A near-infrared heating light source apparatus

Abstract

The application relates to the technical field of infrared devices, and discloses a near-infrared heating light source device which comprises a substrate and a plurality of infrared light modules arranged in an array on the substrate; wherein the infrared light modules comprise a plurality of modules for outputting infrared light of different wavelengths; and the wavelength range of the infrared light output by the infrared light modules is 808nm-2200nm. The near-infrared heating light source device has the characteristics that near-infrared light has high heat energy and good penetration ability in air, can realize fast heating of small targets in various special scenes such as long-distance or narrow space, and guarantees good heating effect.

Description

Technical Field

[0001] This invention relates to the field of infrared device technology, and in particular to a near-infrared heating light source device. Background Technology

[0002] In daily life, heating methods such as open flames, electric heating, and central heating are commonly used. These methods rely on heat conduction between a nearby heat source and the air to raise the temperature, and are often used to heat a specific local space. However, these methods are relatively slow and unsuitable for certain situations. For example, heating and de-icing high-voltage cables covered in ice and snow in winter is obviously not feasible using open flames, and for cables suspended high in the air, remote, non-contact heating is preferable. Similarly, heating and de-icing underground ice layers during coal mining is not suitable due to the confined space and potential presence of flammable gases in mines. Furthermore, defrosting and de-icing hidden door handles in cars, heating fingerprint locks to prevent them from malfunctioning in low temperatures, and de-icing and defogging car windshields are all difficult tasks that traditional heating methods cannot accomplish.

[0003] Therefore, it is evident that the ability to rapidly and efficiently heat small, localized targets in special scenarios such as long distances or confined spaces has significant practical value. Summary of the Invention

[0004] The purpose of this invention is to provide a near-infrared heating light source device that can achieve rapid and efficient heating of local targets, distant targets, etc.

[0005] To solve the above-mentioned technical problems, the present invention provides a near-infrared heating light source device, including a substrate and a plurality of infrared light modules arranged in an array on the substrate;

[0006] The infrared light module includes multiple modules for outputting infrared light of different wavelengths; and the wavelength range of the infrared light output by the infrared light module is 808nm-2200nm.

[0007] In one optional embodiment of this application, a power supply circuit connecting the infrared light module and the power supply is provided on the substrate;

[0008] The power supply circuit synchronously connects and disconnects the power supply for the infrared light module that outputs infrared light of the same wavelength, and independently connects and disconnects the power supply for the infrared light module that outputs infrared light of different wavelengths.

[0009] In one optional embodiment of this application, the infrared light modules arranged in the same column along the first direction on the substrate are used to output infrared light of the same wavelength; the infrared light modules arranged in the same column along the second direction are used to output infrared light of different wavelengths; and along the second direction, the wavelength of the infrared light output by each column of infrared light modules first increases and then decreases; wherein, the first direction and the second direction are perpendicular to each other.

[0010] In an optional embodiment of this application, each infrared light module includes an alumina ceramic substrate; an infrared chip disposed on the alumina ceramic substrate; a collimating lens disposed in the output light path of the infrared chip; and an annular support structure with one end connected to the alumina ceramic substrate and the other end supporting the collimating lens.

[0011] In one optional embodiment of this application, a resonant cavity is provided in the output optical path of each of the infrared light modules;

[0012] The resonant cavity includes an annular shell connected to the edge of the substrate, and a semi-transparent, semi-reflective plate connected to the side of the annular shell opposite to the substrate.

[0013] The semi-transparent and semi-reflective plate, the annular shell, and the substrate together form a closed resonant cavity, so that the infrared light output by each infrared light module is superimposed and oscillated between the substrate and the semi-transparent and semi-reflective plate and output through the semi-transparent and semi-reflective plate.

[0014] In an optional embodiment of this application, the surface of the semi-transparent and semi-reflective plate near each of the infrared light modules includes a plurality of strip-shaped reflective areas corresponding to each column of the infrared light modules; each of the strip-shaped reflective areas is provided with a semi-transparent and semi-reflective film layer.

[0015] The strip-shaped reflective areas are not perfectly aligned on the same plane due to their varying heights, so that the distance between each strip-shaped reflective area and the corresponding column of infrared light modules is an integer multiple of half the wavelength of the infrared light output by the infrared light module.

[0016] In one optional embodiment of this application, a reflective film layer of the same height as the light-emitting surface of the infrared light module is filled in the gap between each of the infrared light modules on the substrate.

