Multi-rail independent power supply and relay control system for PCB vertical continuous electroplating

Abstract

This invention discloses a multi-track independent power supply and relay control system for vertical continuous electroplating of PCBs, comprising: an electroplating tank, cathode hangers, cathode power supply tracks, anode units, and control components, including a position tracking module, a power control module, and a cross-tank relay power supply control module. The position tracking module is used to track the position of each cathode hanger in real time. The power control module is used to independently adjust the current output parameters of each power supply track segment and the first anode area and the second anode area. The cross-tank relay power supply control module is used to coordinate the output timing and current intensity of the power supply before and after when the cathode hanger crosses the power supply track segment corresponding to different electroplating tanks, so as to smoothly transition the electroplating charge on the PCB board. This invention can solve the problem of uneven plating between boards and within boards caused by parallel power supply of multiple hangers in the same tank in traditional PCB electroplating equipment.

Description

Technical Field

[0001] This invention relates to the field of PCB board processing equipment, and more specifically to a multi-track independent power supply and relay control system for vertical continuous electroplating of PCBs. Background Technology

[0002] Vertical continuous plating (VCP) production lines are key equipment in the pattern plating process of PCB manufacturing. As PCBs become increasingly high-density and feature finer lines, the requirements for plating uniformity and precise copper thickness control in patterned areas are becoming increasingly stringent. Traditional VCP equipment typically uses multiple pairs of collector brushes to power continuously moving racks on a track. However, a single track usually supplies power to multiple racks within the same plating tank in parallel, making it impossible to independently and precisely control the current of a single PCB rack. Especially in the transition area where racks enter and exit the plating tank, changes in conductive contact can easily lead to uneven plating thickness between the PCB edge and center, and between different racks. Furthermore, traditional systems struggle to adjust the differential current on both sides of a single PCB, failing to accurately compensate for plating differences caused by anode losses, uneven solution flow, and other factors. Summary of the Invention

[0003] To overcome the above-mentioned shortcomings, the purpose of this invention is to provide a multi-track independent power supply and relay control system for vertical continuous electroplating of PCBs.

[0004] To achieve the above objectives, the technical solution adopted by the present invention includes:

[0005] Electroplating tanks, having at least two and arranged sequentially along the production line direction; The cathode holder is used to clamp and fix the PCB board and can conduct the cathode current to the first and second sides of the PCB board respectively. A cathode power supply track is located above the electroplating tank. The cathode power supply track has N independent power supply track segments, where N is greater than the number of cathode hangers that the corresponding electroplating tank can effectively accommodate. Each power supply track segment is electrically connected to the corresponding cathode hanger through an independent power supply to provide cathode current to the first side and the second side of the PCB board, respectively. An anode unit is disposed in the electroplating tank and located on both sides of the cathode hanger, forming a first anode area corresponding to the first side of the PCB board and a second anode area corresponding to the second side of the PCB board. The first anode area and the second anode area are each equipped with an independent power supply. The control components include a position tracking module, a power control module, and a cross-tank relay power supply control module. The position tracking module is used to track the position of each cathode fixture in real time. The power control module is used to independently adjust the current output parameters of each power supply track segment and the first anode area and the second anode area. The cross-tank relay power supply control module is used to coordinate the output timing and current intensity of the power supply before and after when the cathode fixture crosses the power supply track segment corresponding to different electroplating tanks, so as to make the electroplating charge of the PCB board transition smoothly.

[0006] In the preferred technical solution of the multi-track independent power supply and relay control system for vertical continuous electroplating of PCBs, the cathode holder includes a frame body forming an accommodating space, a first conductive clip disposed above the accommodating space, a second conductive clip disposed below the accommodating space, and a power-collecting carbon brush disposed on the upper side of the frame body. The power-collecting carbon brush has a first power-collecting part and a second power-collecting part disposed along the production line direction. The first conductive clip is electrically connected to the first power-collecting part to provide cathode current to a first side of the PCB board, and the second conductive clip is electrically connected to the second power-collecting part to provide cathode current to a second side of the PCB board.

[0007] In the preferred technical solution of the multi-track independent power supply and relay control system for vertical continuous electroplating of PCBs, the effective working length of each electroplating tank is set to accommodate three cathode hangers at the same time, and the cathode power supply track is provided with four independent power supply track segments.

