Substrate processing method and substrate processing apparatus
By using a conductivity holding section and a variable resistor section to adjust the resistance value in the substrate processing apparatus, the problem of arc discharge during substrate processing is solved, and the stability and safety of the processing are achieved.
CN122121584APending Publication Date: 2026-05-29TOKYO ELECTRON LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- TOKYO ELECTRON LTD
- Filing Date
- 2025-11-19
- Publication Date
- 2026-05-29
AI Technical Summary
Technical Problem
Existing technologies are prone to arcing problems during substrate processing.
Method used
The substrate is held at its outer periphery by a conductive holding part in a substrate processing apparatus, and a liquid solution is supplied to the upper surface of the substrate through a conductive supply pipe provided on the outer periphery. The resistance value is adjusted by a variable resistor part to control the current flow and suppress the generation of arc discharge.
Benefits of technology
It effectively suppressed arc discharge during substrate processing, ensuring the stability and safety of the process.
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Smart Images
Figure CN122121584A_ABST
Abstract
A substrate processing method and a substrate processing apparatus capable of suppressing generation of arc discharge during processing of a substrate are described. The substrate processing method includes a holding step of holding an outer periphery of a substrate with a holding portion having conductivity, and a chemical liquid supplying step of supplying a chemical liquid to an upper surface of the substrate through a supply tube provided with a conductive member on an outer peripheral surface after the holding step. The conductive member is electrically connected to one end portion of a variable resistance portion capable of changing a resistance value. The holding portion is electrically connected to the other end portion of the variable resistance portion. The chemical liquid supplying step includes a first sub-step of supplying the chemical liquid to the upper surface of the substrate through the supply tube in a state where the resistance value of the variable resistance portion is set to a first value, and a second sub-step of changing the resistance value of the variable resistance portion to a second value lower than the first value in a state where the chemical liquid is continuously supplied after the first sub-step, and supplying the chemical liquid to the upper surface of the substrate through the supply tube.
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