Phase change heat spreader and method of making same

Abstract

The application provides a phase change radiator and a manufacturing method thereof, and the manufacturing method comprises the following steps: S1, a first metal plate is obtained, and the first metal plate is provided with a hollow formed in a thickness direction thereof; S2, a second metal plate and a third metal plate are obtained, the first metal plate is arranged between the second metal plate and the third metal plate, a cavity is formed at the hollow of the first metal plate, the cavity is used for filling a phase change medium, and an outer surface of the third metal plate is used for mounting a chip; and S3, a cooling device is obtained, and the second metal plate is cooled by the cooling device. The manufacturing method of the phase change radiator can efficiently cool the chip in a phase change mode.

Description

Technical Field

[0001] This invention relates to the field of radiators, and in particular to a phase change radiator and its manufacturing method. Background Technology

[0002] Chips (such as central processing units, graphics processing units, power chips, etc.) generate a lot of heat during operation. Excessive temperature will seriously affect their performance, reliability and lifespan.

[0003] Existing heat dissipation technologies mainly include air cooling and liquid cooling. Air-cooled heat sinks are simple in structure and low in cost, but their heat dissipation efficiency is limited and they are difficult to meet the heat dissipation requirements of ultra-high power density chips. Liquid-cooled heat sinks, while having strong heat dissipation capabilities, usually require complex pump drive systems and precise temperature control. The system design is complex and costly, and there is also a risk of coolant leakage. Summary of the Invention

[0004] To address the aforementioned problems in the prior art, the present invention aims to provide a phase change heat sink and its manufacturing method, which can efficiently dissipate heat from a chip through a phase change mechanism.

[0005] To address the above problems, the present invention provides a method for manufacturing a phase change heat sink, the method comprising:

[0006] Step S1: Obtain a first metal plate, on which a perforation penetrating the thickness direction is formed;

[0007] Step S2: Obtain the second metal plate and the third metal plate, place the first metal plate between the second metal plate and the third metal plate, form a cavity in the hollow part of the first metal plate, the cavity is used to fill the phase change medium, and the outer surface of the third metal plate is used to mount the chip.

[0008] Step S3: Obtain a cooling device and cool the second metal plate using the cooling device.

[0009] Further, step S1 includes:

[0010] Step S11: Obtain the first layer board, the second layer board, and the third layer board;

[0011] Step S12: The first layer plate is cut to form a plurality of spaced first cutouts; the second layer plate is cut to form a second cutout that can cover all the first cutouts; and the third layer plate is cut to form a third cutout that can cover all the first cutouts.

[0012] Step S13: Place the first layer plate between the second layer plate and the third layer plate to form the first metal plate, wherein the first cutout, the second cutout and the third cutout are interconnected.

[0013] Furthermore, in step S12, the first cutout is further cut to form a chamfered edge at the upper edge of the first cutout.

[0014] Further, step S2 includes:

[0015] The lower surface of the second metal plate is cold-forged or cut to form a protrusion on the lower surface of the second metal plate;

[0016] The lower surface of the second metal plate covers the upper surface of the first metal plate, and the protrusion extends into the second cutout and the first cutout.

[0017] Furthermore, the protrusion is formed as a column or an inverted cone, the cross-sectional area of ​​which decreases along the direction toward the first metal plate.

[0018] Furthermore, step S2 also includes:

[0019] The upper surface of the second metal plate is cold-forged or cut to form needle-like fins on the upper surface of the second metal plate.

[0020] Furthermore, the first cutout includes at least one group, with each group of the first cutouts corresponding to one chip, and the distribution density of each group of the first cutouts on the first layer plate decreases from the projection center of the chip corresponding to the group towards the edge.

[0021] Further, step S3 includes:

[0022] Step S31: Obtain a fourth metal plate, cut the fourth metal plate to form a strip-shaped groove for containing coolant on the lower surface of the fourth metal plate, and form an inlet hole and an outlet hole on the fourth metal plate that communicate with the groove.

