Buffer for substrate transport apparatus and substrate transport apparatus including buffer

Abstract

A substrate delivery device includes: a chamber having a base and two substrate delivery ports arranged side-by-side on a common side of the chamber; at least two side-by-side arms inside the chamber, each arm having a fixed end joint about which the arms rotate and extend, the end joint being common to each arm and connecting each arm in the chamber to each other arm and the base via the common end joint, wherein the at least two side-by-side arms rotate as a whole about the common end joint, each arm having at least one arm link and an end effector attached thereto; a drive portion; and a substrate buffer inside the chamber having more than one substrate buffer stage, each substrate buffer stage being movably connected to the base inside the chamber to move from an open position to a closed position inside the chamber.

Description

[0001] Cross-reference of related applications This application claims the benefit of U.S. Provisional Patent Application No. 63 / 581,512, filed September 8, 2023, and U.S. Provisional Patent Application No. 63 / 685,401, filed August 21, 2024, the entire disclosure of which is incorporated herein by reference. Background Technology 1. Technical Field This disclosure generally relates to robotic systems, and more specifically, to robotic conveying systems.

[0003] 2. Brief overview of relevant progress For example, in the semiconductor processing field, vacuum systems are evolving towards narrower or elongated designs. These narrower vacuum systems are increasingly larger in footprint, especially in length. Typically, these elongated vacuum systems employ vacuum robots that move in a Cartesian coordinate system (called yaw robots). However, as the length or footprint of elongated vacuum systems increases, the reach required by the vacuum robot also increases. To accommodate this increased reach, the links of the vacuum robot arm also increase in length / size, resulting in a heavier arm structure with increased inertia. This places higher demands on the motors driving the individual axes of the robot arm. In some applications, to increase semiconductor production throughput, the robot arm operates at higher accelerations, further increasing the demands on the motors (e.g., the torque output requirements). In some cases, the motors driving the robot arm are located within a common motor housing (e.g., in coaxial or side-by-side arrangements, where the motor output is via a coaxial drive shaft assembly); in others, some motors are distributed within the robot arm itself. As can be recognized, placing motors inside the arm increases the weight and inertia of the arm structure.

[0004] Customers are also continuously building systems with side-by-side process modules or holding tables that require automation for any independent process / maintenance on each process side, enabling parallel processing of both sides simultaneously on the side-by-side holding tables. In most cases, these clustered tool chambers are configured as square or pentagonal chambers, large enough to accommodate a pair of process modules side-by-side on each face. These process modules are typically configured to share a process gas facility but can operate simultaneously or be shut down independently for sequential matching or maintenance.

[0005] Typically, substrate orientation (e.g., the location of notches on the substrate) cannot be controlled during substrate transport. For a three-axis dual SCARA arm, this orientation control is often impossible because the wrist axis is usually driven by the forearm and cannot be controlled. When multiple robots in the same system (e.g., ATM and VAC robots) handle wafers at different transfer angles, the substrate orientation will rotate as the substrate passes the tool.

[0006] Therefore, this disclosure resolves several of these problems. Attached Figure Description

[0007] The foregoing aspects and other features of this disclosure are described in the following description in conjunction with the accompanying drawings, wherein: Figure 1A-1I This is a schematic diagram of a substrate processing apparatus according to the present disclosure; Figure 2A-2J This is a schematic diagram of an exemplary substrate delivery device according to the present disclosure, which can be used in... Figure 1A-1I In any substrate processing device; Figures 3A-3C This is a schematic diagram of an exemplary brushless motor according to the present disclosure, which can be incorporated into one or more joints of any substrate delivery device described herein; Figure 4 It is a substrate processing device (e.g.) Figure 1A-2J An exemplary top plan view of the substrate processing apparatus shown, including the buffer according to the invention; Figure 5 It is a substrate processing device (e.g.) Figure 1A-2J An exemplary top plan view of the substrate processing apparatus shown, including the buffer according to the invention; Figure 6 Based on this disclosure Figure 5 An exemplary top perspective view of a portion of a substrate processing apparatus (where the structure is also applicable) Figure 4 (substrate processing apparatus). Figures 7A-7E The illustration shows a device with [specific features] according to this disclosure. Figure 5 The exemplary substrate exchange of the buffer (the operation of the exemplary substrate exchange is also applicable to) Figure 4 (buffer); Figure 8 This is an exemplary flowchart of a fast-swapping substrate according to the present disclosure; Figure 9 An exemplary loading lock of the substrate processing apparatus described herein is illustrated, which is serviced by the substrate transfer device described herein, and the loading lock is comparable to popular loading lock configurations widely used in the industry. Figure 10 It is based on this disclosure, for example Figure 2I and 2J The motor device shown is driven by Figure 4-7E A schematic top view of a portion of the substrate processing apparatus; Figure 11A and 11B The diagram shows... Figure 10 Exemplary pick-up / placement operations of a portion of a substrate processing apparatus; and Figure 12 This is an example flowchart of an exemplary method according to this disclosure. Detailed Implementation

[0008] The following detailed description is intended to help those skilled in the art to understand and is not intended to unduly limit the claims relating to or connected with this disclosure in any way.

[0009] The following detailed description references various figures, where the same reference numerals indicate the same parts and features in various figures, regardless of whether a specific figure is referenced.

[0010] The word “each” as used in this article refers to a single item (i.e., the item) when referring to a single item, or each item when referring to multiple items. The words “a,” “one,” and “the” as used in this article all include “at least one” and “one or more,” and therefore do not limit the items mentioned to the singular.

[0011] Figure 1A-1I This is a schematic diagram of a substrate processing apparatus according to the present disclosure. Although the present disclosure will be described with reference to the accompanying drawings, it should be understood that the present disclosure can be implemented in many forms. Furthermore, any suitable size, shape, or type of element or material can be used.

[0012] This disclosure provides one or more of the following: a robot architecture that integrates motors into one or more joints of a robot arm, wherein the motors are high-torque compact motors that can reduce the driven mass and the overall size of the robot arm links; and operation of the robot architecture in one or more environments, including vacuum and atmospheric environments.

[0013] Substrate buffer or buffer system 2000, 2000A (see...) Figure 4 and Figure 5This device can be used with dual-arm conveyors / robots. Buffers 2000 and 2000A can be positioned above the arms (but also below, depending on whether the robot is mounted on top or bottom of the transfer chamber) and arranged in a so-called rotary arrangement, in which the substrate holding stage of buffers 2000 and 2000A rotates above the arms to align the desired substrate holding stage of buffers 2000 and 2000A with the end effector of the arms, thereby enabling substrate transfer between buffers 2000 and 2000A and the arms. Buffers 2000 and 2000A can provide dual-arm conveyors / robots with substantially the same substrate throughput as quad-arm conveyors / robots (without buffers 2000 and 2000A) and have the same Z-axis (e.g., vertical movement) limitations (see [link to relevant documentation]). Figure 9 ).

[0014] Still referencing Figure 1A-1I The present disclosure illustrates processing devices 100A, 100B, 100C, 100D, 100E, 100F, and 100G, such as semiconductor tool tables. Although semiconductor tool tables are shown in the figures, the present disclosure described herein is applicable to any tool table or application employing a robotic arm. Processing devices 100A, 100B, 100C, 100D, 100E, 100F, and 100G are shown with a clustered tool arrangement (e.g., with a substrate holding stage connected to a central chamber), although the processing device may be a linear arrangement of tools; however, the present disclosure is applicable to any suitable tool table. Devices 100A, 100B, 100C, 100D, 100E, 100F, and 100G generally include an atmospheric front end 101, at least one vacuum loading lock 102, 102A, or 102B, and a vacuum back end 103. At least one vacuum loading lock 102, 102A, 102B can be connected to any suitable port or opening of the front end 101 and / or the rear end 103 in any suitable arrangement. For example, one or more loading locks 102, 102A, 102B can be arranged side-by-side in a common horizontal plane, such as... Figure 1B , 1D As seen in -1H, however: one or more load locks can be arranged in a grid pattern, such that at least two load locks 102A, 102B, 102C, 102D are arranged in rows (e.g., with spaced horizontal planes) and columns (e.g., with spaced vertical planes), as... Figure 1I As shown; one or more load locks can be as follows Figure 1A The single in-line loading lock 102 shown; or, at least one loading lock 102, 102E can be as follows Figure 1CThe arrangement shown is in a stacked, in-line configuration. It should be understood that although the load locks are illustrated as being located on end 100E1 or face 100F1 of transport chambers 125A, 125B, 125C, 125D, 125E, 125F, and 125G, one or more load locks may be arranged on any number of sides 100S1, 100S2, ends 100E1, 100E2, or faces 100F1-100F8 of transport chambers 125A, 125B, 125C, 125D, 125E, 125F, and 125G. Each of at least one load lock may also include one or more wafer / substrate support planes (WRPs). Figure 1C The substrate is held on a suitable support within the respective loading lock in the substrate support plane. The tool table can have any suitable configuration. Components of each of the front end 101, at least one loading lock 102, 102A, 102B, and the rear end 103 can be connected to a controller 110, which can be part of any suitable control architecture, such as a cluster architecture control. The control system can be a closed-loop controller having a master controller, a cluster controller, and an autonomous remote controller, such as the controller disclosed in U.S. Patent No. 7,904,182, entitled “Scalable Motion Control System,” issued March 8, 2011, the entire disclosure of which is incorporated herein by reference, although any suitable controller and / or control system may be used.

[0015] Front end 101 typically includes a loading port module 105 and a miniature environment 106, such as a device front end module (EFEM). The loading port module 105 can be a cabinet opener / loader to tool standard (BOLTS) interface conforming to SEMI standards E15.1, E47.1, E62, E19.5, or E1.9, for a 300 mm loading port, front-opening or bottom-opening cabinet / chamber, or cassette. The loading port module can be configured as a 200 mm wafer / substrate interface, a 450 mm wafer / substrate interface, or any other suitable substrate interface, such as larger or smaller semiconductor wafers / substrates, flat panel displays, solar panels, photomasks, or any other suitable object. Although in Figure 1A , 1B Three loading port modules 105 are shown in 1D, 1E, 1F, 1G, and 1H, but any suitable number of loading port modules can be incorporated into the front end 101. Loading port modules 105 can be configured to receive substrate carriers or cassettes C from overhead conveyor systems, automated guided vehicles, personnel-guided vehicles, rail-guided vehicles, or any other suitable transport method. Loading port modules 105 can be connected to the microenvironment 106 via loading port 107. Loading port 107 allows the substrate to pass between the substrate cassette and the microenvironment 106.

