Display panel, preparation method thereof and electronic device

Abstract

The application discloses a display panel, a preparation method thereof and an electronic device, and relates to the technical field of electronic devices.The display panel comprises a conductive layer, a substrate and at least two signal lines arranged in sequence in a first direction.The substrate has a through hole communicating both sides of the substrate in the first direction, and at least two connecting parts are located in the through hole, so that the mechanical strength of the substrate at the through hole is ensured.The at least two connecting parts are connected with the conductive layer and the signal lines.The conductive layer is used for electrical connection with a circuit board, so that the electrical connection between the at least two signal lines and the circuit board is realized, the edge of the display panel needs not to be bent, the frame area of the display panel is reduced, and the display panel is beneficial to forming a larger screen ratio.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, and in particular to a display panel, a method for manufacturing the same, and an electronic device. Background Technology

[0002] Electronic devices include display panels and circuit boards, which are stacked together. The surface of the display panel facing away from the circuit board has a display area for displaying information. The larger the display area, the larger the screen-to-body ratio of the electronic device. The larger the screen and the narrower the bezel, the better the visual experience.

[0003] Electronic devices also include signal lines, which are used to electrically connect the display panel and the circuit board. One end of the signal line is located on the side of the display panel with the display area, and the other end is electrically connected to the circuit board. Since the display area and the circuit board are located on opposite sides of the display panel, a terminal bending process is typically used to bend the edge of the display panel. The signal line is simultaneously bent at the edge of the display panel so that its other end can connect to the circuit board. However, the signal line experiences greater stress at the bend, making it prone to breakage. This affects the stability of the electrical connection between the display panel and the circuit board, reducing the lifespan and manufacturing yield of the electronic device. Furthermore, the area where multiple signal lines converge and bend simultaneously at the edge of the display panel forms a terminal bending area. This area occupies space at the edge of the display panel, hindering the achievement of a large screen-to-body ratio in electronic devices. Summary of the Invention

[0004] This application provides a display panel, its manufacturing method, and an electronic device. By setting through holes on the substrate, the connecting part located in the through holes connects the signal lines and conductive layers on both sides of the substrate, avoiding edge bending of the display panel and achieving a larger screen ratio. The connecting part also ensures the mechanical strength of the display panel at the through holes, which helps to simplify the display panel setting process.

[0005] In a first aspect, this application provides a display panel, comprising: a substrate and at least two connecting portions, the substrate having through holes communicating with both sides of the substrate in a first direction, the connecting portions being located within the through holes, and the at least two connecting portions being spaced apart; at least two signal lines and a conductive layer, respectively located on both sides of the substrate in the first direction, the signal lines and the connecting portions being connected in a one-to-one correspondence, the conductive layer being connected to both the at least two connecting portions, and the conductive layer being used to conduct electricity in the first direction.

[0006] This application provides a display panel comprising a conductive layer, a substrate, and at least two signal lines sequentially disposed in a first direction. The substrate has through holes connecting both sides of the substrate in the first direction, and at least two connecting portions are located within the through holes, ensuring the mechanical strength of the substrate at the through holes and thus contributing to the structural stability of the display panel. The at least two connecting portions are connected to both the conductive layer and the signal lines. The conductive layer is used for electrical connection with a circuit board, thereby achieving electrical connection between the at least two signal lines and the circuit board. This avoids the need for bending the edges of the display panel, reduces the bezel area of ​​the display panel, and facilitates a larger screen-to-body ratio.

[0007] The conductive layer and at least two connecting parts are connected simultaneously, and the conductive layer is used to conduct electricity in a first direction, which simplifies the electrical connection structure of the circuit board and at least two signal lines and simplifies the setup process of the display panel.

[0008] In one possible implementation, the connecting portion includes a lower connecting portion and an upper connecting portion connected together. The upper connecting portion is located on one side of the lower connecting portion in the first direction. The lower connecting portion is connected to the conductive layer, and the upper connecting portion is connected to the signal line. The length of the lower connecting portion in the second direction is greater than the length of the upper connecting portion in the second direction, and the second direction is perpendicular to the first direction. By including the connected lower and upper connecting portions, the thickness of the upper and lower connecting portions is reduced, which simplifies the installation process of the upper and lower connecting portions. The stress on the connecting portion is dispersed at the upper and lower connecting portions, which also helps to improve the mechanical strength of the display panel at the connecting portion. By making the length of the lower connecting portion in the second direction greater than the length of the upper connecting portion in the second direction, the contact area between the lower connecting portion and the conductive layer is increased, ensuring the stability of the electrical connection between the lower connecting portion and the conductive layer.

[0009] In one possible implementation, two adjacent upper connecting portions are staggered in a third direction, the third direction being perpendicular to the first direction and forming an angle with the second direction. By staggering adjacent upper connecting portions in a third direction, contact between adjacent upper connecting portions is avoided, which simplifies the arrangement of the upper connecting portions and prevents at least two signal lines from short-circuiting.

[0010] In one possible implementation, the lower connecting portion includes a first lower connecting portion and a second lower connecting portion, which are alternately arranged in the second direction. The length of the first lower connecting portion in the second direction is greater than the length of the second lower connecting portion in the second direction. By alternating the first and second lower connecting portions of different lengths, the upper connecting portion is always located at the end of the lower connecting portion away from the display area in the second direction, thus avoiding wasted structural space in the lower connecting portion.

[0011] In one possible implementation, the upper connecting portion is located on the side of the lower connecting portion that is farther from the display area in the second direction. By positioning the upper connecting portion on the side of the lower connecting portion that is farther from the display area in the second direction, it is beneficial to ensure that the upper connecting portion and the display area are spaced apart, avoiding the impact of the through-hole on the display area. At the same time, a portion of the lower connecting portion can be positioned opposite to the display area in the first direction, making full use of the space on the side of the substrate closer to the mounting surface and reducing the bezel area of ​​the display panel.

[0012] In one possible implementation, at least a portion of the conductive layer is located on the side of the upper connection portion closer to the display area in the second direction. By placing at least a portion of the conductive layer on the side of the upper connection portion closer to the display area in the second direction, it is advantageous to reduce the overall length of the display panel in the second direction, i.e., to reduce the bezel area of ​​the display panel.

[0013] In one possible implementation, the substrate surface facing the conductive layer has a groove, the opening of the through-hole is located on the bottom wall of the groove, and at least a portion of the conductive layer is located within the groove. By having a groove on the substrate surface facing the conductive layer, the opening of the through-hole being located on the bottom wall of the groove, and at least a portion of the conductive layer being located within the groove, electrical connection between the conductive layer and the signal line is ensured. Furthermore, the process ensures that the connection portion and the substrate are separated by the substrate material, guaranteeing the removal effect of the substrate and thus ensuring the contact area between the conductive layer and the connection portion.

[0014] In one possible implementation, the substrate includes a lower filler layer and an upper filler layer, the upper filler layer being located on one side of the lower filler layer in the first direction, the groove penetrating the lower filler layer, the via being located in the upper filler layer, and the thickness of the lower filler layer being less than the thickness of the upper filler layer. By including a lower filler layer and an upper filler layer on the substrate, with the upper filler layer located on one side of the lower filler layer in the first direction, the groove penetrating the lower filler layer, the via being located in the upper filler layer, and the thickness of the lower filler layer being less than the thickness of the upper filler layer, the thickness of the lower filler layer is reasonably configured, simplifying the subsequent process of setting the groove in the lower filler layer.