[0023] Step S32: Connect the lower surface of the fourth metal plate to the upper surface of the second metal plate.

[0024] Furthermore, the process between steps S31 and S32 includes:

[0025] Step S33: Obtain the first fan blade, the second fan blade, and the connecting shaft. The first fan blade is disposed on the lower surface of the second metal plate and located in the second hollow. The second fan blade is disposed in the strip-shaped groove of the fourth metal plate. The connecting shaft is rotatable and passes through the second metal plate in a closed manner, with its two ends connected to the first fan blade and the second fan blade respectively. The flow of coolant in the strip-shaped groove enables the second fan blade to drive the first fan blade to rotate.

[0026] The present invention provides another phase change heat sink, which is manufactured by any of the phase change heat sink manufacturing methods described above.

[0027] Due to the above technical solution, the present invention has the following beneficial effects:

[0028] According to the method for manufacturing the phase change heat sink of the present invention, a sealed phase change chamber is cleverly constructed by decomposing the complex internal cavity structure into three independent metal plates and using a stacking method. This modular manufacturing method greatly reduces the difficulty compared to carving out a complex cavity from a single piece of metal, making it easier to achieve industrial mass production. The phase change heat sink manufactured by this method utilizes the efficient heat transfer characteristics of the phase change medium to rapidly transfer the heat generated by the chip to the cooling end, exhibiting extremely high heat dissipation efficiency and excellent temperature uniformity.

[0029] This solution utilizes the efficient heat transfer characteristics of phase change media to rapidly transfer the heat generated by the chip to the cooling end, solving the problem of low efficiency in traditional air cooling. Simultaneously, the cooling device only needs to cool the second metal plate (condensation end), without directly facing the extreme heat load on the chip surface. This reduces the stringent requirements on coolant temperature and system precision, simplifies the overall system design, and overcomes the shortcomings of existing liquid cooling systems, such as complexity and high cost. Attached Figure Description

[0030] To more clearly illustrate the technical solutions of the present invention, the accompanying drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0031] Figure 1 This is a flowchart of a method for manufacturing a phase change heat sink according to an embodiment of the present invention;

[0032] Figure 2 This is a structural diagram of a phase change heat sink and a chip according to an embodiment of the present invention;

[0033] Figure 3 yes Figure 2Exploded view of the phase change heat sink and chip in the embodiment;

[0034] Figure 4 This is a structural diagram of a first metal plate according to an embodiment of the present invention;

[0035] Figure 5 yes Figure 4 Another structural view of the first metal plate in the embodiment.

[0036] Figure label:

[0037] 100, Chip; 200, Third Metal Plate; 300, Third Layer Plate; 310, Third Cutout; 400, First Layer Plate; 410, First Cutout; 500, Second Layer Plate; 510, Second Cutout; 600, Second Metal Plate; 610, Protrusion; 700, Fourth Metal Plate; 710, Liquid Inlet Hole. Detailed Implementation

[0038] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0040] The following describes the manufacturing method of the phase change heat sink according to an embodiment of the present invention.

[0041] like Figures 1 to 5 As shown, the manufacturing method of the phase change heat sink according to an embodiment of the present invention includes the following steps:

[0042] Step S1: Obtain a first metal plate, on which a perforation extending through its thickness is formed.

[0043] The first metal plate is the core framework of the entire phase change heat sink. This first metal plate is the component that forms the phase change chamber. The first metal plate is preferably made of a metal with high thermal conductivity, such as copper, aluminum, or their alloys. The perforation is a through-hole that extends through the thickness of the plate; its shape can be circular, square, racetrack-shaped, or any other geometric shape. The purpose of the perforation is to provide space to accommodate the phase change medium when combined with subsequent plates.

[0044] Step S2: Obtain the second metal plate 600 and the third metal plate 200, place the first metal plate between the second metal plate 600 and the third metal plate 200, form a cavity in the cutout of the first metal plate, the cavity is used to fill the phase change medium, and the outer surface of the third metal plate 200 is used to mount the chip 100.

