Antenna device comprising glass to which optical fibers are attached

Abstract

An apparatus includes a glass layer and an optical fiber directly attached to the glass layer. The apparatus also includes a photodiode electrically connected to an antenna element. The apparatus also includes a lens coupled to or included within the glass layer and configured to manipulate light exchanged between the optical fiber and the photodiode. The photodiode is configured to convert optical signals from the optical fiber to electrical signals for the antenna element, convert electrical signals from the antenna element to optical signals provided to the optical fiber, or both.

Description

[0001] Cross-reference to related applications

[0002] This application claims the benefit of priority to jointly owned U.S. non-provisional patent application No. 18 / 514,225, filed November 20, 2023, the entire contents of which are expressly incorporated herein by reference. Technical Field

[0003] Various features are involved in antenna equipment. Background Technology

[0004] In conventional antenna equipment, alignment sleeves are used to align optical fibers with corresponding lenses that manipulate the light exchanged between the fibers and photodiodes. The pitch (e.g., space) between the fibers must be large enough to accommodate the alignment sleeve. A larger pitch means fewer fibers and a lower data rate supported by the antenna equipment. Summary of the Invention

[0005] Various features are involved in integrated circuit devices.

[0006] One example provides a device comprising: a glass layer; an optical fiber directly attached to the glass layer; and a photodiode electrically connected to an antenna element. The device further includes a lens coupled to or included within the glass layer and configured to manipulate light exchanged between the optical fiber and the photodiode. The photodiode is configured to convert an optical signal from the optical fiber into an electrical signal for the antenna element, convert an electrical signal from the antenna element into an optical signal supplied to the optical fiber, or both.

[0007] Another example provides a method of manufacturing an apparatus. The method includes aligning an optical fiber with a lens and a photodiode, such that the lens is positioned to manipulate light exchanged between the optical fiber and the photodiode. The method further includes directly attaching the optical fiber to a first side of a glass layer including or coupled to the lens. The method also includes electrically connecting the photodiode to an antenna element. The photodiode is configured to convert an optical signal from the optical fiber into an electrical signal for the antenna element, convert an electrical signal from the antenna element into an optical signal provided to the optical fiber, or both.

[0008] Another example provides a device comprising: a glass layer; a plurality of optical fibers directly attached to the glass layer; and a plurality of antenna elements. The device further includes a plurality of photodiodes, with a particular photodiode electrically connected to a corresponding antenna element among the plurality of antenna elements. The device also includes a plurality of lenses coupled to or included within the glass layer, with a particular lens configured to manipulate light exchanged between a particular optical fiber and the particular photodiode. The particular photodiode is configured to convert an optical signal from the particular optical fiber into an electrical signal for the corresponding antenna element, convert an electrical signal from the corresponding antenna element into an optical signal provided to the particular optical fiber, or both. Attached Figure Description

[0009] The various features, essence, and advantages will become apparent when the detailed description set forth below is understood in conjunction with the accompanying drawings, in which similar reference characters are used for corresponding identification throughout.

[0010] Figure 1 A cross-sectional profile of an exemplary device including glass with attached optical fibers is shown.

[0011] Figure 2 A cross-sectional profile view of an exemplary substrate having embedded passive components of a device including glass with attached optical fibers is shown.

[0012] Figure 3 A cross-sectional profile of another exemplary device including glass with attached optical fibers is shown.

[0013] Figure 4 A cross-sectional profile of another exemplary device including glass with attached optical fibers is shown.

[0014] Figure 5 A cross-sectional profile of another exemplary device including glass with attached optical fibers is shown.

[0015] Figure 6 A cross-sectional profile of another exemplary device including glass with attached optical fibers is shown.

[0016] Figure 7A A cross-sectional profile of another exemplary device including glass with attached optical fibers is shown.

[0017] Figure 7B A cross-sectional profile of another exemplary device including glass with attached optical fibers is shown.

[0018] Figure 8 An exemplary sequence of stages is illustrated for an exemplary apparatus for manufacturing glass including attached optical fibers.

[0019] Figure 9 Additional stages of an exemplary sequence of exemplary apparatus for manufacturing glass including attached optical fibers are illustrated.

[0020] Figure 10 An exemplary flowchart illustrating a method for manufacturing an antenna device including glass with attached optical fibers.

[0021] Figure 11 Examples are provided of various electronic devices that can integrate the dies, electronic circuits, integrated devices, integrated passive devices (IPDs), passive components, packages and / or device packages described herein. Detailed Implementation

[0022] In the following description, specific details are set forth to provide a thorough understanding of the various aspects of this disclosure. However, those skilled in the art will understand that these aspects can be practiced without these specific details. For example, circuits may be shown as block diagrams to avoid complicating these aspects with unnecessary detail. In other instances, well-known circuits, structures, and techniques may not be shown in detail to avoid complicating these aspects of this disclosure.

[0023] This disclosure describes an apparatus comprising: a glass layer; an optical fiber directly attached to the glass layer; and a photodiode electrically connected to an antenna element. The apparatus further includes a lens coupled to or included within the glass layer and configured to manipulate light exchanged between the optical fiber and the photodiode. The photodiode is configured to convert an optical signal from the optical fiber into an electrical signal for the antenna element, convert an electrical signal from the antenna element into an optical signal supplied to the optical fiber, or both. The optical fiber is directly attached to the glass layer, eliminating the need for an alignment sleeve to align the optical fiber and the lens with the photodiode. Therefore, the pitch between the optical fibers can be reduced, and the number of optical fibers and the data rate supported by the apparatus can be increased.

[0024] Specific aspects of this disclosure are described below with reference to the accompanying drawings. In this description, common features are designated by common reference numerals. As used herein, various terms are used only for the purpose of describing particular embodiments and are not intended to limit the scope of the embodiments. For example, the singular forms “a,” “an,” and “the” are intended to also include the plural forms, unless the context clearly indicates otherwise. Furthermore, some features described herein are singular in some embodiments and plural in others. For ease of reference herein, such features are generally introduced as “one or more” features and are subsequently referred to in the singular or optional plural form (as indicated by “(multiple)”), unless the aspect relating to multiples of features is being described.

[0025] As used herein, the term “comprising” is used interchangeably with “including”. As used herein, “exemplary” indicates an example, specific implementation, and / or aspect, and should not be construed as restrictive or indicating a preference or preferred implementation. As used herein, ordinal terms used to modify elements (such as structures, components, operations, etc.) (e.g., “first,” “second,” “third,” etc.) do not in themselves indicate any priority or order of that element relative to another element, but merely distinguish that element from another element with the same name (but using ordinal terms). As used herein, the term “set” refers to one or more specific elements among specific elements, while the term “multiple” refers to multiple (e.g., two or more) specific elements.

[0026] In some figures, multiple instances of a particular type of feature are used. Although these features are physically and / or logically different, the same reference numerals are used for each feature, and these different instances are distinguished by adding letters to the reference numerals. Reference numerals are used without distinguishing letters when a feature is referenced herein as a group or a type of feature (e.g., when a specific feature among these features is not referenced). However, reference numerals are used with distinguishing letters when a specific feature among multiple features of the same type is mentioned herein. See, for example, [link to relevant documentation]. Figure 1 The figure illustrates multiple photodiodes, which are associated with reference numerals 110A and 110B. When referring to a specific location among these locations (such as photodiode 110A), the distinguishing letter "A" is used. However, when referring to any of these photodiodes or to these photodiodes as a group, the reference numeral 110 without a distinguishing letter is used.

[0027] As used herein, the term "layer" includes films and is not construed as indicating vertical or horizontal thickness unless otherwise stated. As used herein, the term "chiplet" can refer to a block of integrated circuits, a block of functional circuitry, or other similar circuitry specifically designed to work with one or more other chiplets to form a larger, more complex chiplet architecture.

[0028] Exemplary antenna device including glass with attached optical fibers

[0029] Figure 1A cross-sectional profile of a device 100 including glass to which optical fibers are attached is illustrated. Device 100 includes a glass layer 104 and a plurality of optical fibers, such as fiber 102A and fiber 102B, directly attached to the glass layer 104. For example, one end of fiber 102A and one end of fiber 102B are directly attached to a side 144 of the glass layer 104. In some aspects, one end of fiber 102 is directly attached to side 144 using fusion, mechanical splicing, adhesive bonding, V-groove assembly, fiber connector, fiber optic sleeve, fiber Bragg grating, or a combination thereof. In one example, one end of fiber 102 is fused to side 144 of the glass layer 104. In another example, one end of fiber 102 is adhered to side 144 of the glass layer 104. It should be understood that the two optical fibers 102 directly attached to the glass layer 104 are provided as illustrative examples; in other examples, more than two optical fibers 102 may be directly attached to the glass layer 104.

[0030] The device 100 also includes an antenna array 120 adjacent to side 144 of the glass layer 104. In one example, the antenna array 120 includes antenna elements 108A, 108B, 108C, and 108D. It should be understood that the antenna array 120 including four antenna elements 108 is provided as an exemplary example, and in other examples, the antenna array 120 may include fewer or more than four antenna elements. In a particular embodiment, each antenna element in the antenna array 120 is directly attached to side 144 of the glass layer 104. In a particular embodiment, molding compound 122 at least partially encapsulates optical fibers 102A, 102B, the antenna array 120, the glass layer 104, or combinations thereof.

[0031] In a particular embodiment, there is no antenna element 108 between optical fibers 102A and 102B. For example, antenna elements 108A and 108B are located on the glass layer 104 on one side of optical fiber 102A relative to optical fiber 102B. As another example, antenna elements 108C and 108D are located on the glass layer 104 on one side of optical fiber 102B relative to optical fiber 102A.

[0032] A glass layer 104 is located between antenna element 108 and substrate 140. For example, glass layer 104 is located between antenna elements 108A and 108B and substrate 140A. As another example, glass layer 104 is located between antenna elements 108C and 108D and substrate 140B. Substrate 140 is located on side 142 of glass layer 104 opposite to side 144.