[0015] In one possible implementation, the conductive layer and the sidewalls of the groove are spaced apart. By spacing the conductive layer and the sidewalls of the groove, the placement of the conductive layer within the groove is simplified, the conductive layer is made smoother, and the contact area between the conductive layer and the connecting portion is ensured.

[0016] In one possible implementation, the through-hole includes a first segment and a second segment that are connected to each other. The first segment is directly connected to the groove, and the second segment and the groove are staggered in the first direction. By making the through-hole include a first segment and a second segment that are connected to each other, the first segment is directly connected to the groove, and the second segment and the groove are staggered in the first direction, the substrate has a large thickness at both the groove and the second segment in the first direction, which helps to ensure the mechanical strength of the substrate.

[0017] In one possible implementation, the conductive layer is an anisotropic conductive material. By making the conductive layer anisotropic, conductivity in the first direction is achieved, preventing short circuits at the conductive layer for at least two signal lines, which helps ensure the stability of the electrical connection between at least two signal lines and the circuit board.

[0018] In one possible implementation, a portion of the at least two signal lines is located within the through-hole, and the at least two signal lines are in contact with the surface of the connector. By placing a portion of the at least two signal lines within the through-hole and ensuring contact between the at least two signal lines and the surface of the connector, the thickness of the connector is reduced, which simplifies the connector installation process and the connection structure between the signal lines and the connector, thus minimizing interference with other structures during the connection process.

[0019] In one possible implementation, the at least two signal lines are arranged in parallel. By arranging the at least two signal lines in parallel, a larger spacing is achieved between adjacent signal lines, which helps to provide space for subsequent connections and avoids short circuits between the at least two signal lines.

[0020] Secondly, this application also provides a method for manufacturing a display panel, used to manufacture the display panel described in any embodiment of the first aspect. The method includes: sequentially disposing of a lower filling layer, at least two connecting portions, and an upper filling layer on a substrate, wherein the at least two connecting portions are embedded within the upper filling layer and are spaced apart; etching the upper filling layer to expose the at least two connecting portions, and disposing of at least two signal lines on the side of the upper filling layer opposite to the lower filling layer, which are connected to the at least two connecting portions in a one-to-one correspondence; removing the substrate, etching the lower filling layer to expose the at least two connecting portions, and disposing of a conductive layer on the side of the lower filling layer opposite to the upper filling layer, which is connected to the at least two connecting portions. The beneficial effects of this embodiment are similar to those of the above embodiments, and will not be repeated here.

[0021] In one possible implementation, the thickness of the lower filler layer is less than or equal to half the thickness of the upper filler layer. By making the thickness of the lower filler layer less than or equal to half the thickness of the upper filler layer, the thickness of the lower filler layer is reasonably configured, which helps to simplify the etching process of the lower filler layer.

[0022] In one possible implementation, the connecting portion includes an upper connecting portion and a lower connecting portion connected together. The lower filling layer, the lower connecting portion, and the upper connecting portion are connected sequentially, and the length of the lower connecting portion is greater than or equal to the length of the upper connecting portion. By making the length of the lower connecting portion greater than or equal to the length of the upper connecting portion, the surface of the lower connecting portion facing away from the upper connecting portion has a larger area, which helps to ensure the contact area between the lower connecting portion and the conductive layer and improves the stability of the electrical connection between the connecting portion and the conductive layer.

[0023] In one possible implementation, the upper filling layer includes a first filling layer and a second filling layer connected together. A lower filling layer, at least two lower connecting portions, and the first filling layer are sequentially disposed on the base layer. The at least two lower connecting portions are embedded within the first filling layer and are spaced apart. The first filling layer is etched to partially expose the at least two lower connecting portions. At least two upper connecting portions are disposed in the etched area of ​​the first filling layer, and the at least two upper connecting portions and the at least two lower connecting portions are connected in a one-to-one correspondence. The second filling layer is disposed on the side of the first filling layer opposite to the lower filling layer, and the second filling layer embeds the at least two upper connecting portions.

[0024] By including the first and second filling layers connected in the upper filling layer, the substrate is ensured to have sufficient thickness and mechanical strength. Furthermore, the lower connection portion is buried in the first filling layer and the upper connection portion is buried in the second filling layer, which improves the sealing performance of the display panel and prevents moisture from eroding the lower and upper connection portions.

[0025] Thirdly, this application also provides an electronic device, which includes a circuit board and a display panel manufactured by the method described in any embodiment of the first aspect or the method described in any embodiment of the second aspect, wherein the circuit board and the display panel are electrically connected. The beneficial effects of this embodiment are similar to those of the above embodiments, and will not be repeated here. Attached Figure Description

[0026] Figure 1 This is an exploded structural diagram of the electronic device provided in the embodiments of this application;

[0027] Figure 2 yes Figure 1 The illustrated embodiment shows a cross-sectional view of the display panel;

[0028] Figure 3 yes Figure 1 A cross-sectional view of the substrate in the illustrated embodiment;

[0029] Figure 4 yes Figure 1 An exploded view of the display panel in the illustrated embodiment;

[0030] Figure 5 yes Figure 1 A top view of the display panel provided in the illustrated embodiment;

[0031] Figure 6 This is a cross-sectional view of a display panel in which the upper and lower connecting portions completely overlap, according to an embodiment of this application.

[0032] Figure 7 This is a cross-sectional view of a display panel with a small thickness in the upper and lower connecting portions provided in the embodiments of this application;

[0033] Figure 8 This is a cross-sectional view of a display panel in which the upper and lower connecting portions partially overlap, as provided in the embodiment of this application.

[0034] Figure 9 yes Figure 8 The diagram shows the structure of the upper connecting part and the lower connecting part in the embodiment shown.

[0035] Figure 10 This is a schematic diagram of the structure of the connecting parts with alternating upper connecting parts provided in the embodiments of this application;

[0036] Figure 11 This is a schematic diagram of the structure of the connecting parts with different lengths provided in the embodiments of this application;

[0037] Figure 12 This is a cross-sectional view of a display panel with a groove provided in an embodiment of this application;

[0038] Figure 13 This is a cross-sectional view of a substrate with grooves provided in an embodiment of this application;

[0039] Figure 14 This is a flowchart of a method for manufacturing a display panel according to an embodiment of this application;

[0040] Figure 15 This is a cross-sectional view of the base layer, substrate, and connecting portion provided in the embodiments of this application. Detailed Implementation

[0041] The embodiments of this application are described below with reference to the accompanying drawings.

[0042] For ease of understanding, the English abbreviations and related technical terms used in the embodiments of this application will be explained and described below.

[0043] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0044] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0045] It should be understood that the term "and / or" used in this document is merely a description of the same field in the related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0046] Depending on the context, the word "if" as used herein can be interpreted as "when," "when," "in response to determination," or "in response to detection." Similarly, depending on the context, the phrase "if determination" or "if detection (of the stated condition or event)" can be interpreted as "when determination," "in response to determination," "when detection (of the stated condition or event)," or "in response to detection (of the stated condition or event)."

[0047] It should be understood that the terms "first," "second," etc., used in this application are for distinguishing purposes only and should not be construed as indicating or implying relative importance or order.

[0048] In the description of this application, the terms “center,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0049] In the description of this application, it should be noted that due to manufacturing or assembly errors, there may be slight angular deviations in the design that should be perpendicular or parallel. For example, a deviation within 15 degrees is also considered perpendicular or parallel as described in this embodiment.