[0045] The second metal plate 600 serves as the top cover of the phase change chamber, and the third metal plate 200 serves as the bottom plate of the phase change chamber. The first metal plate is sandwiched between the second metal plate 600 and the third metal plate 200, and the three are tightly and sealed together as a single unit through welding, brazing, or diffusion welding. The cutouts on the first metal plate are sealed at their top and bottom ends by the second metal plate 600 and the third metal plate 200, respectively, thus forming one or more sealed chambers. These chambers are evacuated and filled with an appropriate amount of phase change medium, such as fluorinated liquid, the working fluid being selected according to the target operating temperature range. The lower surface of the third metal plate 200 is precision-machined to ensure flatness, and is used to tightly connect with the chip 100 to be cooled via a thermally conductive interface material (such as thermal grease, thermal pads, solder, etc.), forming a low thermal resistance heat conduction path. This design allows heat to be efficiently conducted from the chip 100 to the interior of the chamber.

[0046] Step S3: Obtain a cooling device and cool the second metal plate 600 using the cooling device.

[0047] The cooling device is used to remove the final heat. It can be an air-cooled heat dissipation module (such as a fan with fins), a liquid cooling plate, or any other device capable of effectively cooling the second metal plate 600. Its function is to continuously and efficiently cool the second metal plate 600, which serves as the condensation end, keeping its temperature below the saturation temperature of the phase change medium within the chamber. Thus, the vapor that absorbs heat from the lower chip 100 and rises, upon contacting the cooler second metal plate 600, condenses, releasing latent heat and turning into a liquid. Under gravity, it flows back to the bottom of the chamber, completing a full phase change cycle.

[0048] The manufacturing method of this invention cleverly constructs a sealed phase-change chamber by decomposing the complex internal chamber structure into three independent metal plates and using a stacking method. This modular manufacturing method significantly reduces the difficulty compared to carving out a complex chamber from a single piece of metal, making it easier to achieve industrial-scale mass production. The phase-change heat sink produced by this method utilizes the highly efficient heat transfer characteristics of the phase-change medium to rapidly transfer the heat generated by the chip 100 to the cooling end, exhibiting extremely high heat dissipation efficiency and excellent temperature uniformity.

[0049] This solution utilizes the efficient heat transfer characteristics of phase change media to rapidly transfer the heat generated by chip 100 to the cooling end, solving the problem of low efficiency in traditional air cooling. Simultaneously, the cooling device only needs to cool the second metal plate 600 (condensation end), without directly facing the extreme heat load on the surface of chip 100. This reduces the stringent requirements on coolant temperature and system accuracy, simplifies the overall system design, and overcomes the shortcomings of existing liquid cooling systems, such as complexity and high cost.

[0050] In some embodiments of the present invention, such as Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, step S1 specifically includes:

[0051] Step S11: Obtain the first layer plate 400, the second layer plate 500, and the third layer plate 300.

[0052] First, prepare three independent metal plates: the first plate 400 as the middle layer, and the second plate 500 and the third plate 300 as the upper and lower cover plates, respectively.

[0053] In step S12, the first layer plate 400 is cut to form a plurality of spaced first cutouts 410, the second layer plate 500 is cut to form second cutouts 510 that can cover all the first cutouts 410, and the third layer plate 300 is cut to form third cutouts 310 that can cover all the first cutouts 410.

[0054] Cutting refers to shaping on a metal sheet through mechanical processing (such as milling and drilling) or laser cutting. Multiple first perforations 410, separated from each other and arranged in an array or specific pattern, are machined on the first layer 400. These first perforations 410 are the main components of the chamber. A large second perforation 510 is machined on the second layer 500, its size and position designed to cover all the first perforations 410 in the vertical direction, serving as a connection and gas collection point. Similarly, a large third perforation 310 is machined on the third layer 300, its size and position also ensuring that it covers all the first perforations 410, serving as a connection and liquid collection point.

