A power device, a power device control method, and a photovoltaic system

Abstract

This invention discloses a power device, a power device control method, and a photovoltaic system, relating to the field of power electronics technology. The power device includes a device housing and at least one integrated inductor embedded in the device housing; it also includes an internal heat dissipation component and an external heat dissipation component respectively located on the inner and outer sides of the device housing. The internal heat dissipation component is fixed to the air inlet end of the internal heat dissipation duct of the integrated inductor; the integrated inductor is fixed to the air inlet or outlet of the external heat dissipation component. The integrated inductor includes external heat dissipation fins and internal heat dissipation fins respectively located on the inner and outer sides of the device housing. The external heat dissipation fins dissipate heat to the outside of the device housing, and the internal heat dissipation fins dissipate heat to the inside of the device housing through the external heat dissipation fins. The internal heat dissipation component, the external heat dissipation component, and the integrated inductor of this invention together constitute a composite heat dissipation structure with internal and external dual paths, improving heat dissipation efficiency while enhancing the structural compactness of the power device.

Description

Technical Field

[0001] This invention relates to the field of power electronics technology, and in particular to a power device, a power device control method, and a photovoltaic system. Background Technology

[0002] Taking the photovoltaic industry as an example, power devices such as inverters and energy storage converters are developing towards higher power density and more compact size. As power output continues to increase, internal losses within these devices also increase, while the internal space of the device casing becomes increasingly limited, leading to ever-increasing heat dissipation pressure. Against this backdrop, how to achieve efficient control of internal temperature rise within a limited space has become a key technological challenge that the photovoltaic industry and even the entire power electronics field urgently need to overcome.

[0003] Typically, to address the temperature rise issue, a heat exchanger 01 is installed independently outside the equipment casing, as shown in the attached diagram. Figure 1 As shown, forced convection enhances heat exchange between the inside and outside of the casing, thus improving the heat dissipation effect of power equipment. However, as the power level of power equipment continues to increase, the heat exchanger installed on the casing, while partially alleviating the heat dissipation pressure, still cannot meet the ever-increasing demand for high heat flux density heat dissipation. This results in the internal temperature of the casing remaining persistently high, directly affecting the reliability and lifespan of key components. Furthermore, the added heat exchanger occupies extra installation space, hindering the overall compact design of the device. Summary of the Invention

[0004] In view of this, the purpose of the present invention is to provide a power device, a power device control method and a photovoltaic system, which together form a composite heat dissipation structure with internal heat dissipation components, external heat dissipation components and integrated inductors to conduct internal heat to the device shell without the need for additional heat exchangers, thereby improving the structural compactness of the power device.

[0005] To achieve the above objectives, the present invention provides a power device, including a device housing and at least one integrated inductor embedded in the device housing; further comprising:

[0006] Internal heat dissipation components are fixed inside the equipment casing; the internal heat dissipation components are fixed at the air inlet end of the internal heat dissipation duct of the integrated inductor.

[0007] External heat dissipation components are fixed to the outside of the equipment housing; integrated inductors are fixed to the air inlet or air outlet of the external heat dissipation components.

[0008] The integrated inductor includes external heat dissipation fins and internal heat dissipation fins located on the inner and outer sides of the device housing, respectively. The external heat dissipation fins are used to dissipate heat from the outside of the device housing, and the internal heat dissipation fins are used to dissipate heat from the inside of the device housing through the external heat dissipation fins.

[0009] In some embodiments, the integrated inductor further includes:

[0010] Inductor body;

[0011] A fixed baffle is fixed to the edge of the embedded hole in the equipment housing;

[0012] The protective cover is fixed to the side of the fixed baffle away from the equipment housing. The protective cover has a receiving cavity for accommodating the inductor body. External heat dissipation fins are formed on the outer surface of the protective cover.

[0013] In some embodiments, the external heat dissipation fins are specifically raised ribs integrally formed on the outer surface of the protective cover.

[0014] In some embodiments, the internal heat dissipation fins are fixed to the side of the fixed baffle away from the protective cover; the internal heat dissipation fins are specifically plate-shaped fins integrally and vertically disposed on the fixed baffle.

[0015] In some embodiments, an external heat dissipation gap is formed between two adjacent external heat dissipation fins; an internal heat dissipation gap is formed between two adjacent internal heat dissipation fins; and the external heat dissipation gap and the internal heat dissipation gap are set at an angle.

[0016] In some embodiments, all integrated inductors are distributed in a straight line, and the external heat dissipation gaps of all integrated inductors are connected to the external heat dissipation channels of the external heat dissipation components to form external heat dissipation ducts; and / or, the internal heat dissipation gaps of all integrated inductors are connected one-to-one to form internal heat dissipation ducts.

[0017] In some embodiments, the end of the protective cover is provided with an accommodating opening, which is connected to the accommodating cavity; the accommodating opening is detachably fixed with an end sealing plate.

[0018] In some embodiments, the external heat dissipation component includes:

[0019] External fixed base plate, which is fixed to the equipment casing;

[0020] External heat-conducting fins are integrally and vertically fixed to an external base plate; an external heat dissipation channel is formed between two adjacent external heat-conducting fins, and the external heat dissipation channel is linearly connected to the external heat dissipation air duct of the integrated inductor.

[0021] An external cooling fan is fixed at the air inlet end of the external cooling channel.

