Circuit board assembly, method of manufacturing the same, and electronic device

Abstract

This disclosure relates to a circuit board assembly and its manufacturing method, as well as an electronic device. The circuit board assembly includes a first circuit board and an integrated assembly. The integrated assembly includes a second circuit board, an electrical connection portion, and at least one optoelectronic device. The second surface of the second circuit board is disposed opposite to the first circuit board. The electrical connection portion is disposed on the second surface, and the second circuit board is supported on and electrically connected to the first circuit board via the electrical connection portion. At least one optoelectronic device is disposed on the first surface and is electrically connected to the second circuit board. By supporting the second circuit board on the first circuit board via the electrical connection portion and accommodating the built-in electrical device within the space between the second surfaces of the first and second circuit boards, the function of the optoelectronic device is ensured while fully utilizing the space between the optoelectronic device and the first circuit board. This reduces the production cost of the circuit board assembly, facilitates the layout design of the circuit board assembly, and improves the performance of the circuit board assembly.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor technology, specifically to a circuit board assembly and its manufacturing method, and electronic equipment. Background Technology

[0002] In recent years, with the rapid development of physiological indicator detection technology and the continuous iteration of electronic devices, such as wearable devices, electronic devices with physiological indicator detection functions have been widely used in people's daily health monitoring. By setting up photoelectric devices in electronic devices, detection signals such as the user's skin conductance signals are acquired to realize the detection of physiological indicators.

[0003] However, circuit board assemblies using related technologies suffer from significant space waste and high production costs, affecting the layout design and performance of the circuit board assemblies. Summary of the Invention

[0004] To overcome the problems existing in the related technologies, this disclosure provides a circuit board assembly and its manufacturing method, as well as an electronic device.

[0005] According to a first aspect of the present disclosure, a circuit board assembly is provided, the circuit board assembly including a first circuit board and an integrated assembly, the integrated assembly including:

[0006] The second circuit board includes a first surface and a second surface that are opposite to each other, and the second surface is disposed opposite to the first circuit board.

[0007] An electrical connection portion is disposed on the second surface, the second circuit board is supported on the first circuit board through the electrical connection portion and is electrically connected to the first circuit board, and there is an accommodating space between the second surface and the first circuit board, and at least one built-in electrical component is disposed in the accommodating space;

[0008] At least one optoelectronic device is disposed on the first surface and is electrically connected to the second circuit board.

[0009] In some embodiments of this disclosure, each of the built-in electrical components is disposed on the second surface; or...

[0010] Each of the aforementioned built-in electrical components is disposed on the first circuit board; or,

[0011] Some of the built-in electrical components are disposed on the second surface, and some of the built-in electrical components are disposed on the first circuit board.

[0012] In some embodiments of this disclosure, the integrated component further includes a first molding compound for molding the optoelectronic device, the first molding compound being transparent.

[0013] In some embodiments of this disclosure, the circuit board assembly further includes a second molding compound for molding the built-in electrical components.

[0014] In some embodiments of this disclosure, the optoelectronic device includes a photosensitive chip and at least one light-emitting diode.

[0015] In some embodiments of this disclosure, the built-in electrical device includes an integrated circuit chip and / or a passive device.

[0016] In some embodiments of this disclosure, the electrical connection portion includes solder balls or an adapter plate.

[0017] In some embodiments of this disclosure, the circuit board assembly further includes an external electrical device disposed on the first circuit board. The external electrical device and the integrated assembly are disposed on the same side of the first circuit board, and the external electrical device is located outside the accommodating space. The external electrical device includes packaged devices and / or unpackaged devices.

[0018] In some embodiments of this disclosure, the second molding compound used for molding the built-in electrical device is also used for molding the packaged device; or...

[0019] The circuit board assembly also includes a third molding compound for molding the packaged device.

[0020] In some embodiments of this disclosure, the unpackaged device includes a microphone and / or a power interface.

[0021] According to a second aspect of the present disclosure, an electronic device is provided, the electronic device including a circuit board assembly as described in the first aspect.

[0022] In some embodiments of this disclosure, the electronic device is a wearable device.

[0023] According to a third aspect of the present disclosure, a method for manufacturing a circuit board assembly is provided, the method comprising:

[0024] Provide the first circuit board;

[0025] An integrated assembly is formed, the integrated assembly including a second circuit board, at least one optoelectronic device disposed on a first surface of the second circuit board, and an electrical connection portion disposed on a second surface of the second circuit board;

[0026] The second circuit board is supported on the first circuit board and electrically connected to the first circuit board through the electrical connection part, and the optoelectronic device is located on a first surface of the second circuit board away from the first circuit board. There is an accommodating space between the second surface and the first circuit board, and at least one built-in electrical device is disposed in the accommodating space.

[0027] In some embodiments of this disclosure, forming the integrated component includes:

[0028] Provide circuit board motherboard;

[0029] A plurality of the optoelectronic devices are disposed on one side of the circuit board motherboard;

[0030] Multiple electrical connection parts are provided on the other side of the circuit board motherboard to obtain an integrated motherboard;

[0031] The integrated motherboard is cut to obtain multiple integrated components.

[0032] In some embodiments of this disclosure, a plurality of electrical connection portions are provided on the other side of the circuit board motherboard. Before obtaining the integrated motherboard, the process of forming the integrated assembly further includes:

[0033] The plurality of optoelectronic devices are encapsulated with a first molding compound, which is transparent.

[0034] In some embodiments of this disclosure, before cutting the integrated motherboard, forming the integrated assembly further includes:

[0035] Multiple built-in electrical components are formed on the other side of the circuit board motherboard.

[0036] In some embodiments of this disclosure, the forming of the integrated component further includes:

[0037] The built-in electrical components are encapsulated with a second molding compound.

[0038] In some embodiments of this disclosure, before supporting the second circuit board on the first circuit board via the electrical connection portion, the method of manufacturing the circuit board assembly further includes:

[0039] At least one of the built-in electrical components is disposed in a preset area of ​​the first circuit board, such that after the second circuit board is supported on the first circuit board, each of the built-in electrical components in the preset area is located within the accommodating space.

[0040] In some embodiments of this disclosure, the method for manufacturing the circuit board assembly further includes:

[0041] An external electrical device is formed on the first circuit board. The external electrical device and the integrated component are located on the same side of the first circuit board, and the external electrical device is located outside the accommodating space. The external electrical device includes packaged devices and / or unpackaged devices.

[0042] In some embodiments of this disclosure, the method for manufacturing the circuit board assembly further includes:

[0043] The encapsulated device and the built-in electrical components are integrally encapsulated using a second molding compound; or...

[0044] The packaged device is encapsulated with a third molding compound.

[0045] The technical solutions provided by the embodiments of this disclosure can include the following beneficial effects: the circuit board assembly formed by the first circuit board, the second circuit board, the electrical connection portion, and at least one optoelectronic device integrates the optoelectronic device with the circuit board, and the electrical connection portion enables the electrical connection between the first circuit board and the second circuit board, providing a basis for the functional realization of the optoelectronic device. The second circuit board is supported on the first circuit board by the electrical connection portion, and the built-in electrical device is disposed in the accommodating space between the second surfaces of the first and second circuit boards. This ensures the function of the optoelectronic device while fully utilizing the space between the optoelectronic device and the first circuit board, reducing the production cost of the circuit board assembly, facilitating the layout design of the circuit board assembly, and improving the performance of the circuit board assembly.

