An electronic device

By optimizing the airflow design in mobile terminal devices, increasing the height difference and spacing between the fan and the heat sink, and combining exhaust and blowing methods, the problem of low heat dissipation efficiency caused by irregular airflow space was solved, thereby improving the heat dissipation performance of the device and the reliability of the fan.

CN122121104APending Publication Date: 2026-05-29HUAWEI TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HUAWEI TECH CO LTD
Filing Date
2024-11-27
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

Irregular airflow spaces in mobile terminal devices result in low heat dissipation efficiency, affecting the airflow of heat dissipation fins and failing to meet the heat dissipation requirements of high-power devices.

Method used

By setting a first air inlet near the first end of the first heat sink and a second air inlet near the second end of the first heat sink in the electronic device, the height difference along the thickness direction of the device is increased, the airflow path is extended, and a gap is set between the fan and the heat-generating device, heat dissipation is achieved by combining exhaust and blowing.

Benefits of technology

It improves the heat exchange efficiency of the heat sink, enhances the heat dissipation capacity of electronic devices, reduces the operating temperature of the fan, and extends the reliability and service life of the fan.

✦ Generated by Eureka AI based on patent content.

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    Figure CN122121104A_ABST
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Abstract

The application relates to the technical field of heat dissipation, in particular to an electronic device. The electronic device comprises a back cover, a middle frame, an air duct support, a fan and a first heat dissipation fin. The air duct support is installed on the middle frame, the middle frame is connected with the back cover, and an air duct space allowing air circulation is arranged between the back cover and the air duct support. The electronic device is provided with a first air inlet communicating with the air duct space. The fan and the first heat dissipation fin are both located in the air duct space, and the fan is installed on the back cover or a decorative part on the back cover. The fan is provided with a second air inlet. The first heat dissipation fin is located on the side of the fan close to the first air inlet, and the fan can draw air passing through the first heat dissipation fin into the second air inlet. The first heat dissipation fin is provided with a first end and a second end arranged oppositely. The first air inlet is arranged close to the first end, and the second air inlet is arranged close to the second end. The flow path of air flowing from the first air inlet to the second air inlet is lengthened, the heat exchange efficiency of the first heat dissipation fin is improved, and the heat dissipation efficiency of the electronic device is further improved.
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