Cooling device for a high temperature gas cooled reactor

Abstract

This invention relates to the field of gas-cooled reactor cooling technology and discloses a cooling device for a high-temperature gas-cooled reactor, comprising a base plate, multiple heat exchange tubes, and multiple heat dissipation rings. The base plate is disposed between a support structure and a concrete wall of the high-temperature gas-cooled reactor, and is used to absorb heat from the support structure. Multiple heat exchange tubes are spaced apart on the base plate, each containing cooling water. One end of each heat exchange tube penetrates the wall and extends to the outside to conduct heat from the support structure to the outside. The other end of each heat exchange tube is an open end connected to the base plate, allowing direct contact between the cooling water and the base plate. Multiple heat dissipation rings are sleeved on the heat exchange tubes along their axial direction. The heat dissipation rings located within the wall absorb heat from the wall, while those located outside dissipate heat. This high-temperature gas-cooled reactor cooling device, through direct contact between the heat exchange tubes and the base plate, achieves direct heat exchange between the cooling water and the base plate, improving heat transfer efficiency and simplifying the cooling structure.

Description

Technical Field

[0001] This invention belongs to the field of gas-cooled reactor cooling technology, and specifically relates to a cooling device for a high-temperature gas-cooled reactor. Background Technology

[0002] In high-temperature gas-cooled reactor nuclear power plants, the cooling of the main equipment supports is crucial, as it directly affects the stable operation and safety performance of the main equipment in the nuclear island. Currently, the cooling of the main equipment supports relies on two independent systems: the pressure vessel support cooling system (with dedicated safety facilities, including air-cooled towers, expansion tanks, and three parallel sequences to cool the load-bearing supports) and the shielded cooling water system (a non-safety-related system, including heat transfer pipes, to cool the lateral supports and steam generator supports, and which shares multiple pieces of equipment with other systems).

[0003] Existing cooling systems suffer from complex structures and high equipment redundancy. Furthermore, the dedicated safety facilities and shared design with multiple systems significantly increase procurement, installation, and maintenance costs. Operational reliability is also susceptible to changes in operating conditions, making it difficult to meet the economical and efficient operation requirements of nuclear power plants. Summary of the Invention

[0004] This invention aims to at least partially solve one of the technical problems in related technologies. To this end, embodiments of this invention propose a cooling device for a high-temperature gas-cooled reactor (HTGR). This device employs a simple structure to cool the main equipment support of the HTGR, reducing costs and improving the reliability of equipment operation.

[0005] The cooling device for a high-temperature gas-cooled reactor according to an embodiment of the present invention includes:

[0006] A substrate is disposed between the support and the concrete wall of the high-temperature gas-cooled reactor, and the substrate is used to absorb the heat of the support. Multiple heat exchange tubes are spaced apart on the substrate. Each heat exchange tube contains cooling water. One end of each heat exchange tube penetrates the wall and extends to the outside to conduct the heat of the support to the outside. The other end of the heat exchange tube is an open end, which is connected to the substrate so that the cooling water is in direct contact with the substrate. Multiple heat dissipation rings are sleeved on the heat exchange tube along the axial direction of the heat exchange tube. The heat dissipation rings located in the wall are used to absorb heat from the wall, and the heat dissipation rings located on the outside are used to dissipate heat.

[0007] The cooling device for the high-temperature gas-cooled reactor in this invention employs a heat exchange tube design where one end is open and in direct contact with the substrate, while the other end extends through the wall to the outside. This design enables direct heat exchange between the cooling water and the substrate, improving heat transfer efficiency. Furthermore, it eliminates the need to share equipment with other systems, reducing the impact of operating conditions on operational reliability. The heat exchange tubes eliminate the need for specialized equipment such as air-cooled towers, expansion tanks, and heat transfer pipes found in traditional systems, significantly reducing the procurement, installation, and maintenance costs of the cooling device, thus meeting the economical and efficient operation requirements of nuclear power plants. The heat dissipation rings absorb heat from the walls and provide auxiliary heat dissipation from the outside, further enhancing the overall cooling effect, ensuring the cooling reliability of the main equipment support structure in the nuclear island, and maintaining the stable operation and safety performance of the main equipment.

[0008] In some embodiments, the substrate is disposed on the embedded plate of the bracket, and the vertical cross-sectional area of ​​the substrate is larger than the vertical cross-sectional area of ​​the embedded plate, so that the substrate can fully absorb the heat of the bracket.