[0008] In the preferred technical solution of the multi-track independent power supply and relay control system for vertical continuous electroplating of PCBs, the cathode hanger is equipped with a current sensor and a voltage sensor to detect the current and voltage at the end of the PCB electroplating circuit on the cathode hanger in real time and to feed back the detection data to the control component.

[0009] In the preferred technical solution of the multi-track independent power supply and relay control system for vertical continuous electroplating of PCB, the anode unit includes an anode plate and a shielding plate disposed on the anode plate. The shielding plate has regional compensation holes on its surface. The regional compensation holes are at least one of grids of different densities, circular hole arrays, and irregular holes. The opening density or size of the regional compensation holes is adapted to the current density of the corresponding area of ​​the workpiece.

[0010] In the preferred technical solution of the multi-track independent power supply and relay control system for vertical continuous electroplating of PCBs, both the first power taking part and the second power taking part are pressed against the power supply track section by an elastic structure.

[0011] In the preferred technical solution of the multi-track independent power supply and relay control system for vertical continuous electroplating of PCB, the outer surfaces of the first conductive clip and the second conductive clip are covered with an insulating and corrosion-resistant layer, which covers the remaining surfaces except for the parts in contact with the PCB board.

[0012] In the preferred technical solution of the multi-track independent power supply and relay control system for vertical continuous electroplating of PCBs, the material of the insulating corrosion-resistant layer is at least one of PP, PE, PVC, PTFE or epoxy resin.

[0013] In the preferred technical solution of the multi-track independent power supply and relay control system for vertical continuous electroplating of PCB, a baffle tube is provided below the cathode hanger in the electroplating tank, and the baffle tube has several upward through-holes.

[0014] In the preferred technical solution of the multi-track independent power supply and relay control system for vertical continuous electroplating of PCB, the frame body includes an upper frame and a lower frame. The upper frame has a through hole on its side, and the lower frame has a waist hole on its side. The upper frame and the lower frame are connected by bolts and nuts passing through the through hole and waist hole to adjust the relative position of the upper frame and the lower frame and to lock and fix them.

[0015] The beneficial effects of this invention are as follows: By configuring N+1 independent power supply tracks for each electroplating tank and connecting them to a programmable power supply, and by combining independent control of the power supply circuits of the first and second sides of the cathode hanger and the anode area, this application achieves fine current regulation with one power supply track segment corresponding to one cathode hanger and independent control of the current and voltage parameters of the first and second sides of the PCB board. This solves the problem of uneven plating between boards and within boards caused by parallel power supply of multiple hangers in the same tank in traditional equipment. Attached Figure Description

[0016] Figure 1 This is the front view of the present invention; Figure 2 A top view of the cathode fixture placed inside the electroplating tank; Figure 3 Side view of the cathode holder placed inside the electroplating tank. Figure 1 ; Figure 4 Side view of the cathode holder placed inside the electroplating tank. Figure 2 ; Figure 5 A front view of the PCB board being fixed by the cathode mount; Figure 6 This is the front view of the charging carbon brush; Figure 7 This is a schematic diagram showing the connection between the elastic structure and the first power extraction unit. Figure 8 This is the front view of the anode unit; In the figure: 1. Electroplating tank; 2. Cathode hanger; 21. Frame body; 22. First conductive clip; 23. Second conductive clip; 24. Carbon brush for power collection; 241. First power collection part; 242. Second power collection part; 3. Cathode power supply track; 31. Power supply track section; 4. Anode unit; 41. First anode area; 42. Second anode area; 43. Anode plate; 44. Shielding plate body; 441. Area compensation hole; 5. Spraying unit; 6. PCB board; 61. First side; 62. Second side; 7. Elastic structure. Detailed Implementation

[0017] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0018] It should be noted that in the description of this invention, terms such as "upper," "lower," "left," "right," "front," and "rear," which indicate direction or positional relationships, are based on the direction or positional relationships shown in the accompanying drawings. These are used merely for ease of description and do not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0019] Furthermore, it should be noted that, in the description of this invention, unless otherwise explicitly specified and limited, the terms "set," "connected," and "linked" should be interpreted broadly, for example, referring to a fixed connection, a detachable connection, or an integral connection. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0020] See Figures 1 to 8 The present invention provides a multi-track independent power supply and relay control system for vertical continuous electroplating of PCBs, comprising an electroplating tank 1, a cathode hanger 2, a cathode power supply track 3, an anode unit 4, and a control component.

