Pin repair apparatus for semiconductor device packages

Abstract

This application discloses a pin repair device for semiconductor device packages, the semiconductor device package including a body and pins. The pin repair device includes: a jig base, a pressing handle, a pressing rod, a pressing head, a support plate, and a base; wherein, the jig base is used to place the semiconductor device package; the support plate is vertically arranged, and a vertical guide rail is provided on the side of the support plate facing the pressing head; and both the jig base and the support plate are fixed to the base; the pressing handle is rotatably connected to the upper part of the support plate; the upper end of the pressing rod is connected to the pressing handle, and the lower end is connected to the pressing head; the pressing head includes a pressing block and a pressing plate, the pressing block and the pressing plate are respectively arranged on different sides of the bottom surface of the pressing head, and the side of the pressing head near the support plate cooperates with the vertical guide rail; wherein, when the pressing handle is rotated downward, it drives the pressing rod to move vertically downward, and further drives the pressing head to move downward along the vertical guide rail, so that the pressing block presses the pin and the pressing plate presses the body.

Description

Technical Field

[0001] This invention relates to the field of semiconductors, and in particular to a pin repair device for semiconductor device packages. Background Technology

[0002] Semiconductor device packages are susceptible to external forces during manufacturing or transportation, which can lead to issues such as pin deformation and poor flatness. All packages undergo visual inspection before shipment, and only those meeting the shipping criteria are allowed to be shipped. Packages with deformed pins or poor flatness will be deemed visually defective during shipment inspection and will not be allowed to be shipped.

[0003] These packages with deformed or uneven pins need to be repaired before they can be shipped. Semiconductor production lines use manual methods to repair the pins of the packages. Due to differences in operator techniques, the flatness of the pins varies, and static electricity issues can arise during the manual repair process. Summary of the Invention

[0004] To avoid the problems of low efficiency, poor repair effect, and static electricity in manual pin repair, this application proposes a pin repair device for semiconductor device packages, wherein the semiconductor device package includes a body and pins. The pin repair device includes: a jig base, a lower pressure handle, a lower pressure rod, a pressure head, a support plate, and a base. The jig base is used to place the semiconductor device package. The support plate is vertically arranged, and a vertical guide rail is provided on the side of the support plate facing the pressure head. Both the jig base and the support plate are fixed to the base. The lower pressure handle is rotatably connected to the upper part of the support plate. The upper end of the lower pressure rod is connected to the lower pressure handle, and the lower end is connected to the pressure head. The pressure head includes a pressure block and a pressure plate, which are respectively disposed on different sides of the bottom surface of the pressure head. The side of the pressure head closest to the support plate cooperates with the vertical guide rail. When the lower pressure handle rotates downward, it drives the lower pressure rod to move vertically downward, and further drives the pressure head to move downward along the vertical guide rail, so that the pressure block presses the pin and the pressure plate presses the main body.

[0005] Optionally, the fixture base has a first bearing area for placing the main body and a second bearing area for placing the pins, and the height of the first bearing area is lower than the height of the second bearing area, so that when the main body abuts against the step between the first bearing area and the second bearing area, the pins are located above the second bearing area.

[0006] Optionally, the first bearing area includes a first bearing surface and a second bearing surface, with a height difference between the first bearing surface and the second bearing surface, so that when the main body of the semiconductor device package is placed in different orientations, it is supported by the first bearing surface or the second bearing surface respectively.

[0007] Optionally, the upper surface of the second bearing area is an inclined surface, which is inclined downward in a direction away from the step.

[0008] Optionally, the second bearing area is further provided with an angle adjuster for adjusting the tilt angle of the inclined surface.

[0009] Optionally, the angle adjuster is an adjusting screw.

[0010] Optionally, the pressure block is rotatably connected to the pressure head via a rotating shaft so that the pressure head engages with the inclined surface.

[0011] Optionally, the pressure rod is connected to the pressure head via a first spring.

[0012] Optionally, a protective pad layer is provided on the bottom surface of the pressure plate.

[0013] Optionally, a second spring acting on the pressure plate is provided inside the pressure head.

[0014] Optionally, the pin repair device further includes a grounding wire.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] This pin repair device uses a pressure plate to fix the semiconductor package, and presses down the handle to move the pressure block to repair the pin, improving both repair efficiency and repair effect. Furthermore, by setting a step on the fixture base to limit the package's position, using a first and second bearing surface with a height difference to repair the package from both sides, and setting the upper surface of the second bearing area as an inclined surface, with a rotatable pressure block accommodating this inclined surface, the repair effect is further improved. Finally, by incorporating a grounding wire, the influence of static electricity on the semiconductor package is avoided. Attached Figure Description

[0017] Figure 1 This is a perspective view of a pin repair device according to an embodiment of this application.