[0055] Step S13: Place the first layer plate 400 between the second layer plate 500 and the third layer plate 300 to form the first metal plate, and the first cutout 410, the second cutout 510 and the third cutout 310 are interconnected.

[0056] These three layers of plates are stacked and aligned in sequence, and then fixed into a whole by welding or other methods, thus forming the first metal plate. At this point, the first cutout 410, the second cutout 510, and the third cutout 310 are connected in the vertical direction, forming a composite chamber with a larger internal space and a more complex structure.

[0057] Refining the original single metal sheet into a three-layer structure represents another optimization of the manufacturing process. By processing thin sheets with different perforation patterns separately, complex internal structures that are difficult to manufacture using traditional methods can be easily achieved. For example, the multiple small perforations on the middle first layer 400 can serve as support pillars or reinforce the microstructures for boiling / condensation, while the large perforations in the upper and lower layers ensure smooth flow of steam and liquid. This design not only enhances the performance potential of the radiator but also reduces the difficulty and cost of processing individual parts.

[0058] Furthermore, the structure of the first perforation 410 was further defined. For example... Figure 4 As shown, in step S12, the first cutout 410 is further cut to form a chamfered edge on the upper edge of the first cutout 410.

[0059] The upper edge of the first cutout 410 here refers to the edge closest to the second metal plate 600 (i.e., the condenser end) after final assembly. This right-angled edge is machined into a bevel or rounded surface with a certain angle through an additional cutting process, i.e., a chamfered edge.

[0060] The chamfered edge on the upper edge of the first perforation 410 has significant technical advantages. Firstly, it provides a smoother, less-resistance inlet for the rising hot steam from the lower chamber, facilitating rapid steam diffusion to the condensation end and reducing flow losses. Secondly, when the steam condenses into liquid on the lower surface of the second metal plate 600 or on the protrusion 610 extending into the perforation, the chamfered edge guides the droplets to flow more smoothly back along the wall to the bottom of the chamber, preventing liquid accumulation at the right angles of the perforation edge, thus avoiding "liquid blockage" or thickening of the liquid film. This effectively reduces condensation thermal resistance and maintains the high efficiency and stability of the phase change cycle.

[0061] Furthermore, step S2 was further optimized. For example... Figure 3 As shown, step S2 includes:

[0062] The lower surface of the second metal plate 600 is cold-forged or cut to form a protrusion 610 on the lower surface of the second metal plate 600.

[0063] The second metal plate 600 serves as a condensation end cover. A downwardly protruding protrusion 610 is integrally formed on its lower surface through a processing method such as cold forging (a metal pressure processing technique) or cutting. These protrusions 610 can be of various shapes, such as columnar, conical, or sheet-like.

[0064] The lower surface of the second metal plate 600 covers the upper surface of the first metal plate (i.e., the assembly consisting of the first layer plate 400, the second layer plate 500, and the third layer plate 300), and the protrusion 610 extends into the second cutout 510 and the first cutout 410.

[0065] When assembling the second metal plate 600 with the first metal plate, these pre-processed protrusions 610 are precisely inserted into the space defined by the second cutout 510 and the first cutout 410 of the lower first metal plate.

[0066] This method significantly expands the condensation surface area by directly machining protrusions 610 extending into the chamber onto the condenser end cover. These protrusions 610 act as "three-dimensional" condenser fins, significantly increasing the contact area between steam and the condensation surface, allowing steam to condense more quickly and fully, thereby greatly enhancing the maximum heat transfer capacity of the phase change radiator. This design integrates the condenser's function onto the end plate, resulting in a compact and efficient structure.

[0067] Furthermore, the shape of the protrusion 610 is further defined. The protrusion 610 is formed as a column or an inverted cone, the cross-sectional area of ​​which decreases along the direction toward the first metal plate.

[0068] The protrusion 610 can be a simple prism, such as a cylinder or prism, providing a uniformly expanded surface area. More preferably, the protrusion 610 is designed as an inverted cone, i.e., its cross-sectional area gradually decreases from top to bottom (from one end near the body of the second metal plate 600 to the free end extending downward into the cavity). Typical examples include cones, pyramids, frustums, etc.

