD
- Filing Date
- 2026-01-30
- Publication Date
- 2026-05-29
AI Technical Summary
Traditional power device connection structures lack local maintenance design, allowing contaminants to enter and cause circuit failures, welding fumes to accumulate and affect connection stability, and the maintenance process is time-consuming, labor-intensive and may damage surrounding components, increasing equipment downtime and maintenance costs.
A connection structure including a hollow heat-conducting cylinder, heat dissipation fins, a cooling fan, an auxiliary welding mechanism, and a sealing ring is designed. Heat is conducted through the hollow heat-conducting cylinder, welding fumes are discharged through the fume exhaust hole, the auxiliary welding mechanism prevents solder bridging, and the sealing ring prevents contaminants from entering, thus achieving localized maintenance and efficient heat dissipation.
It enables rapid replacement of locally faulty components, reduces maintenance difficulty and cost, improves connection stability and reliability, avoids circuit failures caused by flue gas accumulation and pollutant intrusion, and enhances maintenance convenience and equipment operation reliability.
Smart Images
Figure CN122121098A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of integrated circuit technology, and more specifically, relates to a power device connection structure. Background Technology
[0002] Power devices are core semiconductor components in the field of power electronics. They are mainly used for the conversion, control and transmission of electrical energy. They have the core characteristics of withstanding high voltage, high current and low conduction loss. Common types include thyristors and power diodes. They are widely used in new energy power generation, electric vehicles, industrial control, rail transportation, smart grids and other scenarios. They are key components for achieving efficient use of electrical energy and energy-saving operation of equipment.
[0003] Current power device interconnect structures have been found to have at least the following problems: First, in common working environments such as industrial control and electronic equipment operation, the power device connection structure usually adopts a design that integrates multiple power components to meet the circuit function requirements. In actual use, individual power components may fail due to factors such as long-term operation and voltage fluctuations. Traditional connection structures lack targeted local maintenance designs, and contaminants may adhere to the solder pads and internal circuit surfaces. When a single component fails, the entire connection board needs to be heated or the entire device needs to be disassembled for replacement. This not only leads to operational failures such as poor circuit contact and short circuits, but also makes the maintenance process time-consuming and labor-intensive, and may even cause unnecessary damage to surrounding normal components, increasing equipment downtime and maintenance costs.
[0004] Secondly, in the power device soldering and assembly scenario in the electronics manufacturing workshop, the soldering process is a key link to ensure the reliable connection between power components and the connection board. Since power components need to be precisely fitted to the solder pads for installation, the solder pads will be covered by the power components during soldering, making it difficult for the fumes generated by the high temperature melting of the solder to diffuse quickly. This causes the fumes to accumulate in the soldering area, which can lead to the formation of tiny voids in the soldering part, destroying the tight bond between the solder and the pins and solder pads. This, in turn, affects the stability of circuit conduction and connection strength. Long-term use may result in problems such as loose connections and poor contact, reducing the service life and operational reliability of the entire power device connection structure. Summary of the Invention
[0005] To address the aforementioned technical problems, this invention provides a power device connection structure. This structure addresses the issue that individual power components may fail due to prolonged operation, voltage fluctuations, or other factors. Traditional connection structures lack targeted local maintenance designs, and contaminants may adhere to the solder pads and internal circuit surfaces. When a single component fails, the entire connection board must be heated or the entire device must be disassembled for replacement. This not only leads to operational failures such as poor circuit contact and short circuits but also makes the maintenance process time-consuming and labor-intensive. It may even cause unnecessary damage to surrounding normal components, increasing equipment downtime and maintenance costs.