[0021] See Figures 1 to 4 There are at least two electroplating tanks 1, which are connected sequentially along the production line. The number of electroplating tanks 1 can be selected according to actual production needs. Each electroplating tank 1 has two sets of spraying units 5 arranged opposite each other along its length. The spraying units 5 are located between the anode unit 4 and the cathode hanger 2. The spraying unit 5 includes a spray plate, several nozzles on the spray plate, and a high-pressure pump connected to the spray plate. The high-pressure pump can draw the electroplating liquid in the electroplating tank 1 into the spray plate and spray it out to the center of the electrolytic tank through the nozzles, so that the copper ions in the electrolyte can be uniformly deposited on the surface of the PCB board 6.

[0022] See Figures 3 to 5 The PCB board 6 has a first side 61 and a second side 62 that are to be electroplated and are arranged opposite to each other; the cathode hanger 2 is used to clamp and fix the PCB board 6, and can connect the first side 61 and the second side 62 of the PCB board 6 respectively, and the external cathode current can be conducted to the first side 61 and the second side 62 of the PCB board 6 through the cathode hanger 2.

[0023] See Figures 1 to 4 Each electroplating tank 1 is provided with a cathode power supply track 3 above it. Adjacent cathode power supply tracks 3 are connected end to end. Each cathode power supply track 3 has N independent power supply track segments 31. The number of N is greater than the number of cathode hangers 2 that the corresponding electroplating tank 1 can effectively accommodate. Each power supply track segment 31 has at least two power supply track slots extending along its length direction. Each power supply track slot is connected to an independent power supply so that different cathode hangers 2 can be powered by the corresponding power supply track segment 31, so as to separately power the first side 61 and the second side 62 of the PCB clamped by the cathode hanger 2.

[0024] See Figures 2 to 5 , Figure 8 The anode unit 4 includes an anode plate 43, which is made of titanium-based or platinum-coated material and serves as the anode body for the electroplating reaction. Multiple anode plates 43 are arranged on both sides of the cathode holder 2 along the length of the electroplating tank 1, forming a first anode area 41 corresponding to the first side 61 of the PCB board 6 and a second anode area 42 corresponding to the second side 62 of the PCB board 6. Both the first anode area 41 and the second anode area 42 are equipped with independent power supplies. This arrangement allows for independent power supply control of the first side 61 and the second side 62 of the PCB board 6 for each cathode holder 2 within the same electroplating tank 1. Specifically, the first side 61 cathode and the second side 62 cathode of each cathode holder 2 are powered by two independent programmable DC power supplies. Correspondingly, the first anode area 41 and the second anode area 42 of the electroplating tank 1 are also powered by independent anode power supplies, thus ensuring precise control of the current density on both sides of the PCB on each holder by the control components.

[0025] See Figures 1 to 5The control components include a position tracking module, a power control module, and a cross-tank relay power supply control module. The position tracking module includes at least an encoder and a displacement sensor installed on the cathode hanger 2. The position tracking module can track the precise position of each cathode hanger 2 on the production line in real time and identify that each cathode hanger 2 is on the corresponding power supply track segment 31 of the corresponding electroplating tank 1. The power control module can communicate with the independent power supply controlling the cathode track and the anode unit 4. The power control module can independently set and adjust the output current to the first side 61 and the second side 62 of the PCB board 6 in real time for each cathode hanger 2 on its corresponding power supply track segment 31, and can also adjust the current output parameters of the first anode area 41 and the second anode area 42 in real time. The cross-tank relay power supply control module is used to coordinate the output timing and current intensity of the power supply before and after when the cathode hanger 2 crosses the power supply track segment 31 corresponding to different electroplating tanks 1, so that the electroplating charge of the PCB board 6 is smoothly transitioned.

