Display panels and electronic devices

Abstract

This disclosure relates to display panels and electronic devices. The display panel includes: a planarization layer; a plurality of raised portions disposed on the planarization layer and spaced apart from each other, wherein the upper surface of each of the plurality of raised portions includes a first raised surface; a raised insulating layer covering the plurality of raised portions and including an upper surface, the upper surface of the raised insulating layer including a plurality of second raised surfaces corresponding to the plurality of raised portions; and a pixel electrode disposed on the raised insulating layer and including an upper surface, the upper surface of the pixel electrode including a plurality of third raised surfaces corresponding to the plurality of second raised surfaces.

Description

[0001] Cross-references to related applications

[0002] This application is based on and claims priority to Korean Patent Application No. 10-2024-0176723, filed on December 2, 2024, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] This disclosure relates to display panels and electronic devices, and more specifically, to display panels that reduce brightness reduction in the lateral direction and electronic devices including display panels. Background Technology

[0004] Display panels are already used in various electronic devices. To improve user convenience, it is necessary to enhance visibility not only in the front direction but also in the lateral direction. Summary of the Invention

[0005] However, in display panels and electronic devices including display panels in the relevant field, when the display panel and electronic devices including display panels are viewed in the horizontal direction, the brightness of the displayed image is low and the visibility is poor.

[0006] One or more embodiments include a display panel that reduces brightness reduction in the lateral direction and an electronic device including the display panel. However, such technical objectives are merely examples, and this disclosure is not limited thereto.

[0007] Additional aspects will be set forth in part in the description which follows, and will also be apparent in part from the description, or may be learned by practice of the embodiments of this disclosure.

[0008] According to one or more embodiments, a display panel includes: a planarization layer; a plurality of raised portions disposed on the planarization layer and spaced apart from each other. Each of the plurality of raised portions has an upper surface including a first raised surface; a raised insulating layer covering the plurality of raised portions and including the upper surface, the upper surface of the raised insulating layer including a plurality of second raised surfaces corresponding to the plurality of raised portions; and a pixel electrode disposed on the raised insulating layer and including the upper surface, the upper surface of the pixel electrode including a plurality of third raised surfaces corresponding to the plurality of second raised surfaces.

[0009] The multiple protrusions may include organic materials.

[0010] The raised insulating layer may include inorganic materials.

[0011] The pixel electrode can extend to the outside of the raised insulating layer, and the pixel electrode is electrically connected to a thin-film transistor disposed below the planarization layer through a contact hole in the planarization layer.

[0012] The display panel may also include a pixel defining layer, which includes an opening around the central portion of the pixel electrode and is disposed on the planarization layer to cover the edges of the pixel electrode.

[0013] In a plan view, multiple protrusions can be positioned within an opening.

[0014] In a plan view, some of the multiple protrusions can be positioned outside the opening.

[0015] The display panel may also include a connector area positioned between a plurality of protrusions that connect the protrusions to each other, and the connector area having a thickness smaller than the maximum height of each of the plurality of protrusions.

[0016] Multiple protrusions and connector areas can be integrated into a single unit.

[0017] The taper angle at the edge of each of the multiple protrusions relative to the upper surface of the planarization layer is approximately 25° to approximately 35°.

[0018] In a plan view, each of the multiple protrusions can have a circular shape.

[0019] The diameter of a circular shape can be from about 2 μm to about 10 μm.

[0020] The thickness of the raised insulating layer can be from about 0.5 μm to about 2 μm.

[0021] In a plan view, each of the multiple protrusions can have a shape that extends in one direction.

[0022] In a planar diagram, the area of ​​each of the plurality of second raised surfaces can be larger than the area of ​​the first raised surface.

[0023] According to one or more embodiments, an electronic device includes one or more processors, and a display panel is controlled by one or more processors, wherein the display panel includes: a planarization layer; a plurality of protrusions disposed on the planarization layer and spaced apart from each other, wherein an upper surface of each of the plurality of protrusions includes a first protruding surface, a protrusion insulating layer covers the plurality of protrusions and includes the upper surface, the upper surface of the protrusion insulating layer includes a plurality of second protruding surfaces corresponding to the plurality of protrusions; and a pixel electrode disposed on the protrusion insulating layer and including the upper surface, the upper surface of the pixel electrode including a plurality of third protruding surfaces corresponding to the plurality of second protruding surfaces.

[0024] The multiple protrusions may include organic materials.

[0025] The raised insulating layer may include inorganic materials.

[0026] The display panel may also include a pixel defining layer, which includes an opening around the central portion of the pixel electrode and is disposed on the planarization layer to cover the edges of the pixel electrode.

[0027] In a plan view, multiple protrusions can be positioned within an opening.

[0028] The display panel may also include a connector area positioned between a plurality of protrusions that connect the protrusions to each other, and the connector area having a thickness smaller than the maximum height of each of the plurality of protrusions.

[0029] Multiple protrusions and connector areas can be integrated into a single unit.

[0030] The taper angle at the edge of each of the multiple protrusions relative to the upper surface of the planarization layer is approximately 25° to approximately 35°.

[0031] In a plan view, the area of ​​each of the multiple second protrusions can be larger than the area of ​​the first protrusion.

[0032] Other aspects, features and advantages will become apparent from the detailed description, claims and drawings, in order to implement this disclosure below. Attached Figure Description

[0033] The above and other aspects, features and advantages of specific embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0034] Figure 1 This is a schematic block diagram of an electronic device according to an embodiment;

[0035] Figure 2 This is a schematic diagram of an electronic device according to aspects of this disclosure;

[0036] Figure 3 This is a schematic diagram illustrating an example of a wearable electronic device as an electronic device according to aspects of this disclosure;

[0037] Figure 4 This is a schematic diagram illustrating an example of a vehicle electronic device as an electronic device according to aspects of this disclosure;

[0038] Figure 5 This is a schematic plan view of a display module including a display panel according to aspects of this disclosure;

[0039] Figure 6 Based on the aspects of this disclosure Figure 5 A schematic side view of the display module;

[0040] Figure 7 It is in accordance with aspects of this disclosure along Figure 5The line A-A' intercepts Figure 5 A schematic cross-sectional view of the display panel;

[0041] Figure 8 This is a schematic cross-sectional view of the display panel according to aspects of this disclosure;

[0042] Figure 9 This is a schematic cross-sectional view of the display panel according to aspects of this disclosure;

[0043] Figure 10 This is a schematic cross-sectional view of the display panel according to aspects of this disclosure;

[0044] Figure 11 This is a schematic plan view of a portion of the display panel according to aspects of this disclosure;

[0045] Figure 12 This is a schematic plan view of a portion of the display panel according to aspects of this disclosure;

[0046] Figure 13 A schematic cross-sectional view of a portion of a display panel according to aspects of this disclosure; and

[0047] Figures 14 to 17 This is a schematic cross-sectional view illustrating the operation of manufacturing a display panel according to aspects of this disclosure. Detailed Implementation

[0048] Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings, wherein the same reference numerals refer to the same elements throughout. In this respect, the presented embodiments may have different forms and should not be construed as limited to the description set forth herein. Therefore, embodiments are described below only by reference to the accompanying drawings to illustrate aspects of this description. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Throughout this disclosure, the expression “at least one of a, b, and c” indicates only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0049] Because this disclosure allows for various modifications and numerous embodiments, specific embodiments will be shown in the accompanying drawings and described in the written description. The effects and features of this disclosure, as well as methods for achieving these effects and features, will be illustrated with reference to the embodiments described below with reference to the accompanying drawings. However, this disclosure is not limited to the embodiments described below and can be implemented in various forms.