[0006] A power device connection structure includes a power device connection board with a soldering pad fixedly mounted on it. A power component is positioned above the soldering pad, and a connection pin is positioned below the power component. A solder bath is provided on the soldering pad, corresponding to the pin positions of the power component. A circuit connected to the power device connection board is located within the soldering pad. A hollow heat-conducting cylinder is positioned below the power device connection board, and a heat dissipation base plate is positioned below the hollow heat-conducting cylinder. A heat conduction mechanism is provided on the heat dissipation base plate. This mechanism can conduct the heat generated by the power component during operation to the heat dissipation base plate through the hollow heat-conducting cylinder. Furthermore, if a single power component malfunctions, only the corresponding solder bath needs to be heated to remove the component. An auxiliary soldering mechanism is provided above the power device connection board. This auxiliary soldering mechanism can accommodate solder through multiple soldering pads and their solder baths, preventing bridging and short circuits caused by solder overflow during soldering of different power components. It can also exhaust fumes generated during high-temperature soldering.
[0007] Preferably, the heat conduction mechanism includes heat dissipation fins, which are fixedly installed on the circumferential surface of a hollow heat-conducting cylinder. The hollow heat-conducting cylinder has a larger diameter at the top and a smaller diameter at the bottom. Both the hollow heat-conducting cylinder and the heat dissipation fins are located between the power device connecting plate and the heat dissipation base plate. The power device connecting plate and the heat dissipation base plate are connected on both sides by sealing plates. The heat dissipation base plate, the power device connecting plate, and the sealing plates on both sides are fixed to form a channel open on both sides. Filters are symmetrically installed on both sides of the heat dissipation base plate, and the filters are located between the power device connecting plate and the heat dissipation base plate. A cooling fan is fixedly installed on the heat dissipation base plate, and the cooling fan is located below the power device connecting plate. A window is opened on the heat dissipation base plate corresponding to the position of each welding pad. A sealing ring is fixedly installed in each window on the heat dissipation base plate. The sealing ring has an interface and can be connected to the air outlet of a hot air gun. A sealing groove is provided in the sealing ring, and a sealing plug is provided in the sealing ring. A sealing ring is fixedly installed on the sealing plug.
[0008] Preferably, the auxiliary welding mechanism includes a solder channel, a window is provided in the middle of the welding pad, the welding pad is located above the hollow heat-conducting cylinder, an annular baffle is fixedly installed on the welding pad, the annular baffle is fixedly installed above the hollow heat-conducting cylinder, and a flue gas exhaust hole is provided on the hollow heat-conducting cylinder.
[0009] Compared with the prior art, the present invention has the following beneficial effects: In this invention, by providing a sealing ring, a sealing plug, and a sealing ring, the sealing ring can tightly seal the window on the heat dissipation base plate, effectively preventing external dust and impurities from entering the device and protecting the solder pad and circuit from contamination. When a single power component fails, it is not necessary to disassemble the entire device. Only the sealing plug at the corresponding position needs to be removed, and the hot air gun can be connected to the sealing ring to accurately heat the solder bath corresponding to the faulty component. After the solder melts, the faulty component can be quickly removed without heating the entire connecting board, which greatly reduces the difficulty and cost of maintenance and improves the ease of maintenance of the device.
[0010] In this invention, by providing a hollow heat-conducting cylinder and a fume exhaust hole, the high-temperature fumes generated during the welding process enter the hollow heat-conducting cylinder through the solder channel and can be quickly dispersed through the fume exhaust hole, preventing the fumes from accumulating in the welding area. At the same time, after the cooling fan is turned on, the airflow will accelerate the discharge of fumes from the hollow heat-conducting cylinder, completely solving the problem that fumes cannot be discharged in time due to the welding pad being covered by power components. This prevents welding voids and unstable connections caused by fumes, ensuring the reliability and stability of the connection between power components and welding pads.
[0011] In this invention, a hollow heat-conducting cylinder with a heat conduction mechanism, heat dissipation fins, and a cooling fan are used. The hollow heat-conducting cylinder can quickly conduct the heat generated by the power components during operation, and its special structure optimizes the heat transfer path. The heat dissipation fins are fixed to the surface of the hollow heat-conducting cylinder, which greatly expands the heat dissipation contact area, allowing some heat to be dissipated during the transfer process. The cooling fan can draw air from the outside to form an airflow, which quickly removes the heat from the hollow heat-conducting cylinder and the heat dissipation fins. Combined with the heat dissipation base plate, the heat dissipation area is further increased, achieving efficient heat dissipation, effectively controlling the operating temperature of the device, and preventing the power components from experiencing performance degradation or damage due to high temperatures.