[0033] Device 100 includes passive components 130 (e.g., passive components 130A and 130B). Passive components 130 include one or more inductors, capacitors, varistors, thermistors, converters, passive filters, waveguides, or other types of passive components. In a particular embodiment, passive component 130 corresponds to a passive on-glass (POG) assembly coupled to side 142.

[0034] exist Figure 1 In device 100, passive element 130A includes an inductor 132A and a capacitor 134A, and passive element 130B includes an inductor 132B and a capacitor 134B. In a particular embodiment, passive element 130 is embedded in substrate 140 on side 142 of glass layer 104. For example, passive element 130A is embedded in substrate 140A, as shown in reference . Figure 2 Further description. As another example, passive component 130B is embedded in substrate 140B.

[0035] It should be understood that the passive element 130 embedded in the substrate 140A on side 142 of the glass layer 104 is provided as an illustrative example. In other examples, one or more of the passive elements 130 may be located on side 144 of the glass layer 104, one or more of the passive elements 130 may be integrated within the glass layer 104, or both. In a particular embodiment, the passive element 130 may be integrated within the glass layer 104, comprising a first feature on side 142 of the glass layer 104 and a second feature on side 144 of the glass layer 104.

[0036] Glass layer 104 includes glass through-holes (TGVs) that electrically connect antenna element 108 to passive element 130. For example, TGV 112A electrically connects antenna element 108A to inductor 132A, TGV 112B electrically connects antenna element 108B to capacitor 134A, TGV 112C electrically connects antenna element 108C to inductor 132B, and TGV 112D electrically connects antenna 108D to inductor 134B.

[0037] The apparatus 100 includes a die 118 located on side 142 of glass layer 104. The die 118 may include integrated circuits, such as multiple transistors and / or other circuit elements arranged and interconnected to form logic cells, memory cells, etc. Components of the integrated circuit may be formed in and / or on a semiconductor substrate. Different embodiments may use different types of transistors, such as field-effect transistors (FETs), planar FETs, fin FETs, gate-all-around FETs, or a mixture of transistor types. In some embodiments, front-end process (FEOL) processes may be used to fabricate the integrated circuit in and / or on the semiconductor substrate.

[0038] Die 118 includes a plurality of photodiodes 110, such as photodiode 110A and photodiode 110B. For example, photodiodes 110A and 110B are embedded in die 118. Each photodiode 110 is electrically connected to antenna element 108. For example, photodiode 110A is electrically connected to antenna element 108B via conductive interconnect 126A, capacitor 134A, and TGV 112B. As another example, photodiode 110B is electrically connected to antenna element 108C via conductive interconnect 126B, inductor 132B, and TGV 112C. As used herein, "conductive interconnect" may include solder bumps, solder balls, copper bumps, copper balls, copper pillars, solder-coated copper, another type of conductive interconnect, or combinations thereof.

[0039] Device 100 includes a plurality of lenses 106 coupled to or included within a glass layer 104. For example, device 100 includes lens 106A configured to manipulate light exchanged between optical fiber 102A and photodiode 110A. As another example, device 100 includes lens 106B configured to manipulate light exchanged between optical fiber 102B and photodiode 110B.

[0040] As a non-limiting example, manipulating light may include focusing, collimation, aperture control, beamforming, aberration correction, increasing coupling efficiency, or combinations thereof. In a particular embodiment, lens 106A focuses light emitted from fiber 102A onto the active region of photodiode 110A. In a particular example, lens 106A converts diverging light from fiber 102A into collimated light reaching photodiode 110A. In some aspects, lens 106A with a specific aperture reduces the intensity of light arriving at photodiode 110A from fiber 102A, reduces the influence of stray or background light, or combinations thereof. In some aspects, lens 106A performs beamforming to alter the spatial distribution of light emitted from fiber 102A. For example, lens 106A may change a Gaussian beam profile to a flat-top profile. Lens 106A may transform the beam into a specific shape that matches the geometry of the active region of photodiode 110A. Lens 106A may be designed to reduce optical aberrations such as spherical aberration, chromatic aberration, and coma. Lens 106A can improve the efficiency of optical coupling between optical fiber 102A and photodiode 110A. For example, it can increase the amount of light emitted from optical fiber 102A that reaches photodiode 110A.

[0041] Similarly, lens 106A can manipulate the light emitted from photodiode 110A and supplied to optical fiber 102A. In a particular embodiment, lens 106A focuses the light emitted from photodiode 110A onto the core of optical fiber 102A. In a particular example, lens 106A converts the diverging light from photodiode 110A into collimated light reaching optical fiber 102A. In some aspects, lens 106A performs beamforming to alter the spatial distribution of light emitted from optical fiber 102A. For example, lens 106A can transform the beam to match the acceptance angle and numerical aperture of optical fiber 102A. Lens 106A can reduce optical aberrations in the light reaching optical fiber 102A. Lens 106A can increase a portion of the light emitted from photodiode 110A reaching optical fiber 102A.

[0042] It should be understood that the glass layer 104 is provided as an exemplary example of a material to be directly attached to the optical fiber 102. In some examples, another rigid material that is transparent to the frequency of light exchanged between the optical fiber 102 and the photodiode 110 and is non-conductive may be used to directly attach the optical fiber 102. For example, the optical fiber 102 may be directly attached to a polymer layer.

[0043] A sealant layer 114 encapsulates conductive interconnect 126A, die 118, and conductive interconnect 126B. The sealant layer 114 encapsulates the volume comprising the lens 106 and photodiode 110 (which may be evacuated (e.g., vacuum) or filled with gas). In a particular aspect, the sealant layer 114 prevents particles (e.g., dust) from entering the encapsulated volume and interfering with the light exchanged between the lens 106 and the photodiode 110.

[0044] The distance between lens 106A and photodiode 110A corresponds to the focal length 116 of lens 106A. In some examples, lens 106A and photodiode 110A are positioned at a specific distance based on a predetermined focal length 116 of lens 106A. In some examples, lens 106A is designed to have a focal length 116 based on a target distance between lens 106A and photodiode 110A.

[0045] exist Figure 1 In device 100, lenses 106A and 106B are illustrated as formed portions of glass layer 104. In other examples, lens 106 may be directly attached (e.g., adhered or fused) to side 142 of glass layer 104, as referenced. Figure 3 As described. In yet another example, lens 106 corresponds to a gradient refractive index lens included within glass layer 104, as referenced. Figure 6 As described.

[0046] Optical fiber 102 is directly attached to side 144 of glass layer 104, and photodiode 110 is located on side 142 of glass layer 104. Photodiode 110A is configured to convert an optical signal from optical fiber 102A into an electrical signal for antenna element 108B, convert an electrical signal from antenna element 108B into an optical signal supplied to optical fiber 102A, or both. In one example, the optical signal from optical fiber 102A reaches photodiode 110A through lens 106A, and photodiode 110A converts the optical signal into an electrical signal and supplies the electrical signal to antenna element 108B via conductive interconnect 126A, capacitor 134A, and TGV 112B for wireless transmission. In another example, the electrical signal received by antenna element 108B is supplied to photodiode 110A via TGV 112B, capacitor 134A, and conductive interconnect 126A, and photodiode 110A converts the electrical signal into an optical signal that reaches optical fiber 102A via lens 106A for fiber optic transmission. Similarly, photodiode 110B is configured to convert an optical signal from optical fiber 102B into an electrical signal for antenna element 108C, convert an electrical signal from antenna element 108C into an optical signal provided to optical fiber 102B, or both.

[0047] In a particular embodiment, the pitch 124 between the center of the first connection of fiber 102A to glass layer 104 and the center of the second connection of fiber 102B to glass layer 104 is less than 0.2 millimeters (mm). Attaching fiber 102 directly to glass layer 104 allows the pitch 124 (e.g., 0.2 mm) to be smaller than the pitch (e.g., 2 mm) associated with aligning the fiber to the photodiode of the device using an alignment sleeve. The smaller pitch allows more fiber to be supported by device 100, enabling a smaller device to deliver the target data rate, or both.

[0048] The techniques described herein are scalable to support sixth-generation (6G) and beyond wireless. For example, device 100 may include more than two optical fibers 102 directly attached to glass layer 104. In one example, device 100 may be a modular antenna device assembly that can be combined with other similar devices. In a particular embodiment, device 100 is used to support antennas with a first dimension (e.g., 2.5 × 2.5 mm). 2 In another embodiment, device 100 is used to support a first fiber array (e.g., 12×12 fibers) containing a first fiber bundle (e.g., 144 fiber bundles). 2 The second fiber optic bundle (e.g., 900 fiber optic bundles) is placed in a second fiber optic array (e.g., 30×30 fibers). Smaller antenna devices with lower manufacturing costs can be placed in each room at a more affordable price to improve network connectivity.

[0049] In some implementations, die 118 includes input / output (I / O) circuitry, and one or more of the passive components 130 are connected to the I / O circuitry to provide a data path between die 118 and another device, as further referenced. Figure 5 and Figure 6 Description. As an illustrative example, the other device may include a dynamic random access memory (DRAM) chip (or chiplet). In this illustrative example, the I / O circuitry of die 118 may include or correspond to interface circuitry (e.g., serializer / deserializer (SerDes) circuitry, double data rate (DDR) type DRAM bus interface circuitry), memory buffers, and / or other circuitry that facilitates interaction between the active circuitry of die 118 and the DRAM.

[0050] Device 100 may also include connectors to couple device 100 to other circuitry. For example, device 100 may include interconnects (such as ball grid arrays (BGAs), C4 bumps, or other connectors) to electrically couple device 100 to a substrate. In this example, the interconnects may include connectors to a second set of contacts on a second die.

[0051] Figure 2 Examples Figure 1 A cross-sectional profile of an example substrate 140A having an embedded passive component 130A. The substrate 140A includes a dielectric layer 202 (e.g., a top layer) and a dielectric layer 206 (e.g., a bottom layer).