[0050] In the following description, embodiments will be described with reference to the accompanying drawings, wherein the same reference numerals always refer to the same elements and repeated descriptions thereof are omitted.

[0051] As used herein, when various elements such as layers, zones, plates, etc., are disposed "on" another element, these elements can not only be disposed "directly" "on" the other element, but also the other element can be disposed between said element and said other element. Furthermore, in the accompanying drawings, the dimensions of elements may be exaggerated or reduced for ease of illustration. As an example, the dimensions and thicknesses of each element shown in the drawings are arbitrarily represented for ease of description, and therefore this disclosure is not necessarily limited thereto.

[0052] In the embodiments described below, the x-axis, y-axis, and z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or they can represent different orientations that are not perpendicular to each other.

[0053] While terms such as "first" and "second" can be used to describe various components, such components should not be limited to these terms. These terms are used to distinguish one component from another.

[0054] It will be understood that, as used herein, the terms “comprising,” “including,” “having,” and / or “having” indicate the presence of the stated features or components, but do not exclude the addition of one or more other features or components.

[0055] In this specification, "A and / or B" means A or B, or A and B. In this specification, "at least one of A and B" means A or B, or A and B.

[0056] It will be understood that when a layer, area, or component is referred to as being "connected" to another layer, area, or component, the layer, area, or component may be "directly connected" to the other layer, area, or component, or may be "indirectly connected" to the other layer, area, or component, and other layers, areas, or components are located between the layer, area, or component and the other layer, area, or component. As an example, in this specification, it will be understood that when a layer, area, or element is referred to as being "electrically connected" to another layer, area, or element, the layer, area, or element may be "directly electrically connected" to the other layer, area, or element, or may be "indirectly electrically connected" to the other layer, area, or element, and other layers, areas, or elements are located between the layer, area, or element and the other layer, area, or element.

[0057] Figure 1 This is a schematic block diagram of an electronic device 1 according to an embodiment. The electronic device 1 according to the embodiment may be a display device, or may include one or more other modules having functions different from the display module 11, in addition to the display module 11.

[0058] like Figure 1As shown, the electronic device 1 according to the embodiment may include a display module 11, one or more processors 51, a memory 52, a power module 54, an input module 55, an output module 56, and a communication module 57.

[0059] Display module 11 may include display panel 10 as described below (see below) Figure 5 As an example, display module 11 may include display panel 10 and data driver 20 mounted on display panel 10 (see [link]). Figure 5 Display panel 10 is described below.

[0060] As a collective or selection of one or more processors 51, the one or more processors 51 can individually control most of the components of the electronic device 1. As an example, one or more processors of the one or more processors 51 can output digital video data to the display module 11, causing the display module 11 to display an image, and one or more processors of the one or more processors 51 can receive input data from the input module 55 to allow the electronic device 1 to perform functions corresponding to the relevant data. The one or more processors 51 may include at least one of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0061] When needed, one or more processors 51 can be divided into two or more parts from a functional or structural perspective. As an example, processor 51 may include a main processor in the form of a first driver chip containing a central processing unit and an auxiliary processor in the form of a second driver chip as part of the display module 11. The auxiliary processor in the form of a second driver chip may include a controller that receives image signals from the main processor and processes the image signals to match the display panel 10 included in the display module 11 (see [link to relevant documentation]). Figure 5 ) interface specifications.

[0062] The memory 52 may include at least one of non-volatile memory and volatile memory. The memory 52 may store data information required for the operation of the processor 51 or the display module 11. When one or more processors 51 execute applications stored in the memory 52, data signals and / or input control signals for images may be transmitted to the display module 11, and the display module 11 may process the provided signals and output image information.

[0063] The power module 54 may include a power supply module (such as a power adapter or battery cell) and a power conversion module that converts the power supplied by the power supply module to generate the power required for the operation of the electronic device 1. Power conversion via the power conversion module may include direct-to-direct-current (DC-DC) conversion, alternating-current (AC-DC) conversion, and direct-to-alternating-current (DC-AC) conversion. However, this disclosure is not limited thereto.

[0064] Input module 55 can provide input information to one or more processors 51 and / or display module 11. Input module 55 may include not only physical buttons, a keyboard, and a microphone, but also various sensor modules. Examples of sensor modules may include touch sensors, pressure sensors, proximity sensors, position sensors, digitizers, motion recognition sensors, camera sensors, light receiving sensors, photoelectric conversion sensors, and / or temperature sensors. Additionally, sensor modules may include biometric sensors (such as blood pressure sensors, blood glucose sensors, electrocardiogram sensors, and / or heart rate sensors).

[0065] The output module 56 can receive information other than images from one or more processors 51 and can provide that information to a user. The output module 56 may include, for example, a sound module, a haptic module, and / or a light-emitting module. Additionally, the output module 56 may include unique functional modules of the electronic device 1 (such as a cooling module for a refrigerator).

[0066] For reference, display module 11 can also be responsible for output functions. As an example, display panel 10 included in display module 11 can display (output) information processed by electronic device 1. As an example, display panel 10 can display execution screen information of an application driven by electronic device 1, and user interface (UI) or graphical user interface (GUI) information corresponding to the execution screen information. Display panel 10 may include a display layer and a touch screen layer, wherein the display layer displays images and the touch screen layer senses user touch input. Therefore, display panel 10 can be used as part of input module 55, which provides an input interface between electronic device 1 and the user, and simultaneously as part of output module 56, which provides an output interface between electronic device 1 and the user.

[0067] Communication module 57 is responsible for sending / receiving information between electronic device 1 and external devices, and communication module 57 may include a receiver and a transmitter. Communication module 57 may include wireless communication modules or various wired communication modules such as mobile communication modules, broadcast receiving modules, wireless internet modules, short-range communication modules, Wi-Fi modules and / or Bluetooth modules.

[0068] Figure 1The electronic device 1 shown is merely an example. As an example, a display device without communication functionality may not include the communication module 57. Additionally, when electronic device 1 includes a display device, at least one component of electronic device 1 may be included in the display device. Furthermore, some modules that are functionally included in a single module may be included in the display device, and other modules may be included separately from the display device in electronic device 1. As an example, the display device may include a display module 11, and the processor 51, memory 52, and power module 54 may be components of electronic device 1 rather than components of the display device. Alternatively, the display device may include a display module 11 and a power module 54, and the power module 54 may supply power to components such as the processor 51 and memory 52 of electronic device 1. However, various modifications are possible.

[0069] Figure 2 This is a schematic diagram of an electronic device 1 according to aspects of this disclosure. Figure 2 Examples of electronic devices 1 include a smartphone 1_1a, a tablet PC 1_1b, a laptop computer 1_1c, a television (TV) 1_1d, and a desktop monitor 1_1e.

[0070] Smartphone 1_1a can include not only Figure 1 The processor 51, memory 52, power module 54, and display module 11 shown may also include Figure 1 The input module 55 (such as a touch sensor) and communication module 57 are shown. The smartphone 1_1a can process received information through the communication module 57 or other input modules and display the information through the display module 11.

[0071] Similar to the smartphone 1_1a, the tablet PC 1_1b, laptop computer 1_1c, TV 1_1d and / or desktop monitor 1_1e may include a display module 11 and an input module 55, and may also include a communication module 57, depending on the circumstances.