[0012] In this invention, an annular baffle with an auxiliary welding mechanism and a solder channel are used. The annular baffle can effectively prevent the molten solder from flowing into the hollow heat-conducting cylinder, avoiding solder waste and internal structural contamination. The solder channel can guide the solder in each solder bath to flow evenly, ensuring that the solder height in each solder bath is consistent, allowing the pins of the power components to fully contact the solder. At the same time, the solder channel can also smoothly guide the high-temperature fumes generated during welding into the hollow heat-conducting cylinder, avoiding the formation of voids in the welded area due to fumes retention, and significantly improving the strength and consistency of the welded connection. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the power component structure of the present invention; Figure 3 This is a schematic diagram of the heat dissipation base plate structure of the present invention; Figure 4 This is a schematic diagram of the solder bath structure of the present invention; Figure 5 This is a schematic diagram of the hollow heat-conducting cylinder structure of the present invention; Figure 6 This is a schematic diagram of the cooling fan structure of the present invention; Figure 7 This is a schematic diagram of the filter structure of the present invention; Figure 8 This is the present invention. Figure 5 Schematic diagram of the structure at point A in the middle.
[0014] In the figure, the correspondence between the component names and the attached drawing numbers is as follows: 1. Power device connection plate; 2. Heat dissipation base plate; 3. Power component; 4. Soldering pad; 5. Solder bath; 6. Solder channel; 7. Annular baffle; 8. Hollow heat conduction cylinder; 9. Heat dissipation fins; 10. Flue gas exhaust hole; 11. Sealing ring; 12. Cooling fan; 13. Filter screen; 14. Sealing plug; 15. Sealing ring. Detailed Implementation
[0015] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of the invention.
[0016] Please see Figures 1-8 This invention provides a power device connection structure, including a power device connection plate 1, a soldering pad 4 fixedly mounted on the power device connection plate 1, a power component 3 disposed above the soldering pad 4, and connection pins disposed below the power component 3. A solder trough 5 is opened on the soldering pad 4, corresponding to the position of the pins below the power component 3. A circuit connected to the power device connection plate 1 is provided inside the soldering pad 4. A hollow heat-conducting cylinder 8 is provided below the power device connection plate 1. The hollow heat-conducting cylinder 8 can help to discharge the fumes generated by the solder and flux paste due to high temperature during the soldering process of the power component 3. A heat dissipation base plate 2 is provided below the hollow heat-conducting cylinder 8. The hollow heat-conducting cylinder 8 is used to conduct the heat of the power component 3 during operation to the heat dissipation base plate 2. The heat dissipation base plate 2 is used to increase the heat dissipation area of the entire device during operation.
[0017] The heat dissipation base plate 2 is equipped with a heat conduction mechanism, which can conduct the heat generated by the power components 3 during operation to the heat dissipation base plate 2 through the hollow heat conduction cylinder 8. When a single power component 3 fails, it can remove the component by heating only the corresponding part of the solder bath 5. An auxiliary welding mechanism is provided above the power component connection plate 1. The auxiliary welding mechanism can accommodate solder through multiple sets of welding trays 4 and the solder baths 5 opened on them, preventing bridging and short circuits caused by solder flow when different power components 3 are welded. It can also exhaust the fumes generated by the high temperature during welding.