[0050] The phrase "within the range" used in this application, unless otherwise specified, includes both endpoints of the range by default. For example, in the range of 1 to 5, it includes the values ​​1 and 5.

[0051] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation", "connection" and "joining" should be interpreted broadly, for example, they can be fixed connections, detachable connections, mating connections or integral connections; those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0052] It should be understood that in this application, "electrical connection" can be understood as physical contact and electrical conduction between components; it can also be understood as the form in which different components in a circuit structure are connected through physical lines that can transmit signals, such as copper foil or wires on a printed circuit board (PCB). "Connection" and "connected" can both refer to a mechanical or physical connection relationship. For example, A and B being connected or A and B being connected can mean that there are fastening components (such as screws, bolts, rivets, etc.) between A and B, or that A and B are in contact with each other and are difficult to separate.

[0053] In this application, electrical length can be expressed as the ratio of physical length (i.e., mechanical length or geometric length) multiplied by the transmission time of an electrical or electromagnetic signal in a medium to the time required for that signal to travel a distance in free space equal to the physical length of the medium. Electrical length can satisfy the following formula:

[0054]

[0055] Where L is the physical length, a is the transmission time of the electrical or electromagnetic signal in the medium, and b is the transmission time in free space.

[0056] Alternatively, electrical length can also refer to the ratio of physical length (i.e., mechanical length or geometric length) to the wavelength of the transmitted electromagnetic wave, and electrical length can satisfy the following formula:

[0057]

[0058] Where L is the physical length and λ is the wavelength of the electromagnetic wave.

[0059] Electronic devices include, but are not limited to, devices capable of receiving and / or transmitting communication signals connected via any one or more of the following connection methods:

[0060] (1) Via wired connection, such as via Public Switched Telephone Networks (PSTN), Digital Subscriber Line (DSL), digital cable, or direct cable connection;

[0061] (2) Via wireless interface, such as cellular network, wireless local area network (WLAN), digital television network such as DVB-H network, satellite network, AM-FM broadcast transmitter.

[0062] An electronic device configured to communicate via a wireless interface can be referred to as a "mobile terminal". Examples of mobile terminals include, but are not limited to, the following electronic devices:

[0063] (1) Satellite phone or cellular phone;

[0064] (2) A personal communications system (PCS) terminal that can combine cellular radio telephone with data processing, fax and data communication capabilities;

[0065] (3) Radio telephone, pager, Internet / intranet access, web browser, notepad, calendar, personal digital assistant (PDA) equipped with a Global Positioning System (GPS) receiver;

[0066] (4) Conventional above-knee and / or palm-sized receivers;

[0067] (5) Conventional knee-mounted and / or handheld wireless telephone transceivers, etc.

[0068] Please see Figure 1 , Figure 1 An exploded view of the electronic device 200 provided in an embodiment of this application is shown. The electronic device 200 includes, but is not limited to, electronic products such as mobile phones, tablet computers, personal computers, laptops, and wearable devices. In this embodiment, a mobile phone is used as an example for illustration.

[0069] Electronic device 200 includes display panel 100 and circuit board 210, the display panel 100 and circuit board 210 being in a first direction (e.g. Figure 1As shown in the Z direction, the display panel 100 includes a substrate 10, which has a display surface 11 and a mounting surface 12 facing away from each other in its thickness direction. The display surface 11 has a display area 111 for displaying information such as text, images and videos. The circuit board 210 is located on the side of the substrate 10 with the mounting surface 12, such that the display surface 11 and the circuit board 210 are facing away from each other in the first direction.

[0070] The display panel 100 includes a signal line 30. One end of the signal line 30 is located on the side of the display panel 100 with the display surface 11, and the other end of the signal line 30 is used for electrical connection with the circuit board 210, so that the display panel 100 and the circuit board 210 are electrically connected. Since the display surface 11 and the circuit board 210 are located on opposite sides of the substrate 10 in a first direction, a terminal bending process is typically used to bend the edge of the display panel 100. The signal line 30 is simultaneously bent at the edge of the display panel 100 so that the other end of the signal line 30 is bent and wrapped around to the mounting surface 12 of the substrate 10, ensuring that the bent signal line 30 can be connected to the circuit board 210. However, the signal line 30 is subjected to greater stress at the bend, which makes it prone to breakage at the bend, affecting the stability of the electrical connection between the display panel 100 and the circuit board 210, and reducing the service life and manufacturing yield of the electronic device 200.

[0071] Display panel 100 typically includes multiple signal lines 30. If a terminal bending process is used to connect the multiple signal lines 30 to the circuit board 210, the area where the multiple signal lines 30 converge and bend synchronously at the edge of display panel 100 will form a terminal bending area. The terminal bending area occupies the space at the edge of display panel 100 and cannot be used to display information, resulting in the display area 111 of display panel 100 being compressed, which is not conducive to achieving a large screen ratio in electronic device 200. If multiple through holes 13 connecting display surface 11 and mounting surface 12 are provided on substrate 10 of display panel 100, and multiple signal lines 30 pass through multiple through holes 13 one by one to connect to circuit board 210, the multiple through holes 13 reduce the mechanical strength of display panel 100, and multiple signal lines 30 usually need to be printed and connected to circuit board 210 one by one, resulting in a more complex connection process. The mechanical strength of display panel 100 at this time may not be able to meet the printing connection process, which is not conducive to the manufacturing and structural stability of electronic device 200.

[0072] This application provides a display panel 100, please refer to... Figure 1 and Figure 2 , Figure 2 It shows Figure 1The illustrated embodiment shows a cross-sectional view of a display panel 100. The display panel 100 includes a substrate 10, at least two signal lines 30, and a conductive layer 40. The substrate 10 is used to fix the at least two signal lines 30 and the conductive layer 40, ensuring the mechanical strength and structural stability of the display panel 100. The thickness direction of the substrate 10 is taken as the first direction (e.g.,...). Figure 1 and Figure 2 (As shown in the Z direction), the substrate 10 has a display surface 11 and a mounting surface 12 facing away from each other in the first direction. At least two signal lines 30 are located on the side of the substrate 10 with the display surface 11, and a conductive layer 40 is located on the side of the substrate 10 with the mounting surface 12. This arrangement of the substrate 10 with at least two signal lines 30 and the conductive layer 40 spaced apart reduces the space occupied by the display panel 100 in the plane perpendicular to the first direction, which is beneficial for miniaturizing the display panel 100. The conductive layer 40 is used for electrical connection with the circuit board 210, so that at least two signal lines 30 and the conductive layer 40 are electrically connected, thus achieving electrical connection between at least two signal lines 30 and the circuit board 210.

[0073] Please see Figure 2 and Figure 3 , Figure 3 It shows Figure 1 The illustrated embodiment shows a cross-sectional view of the substrate 10. The substrate 10 has a through hole 13, which connects the substrate 10 in a first direction (e.g., Figure 2 and Figure 3 On both sides of the Z-direction (as shown), the through-hole 13 is located on the side of the display area 111 closest to the edge of the substrate 10, to avoid the through-hole 13 affecting the display area 111. The through-hole 13 has a certain distance from both the display area 111 and the edge of the substrate 10, providing a certain tolerance for the electrical connection structure of the signal line 30 and the conductive layer 40, thereby improving the manufacturing yield of the display panel 100. It is understood that the distance between the through-hole 13 and the edges of the display area 111 and the substrate 10 should be reasonably set according to actual needs to avoid an excessively large bezel area of ​​the display panel 100.