[0052] The dielectric layer 202 is configured adjacent to side 142 of the glass layer 104. A plurality of metal pads 212 (such as metal pads 212A and 212B) are embedded in the dielectric layer 202. In a particular aspect, metal pad 212A is positioned to... Figure 1 The TGV112A is aligned to be electrically connected to the antenna element 108A, and the metal pad 212B is positioned to be aligned with the TGV 112B to be electrically connected to the antenna element 108B.

[0053] Multiple metal pads 216 (such as metal pad 216A and metal pad 216B) are embedded in the dielectric layer 206. In a particular aspect, metal pad 216B is positioned to... Figure 1 The conductive interconnect 126A is aligned to be electrically connected to the die 118 and one or more photodiodes, such as photodiode 110A, embedded in the die 118.

[0054] Substrate 140 includes one or more intermediate dielectric layers, such as dielectric layer 204, between dielectric layer 202 and dielectric layer 206. Metal pads, vias, insulating layers, or combinations thereof are embedded in one or more intermediate dielectric layers. In one example, substrate 140A includes vias 232, 214A, and 236A arranged to electrically interconnect metal pads 212A and 216A. In some embodiments, two or more of metal pads 212A, 232, 214A, 236A, or 216A are offset and interconnected using electrical traces. In a particular aspect, via 232 is embedded in dielectric layer 202, and via 236A is embedded in dielectric layer 204. In another example, substrate 140A includes an insulating layer 222, a metal pad 224, a via 234, and a metal pad 214B aligned with and located between metal pads 212B and 216B. In a particular aspect, the insulating layer 222, metal pad 224, and via 234 are embedded in a dielectric layer 202. Via 236B is embedded in the dielectric layer 204.

[0055] Passive components 130A (e.g., inductor 132A and capacitor 134A) are embedded in substrate 140A. In some embodiments, inductor 132A is a two-dimensional (2D) inductor including metal pad 212A. In some embodiments, inductor 132A is a three-dimensional (3D) inductor including metal pad 212A, via 232, metal pad 214A, via 236A, and metal pad 216A. In some embodiments, capacitor 134A includes metal pad 212B, insulating layer 222, and metal pad 224. In certain aspects, substrate 140B corresponds to a mirror image of substrate 140A.

[0056] In an alternative embodiment, inductor 132A and capacitor 134A share a common metal pad (e.g., metal pad 212). For example, an LC circuit includes inductor 132A and capacitor 134A, as referenced. Figure 4 Further description.

[0057] Figure 3 A cross-sectional profile view of a device 300 including glass to which optical fibers are attached is illustrated. The device 300 includes optical fibers 102 directly attached to a glass layer 104. For example, optical fiber 102A extends through the glass layer 104, and optical fiber 102B extends through the glass layer 104.

[0058] Device 300 includes a lens 106 attached (e.g., fused or adhered) to optical fiber 102. For example, lens 106A is attached to optical fiber 102A, and lens 106B is attached to optical fiber 102B. In an alternative embodiment, optical fiber 102 is directly attached to glass layer 104, and lens 106 is located on glass layer 104, as referenced. Figure 1 As described.

[0059] Photodiode 110A is aligned with lens 106A and optical fiber 102A. Photodiode 110B is aligned with lens 106B and optical fiber 102B. The die 118 encapsulates the volume of photodiode 110 and lens 106 (e.g., vacuum or gas-filled).

[0060] Device 300 includes a laminated substrate 340 located between photodiode 110 and antenna elements 108 of antenna array 120. For example, antenna elements 108A and 108B are adjacent to a first side of the laminated substrate 340, and a die 118 is located on a second side of the laminated substrate 340 opposite to the first side. In a particular aspect, antenna element 108 is coupled to or embedded in the first side of the laminated substrate 340. Figure 1 The antenna array 120 and the optical fiber 102 are coupled to the glass layer 104 and are disposed oppositely on the same side 144 of the glass layer 104. Figure 3 In this configuration, the antenna array 120 is separate from the glass layer 104 and located on the opposite side of the optical fiber 102. In a particular aspect, one or more passive elements 130 are coupled to or embedded within the laminate substrate 340. The die 118 is electrically connected to the antenna element 108 via a plurality of conductive interconnects 326 (e.g., conductive interconnects 326A and 326B) and the passive elements 130.

[0061] Photodiode 110A is configured to convert an optical signal from optical fiber 102A into an electrical signal for antenna element 108A, convert an electrical signal from antenna element 108A into an optical signal supplied to optical fiber 102A, or both. In one example, the optical signal from optical fiber 102A reaches photodiode 110A through lens 106A, and photodiode 110A converts the optical signal into an electrical signal and supplies the electrical signal to antenna element 108A for wireless transmission via one or more of die 118, conductive interconnect 326A, and passive element 130. In another example, the electrical signal received by antenna element 108A is supplied to photodiode 110A via one or more of passive element 130, conductive interconnect 326A, and die 118, and photodiode 110A converts the electrical signal into an optical signal that reaches optical fiber 102A through lens 106A for fiber optic transmission. Similarly, photodiode 110B is configured to convert an optical signal from optical fiber 102B into an electrical signal for antenna element 108B, convert an electrical signal from antenna element 108B into an optical signal provided to optical fiber 102B, or both.

[0062] Molded compound 122 at least partially encapsulates optical fiber 102, glass layer 104, bare die 118, lens 106, photodiode 110, conductive interconnect 326A, conductive interconnect 326B, or combinations thereof. For ease of illustration, details of passive element 130 are not shown. It should be understood that conductive interconnect 326A and conductive interconnect 326B are provided as illustrative examples of contacts; in other examples, contacts of different shapes, different materials, or both may be used.

[0063] Figure 4 A cross-sectional profile view of a device 400 including glass with attached optical fibers is illustrated. Device 400 includes an optical fiber 102 directly attached to a glass layer 104 and a lens 106 attached (e.g., fused or adhered) to the optical fiber 102, as shown in reference. Figure 3 As described. In an alternative embodiment, the optical fiber 102 is directly attached to the glass layer 104 and the lens 106 is located on or therein the glass layer 104, as referenced. Figure 1 As described.

[0064] Antenna elements 108 of antenna array 120 are adjacent to side 144 of glass layer 104. For example, antenna elements 108A and 108B are adjacent to side 144. A plurality of TGVs extend through glass layer 104 to electrically connect the antenna elements 108 on side 144 to metal pads 412 of substrate 140 on side 142 of glass layer 104. For example, TGV 112A extends through glass layer 104 and electrically connects antenna element 108A to metal pad 412A of substrate 140A. As another example, TGV 112B extends through glass layer 104 and electrically connects antenna element 108B to metal pad 412B of substrate 140B.

[0065] exist Figure 4 In the middle, substrate 140A and Figure 1 The substrate 140A differs from the substrate 140A, in which inductor 132A and capacitor 134A share a common metal pad (e.g., metal pad 412A). For example, a first LC circuit includes inductor 132A and capacitor 134A. Similarly, inductor 132B and capacitor 134B share a common metal pad (e.g., metal pad 412B). For example, a second LC circuit includes inductor 132B and capacitor 134B.

[0066] The die 118 is electrically connected to the antenna element 108 via a plurality of conductive interconnects 126 (e.g., conductive interconnects 126A and 126B) and passive element 130. For example, conductive interconnect 126A is aligned with metal pad 216A to electrically connect inductor 132A to the die 118. As another example, conductive interconnect 126B is aligned with the metal pad of capacitor 134B to electrically connect capacitor 134B to the die 118.

[0067] Photodiode 110A is aligned with lens 106A and optical fiber 102A. Photodiode 110B is aligned with lens 106B and optical fiber 102B. A sealant layer 114 encapsulates the volume of photodiode 110 and lens 106 (e.g., in a vacuum or filled with gas).

[0068] Photodiode 110A is configured to convert an optical signal from optical fiber 102A into an electrical signal for antenna element 108A, convert an electrical signal from antenna element 108A into an optical signal supplied to optical fiber 102A, or both. In one example, the optical signal from optical fiber 102A reaches photodiode 110A through lens 106A, and photodiode 110A converts the optical signal into an electrical signal and supplies the electrical signal to antenna element 108A for wireless transmission via die 118, conductive interconnect 126A, passive element 130A, and TGV 112A. In another example, the electrical signal received by antenna element 108A is supplied to photodiode 110A via TGV 112A, passive element 130A, conductive interconnect 126A, and die 118, and photodiode 110A converts the electrical signal into an optical signal that reaches optical fiber 102A through lens 106A for fiber optic transmission. Similarly, photodiode 110B is configured to convert an optical signal from optical fiber 102B into an electrical signal for antenna element 108B, convert an electrical signal from antenna element 108B into an optical signal provided to optical fiber 102B, or both.

[0069] Molded compound 122 at least partially encapsulates optical fiber 102, antenna array 120, glass layer 104, passive element 130, conductive interconnect 126A, conductive interconnect 126B, die 118, sealant layer 114, lens 106, photodiode 110, or combinations thereof.

[0070] Figure 5 A cross-sectional profile view of a device 500, including glass with attached optical fibers, is shown. Device 500 corresponds to... Figure 1 The device 100 also includes a plurality of conductive interconnects 526 electrically connected to the passive element 130.

[0071] In one example, conductive interconnect 526A is directly attached to metal pad 216A and electrically connected to inductor 132A. In another example, conductive interconnect 526B is directly attached to metal pad of substrate 140B and electrically connected to capacitor 134B.

[0072] Conductive interconnect 526 can be used to electrically connect antenna element 108 to a second die, a second device, or both. For example, antenna element 108A is electrically connected to conductive interconnect 526A via TGV 112A, inductor 132A, one or more metal pads, one or more vias, metal pad 216A, or a combination thereof. As another example, antenna element 108D is electrically connected to conductive interconnect 526B via TGV 112D, capacitor 134B, one or more metal pads, one or more vias, or a combination thereof.