[0026] Specifically, when electroplating the PCB board 6, the PCB board 6 is first clamped and fixed using the cathode hanger 2. Then, a preset number of cathode hangers 2 are placed in the electroplating tank 1 using a robotic arm or other equipment, and the corresponding cathode hanger 2 is brought into contact with the power supply track section 31 of the cathode power supply track 3. This allows the first side 61 and the second side 62 of the PCB board 6 clamped and fixed by each cathode hanger 2 to be connected to an independent power supply. Simultaneously, with the first anode area 41 and the second anode area 42 also connected to independent power supplies, individual power parameter adjustments can be made to the PCB board 6 on a single cathode hanger 2. When several cathode hangers 2 are controlled to move synchronously in different electroplating tanks 1, all cathode hangers 2 move forward one station. The voltage and current of the cathode hangers 2 located in the electrolytic tank are maintained at preset values, while the cathode hangers 2 located at the edge of the electrolytic tank begin to move out of their respective positions. The cathode holder 2 is partially inside the current electrolytic cell, while the other part has entered the next electrolytic cell. Specifically, during the relay process of the cathode holder 2 switching from the current electrolytic cell to the next electrolytic cell, the cross-cell relay power supply control module controls the output current of the current cell to the first side 61 and the second side 62 of the PCB board 6 to decrease linearly to 0. At the same time, it controls the output power of the next electroplating cell 1 to the first side 61 and the second side 62 of the PCB board 6 to increase from 0 to a preset value. During this process, the instantaneous total current received by the PCB board 6 on the cathode holder 2 always remains at the preset value, realizing a smooth relay of charge and ensuring the uniformity of the plating thickness on the surface of the PCB board 6. This cycle is repeated so that each cathode holder 2 can achieve precise power supply and smooth cross-cell relay when passing through the electroplating cell 1, ensuring that the PCB board 6 processed by the production line can obtain a uniform electroplating effect.

[0027] In one or more embodiments, the cathode holder 2 includes a frame body 21 having an accommodating space, a first conductive clip 22 disposed above the accommodating space, a second conductive clip 23 disposed below the accommodating space, and a power-collecting carbon brush 24 disposed on the upper side of the frame body 21. The power-collecting carbon brush 24 has a first power-collecting part 241 and a second power-collecting part 242 disposed along the production line direction. The first conductive clip 22 is electrically connected to the first power-collecting part 241 to provide cathode current to the first side 61 of the PCB board 6, and the second conductive clip 23 is electrically connected to the second power-collecting part 242 to provide cathode current to the second side 62 of the PCB board 6.

[0028] See Figures 2 to 6 The first conductive clip 22 can clamp the upper part of the PCB board 6 in the accommodating space, and the conductive part of the first conductive clip 22 is connected to the first side 61 of the PCB board 6. The second conductive clip 23 can clamp the lower part of the PCB board 6 in the accommodating space, and the conductive part of the second conductive clip 23 is connected to the second side 62 of the PCB board 6. The first conductive clip 22 is connected to the first power-collecting part 241 of the power-collecting carbon brush 24 through a cable, and the second conductive clip 23 is connected to the second power-collecting part 242 of the power-collecting carbon brush 24 through a cable.

[0029] When the cathode holder 2 is placed in the electrolytic cell, the carbon brush 24 of the cathode holder 2 is placed in one of the power supply sections of the cathode power supply track 3, and the first power supply part 241 and the second power supply part 242 are located in different power supply track slots of the power supply section. Each power supply track section 31 is electrically connected to two independent programmable DC power supplies. One power supply provides cathode current to the first side 61 of the PCB board 6 through the first power supply part 241, and the other power supply provides cathode current to the second side 62 of the PCB board 6 through the second power supply part 242, so as to realize the fine supply of current and ensure the uniformity of the coating on the surface of the PCB board 6.

[0030] In one or more embodiments, the first power-taking unit 241 and the second power-taking unit 242 are both pressed against the power supply track section 31 by the elastic structure 7.

[0031] See Figures 5 to 7 The first power take-off part 241 and the second power take-off part 242 are both rotatably mounted on the side of the frame body 21 via a rotating shaft; the elastic structure 7 is a torsion spring, which has a first end and a second end opposite to each other. The first end of the torsion spring is mounted on the frame body 21, and the second end of the torsion spring is mounted on the first power take-off part 241 or the second power take-off part 242. With the help of the elastic force of the torsion spring, the first power take-off part 241 and the second power take-off part 242 can always maintain contact with the cathode power supply track 3, thereby improving the stability of power supply to the first side 61 and the second side 62 of the PCB board 6.

[0032] In one or more embodiments, the outer surfaces of the first conductive clip 22 and the second conductive clip 23 are covered with an insulating and corrosion-resistant layer, which covers the remaining surfaces except for the parts that contact the PCB board 6.