[0069] In addition to providing a large condensation surface area, the inverted cone-shaped protrusion 610 has a unique technical effect: facilitating the shedding and reflux of condensate droplets. Because the inverted cone is wider at the top and narrower at the bottom, droplets condensed on its surface easily drip from the tip of the cone or flow rapidly down the slope under the influence of gravity, unlike on a cylindrical surface where surface tension might cause them to stagnate and form a thicker liquid film. Maintaining a thin liquid film on the condensation surface is key to maintaining a high condensation heat transfer coefficient. Therefore, the inverted cone design further enhances the condensation process.

[0070] In some embodiments of the present invention, step S2 has been supplemented. Step S2 further includes:

[0071] The upper surface of the second metal plate 600 is cold-forged or cut to form needle-like fins on the upper surface of the second metal plate 600.

[0072] Similar to the protrusion 610 on the lower surface, upward-protruding needle-like fins are integrally formed on the upper surface of the second metal plate 600 by cold forging or cutting. The needle-like fins can be columnar, sheet-like, or other microstructures with a high expanded surface area.

[0073] The formation of fins on the upper surface of the second metal plate 600 enhances heat exchange with external cooling devices (such as fans or liquid cooling plates). When the external cooling device is a fan, the fins significantly increase the contact area with air, improving air cooling efficiency. When the external cooling device is a liquid cooling plate, the fins extending into the liquid cooling plate channels significantly enhance convective heat transfer and reduce contact thermal resistance. This makes the second metal plate 600 itself a highly efficient "cold-end heat exchanger," capable of rapidly transferring the heat released by the condensation of the phase change medium within the chamber to the external cooling medium, maintaining the low temperature at the condensation end, and ensuring the driving force of the phase change cycle.

[0074] In some embodiments of the present invention, the cutout layout of the intermediate layer board (first layer board 400) has been optimized. The first cutout 410 includes at least one group, and each group of first cutouts 410 corresponds to one chip 100. The distribution density of each group of first cutouts 410 on the first layer board 400 decreases from the projection center of the chip 100 corresponding to that group towards the edge.

[0075] When cooling multiple chips 100 (such as a multi-chip 100 module) or a large chip 100 with extremely uneven heat distribution is required, the first cutout 410 on the first layer board 400 can be divided into multiple groups. Each group of first cutouts 410 is aligned vertically with the projection area of ​​a chip 100. Furthermore, within each group, the distribution of the first cutouts 410 is not uniform, but rather exhibits a density gradient: the distribution of the first cutouts 410 is densest in the central region (hot spot region) of the chip 100 projection; the closer to the edge of the chip 100 projection, the sparser the cutout distribution.

[0076] This "on-demand allocation" of perforation density perfectly matches the typical heat flux density distribution on the surface of the chip 100, which is high in the center and low at the edges. In the central region, where heat flux density is highest, more phase-change cores and larger gas-liquid exchange space are provided, thus giving this area stronger local heat dissipation capabilities and effectively suppressing hotspot temperatures. In the edge regions with lower heat flux density, the perforations are appropriately reduced, ensuring structural strength while also making the temperature distribution across the entire chip 100 surface more uniform. This achieves precise allocation of heat dissipation resources, representing an advanced design that improves heat sink performance and temperature uniformity.

[0077] In some embodiments of the present invention, the use of liquid cooling as a cooling device in step S3 is described in detail. For example... Figure 2 and Figure 3 As shown, step S3 includes:

[0078] Step S31: Obtain the fourth metal plate 700, cut the fourth metal plate 700 to form a strip-shaped groove for containing coolant on the lower surface of the fourth metal plate 700, and form an inlet hole 710 and an outlet hole on the fourth metal plate 700 that connect the groove.

[0079] The fourth metal plate 700 is the main body of the liquid cooling plate. One or more grooves with a certain shape (such as straight, serpentine, or spiral) are machined on its lower surface, and these grooves serve as channels for the coolant. At the same time, inlet holes 710 and outlet holes are machined on the side or top surface of the fourth metal plate 700. These two holes are connected to the two ends of the grooves for connecting to an external coolant circulation system.