[0018] Figure 2 This is a front view of a pin repair device according to an embodiment of this application.

[0019] Figure 3 This is a side view of a pin repair device according to an embodiment of this application.

[0020] Figure 4 This is a pin repair device according to an embodiment of the present application. Figure 3 A partial enlarged view of the side view shown.

[0021] Figure 5 This is a pin repair device according to an embodiment of the present application. Figure 2 A partial enlarged view of the front view shown.

[0022] Figure Labels

[0023] 1. Base; 2. Support plate; 21. Vertical guide rail; 3. Fixture seat; 31. First bearing area; 311. First bearing surface; 312. Second bearing surface; 32. Second bearing area; 321. Adjusting screw; 33. Step; 4. Pressure head; 41. Pressure block; 42. Pressure plate; 421. Protective pad; 43. Second spring; 44. Rotating shaft; 5. Lower pressure handle; 6. Lower pressure rod; 61. Connecting piece; 62. Vertical sleeve; 7. Main body; 8. Tube foot; 9. First spring. Detailed Implementation

[0024] Next reference Figure 1 Abstract Figure 5 The pin repair device proposed in this application will be described in detail.

[0025] Figure 1 The overall structure of a pin repair device according to an embodiment of the present invention is shown. The device includes a base 1, a support plate 2 and a fixture seat 3 fixed to the base 1, a pressure head 4, a lower pressure handle 5, and a lower pressure rod 6. The support plate 2 is vertically arranged, and a vertical guide rail 21 is mounted on the side facing the pressure head 4. The side of the pressure head 4 near the support plate 2 cooperates with the vertical guide rail 21 so that the pressure head 4 can move vertically along the vertical guide rail 21. To ensure the stability of the movement, it is preferable to provide two vertical guide rails 21, such as... Figure 1 As shown. The fixture 3 is used to place the semiconductor device package to be repaired, which typically includes a body 7 made of a plastic encapsulation and pins 8 extending from the body 7.

[0026] The pressure handle 5 is rotatably connected to the upper part of the support plate 2, and the upper end of the pressure rod 6 is connected to the pressure handle 5, while the lower end of the pressure rod 6 is connected to the pressure head 4. It is understandable that, since the rotational connection point between the pressure handle 5 and the support plate 2 is fixed, if the pressure handle 5 and the pressure rod 6 are directly connected (the connection point is different from the rotational connection point between the pressure handle 5 and the support plate 2), the displacement of the pressure rod 6 driven by the rotation of the pressure handle 5 cannot remain vertical, but rather forms an angle with the vertical direction, making it difficult to align with the packaged product on the fixture base. Therefore, if... Figures 1 to 3As shown, the lower pressure handle 5 can be connected to the lower pressure rod 6 via a connector 61. The upper end of the connector 61 is rotatably connected to the lower pressure handle 5, and the lower end is rotatably connected to the lower pressure rod 6. The lower pressure rod 6 is fitted into a vertical sleeve 62 fixed to one side of the support plate 2. Therefore, when the lower pressure handle 5 rotates, it drives the connector 61 to rotate and move upward around its connection point with the lower pressure rod 6. The vertical sleeve 62 then limits the vertical movement of the lower pressure rod 6, causing the pressure head 4 to move vertically upward. Furthermore, the lower pressure rod 6 is preferably connected to the pressure head 4 via a first spring 9 to ensure the stability of the pressure head 4 during movement. The side of the pressure head 4 closest to the support plate 2 is slidably fitted with the vertical guide rail 21 (e.g., having a protrusion to fit into a side groove of the vertical guide rail 21, such as...). Figure 1 As shown), this further ensures that the pressure head 4 moves in the vertical direction.

[0027] It is understood that in this embodiment of the application, the pressing handle 5 and the pressing rod 6 are rotatably connected, and preferably connected by a connector 61. However, any structure that can drive the pressing rod 6 to make vertical displacement is feasible. For example, in other embodiments, the pressing handle 5 is not rotatable and is directly fixed to the pressing rod 6. Vertical displacement is achieved by cooperating with the guide rail set on the support plate 2 and applying a vertical force.