[0016] The microenvironment 106 typically includes any suitable handling robot 108, which may incorporate one or more features of this disclosure as described herein. Robot 108 may be a track-mounted robot, such as those described in U.S. Patents 6,002,840 (issued December 14, 1999), 8,419,341 (issued April 16, 2013), and 7,648,327 (issued January 19, 2010), the entire contents of which are incorporated herein by reference. Robot 108 with respect to rear end 103 may be substantially similar to the robot described herein. The microenvironment 106 may provide a controlled clean area for transferring substrates between multiple loading port modules.

[0017] At least one vacuum loading lock 102, 102A, 102B may be located between and connected to the microenvironment 106 and the rear end 103. The loading port module 105 may be substantially directly coupled to at least one loading lock 102, 102A, 102B or transport chambers 125A, 125B, 125C, 125D, 125E, 125F, 125G, wherein the substrate carrier C is evacuated to the vacuum of the transport chambers 125A, 125B, 125C, 125D, 125E, 125F, 125G, and the substrate is directly transferred between the substrate carrier C and the loading lock or transport chamber. The substrate carrier C may act as a loading lock, allowing the processing vacuum of the transport chamber to extend into the substrate carrier C. As can be appreciated, when the substrate carrier C is substantially directly connected to the loading lock via a suitable loading port, any suitable transfer device can be located within the loading lock, or otherwise accessible to the carrier C, for transferring the substrate to and from the substrate carrier C. It should be noted that the term "vacuum" as used herein can refer to a high vacuum, such as 1 × 10⁻⁶, in which the substrate processing takes place. -5Torr or lower. At least one loading lock 102, 102A, 102B typically includes an atmospheric valve and a vacuum slit valve. The slit valves of loading locks 102, 102A, 102B (and for the processing stage 130) provide environmental isolation for evacuating the loading locks after loading the substrate from the atmospheric front end and for maintaining a vacuum in the delivery chamber when the loading locks are vented with an inert gas (e.g., nitrogen). As described herein, the slot valves of processing devices 100A, 100B, 100C, 100D, 100E, 100F, and 100G may be located in the same plane, in different vertical stacking planes, or in a combination of slot valves located in the same plane and slot valves located in different vertical stacking planes (as described above regarding loading ports) to facilitate the transfer of substrates to at least processing stages 130 and loading locks 102, 102A, and 102B connected to transport chambers 125A, 125B, 125C, 125D, 125E, 125F, and 125G, and from at least processing stages 130 and loading locks 102, 102A, and 102B connected to transport chambers 125A, 125B, 125C, 125D, 125E, 125F, and 125G. At least one loading lock 102, 102A, 102B (and / or front end 101) may also include an aligner ALN for aligning the substrate reference marks to the location required for processing, or any other suitable substrate metrology device. The vacuum loading lock may be located in any suitable location of the processing apparatus and may have any suitable configuration.

[0018] The vacuum backend 103 typically includes transfer chambers 125A, 125B, 125C, 125D, 125E, 125F, and 125G, one or more processing stages 130, and any suitable number of transfer unit modules 104 containing one or more handling robots, which may include one or more features of this disclosure as described herein. The transfer chambers 125A, 125B, 125C, 125D, 125E, 125F, and 125G can have any suitable shape and size, for example, conforming to SEMI Standard E72 Guide. The transfer chambers 125A, 125B, 125C, 125D, 125E, 125F, and 125G are arranged to maintain a sealed environment. The transfer chambers may have two substrate transfer ports arranged side-by-side with each other on a common side of the chamber (e.g., see...). Figure 1B-1I 4 and 5). Conveyor chambers 125A, 125B, 125C, 125D, 125E, 125F, and 125G have a base or frame (see...). Figure 1A-1I 4 and 5).

[0019] The following describes transfer unit module 104 and one or more handling robots, which may be at least partially located within transfer chambers 125A, 125B, 125C, 125D, 125E, 125F, and 125G, for transferring substrates between loading locks 102, 102A, and 102B (or box C located at the loading port) and various processing stages 130. Transfer unit module 104 may be removable as a modular unit from transfer chambers 125A, 125B, 125C, 125D, 125E, 125F, and 125G, such that transfer unit module 104 conforms to SEMI standard E72 guideline.

[0020] Stage 130 can operate on a substrate using various deposition, etching, or other types of processes to form circuits or other desired structures on the substrate. Typical processes include, but are not limited to, thin film processes using vacuum, such as plasma etching or other etching processes, chemical vapor deposition (CVD), plasma vapor deposition (PVD), implantation (e.g., ion implantation), metrology, rapid thermal processing (RTP), dry lift atomic layer deposition (ALD), oxidation / diffusion, nitride formation, vacuum lithography, epitaxy (EPI), wire bonding, and other thin film processes using evaporation or vacuum pressure. Stage 130 is communicatively connected to transport chambers 125A, 125B, 125C, 125D, 125E, 125F, 125G in any suitable manner (e.g., via a slot valve SV), thereby allowing substrates to be transferred from transport chambers 125A, 125B, 125C, 125D, 125E, 125F, 125G to stage 130 and vice versa. The slit valve SV of the transport chamber 125 can be arranged to allow connection of dual processing stages (e.g., more than one substrate processing chamber located within a common housing) or side-by-side processing stages 130T1, 130T2, single processing stage 130S and / or stacked process modules / loading locks. Figure 1C and 1I ).

[0021] It should be noted that when one or more arms of the transfer unit module 104 are aligned with the predetermined processing stage 130, transfer of substrates to and from the processing stage 130 and to the loading locks 102, 102A, 102B (or cassette C) connected to the transfer chambers 125A, 125B, 125C, 125D, 125E, 125F, 125G can occur. According to this disclosure, one or more substrates can be transferred individually or substantially simultaneously to the respective predetermined processing stage 130 (e.g., as shown in the image). Figure 1B , 1D As shown in 1H, for example when picking up / placing a substrate from a side-by-side or tandem processing stage). The transfer unit module 104 can be mounted on the arm 143 (e.g., see 1H). Figure 1E , 1F , 1H) or linear carriage 144 (e.g., see Figure 1C The disclosures of, for example, those described in U.S. Patent No. 10,777,438 (titled “Processing Apparatus,” issued September 15, 2020) and International Patent Application No. PCT / US13 / 25513 (titled “Substrate Processing Apparatus,” filed February 11, 2013) are incorporated herein by reference in their entirety.

[0022] refer to Figure 2A and 2B An exemplary boom arm configuration will be described, to which the transfer unit module 104 can be coupled. The boom 143 and the transfer unit module 104, together with their respective transfer chambers, can be collectively referred to as a substrate transfer device (however, the boom 143 and the transfer unit module 104 can be collectively referred to as a substrate transfer device), or if the transfer unit module 104 is used without the boom 143, then the transfer unit module, together with its respective transfer chamber, can be referred to as a substrate transfer device (however, the transfer unit module 104 can be referred to as a substrate transfer device). Here, the boom 143 can be a single non-hinged linkage boom 220 ( Figure 2A ), or articulated boom 222 ( Figure 2B ).

[0023] refer to Figure 2A A single non-hinged linkage boom 220 is rotatably connected to the frame or base 201 of the conveying device and is directly driven by a motor 200BA, which is the same as the direct drive motor 500 described herein (see...). Figure 5 The A-5C (also referred to herein as an axial flux brushless motor / motor) is substantially similar. Motor 200BA is connected to the frame and positioned at the boom rotation axis BSX to directly drive boom 143 in a manner similar to that described herein. Transmission unit module 104 is connected to the distal end of boom 143 (opposite to the boom rotation axis BSX). It should be understood that although transmission unit module 104 is illustrated as having a SCARA arm 210 (or dual SCARA arms 210, 210A) configuration, transmission unit module 104 can have any suitable arm configuration, including but not limited to the configurations described herein.

[0024] refer to Figure 2BThe articulated boom 220 includes an upper boom link 220, the proximal end of which is rotatably connected to the frame or base 201 of the conveyor (at the boom rotation axis BAX). The other or distal end of the upper boom link 220 is rotatably connected at the boom joint rotation axis BEX to the proximal end of a front boom link 221, wherein the transmission unit module 104 is connected to and supported by the front boom link 221 at its distal end. In a similar manner to that described herein, the upper boom link 220 is directly driven by a motor 200BA, which is connected to the frame 201 and located at the boom rotation axis BSX.

[0025] The articulated boom 222 may have a hybrid drive system, wherein a motor 200BA directly drives the upper boom link 220, and the front boom link 221 is driven to rotate (e.g., the rotation of the front boom link 221 is driven by the frame 201 via a belt and pulley drive). The front boom link 221 may be directly driven by a motor 200BFA located at the axis of rotation BEX of the front boom link 221 and within at least one of the upper boom link 220 and the front boom link 221 (in a similar manner to that described herein, the motor 200BFA is driven by the direct drive motor 500 described herein (see...). Figure 5 (Similar to A-5C). It should be understood that the articulated boom 222 may have any suitable number of links connected in series with each other, wherein one or more links are directly driven by a corresponding motor disposed at a respective axis of rotation of said one or more links. Suitable examples of booms that may be used by this disclosure are described in U.S. Patent Application No. 15 / 215,143, filed July 20, 2016, entitled “Substrate Processing Apparatus,” the entire disclosure of which is incorporated herein by reference.

[0026] Although Figure 2A and Figure 2B The transmission unit module 104 is illustrated as having a SCARA arm 210 (or dual SCARA arms 210, 210A) configuration, but the transmission unit module 104 can have any suitable transmission arm configuration, including but not limited to the configurations described herein. For example, the transmission unit module can have any other desired arrangement, such as a frog leg arm 216 ( Figure 2C Configuration, jumping frog arm 217 ( Figure 2D ) configuration, double symmetrical arms 218 ( Figure 2EConfiguration, etc. The frog leg arm 216 can be directly driven by a drive motor 200TA located at the shoulder axis SX of the frog leg arm 216. Each end effector of the jumping frog arm 217 can be extended and retracted by its respective drive motor 200TA, 200TAA (located at the shoulder axis SX), which directly drives the corresponding frog leg arm of the corresponding end effector 211, 211DS. The double symmetrical arm 218 can be directly driven by a drive motor 200TA located at the shoulder axis of the double symmetrical arm 218 for extension and retraction. Motors 200TA, 200TAA and the direct drive motor 500 described herein (see...) Figure 5 (A-5C) are basically similar.