[0080] Step S32: Connect the lower surface of the fourth metal plate 700 to the upper surface of the second metal plate 600.

[0081] The lower surface of the processed fourth metal plate 700 is tightly bonded to the upper surface of the second metal plate 600 and fixed together by welding, thermally conductive adhesive bonding, or pressing with fasteners. At this point, the groove of the fourth metal plate 700 is closed by the upper surface of the second metal plate 600, forming a sealed channel for the flow of coolant.

[0082] This method provides a specific process for integrating phase change heat dissipation with liquid cooling. By machining flow channels into a metal plate and then attaching it to the condenser end of the phase change heat sink, a complete "phase change + liquid cooling" composite heat dissipation system is formed. This integration method has a compact structure and low interfacial thermal resistance. During operation, the flowing coolant passes through the grooves, directly carrying away the heat conducted from the second metal plate 600. Its extremely high heat capacity and heat transfer coefficient ensure that the condenser end of the phase change heat sink is maintained at an extremely low temperature, enabling the entire system to cope with extreme heat dissipation power demands of several kilowatts or even higher.

[0083] Furthermore, a structure was added that utilizes liquid-cooled flow to drive internal gas disturbance. For example... Figure 4 As shown, the process between step S31 and step S32 also includes:

[0084] Step S33: Obtain the first fan blade, the second fan blade, and the connecting shaft. The first fan blade is disposed on the lower surface of the second metal plate 600 and located in the first cutout 410 (or the second cutout 510). The second fan blade is disposed in the strip-shaped groove of the fourth metal plate 700. The connecting shaft is rotatable and passes through the second metal plate 600 in a closed manner, with its two ends connected to the first fan blade and the second fan blade respectively.

[0085] Before assembly, the first fan blade, the second fan blade, and the connecting shaft are prefabricated. First, the connecting shaft is rotatably and sealingly installed in an opening on the second metal plate 600. Then, the second fan blade is placed in a groove in the fourth metal plate 700 and connected to the upper end of the connecting shaft. The first fan blade is placed below the second metal plate 600 and connected to the lower end of the connecting shaft. Finally, step S32 is performed to connect the fourth metal plate 700 to the second metal plate 600. In this way, when coolant flows in the groove of the fourth metal plate 700, the flowing liquid will drive the second fan blade to rotate, and the second fan blade will drive the first fan blade located inside the phase change chamber to rotate synchronously via the connecting shaft.

[0086] This embodiment cleverly utilizes the kinetic energy of the external coolant flow to drive the rotation of the fan blades inside the chamber. The rotation of the first fan blade produces the following beneficial effects: First, it agitates the steam and air inside the chamber, forcing convection, which can break up any stagnant steam layers and accelerate the movement of steam towards the condenser end; second, the rotating airflow can sweep the condensation surface, helping to peel off accumulated condensate droplets, reducing the thickness of the liquid film, thereby further enhancing condensation heat transfer. This design transforms the phase change process inside the radiator from "passive" natural convection to "active" forced convection-assisted convection, significantly improving its heat dissipation performance limits, especially under certain special operating conditions.

[0087] The phase change heat sink according to an embodiment of the present invention will be described below.

[0088] like Figures 2 to 5 As shown, the phase change radiator is manufactured using any of the above-mentioned methods for manufacturing phase change radiators.

[0089] The structural features of a phase change heat sink obtained by any of the aforementioned manufacturing methods are defined by the manufacturing method. For example, it includes a sealed chamber composed of a first metal plate, a second metal plate 600, and a third metal plate 200, and the chamber contains a phase change medium; the lower surface of the second metal plate 600 may have a protrusion 610 extending into the chamber, and the upper surface may have pin fins; the perforations inside the chamber may have a specific distribution density and chamfer structure; its top may be integrated with a liquid cooling plate with flow channels, and there may even be a fan blade driven by liquid cooling inside the chamber, etc.