[0022] In some embodiments, it also includes:

[0023] An external protective cover is fixed to one side of the equipment housing and covers both the integrated inductor and the external heat dissipation components. The two ends of the external protective cover are respectively provided with an air inlet and an air outlet.

[0024] In some embodiments, it also includes:

[0025] A temperature sensor is located inside the device housing and is used to detect the internal temperature of the device housing.

[0026] The controller is connected to the temperature sensor, the internal cooling fan, and the external cooling fan.

[0027] When the temperature sensor detects that the internal temperature of the device casing has not reached the first temperature threshold, the temperature sensor sends a signal to the controller. The controller then sends the generated first control command to the internal cooling fan and the external cooling fan respectively, controlling the internal cooling fan to stop and adjusting the speed of the external cooling fan to the first external set speed.

[0028] When the temperature sensor detects that the internal temperature of the device casing is between the first temperature threshold and the second temperature threshold, the temperature sensor sends a signal to the controller. The controller then sends the generated second control command to the internal cooling fan and the external cooling fan respectively, adjusting the speed of the internal cooling fan to the first internal set speed and adjusting the speed of the external cooling fan to the second external set speed.

[0029] When the temperature sensor detects that the internal temperature of the device casing is between the second temperature threshold and the third temperature threshold, the temperature sensor sends a signal to the controller. The controller then sends the generated third control command to the internal cooling fan and the external cooling fan respectively, adjusting the speed of the internal cooling fan to the second internal set speed and adjusting the speed of the external cooling fan to the third external set speed.

[0030] When the temperature sensor detects that the internal temperature of the device casing exceeds the third temperature threshold, the temperature sensor sends a signal to the controller. The controller then sends the generated fourth control command to the internal cooling fan and the external cooling fan respectively, controlling the internal cooling fan to rotate at full speed and adjusting the speed of the external cooling fan to the fourth external set speed.

[0031] The present invention also provides a power device control method, applied to the above-mentioned power device, comprising the following steps:

[0032] Utilizing a temperature sensor to detect the internal temperature of the device's casing;

[0033] Determine whether the internal temperature of the device casing has reached the first temperature threshold. If so, generate a first control command based on the temperature signal fed back by the temperature sensor, and send the first control command to the internal cooling fan and the external cooling fan respectively, control the internal cooling fan to stop, and adjust the speed of the external cooling fan to the first external set speed.

[0034] Determine whether the internal temperature of the device casing is between the first temperature threshold and the second temperature threshold. If so, generate a second control command based on the temperature signal fed back by the temperature sensor, and send the second control command to the internal cooling fan and the external cooling fan respectively. Adjust the speed of the internal cooling fan to the first internal set speed, and adjust the speed of the external cooling fan to the second external set speed.

[0035] Determine whether the internal temperature of the device casing is between the second temperature threshold and the third temperature threshold. If so, generate a third control command based on the temperature signal fed back by the temperature sensor, and send the third control command to the internal cooling fan and the external cooling fan respectively. Adjust the speed of the internal cooling fan to the second internal set speed, and adjust the speed of the external cooling fan to the third external set speed.

[0036] The system determines whether the internal temperature of the device casing exceeds a third temperature threshold. If so, it generates a fourth control command based on the temperature signal fed back by the temperature sensor and sends the fourth control command to both the internal and external cooling fans. The internal cooling fan is controlled to rotate at full speed, and the speed of the external cooling fan is adjusted to a fourth externally set speed. This invention also provides a photovoltaic system including the aforementioned power device.

[0037] Compared with the prior art, the present invention optimizes the power device, and the optimized power device includes an internal heat dissipation component, an external heat dissipation component, and at least one integrated inductor embedded in the device housing.

[0038] The internal heat dissipation components are fixed inside the equipment casing and directly absorb the heat generated by the heat-generating elements during operation. By guiding the airflow inside the equipment in a directional manner, the internal heat is effectively conducted to the equipment casing, preventing local heat accumulation inside the equipment, reducing the adverse effects of high temperature on the sensitive circuits inside the equipment, reducing performance degradation and lifespan reduction caused by overheating, and thus improving the reliability of power equipment.

[0039] The external heat dissipation component is fixed to the outside of the equipment casing. Through an active heat dissipation mechanism, the external heat dissipation component can achieve efficient heat dissipation in complex environments. It dissipates the heat conducted to the equipment casing to the surrounding environment through convection and radiation, which helps to improve the heat dissipation efficiency of the power equipment and extend the service life of the power equipment.

[0040] Integrated inductors perform both electromagnetic and heat dissipation functions. Specifically, integrated inductors include external and internal heat dissipation fins, which together form a highly efficient dual-path heat dissipation structure.

[0041] The external heat dissipation fins are located on the outside of the equipment casing and are directly exposed to the external environment. They can efficiently dissipate heat to the external environment through convection and radiation, thus actively dissipating heat directly to the outside of the equipment casing.

[0042] The internal heat dissipation fins are located inside the equipment casing and form an efficient heat exchange connection with the external heat dissipation fins, constituting a heat conduction path from the inside of the equipment casing to the outside. This allows the internal heat dissipation fins to absorb and conduct the heat generated inside the equipment, and then efficiently guide the heat accumulated inside to the external heat dissipation fins, and finally dissipate it to the external environment, thus achieving auxiliary heat dissipation for the internal environment of the equipment casing.