[0072] Figure 3 This is a schematic diagram illustrating an example of a wearable electronic device, which is an electronic device 1 according to an aspect of this disclosure. Figure 3 The following are examples of electronic devices 1: smart glasses 1_2a, head-mounted display 1_2b, and smartwatch 1_2c.

[0073] The smart glasses 1_2a and the head-mounted display 1_2b may include a display module 11 for displaying images (see [link]). Figure 1 The device 1 includes a reflector, which comprises a display surface that displays an image to reflect the image and provides the image to the user's eyes. The user can use the electronic device 1 to experience virtual reality or augmented reality.

[0074] The smartwatch 1_2c may include an input module 55 (see...) Figure 1 The biometric sensor is used to provide the user with the biological information identified by the biometric sensor through the display module 11.

[0075] Figure 4 This is a schematic diagram illustrating an example of vehicle electronic device 1_3, which is an electronic device 1 according to an aspect of this disclosure. Figure 4 As shown, the vehicle electronic equipment 1_3 can be included in the vehicle's dashboard, central instrument panel, etc., or it can be a central information display (CID) installed on the vehicle's dashboard or an interior mirror display that replaces the rearview mirror.

[0076] However, the electronic device 1 according to the embodiment is not limited thereto. As an example, the electronic device 1 according to the embodiment may include not only display-centric devices (such as billboards, electronic boards, and / or game consoles), but also devices via display module 11 (see...). Figure 1 This refers to various household appliances (such as refrigerators, washing machines, dryers, air conditioners, and / or robotic vacuum cleaners) that display information. Additionally, if the display module 11 has the function of transmitting light, the electronic device 1 can be a smart window or transparent display device that simultaneously displays a background and an image. However, the electronic device 1 according to this disclosure is not limited thereto. As long as the electronic device 1 includes the display panel 10 described below (see...) Figure 5 Any electronic device may fall within the scope of this disclosure.

[0077] Figure 5 This is a schematic plan view of a display module 11 including a display panel 10, according to aspects of this disclosure. Figure 6 Based on the aspects of this disclosure Figure 5 A schematic side view of the display module 11. Included in the electronic device 1 (see...) Figure 1 The display module 11 in the ) may include, for example, Figure 5 and Figure 6 The display panel 10 shown is also applicable to the embodiments and modifications described below.

[0078] Display panel 10 can be shown as having a roughly rectangular shape in a plan view. For example, as... Figure 5As shown, the display panel 10 can have a generally rectangular shape in the xy plane, having a short side in the x-axis direction and a long side in the y-axis direction. In this case, the edge where the short side in the x-axis direction intersects the long side in the y-axis direction can form a right angle or a circular shape with a preset curvature. In the plan view, the shape of the display panel 10 is not limited to a rectangle, and can include other polygonal, elliptical, or irregular shapes.

[0079] Display panel 10 may include a display area DA and a peripheral area PA outside the display area DA. The display area DA is the area in which an image is displayed, and multiple pixels may be positioned within the display area DA. The display area DA may have various shapes, such as circular, elliptical, polygonal, or the shape of a specific graphic. Figure 5 The image shows that the display area DA has a roughly rectangular shape with rounded corners.

[0080] The peripheral region PA can be positioned outside the display region DA. The peripheral region PA may include a first peripheral region PA1 and a second peripheral region PA2, wherein the first peripheral region PA1 is positioned around at least a portion of the display region DA, and the second peripheral region PA2 is positioned at the lower end of the display region DA and extends in a first direction (e.g., the x-axis direction). The width of the second peripheral region PA2 in the first direction (e.g., the x-axis direction) may be smaller than the width of the display region DA. With this structure, at least a portion of the second peripheral region PA2 can be easily bent.

[0081] Figure 5 The planar shape of the display panel 10 shown can be the same as that of the substrate 100 included in the display panel 10 (see...). Figure 7 The shapes of the components are substantially equal. When the display panel 10 includes a display area DA and a peripheral area PA outside the display area DA, this can mean that the substrate 100 includes a display area DA and a peripheral area PA outside the display area DA. In the following description, for convenience, it will be assumed that the substrate 100 includes a display area DA and a peripheral area PA.

[0082] Display panel 10 may include a main area MR, a bent area BR outside the main area MR, and a sub-area SR separated from the main area MR, with the bent area BR located between the sub-area SR and the main area MR. The main area MR may be positioned on one side of the bent area BR, and the sub-area SR may be positioned on the other side of the bent area BR. Figure 6 As shown, the display panel 10 can be bent in the bending region BR, and when viewed from a third direction (e.g., the z-axis direction), at least a portion of the sub-region SR can overlap with the main region MR.

[0083] Although Figure 6 The diagram shows the display panel 10 bent, but this disclosure is not limited thereto. As an example, the display panel 10 may be a foldable display panel, in which case the display panel 10 may be bent within the display area DA about a bending axis intersecting the display area DA. The display panel 10 may not be bent when necessary. The sub-area SR may be a non-display area.

[0084] As described above, the display panel 10 can be a rigid display panel, which is rigid and therefore not easily bent, or a flexible display panel, which is flexible and therefore easily bendable, foldable, or rollable. As examples, the display panel 10 may include a foldable display panel capable of being folded and unfolded, a curved display panel having a curved display surface, a bent display panel in which areas other than the display surface are bent, a rollable display panel capable of being rolled up or unfolded, and a stretchable display panel capable of being extended or retracted.

[0085] The display module 11, including the display panel 10, may include a data driver 20 mounted in a sub-area SR of the display panel 10. The data driver 20 may be disposed on the display panel 10 in the form of an integrated circuit (IC). As an example, the data driver 20 may be a data driver integrated circuit that generates data signals. The data driver 20 may be an auxiliary processor in the form of a second driver chip as described above, and may be a processor 51 (see...). Figure 1 Part of ).

[0086] The display circuit board 30 can be attached to the end of the sub-area SR of the display panel 10. That is, the display module 11 may include the display circuit board 30 when needed. The display circuit board 30 can be electrically connected to the data driver 20, etc., via the pads of the sub-area SR of the display panel 10.

[0087] Figure 7 It is in accordance with aspects of this disclosure along Figure 5 The line A-A' intercepts Figure 5 A schematic cross-sectional view of the display panel 10. (Refer to...) Figure 7 The display panel 10 may include a substrate 100. Various elements forming the display panel 10 may be disposed on the substrate 100. As an example, a display layer 200 and a thin-film encapsulation layer 300 may be disposed on the substrate 100.

[0088] The substrate 100 may comprise glass, ceramic, metal, or polymer resin. The substrate 100 may comprise polymer resins (such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, or cellulose acetate propionate). The substrate 100 may have a multilayer structure comprising two or more layers containing the aforementioned polymer resin and an inorganic material layer disposed between the two or more layers containing the polymer resin. Alternatively, the substrate 100 may have a structure in which the polymer resin layers and the inorganic material layer alternately overlap. The inorganic material layer may comprise, for example, silicon oxide, silicon nitride, or silicon oxynitride, and the inorganic material layer may have a single-layer or multilayer structure. The inorganic material layer may serve as a barrier layer to prevent the penetration of external foreign matter.

[0089] Display layer 200 may include a plurality of pixels. Display layer 200 may include a display element 220 positioned for each pixel, pixel circuitry positioned for each pixel, and an insulating layer. Pixel circuitry may include thin-film transistors (TFTs) and storage capacitors (Cst). Display element 220 may include, for example, an organic light-emitting diode (OLED).