[0046] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0047] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0048] Figure 1 This is a schematic diagram of a circuit board assembly.

[0049] Figure 2 This is a schematic diagram of the structure of a circuit board assembly according to an exemplary embodiment.

[0050] Figure 3 This is a schematic diagram of the structure of a circuit board assembly according to another exemplary embodiment.

[0051] Figure 4 This is a schematic diagram of the structure of a circuit board assembly according to another exemplary embodiment.

[0052] Figure 5 This is a flowchart illustrating a method for manufacturing a circuit board assembly according to an exemplary embodiment.

[0053] Figure 6 This is a schematic diagram illustrating the provision of a first circuit board according to an exemplary embodiment.

[0054] Figure 7 This is a schematic diagram illustrating the formation of an integrated component according to an exemplary embodiment.

[0055] Figure 8 This is a schematic diagram illustrating the formation of an integrated component according to another exemplary embodiment.

[0056] Figure 9 This is a schematic diagram illustrating the formation of an integrated component according to another exemplary embodiment.

[0057] Figure 10 This is a schematic diagram illustrating, according to an exemplary embodiment, how a second circuit board is supported on a first circuit board and electrically connected to the first circuit board via an electrical connection portion.

[0058] Figure 11 This is a schematic diagram illustrating, according to another exemplary embodiment, how a second circuit board is supported on and electrically connected to a first circuit board via an electrical connection portion.

[0059] Figure 12 This is a schematic diagram illustrating, according to another exemplary embodiment, how a second circuit board is supported on and electrically connected to a first circuit board via an electrical connection portion.

[0060] Figure 13 This is a flowchart illustrating the formation of an integrated component according to an exemplary embodiment.

[0061] Figure 14 This is a schematic diagram illustrating a plurality of optoelectronic devices disposed on one side of a circuit board motherboard according to an exemplary embodiment.

[0062] Figure 15 This is a schematic diagram illustrating an integrated motherboard by providing multiple electrical connection portions on the other side of a circuit board motherboard according to an exemplary embodiment.

[0063] Figure 16 This is a schematic diagram illustrating an integrated motherboard by providing multiple electrical connection portions on the other side of a circuit board motherboard according to another exemplary embodiment.

[0064] Figure 17 This is a schematic diagram illustrating, according to an exemplary embodiment, the formation of a plurality of built-in electrical components on the other side of a circuit board motherboard.

[0065] Figure 18 This is a schematic diagram illustrating, according to another exemplary embodiment, the formation of a plurality of built-in electrical components on the other side of a circuit board motherboard.

[0066] Figure 19 This is a schematic diagram illustrating, according to an exemplary embodiment, at least one built-in electrical component disposed in a predetermined area of ​​a first circuit board.

[0067] Figure 20 This is a schematic diagram illustrating the formation of an external electrical device on a first circuit board according to an exemplary embodiment.

[0068] Figure 21 This is a schematic diagram illustrating the formation of an external electrical device on a first circuit board according to another exemplary embodiment.

[0069] Figure 22 This is a schematic diagram illustrating the formation of an external electrical device on a first circuit board according to another exemplary embodiment.

[0070] Figure 23 This is a process flow diagram illustrating the manufacturing process of a circuit board assembly according to an exemplary embodiment.

[0071] Figure 24 This is a process flow diagram illustrating the manufacturing process of a circuit board assembly according to another exemplary embodiment.

[0072] Figure 25 This is a process flow diagram illustrating the manufacturing process of a circuit board assembly according to another exemplary embodiment.

[0073] Figure 26 This is a block diagram of an electronic device according to an exemplary embodiment.

[0074] In the picture:

[0075] 1-Main board; 2-Elevated structure; 10-First circuit board; 20-Integrated component; 21-Second circuit board; 22-Electrical connection; 23-Optoelectronic device; 30-Built-in electrical device; 41-First molding compound; 42-Second molding compound; 43-Third molding compound; 50-External electrical device; 51-Packaged device; 52-Unpackaged device; 60-Accommodation space; 70-Circuit board motherboard; 101-Processing component; 102-Memory; 103-Power component; 104-Multimedia component; 105-Audio component; 106-Input / output interface; 107-Sensor component; 108-Communication component; 109-Processor. Detailed Implementation

[0076] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with some aspects of the invention as detailed in the appended claims.

[0077] In recent years, with the rapid development of physiological indicator detection technology and the continuous iteration of electronic devices, such as wearable devices with physiological indicator detection functions, electronic devices have been widely used in people's daily health monitoring. When conducting physiological indicator detection, electronic devices such as wristbands need to acquire detection signals such as the user's skin conductance signals through photoelectric devices embedded within them.

[0078] In related technologies, refer to Figure 1 As shown, in order to realize the function of the optoelectronic device 23 and ensure the effect of the optoelectronic device 23, the optoelectronic device 23 needs to be placed in a position away from the motherboard 1 and close to the outer casing. Therefore, a shim structure 2 needs to be set on the motherboard 1 to raise the height of the optoelectronic device 23.

[0079] However, the circuit board assembly using the relevant technology is limited by the raised structure 2, resulting in a large amount of wasted space. It is necessary to increase the area of ​​the circuit board assembly to accommodate other devices, which increases production costs and affects the layout design and performance of the circuit board assembly.

[0080] Based on this, an exemplary embodiment of this disclosure provides a circuit board assembly. The circuit board assembly, formed by a first circuit board, a second circuit board, an electrical connection portion, and at least one optoelectronic device, integrates the optoelectronic device with the circuit board. The electrical connection portion enables electrical connection between the first and second circuit boards, providing a basis for the functional realization of the optoelectronic device. The second circuit board is supported on the first circuit board by the electrical connection portion, and the built-in electrical device is disposed within the accommodating space between the second surfaces of the first and second circuit boards. This ensures the function of the optoelectronic device while fully utilizing the space between the optoelectronic device and the first circuit board, reducing the production cost of the circuit board assembly, facilitating the layout design of the circuit board assembly, and improving the performance of the circuit board assembly.

[0081] In one exemplary embodiment, a circuit board assembly is provided, with reference to Figure 2 , Figure 3 or Figure 4 As shown, the circuit board assembly includes a first circuit board 10 and an integrated assembly 20. The integrated assembly 20 includes a second circuit board 21, an electrical connection portion 22, and at least one optoelectronic device 23. The second circuit board 21 includes a first surface and a second surface that are opposite to each other, with the second surface disposed opposite to the first circuit board 10. The electrical connection portion 22 is disposed on the second surface, and the second circuit board 21 is supported on and electrically connected to the first circuit board 10 via the electrical connection portion 22. A receiving space 60 is provided between the second surface and the first circuit board 10, and at least one built-in electrical device 30 is disposed within the receiving space 60. At least one optoelectronic device 23 is disposed on the first surface and is electrically connected to the second circuit board 21.

[0082] The circuit board assembly includes a first circuit board 10 and an integrated assembly 20. The first circuit board 10 serves as a support platform for the circuit board assembly and has good electrical performance and mechanical strength. One side surface of the first circuit board 10 is used to support other components of the circuit board assembly.

[0083] The integrated component 20 comprises a second circuit board 21, an electrical connection portion 22, and at least one optoelectronic device 23. The second circuit board 21 includes a first surface and a second surface that are opposite to each other. The second surface is disposed opposite to the first circuit board 10, meaning the second surface of the second circuit board 21 is close to the first circuit board 10, and the first surface is away from the first circuit board 10. Exemplarily, the planar dimension of the second circuit board 21 is smaller than the planar dimension of the first circuit board 10, and the second circuit board 21 is parallel to the first circuit board 10.