[0033] join Figures 5 to 7 The insulating and corrosion-resistant layer provided on the outer surface of the first conductive clip 22 and the second conductive clip 23 can isolate the electroplating solution from contact with the metal substrate of the first conductive clip 22 and the second conductive clip 23, effectively resisting strong acid and alkali corrosion, greatly extending the service life of the rack, and preventing metal ions in the first conductive clip 22 and the second conductive clip 23 from dissolving and contaminating the plating solution, thus ensuring the plating quality and yield of the PCB board 6. On the other hand, the insulating layer only exposes the clamping part, reducing stray current interference and allowing the current to be directionally conducted to the PCB board 6, improving the uniformity of electroplating.

[0034] In one or more embodiments, the insulating corrosion-resistant layer is made of at least one of PP, PE, PVC, PTFE or epoxy resin.

[0035] In one or more embodiments, the effective working length of each electroplating tank 1 is set to accommodate three cathode hangers 2 simultaneously, and the corresponding cathode power supply track 3 is provided with four independent power supply track segments 31. It can be understood that the number of cathode hangers 2 accommodated by the electroplating tank 1 can be selected according to the actual production needs based on the length of the electrolytic tank. In a preferred embodiment, along the production line direction, the electroplating tank 1 can accommodate three cathode hangers 2 simultaneously for electroplating operations. Correspondingly, the cathode power supply track 3 provided above the electroplating tank 1 has four power supply track segments 31, three of which are used to accommodate the carbon brushes 24 of the three cathode hangers 2 respectively, and the remaining power supply track segments 31 are for backup.

[0036] In one or more embodiments, the cathode mount 2 is provided with a current sensor and a voltage sensor, which are used to detect the current and voltage at the end of the PCB electroplating circuit on the cathode mount 2 in real time and transmit the detection data back to the control component.

[0037] In one or more embodiments, the anode unit 4 includes an anode plate 43 and a shielding plate 44 disposed on the anode plate 43. The shielding plate 44 has a region compensation hole 441 on its surface. The region compensation hole 441 is at least one of a grid of different densities, a circular hole array, or an irregular hole. The opening density or size of the region compensation hole 441 is adapted to the current density of the corresponding area of ​​the workpiece.

[0038] See Figures 1 to 4 , Figure 8The shielding plate 44 is fixed to the side of the anode plate 43 facing the electroplated workpiece. The area compensation holes 441 opened on its surface are a combination of at least one of the following hole types: mesh holes of different densities, circular hole arrays, or irregular holes. In the high current density area of ​​the PCB board 6, the compensation holes at the corresponding positions on the shielding plate 44 are denser or smaller to block more electric field lines. In the low current density area, the compensation holes are sparser or larger to allow more current to pass through. When electroplating the PCB board 6, the electric field lines generated by the anode must first pass through the shielding plate 44 before reaching the surface of the PCB board 6. By selectively blocking the electric field lines, the shielding plate 44 can effectively balance the problem of uneven current density caused by the difference in circuit pattern on the surface of the PCB board 6, and improve the uniformity of the plating layer deposited on the surface of the PCB board 6.

[0039] In one or more embodiments, a baffle tube is provided in the electroplating tank 1 below the cathode hanger 2, and the baffle tube has several upward-through air holes.

[0040] See Figure 4 The turbulence tube is connected to an external pump body, which can be an air pump. Gas is pumped into the turbulence tube through the pump body and discharged upward through the air hole. The bubbles strongly disturb the electrolyte during their ascent, effectively destroying the static diffusion layer formed on the surface of PCB board 6 due to the continuous consumption of metal ions. This accelerates the replenishment of fresh electrolyte, significantly alleviates concentration polarization, avoids the problems of scorching and uneven thickness of the plating under high current density, and improves the quality of the plating on PCB board 6.

[0041] In one or more embodiments, the frame body 21 includes an upper frame and a lower frame. The upper frame has a through hole on its side, and the lower frame has a corresponding waist hole on its side. The upper frame and the lower frame are connected by bolts and nuts passing through the through hole and waist hole to adjust the relative position of the upper frame and the lower frame and to lock and fix them.

[0042] See Figure 5 When adjusting the upper and lower frames, simply unscrew the nuts in the opposite direction to release their limiting and fixing effect on the upper and lower frames. Then, move the upper or lower frame vertically to the preset position and tighten the nuts and bolts to lock and fix the upper and lower frames. This allows for adjustment of the accommodating space of the frame body 21, adapting to the clamping and fixing of PCB boards 6 of different sizes.