[0074] Please see Figure 2 and Figure 4 , Figure 4 It shows Figure 1The exploded view of the display panel 100 in the illustrated embodiment shows that the display panel 100 includes at least two connecting portions 20 located within through holes 13. Each of the at least two connecting portions 20 is connected to a signal line 30 and a conductive layer 40, thus achieving electrical connection between the signal line 30 and the conductive layer 40. The at least two connecting portions 20 have a certain thickness, which enhances the mechanical strength of the display panel 100 near the through holes 13. It is understood that the at least two connecting portions 20 are substantially in contact with the sidewalls of the through holes 13 to ensure sufficient connection area between the at least two connecting portions 20 and the substrate 10. This helps ensure the positional stability of the at least two connecting portions 20 within the through holes 13 and guarantees the enhancement of the mechanical strength of the substrate 10 by the at least two connecting portions 20.

[0075] The connecting part 20 can be completely located inside the through hole 13, or a part of the connecting part 20 can extend out of the opening of the through hole 13. When a part of the connecting part 20 extends out of the opening of the through hole 13, the connection between the part of the connecting part 20 extending out of the opening of the through hole 13 and the signal line 30 and / or the conductive layer 40 is simpler, which helps to simplify the connection process between the connecting part 20 and the signal line 30 and the conductive layer 40.

[0076] In one embodiment, please refer to Figure 2 The connecting portion 20 is completely located within the through hole 13, causing the thickness of the connecting portion 20 to overlap with the thickness of the substrate 10, which is beneficial for reducing the thickness of the display panel 100. The connecting portion 20 and the opening of the through hole 13 near the display surface 11 are spaced apart. A portion of the signal line 30 extends into the through hole 13 from the display surface 11 side, and the portion of the signal line 30 located within the through hole 13 contacts the surface of the connecting portion 20 near the display surface 11. This simplifies the connection process between the signal line 30 and the connecting portion 20. The connection structure between the signal line 30 and the connecting portion 20 is located within the through hole 13, which also allows the substrate 10 to protect the connection structure between the signal line 30 and the connecting portion 20, ensuring the stability of the connection structure. At the same time, the thickness of the connecting portion 20 in the first direction is small, which simplifies the installation process of the connecting portion 20.

[0077] Please see Figure 4The number of signal lines 30 is at least two, and the number of connecting parts 20 is at least two. Each of the at least two connecting parts 20 and the at least two signal lines 30 is connected in a one-to-one correspondence. The at least two signal lines 30 are spaced apart, and the at least two connecting parts 20 are also spaced apart to prevent short circuits between the signal lines 30. The substrate 10 may have at least two through holes 13, which are spaced apart. Each through hole 13 contains only a single connector to ensure that adjacent connectors are spaced apart and to reduce the area of ​​the through hole 13 on the substrate 10, thus ensuring the mechanical strength of the substrate 10. Alternatively, the substrate 10 may have a single through hole 13, with at least two connecting parts 20 located within this single through hole 13, thereby simplifying the through hole 13 installation process.

[0078] Please see Figure 1 and Figure 4 The conductive layer 40 and at least two connecting portions 20 are all connected, and the circuit board 210 and the conductive layer 40 are electrically connected. This enables the electrical connection between the circuit board 210 and at least two signal lines 30, simplifying the electrical connection structure and improving the connection efficiency. The conductive layer 40 is used in the first direction (e.g., Figure 1 and Figure 4 Conductive in the Z direction (as shown), the circuit board 210 is disposed on the side of the conductive layer 40 facing away from the substrate 10, which avoids short circuits of at least two signal lines 30 at the conductive layer 40, and helps to ensure the stability of the electrical connection between at least two signal lines 30 and the circuit board 210. For example, the conductive layer 40 is an anisotropic conductive material to achieve conductivity of the conductive layer 40 in the first direction.

[0079] In one embodiment, please refer to Figure 1 and Figure 4 The bonding process is used to connect at least two connection parts 20, conductive layer 40 and circuit board 210. Since the at least two connection parts 20 improve the mechanical strength of substrate 10, the mechanical strength of substrate 10 can meet the connection conditions of bonding process. Circuit board 210 can connect at least two signal lines 30 at one time, which greatly improves the connection efficiency of circuit board 210 and at least two signal lines 30.

[0080] This application provides a display panel 100, which includes a conductive layer 40, a substrate 10, and at least two signal lines 30 sequentially disposed in a first direction. The substrate 10 has through holes 13 connecting both sides of the substrate 10 in the first direction. At least two connecting portions 20 are located within the through holes 13, ensuring the mechanical strength of the substrate 10 at the through holes 13 and thus contributing to the structural stability of the display panel 100. The at least two connecting portions 20 are connected to both the conductive layer 40 and the signal lines 30. The conductive layer 40 is used for electrical connection with a circuit board 210, thereby achieving electrical connection between the at least two signal lines 30 and the circuit board 210. This avoids the need for bending at the edges of the display panel 100, which would otherwise require a large space for the convergence and bending of the at least two signal lines 30. By connecting the signal lines 30 and the conductive layer 40 with the at least two connecting portions 20 located within the through holes 13, the bezel area of ​​the display panel 100 is reduced, providing more space for the display area 111 of the display panel 100 and contributing to a larger screen-to-body ratio.

[0081] The conductive layer 40 and at least two connecting portions 20 are connected simultaneously, simplifying the electrical connection structure between the circuit board 210 and at least two signal lines 30, and improving the connection efficiency of the circuit board 210 and at least two signal lines 30 during the manufacturing process of the display panel 100. The conductive layer 40 is used to conduct electricity in the first direction, avoiding short circuits in the at least two signal lines 30, which helps to ensure the stability of the electrical connection between the at least two signal lines 30 and the circuit board 210.

[0082] For one possible implementation, please refer to Figure 5 , Figure 5 It shows Figure 1 The top view of the display panel 100 provided in the illustrated embodiment shows that the display panel 100 includes at least two signal lines 30, which are arranged in parallel, resulting in a large spacing between adjacent signal lines 30. This facilitates providing space for the subsequent connection portion 20 and avoids short circuits between the at least two signal lines 30. For example, please refer to... Figure 5 At least two signal lines 30 are along the second direction (e.g.) Figure 5 The signal lines 30 extend in the X direction (as shown), the second direction is perpendicular to the first direction, and at least two signal lines 30 extend in the third direction (e.g., in the X direction). Figure 5 The signal lines 30 are spaced apart in the Y direction (as shown), and the third direction is perpendicular to both the first and second directions, so that two adjacent signal lines 30 have a large spacing distance in the third direction.

[0083] The display panel 100 provided in this application does not require bending at its edges, so that at least two signal lines 30 do not need to converge at the edge of the display panel 100. The display panel 100 does not need to provide space for the convergence of at least two signal lines 30, which helps to reduce the bezel area of ​​the display panel 100. When at least two signal lines 30 converge, the spacing between adjacent signal lines 30 becomes smaller, making it easier for adjacent signal lines 30 to come into contact and short-circuit, which is also detrimental to the subsequent installation of the connection portion 20.