[0084] An electrical connection portion 22 is disposed on the second surface, specifically on the side of the second circuit board 21 closest to the first circuit board 10. The electrical connection portion 22 supports the second circuit board 21 onto the first circuit board 10, creating an accommodating space 60 between the first and second circuit boards 10, which are not in direct contact. This allows the first circuit board 10 to be electrically connected to the second circuit board 21 via the electrical connection portion 22. One or more built-in electrical components 30 are disposed within the accommodating space 60. The number and type of the built-in electrical components 30 can be configured and adjusted as needed.

[0085] At least one optoelectronic device 23 is disposed on the first surface. Since the electrical connection portion 22 supports the second circuit board 21 on the first circuit board 10, each optoelectronic device 23 is located at the top in the height direction of the circuit board assembly, ensuring the intensity of the emitted and received light signals, thereby realizing the function and ensuring the effectiveness of the optoelectronic device 23. The optoelectronic device 23 is electrically connected to the second circuit board 21. With the second circuit board 21 electrically connected to the first circuit board 10 via the electrical connection portion 22, an electrical connection path is formed: optoelectronic device 23 - second circuit board 21 - electrical connection portion 22 - first circuit board 10. This allows each optoelectronic device 23 to be electrically connected to the first circuit board 10, realizing the control of the optoelectronic device 23.

[0086] Understandably, unlike the raised structure in related technologies, this circuit board assembly supports the second circuit board 21 through the electrical connection part 22 to ensure the installation height of the optoelectronic device 23, and sets the built-in electrical device 30 in the formed accommodating space 60. This makes full use of the accommodating space 60 and saves the planar size and height space occupied by the built-in electrical device 30 if it were set in other positions, thereby reducing the manufacturing cost of the circuit board assembly.

[0087] In this embodiment, the circuit board assembly formed by the first circuit board 10, the second circuit board 21, the electrical connection portion 22, and at least one optoelectronic device 23 integrates the optoelectronic device 23 with the circuit board, and the electrical connection portion 22 enables the electrical connection between the first circuit board 10 and the second circuit board 21, providing a basis for the functional realization of the optoelectronic device 23. The second circuit board 21 is supported on the first circuit board 10 by the electrical connection portion 22, and the built-in electrical device 30 is disposed in the accommodating space 60 between the second surfaces of the first circuit board 10 and the second circuit board 21. While ensuring the function of the optoelectronic device 23, the space between the optoelectronic device 23 and the first circuit board 10 is fully utilized, reducing the production cost of the circuit board assembly, facilitating the layout design of the circuit board assembly, and improving the performance of the circuit board assembly.

[0088] In some embodiments, all built-in electrical components 30 are disposed on the second surface; or, all built-in electrical components 30 are disposed on the first circuit board 10; or, some built-in electrical components 30 are disposed on the second surface and some built-in electrical components 30 are disposed on the first circuit board 10.

[0089] like Figure 2 and Figure 3 As shown, each built-in electrical component 30 can be disposed on the second surface, forming an integrated assembly 20 together with the second circuit board 21, the electrical connection part 22 and the optoelectronic device 23. Each built-in electrical component 30 disposed on the second surface is electrically connected to the second circuit board 21, forming an electrical connection path of built-in electrical component 30-second circuit board 21-electrical connection part 22-first circuit board 10, so that each built-in electrical component 30 can be electrically connected to the first circuit board 10, thereby realizing the control of each built-in electrical component 30.

[0090] Each built-in electrical component 30 can also be disposed on the first circuit board 10. Each built-in electrical component 30 disposed on the first circuit board 10 is directly electrically connected to the first circuit board 10, thereby realizing the control of each built-in electrical component 30.

[0091] like Figure 4 As shown, some of the built-in electrical components 30 can be disposed on the second surface, while another portion of the built-in electrical components 30 can be disposed on the first circuit board 10. This allows some of the built-in electrical components 30, together with the second circuit board 21, the electrical connection portion 22, and the optoelectronic device 23, to form an integrated assembly 20. This assembly is electrically connected to the first circuit board 10 via the second circuit board 21 and the electrical connection portion 22, while the other portion of the built-in electrical components 30 is directly electrically connected to the first circuit board 10, thus enabling control of each built-in electrical component 30. In this case, the built-in electrical components 30 in the accommodating space 60 can be configured in multiple layers, meaning that multiple built-in electrical components 30 can be disposed within the same projection area on the first circuit board 10, further improving the utilization rate of the accommodating space 60.

[0092] In this embodiment, each built-in electrical component 30 is disposed on the second surface or the first circuit board 10, or some of the built-in electrical components 30 are disposed on the second surface and some of the built-in electrical components 30 are disposed on the first circuit board 10. This realizes the placement of the built-in electrical components 30 in the accommodating space 60 and enables each built-in electrical component 30 to be electrically connected to the first circuit board 10. This makes full use of the accommodating space 60, reduces the production cost of the circuit board assembly, facilitates the layout design of the circuit board assembly, and improves the performance of the circuit board assembly.

[0093] In some embodiments, such as Figure 2 As shown, each optoelectronic device 23 is not encapsulated and is directly exposed to the outside, which can ensure the intensity of the light signals emitted and received by the optoelectronic device 23, thereby realizing the function of the optoelectronic device 23 and ensuring the effect of the optoelectronic device 23.

[0094] In other embodiments, such as Figure 3 and Figure 4 As shown, the integrated component 20 also includes a first molding compound 41, which is used to mold the optoelectronic device 23, and the first molding compound 41 is transparent.

[0095] The integrated component 20 also includes a first molding compound 41, which is used to encapsulate the optoelectronic device 23 through a molding process to protect and electrically isolate the optoelectronic device 23. The material of the first molding compound 41 can be, for example, a composite material such as epoxy resin molding compound. The first molding compound 41 is transparent to ensure the intensity of the light signals emitted and received by the optoelectronic device 23.

[0096] In this embodiment, by providing a first molding compound 41 in the integrated component 20, the optoelectronic device 23 can be encapsulated using the first molding compound 41, thereby protecting and encapsulating the optoelectronic device 23 and giving the area where the optoelectronic device 23 is located a fixed shape, thus improving the stability and reliability of the integrated component 20. Choosing a transparent first molding compound 41 ensures the intensity of the light signals emitted and received by the optoelectronic device 23, thereby enabling the function of the optoelectronic device 23 and guaranteeing its effectiveness.

[0097] In some embodiments, the circuit board assembly further includes a second molding compound 42 for molding the built-in electrical components 30.

[0098] The circuit board assembly also includes a second molding compound 42, which is used to encapsulate the built-in electrical components 30 through a molding process to protect and electrically isolate the built-in electrical components 30. The material of the second molding compound 42 can be, for example, a composite material such as epoxy resin molding compound. Figure 2 and Figure 3As shown, with each built-in electrical component 30 disposed on the second surface, the second molding compound 42 together with each built-in electrical component 30 is a component of the integrated assembly 20.

[0099] In this embodiment, by providing a second molding compound 42 in the integrated component 20, the built-in electrical components 30 can be molded by the second molding compound 42, thereby achieving protection and encapsulation of the built-in electrical components 30 and giving the area where the built-in electrical components 30 are located a fixed shape, thus improving the stability and reliability of the circuit board assembly.