[0043] This invention employs a highly integrated design, combining internal heat dissipation components, external heat dissipation components, and integrated inductors to form a composite heat dissipation structure with dual internal and external paths. This creates a thermal bridge that runs through the inside and outside of the device, simultaneously meeting the internal and external heat dissipation needs of the device casing. This reduces reliance on additional independent heat exchangers, improving heat dissipation efficiency while enhancing the structural compactness of the power equipment. Attached Figure Description

[0044] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0045] Figure 1 This is a schematic diagram of the internal structure of an existing power device;

[0046] Figure 2 This is an internal schematic diagram of a power device provided in a specific embodiment of the present invention;

[0047] Figure 3 for Figure 1 A diagram of the back of the building;

[0048] Figure 4 for Figure 3 Exploded view of an integrated inductor located at the air inlet of an external heat dissipation component;

[0049] Figure 5 for Figure 3 A schematic diagram of an integrated inductor;

[0050] Figure 6 for Figure 5 Exploded view;

[0051] Figure 7 for Figure 3 An exploded view of an integrated inductor located at the air outlet of an external heat dissipation component.

[0052] The attached figures are labeled as follows:

[0053] Heat exchanger 01;

[0054] Equipment housing 1, integrated inductor 2, internal heat dissipation assembly 3, external heat dissipation assembly 4, external protective cover 5, and temperature sensor 6;

[0055] External heat dissipation fins 21, internal heat dissipation fins 22, inductor body 23, fixing baffle 24, protective cover 25 and end sealing plate 26;

[0056] Accommodating cavity 251 and accommodating opening 252;

[0057] External heat dissipation gap 211;

[0058] Internal heat dissipation gap 221;

[0059] Internal cooling fan 31;

[0060] External fixed base plate 41, external heat-conducting fins 42 and external cooling fan 43;

[0061] Air inlet 51 and air outlet 52 of the cover. Detailed Implementation

[0062] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0063] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0064] This invention discloses a power device, as shown in the attached figure. Figures 1 to 3 As shown, it includes a device housing 1 and at least one integrated inductor 2 embedded in the device housing 1.

[0065] As attached Figure 1 and 2As shown, the device housing 1 includes an outer frame and front and rear cover plates respectively located on both sides of the outer frame, which together form a closed housing cavity. A circuit board is fixedly installed inside the housing cavity, and a power module is integrated on the circuit board. As the core functional component of the entire device, it is the main heat source. The device housing 1 is made of thermally conductive material. The heat generated by the power module is conducted through the circuit board to the inner wall of the device housing 1, and then through the device housing 1 to the external environment.

[0066] Integrated inductor 2 serves both electromagnetic and heat dissipation functions. Specifically, see attached... Figure 5 and 6 As shown, the integrated inductor 2 includes external heat dissipation fins 21 and internal heat dissipation fins 22, which together form a highly efficient dual-path heat dissipation structure.

[0067] As attached Figure 5 and 6 As shown, the external heat dissipation fins 21 are located outside the device housing 1 and are directly exposed to the external environment. They can efficiently dissipate heat to the external environment through convection and radiation, and actively dissipate heat directly to the outside of the device housing 1.

[0068] As attached Figure 5 and 6 As shown, the internal heat dissipation fins 22 are located inside the device housing 1 and form an efficient heat exchange connection with the external heat dissipation fins 21, forming a heat conduction path from the inside to the outside of the device housing 1. This allows the internal heat dissipation fins 22 to absorb and conduct the heat generated inside the device, and then efficiently guide the heat accumulated inside to the external heat dissipation fins 21, and finally dissipate it to the external environment, thus achieving auxiliary heat dissipation of the internal environment of the device housing 1.

[0069] As a preferred embodiment, as shown in the appendix Figure 2 As shown, the power device also includes an internal heat dissipation component 3, which is fixed inside the device housing 1. It directly absorbs the heat generated by the heat-generating element during operation. By guiding the airflow inside the device in a directional manner, the internal heat is effectively conducted to the device housing 1, preventing local heat accumulation inside the device, reducing the adverse effects of high temperature on the sensitive circuits inside the device, reducing performance degradation and lifespan loss caused by overheating, thereby improving the reliability of the power device.

[0070] As attached Figure 2 As shown, the internal heat dissipation component 3 is specifically an internal cooling fan 31. As an active heat dissipation element, the internal cooling fan 31 effectively overcomes the limitations of uneven distribution in natural convection. Through forced convection, the air inside the device flows efficiently through the heat-generating area, thereby improving heat dissipation efficiency and reducing the temperature gradient inside the device at the same time.

[0071] Furthermore, the internal cooling fan 31 is fixed at the air inlet of the internal cooling air duct of the integrated inductor 2, which can establish a clear airflow direction and pressure gradient, ensuring that the airflow flows orderly through the heat dissipation surface of all integrated inductors 2, avoiding disordered diffusion and short circuit of airflow inside the device, and making the heat dissipation efficiency higher.

[0072] As a preferred embodiment, as shown in the appendix Figure 4 As shown, the power device also includes an external heat dissipation component 4, which is fixed to the outside of the device housing 1. Through an active heat dissipation mechanism, the external heat dissipation component 4 can achieve efficient heat dissipation in complex environments, dissipating the heat conducted to the device housing 1 to the surrounding environment through convection and radiation, which helps to improve the heat dissipation efficiency of the power device and extend the service life of the power device.