[0028] The bottom surface of the pressure head 4 is provided with a pressure block 41 and a pressure plate 42, which are located on different sides of the bottom surface. In this embodiment, in order to match the placement of the packaged product on the fixture base 3, the pressure block 41 is located on the side closer to the support plate 2, and the pressure plate 42 is located on the side farther from the support plate 2. When the lower pressure handle 5 is rotated downward, it drives the lower pressure rod 6 to move vertically downward, which in turn drives the pressure head 4 to move downward along the vertical guide rail 21, ultimately causing the pressure block 41 to press the tube pin 8 and the pressure plate 42 to press the main body 7. The pressure block can be a fixed structure, but in some cases... Figure 4 In the preferred embodiment shown, the pressure block 41 is rotatably connected to the pressure head 4 via a rotating shaft, thereby enabling adaptive angle adjustment so that the tilt angle of the bottom surface of the pressure head 4 matches the warping degree of the tube pins. A protective padding layer 421 (such as a plastic pad) is provided on the bottom surface of the pressure plate 42 to prevent damage to the plastic seal of the main body 7. Furthermore, a second spring 43 acting on the pressure plate 42 is provided inside the pressure head 4. Figures 1 to 5 As shown, one end of the second spring 43 protrudes from the top of the pressure head 4, and the other end (not shown) is located inside the pressure head 4 and at the symmetrical ends of the pressure plate 42, thereby ensuring the stability of the pressure head 4 and the pressure plate 42 when they move.

[0029] The fixture base 3 has a first bearing area 31 for placing the main body 7 and a second bearing area 32 for placing the pins, with the height of the first bearing area 31 being lower than the height of the second bearing area 32, so that when the main body 7 abuts against the step 33 between the first bearing area 31 and the second bearing area 32, the pins 8 are positioned above the second bearing area 32. Thus, the limiting function of the step 33 ensures that the pins 8 are in the appropriate position when placing the packaged product, aligning with the pressing position of the pressure block 41.

[0030] Furthermore, taking the pin 8 position as a reference, the thickness of the front and back sides of the package body 7 is usually different (i.e., the vertical distance from the front and back sides to the pin 8 is different). Therefore, when the package body 7 is placed in different orientations (front facing up and back facing up), the height of the pin 8 will also differ, thus affecting the pin repair effect. Therefore, in this embodiment, the first bearing area 31 is also configured to include a first bearing surface 311 and a second bearing surface 312. There is a height difference between the first bearing surface 311 and the second bearing surface 312. Figure 5 In the illustrated embodiment, the height difference is 6.80mm - 6.50mm = 0.30mm. Therefore, when the main body 7 of the package is placed in different orientations, it can be supported by either the first or second supporting surface, so that the pin 8 is close in height to the step 33 to achieve the best repair effect. Figure 4 As shown.

[0031] Furthermore, those skilled in the art will understand that, due to material and structural reasons, pin 8 will exhibit a certain degree of springback after force correction. Therefore, when the second bearing area 32 is horizontal, once the pressure block 41 is released, the springback of the pin will result in poor repair effect and low repair efficiency for the warped pin. To address this, in this embodiment, the upper surface of the second bearing area 32 is set as an inclined surface, and this inclined surface slopes downwards in the direction away from the step 33. Figure 3 , Figure 4 In the illustrated embodiment, the tilt angle is 5°. Therefore, when the pressure block 41 presses down on the corrected pin 8 at a certain angle and then releases, the pin 8 can spring back to a horizontal or near-horizontal position, improving the pin's correction and repair effect. Simultaneously, to accommodate various pins with different degrees of springback, an angle adjuster is also provided on one side of the second bearing area 32 to adjust the tilt degree of the tilted surface. Figure 4 In the illustrated embodiment, the angle adjuster is an adjusting screw 321 located on the side of the second bearing area 32 near the support plate 2. When the adjusting screw 321 is rotated upwards, the tilt angle of the inclined surface decreases; when the adjusting screw 321 is rotated downwards, the tilt angle of the inclined surface increases. In other embodiments, wedge blocks, eccentric wheels, or other devices can also be used as angle adjusters.

[0032] Furthermore, when the surface of the second bearing area 32 where the pin 8 is located is an inclined surface during repair, the pressure block 41 used to press the pin 8 should also be matched with the inclined surface to improve the repair effect. Thus, the pressure block 41 is rotatably connected to the pressure head 4 via the rotating shaft 44, and the rotation angle is adjusted according to the inclination angle of the inclined surface to make them consistent and match the inclined surface.

[0033] Finally, to prevent static electricity generated during pin repair from affecting the semiconductor package, the pin repair device also includes a grounding wire.