[0090] The thin-film encapsulation layer 300 may cover the display layer 200. The thin-film encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. The thin-film encapsulation layer 300 may prevent or reduce the penetration of impurities (such as moisture from the outside) into the display element.

[0091] The display layer 200 and the thin-film encapsulation layer 300 are described in detail below.

[0092] A buffer layer 201 may be formed on the substrate 100, wherein the buffer layer 201 is configured to prevent impurities from penetrating the semiconductor layer Act of the thin-film transistor TFT. The buffer layer 201 may include an inorganic insulating material (such as silicon nitride, silicon oxynitride, and / or silicon oxide), and the buffer layer 201 may include a single-layer structure or a multilayer structure.

[0093] The pixel circuit PC can be disposed on the buffer layer 201. The pixel circuit PC may include a thin-film transistor (TFT) and a storage capacitor Cst. The thin-film transistor (TFT) may include a semiconductor layer Act, a gate electrode GE, a source electrode SE, and / or a drain electrode DE. Figure 7 The thin-film transistor (TFT) shown can be a driving transistor. When an emission control transistor or similar element is positioned between the driving transistor and the organic light-emitting diode (OLED), in this case, it is related to... Figure 7Unlike other transistors, the thin-film transistor (TFT), acting as the driving transistor, can be connected to the pixel electrode 221 of the organic light-emitting diode (OLED) without contacting the metal layer CM, and can be electrically connected to the emission control transistor (not shown), which in turn can be electrically connected to the pixel electrode 221 of the OLED. When needed, Figure 7 The thin-film transistor (TFT) shown can be considered as an emitter control transistor. In the following description, for convenience, it will be further described as follows: Figure 7 The thin-film transistor (TFT) is connected to the pixel electrode 221 of the organic light-emitting diode through a contact metal layer (CM).

[0094] Despite Figure 7 Although not shown, the data line DL of the pixel circuit PC can be electrically connected to the switching transistor included in the pixel circuit PC.

[0095] The semiconductor layer Act may include polycrystalline silicon. Alternatively, the semiconductor layer Act may include amorphous silicon, oxide semiconductor, or organic semiconductor. The gate electrode GE may include a low-resistance metallic material. As an example, the gate electrode GE may include a conductive material comprising molybdenum (Mo), aluminum (Al), copper (Cu), and / or titanium (Ti), and the gate electrode GE may have a multilayer structure or a single-layer structure. As an example, the gate electrode GE may have a three-layer structure of a molybdenum layer, an aluminum layer, and a molybdenum layer (Mo / Al / Mo).

[0096] The gate insulating layer 203 between the semiconductor layer Act and the gate electrode GE may include an inorganic insulating material, such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, and / or hafnium oxide. The gate insulating layer 203 may have a single-layer structure or a multi-layer structure.

[0097] The source electrode SE and drain electrode DE can be disposed on the same layer as the data line DL, and the source electrode SE and drain electrode DE can include the same material as the data line DL. The source electrode SE, drain electrode DE, and data line DL can include materials with high electrical conductivity. The source electrode SE and drain electrode DE can include conductive materials containing molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti), and the source electrode SE and drain electrode DE have a multilayer structure or a single-layer structure. As an example, the source electrode SE, drain electrode DE, and data line DL can have a multilayer structure of titanium layers, aluminum layers, and titanium layers (Ti / Al / Ti).

[0098] Although Figure 7The diagram illustrates a thin-film transistor (TFT) comprising both a source electrode (SE) and a drain electrode (DE), but this disclosure is not limited thereto. As an example, the drain region of the semiconductor layer Act of the TFT can be integrally formed with the source region of the semiconductor layer of another TFT. In this case, the TFT may not have a drain electrode (DE), and the other TFT may not have a source electrode. In this case, the drain electrode of the TFT can be shown in the circuit diagram connected to the source electrode of the other TFT. As an example, when the drain electrode of a driving transistor is connected to the source electrode of an emitter control transistor, the driving transistor may not have a drain electrode, the emitter control transistor may not have a source electrode, and the drain region of the semiconductor layer of the driving transistor can be integrally formed with the source region of the emitter control transistor. Similarly, when the source electrode of a driving transistor is connected to the drain electrode of an operation control transistor, the driving transistor may not have a source electrode, the operation control transistor may not have a drain electrode, and the source region of the semiconductor layer of the driving transistor can be integrally formed with the drain region of the operation control transistor. Therefore, the driving transistor may thus not have both a source electrode and a drain electrode.

[0099] The storage capacitor Cst may include a lower electrode CE1 and an upper electrode CE2 that overlap each other, and a first interlayer insulating layer 205 is located between the upper electrode CE2 and the lower electrode CE1. The storage capacitor Cst may overlap with a thin-film transistor (TFT). Figure 7 The diagram illustrates that the gate electrode GE of a thin-film transistor (TFT) serves as the lower electrode CE1 of a storage capacitor Cst. However, this disclosure is not limited thereto, and the storage capacitor Cst may not overlap with the TFT. The storage capacitor Cst may be covered by a second interlayer insulating layer 207. The upper electrode CE2 of the storage capacitor Cst may comprise a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), and / or titanium (Ti), and the upper electrode CE2 may have a multilayer or monolayer structure.

[0100] The first interlayer insulation layer 205 and the second interlayer insulation layer 207 may each include inorganic insulating materials, such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, and / or hafnium oxide. The first interlayer insulation layer 205 and the second interlayer insulation layer 207 may have a single-layer structure or a multi-layer structure.

[0101] The pixel circuit PC, including the thin-film transistor (TFT) and the storage capacitor (Cst), can be covered by the first organic insulating layer 209.

[0102] The pixel circuit PC can be electrically connected to the pixel electrode 221. As an example, such as... Figure 7As shown, a contact metal layer CM can be disposed between the thin-film transistor TFT and the pixel electrode 221. The contact metal layer CM can be connected to the thin-film transistor TFT through contact holes formed in the first organic insulating layer 209, and the pixel electrode 221 can be connected to the contact metal layer CM through contact holes formed in the second organic insulating layer 211, which is disposed on the first organic insulating layer 209 to cover the contact metal layer CM, etc. The contact metal layer CM can include a conductive material comprising molybdenum (Mo), aluminum (Al), copper (Cu), and / or titanium (Ti), and the contact metal layer CM has a multilayer structure or a single-layer structure. As an example, the contact metal layer CM can have a multilayer structure of titanium layer, aluminum layer, and titanium layer (Ti / Al / Ti).

[0103] The first organic insulating layer 209 and the second organic insulating layer 211 may comprise organic insulating materials such as acrylic, polystyrene (PS), polymethyl methacrylate (PMMA), benzocyclobutene (BCB), polyimide, hexamethyldisiloxane (HMDSO), or the like. As an example, the first organic insulating layer 209 and the second organic insulating layer 211 may each comprise polyimide. The first organic insulating layer 209 and / or the second organic insulating layer 211 may have a substantially flat upper surface. That is, the second organic insulating layer 211 may be a planarization layer.

[0104] Multiple protrusions 213 may be disposed on the second organic insulating layer 211. The multiple protrusions 213 may be spaced apart from each other. The upper surface of each of the multiple protrusions 213 may include a protruding surface. The protruding surface included in the upper surface of each of the multiple protrusions 213 may be referred to as a first protruding surface.