[0073] As attached Figure 4 and 7 As shown, the integrated inductor 2 is fixed to the air inlet or air outlet of the external heat dissipation component 4, breaking the heat dissipation layout of the internal and external partitions of the transmission, effectively shortening the heat conduction path and improving heat dissipation efficiency.

[0074] As a preferred embodiment, as shown in the appendix Figure 4 As shown, when the integrated inductor 2 is installed at the air outlet, the external heat dissipation component 4 uses the air after heat exchange to perform secondary cooling on the integrated inductor 2, maximizing the utilization of the airflow's heat exchange capacity.

[0075] As a preferred embodiment, as shown in the appendix Figure 7 As shown, when the integrated inductor 2 is installed at the air inlet, the external cold air first flows over the surface of the integrated inductor 2, carrying away the heat before entering the external heat dissipation component 4, thereby achieving enhanced cooling of the integrated inductor 2.

[0076] The present invention arranges the integrated inductor 2 in the external heat dissipation duct, so that the heat dissipation path of the integrated inductor 2 and the external heat dissipation component 4 are combined into one, which not only reduces the number of independent air ducts, but also helps to reduce wind resistance.

[0077] This invention adopts a highly integrated design, integrating the integrated inductor 2 with the device housing 1 to form a composite heat dissipation structure with internal and external dual paths, forming a thermal bridge that runs through the inside and outside of the device. This can simultaneously meet the internal and external heat dissipation needs of the device housing 1, reduce the reliance on additional independent heat exchangers, and improve the heat dissipation efficiency while achieving a more compact structure for the power device.

[0078] As a preferred embodiment, as shown in the appendix Figure 5 and 6As shown, the integrated inductor 2 also includes an inductor body 23, a fixed baffle 24, and a protective cover 25. The function of the inductor body 23 is to periodically store and release magnetic energy in the switching power supply circuit, thereby realizing voltage transformation, smoothing the output current, and limiting the rate of current change. It is not only an energy storage element for energy conversion, but also effectively suppresses current surges.

[0079] The fixing baffle 24 is fixed to the edge of the embedding hole in the equipment housing 1, which not only fixes the integrated inductor 2 to the equipment housing 1, but also prevents the integrated inductor 2 from completely penetrating the equipment housing 1. Preferably, the fixing baffle 24 is detachably fixed to the equipment housing 1 by fastening screws, which facilitates the disassembly and replacement of the integrated inductor 2 and reduces the maintenance difficulty of the power equipment.

[0080] The protective housing 25 is fixed to the side of the fixed baffle 24 away from the equipment housing 1. The protective housing 25 has a receiving cavity 251 for accommodating the inductor body 23, thereby achieving structural protection and environmental isolation for the inductor body 23. The protective housing 25 provides a sealed enclosure for the inductor body 23, effectively preventing the intrusion of dust, moisture, etc., which is beneficial to improving the operational reliability of the integrated inductor 2. External heat dissipation fins 21 are formed on the outer surface of the protective housing 25. While achieving protection, they guide airflow through the protective housing 25, carrying away heat and preventing heat accumulation, thus achieving a balance between protection and heat dissipation.

[0081] As a preferred embodiment, as shown in the appendix Figure 5 and 6 As shown, the external heat dissipation fins 21 are integrally molded and directly disposed on the outer surface of the protective cover 25. Specifically, the external heat dissipation fins 21 are raised ribs integrally disposed on the outer surface of the protective cover 25, eliminating the contact thermal resistance between the traditional additional heat sink and the housing, allowing the heat generated by the integrated inductor 2 during operation to be directly conducted to the external heat dissipation fins 21 through the protective cover 25. In addition, the raised ribs are preferably U-shaped structures, utilizing a continuous undulating shape to significantly increase the effective heat dissipation area, enhance the heat exchange capacity with the air within a limited space, effectively improve the efficiency of natural convection and radiation heat dissipation, and effectively suppress the temperature rise of the inductor.

[0082] Furthermore, the integrated molding process of the external heat dissipation fins 21 avoids continuous weak current and stress concentration that may occur during fastening or welding, making the heat dissipation structure and the protective cover 25 a single unit. This results in higher mechanical strength and stronger resistance to impact and vibration, making it particularly suitable for high-vibration applications. It prevents the heat dissipation fins from loosening or short-circuiting due to long-term vibration, ensuring the reliability of the integrated inductor 2. Crucially, the undulating arrangement of the raised ribs is optimized according to the shape of the protective cover 25 and the internal inductor layout. This improves heat dissipation capacity without requiring additional internal space, facilitating the miniaturization and compact layout of the integrated inductor 2.

[0083] As a preferred embodiment, as shown in the appendix Figure 5 and 6 As shown, the internal heat dissipation fins 22 are fixed to the side of the fixed baffle 24 away from the protective cover 25, so that the internal heat dissipation fins 22 and the external heat dissipation fins 21 are respectively fixed on both sides of the fixed baffle 24. The fixed baffle 24 serves as the medium for heat conduction, forming a complete heat flow path. This bidirectional layout improves the efficiency of heat transfer from the heat source to the external environment and avoids heat accumulation inside. In addition, the fixed baffle 24 serves as a common mounting base for the internal heat dissipation fins 22 and the external heat dissipation fins 21, balancing the distribution of thermal stress caused by temperature changes, reducing the risk of structural deformation or connection failure caused by unilateral overheating, and is suitable for working scenarios with frequent temperature cycles.