[0027] As another example, see Figure 2F The transmission unit module 104 can be configured as a transmission arm 219. The transmission arm 219 includes at least first and second articulated SCARA arms 210 and 210A, wherein each arm 210 and 210A includes an end effector 211DS, 211, 211DE, 211DT, 211DQ, configured to hold at least two substrates S1, S2 side-by-side in a common transmission plane (each substrate holding position of the end effector 211DS shares a common actuator for picking up and placing substrates S1, S2), wherein the spacing DX between substrates S1, S2 corresponds to a fixed spacing between the side-by-side substrate holding positions. Reference Figure 2F and 2G The SCARA arm 210 (and arm 210A) includes an upper arm 213, a forearm 212, and end effectors 211, 211DS, 211DE, 211DT, and 211DQ, which are connected in series to form an articulated chain arm link. Here, at least one of the arm links 213, 212, and 211 is driven by a corresponding drive motor 200TA, 200TAA, 200TFA, 200TFAA, 200TWA, or 200TWAA located at the corresponding joints SX, EX, and WX of the transmission arm (the drive motor is the same as the direct drive motor 500 described herein). Figure 5 (A-5C) Basically similar) Direct drive. Each of the arm links 213, 212 and end effectors 211, 211DS, 211DE, 211DT, 211DQ can be directly driven, but both arm links 212, 211 and end effectors 211, 211DS, 211DE, 211DT, 211DQ can also be driven (e.g., via their respective belt / pulley drives), or when links 213, 212 are directly driven in the manner described herein, end effectors 211, 211DS, 211DE, 211DT, 211DQ can be driven (e.g., driven by the upper arm).

[0028] Suitable examples of transmission arms for which this disclosure may be used can be found in U.S. Patents 6,231,297 (issued May 15, 2001), 5,180,276 (issued January 19, 1993), 6,464,448 (issued October 15, 2002), 6,224,319 (issued May 1, 2001), 5,447,409 (issued September 5, 1995), 7,578,649 (issued August 25, 2009), 5,794,487 (issued August 18, 1998), 7,946,800 (issued May 24, 2011), and 6,485,250 (issued November 26, 2002). U.S. Patent Application No. 13 / 293,717, filed November 10, 2011, entitled “Dual-Arm Robot”, and U.S. Patent Application No. 13 / 270,844, filed October 11, 2011, entitled “Coaxial Driven Vacuum Robot”, the entire contents of which are incorporated herein by reference. Suitable examples of belt / pulley drives that may be used in this disclosure have been described in U.S. Patent Nos. 5,682,795 (issued November 4, 1997), 5,778,730 (issued July 14, 1998), and 11,201,073 (issued December 14, 2021), the entire contents of which are incorporated herein by reference.

[0029] refer to Figure 2H The diagram illustrates another transmission unit module 104. Figure 2H The transmission unit module, like other transmission unit modules described herein, can be connected to boom 143 (e.g., see...). Figure 1H , 2A (and 2B), so that it can be transported by boom 143; it can be connected to linear carriage 144 (e.g., see 2B). Figure 1G ( ), so that it can be transported by linear carriage 144; or it can be fixed stationary to the frame (or the frame of miniature environment 106) of transport chambers 125A, 125B, 125C, 125D, 125E, 125F, 125G. Here, the transport unit module 104 includes a frame 266F to which the turret 266 is rotatably connected for rotation about the turret rotation axis TAX. The drive section 200 includes a turret driver 200R disposed on the turret rotation axis TAX, which directly drives the turret 266 to rotate in direction T3. The turret driver 200R is connected to the direct drive motor 500 described herein (see Figure 5 Similar to (A-5C). The turret 266 includes transfer arm supports 270A and 270B extending from opposite sides of the turret 266, with respective transfer arms 210, 210A, 216, 217, and 218 connected to the transfer arm supports. The transfer arm supports 270A and 270B are spaced apart from each other such that their respective transfer arms are supported by the turret 266 in a side-by-side arrangement, wherein each of the side-by-side transfer arms includes end effectors 211, 211DS, 211DE, 211DT, and 211DQ, the end effectors being configured to hold at least one substrate side-by-side in a common transfer plane, wherein the spacing DX between substrates S1 and S2 corresponds to a fixed spacing between the side-by-side substrate holding positions (e.g., similar to the spacing between substrates S1 and S2 in a common transfer plane). Figure 2F The manner in which it is described, and the entire disclosure of U.S. Patent No. 10,134,621, issued November 20, 2018, are incorporated herein by reference.

[0030] The turret 266 may include one or more linear motors 200LM connected to respective transfer arm supports 270A, 270B for moving the respective transfer arm supports 270A, 270B along directions 271A, 271B to achieve adjustments in distance DX (or independent adjustments of respective distances DX1, DX2 from axis TAX) to take into account variability from substrate holding stage to substrate holding stage, and to automatically center the independent wafers relative to the transfer arms held on the respective transfer arm supports 270A, 270B. Here, turret 266 provides individual or independent Cartesian coordinate adjustments for each respective transfer arm support 270A, 270B (and the respective transfer arm connected thereto) to maintain substrate alignment and reduce substrate exchange time, because the position correction achieved by Cartesian coordinate (e.g., XY) positioning of the end effectors 211, 211DS, 211DE, 211DT, 211DQ of at least one transfer arm connected to transfer arm support 270A is performed in parallel with the Cartesian coordinate positioning of the end effectors 211, 211DS, 211DE, 211DT, 211DQ of at least one other transfer arm connected to transfer arm support 270B. Each transfer arm support 270A, 270B may also include a respective Z-axis driver 200Z1, 200Z2 for moving the corresponding transfer arm held on that transfer arm support 270A, 270B independently of the Z-axis movement of the corresponding transfer arm held on the other transfer arm support 270A, 270B. Another Z-axis driver can be set up to move the turret 266 and any transmission arms connected to it as a whole along the Z direction.

[0031] refer to Figure 2IThe transmission unit module 104 is illustrated as robot assembly 10F. Robot assembly 10F includes four independent SCARA arms 2401A-2401D, which are connected to a hub 2420 and a distributed drive section 2400 (which may be similar to drive section 200) for driving the rotation of the hub 2420 and the rotation and extension of the arms 2401A-2401D. Each arm 2401A-2401D has an independent radial degree of freedom R and rotational degree of freedom θ (see also...). Figure 10 While each arm 2401A-2401D has an independent radial degree of freedom R and rotational degree of freedom θ, the hub 2420 can provide (e.g., in addition to or in place of rotational degree of freedom θ) movement of the arms 2401A-2401D in directions 271A, 271B, in a manner similar to that of the turret 266. The rotational degree of freedom θ and / or the movement of the arms 2401A-2401D in directions 271A, 271B can allow for automatic substrate / wafer centering during substrate placement, in any suitable substrate holding position (e.g., process module, loading lock, etc.).

[0032] Robot component 10F includes a base or frame 2401, to which a hub 2420 is rotatably connected for rotation about the hub's rotation axis HX (i.e., rotational degree of freedom θ). H ).exist Figure 2I In this design, the hub 2420 includes a proximal hub portion 2420L and a distal hub portion 2420H, which are interconnected by a strut 2420S, such that the proximal hub portion 2420L is closer to the base 2401, and the distal hub portion 2420H is farther from the base 2401, and the two portions rotate as a whole about the hub axis HX. The drive unit 2400 includes a motor 2400H, which is connected to the hub 2420 and drives the hub 2420 to rotate about the hub rotation axis HX. The motor 2400H can be similar to any motor described herein.

[0033] The dimensions of the strut 2420S are designed such that the far and near hub portions 2420H, 2420L are spaced apart from each other by any suitable distance, with arms 2401A-2401D positioned between the far and near hub portions 2420H, 2420L, although any other suitable arrangement of arms 2401A-2401D relative to the strut and hub portions 2420H, 2420L is also possible.

[0034] Each of the distal hub portion 2420H and the proximal hub portion 2420L extends on opposite sides of the hub rotation axis HX, such that each of the distal hub portion 2420H and the proximal hub portion 2420L has a first end 2420E1 and a second end 2420E2. Arm 2401A is connected to the adjacent end 2420E2 of the distal hub portion 2420H, and arm 2401B is connected to the adjacent end 2420E2 of the proximal hub portion 2420L, such that arms 2401A and 2401B are stacked one on top of the other in a relative relationship (i.e., the end effector 2402E of arm 2401A is adjacent to the end effector 2402E of arm 2401B), so that the transfer planes TP of arms 2401A and 2401B are adjacent to each other to minimize the Z-axis travel of arms 2401A and 2401B when picking up / placing substrate S onto the same or different substrate holding stages. Arm 2401D is connected to the adjacent end 2420E1 of the distal hub portion 2420H, and arm 2401C is connected to the adjacent end 2420E1 of the proximal hub portion 2420L, such that arms 2401D and 2401C are stacked one on top of the other in a relative relationship (i.e., the end effector 2402E of arm 2401D is adjacent to the end effector 2402E of arm 2401C), thereby the transfer planes TP of arms 2401A and 2401B are adjacent to each other to minimize the Z-axis travel of arms 2401A and 2401B when picking up / placing substrate S onto the same or different substrate holding stages. Connecting arms 2401A-2401D to hub 2420 allows arms 2401A-2401D to rotate together with hub 2420 about hub axis HS as a whole.

[0035] Arms 2401A-2401D are mounted or otherwise connected to hub 2420 to achieve independent radial degree of freedom R and rotational degree of freedom θ. For example, referring to arm 2401D (the other arms 2401A-2401C have the same arrangement), arm 2401D includes an upper arm link 2402U (referred to as the upper arm) connected to hub 2420 about a corresponding shoulder axis SX. Forearm link 2402F (referred to as the forearm) of arm 2401D is rotatably connected to upper arm 2402U about a corresponding elbow axis EX. An end effector 2402E (more than one end effector may be connected to each arm 2401A-2401D) is rotatably connected to forearm 2402F about a corresponding wrist axis WX. The drive components include motors 2400U and 2400S, which are disposed in hub 2420 at corresponding shoulder axes SX. Motor 2400U is connected to upper arm 2402U to drive upper arm 2402U to rotate about the corresponding shoulder axis SX. Motor 2400S is connected to forearm 2402F via any suitable transmission device TX1 (e.g., belt and pulley drive) to drive forearm to rotate about the corresponding elbow axis EX. The rotation of end effector 2402E about wrist axis WX is driven by upper arm 2402U via any suitable transmission device TX2 (e.g., belt and pulley drive) such that when arm 2401D extends and retracts, end effector 2401E is coupled to a radial path R (see [reference needed] through the corresponding shoulder axis SX). Figure 10 Align and move along radial path R. Two motors, 2400U and 2400S, rotate at the same rate in the same direction, causing arm 2401D to rotate as a whole about its respective shoulder axis; while motors 2400U and 2400S rotate at different rates in the same or different directions, causing arm 2401D to move along radial path R (or radial path HR, see...). Figure 11A Extension and retraction. While a driven end effector 2402E is described for each arm 2401A-2401D, the end effector 2402E of each arm can also rotate independently, wherein a third motor 2400E is provided at the respective shoulder axis SX of each arm 2401A-2401D for driving the rotation of the respective end effector 2402E via any suitable transmission mechanism (e.g., belt and pulley transmission). Although motors 2400S, 2400U and (if included) motor 2400E are described as being located at the shoulder axis, motor 2400U may be located at the shoulder axis, motor 2400S may be located at the elbow axis, and motor 2400E (if provided) may be located at the wrist axis WX, so as to be distributed throughout the respective arms 2401A-2401D.

