Mechanical switching bidirectional thermal management device and control method

Abstract

The application discloses a mechanical switching type bidirectional heat management device and a control method, relates to the technical field of electronic components and heat management, and comprises an electromagnetic module, a component heat dissipation module, a component heating module and the like.

Description

Technical Field

[0001] This application relates to the fields of electronic components and thermal management technology, and in particular to a mechanical switching bidirectional thermal management device and control method. Background Technology

[0002] The heat dissipation problem of core components in modern electronic devices (such as CPUs, FPGAs, lasers, and pump sources) has become a major challenge restricting the development of the modern electronics industry. These electronic components not only generate a large amount of heat during operation but are also extremely sensitive to operating temperature. Exceeding the allowable junction temperature can lead to performance degradation, operational instability, and data corruption. Furthermore, in certain low-temperature environments, these components may fail to start. Therefore, a two-way temperature management system is needed to enable active heating of components in low-temperature environments for rapid temperature rise, and to dissipate heat after the components have generated sufficient heat to prevent the temperature from exceeding the safe upper limit.

[0003] Existing solutions for heat dissipation problems in electronic components often employ heat sinks + fans / liquid cooling, thermoelectric coolers (TECs), and independent heaters + heat sinks. Traditional heat sinks are not only bulky but also only provide unidirectional heat dissipation and cannot help raise the temperature. When the temperature difference is large, most of the electrical energy of thermoelectric coolers is used for self-heating rather than effective heat transfer, resulting in low energy efficiency. When the temperature is low, the performance and reliability of the TEC itself cannot be guaranteed, and it has high power consumption, large size, complex structure, and high manufacturing cost. Traditional independent heating and heat dissipation devices occupy space and have a slow response. Summary of the Invention

[0004] This application provides a mechanically switching bidirectional thermal management device and control method. The mechanically switching bidirectional thermal management device uses an electromagnetic drive to achieve high-response and rapid switching of thermal treatment modes to improve the environmental adaptability of electronic components.

[0005] This application provides a mechanically switching bidirectional thermal management device, comprising: An electromagnetic module includes a fixed bracket, an electromagnetic coil is disposed inside the fixed bracket, and the electromagnetic coil is connected to a power control module. The component heat dissipation module includes a track slider, a permanent magnet, and a rocking spring. The track slider is connected to a track base via a guide spring. The permanent magnet is fixed to the track slider via a track cover. The upper end of the rocking spring is fixed to the track slider based on the track slider cover, and the lower end is fixed to the phase change heat sink. The phase change heat sink is confined within the track by the rocking spring and the track slider. The component heating module includes the track base, the guide spring, the heating element, the guide torsion spring, and the base cover. The heating element is located below the phase change heat sink, and the surface of the heating element is provided with heating plates. The lower end of the guide torsion spring is fixed to the base cover through the guide groove in the track base, and the upper end of the guide torsion spring is connected to a permanent magnet.

[0006] This application provides a thermal management control method for a mechanically switching bidirectional thermal management device, including: configuring a heating mode and a heat dissipation mode; In heating mode, the phase change heat sink is suspended by a rocking spring and separated from the heating element. After the heating element is turned on, the device continues to heat up. Once the predetermined temperature is reached, the heating element will start working. In heat dissipation mode, when the temperature of the heat-generating component exceeds its safe upper limit temperature, the electromagnetic coil is energized to generate magnetic force, which drives the track slider to slide down through the permanent magnet. The upper end of the guide torsion spring moves up, and during the downward movement of the track slider, the phase change heat sink comes into contact with the heat-generating component to achieve heat dissipation.

[0007] This application provides a mechanically switching bidirectional thermal management device. In low-temperature conditions, the device rapidly heats electronic components using resistance heating. Once the component's activation temperature is reached, resistance heating is deactivated, and the component begins to heat up on its own. When the temperature reaches a threshold, mechanical switching dissipates heat, allowing the component to continue operating stably. The device employs an electromagnetic drive to achieve high-response, rapid switching of thermal management modes, thereby improving the environmental adaptability of electronic components. This electromagnetically driven mechanically switching bidirectional thermal management device is small in size, fast in response, low in energy consumption, has good environmental adaptability, and is highly practical for engineering applications.