[0100] In some embodiments, the optoelectronic device 23 includes a photosensitive chip and at least one light-emitting diode.

[0101] The optoelectronic device 23 includes a photosensitive chip and one or more light-emitting diodes (LEDs). The LEDs emit light signals, and the photosensitive chip converts the reflected light signals into electrical signals, thereby enabling the detection and processing of the light signals. For example, the LEDs can be used for signal indication such as power indicators or for display screens, and the photosensitive chip can be used for light control modules such as adjusting the brightness of the display screen. The combination of LEDs and photosensitive chips can be used for the detection of physiological indicators.

[0102] In this embodiment, a photosensitive chip and at least one light-emitting diode are used as optoelectronic devices 23, enabling the optoelectronic devices 23 to have functions such as emitting, detecting and processing light signals, thereby providing display, indication and physiological indicator detection functions for circuit board assemblies and electronic devices including circuit board assemblies, thus improving the user experience.

[0103] In some embodiments, the built-in electrical device 30 includes an integrated circuit chip, or the built-in electrical device 30 includes a passive device, or the built-in electrical device 30 includes both an integrated circuit chip and a passive device.

[0104] Integrated circuit (IC) chips can be housed as built-in electrical devices 30 within the accommodating space 60. These IC chips integrate numerous microelectronic components such as transistors, resistors, and capacitors, providing certain computational and storage functions. Alternatively, passive devices, including resistors, inductors, and capacitors, can be housed as built-in electrical devices 30 within the accommodating space 60. These passive devices operate without a power supply and provide functions such as voltage reduction, voltage division, coupling, and filtering. Furthermore, both IC chips and passive devices can be housed as built-in electrical devices 30 within the accommodating space 60. The quantity and type of IC chips and passive devices can be set and adjusted according to requirements, and IC chips and passive devices with sizes suitable for the accommodating space 60 can be selected as the built-in electrical devices 30.

[0105] In this embodiment, integrated circuit chips and passive devices are set as built-in electrical components 30 within the accommodating space 60, making full use of the accommodating space 60. The integrated circuit chips and passive devices provide more complex and diverse functions for the circuit board assembly, thereby improving the practicality of the circuit board assembly.

[0106] In some embodiments, the electrical connection portion 22 includes solder balls or an adapter plate.

[0107] like Figure 2 and Figure 3 As shown, the electrical connection portion 22 used to support the second circuit board 21 and electrically connect the second circuit board 21 to the first circuit board 10 can be a solder ball, which is a spherical metal particle based on electronic packaging and soldering technology. Figure 4 As shown, the electrical connection part 22 can also be an adapter board. An adapter board is an intermediate device used for electrical connection between devices or circuit boards, and features high-density interconnection, low power consumption and low latency.

[0108] The number and size of solder balls or adapter boards can be set according to electrical connection requirements, the height of the accommodating space 60, and the number of built-in electrical components 30. It is understandable that if the height of the accommodating space 60 is small, and the number and size of the built-in electrical components 30 within the accommodating space 60 are small, solder balls can be chosen as the electrical connection part 22. If the height of the accommodating space 60 is large, the number and size of the built-in electrical components 30 within the accommodating space 60 are large, or there are multiple layers of built-in electrical components 30, an adapter board can be chosen as the electrical connection part 22.

[0109] In this embodiment, solder balls or adapter plates are used as the electrical connection part 22, which can provide stable support for the second circuit board 21 and realize the electrical connection between the second circuit board 21 and the first circuit board 10. By selecting solder balls or adapter plates, the electrical connection part 22 can be adapted to circuit board assemblies with different accommodating space 60 heights or different numbers of built-in electrical components 30, ensuring the overall strength and electrical connection stability of the circuit board assembly.

[0110] In some embodiments, the circuit board assembly further includes an external electrical device 50 disposed on the first circuit board 10. The external electrical device 50 and the integrated assembly 20 are disposed on the same side of the first circuit board 10, and the external electrical device 50 is located outside the accommodating space 60. The external electrical device 50 includes a packaged device 51, or the external electrical device 50 includes a non-packaged device 52, or the external electrical device 50 may include both a packaged device 51 and a non-packaged device 52.

[0111] like Figure 2 , Figure 3 or Figure 4As shown, the circuit board assembly also includes an external electrical device 50 disposed on the first circuit board 10. The external electrical device 50 and the integrated assembly 20 are disposed on the same side of the first circuit board 10, and the external electrical device 50 is located outside the accommodating space 60, so that the circuit board assembly is a single-sided integrated structure relative to the first circuit board 10, making full use of the planar size of the first circuit board 10 while avoiding the increase in the thickness of the circuit board assembly caused by double-sided integration.

[0112] The external electrical device 50 may include a packaged device 51, which is a device that requires packaging. The packaged device 51 may, for example, include an integrated circuit chip with certain computing and storage functions. As mentioned earlier, the integrated circuit chip can be housed as a built-in electrical device 30 within the accommodating space 60. Therefore, to maximize the overall space utilization of the circuit board assembly, a smaller integrated circuit chip can be selected as the built-in electrical device 30 within the accommodating space 60, while a larger integrated circuit chip can be selected as the external electrical device 50 outside the accommodating space 60. The external electrical device 50 may also include an unpackaged device 52, which is a device that cannot be packaged due to functional limitations. The unpackaged device 52 may include at least one of a microphone and a power interface.

[0113] In this embodiment, the circuit board assembly also includes an external electrical component 50, which provides more complex and diverse functions to the circuit board assembly, thereby improving its practicality. By placing the external electrical component 50 and the integrated component 20 on the same side of the first circuit board 10, and with the external electrical component 50 located outside the accommodating space 60, the planar dimensions on the first circuit board 10 can be fully utilized, and the overall height can be controlled, further improving the space utilization rate of the circuit board assembly.

[0114] In some embodiments, the second molding compound 42 used for molding the built-in electrical device 30 is also used for molding the encapsulated device 51; or, the circuit board assembly further includes a third molding compound 43 used for molding the encapsulated device 51.

[0115] like Figure 4 As shown, the second molding compound 42 used for molding the built-in electrical device 30 is also used for molding the encapsulation device 51. That is, the second molding compound 42 is used to achieve overall encapsulation of the built-in electrical device 30 and the encapsulation device 51, while protecting and electrically isolating the built-in electrical device 30 and the encapsulation device 51, and making the area where each built-in electrical device 30 and the encapsulation device 51 are located have a fixed shape, thereby improving the overall strength of the accommodating space 60 and the space where the encapsulation device 51 is located.

[0116] Or, such as Figure 2 and Figure 3As shown, the circuit board assembly also includes a third molding compound 43, which is used to separately encapsulate the packaged device 51, which is an external electrical device 50, so as to achieve protection and electrical isolation of the packaged device 51 through the third molding compound 43. The material of the third molding compound 43 can be the same as that of the second molding compound 42.

[0117] In this embodiment, either the built-in electrical device 30 and the packaged device 51 are simultaneously encapsulated by the second molding compound 42, or the packaged device 51 is encapsulated separately by the third molding compound 43. Both methods achieve encapsulation of the packaged device 51, protecting and encapsulating it. This ensures that the area containing the packaged device 51, or the area containing the packaged device 51 and the accommodating space 60, has a fixed shape, improving the stability and reliability of the circuit board assembly. Furthermore, by simultaneously encapsulating the built-in electrical device 30 and the packaged device 51 with the second molding compound 42, the built-in electrical device 30 does not need to be pre-encapsulated and can be installed as a bare die. This reduces the spacing between the built-in electrical devices 30, allowing more built-in electrical devices 30 to be placed within the accommodating space 60, further improving the utilization rate of the accommodating space 60.