[0018] like Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, the heat conduction mechanism includes heat dissipation fins 9, which are fixedly installed on the circumferential surface of the hollow heat conduction cylinder 8. The hollow heat conduction cylinder 8 has a larger diameter at the top and a smaller diameter at the bottom. Both the hollow heat conduction cylinder 8 and the heat dissipation fins 9 are located between the power device connection plate 1 and the heat dissipation base plate 2. The heat dissipation fins 9 are used to assist in the transfer of heat generated by the power device 3 during operation from the hollow heat conduction cylinder 8 to the heat dissipation base plate 2, and can still dissipate heat during the transfer process. The power device connection plate 1 and the heat dissipation base plate 2 are connected on both sides by sealing plates. The heat dissipation base plate 2, the power device connection plate 1, and the sealing plates on both sides are fixed to form a channel with open sides. Filters 13 are symmetrically installed on both sides of the heat dissipation base plate 2. The filters 13 are located between the power device connection plate 1 and the heat dissipation base plate 2. The filters 13 are used to filter dust and prevent dust and impurities in the air from entering the soldering pad 4 and causing circuit failure. A cooling fan 12 is fixedly installed on the heat dissipation base plate 2. The cooling fan 12 is located below the power device connection plate 1. The cooling fan 12 can draw air from the outside to form an airflow, passing through each The hollow heat-conducting cylinder 8 carries away the heat. The bottom of the power device connecting plate 1 and the top of the heat dissipation base plate 2 are both heat dissipation media. Windows are provided on the heat dissipation base plate 2 at the positions corresponding to each welding pad 4. A sealing ring 11 is fixedly installed in each window on the heat dissipation base plate 2. The sealing ring 11 has an interface that can connect to the air outlet of the hot air gun. A sealing groove is provided inside the sealing ring 11, and a sealing plug 14 is provided inside the sealing ring 11. A sealing ring 15 is fixedly installed on the sealing plug 14. The sealing ring 15 is used for... The window at the bottom of the heat dissipation base plate 2 is sealed to prevent dust from entering. When one of the power components 3 malfunctions during operation, the hollow heat-conducting cylinder 8 corresponding to the malfunctioning power component 3 can be exposed by removing the corresponding sealing plug 14. After connecting the air outlet of the hot air gun to the sealing ring 11, the hot air gun is turned on. The heat will be transferred in the opposite direction to the corresponding soldering pad 4 through the hollow heat-conducting cylinder 8. After the solder on the heated soldering pad 4 melts, the malfunctioning power component 3 can be quickly removed without heating the entire power component connecting board 1.
[0019] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the auxiliary welding mechanism includes a solder channel 6. After solder is applied into the solder bath 5 and heated, the solder channel 6 allows the solder in each solder bath 5 to flow until the solder height in each solder bath 5 is the same. A window is provided in the center of the welding pad 4, which is located above the hollow heat-conducting cylinder 8. An annular baffle 7 is fixedly installed on the welding pad 4, preventing the molten solder from flowing into the hollow heat-conducting cylinder 8. Because the power component 3 covers the welding pad 4, the fumes during heating may not be able to escape in time, causing voids in the welding area. The solder channel 6 guides the fumes from each solder bath 5 into the hollow heat-conducting cylinder 8, preventing unstable welding caused by fumes. The heat exchange cylinder 8 is provided with a flue gas exhaust hole 10, which is used to disperse the flue gas. At this time, the cooling fan 12 can be turned on to quickly exhaust all the flue gas in the hollow heat exchange cylinder 8 through the flue gas exhaust hole 10. During the welding process, the solder trough 5 on the welding pad 4 is first filled with solder and smoothed. Then, the pins under the power component 3 are connected to the solder trough 5 and placed into the welding pad 4. The sealing plug 14 at the corresponding position is removed to expose the sealing ring 11. The hot air gun is connected to the sealing ring 11 and then turned on. The hot air gun accurately heats the solder at the position to be installed to melt it. The generated flue gas enters the hollow heat exchange cylinder 8 through the solder channel 6. Then, the cooling fan 12 is turned on to quickly cool and solidify the solder and quickly exhaust the flue gas in the hollow heat exchange cylinder 8 through the flue gas exhaust hole 10.