[0034] The following are the operating instructions for this pin repair device: The initial position of the pressure head is a non-working position at a certain height above the fixture. To begin repair, first place the semiconductor package face up (either front or back) on the fixture, abutting it against the step on the fixture. Then, adjust the tilt angle of the inclined surface and the rotation angle of the pressure block according to the specific rebound of the pin. Finally, rotate the lower pressure handle downwards so that the pressure plate presses and fixes the main body of the semiconductor package, and the pressure head presses the pin into contact with the inclined surface. After holding for a certain time, rotate the lower pressure handle upwards to release the semiconductor package. To improve the repair effect, the semiconductor package can then be placed face up (either front or back) and the above steps repeated for further repair. Thus, both upturned and downturned pins can be repaired. Alternatively, the angles of the pressure block and the inclined surface can be adjusted first before placing the semiconductor package on the fixture.

[0035] The specific embodiments described above illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application is presented in conjunction with preferred embodiments, this does not mean that the features of this invention are limited to these embodiments. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0036] Furthermore, the various operations will be described as multiple discrete operations in a manner most conducive to understanding the illustrative embodiments; however, the order of description should not be construed as implying that these operations must depend on the order. In particular, these operations do not need to be performed in the order presented.

[0037] Unless the context otherwise specifies, the terms “contains,” “has,” and “includes” are synonyms. The phrase “A / B” means “A or B.” The phrase “A and / or B” means “(A and B) or (A or B).”

[0038] In the accompanying drawings, certain structural or methodological features are shown in a specific arrangement and / or order. However, it should be understood that such a specific arrangement and / or order may not be necessary. In some embodiments, these features may be arranged in a manner and / or order different from that shown in the illustrative drawings. Furthermore, the inclusion of structural or methodological features in a particular figure does not imply that such features are required in all embodiments, and in some embodiments, these features may be omitted or may be combined with other features.

[0039] It should be understood that although terms such as "first," "second," etc., may be used herein to describe various units or data, these units or data should not be limited by these terms. These terms are used merely to distinguish one feature from another. For example, without departing from the scope of the exemplary embodiments, a first feature may be referred to as a second feature, and similarly, a second feature may be referred to as a first feature.

[0040] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0041] Although the invention has been illustrated and described with reference to certain preferred embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.

Claims

1. A pin repair apparatus for a semiconductor device package, the semiconductor device package comprising a body and pins, characterized in that, include: The fixture includes a base, a lower pressure handle, a lower pressure rod, a pressure head, a support plate, and a base; among which, The fixture is used to hold the semiconductor device package; The support plate is vertically arranged, and a vertical guide rail is provided on the side of the support plate facing the pressure head; and both the fixture base and the support plate are fixed to the base. The pressing handle is rotatably connected to the upper part of the support plate; The upper end of the pressure rod is connected to the pressure handle, and the lower end is connected to the pressure head; The pressure head includes a pressure block and a pressure plate, the pressure block and the pressure plate are respectively disposed on different sides of the bottom surface of the pressure head, and the side of the pressure head closer to the support plate cooperates with the vertical guide rail; The downward pressure handle is used to drive the downward pressure rod to move vertically downward when rotated downward, and further drive the pressure head to move downward along the vertical guide rail, so that the pressure block presses the tube foot and the pressure plate presses the main body.

2. The pin repair device according to claim 1, characterized in that, The fixture base has a first bearing area for placing the main body and a second bearing area for placing the tube feet, and the height of the first bearing area is lower than the height of the second bearing area, so that when the main body abuts against the step between the first bearing area and the second bearing area, the tube feet are located above the second bearing area.

3. The pin repair device according to claim 2, characterized in that, The first bearing area includes a first bearing surface and a second bearing surface, with a height difference between the first bearing surface and the second bearing surface, so that when the main body of the semiconductor device package is placed in different orientations, it is supported by the first bearing surface or the second bearing surface respectively.

4. The pin repair device according to claim 2, characterized in that, The upper surface of the second bearing area is an inclined surface, which is inclined downward in the direction away from the step.

5. The pin repair device according to claim 4, characterized in that, An angle adjuster is also provided on the second bearing area to adjust the tilt angle of the inclined surface.

6. The pin repair device according to claim 5, characterized in that, The angle adjuster is an adjusting screw.

7. The pin repair device according to claim 6, characterized in that, The pressure block is rotatably connected to the pressure head via a rotating shaft, so that the pressure head engages with the inclined surface.

8. The pin repair device according to claim 1, characterized in that, The pressure rod is connected to the pressure head via a first spring.

9. The pin repair device according to claim 8, characterized in that, A protective pad is provided on the bottom surface of the pressure plate.

10. The pin repair device according to claim 9, characterized in that, A second spring is provided inside the pressure head to act on the pressure plate.

11. The pin repair device according to claim 1, characterized in that, The pin repair device also includes a grounding wire.

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