[0008] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0009] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings: Figure 1 This is a schematic diagram of the overall structure of the mechanical switching bidirectional thermal management device according to an embodiment of this application; Figure 2 This is a schematic cross-sectional view of the mechanical switching bidirectional thermal management device according to an embodiment of this application. Detailed Implementation

[0010] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0011] To address the shortcomings of traditional heat dissipation solutions, a mechanically switching bidirectional thermal management device is provided. In low-temperature conditions, the device rapidly heats electronic components using resistance heating. Once the component's activation temperature is reached, resistance heating is deactivated, and the component begins to heat up on its own. When a threshold temperature is reached, mechanical switching is used to dissipate heat, allowing the component to continue operating stably. Specifically, this application provides a mechanically switching bidirectional thermal management device, such as... Figure 1 , Figure 2 As shown, it includes: The electromagnetic module 1 includes a fixed bracket 4, within which an electromagnetic coil 5 is disposed. The electromagnetic coil 5 is connected to a power control module. The power control device controls the electromagnetic module via a wire connected to the electromagnetic coil 5.

[0012] The component heat dissipation module 2 includes a track slider 6, a permanent magnet 8, and a rocking spring 9. The track slider 6 is connected to the track base 11 via a guide spring 12. The permanent magnet 8 is fixed to the track slider 6 via a track cover 7. The upper end of the rocking spring 9 is fixed to the track slider 6 based on the track slider cover 7, and the lower end is fixed to the phase change heat sink 10. The phase change heat sink 10 is limited within the track by the rocking spring 9 and the track slider 6.

[0013] The component heating module 3 includes the track base 11, the guide spring 12, the heating element 13, the guide torsion spring 15, and the base cover 16. The heating element 13 is disposed below the phase change heat sink 10, and a heating element 14 is provided on the surface of the heating element 13. The lower end of the guide torsion spring 15 is fixed to the base cover 16 through a guide groove in the track base 11, and the upper end of the guide torsion spring 15 is connected to the permanent magnet 8. In some examples, the heating element 14 can be an electric heating element.

[0014] like Figure 2As shown, a guide groove is also provided at the upper end of the guide torsion spring 15. The guide groove is located on the component heat dissipation module 2. The guide groove is used to limit the movement trajectory of the upper end of the guide torsion spring 15. The permanent magnet 8 is driven by the electromagnetic module force to move the component heat dissipation module 2 downward. The upper end of the guide torsion spring 15 rises along the triangular guide groove to the left end of the inverted triangle and reaches the top. After the force on the permanent magnet 8 disappears, the component heat dissipation module 2 rises under the action of the spring and is stopped by the upper end of the guide torsion spring 15. After the permanent magnet 8 is subjected to force again, the upper end of the guide torsion spring 15 rises to the right end of the inverted triangle and reaches the top. After the force on the permanent magnet 8 disappears, the heat dissipation component of the component heat dissipation module 2 rises, and the upper end of the guide torsion spring 15 returns to its original position.

[0015] This device, when operating at low temperatures, rapidly heats electronic components using resistance heating. Once the component's activation temperature is reached, resistance heating is deactivated, and the component begins to heat up on its own. After reaching a threshold temperature, mechanical switching dissipates heat, allowing the component to continue operating stably. The device employs an electromagnetic drive to achieve high-response, rapid switching of thermal management modes, thereby enhancing the environmental adaptability of electronic components. This electromagnetically driven, mechanically switching, bidirectional thermal management device is small in size, fast in response, low in energy consumption, highly adaptable to various environments, and highly practical for engineering applications.

[0016] In some embodiments of this application, such as Figure 2 As shown, the heating element 14 is pressed and fixed to the track base 11 by electronic components, and the heating element 14 is connected to the power control module by wires.