[0118] It should be noted that, as Figure 4 As shown, when the second molding compound 42 is also used to encapsulate the device 51, it is necessary to ensure that the first molding compound 41 is exposed and to improve the surface roughness of the first molding compound 41 to avoid optical reflection, scattering, and other phenomena. To ensure that the first molding compound 41 is exposed, the height of the second molding compound 42 can be made higher than that of the first molding compound 41 when molding the internal electrical device 30 and the encapsulated device 51 with the second molding compound 42, and then the second molding compound 42 can be ground. Alternatively, when molding the optoelectronic device 23 with the first molding compound 41, the first molding compound can be ground or the surface of the molding mold can be treated to ensure that the surface of the first molding compound 41 is smooth, and when molding the internal electrical device 30 and the encapsulated device 51 with the second molding compound 42, molding can be performed through processes such as film coating, dispensing, and spraying.

[0119] In one exemplary embodiment, a method for manufacturing a circuit board assembly is provided, for manufacturing the circuit board assembly as described above. (Reference) Figure 5 As shown, the method for manufacturing the circuit board assembly includes:

[0120] S100, provides the first circuit board.

[0121] In step S100, provide as follows Figure 6 The first circuit board 10 shown serves as a support platform for the circuit board assembly, possessing excellent electrical performance and mechanical strength. One side surface of the first circuit board 10 is used to support other components of the circuit board assembly.

[0122] S200. An integrated assembly is formed, the integrated assembly including a second circuit board, at least one optoelectronic device disposed on a first surface of the second circuit board, and an electrical connection portion disposed on a second surface of the second circuit board.

[0123] In step S200, the following is formed: Figure 7 , Figure 8 or Figure 9 The integrated component 20 shown includes a second circuit board 21 and at least one optoelectronic device 23 disposed on a first surface of the second circuit board 21 and an electrical connection portion 22 disposed on a second surface of the second circuit board 21.

[0124] S300. The second circuit board is supported on the first circuit board and electrically connected to the first circuit board through the electrical connection part, and the optoelectronic device is located on the first surface of the second circuit board away from the first circuit board. There is an accommodating space between the second surface and the first circuit board, and at least one built-in electrical device is disposed in the accommodating space.

[0125] In step S300, the second circuit board 21 is supported on the first circuit board 10 and electrically connected to the first circuit board 10 via the electrical connection part 22, corresponding to... Figure 7 , Figure 8 and Figure 9 The integrated components 20 shown form as follows: Figure 10 , Figure 11 and Figure 12 The circuit board assembly shown has an electrical connection 22 disposed on the second surface of the second circuit board 21, so that the second surface is disposed opposite to the first circuit board 10. An accommodating space 60 is formed between the first circuit board 10 and the second circuit board 21, which are not in direct contact. One or more built-in electrical components 30 are disposed in the accommodating space 60. The number and type of built-in electrical components 30 can be set and adjusted according to requirements.

[0126] Each optoelectronic device 23 is located on the first surface away from the first circuit board 10, that is, at the top of the circuit board assembly in the height direction. This ensures the intensity of the emitted and received light signals, thereby realizing the function and ensuring the effectiveness of the optoelectronic device 23. The optoelectronic device 23 is electrically connected to the second circuit board 21. With the second circuit board 21 electrically connected to the first circuit board 10 through the electrical connection part 22, an electrical connection path is formed: optoelectronic device 23 - second circuit board 21 - electrical connection part 22 - first circuit board 10. This allows each optoelectronic device 23 to be electrically connected to the first circuit board 10, realizing the control of the optoelectronic device 23.

[0127] In this embodiment, by providing a first circuit board 10 and forming an integrated assembly 20, and then supporting a second circuit board 21 on the first circuit board 10 and electrically connecting it to the first circuit board 10 via an electrical connection portion 22, a circuit board assembly is formed including the first circuit board 10, the second circuit board 21, the electrical connection portion 22, and at least one optoelectronic device 23. This achieves the integration of the optoelectronic device 23 with the circuit board, and the electrical connection portion 22 enables the electrical connection between the first circuit board 10 and the second circuit board 21, providing a basis for the functional realization of the optoelectronic device 23. By supporting the second circuit board 21 on the first circuit board 10 via the electrical connection portion 22, and placing the built-in electrical device 30 within the accommodating space 60 between the second surfaces of the first circuit board 10 and the second circuit board 21, the space between the optoelectronic device 23 and the first circuit board 10 is fully utilized while ensuring the function of the optoelectronic device 23, reducing the production cost of the circuit board assembly, facilitating the layout design of the circuit board assembly, and improving the performance of the circuit board assembly.

[0128] In some embodiments, reference Figure 13 As shown, an integrated component 20 is formed, comprising:

[0129] S210 provides circuit board motherboard.

[0130] S220: Multiple optoelectronic devices are installed on one side of the circuit board motherboard.

[0131] In steps S210 and S220, as Figure 14 As shown, a circuit board motherboard 70 is provided, which serves as the motherboard for the second circuit board 21. Multiple optoelectronic devices 23 are mounted on one side of the circuit board motherboard 70 using surface mount technology (SMT), flip chip technology, or reflow soldering and other soldering processes. For example, multiple groups of optoelectronic devices 23 can be arranged according to the principle of one photosensitive chip and two light-emitting diodes per group.

[0132] S230. Multiple electrical connection parts are provided on the other side of the circuit board motherboard to obtain an integrated motherboard.

[0133] In step S230, multiple electrical connection portions 22 can be formed on the other side of the circuit board motherboard 70 using a surface mount process, resulting in the following: Figure 15 or Figure 16 The integrated motherboard shown. The electrical connection portion 22 can be as follows: Figure 15 The solder ball shown, the electrical connection part 22 can also be as follows: Figure 16 The adapter plate shown.

[0134] S240, cut the integrated motherboard to obtain multiple integrated components.

[0135] In step S240, the integrated motherboard is cut into multiple integrated components 20, thereby realizing the batch formation of integrated components 20.

[0136] In this embodiment, by providing a circuit board motherboard 70 and setting multiple optoelectronic devices 23 and multiple electrical connection parts 22 on both sides of the circuit board motherboard 70, an integrated motherboard is obtained. By cutting the integrated motherboard, multiple integrated components 20 including a second circuit board 21, optoelectronic devices 23 and electrical connection parts 22 can be mass-produced, thereby improving the production efficiency of the integrated components 20.

[0137] In some embodiments, the optoelectronic device 23 is not encapsulated during the formation of the integrated component 20, and the following can be obtained subsequently: Figure 7 The integrated component 20 shown, and as shown Figure 10 The circuit board assembly shown.

[0138] In some other embodiments, a plurality of electrical connection portions 22 are provided on the other side of the circuit board motherboard 70. Before obtaining the integrated motherboard, the formation of the integrated assembly 20 further includes: encapsulating a plurality of optoelectronic devices 23 with a first molding compound 41, wherein the first molding compound 41 is transparent.