[0073] Figure 6 A cross-sectional profile view of a device 600 including glass with attached optical fibers is illustrated. Device 600 includes an optical fiber 102 directly attached to a glass layer 104. Device 600 includes a lens 106 corresponding to a gradient refractive index lens included within the glass layer 104. For example, lens 106A corresponds to a first gradient refractive index portion of the glass layer 104 and is aligned with a first connection between the optical fiber 102A and the glass layer 104, and lens 106B corresponds to a second gradient refractive index portion of the glass layer 104 and is aligned with a second connection between the optical fiber 102B and the glass layer 104. In an alternative embodiment, lens 106 is located on the glass layer 104, as shown in reference... Figure 1 As described.

[0074] Multiple photodiodes 110 are embedded in a die 118. Photodiode 110A is aligned with lens 106A and adjacent to side 142 of glass layer 104. For example, photodiode 110A is directly attached to lens 106A. Similarly, photodiode 110B is aligned with lens 106B and adjacent to side 142 of glass layer 104. For example, photodiode 110B is directly attached to lens 106B.

[0075] Device 600 includes a laminated substrate 340 located between photodiode 110 and antenna elements 108 of antenna array 120. For example, antenna elements 108A and 108B are adjacent to a first side of laminated substrate 340, and a die 118 is located on a second side of laminated substrate 340 opposite to the first side. In a particular aspect, antenna elements 108 are adhered to or embedded in the first side of laminated substrate 340. Antenna elements 108 of antenna array 120 are located on side 144 of glass layer 104 opposite side 142. In a particular aspect, one or more passive elements 130 are coupled to or embedded within laminated substrate 340.

[0076] The die 118 is electrically connected to the antenna element 108 via a plurality of conductive interconnects 626 (e.g., conductive interconnects 626A and 626B) and one or more of the passive elements 130. The conductive interconnects 626 are directly attached to the photodiode 110. For example, conductive interconnect 626A is directly attached to photodiode 110A and directly attached to one or more of the passive elements 130. As another example, conductive interconnect 626B is directly attached to photodiode 110B and directly attached to one or more of the passive elements 130.

[0077] Photodiode 110A is configured to convert an optical signal from optical fiber 102A into an electrical signal for antenna element 108A, convert an electrical signal from antenna element 108A into an optical signal supplied to optical fiber 102A, or both. In one example, the optical signal from optical fiber 102A reaches photodiode 110A through lens 106A, and photodiode 110A converts the optical signal into an electrical signal and supplies the electrical signal to antenna element 108A via conductive interconnect 626A and one or more passive elements 130 for wireless transmission. In another example, the electrical signal received by antenna element 108A is supplied to photodiode 110A via one or more passive elements 130 and conductive interconnect 626A, and photodiode 110A converts the electrical signal into an optical signal that reaches optical fiber 102A via lens 106A for fiber optic transmission. In another example, photodiode 110B is configured to convert an optical signal from optical fiber 102B into an electrical signal for antenna element 108B, convert an electrical signal from antenna element 108B into an optical signal provided to optical fiber 102B, or both.

[0078] Device 600 includes one or more additional dies (such as die 618) coupled to die 118 via laminate 340. For ease of illustration, active circuitry for die 618 is not provided. In certain aspects, die 618 includes a transmitter, receiver, transceiver, low-noise amplifier, power amplifier, passive device, or a combination thereof. In certain embodiments, die 618 may correspond to another of die 118 as described herein. For example, a photodiode may be embedded in die 618, and die 618 may be attached to or adjacent to a glass layer having directly attached optical fibers.

[0079] The die 618 is electrically connected via a plurality of conductive interconnects 628 (e.g., conductive interconnects 628A and 628B) and one or more of the passive elements 130 to one or more of the antenna elements 108, the die 118, or a combination thereof. In one example, electrical signals may be exchanged between one or more of the antenna elements 108 and the die 618. In one example, electrical signals may be exchanged between one or more of the photodiodes 110 and the die 618.

[0080] Molding compound 122 at least partially encapsulates optical fiber 102, glass layer 104, die 118, lens 106, photodiode 110, conductive interconnects 626A, 626B, die 618, 628A, 628B, or combinations thereof. Laminate 340 is adjacent to a first side of molding compound 122. For ease of illustration, details of passive element 130 are not shown. It should be understood that conductive interconnects 626A, 626B, 628A, and 628B are provided as illustrative examples of contacts; in other examples, contacts of different shapes, materials, or both may be used.

[0081] In certain embodiments, die 118, die 618, or both correspond to chiplets. Using chiplets arranged and interconnected as 3D stacked integrated circuits (ICs) to form device 600 offers various benefits compared to providing the same functional circuitry in a single monolithic chip. For example, each chiplet is smaller than a single die comprising all functional circuitry blocks including the same functional circuitry. Since yield losses in IC manufacturing tend to increase with die size, using smaller dies can reduce yield losses in the IC manufacturing process (i.e., increase yield). Another benefit is that chiplets can be manufactured in different locations and / or by different manufacturers, and in some cases, using different manufacturing technologies (e.g., different manufacturing technology nodes). As an example, one die of a chiplet-based integrated device (e.g., die 118) may include components (e.g., interconnects, transistors, etc.) having a first minimum size, and another die of a chiplet-based integrated device (e.g., die 618) may include components (e.g., interconnects, transistors, etc.) having a second minimum size, wherein the second minimum size is larger than the first minimum size. In contrast, all circuitry in a monolithic die is manufactured using the same manufacturing techniques and equipment. As a result, when manufacturing a monolithic die, the entire die may be subject to the most stringent manufacturing constraints on the most complex components. In contrast, when using chiplets, different chiplets can be manufactured using different manufacturing techniques (e.g., different manufacturing technology nodes), and only one or more chiplets containing the most complex components are subject to the most stringent manufacturing constraints. In this arrangement, chiplets manufactured using less expensive and / or higher-volume manufacturing techniques can be integrated with chiplets manufactured using more expensive and / or lower-volume manufacturing techniques to form an IC (e.g., device 600), resulting in overall savings. Furthermore, in some cases, the design of the chiplets can be changed as technology improves. Chiplet stacking allows such new chiplet designs to be integrated with older chiplet designs to form stacked IC devices, improving manufacturing flexibility and reducing design costs.

[0082] Although Figure 6 Device 600 is illustrated as comprising two dies (e.g., die 118 and die 618), but in some embodiments, device 600 includes more than two dies that are stacked and interconnected to form a 3D IC stack. In such embodiments, one or more additional dies may have photodiodes aligned with lenses located on or within a glass layer having attached optical fibers, and these photodiodes are configured to exchange electrical signals with antenna elements.

[0083] Figure 7AA cross-sectional profile view of a device 700 including glass with attached optical fibers is illustrated. Device 700 includes an optical fiber 102 directly attached to side 144 of a glass layer 104, a lens 106 located on or within the glass layer 104, and a plurality of photodiodes 110 embedded in a die 118, as shown in reference. Figure 1 As described.

[0084] Device 700 includes an antenna array 120 and passive elements 130 located on side 142 of a glass layer 104 relative to side 144. In one example, a redistribution layer (RDL) 702 is adjacent to side 142 and electrically connects the antenna array 120 to a photodiode 110 of a die 118. In a particular aspect, one or more metal pads 708 and one or more vias are embedded in the RDL 702. In a particular aspect, the RDL 702, the metal pads 708, and the one or more vias correspond to the passive element 130.

[0085] In one example, antenna element 108A is electrically connected to conductive interconnect 126A via RDL 702A. For illustration, antenna element 108A is electrically connected to metal pad 708A via a via, and metal pad 708A is electrically connected to conductive interconnect 126A via a via and metal pad 718A. In another example, antenna element 108B is electrically connected to conductive interconnect 126B via RDL 702B. For illustration, antenna element 108B is electrically connected to metal pad 708B via a via, and metal pad 708B is electrically connected to conductive interconnect 126B via a via and metal pad 718B. Conductive interconnects 126A and 126B are attached to die 118, as referenced. Figure 1 As described.

[0086] Photodiode 110A is configured to convert an optical signal from optical fiber 102A into an electrical signal for antenna element 108A, convert an electrical signal from antenna element 108A into an optical signal supplied to optical fiber 102A, or both. In one example, the optical signal from optical fiber 102A reaches photodiode 110A through lens 106A, and photodiode 110A converts the optical signal into an electrical signal and supplies the electrical signal to metal pad 708A through conductive interconnect 126A, metal pad 718A, and via. Metal pad 708A supplies the electrical signal to antenna element 108A through the via for wireless transmission. In another example, the electrical signal received by antenna element 108A is supplied to metal pad 708A through a via. Metal pad 708A supplies the electrical signal to photodiode 110A through the via, metal pad 718A, and conductive interconnect 126A. Photodiode 110A converts the electrical signal into an optical signal that reaches optical fiber 102A through lens 106A for fiber optic transmission.

[0087] Similarly, photodiode 110B is configured to convert an optical signal from optical fiber 102B into an electrical signal for antenna element 108B, convert an electrical signal from antenna element 108B into an optical signal provided to optical fiber 102B, or both. For illustration, an optical signal from optical fiber 102B reaches photodiode 110B through lens 106B, and photodiode 110B converts the optical signal into an electrical signal and provides the electrical signal to metal pad 708B through conductive interconnect 126B, metal pad 718B, and via. Metal pad 708B provides the electrical signal to antenna element 108B through the via for wireless transmission. In another example, an electrical signal received by antenna element 108B is provided to metal pad 708B through a via. Metal pad 708B provides the electrical signal to photodiode 110B through the via, metal pad 718B, and conductive interconnect 126B. Photodiode 110B converts the electrical signal into an optical signal that reaches optical fiber 102B through lens 106B for fiber optic transmission.

[0088] The sealant layer 114 at least partially encapsulates the bare die 118, lens 106, photodiode 110, conductive interconnect 126A, conductive interconnect 126B, metal pad 718A, metal pad 718B, or combinations thereof. It should be understood that conductive interconnect 126A and conductive interconnect 126B are provided as exemplary examples of contacts; in other examples, contacts of different shapes, different materials, or both may be used.