[0017] In some embodiments of this application, the fixed bracket 4 is fixedly connected to the track base 11.

[0018] In some embodiments of this application, the heating element 13 is fixedly connected to the track base 11.

[0019] In some embodiments of this application, the working mode of the bidirectional thermal management device includes a heating mode. In the heating mode, the phase change heat sink 10 is stretched and suspended by the rocker spring 9 to separate it from the heating element 13. After the heating element 14 is turned on, the device continues to heat up. After reaching the predetermined temperature, the heating element 13 starts to work.

[0020] In some embodiments of this application, the working mode of the bidirectional thermal management device includes a heat dissipation mode. In the heat dissipation mode, when the temperature of the heat-generating component 13 exceeds the set temperature, the electromagnetic coil 5 is energized to generate magnetic force, which drives the track slider 6 to slide down through the permanent magnet 8. The upper end of the guide torsion spring 15 moves up. During the downward movement of the track slider 6, the phase change heat sink 10 contacts the heat-generating component 13 to achieve heat dissipation.

[0021] In some embodiments of this application, during the continuous downward movement of the track slider 6, the rocking spring 9 is in a compressed state. After the upper end of the guide torsion spring 15 reaches the top, the electromagnetic coil 5 is de-energized, and the guide torsion spring 15 falls along the track and gets stuck. When the electromagnetic coil 5 is de-energized again, the guide torsion spring 15 resets along the track, and the phase change heat sink 10 separates from the heating element 13.

[0022] As in the aforementioned example, the movement of the rocker spring 9 is linked to that of the guide groove, and the state of the rocker spring 9 changes during the movement. Specifically, initially, the rocker spring 9 is in a stretched state, and the tension it receives is the gravity of the phase change heat sink 10. After the permanent magnet 8 is subjected to force, the component heat dissipation module 2 moves downward as a whole, and the phase change heat sink 10 descends until it contacts the heat-generating component of the component heat dissipation module 2 and then stops moving. At this time, the component heat dissipation module 2 continues to move downward, and the rocker spring 9 begins to be compressed until the guide torsion spring 15 moves to the upper left end of the inverted triangle structure. After the electromagnetic force disappears, the rocker spring 9 naturally pushes the component heat dissipation module 2 slightly upward, and then the external guide torsion spring 15 locks the component heat dissipation module 2, and the component heat dissipation module 2 stops moving upward. At this time, the rocker spring 9 is in a compressed state and can push the phase change heat sink 10 in the opposite direction to make it fit tightly against the heat-generating component.

[0023] The mechanically switching bidirectional thermal management device of this application adopts a collaborative design of resistance wire heating and electromagnetic mechanical switching heat dissipation, which has the ability to quickly start at extremely low temperatures. It can effectively avoid the risk of TEC icing failure and solve the low-temperature failure problem of traditional heat dissipation solutions. When the temperature exceeds the operating temperature, an electromagnetic drive is used to quickly switch the heat dissipation mode, causing the phase change material to press against the heat-generating components, effectively reducing thermal resistance while dissipating heat quickly. The combination of permanent magnets and electromagnets in the mechanical structure can effectively improve the reliability of the device.

[0024] This application also proposes a thermal management control method for the aforementioned mechanical switching bidirectional thermal management device, including: configuring a heating mode and a heat dissipation mode; In heating mode, the phase change heat sink 10 is stretched and suspended by the rocking spring 9 to separate it from the heating element 13. After the heating element 14 is turned on, the device continues to heat up. After reaching the predetermined temperature, the heating element 13 starts to work. In the heat dissipation mode, when the temperature of the heat-generating component 13 exceeds the set temperature, the electromagnetic coil 5 is energized to generate magnetic force, which drives the track slider 6 to slide down through the permanent magnet 8. The upper end of the guide torsion spring 15 moves up, and during the downward movement of the track slider 6, the phase change heat sink 10 comes into contact with the heat-generating component 13 to achieve heat dissipation.