[0017] In an optional embodiment of this application, a shaping lens group is further provided in the output optical path of the infrared light module; wherein the spacing between at least two lens elements in the shaping lens group is adjustable to adjust the size of the infrared light spot output by the shaping lens group.

[0018] In one optional embodiment of this application, a plurality of visible light chip modules are disposed on the substrate surrounding the area where each of the infrared light modules is located, so as to delineate and mark the irradiation area of ​​the infrared light spot output by each of the infrared light modules.

[0019] In one optional embodiment of this application, the substrate is a thermoelectrically separated copper substrate; a semiconductor cooling chip and a heat sink are sequentially attached to the side of the substrate opposite to the infrared light module.

[0020] The present invention provides a near-infrared heating light source device, comprising a substrate and a plurality of infrared light modules arranged in an array on the substrate; wherein the infrared light modules include a variety of modules for outputting infrared light of different wavelengths; and the wavelength range of the infrared light output by the infrared light modules is 808nm-2200nm.

[0021] The near-infrared heating light source device of this application utilizes the high thermal energy characteristic of infrared light. Multiple infrared light modules are integrated onto the same substrate to form a heating light source device capable of outputting infrared light. This enables precise heating of long-distance targets such as high-voltage cables, and also allows for heating of underground ice layers in confined spaces during coal mine development. It provides significant convenience for rapid heating of small targets in various special scenarios, including long-distance or confined spaces. Furthermore, each infrared light module employs multiple different infrared light modules within the 808nm-2200nm wavelength range. Compared to other infrared light bands, near-infrared light in the 808nm-2200nm band has better penetration ability in air, significantly reducing energy loss during infrared light transmission. Moreover, substances such as ice, snow, metals, and most organic materials have a higher absorption rate of infrared light in this band, which is beneficial for achieving rapid and effective heating of the target. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the optical path structure of the near-infrared heating light source device provided in the embodiments of this application;

[0024] Figure 2 A top view of the distribution of infrared light modules on the substrate in the near-infrared heating light source device provided in the embodiments of this application;

[0025] Figure 3This is a cross-sectional structural diagram of the infrared light module provided in the embodiments of this application;

[0026] Figure 4 This is a schematic diagram of the structure of the semi-transparent and semi-reflective plate provided in the embodiments of this application;

[0027] In the attached diagram: 1 is the substrate, 10 is the reflective film layer, 101 is the semiconductor cooling chip, 102 is the heat sink, 2 is the infrared light module, 21 is the alumina ceramic substrate, 22 is the infrared chip, 23 is the ring support structure, 24 is the collimating lens group, 31 is the ring shell, 32 is the semi-transparent and semi-reflective plate, 320 is the strip-shaped reflection area, 4 is the shaping lens group, 40 is the lens element, 401 is the slider, 402 is the slide rail, 41 is the plane mirror, 5 is the visible light chip module, and 6 is the equipment housing. Detailed Implementation

[0028] The core of this invention is to provide a near-infrared heating light source device that can rapidly heat up small targets in special scenarios such as long distances and confined spaces, providing great convenience for heating in various special scenarios.

[0029] To enable those skilled in the art to better understand the present invention, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are merely some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] like Figures 1 to 4 As shown, Figure 1 This is a schematic diagram of the optical path structure of the near-infrared heating light source device provided in the embodiments of this application; Figure 2 A top view of the distribution of infrared light modules on the substrate in the near-infrared heating light source device provided in the embodiments of this application; Figure 3 This is a cross-sectional structural diagram of the infrared light module provided in the embodiments of this application; Figure 4 This is a schematic diagram of the structure of a semi-transparent and semi-reflective plate provided in an embodiment of this application.

[0031] In one specific embodiment of this application, the near-infrared heating light source device may include:

[0032] Substrate 1, and several infrared light modules 2 arranged in an array on substrate 1;

[0033] The infrared light module 2 includes multiple modules for outputting infrared light of different wavelengths; and the wavelength range of the infrared light output by the infrared light module 2 is 808nm-2200nm.

[0034] In this embodiment, several infrared light modules 2 are integrated and arranged in an array on the same substrate 1. Each infrared light module 2 outputs an infrared beam to irradiate the target object to be heated, thereby achieving targeted heating of various objects such as high-voltage cables, concealed vehicle handlebars, windshields, and underground ice layers in coal mines. Compared to traditional heating methods, infrared beams can more effectively heat specific targets or localized areas of targets, avoiding unnecessary heat loss, ensuring heating speed, and achieving heating in various confined environments. They can also heat targets at relatively distant locations, providing convenience and safety for heating special targets in various special scenarios.