[0089] Figure 7B A cross-sectional profile view of device 714, including glass with attached optical fibers, is illustrated. Device 714 corresponds to device 700 and includes one or more inductors, one or more capacitors, or combinations thereof, as passive elements 130 in substrate 140.

[0090] In one example, substrate 140A includes an inductor 132A and a capacitor 134A embedded in multiple dielectric layers. Substrate 140A also includes a metal pad 728A electrically connecting the inductor 132A to the capacitor 134A. As another example, substrate 140B includes an inductor 132B and a capacitor 134B embedded in multiple dielectric layers. Substrate 140B also includes a metal pad 728B electrically connecting the inductor 132B to the capacitor 134B.

[0091] Substrate 140 is located between glass layer 104 and antenna array 120, and antenna array 120 and bare die 118 are located on the same side of substrate 140. Substrate 140A and substrate 140B are adjacent to side 142 of glass layer 104. In a particular embodiment, metal pads 728A and 728B are adjacent to side 142.

[0092] Antenna element 108A is adjacent to substrate 140A and electrically connected to conductive interconnect 126A via inductor 132A, metal pad 728A, and capacitor 134A. Similarly, antenna element 108B is adjacent to substrate 140B and electrically connected to conductive interconnect 126B via capacitor 134B, metal pad 728B, and inductor 132B. Conductive interconnects 126A and 126B are attached to die 118, as referenced. Figure 1 As described.

[0093] Photodiode 110A is configured to convert an optical signal from optical fiber 102A into an electrical signal for antenna element 108A, convert an electrical signal from antenna element 108A into an optical signal supplied to optical fiber 102A, or both. In one example, the optical signal from optical fiber 102A reaches photodiode 110A through lens 106A, and photodiode 110A converts the optical signal into an electrical signal and supplies the electrical signal to antenna element 108A for wireless transmission via conductive interconnect 126A, capacitor 134A, metal pad 728A, and inductor 132A. In another example, the electrical signal received by antenna element 108A is supplied to photodiode 110A via inductor 132A, metal pad 728A, capacitor 134A, and conductive interconnect 126A. Photodiode 110A converts the electrical signal into an optical signal that reaches optical fiber 102A through lens 106A for fiber optic transmission. Similarly, photodiode 110B is configured to convert an optical signal from optical fiber 102B into an electrical signal for antenna element 108B, convert an electrical signal from antenna element 108B into an optical signal provided to optical fiber 102B, or both.

[0094] The sealant layer 114 at least partially encapsulates the bare die 118, lens 106, photodiode 110, conductive interconnect 126A, conductive interconnect 126B, capacitor 134A, inductor 132B, or combinations thereof. It should be understood that conductive interconnect 126A and conductive interconnect 126B are provided as exemplary examples of contacts; in other examples, contacts of different shapes, different materials, or both may be used.

[0095] Figures 1 to 7BThe same non-limiting illustrative example of an antenna device including glass with attached optical fibers is provided. In other examples, there are different types of lenses 106, various ways of attaching optical fibers 102, different positions of the antenna array 120, various ways of providing electrical connections from the antenna device to another device, various ways of controlling the focal length, different positions of passive elements 130, etc. As an example, lens 106 may be fused or adhered to or included in glass layer 104 (e.g., as a gradient refractive index lens). Optical fiber 102 may be attached to the surface of glass layer 104 or extend through the glass layer. Antenna element 108 may be located on the same side or on the opposite side of optical fiber 102. Antenna element 108 may be adjacent to or separate from glass layer 104. Antenna element 108 may be adjacent to laminate substrate 340. Glass layer 104 may be replaced with a rigid, non-conductive layer of another material that is transparent to the optical frequency used. Different types of passive elements 130 may be included in various positions in the device. The various techniques disclosed herein can be combined in various ways to form an antenna device.

[0096] Exemplary sequence of antenna devices for manufacturing glass including attached optical fibers.

[0097] In some specific implementations, manufacturing antenna equipment (e.g., any of equipment 100, 300, 400, 500, 600, 700, or 714) involves several processes. Figures 8 to 9 Exemplary sequences of antenna devices for providing or manufacturing glass including attached optical fibers are illustrated, as shown in references. Figures 1 to 7B As described by any of them. In some specific implementations, Figures 8 to 9 The sequence can be used to provide Figure 1 One or more of the devices 100, 300, 400, 500, 600, 700 or 714 of Figure 7 (e.g., provided during their manufacture).

[0098] It should be noted that Figures 8 to 9 The sequence can be combined with one or more stages to simplify and / or clarify the sequence used to provide or manufacture an integrated device. In some embodiments, the order of the processes can be changed or modified. In some embodiments, one or more processes can be substituted or replaced without departing from the scope of this disclosure. In the following description, various exemplary stages of the reference sequence are shown. Figures 8 to 9 Numbering (using circled numbers). Figures 8 to 9 Each of the various stages in the illustrated sequence shows the formation of a device with two optical fibers. In other specific embodiments, the device may be formed using more than two optical fibers.

[0099] Figure 8Stage 1 illustrates glass layer 104. Stage 2 illustrates the state after a plurality of lenses 106 have been formed on side 142 of glass layer 104. In a particular embodiment, a first portion of glass layer 104 is shaped (e.g., etched) to form lens 106A, and a second portion of glass layer 104 is shaped (e.g., etched) to form lens 106B. In another embodiment, the first portion of glass layer 104 includes a gradient refractive index lens as lens 106A, and the second portion of glass layer 104 includes a gradient refractive index lens as lens 106B. For example, various gradient refractive index (GRIN) lens forming techniques (e.g., neutron irradiation, chemical vapor deposition, ion exchange, or combinations thereof) are used to form lenses 106A and 106B. In a particular aspect, selective doping based on ion implantation is used to form lenses 106A and 106B in glass layer 104. In another embodiment, lens 106A is attached (e.g., fused or adhered) to a first portion of glass layer 104, and lens 106B is attached (e.g., fused or adhered) to a second portion of glass layer 104. In some examples, lenses 106A and 106B are attached to glass layer 104 in a later stage of manufacturing (such as after stage 3 or stage 4).

[0100] In some examples, lenses 106A and 106B are covered (e.g., with a polymer or photoresist) to prevent contamination during subsequent manufacturing stages, and the cover is removed after a later stage. In some aspects, the cover on lens 106 may be removed as part of a subsequent manufacturing stage and must be reapplied during manufacturing to protect lens 106. The formation of lenses on glass layers can be performed using wafer-level or panel-level operations.

[0101] Stage 3 illustrates the state after forming a plurality of glass through-holes (TGVs) 112, antenna elements 108, and metal pads 212 on glass layer 104. For example, openings are formed in glass layer 104 and filled with conductive material to form TGVs 112A, TGV 112B, TGV 112C, and TGV 112D. The openings can be formed using patterning operations, etching processes, drilling operations, laser ablation operations, other targeted glass removal operations, or combinations thereof.

[0102] One or more patterned metal deposition processes (such as electroplating) are used to deposit a first metal layer on side 144 of glass layer 104 and a second metal layer on side 142 of glass layer 104. In some aspects, the same material is deposited on sides 142 and 144 to form the first and second metal layers. In another aspect, the first metal layer includes a first metal not included in the second metal layer, the second metal layer includes a second metal not included in the first metal layer, or both.

[0103] In some examples, the metal layer is deposited and subsequently patterned, and in other examples, a patterned layer (e.g., a photoresist layer) is applied to the glass layer 104 and used to guide the formation of the metal layer. In a particular aspect, antenna elements 108A to 108D are formed (e.g., formed by a first metal layer) on side 144 of the glass layer 104, and metal pads 212A, 212B, 212C, and 212D are formed (e.g., formed by a second metal layer) on side 142 of the glass layer 104. In a particular embodiment, each pair of antenna elements and metal pads is electrically connected. For example, antenna element 108A and metal pad 212A are electrically connected via TGV 112A. As another example, antenna element 108B and metal pad 212B are electrically connected via TGV 112B. Optionally, in some aspects, the second metal layer, metal pads 212A to 212D, or combinations thereof, are thinned after deposition, for example, using an etching or polishing process.

[0104] Phase 4 illustrates the state after molding compound 122 has been applied to side 144 of antenna element 108 and glass layer 104 and substrate 140 has been applied to side 142 of metal pad 212 and glass layer 104. In a particular example, molding compound 122 may be applied using a deposition process, spin coating process, or similar process, and one or more patterning processes may be applied to molding compound 122 to define openings 812, such as opening 812A aligned with lens 106A and opening 812B aligned with lens 106B. In an alternative example, a pattern (e.g., in a photoresist) is formed on side 144, molding compound 122 is applied to the pattern, and the pattern is removed to define openings 812. Molding compound 122 may then be cured or hardened by exposure to light, heat, and / or chemical hardeners.

[0105] Insulators, such as insulating layer 222A on metal pad 212B and insulating layer 222B on metal pad 212D, can be deposited using one or more electroplating processes and one or more patterning processes. Metal pads can be formed on the insulator using one or more electroplating processes and one or more patterning processes. For example, metal pad 224A is formed on insulating layer 222A, and metal pad 224B is formed on insulating layer 222B.

[0106] One or more additional layers may be formed on metal pads 212 and 224 to form portions of the passive component, thereby providing conductive paths for electrical interconnection, etc. For illustration, Figure 8Phase 4 illustrates an example including additional dielectric layers, vias, and metal pads. For example, dielectric layers 202A and 202B are deposited, and openings are formed in dielectric layers 202A to 202B using patterning operations, etching processes, drilling operations, laser ablation operations, other targeted dielectric removal operations, or combinations thereof. For illustration, a first opening to metal pad 212A is formed in dielectric layer 202A, a second opening to metal pad 224A is formed in dielectric layer 202A, a third opening to metal pad 212C is formed in dielectric layer 202B, and a fourth opening to metal pad 224B is formed in dielectric layer 202B. Conductive material is deposited in the openings to form vias and metal pads on the vias (e.g., metal pads 214A, 214B, 214C, and 214D).