[0084] The internal heat dissipation fins 22 are specifically plate-shaped fins that are vertically mounted on the fixed baffle 24. The one-piece molding design can effectively eliminate contact thermal resistance, allowing heat to be directly conducted from the heat-generating element to the fixed baffle 24 through the internal heat dissipation fins 22. This facilitates the uniform diffusion of heat along the height direction of the internal heat dissipation fins 22, avoids the formation of local hot spots, and thus improves heat dissipation efficiency.

[0085] As a preferred embodiment, as shown in the appendix Figure 5 and 6 As shown, an external heat dissipation gap 211 is formed between two adjacent external heat dissipation fins 21 to guide external airflow for convective heat dissipation; an internal heat dissipation gap 221 is formed between two adjacent internal heat dissipation fins 22 to guide airflow within the device. The external heat dissipation gap 211 and the internal heat dissipation gap 221 are set at an angle, preferably perpendicularly, and are physically separated by a fixed baffle 24. This constructs a three-dimensional, efficient heat exchange network, allowing the heat generated inside the device to be collected first by the internal heat dissipation gap 221, and then transmitted vertically to the external heat dissipation gap 211 via the fixed baffle 24. The heat is then dissipated to the external environment through convection and radiation, achieving directional control of the heat flow path from the inside to the outside. This not only makes the overall structure more compact and maximizes the heat dissipation area within a limited device space, but also effectively avoids airflow short-circuiting and heat backflow, thereby improving the stability and reliability of the integrated inductor 2.

[0086] As a preferred embodiment, as shown in the appendix Figure 4 and 7 As shown, all integrated inductors 2 are distributed along a straight line. The external heat dissipation gap 211 of all integrated inductors 2 is connected to the external heat dissipation channel of the external heat dissipation component 4, forming a continuous external heat dissipation air duct. This guides the external airflow to flow continuously along a straight line through the heat dissipation surface of all integrated inductors 2, avoiding airflow dispersion or local stagnation, thereby achieving balanced heat dissipation for multiple integrated inductors 2.

[0087] And / or, the internal heat dissipation gaps 221 of all integrated inductors 2 are connected one-to-one, forming a continuous internal heat dissipation airflow channel, allowing hot air inside the device to pass through all integrated inductors 2 in an orderly manner, enhancing the uniformity of heat exchange inside the device. Both the external and internal heat dissipation airflow channels are continuous straight airflow channels, which improves the airflow path and reduces airflow resistance, thereby improving airflow efficiency.

[0088] This invention arranges all integrated inductors 2 along a straight line to establish an efficient heat dissipation airflow organization among multiple integrated inductors 2, which not only improves heat dissipation capacity but also facilitates compact design.

[0089] As a preferred embodiment, as shown in the appendix Figure 6 As shown, the protective housing 25 has an opening 252 at its end, which is connected to the receiving cavity 251. This provides a direct installation and removal channel for the inductor body 23 and its internal heat dissipation, allowing the inductor body 23 to be replaced without completely disassembling the protective housing 25. The opening 252 is detachably fitted with an end cover 26, which effectively prevents external dust, moisture, and other foreign objects from entering the protective housing 25, while also allowing for convenient replacement without disassembly, thereby reducing the maintenance difficulty and time cost of the integrated inductor 2.

[0090] As a preferred embodiment, as shown in the appendix Figure 4 As shown, the external heat dissipation assembly 4 includes an external fixed base plate 41, external heat-conducting fins 42, and an external cooling fan 43.

[0091] The external fixed base plate 41 is fixed to the equipment shell 1 as a mounting base, which conducts the heat of the equipment shell 1 to the external heat-conducting fins 42. The external heat-conducting fins 42 are integrally and vertically fixed to the external fixed base plate 41, providing the maximum effective heat dissipation area perpendicular to the airflow direction, and utilizing the three-dimensional space outside the equipment to enhance the heat dissipation capacity without increasing the horizontal projected area of ​​the power equipment.

[0092] An external heat dissipation channel is formed between two adjacent external heat-conducting fins 42. The external heat dissipation channel is linearly connected to the external heat dissipation air duct of the integrated inductor 2, constructing a continuous airflow path from the heating surface of the integrated inductor 2 to the external environment. This straight-through design eliminates the turning point of the airflow at the junction, allowing the cooling air to flow undisturbed through the heating surface of the integrated inductor 2 and the heat dissipation surface of the external heat dissipation fins 21 in sequence. This effectively reduces the airflow resistance along the path and the local resistance, and improves the cooling efficiency per unit air volume.

[0093] The external cooling fan 43, as the power source for forced convection cooling, is installed at the air inlet of the external cooling channel. It actively draws external cold air into the channel by generating negative pressure, overcoming the limitations of small and unstable natural convection airflow. Through directional drive, it ensures that the airflow forms a high-speed flow from the air inlet to the air outlet, so that the airflow fully covers the inductor surface and all external heat-conducting fins 42, enhances the convection heat transfer effect, and effectively prevents heat from accumulating in local areas.