[0043] The above embodiments are only for illustrating the technical concept and features of the present invention. Their purpose is to enable those skilled in the art to understand the content of the present invention and implement it. They should not be used to limit the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A multi-rail independent power supply and relay control system for vertical continuous electroplating of PCBs, characterized in that, include: Electroplating tanks, having at least two and arranged sequentially along the production line direction; The cathode holder is used to clamp and fix the PCB board and can conduct the cathode current to the first and second sides of the PCB board respectively. A cathode power supply track is located above the electroplating tank. The cathode power supply track has N independent power supply track segments, where N is greater than the number of cathode hangers that the corresponding electroplating tank can effectively accommodate. Each power supply track segment is electrically connected to the corresponding cathode hanger through an independent power supply to provide cathode current to the first side and the second side of the PCB board, respectively. An anode unit is disposed in the electroplating tank and located on both sides of the cathode hanger, forming a first anode area corresponding to the first side of the PCB board and a second anode area corresponding to the second side of the PCB board. The first anode area and the second anode area are each equipped with an independent power supply. The control components include a position tracking module, a power control module, and a cross-tank relay power supply control module. The position tracking module is used to track the position of each cathode fixture in real time. The power control module is used to independently adjust the current output parameters of each power supply track segment and the first anode area and the second anode area. The cross-tank relay power supply control module is used to coordinate the output timing and current intensity of the power supply before and after when the cathode fixture crosses the power supply track segment corresponding to different electroplating tanks, so as to make the electroplating charge of the PCB board transition smoothly.

2. The multi-rail independent power supply and relay control system for vertical continuous electroplating of PCBs according to claim 1, characterized in that: The cathode holder includes a frame body forming an accommodating space, a first conductive clip disposed above the accommodating space, a second conductive clip disposed below the accommodating space, and a power-collecting carbon brush disposed on the upper side of the frame body. The power-collecting carbon brush has a first power-collecting part and a second power-collecting part disposed along the production line direction. The first conductive clip is electrically connected to the first power-collecting part to provide cathode current to a first side of the PCB board, and the second conductive clip is electrically connected to the second power-collecting part to provide cathode current to a second side of the PCB board.

3. The multi-rail independent power supply and relay control system for vertical continuous electroplating of PCBs according to claim 1, characterized in that: The effective working length of each electroplating tank is set to accommodate three cathode hangers simultaneously, and the cathode power supply track is provided with four independent power supply track segments.

4. The multi-rail independent power supply and relay control system for vertical continuous electroplating of PCBs according to claim 1, characterized in that: The cathode mount is equipped with a current sensor and a voltage sensor, which are used to detect the current and voltage at the end of the PCB electroplating circuit on the cathode mount in real time and transmit the detection data back to the control component.

5. The multi-rail independent power supply and relay control system for vertical continuous electroplating of PCBs according to claim 1, characterized in that: The anode unit includes an anode plate and a shielding plate disposed on the anode plate. The shielding plate has regional compensation holes on its surface. The regional compensation holes are at least one of the following: grids of different densities, circular hole arrays, and irregular holes. The opening density or size of the regional compensation holes is adapted to the current density of the corresponding area of ​​the workpiece.

6. The multi-rail independent power supply and relay control system for vertical continuous electroplating of PCBs according to claim 2, characterized in that: Both the first power-taking unit and the second power-taking unit are held against the power supply track section by an elastic structure.

7. The multi-rail independent power supply and relay control system for vertical continuous electroplating of PCBs according to claim 2, characterized in that: The first conductive clip and the second conductive clip are covered with an insulating and corrosion-resistant layer, which covers the remaining surfaces except for the parts that contact the PCB board.

8. The multi-rail independent power supply and relay control system for vertical continuous electroplating of PCBs according to claim 7, characterized in that: The insulating and corrosion-resistant layer is made of at least one of PP, PE, PVC, PTFE or epoxy resin.

9. The multi-rail independent power supply and relay control system for vertical continuous electroplating of PCBs according to claim 1, characterized in that: A baffle tube is provided below the cathode hanger in the electroplating tank, and the baffle tube has several upward-through air holes.

10. The multi-rail independent power supply and relay control system for vertical continuous electroplating of PCBs according to claim 2, characterized in that: The main frame includes an upper frame and a lower frame. The upper frame has a through hole on its side, and the lower frame has a corresponding waist hole on its side. The upper frame and the lower frame are connected by bolts and nuts passing through the through hole and waist hole to adjust the relative position of the upper frame and the lower frame and to lock and fix them.

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