[0139] Before obtaining the integrated motherboard, multiple electrical connection portions 22 are provided on the other side of the circuit board motherboard 70. Before this, multiple optoelectronic devices 23 located on one side of the circuit board motherboard 70 can be encapsulated with a first molding compound 41 to protect and electrically isolate the optoelectronic devices 23. The first molding compound 41 can be made of composite materials such as epoxy resin molding compound. The first molding compound 41 is transparent to ensure the intensity of the light signals emitted and received by the optoelectronic devices 23.

[0140] Multiple optoelectronic devices 23 are encapsulated using the first molding compound 41, and subsequently, the following can be obtained: Figure 8 or Figure 9 The integrated component 20 shown, and as shown Figure 11 or Figure 12 The circuit board assembly shown.

[0141] In this embodiment, by encapsulating multiple optoelectronic devices 23 with a first molding compound 41, the optoelectronic devices 23 are protected and encapsulated. This ensures that the area containing the optoelectronic devices 23 in the subsequently formed circuit board assembly has a fixed shape, improving the stability and reliability of the integrated assembly 20. Choosing a transparent first molding compound 41 ensures the intensity of the light signals emitted and received by the optoelectronic devices 23, thereby enabling the functionality of the optoelectronic devices 23 and guaranteeing their effectiveness.

[0142] In some embodiments, forming the integrated assembly 20 before cutting the integrated motherboard further includes forming a plurality of built-in electrical components 30 on the other side of the circuit board motherboard 70.

[0143] Before cutting the integrated motherboard, multiple built-in electrical components 30 are formed on the other side of the circuit board motherboard 70, i.e., on the side where multiple electrical connection portions 22 are provided. This ensures that at least some of the built-in electrical components 30 in the subsequently formed circuit board assembly are disposed on the second surface of the second circuit board 21. The built-in electrical components 30, together with the second circuit board 21, the electrical connection portions 22, and the optoelectronic devices 23, constitute the integrated assembly 20. Each built-in electrical component 30 disposed on the second surface is electrically connected to the second circuit board 21, forming an electrical connection path of built-in electrical component 30 - second circuit board 21 - electrical connection portion 22 - first circuit board 10. This allows each built-in electrical component 30 to be electrically connected to the first circuit board 10, enabling control of each built-in electrical component 30.

[0144] Multiple built-in electrical components 30 are formed on the other side of the circuit board motherboard 70, which can achieve such Figure 17 or Figure 18 The integrated motherboard shown can be subsequently used to form... Figure 7 , Figure 8 or Figure 9 The integrated component 20 shown can be respectively formed as follows: Figure 10 , Figure 11 and Figure 12 The circuit board assembly shown.

[0145] In this embodiment, by forming a plurality of built-in electrical components 30 on the other side of the circuit board motherboard 70, the built-in electrical components 30 can be disposed on the second surface of the second circuit board 21, thereby realizing the placement of the built-in electrical components 30 in the accommodating space 60, making full use of the accommodating space 60, reducing the production cost of the circuit board assembly, facilitating the layout design of the circuit board assembly, and improving the performance of the circuit board assembly.

[0146] In some embodiments, during the formation of the integrated component 20, the plurality of built-in electrical components 30 disposed on the other side of the circuit board motherboard 70 are not encapsulated, and subsequent formation can proceed as follows. Figure 9 The integrated component 20 shown is formed as follows: Figure 12 The circuit board assembly shown.

[0147] In other embodiments, forming the integrated component 20 further includes encapsulating the built-in electrical device 30 with a second molding compound 42.

[0148] If multiple built-in electrical components 30 are formed on the other side of the circuit board motherboard 70, the built-in electrical components 30 can be encapsulated with a second molding compound 42 to protect and electrically isolate them. Encapsulating the built-in electrical components 30 with the second molding compound 42 allows for the subsequent formation of... Figure 7 or Figure 8 The integrated component 20 shown can be formed as follows: Figure 10 or Figure 11 The circuit board assembly shown.

[0149] If the built-in electrical components 30 are encapsulated with the second molding compound 42, and the electrical connection portion 22 is a solder ball, the second molding compound 42 needs to be ground using a grinding process to ensure the solder ball is exposed. A laser process is then used to remove the second molding compound 42 around the solder ball, facilitating the remelting of the solder ball when the second circuit board 21 is subsequently supported on the first circuit board 10 and electrically connected to the first circuit board 10. Grinding the second molding compound 42 also exposes part of the built-in electrical components 30, increasing the heat dissipation area and improving the heat dissipation efficiency of the built-in electrical components 30.

[0150] In this embodiment, by encapsulating the built-in electrical components 30 with the second molding compound 42, the built-in electrical components 30 are protected and encapsulated, and the area where the built-in electrical components 30 are located in the subsequently formed circuit board assembly has a fixed shape, thereby improving the stability and reliability of the integrated assembly 20.

[0151] In some embodiments, before supporting the second circuit board 21 on the first circuit board 10 via the electrical connection portion 22, the method of manufacturing the circuit board assembly further includes: providing at least one built-in electrical device 30 in a preset area of ​​the first circuit board 10, such that after supporting the second circuit board 21 on the first circuit board 10, each built-in electrical device 30 in the preset area is located within the accommodating space 60.

[0152] Before the second circuit board 21 is supported on the first circuit board 10 via the electrical connection part 22 to place the integrated component 20 on the first circuit board 10, one or more built-in electrical components 30 are placed in a preset area of ​​the first circuit board 10 by surface mount technology, so that the built-in electrical components 30 are directly placed on the first circuit board 10, and after the second circuit board 21 is supported on the first circuit board 10, each built-in electrical component 30 in the preset area is located within the accommodating space 60, thereby realizing the placement of the built-in electrical components 30 within the accommodating space 60.

[0153] For example, such as Figure 19 As shown, at least one built-in electrical component 30 is disposed in a preset area of ​​the first circuit board 10, and such as Figure 9The integrated component 20 shown is disposed on the first circuit board 10 via the electrical connection portion 22, enabling it to achieve the following: Figure 12 The circuit board assembly shown allows a portion of the built-in electrical components 30 within the accommodating space 60 to be disposed on the first circuit board 10, while another portion of the built-in electrical components 30 within the accommodating space 60 is disposed on the second surface of the second circuit board 21. The built-in electrical components 30 in the accommodating space 60 are configured in multiple layers, further improving the utilization rate of the accommodating space 60.

[0154] In this embodiment, at least one built-in electrical component 30 is provided in a preset area of ​​the first circuit board 10, so that after the second circuit board 21 is supported on the first circuit board 10, each built-in electrical component 30 in the preset area is located within the accommodating space 60. This allows the built-in electrical components 30 to be placed on the first circuit board 10, thereby realizing the placement of the built-in electrical components 30 in the accommodating space 60. This makes full use of the accommodating space 60, reduces the production cost of the circuit board assembly, facilitates the layout design of the circuit board assembly, and improves the performance of the circuit board assembly.

[0155] In some embodiments, the method of manufacturing the circuit board assembly further includes: forming an external electrical device 50 on the first circuit board 10, wherein the external electrical device 50 and the integrated assembly 20 are located on the same side of the first circuit board 10 and the external electrical device 50 is located outside the accommodating space 60, the external electrical device 50 includes a packaged device 51, or the external electrical device 50 includes a non-packaged device 52, or the external electrical device 50 may include a packaged device 51 and a non-packaged device 52.