[0094] As a preferred embodiment, as shown in the appendix Figure 3 and 4 As shown, the power device also includes an external protective housing 5, which is fixed to one side of the device housing 1 and completely covers both the integrated inductor 2 and the external heat dissipation component 4, effectively preventing foreign objects from entering and improving the safety of the power device's operation. At the same time, the protective housing 25 confines the high-frequency electromagnetic noise generated by the integrated inductor 2 within the housing 25, reducing radiation interference to external devices, blocking external electromagnetic interference from entering, and ensuring the stable operation of all components inside the device.

[0095] As attached Figures 2 to 4 As shown, the outer protective cover 5 has an air inlet 51 and an air outlet 52 at both ends, which are precisely aligned with the external heat dissipation air duct. This forces the external cooling air to flow directionally through the integrated inductor 2 and the external heat dissipation fins 21, creating an efficient heat dissipation path. This effectively prevents the airflow from spreading disorderly around the power equipment and improves heat dissipation efficiency.

[0096] As a preferred embodiment, as shown in the appendix Figure 2 As shown, the power device also includes a temperature sensor 6 and a controller. The temperature sensor 6 is located inside the device housing 1 and integrated on the circuit board, used to detect the internal temperature of the device housing 1. The controller is connected to the temperature sensor 6, the internal cooling fan 31 and the external cooling fan 43 respectively, and realizes fine-grained hierarchical control of the heat dissipation strategy based on the real-time temperature.

[0097] The first level is the low-temperature mode: When the temperature sensor 6 detects that the internal temperature of the device casing 1 has not reached the first temperature threshold, the temperature sensor 6 sends a signal to the controller. The controller then sends the generated first control command to the internal cooling fan 31 and the external cooling fan 43, respectively, controlling the internal cooling fan 31 to stop and adjusting the speed of the external cooling fan 43 to the first externally set speed. In this mode, the internal temperature of the power device is low, the internal cooling fan 31 stops, and only the external cooling fan 43 maintains basic ventilation, minimizing energy consumption, preventing internal dust accumulation, and meeting the heat dissipation requirements under low load.

[0098] The second level is the medium-temperature mode: When the temperature sensor 6 detects that the internal temperature of the device casing 1 is between the first and second temperature thresholds, the temperature sensor 6 sends a signal to the controller. The controller then sends the generated second control commands to the internal cooling fan 31 and the external cooling fan 43, adjusting the speed of the internal cooling fan 31 to the first internal preset speed and adjusting the speed of the external cooling fan 43 to the second external preset speed. In this mode, the internal temperature of the power device rises, and the internal cooling fan 31 and the external cooling fan 43 work together to achieve a balance between heat dissipation capacity and power consumption, ensuring stable temperature control.

[0099] The third level is the high-temperature mode: When the temperature sensor 6 detects that the internal temperature of the device casing 1 is between the second and third temperature thresholds, the temperature sensor 6 sends a signal to the controller. The controller then sends the generated third control command to the internal cooling fan 31 and the external cooling fan 43, adjusting the speed of the internal cooling fan 31 to the second internal set speed and adjusting the speed of the external cooling fan 43 to the third external set speed. In this mode, the internal temperature of the power device is high. By simultaneously increasing the speeds of both the internal cooling fan 31 and the external cooling fan 43, the forced convection cooling intensity is enhanced, effectively suppressing temperature rise and ensuring stable operation of the power device under high loads.

[0100] The fourth level is the extreme mode: When temperature sensor 6 detects that the internal temperature of the device casing 1 exceeds the third temperature threshold, temperature sensor 6 sends a signal to the controller. The controller then sends the generated fourth control command to the internal cooling fan 31 and the external cooling fan 43, controlling the internal cooling fan 31 to run at full speed and adjusting the speed of the external cooling fan 43 to the fourth externally set speed. In this mode, the internal temperature of the power device is at an extremely high temperature. The internal cooling fan 31 runs at full speed, and the speed of the external cooling fan 43 is increased to the highest safe speed, activating maximum heat dissipation capacity to fully control the temperature of the power device, prevent overheat protection from being triggered, and ensure that the power device has short-term overload capacity.

[0101] Based on real-time temperature multi-level feedback control, the operating temperature of power equipment can be maintained more accurately within the ideal range, avoiding drastic temperature fluctuations and responding in advance to potential overheating risks. This achieves dynamic matching between heat dissipation power consumption and heat dissipation demand, avoiding energy waste caused by fans running at full speed all year round, and maintaining low-noise operation under medium and low load conditions, thereby improving the overall energy efficiency and reliability of power equipment.

[0102] The first internal set speed mentioned in the text refers to the internal cooling fan 31 being set to operate at a 50% duty cycle, meaning that the internal cooling fan 31 is running for half the time and stops rotating for the other half of the time.

[0103] The second internal speed setting mentioned in the text refers to the internal cooling fan 31 being set to operate with an 80% duty cycle. This means that within a complete control cycle, the internal cooling fan 31 is powered on and running 80% of the time, and only stopped 20% of the time. Compared to the 50% duty cycle setting, this mode allows the fan to run for a longer period and has a stronger cooling capacity, enabling it to meet the cooling needs of higher loads or temperatures.

[0104] The first external set speed in the text is defined as the basic guaranteed speed A, and its corresponding duty cycle is 70%. This means that in the external control mode, the external cooling fan 43 is set at a relatively high basic operating level, keeping it powered on and running for 70% of the time period, and only in a power-off and stopped state for 30% of the time, so as to ensure that the power equipment obtains stable heat dissipation under the set conditions.