[0009] In some embodiments, the heat exchange tubes extend from one end to the other and are arranged at a downward angle.

[0010] In some embodiments, the cooling water absorbs heat in the heat-absorbing section of the heat exchange tube and then vaporizes to form steam. The steam flows along the upward-sloping heat exchange tube to the heat-releasing section, dissipates heat through the heat dissipation ring, and then condenses. The condensed cooling water flows back to the heat-absorbing section along the inner wall of the heat exchange tube under the action of gravity, forming a circulating heat exchange.

[0011] In some embodiments, a guide plate is provided in the middle section of the heat exchange tube, and the guide plate is arranged along the axial direction of the heat exchange tube to guide the steam and the cooling water to flow axially along the heat exchange tube.

[0012] In some embodiments, the vertical cross-section of the guide plate is cross-shaped, and the guide plate is connected to the inner wall of the heat exchange tube.

[0013] In some embodiments, the vertical cross-section of the guide plate is straight, the guide plate is connected to the inner wall of the heat exchange tube, and the guide plate divides the interior of the heat exchange tube into upper and lower spaces, the upper space is used for steam flow, and the lower space is used for condensate flow.

[0014] In some embodiments, a liquid filling port is provided at the end of the heat exchange tube away from the substrate, and the liquid filling port is used to replenish cooling water into the heat exchange tube.

[0015] In some embodiments, the substrate is made of a material with high thermal conductivity.

[0016] In some embodiments, a temperature sensor is provided on the substrate for monitoring the temperature of the substrate. Attached Figure Description

[0017] Figure 1 This is an overall schematic diagram of the present invention. Figure 1 .

[0018] Figure 2 This is an overall schematic diagram of the present invention. Figure 2 .

[0019] Figure 3 This is a schematic diagram of the heat dissipation ring in this invention.

[0020] Figure 4 This is a schematic diagram of the cross-shaped guide plate in this invention.

[0021] Figure 5 This is a schematic diagram of the structure of the straight guide plate in this invention.

[0022] Figure label: 1. Substrate; 2. Bracket; 21. Embedded plate; 22. Mounting plate; 3. Walls; 4. Heat exchanger tubes; 5. Heat dissipation ring; 6. Deflector plate; 7. Liquid filling port. Detailed Implementation

[0023] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0024] like Figures 1-5 As shown, the cooling device of the high-temperature gas-cooled reactor in this embodiment of the invention includes a substrate 1, multiple heat exchange tubes 4 and multiple heat dissipation rings 5.

[0025] The substrate 1 is placed between the support 2 and the concrete wall 3 of the high-temperature gas-cooled reactor, and the substrate 1 is used to absorb the heat of the support 2. Multiple heat exchange tubes 4 are spaced apart on the substrate 1. Cooling water is contained in the heat exchange tubes 4. One end of the heat exchange tube 4 passes through the wall 3 and extends to the outside to conduct the heat of the support 2 to the outside. The other end of the heat exchange tube 4 is an open end, which is connected to the substrate 1 so that the cooling water can directly contact the substrate 1. Multiple heat dissipation rings 5 ​​are sleeved on the heat exchange tube 4 along the axial direction of the heat exchange tube 4. The heat dissipation rings 5 ​​located in the wall 3 are used to absorb the heat of the wall 3, and the heat dissipation rings 5 ​​located on the outside are used to dissipate heat.

[0026] The cooling device for the high-temperature gas-cooled reactor in this invention employs a heat exchange tube design where one end is open and in direct contact with the substrate, while the other end extends through the wall to the outside. This design enables direct heat exchange between the cooling water and the substrate, improving heat transfer efficiency. Furthermore, it eliminates the need to share equipment with other systems, reducing the impact of operating conditions on operational reliability. The heat exchange tubes eliminate the need for specialized equipment such as air-cooled towers, expansion tanks, and heat transfer pipes found in traditional systems, significantly reducing the procurement, installation, and maintenance costs of the cooling device, thus meeting the economical and efficient operation requirements of nuclear power plants. The heat dissipation rings absorb heat from the walls and provide auxiliary heat dissipation from the outside, further enhancing the overall cooling effect, ensuring the cooling reliability of the main equipment support structure in the nuclear island, and maintaining the stable operation and safety performance of the main equipment.