[0084] For one possible implementation, please refer to Figure 6 and Figure 7 , Figure 6 This paper shows a cross-sectional view of a display panel 100 with the upper connecting portion 22 and the lower connecting portion 21 completely overlapping, according to an embodiment of this application. Figure 7 A cross-sectional view of a display panel 100 with a small thickness of upper connecting portion 22 and lower connecting portion 21 provided in this application embodiment is shown. The connecting portion 20 is entirely located within the through hole 13, and the opening of the connecting portion 20 and the through hole 13 near the display surface 11 is spaced apart. Partial areas of at least two signal lines 30 extend into the through hole 13 and contact the connecting portion 20, which helps to reduce the thickness of the connecting portion 20 in the first direction and thus simplifies the arrangement of the connecting portion 20.

[0085] The substrate 10 includes a barrier layer located in the central region of the substrate 10 in a first direction. This barrier layer enhances the connection tightness of the structures on both sides of the substrate 10 in the first direction. The barrier layer has a certain degree of conductivity, and a short circuit can easily occur when the barrier layer and the connection portion 20 come into contact. (See also...) Figure 6 The connecting part 20 can be along the first direction (e.g., Figure 6 The connecting portion 20 (in the Z direction, as shown) passes through the barrier layer, resulting in a larger thickness in the first direction. The connecting portion 20 effectively enhances the mechanical strength of the substrate 10 at the through-hole 13, thus contributing to the structural stability of the display panel 100. However, an additional step is required during the barrier layer fabrication process to ensure that the barrier layer and the connecting portion 20 are spaced apart, preventing short circuits after contact between them. Please refer to... Figure 7 It is also possible to connect part 20 and barrier layer in the first direction (e.g.) Figure 7 The connecting portions 20 are spaced apart in the Z direction (as shown), and the connecting portions 20 are located on the side of the barrier layer away from the display surface 11, so that the connecting portions 20 have a small thickness in the first direction and will not contact the barrier layer, which helps to simplify the manufacturing process of the display panel 100.

[0086] For one possible implementation, please refer to Figure 7 and Figure 8 , Figure 8This illustration shows a cross-sectional view of a display panel 100 with partially overlapping upper connecting portion 22 and lower connecting portion 21 according to an embodiment of this application. A single connecting portion 20 includes a connected lower connecting portion 21 and upper connecting portion 22, with the upper connecting portion 22 located in a first direction (e.g.,...). Figure 7 and Figure 8 On one side (in the Z direction shown), the lower connecting portion 21 is connected to the conductive layer 40, and the upper connecting portion 22 is connected to the signal line 30, so that the signal line 30 and the conductive layer 40 are electrically connected through the upper connecting portion 22 and the lower connecting portion 21. By dividing the single connecting portion 20 into two independent components, the lower connecting portion 21 and the upper connecting portion 22, the thickness of the upper connecting portion 22 and the lower connecting portion 21 are smaller, which simplifies the installation process of the upper connecting portion 22 and the lower connecting portion 21, and ensures that the connecting portion 20 as a whole can have a larger thickness. The stress on the connecting portion 20 is dispersed at the upper connecting portion 22 and the lower connecting portion 21, which also helps to improve the mechanical strength of the display panel 100 at the connecting portion 20.

[0087] Please see Figure 8 The upper connecting portion 22 and the lower connecting portion 21 are stacked and face each other, so that the two opposing surfaces of the upper connecting portion 22 and the lower connecting portion 21 are in contact and connected. This helps to simplify the connection structure of the upper connecting portion 22 and the lower connecting portion 21, and ensures that the upper connecting portion 22 and the lower connecting portion 21 have sufficient connection area, thereby ensuring the stability of the electrical connection between the signal line 30 and the conductive layer 40.

[0088] In one embodiment, please refer to Figure 8 The surface contact connection between the signal line 30 and the upper connecting portion 22 and the lower connecting portion 21, which is opposite to the surface contact connection between the signal line 30 and the connecting portion 20, simplifies the connection structure between the signal line 30 and the connecting portion 20 and minimizes interference with other structures during the connection process. If the upper connecting portion 22 were to pass through the signal line 30 and electrically connect to it, the signal line 30 would need to be etched, increasing the process complexity of the connecting portion 20 setup. Furthermore, the signal line 30 would need to provide tolerance for the etching process, resulting in an increased bezel of the display panel 100. Similarly, in this embodiment, the surface contact connection between the conductive layer 40 and the lower connecting portion 21 and the upper connecting portion 22, which is opposite to the surface contact connection between the conductive layer 40 and the connecting portion 20, simplifies the electrical connection process between the conductive layer 40 and the connecting portion 20.

[0089] Please see Figure 8 and Figure 9 , Figure 9 It shows Figure 8 The schematic diagram of the upper connecting part 22 and the lower connecting part 21 in the embodiment shown is shown in the second direction (e.g. Figure 7 and Figure 8As shown in the X direction, perpendicular to the first direction, the length of the lower connecting portion 21 in the second direction is greater than the length of the upper connecting portion 22 in the second direction. This results in a larger surface area of ​​the lower connecting portion 21 facing away from the upper connecting portion 22, increasing the contact area between the lower connecting portion 21 and the conductive layer 40 and ensuring the stability of the electrical connection between the lower connecting portion 21 and the conductive layer 40. The shorter length of the upper connecting portion 22 in the second direction allows the through-hole 13 to have a smaller inner diameter in the area where the upper connecting portion 22 is located. The smaller distribution range of the through-hole 13 helps to ensure the mechanical strength of the substrate 10, reduces the etching range of the substrate 10, and simplifies the setting process of the through-hole 13.

[0090] In one embodiment, please refer to Figure 8 The thickness of the lower connecting portion 21 is less than the thickness of the upper connecting portion 22. Since the lower connecting portion 21 has a larger length in the second direction, reducing the thickness of the lower connecting portion 21 in the first direction helps to reduce the volume of the lower connecting portion 21, thereby simplifying the arrangement of the lower connecting portion 21. This also allows the through hole 13 to have a smaller depth in the area where the lower connecting portion 21 is located. The substrate 10 has a larger thickness in the first direction at the corresponding location of the lower connecting portion 21, which helps to ensure the mechanical strength of the substrate 10. The upper connecting portion 22 has a larger thickness in the first direction, which helps to ensure that the connecting portion 20 as a whole has sufficient thickness in the first direction, thereby ensuring that the connecting portion 20 is connected to both the signal line 30 and the conductive layer 40.

[0091] Please see Figure 8 The opening of the through-hole 13 near the display surface 11 is spaced apart from the display area 111 to avoid affecting the display area 111. The upper connecting part 22 and the opening of the through-hole 13 near the display surface 11 are arranged opposite each other, so that the upper connecting part 22 and the display area 111 are spaced apart in the second direction. The opening of the through-hole 13 near the mounting surface 12 and the display area 111 are located on different surfaces, so that the opening of the through-hole 13 near the mounting surface 12 will not affect the display area 111. The opening of the through-hole 13 near the mounting surface 12 can have a larger inner diameter, providing a larger accommodating space for the lower connecting part 21 and ensuring that the lower connecting part 21 and the conductive layer 40 have a larger contact area.

[0092] In one embodiment, please refer to Figure 8The lower connecting portion 21 is longer than the upper connecting portion 22 in the second direction. The upper connecting portion 22 is located on the side of the lower connecting portion 21 away from the display area 111 in the second direction. This helps to ensure that the upper connecting portion 22 and the display area 111 are spaced apart, avoiding the through hole 13 from affecting the display area 111. Part of the lower connecting portion 21 and the upper connecting portion 22 are arranged opposite each other in the first direction, and another part of the lower connecting portion 21 and the display area 111 are arranged opposite each other in the first direction. That is, on a plane perpendicular to the first direction, the orthographic projection of part of the lower connecting portion 21 overlaps with the orthographic projection of the upper connecting portion 22, and the orthographic projection of another part of the lower connecting portion 21 overlaps with the orthographic projection of the display area 111. This makes full use of the space on the side of the substrate 10 near the mounting surface 12, so that the length of the lower connecting portion 21 in the second direction partially overlaps with the length of the display area 111, which helps to reduce the bezel area of ​​the display panel 100.