[0156] Before or after the second circuit board 21 is supported on the first circuit board 10 via the electrical connection part 22, an external electrical device 50 may also be formed on the first circuit board 10. The external electrical device 50 and the integrated assembly 20 are disposed on the same side of the first circuit board 10, and the external electrical device 50 is located outside the accommodating space 60, so that the circuit board assembly is a single-sided integrated structure relative to the first circuit board 10. This makes full use of the planar size of the first circuit board 10 while avoiding the increase in the thickness of the circuit board assembly caused by double-sided integration, and provides the circuit board assembly with more complex and diversified functions.

[0157] The external electrical device 50 may include a packaged device 51, which is a device that needs to be packaged. For example, the packaged device 51 may include an integrated circuit chip with certain computing and storage functions. The external electrical device 50 may also include an unpackaged device 52, which is a device that cannot be packaged due to its functional limitations. The unpackaged device 52 may include at least one of a microphone and a power interface.

[0158] By adding an external electrical component 50 to the first circuit board 10, it is possible to achieve the following: Figure 10 , Figure 11 and Figure 12 Based on the circuit board assembly shown, respectively form the following... Figure 20 , Figure 21 and Figure 22 The circuit board assembly shown.

[0159] In some embodiments, the method of manufacturing the circuit board assembly further includes: encapsulating the packaged device 51 and the built-in electrical device 30 with a second molding compound 42; or encapsulating the packaged device 51 with a third molding compound 43.

[0160] The encapsulated device 51 and the built-in electrical device 30 can be integrally encapsulated using the second molding compound 42. For example, after obtaining... Figure 22 After assembling the circuit board as shown, the packaged device 51 and the built-in electrical device 30 can be integrally molded with the second molding compound 42 to obtain the following result: Figure 4 The circuit board assembly shown can simultaneously protect and electrically isolate the built-in electrical components 30 and the packaged components 51, and give each area where the built-in electrical components 30 and the packaged components 51 are located a fixed shape, thereby improving the overall strength of the accommodating space 60 and the space where the packaged components 51 are located.

[0161] It should be noted that when the second molding compound 42 is used to simultaneously encapsulate the device 51 and the internal electrical device 30, it is necessary to ensure that the first molding compound 41 is exposed and to improve the surface roughness of the first molding compound 41 to avoid optical reflection, scattering, and other phenomena. To ensure that the first molding compound 41 is exposed, the height of the second molding compound 42 can be made higher than that of the first molding compound 41 when encapsulating the internal electrical device 30 and the encapsulated device 51 with the second molding compound 42, and then the second molding compound 42 can be ground. Alternatively, when encapsulating the optoelectronic device 23 with the first molding compound 41, the first molding compound can be ground or the surface of the encapsulation mold can be treated to ensure that the surface of the first molding compound 41 is smooth, and when encapsulating the internal electrical device 30 and the encapsulated device 51 with the second molding compound 42, encapsulation can be performed through processes such as lamination, dispensing, and spraying.

[0162] The packaged device 51 can also be encapsulated with a third molding compound 43, for example, after obtaining such a packaged device 51 ... Figure 20 or Figure 21 After assembling the circuit board as shown, the packaged device 51 can be individually encapsulated with the third molding compound 43 to obtain the following result: Figure 2 or Figure 3 The circuit board assembly shown can protect and electrically isolate the packaged device 51.

[0163] In this embodiment, either the encapsulated device 51 and the built-in electrical component 30 are encapsulated using the second molding compound 42, or the encapsulated device 51 is encapsulated using the third molding compound 43. Both methods effectively encapsulate the encapsulated device 51, providing protection and encapsulation. This ensures that the area containing the encapsulated device 51, or the area containing the encapsulated device 51 and the accommodating space 60, has a fixed shape, improving the stability and reliability of the circuit board assembly. Furthermore, by encapsulating the encapsulated device 51 and the built-in electrical component 30 using the second molding compound 42, the built-in electrical component 30 does not need to be pre-encapsulated when mounted on the second surface or the first circuit board 10. It can be mounted as a bare die, reducing the spacing between the built-in electrical components 30. This allows for the placement of more built-in electrical components 30 within the accommodating space 60, further improving the utilization rate of the accommodating space 60.

[0164] The above manufacturing method can yield the following: Figure 2 , Figure 3 or Figure 4 The circuit board assembly shown is for example, Figure 2 and Figure 3 The circuit board assembly shown, while maintaining the overall height of the circuit board assembly and the height of the optoelectronic device 23 unchanged, can reduce the planar area of ​​the circuit board assembly by approximately 20% by utilizing the accommodating space 60. For example... Figure 4 The circuit board assembly shown can reduce the planar area of ​​the circuit board assembly by about 40% to 50% by utilizing the accommodating space 60, while keeping the overall height of the circuit board assembly and the height of the optoelectronic device 23 unchanged.

[0165] For example Figure 2 The circuit board assembly shown is for reference. Figure 23 As shown, the manufacturing process can be carried out through the following specific steps: providing circuit board motherboard - solder ball placement - mounting of built-in electrical components - reflow soldering - solder cleaning - molding - molding curing - molding grinding - laser drilling - remelting solder balls - solder ball placement - mounting of optoelectronic components - reflow soldering - solder cleaning - cutting individual components - solder ball placement - integrated component mounting - edge cutting - automatic appearance inspection - packaging.

[0166] For example Figure 3 The circuit board assembly shown is for reference. Figure 24 As shown, the manufacturing process can be carried out through the following specific steps: providing circuit board motherboard - solder ball placement - optoelectronic device mounting - reflow soldering - solder cleaning - molding - molding curing - molding grinding - solder ball placement - internal electrical component mounting - reflow soldering - solder cleaning - molding - molding curing - laser drilling - remelting solder balls - cutting individual pieces - solder ball placement - integrated component mounting - edge cutting - automatic appearance inspection - packaging.

[0167] For example Figure 4The circuit board assembly shown is for reference. Figure 25 As shown, the manufacturing process can be carried out through the following specific steps: providing circuit board motherboard - solder ball placement - optoelectronic device mounting - reflow soldering - solder cleaning - molding - molding curing - solder ball placement - internal electrical component mounting - reflow soldering - solder cleaning - cutting individual components - solder ball placement - integrated component mounting - overall molding - molding curing - molding grinding - edge cutting - automatic appearance inspection - encapsulation.

[0168] In one exemplary embodiment, an electronic device is provided, including a circuit board assembly as described above. Because the circuit board assembly has the characteristics of saving space, reducing production costs, facilitating layout design, and improving performance, electronic devices including the circuit board assembly can have the same characteristics.

[0169] In some embodiments, the electronic device is a wearable device such as a wristband. By setting the circuit board assembly as described above in the wearable device, physiological indicators can be detected through photoelectric devices, and the wearable device has the characteristics of saving space, reducing production costs, facilitating layout design, and improving performance.

[0170] refer to Figure 26 As shown, the electronic device may include one or more of the following components: processing component 101, memory 102, power component 103, multimedia component 104, audio component 105, input / output (I / O) interface 106, sensor component 107, and communication component 108.

[0171] Processing component 101 typically controls the overall operation of an electronic device, such as operations associated with display, telephone calls, data communication, camera operation, and recording. Processing component 101 may include one or more processors 109 to execute instructions to perform all or part of the steps of the methods described above. Furthermore, processing component 101 may include one or more modules to facilitate interaction between processing component 101 and other components. For example, processing component 101 may include a multimedia module to facilitate interaction between multimedia component 104 and processing component 101.