[0027] Specifically, the substrate 1 is positioned between the support 2 and the concrete wall 3 of the high-temperature gas-cooled reactor, directly absorbing the heat transferred from the support 2; multiple heat exchange tubes 4 are spaced apart on the substrate 1, and the cooling water contained inside them directly contacts the substrate 1 through the open end, absorbing the heat on the substrate 1; one end of the heat exchange tube 4 extends through the wall 3 to the outside, further dissipating the heat absorbed by the cooling water to the outside; multiple heat dissipation rings 5 ​​are sleeved along the axial direction of the heat exchange tubes 4, wherein the heat dissipation ring 5 located inside the wall 3 absorbs the heat from the wall 3, and the heat dissipation ring 5 located on the outside increases the contact area between the heat exchange tube 4 and the outside, accelerating the dissipation of heat to the outside, thus completing the comprehensive cooling process of the support and the wall.

[0028] In some embodiments, the substrate 1 is disposed on the embedded plate 21 of the support 2, and the vertical cross-sectional area of ​​the substrate 1 is larger than the vertical cross-sectional area of ​​the embedded plate 21, so that the substrate 1 can fully absorb the heat of the support 2.

[0029] The cooling device for a high-temperature gas-cooled reactor in this invention utilizes a design where the substrate is mounted on an embedded plate. This design allows for convenient fixation of the substrate using the existing embedded plate of the support structure, eliminating the need for additional dedicated fixing structures and simplifying the installation process and overall structural design of the cooling device. By employing a substrate with a vertical cross-sectional area larger than the embedded plate, the effective heat absorption area of ​​the substrate is increased, allowing it to more fully capture the heat transferred from the support structure, improving heat absorption efficiency and enhancing the core cooling effect. The optimized cross-sectional area design of the substrate improves heat absorption capacity without adding complex heat exchange equipment, avoiding insufficient cooling caused by localized heat accumulation on the support structure, and further ensuring the operational stability of the main equipment support structure in the nuclear island. The substrate's attachment to the support structure via the embedded plate makes the heat transfer path more direct, reducing heat loss during transfer and lowering the maintenance difficulty of the connection between the device and the support structure, meeting the needs of economical and efficient operation in nuclear power plants.

[0030] Specifically, the substrate 1 is set on the embedded plate 21 of the high-temperature gas-cooled reactor support 2, and the embedded plate 21 is used to achieve a stable fit with the support 2, so that the heat of the support 2 can be transferred to the substrate 1 through the embedded plate 21; at the same time, the vertical cross-sectional area of ​​the substrate 1 is larger than the vertical cross-sectional area of ​​the embedded plate 21, which increases the contact range between the substrate 1 and the heat transfer area of ​​the support 2, so that the substrate 1 can more fully absorb the heat transferred by the support 2 through the embedded plate 21.

[0031] Furthermore, the bracket 2 also includes a mounting plate 22, which is mounted on the embedded plate 21.

[0032] In some embodiments, the heat exchange tube 4 extends in a direction from one end to the other and is arranged at a downward inclination.

[0033] The cooling device for the high-temperature gas-cooled reactor in this embodiment of the invention utilizes a downwardly inclined arrangement of heat exchange tubes to achieve natural circulation of cooling water by gravity. This eliminates the need for additional power drive equipment, simplifying the overall structure of the cooling device and reducing equipment matching and procurement costs. The downwardly inclined design of the heat exchange tubes accelerates the flow rate of cooling water within the tubes, improving the water renewal efficiency and enabling the cooling water to more efficiently absorb heat transferred from the substrate, thus enhancing the overall heat exchange and cooling effect.

[0034] Specifically, the heat exchange tube 4 extends from one end (the end that extends through the wall 3 to the outside) to the other end (the open end that connects to the substrate 1), and is arranged in a downward tilt. The cooling water contained inside the heat exchange tube 4 can flow naturally from the higher position of the tube to the lower position due to gravity, and continuously contact the substrate 1 directly through the open end to fully absorb the heat on the substrate 1.

[0035] In some embodiments, cooling water absorbs heat in the heat-absorbing section of the heat exchange tube 4 and then vaporizes to form steam. The steam flows along the upward-sloping heat exchange tube 4 to the heat-releasing section, dissipates heat through the heat dissipation ring 5, and then condenses. The condensed cooling water flows back to the heat-absorbing section along the inner wall of the heat exchange tube 4 under the action of gravity, forming a circulating heat exchange.