[0036] refer to Figure 2JThe transmission unit module 104 is illustrated as robot assembly 10G. Robot assembly 10G is the same as robot assembly 10F, except that the hub portion 2420H is rotatably connected to the support column 2420S and is driven to rotate about the hub rotation axis HX independently of the hub portion 2420L by the corresponding motor 2400L.

[0037] refer to Figures 3A-3C One or more motors 200R, 200TA, 200TWA, 200TFA, 200TAA, 200TWAA, 200TFAA, 200BA, 200BFA, 2400S, 2400U, and 2400E of the substrate delivery device (i.e., the substrate delivery device is a separate transmission unit module 104 or a transmission unit module 104 connected to the boom 143) are axial flux brushless motors or electric motors 500. Motor 500 is a high-torque compact motor. For example, the stator outer diameter of this compact motor is approximately 170 mm or less (the stator surrounds / wraps around the rotor). For motor 500 where the stator and rotor are sealed by an isolation wall, its high torque is approximately twice the torque of a radial flux motor with a similar stator diameter and air gap. For the motor 500, which uses a ferrofluid seal between the stator and rotor, its high torque is approximately five times that of a radial flux motor with a similar stator diameter and air gap. For illustrative purposes only, the peak torque of a motor with a stator outer diameter of approximately 170 mm is approximately 212 Nm, and the torque density is approximately 53.0 Nm / kg; however, the peak torque may be greater than or less than approximately 212 Nm, and the torque density may be greater than or less than approximately 53.0 Nm / kg. Here, due to the stator and rotor being sealed and isolated by the isolation wall, the power of the motor 500 is reduced by approximately 60% or less compared to a motor 500 without such a seal (but as mentioned above, even with the power reduction, the torque produced by the motor 500 with the isolation wall is approximately twice that of a radial flux motor with a similar stator diameter and air gap). The motor can be positioned within the conveyor to directly drive (e.g., without intermediate transmission) the corresponding conveyor arm linkage. For example, a motor can be located at the shoulder axis to directly drive the rotation of the upper arm 213; a motor can be located at the elbow axis to directly drive the rotation of the forearm 212; and a motor can be located at the wrist axis to directly drive the rotation of the end effector 211. If a boom is provided, the motor can be located at the rotation axis of the boom to directly drive the rotation of the boom.

[0038] The motor 500 includes a frame or housing 500H, a motor stator 501, and a motor rotor 505. The stator 501 is connected to the frame 500H and has phase coils 501AC, 501BC, and 501CC disposed in an atmospheric space containing an atmospheric environment. The rotor 505 is cooperatively coupled to the stator 501 to generate an output under the excitation of the stator, wherein the rotor 505 is disposed in a sealed environment that is sealed and isolated from the atmospheric space. As described herein, a seal 510 seals and isolates the rotor 505 from the stator 501. Also as described herein, the rotor 505 and stator 501 are arranged with an axial clearance between them, the axial clearance being arranged across the stator 501. A seal or isolation wall 510 is arranged in the axial clearance to seal each stator 501 with each rotor 505 excited by the stator 501 across the seal 510.

[0039] The stator 501 includes at least one phase coil or stator coils 501AC, 501BC, 501CC and rotors 505A, 505B, 505C and 505D, which are arranged alternately or interleaved with each other. Figure 5 A-5C illustrates a portion of such an axial flux motor 500. Here, the motor 500 includes at least one phase coil 501AC, 501BC, 501CC (three are shown in the figure for illustrative purposes only; there may be more or fewer stator coils), which are stacked or arranged axially. Each stator coil 501AC, 501BC, 501CC is disposed on a respective concentrator ring 501AR, 501BR, 501CR (also referred to herein as a stator ring), wherein the concentrator ring (including the coil) constitutes the stator 501. Rotor 505 includes armatures 505A, 505B, 505C, and 505D (also referred to as rotor rings—four are shown in the figure for illustrative purposes only, and there may be more or fewer depending on the number of concentrator rings 501AR to 501CR), which are stacked or arranged axially, wherein concentrator rings 501AR to 501CR extend between the stacked armatures 505A to 505D to alternate or stagger with the stacked armatures 505A to 505D, thereby having an axial clearance arrangement with axial clearance between the stator and rotor portions (see [reference]). Figure 5 (A and 5B). The axial clearance arrangement is configured such that the stator 501 excites the rotor 505 through the axial clearance.

[0040] The substrate transport device is used in at least a (high) vacuum environment. Here, the rotor 505 may be made of a magnetically permeable material (e.g., without permanent magnets) to be configured for use in a vacuum environment. At least a portion of the interior of the arm link of the substrate transport device is exposed to the vacuum environment, while other portions of the interior of the arm link are exposed to the atmospheric environment. For example, as... Figure 5As shown in Figure A, the stator 501 is located within the portion of the arm connecting rod exposed to the atmospheric environment, while the rotor 505 is located within the portion of the arm connecting rod exposed to the vacuum environment. To maintain isolation between the vacuum environment and the atmospheric environment, the motor 500 (or arm connecting rod) includes an isolation wall or seal 510, which is a static seal (i.e., no moving parts). Here, the isolation wall 510 seals and isolates the sealed environment (e.g., the environment maintaining a vacuum) and the atmospheric environment within the sealed space from each other.

[0041] As described herein, rotor 505 is made of a magnetically permeable material, enabling motor 500 to operate as an induction motor. The axial air gap between stator 501 and rotor 505 is between about 0.3 mm and about 1.0 mm, preferably between about 0.3 mm and 0.8 mm. Isolation wall 510 is axially located between each rotor element (e.g., each rotor ring 505A-505D) and each stator element of the excitation rotor 505 (e.g., each stator / concentrator ring 501AR-501CR). For example, the shape and dimensions of isolation wall 510 are designed to conform to at least one of stator 501 and rotor 505. Here, isolation wall 510 extends along the air gap profile between stator 501 concentrator rings 501AR-501CR (with corresponding coils 501AC-501CC) and rotor 505 armature 505A-505D. Figure 5 As seen in A and 5B, the isolation wall 510 has a serpentine cross-section that extends along a serpentine air gap between the stator 501 and the rotor 505. The serpentine cross-section includes at least one sealing disc portion 510D that spans the entire axial gap, radially separating the stator 501 from the rotor 505.

[0042] The isolation wall 510 is made of a non-magnetic material with low electrical conductivity, capable of withstanding pressure differential loads (e.g., pressure difference between an atmospheric environment and a vacuum environment) and allowing magnetic fields to pass between the stator 501 and the rotor 505. Suitable materials for the isolation wall 510 include, but are not limited to, 300 series stainless steel.

[0043] The isolation wall 510 can be made into a single integral component (see...) Figure 5A), which is hydroformed or welded in a manner similar to constructing a metal bellows, thereby sealing as a solid, integral seal without radial cracks. The isolation wall 510 consists of two or more isolation rings 510R1-510R6, which are assembled / stacked together with the motor concentrator rings 501AR-501CR and the rotor armature 505A-505D. Each isolation ring 510R1-510R6 (e.g., by any suitable seal, such as an O-ring or other static seal) is sealed to one or more adjacent isolation rings 510R1-510R6, wherein the end isolation ring (e.g., isolation rings 510R1, 510R6) is sealed to adjacent isolation rings (e.g., isolation ring 510R6 is sealed to adjacent isolation ring 510R5, isolation ring 510R1 is sealed to adjacent isolation ring 510R2) and to the corresponding isolation wall end cap 510RE (which is an integral, single-piece structure or component) to form in the housing 500H of the isolation wall 510 and the motor 500 (see Figure 3C The seal between the inside of the arm or connecting rod (e.g., by any suitable seal, such as an O-ring or other static seal).

[0044] Motor components (e.g., stator concentrator rings 501AR-501CR and rotor armatures 505A-505D) are assembled around an isolation wall 510. Here, the isolation wall 510 provides support for coils 501AC-501CC, which are mounted to or otherwise disposed on the isolation wall. For example, referring to coil 501AC, when the isolation wall 510 is assembled (e.g....), Figure 5 As shown in Figure A, the isolation wall 510 is a single, integrated component; or as... Figure 5 As shown in B, the isolation wall 510 is composed of isolation rings 510R1 and 510R2), and the coil is wound around and supported by the isolation wall 510 (in Figure 5In A and 5B, the winding of coil 501AC extends in-plane / out-of-plane. Concentrator ring 501AR consists of at least two portions 501ARC1 and 501ARC2, each radially (e.g., toward the center / rotation axis of motor 500) inserted into isolation wall 510 to fit tightly with and interconnect with the respective portions of coil 501AC and concentrator rings 501ARC1 and 501ARC2. Similarly, referring to coil 501AC, concentrator ring 501AR is radially inserted into isolation wall 510 to fit tightly with coil 501AC (e.g., to be electrically connected to coil 501AC), wherein isolation wall 510 fits tightly with concentrator ring 501AR. As used herein, "fitting tightly" means supporting, substantially in contact, touching, and / or close to. As can be appreciated, the components of coils 501BC and 501CC, and their respective concentrator rings 501BR and 501CR, are assembled into the isolation wall 510 in a manner similar to that described above with respect to coil 501AC and concentrator ring 501AR.

[0045] As described above, the isolation wall 510 includes stacked sealing disc portions 510D that radially separate the stator 501 from the rotor 505 across the entire axial clearance. Each sealing disc portion 510D is an integral one-piece structure or component, and they are joined together (e.g., by means of...) Figure 5 The welding shown in A, or by means of, Figure 5 (as shown in B), to form isolation wall 510. Assembly of motor 500 involves step-by-step assembly. For example, still referring to... Figure 5 A and Figure 5B. Starting from end 500E1 of motor 500, rotor ring 505D is tightly fitted onto isolation wall end cap 510RE. Sealing disc 510D (on its radially outer side) is connected to isolation wall end cap 510RE, and another sealing disc 510D (on its radially inner side) is connected to sealing disc 510D, thus forming a recess in which coil 501CC and concentrator ring 501CR are arranged. Coil 501CC is wound within the recess, and concentrator ring portions 501ARP1 and 501ARP2 of concentrator ring 501CR are inserted into the recess in the manner described herein, such that coil 501CC is supported by isolation wall 510, and concentrator ring 501CR is tightly fitted into the recess of isolation wall 510. Rotor ring 505C is assembled to rotor ring 505D, and another sealing disc 501D is connected to another sealing disc 510D on its radially outer side, and another sealing disc 510D (on its radially inner side) is connected to sealing disc 510D, thereby forming a groove in which coil 501BC and concentrator ring 501BR are arranged. Coil 501BC is wound in the groove, and the concentrator ring portions 501ARP1, 501ARP2 of concentrator ring 501BR are inserted into the groove in the manner described herein, such that coil 501BC is supported by isolation wall 510, and concentrator ring 501BR is tightly fitted into the groove of isolation wall 510. The assembly of other rotor rings 505A-505D, coils 501AC-501CC, concentrator rings 501AR-501CR, and sealing disc 510D is carried out in a similar manner to that described above, such that the required number of stator rings and rotor rings are assembled together and sealed to each other.