[0105] The multiple protrusions 213 may comprise organic insulating materials such as acrylic, polystyrene (PS), polymethyl methacrylate (PMMA), benzocyclobutene (BCB), polyimide, hexamethyldisiloxane (HMDSO), or the like. During the manufacturing process, a substrate organic insulating layer comprising the organic insulating material can be formed on the second organic insulating layer 211, and the substrate organic insulating layer can be patterned using an etchant selected for the organic insulating material, such as a photoresist, and then the photoresist can be removed to form the protrusions. Figure 7 The plurality of raised portions 213 shown. Because the substrate organic insulating layer comprises an organic insulating material, during the patterning process, the upper surface of each of the plurality of raised portions 213 may include, as shown in the figure, an organic insulating material. Figure 7 The convex lens shown has a raised surface with a similar surface shape. Multiple raised portions 213 can be formed by inkjet printing or the like when needed. Even in this case, the upper surface of each of the multiple raised portions 213 may include a surface similar to... Figure 7 The convex lens shown has a similar surface shape to a raised surface.

[0106] Multiple protrusions 213 may be covered by a raised insulating layer 214. The raised insulating layer 214 may include an inorganic insulating material. As an example, the raised insulating layer 214 may include an inorganic insulating material, including silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, and / or hafnium oxide, etc. The raised insulating layer 214 including the inorganic insulating material can be formed by a deposition process such as chemical vapor deposition (CVD). Because the raised insulating layer 214 including the inorganic insulating material is formed according to the shape of the upper surface of the structure disposed beneath the raised insulating layer 214, the upper surface of the raised insulating layer 214 may include, for example, […]. Figure 7 The plurality of protruding portions 213 shown correspond to the plurality of second protruding surfaces.

[0107] like Figure 7 As shown, the area A2 of the plurality of second raised surfaces can be larger than the area A1 of the first raised surface. This is because, although the raised insulating layer 214 is formed according to the shape of the upper surface of the structure disposed below the raised insulating layer 214, the raised insulating layer 214 fills the space between the plurality of raised portions 213 disposed below the raised insulating layer 214. The raised insulating layer 214 fills the space between the plurality of raised portions 213, but the entire portion of the raised insulating layer 214 corresponding to the entire space between the plurality of raised portions 213 does not become flat. This is because the raised insulating layer 214 is formed according to the shape of the upper surface of the structure disposed below the raised insulating layer 214 while having a substantially constant thickness. Thus, the area A2 (in the plan view) of each of the plurality of second raised surfaces included in the upper surface of the raised insulating layer 214 can be larger than the area A1 (in the plan view) of the corresponding first raised surface among the plurality of raised portions 213.

[0108] With as a cross-sectional view Figure 7 Unlike other projections, each of the multiple protrusions 213 can be shown as having a circular shape in a plan view. This will be referred to below. Figure 11 The following description is provided. Therefore, each of the first raised surfaces of the plurality of raised portions 213 is shown as having a circular shape in a plan view. In this case, the area A1 of the first raised surface in the plan view can be calculated using a first diameter, which is the diameter of the lower surface of the raised portion 213. Each of the plurality of second raised surfaces included in the upper surface of the raised insulating layer 214 is also shown as having a circular shape in a plan view. In this case, the area A2 of the first raised surface in the plan view can be determined using a second diameter, which is the sum of the first diameter and twice the thickness of the raised insulating layer 214.

[0109] Table 1, printed below, shows how the first area A1, the second area A2, and the ratio of the second area A2 to the first area A1 change when the first diameter and the thickness of the raised insulating layer 214 are varied. In the table below, "thickness" refers to the thickness of the raised insulating layer 214. Each of the first area A1 and the second area A2 is rounded to one decimal place.

[0110] [Table 1]

[0111]

[0112]

[0113] When multiple raised portions 213 are formed by patterning a substrate organic insulating layer using a photoresist or similar agent, the lower limit of the first diameter can be approximately 2 μm due to resolution limitations during the exposure process using the photoresist. Furthermore, when the first diameter is greater than 10 μm, it becomes impossible to maintain the shape of the inclined surface of each of the multiple raised portions 213. As an example, when the first diameter is greater than 10 μm, each of the multiple raised portions 213 may become a shape with a flat upper surface, rather than a shape such as a convex lens. Therefore, as described in the table above, the first diameter can be from approximately 2 μm to approximately 10 μm.

[0114] Because the raised insulating layer 214 can be formed by CVD as described above, the upper limit of the thickness of the raised insulating layer 214 can be approximately 2 μm, as described in the table above, taking into account the characteristics and limitations of CVD when forming inorganic insulating layers. Furthermore, as shown in Example 6 of the table above, when the thickness of the raised insulating layer 214 becomes less than 0.5 μm, the ratio of the second area A2 to the first area A1 becomes less than 120%. When the ratio of the second area A2 to the first area A1 becomes less than 120%, the spacing between the plurality of second raised surfaces included in the upper surface of the raised insulating layer 214 increases, and its light efficiency may deteriorate. Therefore, the thickness of the raised insulating layer 214 can be from approximately 0.5 μm to approximately 2 μm.

[0115] As shown in the table above, when the thickness of the raised insulating layer 214 is about 0.5 μm, the ratio of the second area A2 to the first area A1 is from about 120% to about 233%. When the thickness of the raised insulating layer 214 is about 1 μm, the ratio of the second area A2 to the first area A1 is from about 143% to about 433%. When the thickness of the raised insulating layer 214 is about 2 μm, the ratio of the second area A2 to the first area A1 is from about 320% to about 933%. Therefore, the display panel 10 and the electronic device 1 including the display panel 10 can be significantly improved (see...). Figure 1 ) light efficiency.

[0116] The pixel electrode 221 disposed on the second organic insulating layer 211, which serves as a planarization layer, can be disposed on the raised insulating layer 214. The pixel electrode 221 can be a reflective electrode. As an example, the pixel electrode 221 may include a reflective layer and a transparent or translucent electrode layer disposed on the reflective layer, wherein the reflective layer includes Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or compounds thereof. The transparent or translucent electrode layer may include indium tin oxide (ITO), indium zinc oxide (IZO), or zinc oxide (ZnO). X The pixel electrode 221 can be one of ZnO or ZnO2, indium oxide (In2O3), indium gallium oxide (IGO), or aluminum zinc oxide (AZO). As an example, the pixel electrode 221 can have a three-layer structure of ITO / Ag / ITO. The pixel electrode 221 can be shown as having an isolated shape in a planar view. The pixel electrode 221 can extend outside the raised insulating layer 214, connect to the contact metal layer CM below the second organic insulating layer 211 through contact holes formed in the second organic insulating layer 211, and thus be electrically connected to a thin-film transistor (TFT), etc.

[0117] Each layer included in the pixel electrode 221 (e.g., but not limited to each of the ITO layer and the Ag layer) can be formed by a physical deposition method such as sputtering. The ITO layer or Ag layer formed by sputtering can conform to the shape of the upper surface of the structure disposed below the ITO layer or Ag layer. As described above, the upper surface of the raised insulating layer 214 includes a plurality of second raised surfaces corresponding to the plurality of raised portions 213. Therefore, the upper surface of the pixel electrode 221 disposed on the raised insulating layer 214 may also include a plurality of third raised surfaces corresponding to the plurality of second raised surfaces.