[0025] It should be noted that, in the embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0026] The sequence numbers of the embodiments in this application are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0027] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims. All of these forms are within the protection scope of this application.

Claims

1. A mechanically switching bidirectional thermal management device, characterized in that, include: The electromagnetic module (1) includes a fixed bracket (4), an electromagnetic coil (5) is provided inside the fixed bracket (4), and the electromagnetic coil (5) is connected to the power control module; The component heat dissipation module (2) includes a track slider (6), a permanent magnet (8), and a rocking spring (9). The track slider (6) is connected to the track base (11) through a guide spring (12). The permanent magnet (8) is fixed to the track slider (6) through the track slider cover (7). Based on the track slider cover (7), the upper end of the rocking spring (9) is fixed to the track slider (6), and the lower end is fixed to the phase change heat sink (10). The phase change heat sink (10) is limited to the track by the rocking spring (9) and the track slider (6). The component heating module (3) includes the track base (11), the guide spring (12), the heating element (13), the guide torsion spring (15), and the base cover (16). The heating element (13) is located below the phase change heat sink (10). The surface of the heating element (13) is provided with a heating plate (14). The lower end of the guide torsion spring (15) is fixed to the base cover (16) through the guide groove in the track base (11). The upper end of the guide torsion spring (15) is connected to the permanent magnet (8).

2. The mechanical switching bidirectional thermal management device as described in claim 1, characterized in that, The heating element (14) is pressed and fixed to the track base (11) by electronic components, and the heating element (14) is connected to the power control module by wires.

3. The mechanical switching bidirectional thermal management device as described in claim 1, characterized in that, The fixed bracket (4) is fixedly connected to the track base (11).

4. The mechanical switching bidirectional thermal management device as described in claim 1, characterized in that, The heating element (13) is fixedly connected to the track base (11).

5. The mechanical switching bidirectional thermal management device as described in claim 1, characterized in that, The working modes of the bidirectional thermal management device include a heating mode. In the heating mode, the phase change heat sink (10) is stretched and suspended by a rocking spring (9) to separate it from the heating element (13). After the heating plate (14) is turned on, the device continues to heat up. After reaching the predetermined temperature, the heating element (13) starts working.

6. The mechanical switching bidirectional thermal management device as described in claim 5, characterized in that, The working mode of the bidirectional thermal management device includes a heat dissipation mode. In the heat dissipation mode, when the temperature of the heat-generating component (13) exceeds the set temperature, the electromagnetic coil (5) is energized to generate magnetic force, which drives the track slider (6) to slide down through the permanent magnet (8). The upper end of the guide torsion spring (15) moves up, and the phase change heat sink (10) contacts the heat-generating component (13) during the downward movement of the track slider (6) to achieve heat dissipation.

7. The mechanical switching bidirectional thermal management device as described in claim 6, characterized in that, During the continuous downward movement of the track slider (6), the rocking spring (9) is in a compressed state. After the upper end of the guide torsion spring (15) reaches the top, the electromagnetic coil (5) is de-energized, and the guide torsion spring (15) falls along the track and gets stuck. When the track is disconnected, the control electromagnetic coil (5) is energized and de-energized again, and the guide torsion spring (15) resets along the track.

8. The thermal management control method of the mechanical switching bidirectional thermal management device as described in any one of claims 1-7, characterized in that, include: Configure heating and cooling modes; In heating mode, the phase change heat sink (10) is stretched and suspended by the rocking spring (9) and separated from the heating element (13). After the heating plate (14) is turned on, the device continues to heat up. After reaching the predetermined temperature, the heating element (13) starts working. In the heat dissipation mode, when the temperature of the heat-generating component (13) exceeds its safe upper limit temperature, the electromagnetic coil (5) is energized to generate magnetic force, which drives the track slider (6) to slide down through the permanent magnet (8), the upper end of the guide torsion spring (15) moves up, and the phase change heat sink (10) contacts the heat-generating component (13) during the downward movement of the track slider (6) to achieve heat dissipation.

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