[0046] It should be understood that although some transmission arms are described herein as having a single-ended end effector 211, the transmission arm may include one or more of the following: a single-ended end effector 211; a double-ended end effector 211DE, each actuator being configured to hold at least two substrates S1 and S2 on opposite sides of the wrist axis WX (see Figure 3AThe transfer unit module 104 includes: a side-by-side end effector 211DS; a three-end end effector 211DT with substrate stages radially spaced approximately 120° apart; and a four-end end effector 211DQ with holding stages radially spaced approximately 90° apart. When the transfer unit module 104 has multiple arms, different end effectors 211, 211DE, 211DS, 211DT, and 211DQ can be used on multiple arms in any suitable combination. Rapid substrate exchange in the substrate holding position can be performed by a single transfer arm with a two-end actuator 211DE by picking up / placing a first substrate from the substrate holding position, rotating the transfer arm as a whole to change the orientation of the two-end actuator 211DE, and then placing / picking up a second substrate from the same substrate holding position. Using a single transfer arm equipped with a dual-end actuator 211DE, a triple-end actuator 211DT, and a quadruple-end actuator 211DQ, the end effector can also be rotated via a direct drive motor located at the corresponding wrist joint / axis WX, thereby enabling rapid substrate exchange in the holding position. For example, the transfer arm can be extended to pick up / place the first substrate from the substrate holding position, the transfer arm can be retracted, and the end effector can be rotated to change the orientation of the end effectors 211DE, 211DT, and 211DQ. Then, the transfer arm can be extended to place the second substrate into / pick up the second substrate from the same substrate holding position. Rapid substrate exchange using multiple transfer arms can be achieved by extending the first transfer arm to pick up / place the substrate into the substrate holding position, retracting the first transfer arm, and then extending the second transfer arm to place / pick up the second substrate from the same substrate holding position (it should be noted that one or more of the multiple transfer arms can also be configured as described above to achieve rapid substrate exchange independently).

[0047] When an end effector includes more than one holding stage, different holding stages can be used to transport objects with different cleanliness levels. For example, one holding stage may be used or designated to transport a substrate S to be processed (e.g., in the substrate being processed), while another holding stage may be used or designated to transport processing equipment / accessories within the substrate processing apparatus (e.g., the equipment / accessories described herein), which may have a different cleanliness level than those in the substrate S being processed.

[0048] refer to Figure 2I and 2JIn robot components 10F and 10G, the transfer of substrate S does not require relative rotation of substrate S, but is achieved by a driven end effector 2402E. The distance S1 between transfer platforms 1100 and 1101 is substantially the same as the distance S2 between the radial telescopic axes R (i.e., the distance between the shoulder axes SX of the opposite ends 2420E1 and 2420E of the hub 2420), and the hub rotation axis HX is approximately positioned midway between transfer platforms 1100 and 1101. With independent rotation of the end effector 2402E provided, the distance S1 between transfer platforms 1100 and 1101 can be the same as or different from the distance between the radial telescopic axes R, and the hub rotation axis X can be positioned at any spatial location relative to transfer platforms 1100 and 1101, provided that transfer platforms 1100 and 1101 are within the reach of arms 2401A-2401D. Through the independent rotation of the end effector 2402E of robot components 10F and 10G, at least motors 2400U, 2400S, and 2400E are operated, allowing arms 2401A-2401D to extend. This enables the end effector 2402E to reach transfer tables 1100 and 1101 along their respective non-radial extension paths EXT1 and EXT2, for example, in a manner similar to... Figures 7A-7E The manner shown and described.

[0049] Still referencing Figure 2I , 2J And also refer to Figure 10 and Figure 11A-11B Robotic assemblies 10F and 10G can be configured to place substrates on side-by-side substrate transfer stages 1100 and 1101 and a radially arranged (relative to the hub rotation axis HX) substrate transfer stage 1102, wherein an end effector 2402E places the substrate S at each substrate transfer stage 1100, 1101, and 1102, while the end effector is orthogonal to the respective vertical plane VP of the holding stages 1100, 1101, and 1102. The process by which robotic assemblies 10F and 10G transfer substrates to substrate transfer stages 1100 and 1101 has been described above. The transfer to the so-called radial transfer stage 1102 (e.g., to another robot component, process module, loading lock, etc.) can be achieved by coordinated control of the drive section 2400 motor, such that the substrate holding stage center SHS of the end effector 2402E reaches the substrate holding stage 1102 along the radial extension path HR, and that the end effector 2402E is orthogonal to the vertical plane VP of the substrate holding stage 1102, thereby achieving the transfer of the substrate S, so that no relative rotation of the substrate S occurs at the substrate holding stage 1102 (e.g., when transferring to another robot component).

[0050] To achieve the extension to the substrate holding stage 1102, taking arm 2401A as an example (the extensions of other arms 2401B-2401D are achieved in the same or similar manner), controller 199 operates one or more motors 2400U, 2400S, such that arm 2401A extends to place the substrate holding stage center SHS of end effector 2402E on the radial extension path HR (see...). Figure 11B (Top left corner). When the substrate holding stage center SHS is located on the radial extension path HR, the controller 199 operates the motor 2400H to cause the hub 2401 to rotate about the hub rotation axis HX along the direction θ. H Rotation moves the shoulder axis SX of arm 2401A along the radial extension path HX. As hub 2401 rotates along direction θ... H Movement: Controller 199 operates one or more motors 2400U, 2400S (motors 2400H, 2400U, 2400S are operated in a coordinated manner by controller 199) to extend arm 2401A, wherein the combined movement achieved by motor 2400H and one or more motors 2400U, 2400S keeps the substrate holding stage center SHS moving along the radially extending path HR (see...). Figure 11B (Top right corner). One or more motors 2400H, 2400U, 2400S continue to operate, aligning the end effector with the radial extension path HR (thus orthogonal to the vertical plane VP of the substrate transfer stage 1102) and positioning the substrate holding stage center SHS for picking up or placing the substrate S onto the substrate holding stage 1102. The retraction of arm 2401A (and the other arms 2401B-2401D) is substantially the opposite of the extension of arm 2401A. By extending / retracting arms 2401A-2401D, controller 199 can operate only one of motors 2400H, 2400U, 2400S and / or a combination of two or more of motors 2400H, 2400U, 2400S in a predetermined sequence to hold the substrate holding stage center SHS along the radial extension path HR. For example, in order to extend arms 2401A-2401D, there may be some extension periods during which only motors 2400U and 2400S operate simultaneously; other periods during which only motor 2400H operates; and still other periods during which motors 2400H, 2401U, and 2400S operate simultaneously to place the substrate holding stage center SHS on the radial extension path HR, and / or to keep the substrate holding stage center SHS on the radial extension path HR.

[0051] like Figure 11A and 11BAs shown, when arm 2401A (and / or arm 2401B) is extended, arms 2401C and 2401D located on the opposite end 2420E1 of hub 2420 remain substantially in the retracted configuration. Similarly, when arm 2401D (and / or arm 2401C) is extended, arms 2401A and 2401B located on the opposite end 2420E2 remain substantially in the retracted state.

[0052] refer to Figure 2H , 2I 2J, 10, 11A-11B and Figure 4-7E The substrate delivery device 104 shown in the figure includes buffers 2000 and 2000A. Although buffers 2000 and 2000A are related to... Figure 2H Substrate delivery device with dual SCARA arms (see) Figure 2G The description is similar to that of the buffer 2000 and 2000A, but the buffers 2000 and 2000A can also be described in a similar manner. Figure 4-7C The way of description, and having Figure 2A-2G The substrate delivery device is integrated into any of the arms shown. SCARA arms can be similar to... Figure 2H , 2I Similar configurations exist in 10F, 10, 11A, and 11B, where end effectors 211 and 211A have a shape that bends or folds toward the rotation axes TAX and HX, but end effectors 211 and 211A can have any suitable configuration. In other words, the substrate delivery device can be similar to robot components 10F and 10G, but has two side-by-side arms 2401B, 2401C or 2401A, 2401D (for illustrative purposes, ...). Figure 10 , 11A (Only two arms of 2401A-2401D are shown in 11B, not all four arms of 2401A-2401D.) For illustrative purposes, see reference 11B. Figure 2H , 45 and 6, the substrate transport device 104 includes a turret 266 and transport arm supports 270A, 270B movably connected thereto for movement along directions 271A, 271B (or, in the case of robot assemblies 10F, 10G, the substrate transport device 104 includes a hub 2420 and rotation of the arms in their respective rotational degrees of freedom θ—for ease of description, the turret 266 and hub 2420 may generally be referred to as turrets). Movement of the transport arm supports 270A, 270B along directions 271A, 271B (or, in the case of robot assemblies 10F, 10G, rotation of the arms in their respective rotational degrees of freedom θ) can be achieved by laterally adjusting the center of the substrate held on the respective arm (e.g., relative to the shoulder axis of the respective arm, about radially extending paths EXT1, EXT2), thereby enabling automatic wafer centering for alignment with the center of any suitable substrate holding stage (e.g., process module or loading lock). The turret 266 (or hub 2420) rotates about axes TAX, HX in the manner described herein (e.g., driven by the turret driver 200R, or by the motor 2400H in the case of robot assemblies 10F, 10G), and the transmission arm supports 270A, 270B move in their respective directions 271A, 271B in the manner described herein (e.g., driven by their respective linear motors 200LM), or in the case of robot assemblies 10F, 10G, the arm rotates in rotational θ degree of freedom by one or more of their respective motors 2400S, 2400U.

[0053] Each transmission arm support 270A, 270B is illustrated with a SCARA arm 210, 210A or 2401B, 2401C or 2401A, 2401D (for ease of description, it will be referred to as SCARA arm 2401B, 2401C here), wherein arm 2401B is rotatably connected to transmission arm support 271A and arm 2401C is connected to transmission arm support 271B. Figure 4 and Figure 5 Arms 2401B and 2401C are shown in retracted configuration (RETC) and extended configuration (EXTC), respectively.