[0118] A pixel defining layer 215 can be disposed on a second organic insulating layer 211, which serves as a planarization layer. The pixel defining layer 215 can prevent arcing or the like at the edges of the pixel electrode 221 by covering the edges of the pixel electrode 221 and increasing the distance between the pixel electrode 221 and the common electrode 223 above the pixel electrode 221. In other words, the pixel defining layer 215 can expose the central portion of the pixel electrode 221 by having an opening around its central portion. The pixel defining layer 215 can comprise an organic insulating material such as polyimide, acrylic resin, benzocyclobutene, or phenolic resin, and is formed using a coating method such as spin coating. Alternatively, the pixel defining layer 215 can comprise an inorganic insulating material (such as silicon nitride (SiN)). x ), silicon oxynitride (SiON), silicon oxide (SiO) x (or similar items).

[0119] The intermediate layer 222 disposed between the pixel electrode 221 and the common electrode 223 may include an emitting layer. The intermediate layer 222 may include a first functional layer disposed between the emitting layer and the pixel electrode 221, and the intermediate layer 222 may also include a second functional layer disposed between the emitting layer and the common electrode 223. The emitting layer may include a polymeric organic material (e.g., a low molecular weight organic material) that emits light of a predetermined color.

[0120] The first functional layer can have a single-layer or multi-layer structure. As an example, when the first functional layer comprises a polymer material, it may include a hole transport layer (HTL) with a single-layer structure, and may include polyethylene dioxythiophene (PEDOT: poly(3,4)-ethylene-dioxythiophene), polyaniline (PANI), or the like. When the first functional layer comprises a low molecular weight material, it may include a hole injection layer (HIL) and an HTL.

[0121] The second functional layer may include an electron transport layer (ETL) and / or an electron injection layer (EIL).

[0122] The intermediate layer 222 can be modified in various ways. As an example, the intermediate layer 222 may include a first stack containing an emission layer and a functional layer, a second stack containing an emission layer and a functional layer, and a charge generation layer between the first stack and the second stack. The charge generation layer may include a negative charge generation layer and a positive charge generation layer. The luminous efficiency of a series-connected light-emitting diode (LED) including multiple emission layers can also be enhanced by the negative charge generation layer and the positive charge generation layer.

[0123] The negative charge generation layer can be an n-type charge generation layer. The negative charge generation layer can supply electrons. The negative charge generation layer can include a host and a dopant. The host can include an organic material. The dopant can include a metallic material that, when doped into the host, can give the negative charge generation layer negative charge carriers such as electrons. The positive charge generation layer can be a p-type charge generation layer. The positive charge generation layer can supply hole-type charge carriers. The positive charge generation layer can include a host and a dopant. The host can include an organic material. The dopant can include a metallic material that, when doped into the host, can give the positive charge generation layer hole-type charge carriers.

[0124] Although Figure 7The diagram shows an intermediate layer 222 patterned to correspond to and be isolated from the pixel electrodes 221, but this disclosure is not limited thereto. As an example, an emitter layer included in the intermediate layer 222 can be patterned to correspond to and be isolated from the pixel electrodes 221, but layers other than the emitter layer included in the intermediate layer 222 can be integrally formed across the plurality of pixel electrodes 221. However, various modifications are possible. The portions of the intermediate layer 222 corresponding to the plurality of protrusions 213 can have a curved shape formed according to the shape of the upper surface of the pixel electrodes 221.

[0125] The common electrode 223 disposed on the intermediate layer 222 can be a transparent electrode or a semi-transparent electrode. As an example, the common electrode 223 may include a metal thin film with a small work function, including Li, Ca, Al, Ag, Mg or compounds thereof (e.g., lithium fluoride (LiF)). In addition, the common electrode 223 may also include a transparent conductive oxide (TCO) layer disposed on the metal thin film (the TCO may be such as ITO, indium zinc oxide (IZO), ZnO, ZnO2, In2O3 or the like).

[0126] The common electrode 223 can be integrally formed as a single unit covering the entire surface of the display area DA, and the common electrode 223 can be disposed on the intermediate layer 222 and the pixel defining layer 215. That is, the common electrode 223 can be integrally formed to correspond to multiple organic light-emitting diodes (OLEDs). Multiple OLEDs can share the common electrode 223. The stacked structure of the pixel electrode 221, the intermediate layer 222, and the common electrode 223 can correspond to the OLEDs. The portion of the common electrode 230 corresponding to the multiple protrusions 213 can have a curved shape formed according to the shape of the upper surface of the pixel electrode 221.

[0127] A capping layer (not shown) may be disposed on the common electrode 223. The capping layer may be a material selected to improve the light output and / or tune the spectral characteristics of the organic light-emitting diode, and may include, for example, lithium fluoride (LiF). The capping layer may be omitted.

[0128] A display element 220, such as an organic light-emitting diode (OLED), can be covered by a thin-film encapsulation layer 300. When a cover layer is present, the thin-film encapsulation layer 300 can be disposed on the cover layer. The thin-film encapsulation layer 300 may include at least one organic encapsulation layer and at least one inorganic encapsulation layer. Figure 7 The diagram shows a thin-film encapsulation layer 300 comprising a first inorganic encapsulation layer 310, a second inorganic encapsulation layer 330, and an organic encapsulation layer 320 between the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330. The number of organic encapsulation layers, the number of inorganic encapsulation layers, and the stacking order are not limited to those described and can vary.

[0129] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may comprise at least one inorganic material selected from alumina, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. Each of the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may have a single-layer structure or a multi-layer structure. The organic encapsulation layer 320 may comprise a polymer-based material. The polymer-based material may comprise an acrylic resin (such as polymethyl methacrylate or polyacrylic acid), an epoxy resin, a polyimide, and / or polyethylene. As an example, the organic encapsulation layer 320 may comprise an acrylate.

[0130] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may comprise different materials. As an example, the first inorganic encapsulation layer 310 may comprise silicon oxynitride, and the second inorganic encapsulation layer 330 may comprise silicon nitride.

[0131] The first inorganic encapsulation layer 310 may have a curved portion formed according to the shape of the common electrode 223. The organic encapsulation layer 320 may have a substantially flat upper surface, and therefore the second inorganic encapsulation layer 330 may also have a substantially flat upper surface.

[0132] As described above, pixel electrode 221 can be a reflective electrode. The emitting layer included in the intermediate layer 222 can emit light that diffuses in all directions, rather than emitting light that is guided in a specific direction. Therefore, in order to improve not only the visibility of the display panel 10 and the electronic device 1 including the display panel 10 in the front direction (z-axis direction) but also the visibility in the lateral direction, an increase in the amount of light emitted in a direction at an angle of approximately 45° relative to the front direction (z-axis direction) of the display panel 10 and the electronic device 1 including the display panel 10 can be provided.

[0133] As described above, in the display panel 10 and the electronic device 1 including the display panel 10, because multiple protrusions 213 exist below the pixel electrode 221, the upper surface of the pixel electrode 221 includes multiple third protruding surfaces. This can be understood as meaning that the upper surface of the reflective layer included in the pixel electrode 221 includes third protruding surfaces. The propagation direction of reflected light emitted from the emission layer included in the intermediate layer 222, incident on the pixel electrode 221, and reflected by the pixel electrode 221 can be controlled by the shape of the upper surface of the pixel electrode 221, which serves as a reflective electrode. That is, due to the shape of the upper surface of the pixel electrode 221, which serves as a reflective electrode, the amount of light emitted in a direction at an angle of approximately 45° relative to the front direction (z-axis direction) of the display panel 10 and the electronic device 1 including the display panel 10 can be increased. As a result, not only can the visibility of the display panel 10 and the electronic device 1 including the display panel 10 in the front direction (z-axis direction) be improved, but also the visibility in the lateral direction can be improved.