[0172] Memory 102 is configured to store various types of data to support the operation of the electronic device. Examples of such data include instructions for any application or method used to operate on the electronic device, contact data, phonebook data, messages, pictures, videos, etc. Memory 102 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0173] Power component 103 provides power to various components of the electronic device. Power component 103 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to the electronic device.

[0174] Multimedia component 104 includes a screen that provides an output interface between the electronic device and the user. In some embodiments, the screen may include a display and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touchscreen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors may sense not only the boundaries of touch or swipe actions but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 104 includes a front-facing camera and / or a rear-facing camera. When the electronic device is in an operating mode, such as a shooting mode or a video mode, the front-facing camera and / or the rear-facing camera may receive external multimedia data. Each front-facing camera and rear-facing camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0175] Audio component 105 is configured to output and / or input audio signals. For example, audio component 105 includes a microphone (MIC) configured to receive external audio signals when the electronic device is in an operating mode, such as call mode, recording mode, and voice recognition mode. The received audio signals may be further stored in memory 102 or transmitted via communication component 108. In some embodiments, audio component 105 also includes a speaker for outputting audio signals.

[0176] I / O interface 106 provides an interface between processing component 101 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to, home buttons, volume buttons, power buttons, and lock buttons.

[0177] Sensor assembly 107 includes one or more sensors for providing state assessments of various aspects of the electronic device. For example, sensor assembly 107 can detect the on / off state of the electronic device, the relative positioning of components such as the display and keypad of the electronic device, changes in the position of the electronic device or a component of the electronic device, the presence or absence of user contact with the electronic device, the orientation or acceleration / deceleration of the electronic device, and temperature changes of the electronic device. Sensor assembly 107 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 107 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, sensor assembly 107 may also include an accelerometer, a gyroscope, a magnetometer, a pressure sensor, or a temperature sensor.

[0178] Communication component 108 is configured to facilitate wired or wireless communication between electronic devices and other devices. Devices can access wireless networks based on communication standards, such as WiFi, 2G, or 3G, or combinations thereof. In one exemplary embodiment, communication component 108 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, communication component 108 also includes a near-field communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on radio frequency identification (RFID) technology, Infrared Data Association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0179] In an exemplary embodiment, the electronic device may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components.

[0180] Other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of the invention are indicated by the following claims.

[0181] It should be understood that the present invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A circuit board assembly, characterized in that, The circuit board assembly includes a first circuit board and an integrated assembly, the integrated assembly including: The second circuit board includes a first surface and a second surface that are opposite to each other, and the second surface is disposed opposite to the first circuit board. An electrical connection portion is disposed on the second surface, the second circuit board is supported on the first circuit board through the electrical connection portion and is electrically connected to the first circuit board, and there is an accommodating space between the second surface and the first circuit board, and at least one built-in electrical component is disposed in the accommodating space; At least one optoelectronic device is disposed on the first surface and is electrically connected to the second circuit board.

2. The circuit board assembly according to claim 1, characterized in that, Each of the aforementioned built-in electrical components is disposed on the second surface; or, Each of the aforementioned built-in electrical components is disposed on the first circuit board; or, Some of the built-in electrical components are disposed on the second surface, and some of the built-in electrical components are disposed on the first circuit board.

3. The circuit board assembly according to claim 1, characterized in that, The integrated component also includes a first molding compound, which is used to mold the optoelectronic device, and the first molding compound is transparent.

4. The circuit board assembly according to claim 1, characterized in that, The circuit board assembly also includes a second molding compound for molding the built-in electrical components.

5. The circuit board assembly according to any one of claims 1 to 4, characterized in that, The optoelectronic device includes a photosensitive chip and at least one light-emitting diode.

6. The circuit board assembly according to any one of claims 1 to 4, characterized in that, The built-in electrical components include integrated circuit chips and / or passive devices.

7. The circuit board assembly according to any one of claims 1 to 4, characterized in that, The electrical connection includes solder balls or an adapter plate.

8. The circuit board assembly according to any one of claims 1 to 4, characterized in that, The circuit board assembly further includes external electrical components disposed on the first circuit board. The external electrical components and the integrated assembly are disposed on the same side of the first circuit board, and the external electrical components are located outside the accommodating space. The external electrical components include packaged devices and / or unpackaged devices.

9. The circuit board assembly according to claim 8, characterized in that, The second molding compound used for molding the built-in electrical components is also used for molding the packaged device; or... The circuit board assembly also includes a third molding compound for molding the packaged device.

10. The circuit board assembly according to claim 9, characterized in that, The unpackaged device includes a microphone and / or a power interface.

11. An electronic device, characterized in that, The electronic device includes a circuit board assembly as described in any one of claims 1 to 10.

12. The electronic device according to claim 11, characterized in that, The electronic device is a wearable device.

13. A method for manufacturing a circuit board assembly, characterized in that, The method for manufacturing the circuit board assembly includes: Provide the first circuit board; An integrated assembly is formed, the integrated assembly including a second circuit board, at least one optoelectronic device disposed on a first surface of the second circuit board, and an electrical connection portion disposed on a second surface of the second circuit board; The second circuit board is supported on the first circuit board and electrically connected to the first circuit board through the electrical connection part, and the optoelectronic device is located on a first surface of the second circuit board away from the first circuit board. There is an accommodating space between the second surface and the first circuit board, and at least one built-in electrical device is disposed in the accommodating space.

14. The method for manufacturing a circuit board assembly according to claim 13, characterized in that, The formation of the integrated component includes: Provide circuit board motherboard; A plurality of the optoelectronic devices are disposed on one side of the circuit board motherboard; Multiple electrical connection parts are provided on the other side of the circuit board motherboard to obtain an integrated motherboard; The integrated motherboard is cut to obtain multiple integrated components.

15. The method for manufacturing a circuit board assembly according to claim 14, characterized in that, The other side of the circuit board motherboard is provided with multiple electrical connection parts. Before obtaining the integrated motherboard, the process of forming the integrated assembly further includes: The plurality of optoelectronic devices are encapsulated with a first molding compound, which is transparent.

16. The method for manufacturing a circuit board assembly according to claim 14, characterized in that, Before cutting the integrated motherboard, the forming of the integrated assembly further includes: Multiple built-in electrical components are formed on the other side of the circuit board motherboard.

17. The method for manufacturing a circuit board assembly according to claim 16, characterized in that, The formation of the integrated component also includes: The built-in electrical components are encapsulated with a second molding compound.

18. A method for manufacturing a circuit board assembly according to any one of claims 13 to 16, characterized in that, Before supporting the second circuit board on the first circuit board via the electrical connection portion, the method of manufacturing the circuit board assembly further includes: At least one of the built-in electrical components is disposed in a preset area of ​​the first circuit board, such that after the second circuit board is supported on the first circuit board, each of the built-in electrical components in the preset area is located within the accommodating space.

19. The method for manufacturing a circuit board assembly according to claim 18, characterized in that, The method for manufacturing the circuit board assembly further includes: An external electrical device is formed on the first circuit board. The external electrical device and the integrated component are located on the same side of the first circuit board, and the external electrical device is located outside the accommodating space. The external electrical device includes packaged devices and / or unpackaged devices.

20. The method for manufacturing a circuit board assembly according to claim 19, characterized in that, The method for manufacturing the circuit board assembly further includes: The encapsulated device and the built-in electrical components are integrally encapsulated using a second molding compound; or... The packaged device is encapsulated with a third molding compound.

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