[0054] Here, the substrate transport device 104 has at least two side-by-side arms 2401B, 2401C (see also arms 210, 210A, 2401A, 2401D) within the transport chamber 125C. Each arm 2401B, 2401C has a fixed end joint (e.g., a turret rotation axis TAX) about which the arms 2401B, 2401C rotate and extend. The end joint TAX is common to the arms 2401B, 2401C and connects each arm 2401B, 2401C within the transport chamber 125C to each other arm 2401B, 2401C and to a base or frame connected to the transport chamber 125C via the common end joint TAX, thereby allowing the at least two side-by-side arms 2401B, 2401C to rotate as a whole about the common end joint TAX. Each arm 2401B, 2401C has at least one arm link 213, 212, 213A, 212A and an associated end effector 211, 211A. Each arm link 213, 212, 213A, 212A is connected in series with the end effector 211, 211A at the distal end of the arm 2401B, 2401C.

[0055] As described herein, drive section 200 is operatively connected to each arm 2401B, 2401C, wherein drive section 200 has more than one independent motor 200TFA, 200TFAA, 200TA, 200TAA, 200TWA, 200TWAA, each motor defining an independent drive axis, operatively connected to each arm 2401B, 2401C to describe at least one degree of freedom of motion of end effectors 211, 211A of the respective arm 2401B, 2401C, which is proportionate to the more than one independent drive axis connected to the respective arm 2401B, 2401C, thereby causing the end effectors 211, 211A to extend and laterally pass through one of the two substrate delivery ports (e.g., see...). Figure 1B-1I 4 and 5).

[0056] Each arm 210, 210A can have a driven configuration such that arms 2401B, 2401C extend and retract via a single drive motor (e.g., motors 200TA, 200TAA, or 2400U located at the shoulder axis SX of the respective arm 2401B, 2401C); end effectors 211, 211A can be linked with upper arms 213, 213A, thereby allowing arms 2401B, 2401C to extend and retract via two drive motors (e.g., motors 200TA, 200TAA located at the shoulder axis SX of the respective arm 2401B, 2401C and motors 200TFA, 200TFAA located at the elbow axis EX, or motors 2400U, 2400S located at the shoulder axis SX of the respective arm 210, 210A); or, each arm 24 Each of the end effectors 211, 211A, forearms 212, 212A, and upper arms 213, 213A of 01B and 2401C can be independently driven to extend and retract the corresponding arm 2401B, 2401C. For example, the upper arms 213, 213A are driven by their respective motors 200TA, 200TAA, or 2400U (located at their respective shoulder axis SX), the forearms are driven by their respective motors 200TFA, 200TFAA (located at their respective elbow axis EX), or 2400S (located at their respective shoulder axis SX), and the end effectors 211, 211A are driven by their respective motors 200TWA, 200TWAA (located at their respective wrist axis WX), or 2400E (located at their respective shoulder axis SX). Although distributed drive has been described for each arm 2401B, 2401C, drive motors can also be arranged at their respective shoulder axes SX to drive corresponding drive shafts with coaxial shaft arrangements, and achieve rotation of the corresponding arm links via any suitable transmission device (e.g., belt / pulley, gear / chain, etc.). Figure 2I and 2J As shown. It should be noted that the dual SCARA arms 2401B and 2401C are shown for illustrative purposes only, and the arms can have any suitable configuration, such as those described herein.

[0057] Substrate buffers 2000 and 2000A are disposed within transport chamber 125C and have more than one substrate buffer or holding stage 2030A, 2030B, 2031A, and 2031B. Each substrate buffer or holding stage 2030A, 2030B, 2031A, and 2031B is movably connected within transport chamber 125C to a base or frame of transport chamber 125C (see [reference]). Figure 4-6 ), thereby allowing the material to move from the open position within the transport chamber 125C (e.g., see...). Figure 7A The positions of the middle substrate holding stages 2030A and 2030B are moved to the closed position (e.g., see...). Figure 7DThe substrate buffer stages 2030A and 2030B are positioned such that, in the open position, the substrate buffer stages 2030A, 2030B, 2031A, and 2031B correspond to the end effectors 211 and 211A of each arm 2401B and 2401C within the transport chamber 125C, such that the end effectors 211 and 211A communicate with the buffer stages 2030A, 2030B, 2031A, and 2031B in the open position for end-effector execution. Substrates S1-S4 are transferred between actuators 211, 211A and substrate buffer stages 2030A, 2030B, 2031A, 2031B; wherein, in the closed position, substrate buffer stages 2030A, 2030B, 2031A, 2031B are removed from end effectors 211, 211A, and communication between end effectors 211, 211A and substrate buffer stages 2030A, 2030B, 2031A, 2031B is prevented. More than one substrate buffer stage 2030A, 2030B, 2031A, 2031B is arranged such that each end effector 211A, 211B of each arm 2401B, 2401C has at least one substrate buffer stage 2030A, 2030B, 2031A, 2031B in at least one of the open and closed positions (see...). Figures 7A-7E ).

[0058] As described in more detail herein, one or more of the following are provided individually or in any suitable combination thereof, and / or in combination with any of the features described herein: more than one substrate buffer stage 2030A, 2030B, 2031A, 2031B is arranged such that each end effector 211, 211A of each arm 2401B, 2401C has at least one substrate buffer stage 2030A, 2030B, 2031A, 2031B in both an open position and a closed position; more than one substrate buffer stage 2030A, 2030B, 2031A, 2031B is connected to the transfer chamber 125C via an end joint CAX. The base or frame; the end joint CAX of more than one substrate buffer stage 2030A, 2030B, 2031A, 2031B substantially coincides with the end joint TAX of at least two side-by-side arms 2401B, 2401C; the substrate buffers 2000, 2000A have at least four substrate buffer stages 2030A, 2030B, 2031A, 2031B; the substrate buffers 2000, 2000A include: a first buffer arm 2010 having a first pair of substrate buffer stages 2030A, 2030B disposed at opposite ends 2010E1, 2010E2 of the first buffer arm 2010; and a second buffer arm 2 011, which has a second pair of substrate buffer stages 2031A, 2031B disposed at opposite ends 2011E1, 2011E2 of the second buffer arm 2011; the drive section 200 includes at least one Z-axis drive motor 200BFZ1, 200BFZ2, which is operatively connected to the substrate buffers 2000, 2000A to raise or lower one of the first buffer arm 2010 and the second buffer arm 2011 relative to the other of the first buffer arm 2010 and the second buffer arm 2011; the first buffer arm 2010 is configured such that the first pair of substrate buffer stages 2030A, 2030B are approximately 18 [units missing] apart from each other. The second buffer arm 2011 is configured such that the second pair of substrate buffer stages 2031A and 2031B are arranged approximately 180º apart from each other; the first buffer arm 2010 is configured such that the first pair of substrate buffer stages 2030A and 2030B are arranged approximately 59.56º apart from each other; and the second buffer arm 2011 is configured such that the second pair of substrate buffer stages 2031A and 2031B are arranged approximately 59.56º apart from each other; and the substrate buffers 2000 and 2000A switch from the open position to the closed position substantially simultaneously with the extension or retraction of at least one of the at least two side-by-side arms 2401B and 2401C.

[0059] Buffers 2000 and 2000A can be described as having a carousel-like structure (e.g., a carousel-type buffer). For example, buffers 2000 and 2000A include two buffer arms 2010 and 2011, which are positioned above arms 2401B and 2401C and configured to rotate about a carousel-like axis of rotation CAX. The carousel-like axis of rotation CAX can be located at the point of rotation around which arms 2401B and 2401C rotate as a whole; in the example shown, this axis of rotation is the turret rotation axis TAX and HX. In this way, buffers 2000, 2000A and arms 2401B, 2401C can rotate as a whole around the turret rotation axes TAX, HX, and buffers 2000, 2000A can rotate independently of arms 2401B, 2401C around the turret rotation axes TAX, HX, thereby achieving substrate transfer between buffers 2000, 2000A and arms 2401B, 2401C, as described herein. The two buffer arms 2010, 2011 are driven as a whole to rotate by drive motor 200BFR around the carousel-like rotation axis CAX. One or more of the two buffer arms 2010, 2011 can be driven along the Z-axis direction (e.g., vertically) by any suitable linear actuator or Z-axis driver 200BFZ1, 200BFZ2. For illustrative purposes, each buffer arm 2010, 2011 is driven along the Z-axis by its respective Z-axis driver 200BFZ1, 200BFZ2.

[0060] Buffer arm 2010 includes at least two substrate holding stages 2030A and 2030B, wherein the substrate holding stages 2030A and 2030B are disposed at opposite ends 2010E1 and 2010E2 of buffer arm 2010, and buffer arm 2010 is rotatably connected to its respective drive shaft 2201 (as shown in FIG. 22) between the ends 2010E1 and 2010E2, the drive shaft defining a carousel-like rotation axis CAX. Buffer arm 2011 includes at least two substrate holding stages 2031A and 2031B, wherein the substrate holding stages 2031A and 2031B are disposed at opposite ends 2011E1 and 2011E2 of buffer arm 2011, and buffer arm 2011 is rotatably connected to its respective drive shaft 2202 (as shown in FIG. 22) between the ends 2011E1 and 2011E2, the drive shaft defining a carousel-like rotation axis CAX. Drive shafts 2201 and 2202 can be coaxial drive shafts (defining a carousel-type rotating axis CAX), which are rotatably connected in any suitable manner so that they are jointly driven (i.e. driven by the same drive motor) by drive motor 200BFR and independently driven in the Z direction by their respective Z-axis drive motors 200BFZ1 and 200BFZ2.

[0061] When arms 2401B and 2401C are in the retracted configuration (RETC), the length of each buffer arm 2010 and 2011 from the carousel-like rotation axis (CAX) to the center of the substrate holding stages 2030A, 2030B, 2031A, and 2031B is such that the center CSC of the substrate holding stages 2030A, 2030B, 2031A, and 2031B (and the substrates S1-S4 held thereon) can be coaxial with the center SHSC of the substrate holding stages SHS of the end effectors 211 and 211A. When arms 2401B and 2401C are in the retracted configuration RETC, the center CSC of substrate holding stages 2030A, 2030B, 2031A, and 2031B and the center SHSC of end effectors 211 and 211A are coaxially positioned with arms 2401B and 2401C in the retracted configuration RETC, allowing the transfer of substrates S1-S4 between buffers 2000 and 2000A and arms 2401B and 2401C.