[0020] Working principle: The first step is to check whether the soldering pads 4 on the power device connection board 1 are securely installed, and to confirm that the filters 13 on both sides of the heat sink base plate 2 are free of dust to prevent impurities from entering the circuit and affecting the connection stability. Check whether the sealing plug 14 and the sealing ring 15 tightly seal the window on the heat sink base plate 2 to prevent dust from entering the internal components. Then, fill the solder trough 5 corresponding to the soldering pad 4 with solder and smooth it. Utilize the connectivity of the solder channel 6 to lay the foundation for the uniform flow of solder in the future. At the same time, confirm that the annular baffle 7 is installed in the correct position to prevent the molten solder from flowing into the hollow heat conduction cylinder 8. Ensure that the condition of each component meets the assembly requirements before soldering, and prepare for the subsequent processes.
[0021] The second step is to remove the sealing plug 14 corresponding to the position to be welded, exposing the sealing ring 11 interface on the heat dissipation base plate 2. The hot air gun outlet is precisely aligned with the sealing ring 11. The sealing groove of the sealing ring 11 ensures a sealing effect, reduces heat loss during the heating process, and improves heating efficiency. At the same time, it is confirmed that the cooling fan 12 is in standby mode, and the flue gas exhaust hole 10 on the hollow heat conduction cylinder 8 is checked to ensure that the flue gas generated during welding can be discharged smoothly. This prepares for precise heating of the solder and avoids the stagnation of flue gas affecting the welding quality, ensuring that the welding process is stable and controllable.
[0022] Third, remove the sealing plug 14 corresponding to the position to be welded, exposing the sealing ring 11 interface on the heat dissipation base plate 2. Precisely connect the hot air gun outlet with the sealing ring 11. The sealing groove of the sealing ring 11 ensures the sealing effect, reduces heat loss during the heating process, and improves heating efficiency. At the same time, confirm that the heat dissipation fan 12 is in standby mode and check that the flue gas exhaust hole 10 on the hollow heat conduction cylinder 8 is not blocked, ensuring that the fumes generated during welding can be discharged smoothly. This prepares for precise heating of the solder and avoids the fumes from lingering and affecting the welding quality, ensuring that the welding process is stable and controllable.
[0023] Fourth, start the hot air gun. Heat is transferred in reverse through the hollow heat-conducting cylinder 8 to the corresponding soldering pad 4, causing the solder in the solder bath 5 to gradually melt. The solder channel 6 guides the molten solder to flow in each solder bath 5, ensuring that the solder height in each solder bath 5 is consistent and guaranteeing the uniformity of the soldering connection. The fumes generated during welding enter the hollow heat-conducting cylinder 8 through the solder channel 6. At this time, the cooling fan 12 is immediately started. The outside air is filtered by the filter screen 13 and forms an airflow that passes through the hollow heat-conducting cylinder 8 and the heat dissipation fins 9 on the surface, quickly expelling the fumes in the hollow heat-conducting cylinder 8 through the fume exhaust hole 10, avoiding the fumes from causing voids in the welded parts and effectively ensuring the welding quality.
[0024] Fifth, keep the cooling fan 12 running continuously. The airflow quickly removes the heat from the hollow heat-conducting cylinder 8, the heat dissipation fins 9, and the heat dissipation base plate 2, accelerating the cooling and solidification of the solder in the solder bath 5. This ensures that the pins of the power component 3 are firmly connected to the soldering pad 4, improving the stability and reliability of the connection. During this process, the filter 13 continuously filters impurities in the air to prevent dust from entering the soldering area and affecting the connection stability. The bottom of the power component connection plate 1 and the top of the heat dissipation base plate 2 work together to dissipate heat, further helping the solder to solidify quickly. After the solder has completely solidified, the power component 3 and the power component connection plate 1 achieve a reliable circuit connection and mechanical fixation through the soldering pad 4.
[0025] Step 6: Reinstall the sealing plug 14 back into the sealing ring 11. The sealing ring 15 seals the window of the heat dissipation base plate 2, preventing dust from entering the hollow heat conduction cylinder 8 and the welding plate 4 and causing circuit failure, thus ensuring the long-term stable operation of the device. Then check the connection status of each component, start the equipment, and the heat generated by the power component 3 is transferred to the hollow heat conduction cylinder 8 through the welding plate 4. The heat dissipation fins 9 on the surface of the hollow heat conduction cylinder 8 expand the heat dissipation area, and the airflow drawn by the cooling fan 12 quickly removes the heat, achieving efficient heat dissipation. Finally, check the circuit connectivity and heat dissipation effect to confirm that the entire connection structure is operating normally, and complete all assembly and debugging work.