[0134] For reference, the reason why the upper surface of the pixel electrode 221, which serves as a reflective electrode, has the above-described shape is because a plurality of protrusions 213 are disposed below the pixel electrode 221. However, in the display panel 10 according to the embodiment and the electronic device 1 including the display panel 10, since not only the plurality of protrusions 213, but also the protruding insulating layer 214 covering the plurality of protrusions 213, are disposed between the plurality of protrusions 213 and the pixel electrode 221, the effect of improving visibility in the lateral direction can be further enhanced.

[0135] To improve visibility in the lateral direction, the spacing between the plurality of protrusions 213 can be minimized as much as possible. However, when forming a plurality of protrusions 213 that are separated from each other by forming an organic material layer and patterning the organic material layer, it is not easy to reduce the spacing between the plurality of protrusions 213. This is a fundamental problem that arises when patterning a layer that includes inorganic materials, unlike layers that include inorganic materials. Forming a plurality of protrusions 213 by forming an inorganic material layer and patterning the inorganic material layer can solve this problem. However, when patterning a layer that includes inorganic materials, another problem arises: it is difficult to form the upper surface of each of the plurality of protrusions that is separated from each other, such that the upper surface has a smooth curved surface similar to the surface of a convex lens. Therefore, according to aspects of this disclosure, a combination of organic protrusion surfaces and inorganic protrusion surfaces can be provided to solve these problems.

[0136] In the display panel 10 and the electronic device 1 including the display panel 10 according to the embodiments, since a plurality of protrusions 213 separated from each other are formed by forming an organic material layer and patterning the organic material layer, the upper surface of each of the plurality of protrusions 213 separated from each other can have a first protruding surface, which is a smooth curved surface similar to the surface of a convex lens. Furthermore, the protruding insulating layer 214 includes an inorganic insulating layer and covers the plurality of protrusions 213, and the upper surface of the protruding insulating layer 214 can therefore include a plurality of second protruding surfaces corresponding to the plurality of protrusions 213. Because the protruding insulating layer 214 includes an inorganic material, the spacing between the plurality of second protruding surfaces can be reduced compared to the spacing between the plurality of protrusions 213 formed of organic material. Therefore, with this structure, a display panel 10 and an electronic device 1 including the display panel 10 can be achieved, which can further increase the visibility in the lateral direction.

[0137] exist Figure 7 The diagram shows a raised insulating layer 214 covering a plurality of raised portions 213. However, this disclosure is not limited thereto. As an example, such as Figure 8 As shown, Figure 8 This is a schematic cross-sectional view of the display panel 10 according to an embodiment, showing that the raised insulating layer 214 can extend to the outside of the plurality of raised portions 213. In this case, a portion of the upper surface of the raised insulating layer 214 can have a substantially flat shape.

[0138] like Figure 7 and Figure 8 As shown, a plurality of protrusions 213 can be positioned within the opening of the pixel defining layer 215. That is, in the plan view, the plurality of protrusions 213 can be positioned within the opening of the pixel defining layer 215. However, this disclosure is not limited thereto, and in the plan view, some of the plurality of protrusions 213 can be positioned outside the opening of the pixel defining layer 215. Figure 9 As shown, Figure 9 This is a schematic cross-sectional view of the display panel 10 according to an aspect of the present disclosure, in which some of the plurality of protrusions 213 may be positioned outside the opening of the pixel defining layer 215.

[0139] Due to the waveguide effect, some light emitted from the emitting layer included in the intermediate layer 222 can travel along the interface between the layers without propagating in the front direction (z-axis direction). As an example, light can travel along the interface between the pixel electrode 221 and the pixel defining layer 215 or the interface between the second organic insulating layer 211 and the pixel defining layer 215. In the display panel 10 according to this embodiment, as described above, some of the plurality of protrusions 213 are located outside the opening of the pixel defining layer 215. Therefore, due to the waveguide effect, the light path can be altered so that at least a portion of the light traveling along the interface between the pixel electrode 221 and the pixel defining layer 215 to the outside of the opening of the pixel defining layer 215 propagates in the front direction (z-axis direction). As a result, the display panel 10 and the electronic device 1 including the display panel 10 (see [reference]) can also propagate in the front direction (z-axis direction). Figure 1 The brightness of the display in the front direction (z-axis direction) is increased, and therefore the display in the display area DA (see...) is improved. Figure 5 The visibility of images in ).

[0140] Figure 10 This is a schematic cross-sectional view of the display panel 10 according to an aspect of the present disclosure. As described above, the plurality of protrusions 213 can be separated from each other. The display panel 10 according to this embodiment and the electronic device 1 including the display panel 10 (see [reference]). Figure 1 It may also include a connector region 213a. The connector region 213a may be positioned between a plurality of protrusions 213 and may connect the plurality of protrusions 213 to each other. As an example, in a plan view, the connector region 213a may have a mesh structure and connect the plurality of protrusions 213 to each other. The connector region 213a may have a thickness smaller than the maximum height of each of the plurality of protrusions 213. Furthermore, the plurality of protrusions 213 and the connector region 213a may be integrally formed as a single unit.

[0141] To form the plurality of protrusions 213 as described above, a substrate organic insulating layer comprising an organic insulating material can be formed on the second organic insulating layer 211, and the substrate organic insulating layer can be patterned using an etchant selected for the substrate organic insulating layer, such as a photoresist. In this case, a portion of the substrate organic insulating layer can remain between the plurality of protrusions 213, and this reserved portion can be the connector region 213a described above. The connector region 213a may not be present between the plurality of protrusions 213, but the spacing between the plurality of protrusions 213 can be very narrow depending on the size and resolution of the display panel 10 and the electronic device 1 including the display panel 10. In this case, in the process of forming the plurality of protrusions 213, the shape of the plurality of protrusions 213 can be changed by allowing the connector region 213a to exist between the plurality of protrusions 213.

[0142] Figure 11 This is a schematic plan view of a portion of the display panel 10 according to aspects of this disclosure. For convenience, Figure 11 Only pixel electrodes 221R, 221G, and 221B, as well as multiple protrusions 213, are shown.

[0143] like Figure 11 As shown, the blue pixel electrode 221B and the red pixel electrode 221R can be positioned in an alternating order in a first direction (x-axis direction) in the first row, and the green pixel electrode 221G can be positioned in the first direction (x-axis direction) in the second row. Alternatively, the blue pixel electrode 221B and the red pixel electrode 221R can be positioned in an alternating order in a second direction (y-axis direction) in a column, and the green pixel electrode 221G can be positioned in the second direction (y-axis direction) in the next column.

[0144] exist Figure 11 In the diagram, a circular area is indicated by a dashed line on each of pixel electrodes 221R, 221G, and 221B, and this circular area may represent the pixel defining layer 215 (see [link]). Figure 7 The size of the opening in the pixel defining layer 215 can vary depending on the pixel electrodes 221R, 221G, and 221B. As an example, in a plan view, the area corresponding to the opening of the pixel defining layer 215 for the blue pixel electrode 221B can be the largest, and the area corresponding to the opening of the pixel defining layer 215 for the green pixel electrode 221G can be the smallest. However, this disclosure is not limited and can be modified in various forms.