[0062] refer to Figure 4 Each buffer arm 2010, 2011 has a generally straight configuration, such that the substrate holding stages 2030A, 2030B, 2031A, 2031B of each arm are arranged diagonally opposite each other. For example, the substrate holding stages 2030A, 2030B of buffer arm 2010 are arranged approximately 180° apart, and the substrate holding stages 2031A, 2031B of buffer arm 2011 are arranged approximately 180° apart.

[0063] refer to Figure 5 Each buffer arm 2010, 2011 has an angled configuration such that the substrate holding stages 2030A, 2030B, 2031A, 2031B of each arm are set less than 180° apart from each other. For example, the substrate holding stages 2030A, 2030B of buffer arm 2010 are set to be approximately 180° apart, and the substrate holding stages 2031A, 2031B of buffer arm 2011 are set to be approximately 180° apart. For example, one side of buffer arm 2010, 2011 can be angularly offset from 180° by any suitable offset angle λ, such that compared to Figure 4The substrate holding stages 2030A, 2030B, 2031A, and 2031B are arranged as shown, with the stages positioned closer to each other angularly. Positioning the substrate holding stages 2030A, 2030B, 2031A, and 2031B closer to each other angularly reduces the amount of rotation of the buffer arm 2000A required for substrate exchange compared to the amount of rotation of the buffer 2000 required for substrate exchange. This reduced rotation of the buffer arm 2000A required for substrate transfer between the buffer and the arm, compared to the rotation of the buffer 2000, increases substrate processing / transfer throughput. The offset angle λ can be approximately 59.56º, but it can be greater than or less than approximately 59.56º.

[0064] It should be noted that, for illustrative purposes only, the two buffer arms 2010 and 2011 shown in the figure provide four substrate holding stages 2030A, 2030B, 2031A, and 2031B. There may be more than two buffer arms providing more than four substrate holding stages; there may be two buffer arms providing more than four substrate holding stages; or there may be two or fewer buffer arms providing fewer than four substrate holding stages.

[0065] refer to Figures 7A-7E and Figure 8 The following describes an exemplary substrate exchange for buffers 2000 and 2000A. Although Figures 7A-7E The diagram for buffer 2000A illustrates substrate exchange, but it should be noted that substrate exchange using buffer 2000 can be implemented in the same manner as described herein. In this example, substrates S1 and S2 are exchanged with substrates S3 and S4 at process modules 130T1 and 130T2. Arms 2401B, 2401C and buffer 2000A rotate as a whole about the turret rotation axes TAX and HX to align the extension axes EXT1 and EXT2 with process modules 130T1 and 130T2 (or other suitable substrate holding positions). Figure 8 (Block 800). Buffer 2000A is positioned / rotated relative to arms 2401B and 2401C such that the center CSC of substrate holding stage 2030A is substantially coaxial with the center SHSC of end effector 211 substrate holding stage SHS (so as to be with Figure 6 (Similar to the manner shown in the examples of substrate holding stages 2031A and 2031B), and the center CSC of substrate holding stage 2030B is substantially coaxial with the center SHSC of substrate holding stage SHS of end effector 211A (in order to be consistent with...) Figure 6 (Similar to the method shown in the substrate holding stages 2031A and 2031B) Figure 8(Block 810). Substrate holding stages 2031A and 2031B hold substrates S4 and S3, respectively. End effectors 211 and 211A extend to process modules 130T1 and 130T2 for picking up substrates S1 and S2 (see Figure 23B), and when substrates S1 and S2 are held on end effectors 211 and 211A, arms 2401B and 2401C retract to the retracted configuration RETC, thereby transferring substrates S1 and S2 from end effectors 211 and 211A to buffer holding stages 2030A and 2030B (see Figure 23B). Figure 8 (820 squares)

[0066] In order to achieve the transfer of the substrate from the end effectors 211, 211A to the buffer holding stages 2030A, 2030B ( Figure 8 (Box 820) At least buffer arm 2010 is lowered along the Z direction (before the end effectors 211, 211A are extended to process modules 130T1, 130T2, or in the case of arm extensions 2401B, 2401C) so that substrate holders 2030AH, 2030BH on which substrates S1, S2 are to be placed are located below the transfer plane TP of the substrates on end effectors 211, 211A. For illustrative purposes, buffer holders 2030A, 2030B shown in the figure have lower substrate holders 2030AH, 2030BH and upper substrate holders 2030AH2, 2030BH2 for holding substrates in a stacked manner, although only a single substrate holder may be provided. In the example shown, substrates S1, S2 are to be placed on lower substrate holders 2030AH, 2030BH. When substrates S1 and S2 are held on end effectors 211 and 211A and arms 2401B and 2401C are in retracted configuration (RETC), at least buffer arm 2010 rises in the Z direction to lift substrates S1 and S2 from end effectors 211 and 211A, thereby transferring substrates S1 and S2 from end effectors 211 and 211A to corresponding substrate holders 2030AH and 2030BH.

[0067] When the buffer arms 2010 and 2011 are raised, the substrate holding stages 2030A, 2030B, 2031A, and 2031B are positioned above the arms 2401B and 2401C to allow the buffer 2000A to rotate relative to the arms 2401B and 2401C. The buffer 2000A rotates about the carousel-like rotation axis CAX (which is coaxial with the turret rotation axes TAX and HX) in direction T3 so that the center CSC of the substrate holding stages 2031A and 2031B of the buffer arm 2011 is aligned with the corresponding center SHSC of the end effectors 211 and 211A (see...). Figure 6 and Figure 7D () Figure 8(block 830), thereby enabling the transfer of substrates S3 and S4 from buffer arm 2011 to end effectors 211 and 211A ( Figure 8 (Block 840). In order to transfer substrates S3 and S4 to end effectors 211 and 211A, at least buffer arm 2011 descends along the Z direction, causing substrate holders 2031AH and 2031BH of substrate holding stages 2031A and 2031B to move below their respective end effectors 211 and 211A, thereby transferring substrates S3 and S4 from substrate holders 2031AH and 2031BH.

[0068] When substrates S3 and S4 are held on end effectors 211 and 211A, extension arms 2401B and 2401C are extended, allowing end effectors 211 and 211A to enter process modules 130T1 and 130T2, so that substrates S3 and S4 can be placed in process modules 130T1 and 130T2 (see Figure 23E). Figure 8 (850 squares)

[0069] The (processed) substrates S1 and S2 held on buffer arms 2010 can be placed in loading locks 102A and 102B and exchanged with two other unprocessed substrates in substantially the same manner as described in process modules 130T1 and 130T2 regarding the exchange of substrates S1, S2 and S3, S4, wherein buffers 2000A and arms 2401B and 2401C are rotated as a whole to align the extension axes EXT1 and EXT2 with loading locks 102A and 102B.

[0070] refer to Figure 9The transfer arm of the robot described herein can be used to transfer substrates to, or from, substrate holding stages 1910A, 1910B, and 1910C or other substrate holding positions of the loading lock 102, wherein holding stages 1910A, 1910B, and 1910C are stacked on top of each other. For illustrative purposes, the loading lock 102 is shown as a three-layer stack / chamber loading lock with three fixed (e.g., relative to the loading lock frame) substrate holding stages 1910A, 1910B, and 1910C, wherein the loading lock 102 conforms to a common loading lock configuration widely adopted in the industry. To pick up or place substrates S1-S3 from the respective substrate holding stages 1910A, 1910B, and 1910C, a Z-direction movement distance DX1, DX2 of approximately 5 mm may be required (although this movement may be greater or less than approximately 5 mm) to facilitate the transfer of substrates S1-S3 between the support of the substrate holding stage and the end effector 1920 (a portion of which is shown in Figure 19, where the end effector can be any of those end effectors described herein). Therefore, to pick up a substrate from the uppermost substrate holding stage 1910C, the end effector 1920 moves in the Z-direction at least 5 mm beyond the top of substrate S1 resting on the support of substrate holding stage 1910C. To place substrate S3 onto the lowermost substrate holding stage 1910A, the end effector 1920 moves in the Z-direction at least 5 mm beyond the bottom of substrate S3 resting on the support of substrate holding stage 1910A. The robot's transfer arm described herein may be configured with a Z-direction travel distance or stroke DX3 of approximately 175 mm (the stroke may be greater than or less than approximately 175 mm) to pick up and place substrates S1-S3 from three substrate holding stages 1910A-1910C. The lowermost substrate holding stage 1910A may be located at a distance DX4 of approximately 18.5 mm from the bottom of the transfer opening or slot 1950 of the substrate holding stage 1910A (this distance may be greater than or less than approximately 18.5 mm), wherein the bottom of the slot 1950 is located at a distance DX5 of approximately 107 mm from the reference plane RP of the substrate processing equipment (this distance may be greater than or less than approximately 107 mm).

[0071] refer to Figure 1A-11B and Figure 12 An exemplary method will be described in accordance with this disclosure. The method includes providing a substrate delivery device as described herein (…). Figure 12 (See block 1200). For example, as described herein, the substrate delivery device includes delivery chambers 125A, 125B, 125C, 125D, 125E, 125F, and 125G arranged to accommodate a sealed environment. The delivery chambers may have two side-by-side substrate delivery ports on a common side of the chambers (e.g., see...). Figure 1B-1I , Figure 4 and Figure 5 Conveyor chambers 125A, 125B, 125C, 125D, 125E, 125F, and 125G have a base or frame (see...). Figure 1A-1I , Figure 4 and Figure 5 At least two parallel arms 2401B, 2401C (see also arms 210, 210A, 2401A, 2401D) are disposed within a transport chamber 125C. Each arm has a fixed end joint (e.g., a turret rotation axis TAX) about which the arms 2401B, 2401C rotate and extend. The end joint TAX is common to the arms 2401B, 2401C and connects each arm 2401B, 2401C within the transport chamber 125C to each other arm 2401B, 2401C and to a base or frame connected to the transport chamber 125C via the common end joint TAX, thereby allowing the at least two parallel arms 2401B, 2401C to rotate as a whole about the common end joint TAX. Each arm 2401B, 2401C has at least one arm link 213, 212, 213A, 212A and an associated end effector 211, 211A. Each arm link 213, 212, 213A, 212A is connected in series with the end effector 211, 211A at the distal end of the arm 2401B, 2401C. A drive section 200 is operatively connected to each arm 2401B, 2401C, wherein the drive section 200 has more than one independent motor 200TFA, 200TFAA, 200TA, 200TAA, 200TWA, 200TWAA, each motor defining an independent drive axis, operatively connected to each arm 2401B, 2401C to describe at least one degree of freedom of motion of the end effectors 211, 211A of the respective arm 2401B, 2401C, which is proportionate to the more than one independent drive axis connected to the respective arm 2401B, 2401C, thereby causing the end effectors 211, 211A to extend and laterally pass through one of the two substrate delivery ports (e.g., see...). Figure 1B-1I (4 and 5). Substrate buffers 2000 and 2000A are disposed within transport chamber 125C and are provided with more than one substrate buffer or holding stage 2030A, 2030B, 2031A, and 2031B. Each substrate buffer or holding stage 2030A, 2030B, 2031A, and 2031B is movably connected within transport chamber 125C to a base or frame of transport chamber 125C (see [reference]). Figure 4-6 ).