[0090] This phase-change heat sink integrates all the structural advantages of the aforementioned manufacturing methods. Therefore, it boasts extremely high heat dissipation efficiency, excellent temperature uniformity, compact structure, and high reliability. Furthermore, due to its modular manufacturing method, its manufacturing cost is controllable, resulting in good economic efficiency. It can be widely used in various applications requiring efficient heat dissipation, particularly for chip cooling in high heat flux density applications such as servers, data centers, high-performance computing devices, and power electronic converters.

[0091] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for manufacturing a phase change heat sink, characterized in that, The manufacturing method includes: Step S1: Obtain a first metal plate, on which a perforation penetrating the thickness direction is formed; Step S2: Obtain the second metal plate and the third metal plate, place the first metal plate between the second metal plate and the third metal plate, form a cavity in the hollow part of the first metal plate, the cavity is used to fill the phase change medium, and the outer surface of the third metal plate is used to mount the chip. Step S3: Obtain a cooling device and cool the second metal plate using the cooling device.

2. The method for manufacturing a phase change heat sink according to claim 1, characterized in that, Step S1 includes: Step S11: Obtain the first layer board, the second layer board, and the third layer board; Step S12: The first layer plate is cut to form a plurality of spaced first cutouts; the second layer plate is cut to form a second cutout that can cover all the first cutouts; and the third layer plate is cut to form a third cutout that can cover all the first cutouts. Step S13: Place the first layer plate between the second layer plate and the third layer plate to form the first metal plate, wherein the first cutout, the second cutout and the third cutout are interconnected.

3. The method for manufacturing a phase change heat sink according to claim 2, characterized in that, In step S12, the first cutout is further cut to form a chamfered edge at the upper edge of the first cutout.

4. The method for manufacturing a phase change heat sink according to claim 2, characterized in that, Step S2 includes: The lower surface of the second metal plate is cold-forged or cut to form a protrusion on the lower surface of the second metal plate; The lower surface of the second metal plate covers the upper surface of the first metal plate, and the protrusion extends into the second cutout and the first cutout.

5. The method for manufacturing a phase change heat sink according to claim 4, characterized in that, The protrusion is formed as a column or an inverted cone, the cross-sectional area of ​​which decreases along the direction toward the first metal plate.

6. The method for manufacturing a phase change heat sink according to claim 4, characterized in that, Step S2 further includes: The upper surface of the second metal plate is cold-forged or cut to form needle-like fins on the upper surface of the second metal plate.

7. The method for manufacturing a phase change heat sink according to claim 2, characterized in that, The first cutout includes at least one set, with each set of the first cutout corresponding to one chip. The distribution density of each set of the first cutout on the first layer decreases from the projection center of the chip corresponding to that set towards the edge.

8. The method for manufacturing a phase change heat sink according to claim 6, characterized in that, Step S3 includes: Step S31: Obtain a fourth metal plate, cut the fourth metal plate to form a strip-shaped groove for containing coolant on the lower surface of the fourth metal plate, and form an inlet hole and an outlet hole on the fourth metal plate that communicate with the groove. Step S32: Connect the lower surface of the fourth metal plate to the upper surface of the second metal plate.

9. The method for manufacturing a phase change heat sink according to claim 8, characterized in that, Between steps S31 and S32, the following is also included: Step S33: Obtain the first fan blade, the second fan blade, and the connecting shaft. The first fan blade is disposed on the lower surface of the second metal plate and located in the second hollow. The second fan blade is disposed in the strip-shaped groove of the fourth metal plate. The connecting shaft is rotatable and passes through the second metal plate in a closed manner, with its two ends connected to the first fan blade and the second fan blade respectively. The flow of coolant in the strip-shaped groove enables the second fan blade to drive the first fan blade to rotate.

10. A phase change radiator, characterized in that, The phase change heat sink is manufactured by the method for manufacturing a phase change heat sink according to any one of claims 1 to 9.

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