[0107] As another example, dielectric layers 204A and 204B are deposited, and openings are formed in dielectric layers 204A to 204B using patterning operations, etching processes, drilling operations, laser ablation operations, other targeted dielectric removal operations, or combinations thereof. For illustration, a first opening to metal pad 214A is formed in dielectric layer 204A, a second opening to metal pad 214B is formed in dielectric layer 204A, a third opening to metal pad 214C is formed in dielectric layer 204B, and a fourth opening to metal pad 214D is formed in dielectric layer 204B. Conductive material is deposited in the openings to form vias and metal pads on the vias (e.g., metal pads 216A, 216B, 216C, and 216D). In one example, dielectric layers 206A and 206B are deposited.

[0108] Passive element 130 is thus formed on side 142 of glass layer 104. For example, passive element 130A, including inductor 132A and capacitor 134A, is embedded in substrate 140A, and passive element 130B, including inductor 132B and capacitor 134B, is embedded in substrate 140B.

[0109] Phase 5 illustrates the state after attachment to die 118. For example, heated / reflow conductive interconnects 126 are used to attach die 118 to substrate 140. Conductive interconnects 126A to 126B may include a grid or array of bumps, including conductive interconnect 126A providing electrical connection between passive element 130A and photodiode 110A of die 118, and conductive interconnect 126B providing electrical connection between passive element 130B and photodiode 110B of die 118.

[0110] Figure 9Stage 6 illustrates the state after the deposition of the sealant layer 114. For example, the sealant layer 114 at least partially encapsulates conductive interconnects 126A and 126B, photodiodes 110A and 110B, die 118, lens 106A, lens 106B, or combinations thereof. In a particular aspect, the sealant layer 114 encapsulates the volume between lens 106 and photodiode 110.

[0111] Phase 7 illustrates the state after the optical fiber 102 is directly attached to the glass layer 104. For example, the end of the optical fiber 102A is inserted into the opening 812A to connect to a first portion on the side 144 of the glass layer 104. As another example, the end of the optical fiber 102B is inserted into the opening 812B to connect to a second portion on the side 144 of the glass layer 104. For illustration, the end of the optical fiber 102A is fused or adhered to the first portion of the glass layer 104, and the end of the optical fiber 102B is fused or adhered to the second portion of the glass layer 104.

[0112] exist Figure 9 After stage 7, the formation of device 100 is complete. However, in some specific embodiments, conductive interconnects 526 are attached to device 100 to form device 500. Stage 8 illustrates the state after conductive interconnects 526A are attached to metal pad 216A and conductive interconnects 526B are attached to metal pad 216D. After stage 8, the formation of device 500 is complete. The antenna element 108 formed on side 144 is provided as an illustrative example; in other examples, antenna element 108 may be formed on side 142, as shown in reference. Figures 7A to 7B As described.

[0113] Various other antenna devices with attached optical fibers can be manufactured. For example, the manufacture of device 300 may include stage 2, in which an opening is defined in glass layer 104, and optical fiber 102 is inserted into the opening to extend through glass layer 104, and lens 106 is attached to an end of optical fiber 102. For example, lens 106A is attached (e.g., adhered or fused) to an end of optical fiber 102A, and lens 106B is attached (e.g., adhered or fused) to an end of optical fiber 102B. The manufacture of device 300 proceeds from stage 2 to stage 5, in which die 118 is attached (e.g., adhered) to glass layer 104. Conductive interconnects 326A and 326B are formed on one side of die 118 opposite to glass layer 104 and are used to attach die 118 to laminated substrate 340 including passive element 130. For example, heated / reflowed conductive interconnect 326 is used to connect die 118 to laminated substrate 340. Antenna element 108 is formed on one side of laminated substrate 340 relative to die 118. In some examples, a metal layer is deposited and subsequently patterned, and in other examples, a patterned layer (e.g., a photoresist layer) is applied to laminated substrate 340 and used to guide the formation of antenna element 108. Molding compound 122 is disposed on die 118 and laminated substrate 340. Molding compound 122 at least partially encapsulates optical fiber 102, die 118, conductive interconnect 326, one side of laminated substrate 340, or a combination thereof. In certain examples, molding compound 122 may be applied using a deposition process, spin coating process, or similar process. Molding compound 122 may then be cured or hardened by exposure to light, heat, and / or chemical hardeners to complete the formation of device 300.

[0114] As another example, the manufacture of device 400 may include a stage 2 similar to that of device 300, wherein optical fiber 102 extends through glass layer 104 and the end of optical fiber 102 is attached to lens 106. Stage 3 of the manufacture of device 400 is similar to... Figure 8 Phase 3 of the manufacturing of the device 400 includes a single TGV on each side of the lens 106 that electrically connects an antenna element to a metal pad. For example, TGV 112A electrically connects antenna element 108A to metal pad 412A, and TGV 112B electrically connects antenna element 108B to metal pad 412B. Phases 4 through 6 of the manufacturing of the device 400 are similar to those of the previous phases. Figures 8 to 9Stages 4 to 6 are used for the formation of passive elements 130A and 130B, the attachment of the die 118, and the deposition of the sealant layer 114. A molding compound 122 is disposed on the antenna element 108, the glass layer 104, the substrate 140, and the sealant layer 114. The molding compound 122 at least partially encapsulates the optical fiber 102, the antenna element 108, the substrate 140, the sealant layer 114, or combinations thereof. In a particular example, the molding compound 122 may be applied using a deposition process, a spin coating process, or a similar process. The molding compound 122 may then be cured or hardened by exposure to light, heat, and / or chemical hardeners to complete the formation of the device 400.

[0115] In one example, the fabrication of device 600 includes stage 2, in which various gradient refractive index (GRIN) lens forming techniques (e.g., neutron irradiation, chemical vapor deposition, ion exchange, or combinations thereof) are used to form lenses 106A and 106B in glass layer 104. In stage 3, optical fiber 102 is attached (e.g., adhered or fused) to glass layer 104. Die 118 is attached (e.g., adhered) to glass layer 104. Conductive interconnects 626A and 626B are formed on one side of die 118 opposite to glass layer 104 and are used to attach die 118 to laminated substrate 340 including passive element 130. For example, heated / reflowed conductive interconnect 626 is used to connect die 118 to laminated substrate 340. Similarly, conductive interconnects 628A and 628B are used to attach die 618 to laminated substrate 340.

[0116] Antenna element 108 is formed on one side of laminated substrate 340 relative to dies 118 and 618. In some examples, a metal layer is deposited and subsequently patterned, and in other examples, a patterned layer (e.g., a photoresist layer) is applied to laminated substrate 340 and used to guide the formation of antenna element 108. Molding compound 122 is disposed on one side of dies 118, 618, and laminated substrate 340. Molding compound 122 at least partially encapsulates one side of optical fiber 102, die 118, die 618, conductive interconnect 626, conductive interconnect 628, laminated substrate 340, or combinations thereof. In certain examples, molding compound 122 may be applied using a deposition process, spin coating process, or similar process. Molding compound 122 may then be cured or hardened by exposure to light, heat, and / or chemical hardeners to complete the formation of device 600.

[0117] In one example, the manufacture of device 700 includes Figure 8Phase 2 of the fabrication of device 700 includes forming a lens 106 on or within a glass layer 104. Phase 3 of the fabrication of device 700 includes forming a metal pad 708 on the same side 142 of the glass layer 104 as the lens 106. In some examples, the metal layer is deposited and subsequently patterned, and in other examples, a patterned layer (e.g., a photoresist layer) is applied to the glass layer 104 and used to guide the formation of the metal pad 708. RDL fabrication processes (e.g., spin coating, lithography, etching, sputtering, electroplating, or combinations thereof) are used to form RDLs 702A and 702B. Openings are formed in RDL 702 using patterning operations, etching processes, drilling operations, laser ablation operations, other targeted RDL removal operations, or combinations thereof. The openings are filled with a conductive material to form vias, metal pads 718, and antenna elements 108. Similar to Figures 8 to 9 In stages 5 to 7, conductive interconnects 126 are used to attach the bare die 118, a sealant layer 114 is deposited, and optical fiber 102 is directly attached to glass layer 104. In a particular aspect, molding compound 122 is removed to complete the fabrication of device 700.

[0118] In one example, the manufacture of device 714 includes Figure 8 Phase 2 of the fabrication of device 714 involves the formation of a lens 106 on or within the glass layer 104. Phase 3 of the fabrication of device 714 includes forming a metal pad 728 on the same side 142 of the glass layer 104 as the lens 106. In some examples, the metal layer is deposited and subsequently patterned, and in other examples, a patterning layer (e.g., a photoresist layer) is applied to the glass layer 104 and used to guide the formation of the metal pad 728. Phase 4 of the fabrication of device 714 is similar to... Figure 8 Phase 4 is used for the formation of passive components 130A and 130B. Additionally, antenna element 108 is formed. In some examples, antenna element 108 is formed concurrently with the formation of metal pad 216.

[0119] Phases 5 to 7 of the manufacturing of equipment 714 are similar to Figures 8 to 9 Phases 5 to 7 are used for attaching the die 118, depositing the sealant layer 114, and attaching the optical fiber 102 to the glass layer 104. In a particular aspect, the molding compound 122 is removed to complete the fabrication of the device 714.

[0120] An exemplary flowchart of a method for manufacturing an antenna device with attached optical fibers in glass.

[0121] In some specific implementations, manufacturing antenna equipment involves several processes. Figure 10 An exemplary flowchart illustrating a method 1000 for providing or manufacturing an antenna device is shown. In some specific implementations, Figure 10 Method 1000 can be used to provide or manufacture Figures 1 to 7BAny of the following devices: 100, 300, 400, 500, 600, 700, or 714.

[0122] It should be noted that Figure 10 Method 1000 may combine one or more processes to simplify and / or clarify the methods used to provide or manufacture integrated devices. In some specific implementations, the order of the processes may be changed or modified.