[0145] For reference Figure 7 As described above, and as Figure 11 As shown, multiple protrusions 213 can be positioned inside the openings of the pixel defining layer 215. (Refer to the above text) Figure 9 As described, some of the plurality of protrusions 213 may be positioned outside the opening of the pixel defining layer 215. For example... Figure 11 As shown, each of the plurality of protrusions 213 can be represented as having a circular shape in a plan view. This disclosure is not limited thereto, and as... Figure 12 As shown, Figure 12 This is a schematic plan view of a portion of the display panel 10 according to an embodiment, each of the plurality of protrusions 213 may be shown in the plan view as having a shape extending in one direction (e.g., the y-axis direction as a second direction).

[0146] Figure 13 This is a schematic cross-sectional view of a portion of the display panel 10 according to aspects of this disclosure and is Figure 7A view of a portion of the display panel 10. (e.g.) Figure 13 As shown, a taper angle θ can be defined for each of the plurality of protrusions 213. The taper angle θ can be defined as the angle between a line extending from the edge of each of the plurality of protrusions 213 and tangent to the protruding surface of each of the plurality of protrusions 213 and the upper surface of the second organic insulating layer 211. For example, considering only shape angles, the taper angle θ can be defined in the same manner as the contact angle of a liquid at a point on a solid surface.

[0147] The taper angle θ at the edge of each of the plurality of protrusions 213, as defined above, relative to the upper surface of the planarization layer (e.g., the second organic insulating layer 211), can be from about 25° to about 35°. When the taper angle θ is less than 25°, the convexity of each of the plurality of protrusions 213 decreases, and the brightness enhancement effect on the lateral surface having a viewing angle of approximately 45° relative to the direction perpendicular to the substrate 100 (z-axis direction) may be drastically reduced. Therefore, it is desirable that the taper angle θ at the edge of each of the plurality of protrusions 213 be 25° or greater. When the taper angle θ is greater than 35°, the convexity of each of the plurality of protrusions 213 increases excessively, and the brightness of the display panel 10 in the front direction (z-axis direction) may decrease. Therefore, it is desirable that the taper angle θ at the edge of each of the plurality of protrusions 213 be 35° or less.

[0148] Figures 14 to 17 This illustrates the manufacture of a display panel 10 according to aspects of this disclosure (see [link]). Figure 7 A schematic cross-sectional view of the operation. (e.g.) Figure 14 As shown, at least a portion of the contact metal layer CM can be exposed by forming a second organic insulating layer 211 covering the contact metal layer CM and forming contact holes in the second organic insulating layer 211. Subsequently, as Figure 14 As shown, a substrate organic insulating layer comprising an organic insulating material can be formed on the second organic insulating layer 211, and the organic insulating layer can be patterned using an etchant selected for the substrate organic insulating layer, such as a photoresist, to form a plurality of protrusions 213 on the second organic insulating layer 211. The substrate organic insulating layer can fill the contact holes of the second organic insulating layer 211, and a portion of the substrate organic insulating layer positioned in the contact holes can be removed while the substrate organic insulating layer is being patterned.

[0149] Alternatively, such as Figure 14As shown, a second organic insulating layer 211 covering a contact metal layer CM may also be formed on the second organic insulating layer 211. A substrate organic insulating layer containing an organic insulating material may be formed on the second organic insulating layer 211. Then, the substrate organic insulating layer is patterned using a photoresist or the like and an etchant selected for the substrate organic insulating material, forming a plurality of protrusions 213 on the second organic insulating layer 211. In this case, when the substrate organic insulating layer is patterned, by simultaneously removing a portion of the second organic insulating layer 211 on the contact metal layer CM and a portion of the substrate organic insulating layer, contact holes exposing at least a portion of the contact metal layer CM can be formed in the second organic insulating layer 211. For reference, a halftone mask may be used during the process of exposing the photoresist.

[0150] Subsequently, as Figure 15 As shown, it can be formed by creating a substrate layer 214a comprising an inorganic insulating material covering multiple protrusions 213 and then patterning the substrate layer 214a. Figure 16 The raised insulating layer 214 is shown. When the substrate layer 214a is formed, the substrate layer 214a can fill the contact holes of the second organic insulating layer 211. When the substrate layer 214a is patterned, a portion of the substrate layer 214a positioned in the contact holes can be removed.

[0151] Then, as Figure 17 As shown, a pixel electrode 221, comprising a portion positioned on the raised insulating layer 214 and contacting the contact metal layer CM through a contact hole, can be formed by depositing a layer for forming a pixel electrode on the second organic insulating layer 211 and the raised insulating layer 214 and then patterning it. After forming the pixel electrode 221, a forming process can be performed. Figure 7 The processes shown, including the pixel defining layer 215, intermediate layer 222, common electrode 223, etc., are used to manufacture the display panel 10 and the electronic device 1 including the display panel 10 (see [link to documentation]). Figure 1 ).

[0152] Although the structure of the display panel 10 has been mainly described so far, this disclosure is not limited thereto. Electronic devices 1 that include the display panel 10 also fall within the scope of this disclosure.

[0153] According to embodiments, a display panel with reduced brightness reduction in the lateral direction and an electronic device including the display panel can be realized. However, the scope of this disclosure is not limited to this effect.

[0154] It should be understood that the embodiments described herein should be considered in a descriptive sense only and not for limiting purposes. The description of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope as defined by the appended claims.

Claims

1. A display panel, wherein, The display panel includes: Planarization layer; Multiple protrusions are disposed on the planarization layer and spaced apart from each other, wherein the upper surface of each of the multiple protrusions includes a first protrusion surface; A raised insulating layer covering the plurality of raised portions and including a top surface, the top surface of the raised insulating layer including a plurality of second raised surfaces corresponding to the plurality of raised portions; and A pixel electrode is disposed on the raised insulating layer and includes an upper surface, the upper surface of the pixel electrode including a plurality of third raised surfaces corresponding to the plurality of second raised surfaces.

2. The display panel according to claim 1, wherein, The plurality of protrusions comprise organic materials, and the protrusion insulating layer comprises inorganic materials.

3. The display panel according to claim 1, wherein, The pixel electrode extends to the outside of the raised insulating layer, and the pixel electrode is electrically connected to a thin-film transistor disposed below the planarization layer through a contact hole in the planarization layer.

4. The display panel according to claim 1, wherein, The display panel further includes a pixel defining layer, which includes an opening around the central portion of the pixel electrode and is disposed on the planarization layer to cover the edge of the pixel electrode.

5. The display panel according to claim 4, wherein, In the plan view, the plurality of protrusions are positioned in the opening.

6. The display panel according to claim 4, wherein, In the plan view, some of the plurality of protrusions are positioned outside the opening.

7. The display panel according to claim 1, wherein, The display panel further includes a connector area positioned between the plurality of protrusions, connecting the plurality of protrusions to each other, and the connector area having a thickness smaller than the maximum height of each of the plurality of protrusions, wherein the plurality of protrusions and the connector area are integrally formed as a single unit.

8. The display panel according to claim 1, wherein, The taper angle of each of the plurality of protrusions relative to the upper surface of the planarization layer is 25° to 35° at its edge.

9. The display panel according to claim 1, wherein, In the plan view, the area of ​​each of the plurality of second raised surfaces is larger than the area of ​​the first raised surface.

10. An electronic device, wherein, The electronic device includes: One or more processors; and The display panel according to any one of claims 1 to 9, wherein the display panel is controlled by the one or more processors.

Images