[0035] like Figure 1 As shown, several infrared light modules 2 are arranged on the substrate 1. The number of infrared light modules 2 can be set according to actual needs. Assuming the infrared light modules 2 are arranged in a two-dimensional row and column configuration on the substrate 1, the number in each row and column can be as few as tens or even hundreds. The key is to ensure that the diameter of the infrared beam output by each infrared light module 2 meets the application requirements for beam size in the actual application scenario. For example, if the near-infrared heating light source device is used to de-ice high-voltage cables, the area where each infrared light module 2 is located can be arranged in a rectangular area. The number of infrared light modules 2 in the same column can be as high as tens or even hundreds, while the number of infrared light modules 2 in the same row is only 10, ultimately outputting a rectangular infrared light spot approximately 1m long and 10cm wide. Alternatively, each row and column can contain 20 infrared light modules 2, ultimately outputting a square infrared light spot with a side length of 20cm. In short, the number and layout of the infrared light modules 2 can be set based on actual application requirements.

[0036] In addition, the infrared light output by each infrared light module 2 is near-infrared light with a center wavelength in the range of 808nm-2200nm; taking advantage of the good penetrating ability of near-infrared light in this wavelength range in the air, the energy loss of near-infrared light in the air is minimized as much as possible.

[0037] In addition, in this embodiment, the plurality of infrared light modules 2 integrated on the substrate 1 may include a variety of different types of infrared light modules 2 that can output near-infrared light of different wavelengths.

[0038] It should be noted that different materials have different absorption capabilities for infrared light in different wavelengths. For example, ice and snow have a stronger absorption capability for near-infrared light in the 1400nm~2200nm wavelength range; while for metal materials, they have a stronger absorption capability for near-infrared light in the 800nm~1200nm wavelength range. For example, iron has the strongest absorption capability for near-infrared light at 850nm, aluminum has the strongest absorption capability for near-infrared light at 800nm, and copper has the strongest absorption capability for near-infrared light at 950nm; tempered glass has a stronger absorption capability for near-infrared light in the 2000nm~2200nm wavelength range; and organic materials have the strongest absorption capability for near-infrared light in the 1000nm~2000nm wavelength range.

[0039] Based on this, an infrared light module 2 capable of outputting near-infrared light of different wavelengths is integrated on the substrate 1. In practical applications, different infrared light modules 2 can be selected to start working based on the different materials of the heating target.

[0040] In some alternative embodiments, the near-infrared heating light source device may further include:

[0041] The substrate 1 is provided with a power supply circuit that connects the infrared light module 2 and the power supply.

[0042] The power supply circuit synchronously connects and disconnects the power supply to the infrared light module 2 that outputs infrared light of the same wavelength, and independently connects and disconnects the power supply to the infrared light module 2 that outputs infrared light of different wavelengths.

[0043] In this embodiment, infrared light modules 2, each emitting near-infrared light in different wavelength ranges, are arranged on the substrate 1. Infrared light modules 2 emitting near-infrared light in the same wavelength range are electrically connected to the power supply through the same conductive line, while infrared light modules 2 emitting near-infrared light in different wavelength ranges are electrically connected to the power supply through different conductive lines. Each conductive line is equipped with a control switch. When the control switch is closed, a group of infrared light modules 2 connected to the power supply through the conductive line can be simultaneously connected to the power supply, and the group of infrared light modules 2 can simultaneously output near-infrared light in the same wavelength range. When the control switch is open, a group of infrared light modules 2 connected to the power supply through the conductive line can be simultaneously disconnected from the power supply, and the group of infrared light modules 2 can simultaneously stop outputting near-infrared light. Furthermore, each control switch can be closed and opened independently, which means that infrared light modules 2 that output near-infrared light in the same wavelength range can start and stop working synchronously, while infrared light modules 2 that output near-infrared light in different wavelength ranges can start and stop working independently.