[0026] The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the invention to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical application of the invention, and to enable those skilled in the art to understand the invention and to design various embodiments with various modifications suitable for a particular purpose.
Claims
1. A power device connection structure, comprising a power device connection board (1), characterized in that: A soldering plate (4) is fixedly installed on the power device connection plate (1). A power component (3) is provided above the soldering plate (4). A connection pin is provided below the power component (3). A soldering groove (5) is opened on the soldering plate (4). The soldering groove (5) is opened corresponding to the pin position below the power component (3). A circuit connected to the power device connection plate (1) is provided inside the soldering plate (4). A hollow heat-conducting cylinder (8) is provided below the power device connection plate (1). A heat dissipation base plate (2) is provided below the hollow heat-conducting cylinder (8). The heat dissipation base plate (2) is provided with a heat conduction mechanism. The heat conduction mechanism can conduct the heat generated by the power components (3) during operation to the heat dissipation base plate (2) through the hollow heat conduction cylinder (8). When a single power component (3) fails, it can remove it by heating only the corresponding part of the solder bath (5). An auxiliary welding mechanism is provided above the power device connection plate (1). The auxiliary welding mechanism can accommodate solder through multiple sets of welding trays (4) and the solder baths (5) opened on them, preventing bridging and short circuits caused by solder flow when different power components (3) are welded. It can also discharge the fumes generated by high temperature during welding.
2. The power device connection structure as described in claim 1, characterized in that, The heat conduction mechanism includes heat dissipation fins (9), which are fixedly installed on the circumferential surface of the hollow heat conduction cylinder (8). The hollow heat conduction cylinder (8) has a larger diameter at the top and a smaller diameter at the bottom.
3. The power device connection structure as described in claim 2, characterized in that, The hollow heat-conducting cylinder (8) and the heat dissipation fins (9) are both located between the power device connecting plate (1) and the heat dissipation base plate (2). The power device connecting plate (1) and the heat dissipation base plate (2) are connected on both sides by a sealing plate.
4. The power device connection structure as described in claim 3, characterized in that, The heat dissipation base plate (2) is fixed to the power device connection plate (1) and the sealing plates on both sides to form a channel with open sides. Filters (13) are symmetrically installed on both sides of the heat dissipation base plate (2).
5. The power device connection structure as described in claim 4, characterized in that, The filter (13) is located between the power device connection plate (1) and the heat dissipation base plate (2). A heat dissipation fan (12) is fixedly installed on the heat dissipation base plate (2) and the heat dissipation fan (12) is located below the power device connection plate (1).
6. The power device connection structure as described in claim 5, characterized in that, The heat dissipation base plate (2) has windows at the positions corresponding to each welding plate (4), and a sealing ring (11) is fixedly installed in each window on the heat dissipation base plate (2).
7. The power device connection structure as described in claim 6, characterized in that, The sealing ring (11) is provided with an interface, the sealing ring (11) can be connected to the air outlet of the hot air gun, and the sealing ring (11) is provided with a sealing groove.
8. The power device connection structure as described in claim 7, characterized in that, The sealing ring (11) is provided with a sealing plug (14), and a sealing ring (15) is fixedly installed on the sealing plug (14).
9. The power device connection structure as described in claim 1, characterized in that, The auxiliary welding mechanism includes a solder channel (6), and the welding plate (4) has a window in the middle. The welding plate (4) is located above the hollow heat-conducting cylinder (8).
10. The power device connection structure as described in claim 9, characterized in that, An annular baffle (7) is fixedly installed on the welding plate (4). The annular baffle (7) is fixedly installed above the hollow heat-conducting cylinder (8). A flue gas discharge hole (10) is opened on the hollow heat-conducting cylinder (8).