[0123] At block 1002, method 1000 includes aligning an optical fiber with a lens and a photodiode, such that the lens is positioned to manipulate light exchanged between the optical fiber and the photodiode. For example, optical fiber 102A is aligned with lens 106A and photodiode 110A, thus lens 106A is positioned to manipulate light exchanged between optical fiber 102A and photodiode 110A. In some specific embodiments, Figure 8 Phase 2 illustrates an example of forming a lens 106 on a glass layer 104. In some respects, the position of the lens 106 on the glass layer is aligned with a predetermined position of the photodiode 110 on the die 118. Figure 8 Phase 4 illustrates an example of an opening 812 defined and aligned with lens 106, and Figure 9 Phase 7 illustrates inserting the optical fiber 102 into the opening 812, such that the optical fiber 102 is aligned with the lens 106 and the photodiode 110.

[0124] At block 1004, method 1000 includes directly attaching an optical fiber to a first side of a glass layer including or coupled to a lens. For example, optical fiber 102A is directly attached (e.g., fused or adhered) to side 144 of glass layer 104 including or coupled to lens 106A. In some specific embodiments, Figure 9 Stage 7 illustrates the direct attachment of optical fiber 102A to side 144 of glass layer 104, which includes lens 106A.

[0125] At block 1006, method 1000 includes electrically connecting a photodiode to an antenna element, wherein the photodiode is configured to convert an optical signal from an optical fiber into an electrical signal for the antenna element, convert an electrical signal from the antenna element into an optical signal supplied to the optical fiber, or both. For example, photodiode 110A is electrically connected to Figure 1 The antenna element 108B, and the photodiode 110A are configured to convert optical signals from optical fiber 102A into electrical signals for antenna element 108B, convert electrical signals from antenna element 108B into optical signals for optical fiber 102A, or both. In some specific embodiments, Figure 8 Phase 5 illustrates the electrical connection of photodiode 110A to antenna element 108B via conductive interconnect 126A, capacitor 134A, and TGV 112B.

[0126] Exemplary electronic devices

[0127] Figure 11 Examples of various electronic devices that may include or be integrated with any of antenna devices 100, 300, 400, 500, 600, 700, or 714 are illustrated. For example, mobile phone device 1102, laptop computer device 1104, fixed-location terminal device 1106, wearable device 1108, or vehicle 1110 (e.g., automotive or aviation equipment) may include device 1100. For example, device 1100 may include any of the devices 100, 300, 400, 500, 600, 700, or 714 described herein. Figure 11 The illustrated devices 1102, 1104, 1106, and 1108, as well as vehicle 1110, are merely exemplary. Other electronic devices may also feature device 1100, including, but not limited to, groups of devices (e.g., electronic devices) that include: mobile devices, handheld personal communication system (PCS) units, portable data units (such as personal digital assistants), GPS-enabled devices, navigation devices, set-top boxes, music players, video players, entertainment units, fixed location data units (such as meter reading devices), communication devices, smartphones, tablet computers, computers, wearable devices (e.g., watches, glasses), Internet of Things (IoT) devices, servers, routers, electronic devices implemented in vehicles (e.g., autonomous vehicles), or any other device that stores or retrieves data or computer instructions, or any combination thereof.

[0128] Figures 1 to 11 One or more of the illustrated components, processes, features, and / or functions may be rearranged and / or combined into a single component, process, feature, or function, or embodied in several components, processes, or functions. Additional elements, components, processes, and / or functions may also be added without departing from this disclosure. It should also be noted that in this disclosure… Figures 1 to 11 The corresponding descriptions are not limited to bare dies and / or ICs. In some specific implementations, Figures 1 to 11 The descriptions and their corresponding information can be used to manufacture, create, supply, and / or produce devices and / or integrated devices. In some specific implementations, devices may include dies, integrated devices, integrated passive devices (IPDs), die packages, integrated circuit (IC) devices, device packages, integrated circuit (IC) packages, wafers, semiconductor devices, stacked package (PoP) devices, thermal devices, and / or interposers.

[0129] It should be noted that the accompanying drawings in this disclosure may represent actual and / or conceptual representations of various parts, components, objects, devices, packages, integrated devices, integrated circuits, and / or transistors. In some instances, the drawings may not be to scale. In some instances, not all components and / or parts are shown for clarity. In some instances, the positioning, location, size, and / or shape of the various parts and / or components in the drawings may be exemplary. In some specific embodiments, the various components and / or parts in the drawings may be optional.

[0130] The term “exemplary” is used herein to mean “serving as an example, instance, or illustration.” Any specific implementation or aspect described herein as “exemplary” is not necessarily to be construed as superior to or better than other aspects of this disclosure. Similarly, the term “aspect” does not require that all aspects of this disclosure include the features, advantages, or modes of operation discussed. The term “coupling” is used herein to refer to direct or indirect coupling (e.g., mechanical coupling) between two objects. For example, if object A physically contacts object B, and object B contacts object C, objects A and C can still be considered coupled to each other, even if they are not in direct physical contact. Object A coupled to object B may be coupled to at least a portion of object B. The term “electrical coupling” may mean that two objects are directly or indirectly coupled together such that current (e.g., signal, power, ground) can flow between the two objects. Electrically coupled objects may or may not have current traveling between them. The use of the terms “first,” “second,” “third,” and “fourth” (and / or anything above the fourth) is arbitrary. Any component described can be a first component, a second component, a third component, or a fourth component. For example, a component referred to as a second component can be a first component, a second component, a third component, or a fourth component. The terms “enclosing,” “enclosing,” and / or any derivative meaning can refer to an object that partially or completely encloses another object. The terms “top” and “bottom” are arbitrary. A component located at the top can be above a component located at the bottom. A top component can be considered a bottom component, and vice versa. As described in this disclosure, a first component located “above” a second component can mean that the first component is located above or below the second component, depending on how bottom or top is arbitrarily defined. In another example, a first component can be located above (e.g., above) a first surface of a second component, and a third component can be located above (e.g., below) a second surface of a second component, where the second surface is opposite to the first surface. It should also be noted that the term “above” as used in this application in the context of one component being above another component can be used to mean that a component is on and / or in another component (e.g., on the surface of a component or embedded in a component). Therefore, for example, "the first component is on top of the second component" can mean: (1) the first component is on top of the second component but does not directly contact the second component; (2) the first component is on the second component (e.g., on the surface of the second component); and / or (3) the first component is in the second component (e.g., embedded in the second component). A first component located "in" the second component can be partially or completely located in the second component. Values ​​from about X to XX can refer to values ​​between X and XX, including both X and XX. Values ​​between X and XX can be discrete or continuous. As used in this disclosure, the terms "about 'value X'" or "approximately value X" mean within 10% of "value X".For example, a value of about 1 or approximately 1 would mean a value in the range of 0.9 to 1.1. "Multiple" components can include all possible components or only some of all possible components. For example, if a device comprises ten components, the term "multiple components" can refer to all ten components or only some of those ten components.

[0131] In some embodiments, an interconnect is an element or assembly in a device or package that allows or facilitates an electrical connection between two points, elements, and / or components. In some embodiments, an interconnect may include traces, vias, pads, pillars, metallization layers, redistribution layers, and / or under-bump metallization (UBM) layers / interconnects. In some embodiments, an interconnect may include a conductive material configured to provide an electrical path for signals (e.g., data signals), ground, and / or power. An interconnect may include more than one element or assembly. An interconnect may be defined by one or more interconnects. An interconnect may include one or more metal layers. An interconnect may be part of a circuit. Different embodiments may use different processes and / or steps to form interconnects. In some embodiments, chemical vapor deposition (CVD), physical vapor deposition (PVD), sputtering, spraying, and / or plating processes may be used to form interconnects.

[0132] It should also be noted that the various disclosures contained herein can be described as processes depicted as work diagrams, flowcharts, structural diagrams, or block diagrams. Although flowcharts may describe operations as sequential processes, many operations within an operation can be performed in parallel or concurrently. Furthermore, the order of operations can be rearranged. The process terminates when its operations are completed.

[0133] Further examples are described below to facilitate understanding of this disclosure.

[0134] According to Embodiment 1, a device includes: a glass layer; an optical fiber directly attached to the glass layer; a photodiode electrically connected to an antenna element; and a lens coupled to or included within the glass layer and configured to manipulate light exchanged between the optical fiber and the photodiode, wherein the photodiode is configured to convert an optical signal from the optical fiber into an electrical signal for the antenna element, convert an electrical signal from the antenna element into an optical signal provided to the optical fiber, or both.

[0135] Example 2 includes the device described in Example 1, wherein the light exchanged between the optical fiber and the photodiode passes through the glass layer.

[0136] Example 3 includes the device described in Example 1 or 2, wherein the optical fiber is fused to the glass layer.

[0137] Example 4 includes the device described in Example 1 or 2, wherein the optical fiber is adhered to the glass layer.

[0138] Example 5 includes the device described in any one of Examples 1 to 4, wherein the lens corresponds to the formed portion of the glass layer.

[0139] Example 6 includes the device described in any one of Examples 1 to 4, wherein the lens corresponds to a gradient refractive index lens included within the glass layer.

[0140] Example 7 includes the device described in any one of Examples 1 to 4, wherein the lens is adhered to the glass layer.

[0141] Example 8 includes the device of any one of Examples 1 to 7, wherein the optical fiber is directly attached to a first side of the glass layer, and wherein the photodiode is located on a second side of the glass layer, the second side being opposite to the first side of the glass layer.

[0142] Example 9 includes the device described in Example 8, wherein the antenna element is adjacent to the first side of the glass layer.

[0143] Example 10 includes the device described in Example 8 or 9, wherein the photodiode is adjacent to the second side of the glass layer.

[0144] Example 11 includes the device described in Example 8 or 9, wherein the distance between the second side of the glass layer and the photodiode corresponds to the focal length of the lens.