[0044] Based on this, the near-infrared heating light source device of this embodiment can flexibly switch the infrared light module 2 to start and stop operation according to actual needs. For example, the near-infrared heating light source device can be configured on the hidden door handle facing the car. If the hidden door handle is covered with ice and snow, the infrared light module 2, which outputs light in the 1400nm~2200nm wavelength band, can be activated to melt the ice and snow covering its surface. Then, the infrared light module 2, which outputs light in the 800nm~1200nm wavelength band, can be activated to heat the hidden door handle to a certain extent, restoring its fingerprint recognition function and avoiding the problem of the fingerprint recognition function failing to start due to the door handle being too cold.

[0045] Optionally, in this embodiment, the substrate 1 can be a thermoelectrically separated copper substrate 1, and a semiconductor cooling chip 101 and a heat sink 102 are sequentially attached to the side of the substrate 1 facing away from the infrared light module 2. By utilizing the good thermal conductivity of the substrate 1 and the good heat dissipation of the semiconductor cooling chip 101 and the heat sink 102, the problem of overheating of each infrared light module 2 can be effectively avoided.

[0046] In one optional embodiment, the near-infrared heating light source device may further include:

[0047] The infrared light modules 2 arranged in the same column along the first direction on the substrate 1 are used to output infrared light of the same wavelength; the infrared light modules 2 arranged in the same column along the second direction are used to output infrared light of different wavelengths; and along the second direction, the wavelength of the infrared light output by each column of infrared light modules 2 first increases and then decreases; wherein, the first direction and the second direction are perpendicular to each other.

[0048] like Figure 2 As shown, in this embodiment, infrared light modules 2 that can output infrared light within the same wavelength range are arranged in the same column along the first direction, while infrared light modules 2 that output infrared light within different wavelength ranges are arranged in different columns. Each column of infrared light modules 2 is arranged sequentially on the substrate 1 along the second direction. It can be understood that on the substrate 1, there may be multiple columns of infrared light modules 2 that output infrared light within the same wavelength range, and these modules can be arranged adjacently, evenly, or symmetrically on the substrate 1.

[0049] For example, there are three types of infrared light modules 2. The infrared light modules 2 in the first column are used to output infrared light in the first band range, the infrared light modules 2 in the second column are used to output infrared light in the second band range, and the infrared light modules 2 in the third column are used to output infrared light in the third band range. The infrared light modules 2 in the fourth column are also used to output infrared light in the first band range, the infrared light modules 2 in the fifth column are used to output infrared light in the second band range, and the infrared light modules 2 in the sixth column are used to output infrared light in the third band range. And so on, with the three columns of infrared light modules 2 forming a cycle, they can be arranged in a cyclical manner.

[0050] For example, the infrared light modules 2 in columns 1 to 3 and the last three columns are used to output infrared light in the first band range, while the infrared light modules 2 in columns 4 and 5 and the derivative columns 4 and 5 are used to output infrared light in the second band range. The wavelength of the infrared light in the first band range is smaller than the wavelength of the infrared light in the second band range. Similarly, the infrared light modules 2 that output infrared light in the same band are symmetrically distributed, and the wavelength of the infrared light output by each column of infrared light modules 2 in the first direction first increases and then decreases.

[0051] Of course, the arrangement of each infrared light module 2 in this application is not limited to the above-mentioned arrangement. For example, infrared light modules 2 that output infrared light of the same wavelength can be arranged in a ring; infrared light modules 2 that output infrared light of different wavelengths can be arranged in concentric rings with different inner diameters. This application does not specifically limit this arrangement.

[0052] like Figure 3 As shown, in another optional embodiment, each infrared light module 2 may include:

[0053] Alumina ceramic substrate 21; infrared chip 22 disposed on alumina ceramic substrate 21; collimating lens group 24 disposed on the output optical path of infrared chip 22; annular support structure 23 connected at one end to alumina ceramic substrate 21 and supporting collimating lens group 24 at the other end.

[0054] In this embodiment, a collimating lens group 4 is set in the output optical path of the infrared chip 22 so that the near-infrared beams output by the infrared light module 2 are close to parallel beams, which to a certain extent avoids the near-infrared light from diverging outward and ensures the accuracy of the near-infrared beam in heating the target.

[0055] Further, optionally, the near-infrared heating optical device in this embodiment may also include:

[0056] A resonant cavity is provided in the output optical path of each infrared light module 2;

[0057] The resonant cavity includes an annular shell 31 connected to the edge of the substrate 1, and a semi-transparent and semi-reflective plate 32 connected to the side of the annular shell 31 away from the substrate 1.