[0036] The cooling device for the high-temperature gas-cooled reactor in this embodiment of the invention utilizes a phase change cycle of cooling water and vapor-liquid to achieve heat exchange through heat exchange tubes. The heat transfer efficiency of the phase change process is far higher than that of simple liquid convection heat exchange, significantly improving the overall cooling heat exchange efficiency. By combining the oblique arrangement of the heat exchange tubes with the phase change cycle, gravity is used to complete the cooling water return and steam flow, eliminating the need for additional power-driven equipment such as pumps, simplifying the device structure, and reducing equipment procurement and supporting costs. The heat dissipation ring efficiently dissipates heat from the steam in the heat-releasing section of the heat exchange tubes, accelerating the steam condensation process, ensuring the continuous and stable operation of the vapor-liquid cycle, avoiding the risk of heat exchange interruption, and improving the operational reliability of the cooling device.

[0037] Specifically, the cooling water inside the heat exchange tube 4 absorbs heat in the heat absorption section of the tube body and undergoes a vaporization reaction to form steam. The steam flows along the heat exchange tube 4 to its heat release section due to the upward sloping arrangement of the heat exchange tube 4. The steam flowing to the heat release section exchanges heat with the heat dissipation ring 5 sleeved on the heat exchange tube 4. After being dissipated by the heat dissipation ring 5, the steam condenses and is converted back into liquid cooling water. The condensed cooling water flows back to the heat absorption section naturally along the inner wall of the heat exchange tube 4 under the action of gravity, thus completing a continuous vapor-liquid two-phase circulation heat exchange process.

[0038] In some embodiments, a guide plate 6 is provided in the middle section of the heat exchange tube 4. The guide plate 6 is arranged along the axial direction of the heat exchange tube 4 to guide steam and cooling water to flow axially along the heat exchange tube 4.

[0039] The cooling device for a high-temperature gas-cooled reactor in this embodiment of the invention utilizes a guide vane design along the axial direction of the heat exchange tubes to guide the steam and cooling water axially, preventing turbulent flow and backflow of the steam and liquid phases within the tubes, reducing flow resistance, and ensuring smooth steam-liquid circulation heat exchange. The guide vane accelerates the flow rate of steam towards the exothermic section and the return flow rate of cooling water towards the absorbent section, improving the overall efficiency of the steam-liquid circulation and further enhancing the heat exchange effect of the cooling device. The guide vane also avoids problems such as insufficient condensation and obstructed return flow caused by localized mixing of steam and cooling water within the tubes, reducing the risk of heat exchange interruption and improving the operational reliability of the cooling device.

[0040] Specifically, during the vapor-liquid circulation heat exchange process, the guide plate 6 can axially guide the steam and condensed cooling water in the heat exchange tube 4, guiding the steam to flow axially towards the heat release section along the heat exchange tube 4, while guiding the condensed cooling water to flow axially back towards the heat absorption section along the heat exchange tube 4. This avoids turbulence, backflow, or mixing of steam and cooling water in the tube, ensuring that the vapor and liquid phases flow orderly along the heat exchange tube 4 and maintaining smooth circulation heat exchange.

[0041] In some embodiments, the vertical cross section of the guide plate 6 is cross-shaped, and the guide plate 6 is connected to the inner wall of the heat exchange tube 4.

[0042] The cooling device for the high-temperature gas-cooled reactor in this embodiment of the invention utilizes a cross-shaped vertical cross-section design for the guide plate, dividing the internal space of the heat exchange tube into multiple axial flow channels. This further refines the flow path of the vapor-liquid two phases, improves the accuracy of guidance, and effectively avoids vapor-liquid turbulence and backflow. The direct connection between the guide plate and the inner wall of the heat exchange tube enhances the stability of the guide plate within the tube, preventing displacement or damage due to fluid impact and ensuring the continuous and effective functioning of the guiding flow.

[0043] Specifically, the cross-shaped guide plate 6 divides the internal space of the heat exchange tube 4 into multiple axial flow channels, which can more accurately guide the steam to flow axially along the flow channels to the heat release section of the heat exchange tube 4, while guiding the condensed cooling water to flow axially back along the flow channels to the heat absorption section of the heat exchange tube 4. The connection method between the guide plate 6 and the inner wall of the heat exchange tube 4 makes it more stable inside the tube, which can resist the impact of the vapor-liquid flow inside the tube, continuously and stably play the axial guiding role, avoid the turbulence and backflow of the vapor and liquid phases inside the tube, and ensure the orderly operation of the circulating heat exchange.