[0093] Please see Figure 8 The conductive layer 40 is located on the side of the lower connecting portion 21 away from the upper connecting portion 22 in the first direction. The arrangement of the conductive layer 40 does not affect the display area 111. At least a portion of the conductive layer 40 is located on the side of the upper connecting portion 22 closer to the display area 111 in the second direction. This facilitates full utilization of the space on the side of the substrate 10 closer to the mounting surface 12, reducing the total length of the display panel 100 in the second direction, i.e., reducing the bezel area of ​​the display panel 100. The circuit board 210 is usually disposed opposite to the display area 111 in the first direction. By placing the conductive layer 40 close to the display area 111, it is also beneficial to reduce the spacing between the conductive layer 40 and the circuit board 210, simplifying the electrical connection between the conductive layer 40 and the circuit board 210.

[0094] For one possible implementation, please refer to Figure 8 and Figure 9 The display panel 100 includes at least two connecting portions 20, each connecting portion 20 including a connected lower connecting portion 21 and an upper connecting portion 22. Adjacent lower connecting portions 21 and adjacent upper connecting portions 22 should be spaced apart to avoid short-circuiting at least two signal lines 30. The following will combine... Figure 9 , Figure 10 and Figure 11 The arrangement of at least two lower connecting parts 21 and at least two upper connecting parts 22 will be described in detail.

[0095] Please see Figure 9 At least two lower connecting parts 21 are in a third direction (such as...) Figure 9 The third direction is parallel to the first direction (shown in the Y direction), which simplifies the arrangement of at least two lower connecting parts 21 and avoids contact between at least two lower connecting parts 21. The third direction is perpendicular to the first direction, and the third direction and the second direction have an angle between them. For example, the third direction is perpendicular to both the first direction and the second direction.

[0096] In one embodiment, please refer to Figure 8 and Figure 9 At least two upper connecting portions 22 are located at the ends of at least two lower connecting portions 21 that are away from the display area 111 in the second direction. The at least two upper connecting portions 22 are arranged approximately in a straight line in the third direction. The relative positions of the at least two upper connecting portions 22 are relatively regular, which helps to simplify the arrangement of the at least two upper connecting portions 22.

[0097] In one embodiment, please refer to Figure 8 and Figure 10 , Figure 10 This illustration shows a schematic diagram of a connecting portion 20 with alternating upper connecting portions 22 according to an embodiment of this application. The upper connecting portion 22 includes a first upper connecting portion 221 and a second upper connecting portion 222. The first upper connecting portion 221 and the second upper connecting portion 222 are in a third direction (e.g., Figure 10 The upper connecting portions 221 and 222 are alternately arranged in the Y direction (as shown). The distance between the first upper connecting portion 221 and the display area 111 in the second direction is greater than the distance between the second upper connecting portion 222 and the display area 111 in the second direction. This allows the first upper connecting portion 221 and 222 to be staggered in the third direction, further preventing contact between them. Simultaneously, the upper connecting portion 22 can fully utilize the space between two adjacent lower connecting portions 21 without worrying about contact between adjacent upper connecting portions 22, simplifying the arrangement of the upper connecting portion 22. The surface of the upper connecting portion 22 facing away from the lower connecting portion 21 also has a larger projected area, simplifying the connection process between the signal line 30 and the upper connecting portion 22, thereby ensuring the stability of the electrical connection between the signal line 30 and the conductive layer 40.

[0098] In this embodiment, the distances between the first upper connecting portion 221 and the second upper connecting portion 222 and the display area 111 in the second direction are different, and the lower connecting portion 21 can be set accordingly based on the aforementioned distances. For example, please refer to... Figure 8 and Figure 11 , Figure 11 This invention provides a schematic diagram of the structure of connecting portions 20 with different lengths in the lower connecting portion 21 according to an embodiment of the present application. The lower connecting portion 21 includes a first lower connecting portion 211 and a second lower connecting portion 212. The first lower connecting portion 211 is connected to the first upper connecting portion 221, and the second lower connecting portion 212 is connected to the second upper connecting portion 222. The first lower connecting portion 211 and the second lower connecting portion 212 are connected in a third direction (e.g., ...). Figure 11The upper connecting parts 22 are alternately arranged in the Y direction (as shown). The length of the first lower connecting part 211 in the second direction is greater than the length of the second lower connecting part 212 in the second direction, so that the upper connecting parts 22 are all located at the end of the lower connecting parts 21 that is far away from the display area 111 in the second direction, thus avoiding waste of the structural arrangement of the lower connecting parts 21.

[0099] For one possible implementation, please refer to Figure 12 and Figure 13 , Figure 12 A cross-sectional view of a display panel 100 with a recess 141 provided in an embodiment of this application is shown. Figure 13 This illustration shows a cross-sectional view of a substrate 10 with a groove 141 provided in an embodiment of this application. The substrate 10 includes a lower filler layer 14 and an upper filler layer 15, with the upper filler layer 15 located in a first direction (e.g., ...). Figure 12 and Figure 13 On one side of the upper filling layer 14 (in the Z direction shown), the surface of the lower filling layer 14 facing away from the upper filling layer 15 is a mounting surface 12, which has a groove 141. The surface of the upper filling layer 15 facing away from the lower filling layer 14 is a display surface 11. The opening on one side of the through hole 13 is located at the display surface 11, and the opening on the other side of the through hole 13 is located at the bottom wall of the groove 141, so that the through hole 13 and the groove 141 are connected. The connecting part 20 is located inside the through hole 13, and at least a portion of the conductive layer 40 is located inside the groove 141, so that the conductive layer 40 can be connected to the connecting part 20, thereby ensuring the stability of the electrical connection between the signal line 30 and the conductive layer 40.

[0100] By including a lower filling layer 14 and an upper filling layer 15 in the substrate 10, the thickness of the substrate 10 in the first direction is increased, which helps to improve the mechanical strength of the substrate 10, ensuring that the mechanical strength of the substrate 10 can meet the process requirements of simultaneously connecting the conductive layer 40 and at least two connecting portions 20. At least a portion of the conductive layer 40 is located within the groove 141, which allows the substrate 10 to protect the conductive layer 40, and the thickness of at least a portion of the conductive layer 40 overlaps with the thickness of the substrate 10, thus achieving a reasonable thickness configuration for the display panel 100.

[0101] The substrate 10 structure with upper filler layer 15 and lower filler layer 14 also simplifies the manufacturing process of the display panel 100. During the manufacturing process of the display panel 100, the various structures of the display panel 100 are typically sequentially set on the base layer 50, and the display panel 100 is obtained after removing the base layer 50. If the lower filler layer 14 is not provided, the connecting portion 20 and the base layer 50 are directly connected. Due to the material properties of the connecting portion 20 and the base layer 50, the portion of the base layer 50 connected to the connecting portion 20 is difficult to remove, making it easy for the base layer 50 to remain on the surface of the connecting portion 20. This affects the electrical connection between the connecting portion 20 and the conductive layer 40, and consequently affects the stability of the signal line 30 and the conductive layer 40. By setting the lower filling layer 14 and the base layer 50 to be directly connected, and then setting the connecting part 20 on the side of the lower filling layer 14 facing away from the base layer 50, the connecting part 20 and the base layer 50 are separated by the lower filling layer 14. Due to the material properties of the lower filling layer 14 and the base layer 50, the base layer 50 connected to the lower filling layer 14 is easier to remove, making the removal of the base layer 50 more complete. Then, a groove 141 is set at the lower filling layer 14, so that the connecting part 20 is exposed at the groove 141. The conductive layer 40 and the connecting part 20 can be electrically connected by contacting the exposed part at the groove 141. This helps to simplify the connection process of the conductive layer 40 and the connecting part 20 and improve the connection stability of the conductive layer 40 and the connecting part 20.