[0058] The semi-transparent and semi-reflective plate 32, the annular shell 31, and the substrate 1 together form a closed resonant cavity, so that the infrared light output by each infrared light module 2 is superimposed and oscillated between the substrate 1 and the semi-transparent and semi-reflective plate 32 and output through the semi-transparent and semi-reflective plate 32.

[0059] like Figure 1 As shown, in this embodiment, the two ends of the annular shell 31 are connected to the semi-transparent and semi-reflective plate 32 and the substrate 1 respectively to form a closed cavity structure of the resonant cavity. The plane where each infrared light module 2 is located on the substrate 1 can form a resonant space with the cavity space between the semi-transparent and semi-reflective plate 32. For each infrared light module 2, the infrared beam it outputs is a parallel beam perpendicular to the substrate 1. This allows the near-infrared parallel light output by the infrared light module 2 to oscillate back and forth between the substrate 1 and the semi-transparent and semi-reflective plate 32, so that the energy of the infrared light is superimposed and then transmitted and output from the semi-transparent and semi-reflective plate 32. This greatly improves the energy of the near-infrared beam output by the entire near-infrared heating light source device, thus improving the heating effect of the device on the target object.

[0060] Furthermore, for each collimating lens group 24 in the infrared light module 2, the light-emitting surface on the side opposite to the infrared chip 22 can be a plane perpendicular to the output direction of the infrared parallel light, so that the near-infrared parallel light can be repeatedly reflected and oscillated between the light-emitting surface of the collimating lens group 24 and the semi-transparent and semi-reflective plate 32.

[0061] As described above, this application includes different types of infrared light modules 2 that output near-infrared light of different wavelengths. To achieve the resonant superposition of near-infrared light, the resonant spacing between the two reflective surfaces of the resonant cavity should be an integer multiple of half the wavelength. However, for infrared light modules 2 that output near-infrared light of different wavelengths, this resonant spacing is obviously different.

[0062] Combination Figure 1 and Figure 3 To ensure that the near-infrared light output from different infrared light modules 2 can resonate and superimpose within the resonant cavity, this embodiment may further include:

[0063] The surface of the semi-transparent and semi-reflective plate 32 near each infrared light module 2 includes several strip-shaped reflective areas 320 corresponding to each column of infrared light modules 2; each strip-shaped reflective area 320 is provided with a semi-transparent and semi-reflective film layer.

[0064] The strip-shaped reflective areas 320 are not completely on the same plane due to their uneven heights, so that the distance between each strip-shaped reflective area 320 and the corresponding column of infrared light modules 2 is an integer multiple of half the wavelength of the infrared light output by the infrared light module 2.

[0065] As described above, the infrared light modules 2 in the same column along the first direction on the substrate 1 all output near-infrared light in the same wavelength range. Therefore, the near-infrared parallel light output by the infrared light modules 2 in the same column needs to oscillate in the resonant cavity, and the distance from the infrared light module 2 to the semi-transparent and semi-reflective plate 32 is the same. However, the distances from the infrared light modules 2 in different columns to the semi-transparent and semi-reflective plate 32 are not exactly the same.

[0066] Based on this, the surface of the semi-transparent and semi-reflective plate 32 near the infrared light module 2 can be set as a number of strip-shaped planar areas corresponding to each column of infrared light modules 2. The strip-shaped planar areas are arranged with concave and convex shapes. Each strip-shaped planar area is also a strip-shaped reflection area 320. The strip-shaped reflection areas 320 are not completely located on the same plane due to their uneven heights.

[0067] Therefore, the distance between each strip-shaped reflection area 320 and the corresponding column of infrared light modules 2 is equal to an integer multiple of half the wavelength of the infrared light output by that column of infrared light modules 2, ensuring that the distance between each column of infrared light modules 2 and the corresponding strip-shaped reflection area 320 can meet the resonance condition of that column of infrared light modules 2, so that the infrared light output by that group of infrared light modules 2 can repeatedly oscillate and superimpose between the infrared light modules 2 and the strip-shaped reflection area 320.

[0068] In addition, a semi-transparent and semi-reflective film layer with approximately equal transmittance and reflectance for near-infrared light should be provided on each strip-shaped reflective area 320 (i.e., approximately 50% for each). Of course, the semi-transparent and semi-reflective film layers on different strip-shaped reflective areas 320 can be the same or different, as long as the infrared light output by each infrared light module 2 can be resonant and thus achieve energy superposition.