[0044] In some embodiments, the vertical cross-section of the guide plate 6 is straight, the guide plate 6 is connected to the inner wall of the heat exchange tube 4, and the guide plate 6 divides the interior of the heat exchange tube 4 into upper and lower spaces. The upper space is used for steam flow, and the lower space is used for condensate flow.

[0045] The cooling device of the high-temperature gas-cooled reactor in this embodiment of the invention employs a straight-section design with a guide vane to divide the heat exchange tubes into two independent upper and lower channels. This achieves physical separation of steam and cooling water, structurally avoiding the mixing and turbulence of the vapor and liquid phases, and significantly improving the targeting and effectiveness of the flow guidance. The flow-dividing design of the guide vane allows steam to flow smoothly along the upper space to the heat release section, and cooling water to flow smoothly back to the heat absorption section along the lower space. This reduces flow interference and resistance between the vapor and liquid, accelerates the vapor-liquid circulation rate, and further enhances heat exchange efficiency.

[0046] Specifically, the straight-line guide plate 6 divides the internal space of the heat exchange tube 4 into two independent axial flow channels, one above the other. The upper space is specifically used to guide steam to flow axially towards the heat release section of the heat exchange tube 4, while the lower space is specifically used to guide the condensed cooling water to flow axially towards the heat absorption section of the heat exchange tube 4. The connection method between the guide plate 6 and the inner wall of the heat exchange tube 4 makes it more stable inside the tube, resisting the impact of the vapor-liquid flow inside the tube, and continuously and stably realizing the separation and guidance of the vapor and liquid phases, avoiding the mixing and turbulence of steam and cooling water inside the tube, and ensuring the orderly operation of the circulating heat exchange.

[0047] In some embodiments, a liquid filling port 7 is provided at the end of the heat exchange tube 4 away from the substrate 1, and the liquid filling port 7 is used to replenish cooling water into the heat exchange tube 4.

[0048] The cooling device for the high-temperature gas-cooled reactor in this embodiment of the invention, through the provision of a liquid filling interface, allows for convenient replenishment of cooling water into the heat exchange tubes, promptly compensating for cooling water losses and preventing heat exchange interruptions due to insufficient water volume, thus ensuring the continuity and stability of the cooling device's operation. The liquid filling interface enables on-demand replenishment of cooling water without disassembling the heat exchange tubes or other components, simplifying the cooling water replenishment process and reducing the difficulty and labor costs of subsequent maintenance. The placement of the liquid filling interface at the end of the heat exchange tube furthest from the substrate avoids the heat-concentrated absorption section and the substrate connection area, minimizing interference from the liquid filling operation on the heat exchange process. Furthermore, it facilitates external liquid filling operations, improving operational safety and convenience.

[0049] Specifically, during the long-term operation of the cooling device, if the cooling water in the heat exchange tube 4 is lost due to vaporization, evaporation, etc., cooling water can be replenished into the heat exchange tube 4 through the liquid filling port 7 to ensure that the heat exchange tube 4 always maintains a sufficient amount of cooling water, so that the cooling water can continuously contact the substrate 1 to absorb heat and successfully complete the vapor-liquid phase change cycle heat exchange process, thus ensuring the continuous and stable operation of the cooling device.

[0050] In some embodiments, substrate 1 is made of a material with high thermal conductivity.

[0051] The cooling device for the high-temperature gas-cooled reactor in this embodiment of the invention utilizes a substrate made of a highly thermally conductive material, which significantly improves the rate at which the substrate absorbs and conducts heat. This allows for rapid transfer of heat from the support structure to the cooling water, enhancing the core heat absorption capacity of the cooling device. The high thermal conductivity of the substrate reduces the residence time of heat within the substrate, preventing heat accumulation at the contact points between the substrate and the support structure, and further ensuring the cooling effect and operational stability of the support structure.

[0052] Specifically, the highly thermally conductive substrate 1 can quickly receive the heat transferred by the support 2 and efficiently conduct the heat to the cooling water in the heat exchange tube 4 that is in direct contact with it, thereby accelerating the heat transfer rate from the support 2 to the cooling water. This lays an efficient heat transfer foundation for the subsequent heat export and dissipation of the heat exchange tube 4 and the heat dissipation ring 5, ensuring the overall heat exchange efficiency of the cooling device.

[0053] In some embodiments, a temperature sensor is provided on the substrate 1 for monitoring the temperature of the substrate 1.