[0105] The second external set speed mentioned in the text corresponds to a duty cycle of A+10% duty, which means that the duty cycle is increased by 10% based on the guaranteed speed A. When the second external device speed reaches 80% duty, the external cooling fan 43 is in a powered-on state for 80% of the time and in a stopped state for only 20% of the time in a complete control cycle. By extending the operating percentage, the external cooling fan 43 keeps running for more time, thereby providing stronger heat dissipation capacity.

[0106] The third external set speed mentioned in the text corresponds to a duty cycle of A+20% duty, which means that the duty cycle is increased by 20% on the basis of the guaranteed speed A. When the speed of the third external device reaches 90% duty, the external cooling fan 43 is in a powered-on state for 90% of the time and in a stopped state for only 10% of the time in a complete control cycle. By extending the operating percentage, the external cooling fan 43 can keep running for more time and obtain stronger continuous heat dissipation capacity.

[0107] The fourth external speed setting mentioned in the text corresponds to a duty cycle of A+30% duty, which means that the duty cycle is based on the guaranteed speed A plus a 30% duty cycle. When the speed of the fourth external device reaches 100% duty cycle, the external cooling fan 43 keeps running at full speed within a complete control cycle, providing maximum heat dissipation capacity.

[0108] The full name of the "duty" in the text is "Duty Cycle," which is called "duty ratio" in Chinese.

[0109] The present invention also provides a power device control method, applied to the above-mentioned power device, comprising the following steps:

[0110] Utilizing a temperature sensor to detect the internal temperature of the device's casing;

[0111] Determine whether the internal temperature of the device casing has reached the first temperature threshold. If so, generate a first control command based on the temperature signal fed back by the temperature sensor, and send the first control command to the internal cooling fan and the external cooling fan respectively, control the internal cooling fan to stop, and adjust the speed of the external cooling fan to the first external set speed.

[0112] Determine whether the internal temperature of the device casing is between the first temperature threshold and the second temperature threshold. If so, generate a second control command based on the temperature signal fed back by the temperature sensor, and send the second control command to the internal cooling fan and the external cooling fan respectively. Adjust the speed of the internal cooling fan to the first internal set speed, and adjust the speed of the external cooling fan to the second external set speed.

[0113] Determine whether the internal temperature of the device casing is between the second temperature threshold and the third temperature threshold. If so, generate a third control command based on the temperature signal fed back by the temperature sensor, and send the third control command to the internal cooling fan and the external cooling fan respectively. Adjust the speed of the internal cooling fan to the second internal set speed, and adjust the speed of the external cooling fan to the third external set speed.

[0114] The system determines whether the internal temperature of the device casing exceeds a third temperature threshold. If so, it generates a fourth control command based on the temperature signal from the temperature sensor and sends this command to both the internal and external cooling fans. The internal cooling fan is controlled to run at full speed, and the external cooling fan's speed is adjusted to a fourth externally set speed. This invention, by introducing a multi-level feedback control mechanism, maintains the operating temperature of the power device within an ideal range, achieving dynamic matching between heat dissipation power consumption and real-time heat dissipation requirements. This avoids energy waste caused by fans running at full speed year-round and maintains low-noise operation under low-to-medium load conditions, thereby improving the overall energy efficiency and reliability of the power device.

[0115] The present invention also provides a photovoltaic system including the above-described power device, which has the same beneficial effects.

[0116] It should be noted that in this specification, relational terms such as first and second are used only to distinguish one entity from several other entities, and do not necessarily require or imply any such actual relationship or order between these entities.

[0117] This article uses specific examples to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of the present invention. It should be noted that those skilled in the art can make several improvements and modifications to the present invention without departing from the principles of the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. A power device, characterized in that, Includes a device housing (1) and at least one integrated inductor (2) embedded in the device housing (1); also includes: An internal heat dissipation component (3) is fixed inside the housing (1) of the device; the internal heat dissipation component (3) is fixed at the air inlet of the internal heat dissipation duct of the integrated inductor (2); An external heat dissipation component (4) is fixed to the outside of the device housing (1); the integrated inductor (2) is fixed to the air inlet or air outlet of the external heat dissipation component (4). The integrated inductor (2) includes an external heat dissipation fin (21) and an internal heat dissipation fin (22) located on the inner and outer sides of the device housing (1), respectively. The external heat dissipation fin (21) is used to dissipate heat from the outside of the device housing (1), and the internal heat dissipation fin (22) is used to dissipate heat from the inside of the device housing (1) through the external heat dissipation fin (21).

2. The power device according to claim 1, characterized in that, The integrated inductor (2) also includes: Inductor body (23); A fixed baffle (24) is fixed to the edge of the embedded hole of the equipment housing (1); The protective cover (25) is fixed to the fixed baffle (24) on the side away from the equipment housing (1). The protective cover (25) is provided with a receiving cavity (251) for receiving the inductor body (23). The external heat dissipation fins (21) are formed on the outer surface of the protective cover (25).

3. The power device according to claim 2, characterized in that, The external heat dissipation fins (21) are specifically raised ribs integrally provided on the outer surface of the protective cover (25).

4. The power device according to claim 3, characterized in that, The internal heat dissipation fins (22) are fixed on the side of the fixed baffle (24) away from the protective cover (25); the internal heat dissipation fins (22) are specifically plate-shaped fins that are integrally and vertically disposed on the fixed baffle (24).