[0069] The semi-transparent and semi-reflective plate 32 itself can be a silicon crystal plate with high transmittance to near-infrared light, or other plates with good transmittance to near-infrared light. This application does not specifically limit this.

[0070] Alternatively, a reflective film layer 10 of the same height as the light-emitting surface of the infrared light module 2 is filled in the gap between each infrared light module 2 on the substrate 1.

[0071] It is understood that each infrared light module 2 is protruding from the surface of the substrate 1. This means that the reflective surface of the resonant cavity side of the whole consisting of each infrared light module 2 and the substrate 1 is not a flat surface. Therefore, in this embodiment, a reflective film layer 10 is filled in the gap between adjacent infrared light modules 2 on the substrate 1 to form a reflective plane that is coplanar with the light-emitting surface of each infrared light module 2 (i.e., the surface of the collimating lens that outputs near-infrared light on the side away from the infrared chip 22). This ensures that the reflective plane has a good reflection effect on infrared light and improves the energy utilization rate of infrared light.

[0072] Based on the above discussion, such as Figure 1 As shown, in an optional embodiment, the near-infrared heating light source may further include:

[0073] The output optical path of the infrared light module 2 is also provided with a shaping lens group 4; wherein the spacing between at least two lens elements 40 in the shaping lens group 4 is adjustable to adjust the size of the near-infrared light spot output by the shaping lens group 4.

[0074] In this embodiment, it is considered that the requirements for the size of the infrared beam irradiation area and the energy density of the near-infrared beam irradiation surface are different depending on the application scenario in actual applications. Therefore, a shaping lens group 4 can be further set in the output optical path of the infrared light module 2, and the spacing between at least some of the lens elements 40 is adjustable. By adjusting the spacing between each lens element 40, the size of the near-infrared light spot shaped and output by the shaping lens group 4 can be magnified or reduced, thereby meeting the heating requirements in different scenarios.

[0075] like Figure 1 As shown, the shaping lens group 4 in this embodiment can be disposed in the output optical path of the resonant cavity, and the shaping lens group 4 can include a plurality of lens elements 40 with coincident optical axes. At least one lens element 40 has a slider 401 connected to its edge, and the slider 401 is disposed on a slide rail 402 parallel to the optical axis of the lens element 40. By adjusting the position of the slider 401 on the slide rail 402, the position of the lens element 40 in the optical path of infrared light output can be adjusted, thereby realizing the scaling of the infrared light spot size.

[0076] Of course, this application does not exclude the possibility of setting an optical path deflection element between the shaping lens group 4 and the resonant cavity, so as to realize the spatial position occupied by the optical path structure in the near-infrared heating light source device by deflecting the infrared light transmission path, thereby better adapting to various different installation environments.

[0077] like Figure 1 As shown, Figure 1 The housing 6 of the near-heating light source device is roughly L-shaped. Therefore, a plane mirror 41 is set between the resonant cavity and the shaping lens group 4, so that the infrared light output from the resonant cavity is deflected by 90°, which makes the entire optical path also L-shaped, adapting to the shape of the housing 6.

[0078] In another alternative embodiment, a plurality of visible light chip modules 5 are disposed on the substrate 1 around the area where each infrared light module 2 is located, so as to delineate and mark the irradiation area of ​​the infrared light spot output by each infrared light module 2.

[0079] It is understandable that near-infrared light is invisible light. In the actual process of irradiating a target, regardless of the size of the light spot, the human eye cannot perceive it directly, and therefore cannot determine whether the infrared beam is aimed at the target. Based on this, in this embodiment, multiple visible light chip modules are arranged in a ring around the outer side of the area where each infrared light module 2 is located. Thus, the area enclosed by the visible light spots output by each visible light chip module 5 is the area irradiated by the infrared light output by the infrared light module 2. This provides an intuitive auxiliary function for confirming whether the infrared beam is aimed at the target, and also avoids the problem of false illumination caused by the invisible nature of infrared light, such as targeting a person's face or body, which could lead to safety hazards. This effectively improves the safety and ease of use of the equipment.