[0054] The cooling device of the high-temperature gas-cooled reactor in this embodiment of the invention monitors the substrate temperature in real time through a temperature sensor, which can intuitively reflect the heat transfer status of the support and the heat absorption effect of the cooling device, realize real-time monitoring of the cooling conditions, and grasp the operating status of the device.

[0055] Specifically, a temperature sensor is installed on the substrate 1. The temperature sensor is in direct contact with the substrate 1 and can monitor the temperature change of the substrate 1 in real time. Since the substrate 1 directly absorbs the heat transferred by the support 2, its temperature change can directly reflect the heat accumulation of the support 2 and the heat absorption and cooling effect of the cooling device on the support 2. Therefore, by monitoring the temperature of the substrate 1, the temperature sensor can provide real-time feedback on the operating status of the cooling device and provide accurate temperature data for the regulation and maintenance of the cooling system.

[0056] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0057] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0058] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0059] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0060] In this invention, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0061] Although the above embodiments have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Any changes, modifications, substitutions and variations made to the above embodiments by those skilled in the art are within the protection scope of the present invention.

Claims

1. A cooling device for a high-temperature gas-cooled reactor, characterized in that, include: A substrate (1) is disposed between a support (2) and a concrete wall (3) of a high-temperature gas-cooled reactor. The substrate (1) is used to absorb the heat of the support (2). Multiple heat exchange tubes (4) are spaced apart on the substrate (1). Cooling water is contained in each heat exchange tube (4). One end of each heat exchange tube (4) passes through the wall (3) and extends to the outside to conduct the heat of the support (2) to the outside. The other end of each heat exchange tube (4) is an open end, which is connected to the substrate (1) so that the cooling water is in direct contact with the substrate (1). Multiple heat dissipation rings (5) are sleeved on the heat exchange tube (4) along the axial direction of the heat exchange tube (4). The heat dissipation rings (5) located in the wall (3) are used to absorb the heat of the wall (3), and the heat dissipation rings (5) located outside are used to dissipate heat.

2. The cooling device for a high-temperature gas-cooled reactor according to claim 1, characterized in that, The substrate (1) is disposed on the embedded plate (21) of the bracket (2), and the vertical cross-sectional area of ​​the substrate (1) is larger than the vertical cross-sectional area of ​​the embedded plate (21) so that the substrate (1) can fully absorb the heat of the bracket (2).

3. The cooling device for a high-temperature gas-cooled reactor according to claim 1, characterized in that, The heat exchange tube (4) extends from one end to the other and is arranged at a downward angle.

4. The cooling device for a high-temperature gas-cooled reactor according to claim 3, characterized in that, The cooling water absorbs heat in the heat absorption section of the heat exchange tube (4) and then vaporizes to form steam. The steam flows along the upward-sloping heat exchange tube (4) to the heat release section, dissipates heat through the heat dissipation ring (5), and then condenses. The condensed cooling water flows back to the heat absorption section along the inner wall of the heat exchange tube (4) under the action of gravity, forming a circulating heat exchange.

5. The cooling device for a high-temperature gas-cooled reactor according to claim 4, characterized in that, A guide plate (6) is provided in the middle section of the heat exchange tube (4). The guide plate (6) is arranged along the axial direction of the heat exchange tube (4) to guide the steam and the cooling water to flow axially along the heat exchange tube (4).

6. The cooling device for a high-temperature gas-cooled reactor according to claim 5, characterized in that, The vertical cross section of the guide plate (6) is cross-shaped, and the guide plate (6) is connected to the inner wall of the heat exchange tube (4).

7. The cooling device for a high-temperature gas-cooled reactor according to claim 5, characterized in that, The vertical cross section of the guide plate (6) is in the shape of a straight line. The guide plate (6) is connected to the inner wall of the heat exchange tube (4). The guide plate (6) divides the interior of the heat exchange tube (4) into two spaces, the upper space for steam flow and the lower space for condensate flow.

8. The cooling device for a high-temperature gas-cooled reactor according to claim 1, characterized in that, The heat exchange tube (4) is provided with a liquid filling port (7) at one end away from the substrate (1), and the liquid filling port (7) is used to replenish cooling water into the heat exchange tube (4).

9. The cooling device for a high-temperature gas-cooled reactor according to claim 1, characterized in that, The substrate (1) is made of a material with high thermal conductivity.

10. The cooling device for a high-temperature gas-cooled reactor according to claim 1, characterized in that, A temperature sensor is provided on the substrate (1) for monitoring the temperature of the substrate (1).

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