[0145] Example 12 includes the device of any one of Examples 8 to 11, wherein the antenna element is located on the second side of the glass layer.

[0146] Example 13 includes the device described in any one of Examples 8 to 12, the device further including one or more passive elements located on the second side of the glass layer.

[0147] Example 14 includes the device described in Example 13, wherein the one or more passive components include at least one capacitor, at least one inductor, or a combination thereof.

[0148] Example 15 includes the device of any one of Examples 8 to 14, the device further including a passive element integrated within the glass layer and including features located on the first side and the second side of the glass layer.

[0149] Example 16 includes the device described in any one of Examples 1 to 15, the device further including a sealant layer that encapsulates the volume including the photodiode and the lens.

[0150] Example 17 includes the device described in any one of Examples 1 to 16, and the device further includes a laminated substrate located between the photodiode and the antenna element.

[0151] Example 18 includes the device described in Example 17, wherein the antenna element is adjacent to a first side of the laminated substrate.

[0152] Example 19 includes the device described in Example 17 or 18, and the device further includes one or more passive components coupled to or embedded in the laminated substrate.

[0153] Example 20 includes the device of any one of Examples 17 to 19, wherein the photodiode is embedded in a die, and wherein a second device is coupled to the die via the laminate substrate.

[0154] Example 21 includes the device described in Example 20, wherein the second device includes a transmitter, a receiver, a transceiver, a low-noise amplifier, a power amplifier, a passive device, or a combination thereof.

[0155] Example 22 includes the device of any one of Examples 1 to 21, the device further comprising a molding compound that at least partially encapsulates the glass layer, the optical fiber, the photodiode, the lens, or a combination thereof.

[0156] Example 23 includes the device described in any one of Examples 1 to 22, the device further comprising: a second optical fiber directly attached to the glass layer; a second photodiode electrically connected to a second antenna element, wherein the antenna array includes the antenna element and the second antenna element; and a second lens coupled to or included within the glass layer and configured to manipulate light exchanged between the second optical fiber and the second photodiode, wherein the second photodiode is configured to convert an optical signal from the second optical fiber into an electrical signal for the second antenna element, convert an electrical signal from the second antenna element into an optical signal provided to the second optical fiber, or both.

[0157] Example 24 includes the device described in Example 23, wherein the pitch between the center of the first connection of the optical fiber to the glass layer and the center of the second connection of the second optical fiber to the glass layer is less than 0.2 millimeters (mm).

[0158] According to Embodiment 25, a method of manufacturing an apparatus includes: aligning an optical fiber with a lens and a photodiode such that the lens is positioned to manipulate light exchanged between the optical fiber and the photodiode; directly attaching the optical fiber to a first side including or coupled to a glass layer of the lens; and electrically connecting the photodiode to an antenna element, wherein the photodiode is configured to convert an optical signal from the optical fiber into an electrical signal for the antenna element, convert an electrical signal from the antenna element into an optical signal provided to the optical fiber, or both.

[0159] Example 26 includes the method of Example 25, the method further comprising forming a portion of the glass layer to form the lens.

[0160] Example 27 includes the method described in Example 25 or 26, the method further including forming the antenna element on the first side of the glass layer.

[0161] Example 28 includes the method of any one of Examples 25 to 27, the method further comprising forming one or more passive elements on a second side of the glass layer, the second side being opposite to the first side of the glass layer.

[0162] Example 29 includes the method described in Example 28, the method further including forming the antenna element on the second side of the glass layer.

[0163] Example 30 includes the method of any one of Examples 25 to 29, wherein attaching the optical fiber directly to the first side of the glass layer includes fusing the optical fiber to the first side of the glass layer.

[0164] According to embodiment 31, an apparatus includes: a glass layer; a plurality of optical fibers directly attached to the glass layer; a plurality of antenna elements; a plurality of photodiodes, wherein a particular photodiode of the plurality of photodiodes is electrically connected to a corresponding antenna element of the plurality of antenna elements; and a plurality of lenses coupled to or included within the glass layer, wherein a particular lens of the plurality of lenses is configured to manipulate light exchanged between a particular optical fiber and the particular photodiode, wherein the particular photodiode is configured to convert an optical signal from the particular optical fiber into an electrical signal for the corresponding antenna element, convert an electrical signal from the corresponding antenna element into an optical signal provided to the particular optical fiber, or both.

[0165] Example 32 includes the device described in Example 31, and the device further includes a laminated substrate located between the plurality of photodiodes and the plurality of antenna elements.

[0166] The various features of this disclosure described herein can be implemented in different systems without departing from this disclosure. It should be noted that the foregoing aspects of this disclosure are merely illustrative and should not be construed as limiting the scope of this disclosure. The description of aspects of this disclosure is intended to be exemplary and not to limit the scope of the appended claims. Therefore, the teachings herein are readily applicable to other types of devices, and many substitutions, modifications, and variations will be apparent to those skilled in the art.

Claims

1. An apparatus, the apparatus comprising: Glass layer; Optical fiber, which is directly attached to the glass layer; A photodiode, wherein the photodiode is electrically connected to an antenna element; and A lens, coupled to or included within the glass layer, and configured to manipulate the light exchanged between the optical fiber and the photodiode. The photodiode is configured to convert an optical signal from the optical fiber into an electrical signal for the antenna element, to convert an electrical signal from the antenna element into an optical signal provided to the optical fiber, or both.

2. The device of claim 1, wherein the light exchanged between the optical fiber and the photodiode passes through the glass layer.

3. The device of claim 1, wherein the optical fiber is fused to the glass layer.

4. The device of claim 1, wherein the optical fiber is adhered to the glass layer.

5. The device according to claim 1, wherein the lens corresponds to the formed portion of the glass layer.

6. The device of claim 1, wherein the lens corresponds to a gradient refractive index lens included within the glass layer.

7. The device of claim 1, wherein the lens is adhered to the glass layer.

8. The device of claim 1, wherein the optical fiber is directly attached to a first side of the glass layer, and wherein the photodiode is located on a second side of the glass layer, the second side being opposite to the first side of the glass layer.

9. The device of claim 8, wherein the antenna element is adjacent to the first side of the glass layer.

10. The device of claim 8, wherein the photodiode is adjacent to the second side of the glass layer.

11. The device of claim 8, wherein the distance between the second side of the glass layer and the photodiode corresponds to the focal length of the lens.

12. The device of claim 8, wherein the antenna element is located on the second side of the glass layer.

13. The device of claim 8, further comprising one or more passive elements located on the second side of the glass layer.

14. The device of claim 13, wherein the one or more passive components comprise at least one capacitor, at least one inductor, or a combination thereof.

15. The device of claim 8, further comprising a passive element integrated within the glass layer and including features located on the first side and the second side of the glass layer.

16. The device of claim 1, further comprising a sealant layer encapsulating the volume comprising the photodiode and the lens.

17. The device of claim 1, further comprising a laminated substrate located between the photodiode and the antenna element.

18. The device of claim 17, wherein the antenna element is adjacent to a first side of the laminated substrate.

19. The device of claim 17, further comprising one or more passive components coupled to or embedded within the laminated substrate.

20. The device of claim 17, wherein the photodiode is embedded in the die, and wherein the second device is coupled to the die via the laminate substrate.

21. The device of claim 20, wherein the second device comprises a transmitter, a receiver, a transceiver, a low-noise amplifier, a power amplifier, a passive device, or a combination thereof.

22. The device of claim 1, further comprising a molding compound that at least partially encapsulates the glass layer, the optical fiber, the photodiode, the lens, or a combination thereof.

23. The device according to claim 1, further comprising: The second optical fiber is directly attached to the glass layer; A second photodiode, electrically connected to a second antenna element, wherein the antenna array includes the antenna element and the second antenna element; and A second lens, coupled to or included within the glass layer, is configured to manipulate the light exchanged between the second optical fiber and the second photodiode. The second photodiode is configured to convert an optical signal from the second optical fiber into an electrical signal for the second antenna element, convert an electrical signal from the second antenna element into an optical signal provided to the second optical fiber, or both.

24. The device of claim 23, wherein the pitch between the center of the first connection of the optical fiber to the glass layer and the center of the second connection of the second optical fiber to the glass layer is less than 0.2 mm.

25. A method of manufacturing equipment, the method comprising: Align the optical fiber with the lens and the photodiode, such that the lens is positioned to manipulate the light exchanged between the optical fiber and the photodiode; The optical fiber is directly attached to or coupled to a first side of a glass layer that includes or is coupled to the lens; as well as The photodiode is electrically connected to the antenna element. The photodiode is configured to convert an optical signal from the optical fiber into an electrical signal for the antenna element, to convert an electrical signal from the antenna element into an optical signal provided to the optical fiber, or both.

26. The method of claim 25, further comprising forming a portion of the glass layer to form the lens.

27. The method of claim 25, further comprising forming the antenna element on the first side of the glass layer.

28. The method of claim 25, further comprising forming one or more passive elements on a second side of the glass layer, the second side being opposite to the first side of the glass layer.

29. The method of claim 28, further comprising forming the antenna element on the second side of the glass layer.

30. The method of claim 25, wherein attaching the optical fiber directly to the first side of the glass layer comprises fusing the optical fiber to the first side of the glass layer.

31. An apparatus, the apparatus comprising: Glass layer; Multiple optical fibers are directly attached to the glass layer; Multiple antenna elements; A plurality of photodiodes, wherein a specific photodiode among the plurality of photodiodes is electrically connected to a corresponding antenna element among the plurality of antenna elements; and A plurality of lenses, coupled to or included within the glass layer, wherein a particular lens of the plurality of lenses is configured to manipulate light exchanged between a particular optical fiber and a particular photodiode. The specific photodiode is configured to convert an optical signal from the specific optical fiber into an electrical signal for the corresponding antenna element, convert an electrical signal from the corresponding antenna element into an optical signal provided to the specific optical fiber, or both.

32. The device of claim 31, further comprising a laminated substrate located between the plurality of photodiodes and the plurality of antenna elements.

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