[0102] In one embodiment, the base layer 50 is made of glass, and the connecting portion 20 is made of metal. Since both the base layer 50 and the connecting portion 20 are inorganic materials, their material properties are quite similar, making it difficult to remove the base layer 50 from the connecting portion 20. The lower filler layer 14 is made of polymer materials, including but not limited to polyimide. The material properties of the base layer 50 and the lower filler layer 14 differ significantly, making it easier to remove the base layer 50 from the lower filler layer 14. This simplifies the manufacturing process of the display panel 100, ensures the connection stability between the conductive layer 40 and the connecting portion 20, and improves the manufacturing yield of the display panel 100.

[0103] Please see Figure 12 The depth of the groove 141 is equal to the thickness of the lower filling layer 14, allowing the groove 141 to penetrate the lower filling layer 14. This avoids the need for the through hole 13 to penetrate part of the lower filling layer 14, simplifying the design of the through hole 13. The lower filling layer 14 separates the connecting portion 20 and the base layer 50. The thickness of the lower filling layer 14 can be set according to actual needs, ensuring the isolation effect of the lower filling layer 14 on the connecting portion 20 and the base layer 50, and allowing for a reasonable configuration of the thickness of the lower filling layer 14, simplifying the subsequent process of setting the groove 141 in the lower filling layer 14. For example, please refer to... Figure 12 The thickness of the lower filling layer 14 is less than the thickness of the upper filling layer 15, which makes the thickness of the lower filling layer 14 smaller and helps to simplify the setting of the groove 141.

[0104] Please see Figure 12 The length of the groove 141 in the second direction is greater than the length of the conductive layer 40 in the second direction, providing a larger accommodating space for the conductive layer 40. This simplifies the placement of the conductive layer 40 within the groove 141, resulting in a flatter conductive layer 40 and ensuring sufficient contact area between the conductive layer 40 and the connecting portion 20. For example, please refer to... Figure 12 The conductive layer 40 and the sidewalls of the groove 141 are spaced apart, which avoids interference between the sidewalls of the groove 141 and the conductive layer 40, and helps to ensure the connection stability between the conductive layer 40 and the connecting part 20.

[0105] In one embodiment, please refer to Figure 13 The through-hole 13 includes a first segment 131 and a second segment 132 that are connected. The first segment 131 is directly connected to the groove 141, and the second segment 132 and the groove 141 are staggered in the first direction. This allows the substrate 10 to have a large thickness in the first direction at both the groove 141 and the second segment 132, which helps to ensure the mechanical strength of the substrate 10 and avoids the problem of the substrate 10 having a smaller thickness and poorer mechanical strength at the groove 141 when the groove 141 and the second segment 132 are oppositely arranged in the first direction. Please refer to [link / reference]. Figure 12 The connecting part 20 includes a lower connecting part 21 and an upper connecting part 22 connected together. The lower connecting part 21 is located in the first segment 131, and the upper connecting part 22 is located in the second segment 132. The conductive layer 40 is located in the groove 141. The conductive layer 40 and the upper connecting part 22 are staggered in the first direction. The upper connecting part 22 is used to connect with the signal line 30, so as to avoid the setting of the conductive layer 40 affecting the connection between the signal line 30 and the upper connecting part 22.

[0106] For example, please refer to Figure 13 In this embodiment, the through-hole 13 further includes a third segment 133. The first segment 131, the second segment 132, and the third segment 133 are sequentially connected. The third segment 133 and the second segment 132 are approximately opposite to each other in the first direction. The upper connecting portion 22 is located within the second segment 132, and a portion of at least two signal lines 30 is located within the third segment 133. The at least two signal lines 30 and the upper connecting portion 22 are in contact with the surface of the lower connecting portion 21, away from each other. By placing a portion of at least two signal lines 30 within the through-hole 13, the upper connecting portion 22 has a smaller thickness in the first direction, which simplifies the installation process of the upper connecting portion 22.

[0107] This application also provides a method for manufacturing a display panel 100. This method is used to manufacture the display panel 100 described in any of the above embodiments. Please refer to [link to relevant documentation]. Figure 14 , Figure 14A flowchart illustrating a method for fabricating a display panel 100 according to an embodiment of this application is shown. The method for fabricating the display panel 100 includes:

[0108] Step S10: On the base layer 50, a lower filling layer 14, at least two connecting parts 20 and an upper filling layer 15 are sequentially provided, with at least two connecting parts 20 embedded in the upper filling layer 15 and at least two connecting parts 20 being spaced apart.

[0109] Step S20: Etch the upper filling layer 15 to expose at least two connection portions 20, and provide at least two signal lines 30 and at least two connection portions 20 in a one-to-one correspondence on the side of the upper filling layer 15 opposite to the lower filling layer 14.

[0110] Step S30: Remove the base layer 50, etch the lower filler layer 14 to expose at least two connecting parts 20, and provide a conductive layer 40 and at least two connecting parts 20 connected on the side of the lower filler layer 14 away from the upper filler layer 15.

[0111] By sequentially providing a lower filling layer 14, at least two connecting portions 20, and an upper filling layer 15 on the base layer 50, the lower filling layer 14 separates the base layer 50 and the at least two connecting portions 20, facilitating the subsequent removal of the base layer 50, ensuring that the connecting portions 20 and the conductive layer 40 have sufficient contact area, thereby ensuring the stability of the electrical connection between the signal line 30 and the conductive layer 40.

[0112] In one embodiment, please refer to Figure 15 , Figure 15A cross-sectional view of the base layer 50, substrate 10 and connecting portion 20 provided in the embodiments of this application is shown. The connecting portion 20 includes a lower connecting portion 21 and an upper connecting portion 22 arranged sequentially in a first direction. The substrate 10 includes a lower filling layer 14 and an upper filling layer 15 stacked in a first direction. The upper filling layer 15 includes a first filling layer 151, a shielding layer 153, a second filling layer 152 and a pixel spacing layer 154 arranged sequentially in a first direction. In step S10, a lower filling layer 14, at least two lower connecting portions 21, and a first filling layer 151 are sequentially disposed on the base layer 50, such that at least two lower connecting portions 21 are buried within the first filling layer 151 and are spaced apart to avoid short circuits; then, the first filling layer 151 is etched to form a second segment 132 of the through hole 13, such that the surface portion of at least two lower connecting portions 21 away from the lower filling layer 14 is exposed, and at least two upper connecting portions 22 are disposed within the second segment 132, and at least two upper connecting portions 22 and at least two lower connecting portions 21 are connected one-to-one, dividing the connecting portion 20 into two parts, which helps to simplify the process of setting the lower connecting portions 21 and upper connecting portions 22; then, a shielding layer 153, a second filling layer 152, and a pixel spacing layer 154 are sequentially disposed on the first filling layer 151, such that at least two upper connecting portions 22 are buried within the second filling layer 152, ensuring that the substrate 10 has sufficient thickness, that is, ensuring that the substrate 10 has sufficient mechanical strength.