[0080] In summary, the near-infrared heating light source device of this application utilizes the high thermal energy of infrared light by integrating multiple infrared light modules onto the same substrate, thereby forming a heating light source device capable of outputting infrared light. This enables precise heating of long-distance targets such as high-voltage cables, and also allows for heating of underground ice layers in confined spaces during coal mine development, providing significant convenience for rapid heating of small targets in various special scenarios such as long-distance or confined spaces. Furthermore, each infrared light module employs multiple different infrared light modules within the 808nm-2200nm wavelength range. Compared to infrared light in other wavelength ranges, near-infrared light in the 808nm-2200nm wavelength range has better penetration ability in air, significantly reducing energy loss during infrared light transmission. Moreover, substances such as ice, snow, metal materials, and most organic materials have a higher absorption rate of infrared light in this wavelength range, which is beneficial for achieving rapid and effective heating of the target.

[0081] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that the elements inherent in a process, method, article, or apparatus that includes a list of elements are included. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. Additionally, portions of the technical solutions provided in the embodiments of this application that are consistent with the implementation principles of corresponding technical solutions in the prior art have not been described in detail to avoid excessive elaboration.

[0082] This article uses specific examples to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of the present invention. It should be noted that those skilled in the art can make several improvements and modifications to the present invention without departing from the principles of the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. A near-infrared heating light source device, characterized in that, Includes a substrate, and several infrared light modules arranged in an array on the substrate; The infrared light module includes multiple modules for outputting infrared light of different wavelengths; and the wavelength range of the infrared light output by the infrared light module is 808nm-2200nm.

2. The near-infrared heating light source device as described in claim 1, characterized in that, The substrate is provided with a power supply circuit that connects the infrared light module and the power supply. The power supply circuit synchronously connects and disconnects the power supply for the infrared light module that outputs infrared light of the same wavelength, and independently connects and disconnects the power supply for the infrared light module that outputs infrared light of different wavelengths.

3. The near-infrared heating light source device as described in claim 1, characterized in that, The infrared light modules arranged in the same column along the first direction on the substrate are used to output infrared light of the same wavelength; the infrared light modules arranged in the same column along the second direction are used to output infrared light of different wavelengths; and along the second direction, the wavelength of the infrared light output by each column of infrared light modules first increases and then decreases; wherein, the first direction and the second direction are perpendicular to each other.

4. The near-infrared heating light source device as described in claim 3, characterized in that, Each of the infrared light modules includes an alumina ceramic substrate; an infrared chip disposed on the alumina ceramic substrate; a collimating lens group disposed in the output light path of the infrared chip; and an annular support structure with one end connected to the alumina ceramic substrate and the other end supporting the collimating lens group.

5. The near-infrared heating light source device as described in claim 4, characterized in that, A resonant cavity is provided in the output optical path of each infrared light module; The resonant cavity includes an annular shell connected to the edge of the substrate, and a semi-transparent, semi-reflective plate connected to the side of the annular shell opposite to the substrate. The semi-transparent and semi-reflective plate, the annular shell, and the substrate together form a closed resonant cavity, so that the infrared light output by each infrared light module is superimposed and oscillated between the substrate and the semi-transparent and semi-reflective plate and output through the semi-transparent and semi-reflective plate.

6. The near-infrared heating light source device as described in claim 5, characterized in that, The surface of the semi-transparent and semi-reflective plate near each of the infrared light modules includes several strip-shaped reflective areas corresponding to each of the columns of infrared light modules; each of the strip-shaped reflective areas is provided with a semi-transparent and semi-reflective film layer. The strip-shaped reflective areas are not perfectly aligned on the same plane due to their varying heights, so that the distance between each strip-shaped reflective area and the corresponding column of infrared light modules is an integer multiple of half the wavelength of the infrared light output by the infrared light module.

7. The near-infrared heating light source device as described in claim 5, characterized in that, The substrate is filled with a reflective film layer of the same height as the light-emitting surface of the infrared light module in the gaps between the infrared light modules.

8. The near-infrared heating light source device according to any one of claims 1 to 7, characterized in that, The output optical path of the infrared light module is also provided with a shaping lens group; wherein the spacing between at least two lens elements in the shaping lens group is adjustable to adjust the size of the infrared light spot output by the shaping lens group.

9. The near-infrared heating light source device according to any one of claims 1 to 7, characterized in that, Multiple visible light chip modules are disposed on the substrate around the area where each infrared light module is located, so as to delineate and mark the irradiation area of ​​the infrared light spot output by each infrared light module.

10. The near-infrared heating light source device according to any one of claims 1 to 7, characterized in that, The substrate is a thermoelectrically separated copper substrate; a semiconductor cooling chip and a heat sink are also sequentially attached to the side of the substrate away from the infrared light module.

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