5. The power device according to claim 4, characterized in that, An external heat dissipation gap (211) is formed between two adjacent external heat dissipation fins (21); an internal heat dissipation gap (221) is formed between two adjacent internal heat dissipation fins (22); the external heat dissipation gap (211) and the internal heat dissipation gap (221) are set at an angle.

6. The power device according to claim 5, characterized in that, All the integrated inductors (2) are distributed in a straight line, and the external heat dissipation gaps (211) of all the integrated inductors (2) are connected to the external heat dissipation channels of the external heat dissipation components (4) to form an external heat dissipation air duct; and / or, the internal heat dissipation gaps (221) of all the integrated inductors (2) are connected one-to-one to form an internal heat dissipation air duct.

7. The power device according to claim 2, characterized in that, The protective cover (25) has an opening (252) at its end, which is connected to the receiving cavity (251); the opening (252) is detachably fixed with an end sealing plate (26).

8. The power device according to claim 1, characterized in that, The external heat dissipation component (4) includes: An external fixed base plate (41) is fixed to the outer casing (1) of the equipment. External heat-conducting fins (42) are integrally and vertically fixed to the external fixed base plate (41); an external heat dissipation channel is formed between two adjacent external heat-conducting fins (42), and the external heat dissipation channel is linearly connected to the external heat dissipation air duct of the integrated inductor (2); An external cooling fan (43) is fixed to the air inlet end of the external cooling channel.

9. The power device according to claim 8, characterized in that, Also includes: An external protective cover (5) is fixed to one side of the equipment housing (1) and covers the outside of the integrated inductor (2) and the external heat dissipation assembly (4); the two ends of the external protective cover (5) are respectively provided with a cover air inlet (51) and a cover air outlet (52).

10. The power device according to claim 1, characterized in that, Also includes: Temperature sensor (6), the temperature sensor (6) is disposed inside the device housing (1) and is used to detect the internal temperature of the device housing (1); The controller is connected to the temperature sensor (6), the internal cooling fan (31) of the internal heat dissipation assembly (3), and the external cooling fan (43) of the external heat dissipation assembly (4); When the temperature sensor (6) detects that the internal temperature of the device housing (1) has not reached the first temperature threshold, the temperature sensor (6) sends a signal to the controller, and the controller sends the generated first control command to the internal cooling fan (31) and the external cooling fan (43) respectively, controls the internal cooling fan (31) to stop, and adjusts the speed of the external cooling fan (43) to the first external set speed; When the temperature sensor (6) detects that the internal temperature of the device housing (1) is between the first temperature threshold and the second temperature threshold, the temperature sensor (6) sends a signal to the controller, and the controller sends the generated second control command to the internal cooling fan (31) and the external cooling fan (43) respectively, adjusting the speed of the internal cooling fan (31) to the first internal set speed and adjusting the speed of the external cooling fan (43) to the second external set speed; When the temperature sensor (6) detects that the internal temperature of the device housing (1) is between the second temperature threshold and the third temperature threshold, the temperature sensor (6) sends a signal to the controller, and the controller sends the generated third control command to the internal cooling fan (31) and the external cooling fan (43) respectively, adjusting the speed of the internal cooling fan (31) to the second internal set speed, and adjusting the speed of the external cooling fan (43) to the third external set speed; When the temperature sensor (6) detects that the internal temperature of the device housing (1) exceeds the third temperature threshold, the temperature sensor (6) sends a signal to the controller, and the controller sends the generated fourth control command to the internal cooling fan (31) and the external cooling fan (43) respectively, controls the internal cooling fan (31) to rotate at full speed, and adjusts the speed of the external cooling fan (43) to the fourth external set speed.

11. A power device control method, characterized in that, Applied to the power device according to any one of claims 1 to 10, the steps include: Utilizing a temperature sensor to detect the internal temperature of the device's casing; Determine whether the internal temperature of the device casing has reached a first temperature threshold. If so, generate a first control command based on the temperature signal fed back by the temperature sensor, and send the first control command to the internal cooling fan and the external cooling fan respectively, control the internal cooling fan to stop, and adjust the speed of the external cooling fan to a first external set speed. Determine whether the internal temperature of the device casing is between a first temperature threshold and a second temperature threshold. If so, generate a second control command based on the temperature signal fed back by the temperature sensor, and send the second control command to the internal cooling fan and the external cooling fan respectively. Adjust the speed of the internal cooling fan to a first internal set speed, and adjust the speed of the external cooling fan to a second external set speed. Determine whether the internal temperature of the device casing is between the second temperature threshold and the third temperature threshold. If so, generate a third control command based on the temperature signal fed back by the temperature sensor, and send the third control command to the internal cooling fan and the external cooling fan respectively. Adjust the speed of the internal cooling fan to the second internal set speed, and adjust the speed of the external cooling fan to the third external set speed. If the internal temperature of the device casing exceeds a third temperature threshold, a fourth control command is generated based on the temperature signal fed back by the temperature sensor. The fourth control command is then sent to the internal cooling fan and the external cooling fan respectively, controlling the internal cooling fan to rotate at full speed and adjusting the speed of the external cooling fan to a fourth external set speed.

12. A photovoltaic system, characterized in that, Includes the power device as described in any one of claims 1 to 10.

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