[0113] In this embodiment, dividing the connecting portion 20 into two independent components, a lower connecting portion 21 and an upper connecting portion 22, enhances the overall mechanical strength of the lower connecting portion 21 and the upper connecting portion 22, thereby ensuring the mechanical strength of the display panel 100. Furthermore, the smaller thickness of the lower connecting portion 21 and the upper connecting portion 22 simplifies their installation process. The lower connecting portion 21 is embedded within the first filling layer 151, and the upper connecting portion 22 is embedded within the second filling layer 152, further improving the sealing performance of the display panel 100 and preventing moisture from eroding the lower connecting portion 21 and the upper connecting portion 22.

[0114] Please see Figure 15 The surface of the lower connecting portion 21 facing away from the upper connecting portion 22 is in contact with the conductive layer 40. The length of the lower connecting portion 21 is greater than or equal to the length of the upper connecting portion 22, so that the surface of the lower connecting portion 21 facing away from the upper connecting portion 22 has a large area, which helps to ensure the contact area between the lower connecting portion 21 and the conductive layer 40 and improves the stability of the electrical connection between the connecting portion 20 and the conductive layer 40.

[0115] In step S30, the filler layer 14 needs to be etched to expose at least two connection portions 20, so as to enable electrical connection between the at least two connection portions 20 and the conductive layer 40. In one embodiment, please refer to... Figure 15The thickness of the lower filler layer 14 is less than or equal to the thickness of the upper filler layer 15, resulting in a smaller thickness of the lower filler layer 14, which simplifies the etching process of the lower filler layer 14. For example, the thickness of the lower filler layer 14 is less than or equal to half the thickness of the upper filler layer 15, so that the thickness of the lower filler layer 14 is reasonably configured.

[0116] This application also provides an electronic device 200, please refer to... Figure 1 The electronic device 200 includes a circuit board 210 and a display panel 100 as described in any of the above embodiments or a display panel 100 prepared by the method described in any of the above embodiments. The circuit board 210 and the display panel 100 are electrically connected.

[0117] It is understood that the electronic device 200 in this embodiment has the display panel 100 in the above embodiments. Therefore, the electronic device 200 in this embodiment has all the technical effects of the display panel 100 in the above embodiments. Since the technical effects of the display panel 100 have been fully explained in the above embodiments, they will not be repeated here.

[0118] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, include: A substrate and at least two connecting portions, the substrate having through holes that connect both sides of the substrate in a first direction, the connecting portions being located within the through holes, and the at least two connecting portions being spaced apart; At least two signal lines and a conductive layer are respectively located on both sides of the substrate in the first direction. The signal lines and the connecting portions are connected in a one-to-one correspondence. The conductive layer and the at least two connecting portions are all connected. The conductive layer is used to conduct electricity in the first direction.

2. The display panel according to claim 1, characterized in that, The connecting portion includes a lower connecting portion and an upper connecting portion connected together. The upper connecting portion is located on one side of the lower connecting portion in the first direction. The lower connecting portion is connected to the conductive layer, and the upper connecting portion is connected to the signal line. The length of the lower connecting portion in the second direction is greater than the length of the upper connecting portion in the second direction. The second direction is perpendicular to the first direction.

3. The display panel according to claim 2, characterized in that, The two adjacent upper connecting portions are staggered in a third direction, which is perpendicular to the first direction and has an angle with the second direction.

4. The display panel according to claim 3, characterized in that, The lower connecting portion includes a first lower connecting portion and a second lower connecting portion, which are alternately arranged in the third direction. The length of the first lower connecting portion in the second direction is greater than the length of the second lower connecting portion in the second direction.

5. The display panel according to any one of claims 2 to 4, characterized in that, The upper connecting portion is located on the side of the lower connecting portion that is away from the display area in the second direction.

6. The display panel according to any one of claims 2 to 5, characterized in that, At least a portion of the conductive layer is located on the side of the upper connection portion closer to the display area in the second direction.

7. The display panel according to any one of claims 1 to 6, characterized in that, The substrate has a groove on the surface facing the conductive layer, the opening of the through hole is located on the bottom wall of the groove, and at least a portion of the conductive layer is located within the groove.

8. The display panel according to claim 7, characterized in that, The substrate includes a lower filler layer and an upper filler layer. The upper filler layer is located on one side of the lower filler layer in the first direction. The groove penetrates the lower filler layer, and the through hole is located in the upper filler layer. The thickness of the lower filler layer is less than the thickness of the upper filler layer.

9. The display panel according to claim 7 or 8, characterized in that, The conductive layer and the sidewalls of the groove are spaced apart.

10. The display panel according to any one of claims 7 to 9, characterized in that, The through hole includes a first segment and a second segment that are connected to each other. The first segment is directly connected to the groove, and the second segment and the groove are staggered in the first direction.

11. The display panel according to any one of claims 1 to 10, characterized in that, The conductive layer is an anisotropic conductive material.

12. The display panel according to any one of claims 1 to 11, characterized in that, A portion of the at least two signal lines is located within the through hole, and the at least two signal lines are in contact with the surface of the connector.

13. The display panel according to any one of claims 1 to 12, characterized in that, The at least two signal lines are arranged in parallel.

14. A method for manufacturing a display panel, used to manufacture the display panel according to any one of claims 1 to 13, characterized in that, The preparation method includes: A lower filling layer, at least two connecting parts, and an upper filling layer are sequentially arranged on the base layer, wherein the at least two connecting parts are embedded in the upper filling layer and are spaced apart; The upper filling layer is etched to expose the at least two connection portions, and at least two signal lines are provided on the side of the upper filling layer opposite to the lower filling layer and connected to the at least two connection portions in a one-to-one correspondence. Remove the base layer, etch the lower filler layer to expose the at least two connecting portions, and provide a conductive layer on the side of the lower filler layer opposite to the upper filler layer, which is connected to the at least two connecting portions.

15. The method for manufacturing a display panel according to claim 14, characterized in that, The thickness of the lower filler layer is less than or equal to half the thickness of the upper filler layer.

16. The method for manufacturing a display panel according to claim 14 or 15, characterized in that, The connecting part includes an upper connecting part and a lower connecting part connected together. The lower filling layer, the lower connecting part and the upper connecting part are connected in sequence. The length of the lower connecting part is greater than or equal to the length of the upper connecting part.

17. The method for manufacturing a display panel according to claim 16, characterized in that, The upper filling layer includes a first filling layer and a second filling layer connected together. The lower filling layer, at least two lower connecting parts and the first filling layer are sequentially arranged on the base layer. The at least two lower connecting parts are embedded in the first filling layer and are spaced apart. The first filling layer is etched to expose the at least two lower connecting portions. At least two upper connecting portions are provided in the etched area of ​​the first filling layer, and the at least two upper connecting portions and the at least two lower connecting portions are connected in a one-to-one correspondence. A second filling layer is disposed on the side of the first filling layer opposite to the lower filling layer, and the second filling layer covers the at least two upper connecting portions.

18. An electronic device, characterized in that, The display panel includes a circuit board and a display panel as described in any one of claims 1 to 13 or a display panel as described in any one of claims 14 to 17, wherein the circuit board and the connection portion of the display panel are electrically connected.

Images