[0072] Substrate buffers 2000 and 2000A are in the open position within the transport chamber 125C (e.g., see...). Figure 7A The positions of the middle substrate holding stages 2030A and 2030B are moved to the closed position (e.g., see...). Figure 7D (The middle substrate maintains the positions of stages 2030A and 2030B) Figure 12 (Box 1210). In the open position, the substrate buffer stages 2030A, 2030B, 2031A, 2031B correspond to the end effectors 211, 211A in the transport chamber 125C of each arm 2401B, 2401C, such that the end effectors 211, 211A communicate with the buffer stages 2030A, 2030B, 2031A, 2031B in the open position, thereby allowing communication between the end effectors 211, 211A and the substrate buffer stages 2030A, 2030B, 2031A, 2031B. Substrates S1-S4 are transferred between bottom buffer stages 2030A, 2030B, 2031A, and 2031B; and wherein, in the closed position, substrate buffer stages 2030A, 2030B, 2031A, and 2031B are displaced away from end effectors 211 and 211A, and communication between end effectors 211 and 211A and substrate buffer stages 2030A, 2030B, 2031A, and 2031B is prevented. More than one substrate buffer stage 2030A, 2030B, 2031A, and 2031B is arranged such that each end effector 211A and 211B of each arm 2401B and 2401C has at least one substrate buffer stage 2030A, 2030B, 2031A, and 2031B in at least one of the open and closed positions (see...). Figures 7A-7E ).

[0073] The method includes one or more of the following, which may be provided individually or in any suitable combination thereof, and / or in combination with any of the features described herein: more than one substrate buffer stage 2030A, 2030B, 2031A, 2031B is arranged such that each end effector 211, 211A of each arm 2401B, 2401C has at least one substrate buffer stage 2030A, 2030B, 2031A, 2031B in both an open position and a closed position; more than one substrate buffer stage 2030A, 2030B, 2031A, 2031B is connected to the input via an end joint CAX. A base or frame for a feed chamber 125C; the end joint CAX of more than one substrate buffer stage 2030A, 2030B, 2031A, 2031B substantially coincides with the end joint TAX of at least two side-by-side arms 2401B, 2401C; substrate buffers 2000, 2000A have at least four substrate buffer stages 2030A, 2030B, 2031A, 2031B; substrate buffers 2000, 2000A include: a first buffer arm 2010 having a first pair of substrate buffer stages 2030A, 2030B disposed at opposite ends 2010E1, 2010E2 of the first buffer arm 2010; and a... The second buffer arm 2011 has a second pair of substrate buffer stages 2031A and 2031B disposed at opposite ends 2011E1 and 2011E2 of the second buffer arm 2011; the drive section 200 includes at least one Z-axis drive motor 200BFZ1 and 200BFZ2, which is operatively connected to the substrate buffers 2000 and 2000A to raise or lower one of the first buffer arm 2010 and the second buffer arm 2011 relative to the other of the first buffer arm 2010 and the second buffer arm 2011; the first buffer arm 2010 is configured such that the first pair of substrate buffer stages 2030A and 2030B are larger than each other. The second buffer arm 2011 is configured such that the second pair of substrate buffer stages 2031A and 2031B are approximately 180º apart; the first buffer arm 2010 is configured such that the first pair of substrate buffer stages 2030A and 2030B are approximately 59.56º apart; and the second buffer arm 2011 is configured such that the second pair of substrate buffer stages 2031A and 2031B are approximately 59.56º apart; and the substrate buffers 2000 and 2000A switch from the open position to the closed position substantially simultaneously with the extension or retraction of at least one of the at least two side-by-side arms 2401B and 2401C.

[0074] The following items are provided pursuant to this disclosure and may be used alone, in any combination with each other, and / or in any combination with the features described above: According to this disclosure, a substrate delivery device includes: a chamber arranged to contain a sealed environment and having two substrate delivery ports side-by-side on a common side of the chamber, the chamber having a base; at least two side-by-side arms inside the chamber, each arm having a fixed end joint about which the arms rotate and extend, the end joint being common to each arm and connecting each arm inside the chamber to each other arm and the base via the common end joint, such that the at least two side-by-side arms rotate as a whole about the common end joint, each arm having at least one arm link and an end effector attached to the arm link, each arm link being connected in series with the end effector at a distal end of the arm; and a drive portion operatively connected to each arm, wherein the drive portion has more than one independent motor, each motor defining an independent drive axis, operatively connected to each arm to describe at least one end effector of the corresponding arm. A degree of freedom of motion corresponding to more than one independent drive axis connected to the respective arm, thereby causing the end effector to extend and laterally pass through one of the two substrate delivery ports; and a substrate buffer located in the chamber having more than one substrate buffer stage, each substrate buffer stage being movably connected to the base in the chamber for moving from an open position to a closed position within the chamber; wherein, in the open position, the substrate buffer stage corresponds to the end effector of each arm in the chamber, such that the end effector and the substrate buffer stage communicate in the open position to transfer substrate between the end effector and the substrate buffer stage, and in the closed position, the buffer stage is displaced away from the end effector and prevents communication between the end effector and the substrate buffer stage; wherein, more than one substrate buffer stage is arranged such that each end effector of each arm has at least one substrate buffer stage in at least one of the open and closed positions.

[0075] According to this disclosure, the substrate delivery device, alone or in any suitable combination thereof, or in any suitable combination thereof with the features described herein, includes one or more of the following: More than one substrate buffer stage is arranged such that each end effector of each arm has at least one substrate buffer stage in both the open and closed positions; More than one substrate buffer stage is connected to the base via an end joint; The end joints of more than one substrate buffer stage substantially coincide with the end joints of at least two side-by-side arms; The substrate buffer has at least four substrate buffer stages; The substrate buffer includes: a first buffer arm having a first pair of substrate buffer stages disposed at opposite ends of the first buffer arm; and a second buffer arm having a second pair of substrate buffer stages disposed at opposite ends of the second buffer arm. The drive section includes at least one Z-axis drive motor operatively connected to the substrate buffer to raise or lower one of the first and second buffer arms relative to the other of the first and second buffer arms. The first buffer arm is configured such that the first pair of substrate buffer stages are set approximately 180º apart from each other, and the second buffer arm is configured such that the second pair of substrate buffer stages are set approximately 180º apart from each other. The first buffer arm is configured such that the first pair of substrate buffer stages are set approximately 59.56º apart from each other, and the second buffer arm is configured such that the second pair of substrate buffer stages are set approximately 59.56º apart from each other. The substrate buffer switches from the open position to the closed position substantially simultaneously with the extension or retraction of at least one of the at least two side-by-side arms.

[0076] According to this disclosure, a method includes: providing a substrate delivery device, the device comprising: a chamber arranged to contain a sealed environment and having two substrate delivery ports arranged side-by-side on a common side of the chamber, the chamber having a base; at least two side-by-side arms inside the chamber, each arm having a fixed end joint about which the arm rotates and extends, the end joint being common to each arm, and each arm inside the chamber being connected to each other arm and the base via the common end joint, such that the at least two side-by-side arms rotate as a whole about the common end joint, each arm having at least one arm link and an end effector attached to the arm link, each arm link being connected in series with the end effector at a distal end of the arm; a drive portion operatively connected to each arm, wherein the drive portion has more than one independent motor, each motor defining an independent drive axis, operatively connected to each arm to describe the end of the corresponding arm. The actuator has at least one degree of freedom of movement corresponding to more than one independent drive axis connected to the respective arm, thereby extending the end effector laterally through one of the two substrate delivery ports; and a substrate buffer located in the chamber having more than one substrate buffer stage, each substrate buffer stage being movably connected to the base in the chamber; and moving the substrate buffer from an open position to a closed position in the chamber; wherein: in the open position, the substrate buffer stage corresponds to the end effector of each arm in the chamber, such that the end effector and the substrate buffer stage communicate in the open position, thereby transferring the substrate between the end effector and the substrate buffer stage, and wherein in the closed position, the buffer stage is displaced away from the end effector and prevents communication between the end effector and the substrate buffer stage; and more than one substrate buffer stage is arranged such that each end effector of each arm has at least one substrate buffer stage in at least one of the open and closed positions.

[0077] According to this disclosure, the method, alone or in any suitable combination thereof, or in any suitable combination thereof with the features described herein, includes one or more of the following: More than one substrate buffer stage is arranged such that each end effector of each arm has at least one substrate buffer stage in both the open and closed positions; More than one substrate buffer stage is connected to the base via an end joint; The end joints of more than one substrate buffer stage substantially coincide with the end joints of at least two side-by-side arms; The substrate buffer has at least four substrate buffer stages; The substrate buffer includes: a first buffer arm having a first pair of substrate buffer stages disposed at opposite ends of the first buffer arm; and a second buffer arm having a second pair of substrate buffer stages disposed at opposite ends of the second buffer arm.

[0078] The drive section includes at least one Z-axis drive motor operably connected to the substrate buffer, and the method further includes raising or lowering one of the first buffer arm and the second buffer arm relative to the other of the first buffer arm and the second buffer arm. The first buffer arm is configured such that the first pair of substrate buffer stages are set approximately 180º apart from each other, and the second buffer arm is configured such that the second pair of substrate buffer stages are set approximately 180º apart from each other. The first buffer arm is configured such that the first pair of substrate buffer stages are set approximately 59.56º apart from each other, and the second buffer arm is configured such that the second pair of substrate buffer stages are set approximately 59.56º apart from each other. The substrate buffer switches from the open position to the closed position substantially simultaneously with the extension or retraction of at least one of the at least two side-by-side arms.

[0079] It should be understood that the above description is illustrative only. Those skilled in the art can devise various alternatives and modifications without departing from this disclosure. Therefore, this disclosure is intended to cover all such alternatives, modifications, and variations that fall within the scope of any of the appended claims. Furthermore, the fact that different features are described only in mutually different dependent or independent claims does not mean that combinations of these features cannot be advantageously used, and such combinations remain within the scope of this disclosure.

[0080] What needs protection is...

Claims

1. A substrate delivery device, comprising: A chamber arranged to accommodate a sealed environment, the chamber having two substrate delivery ports arranged side by side on a common side of the chamber, the chamber having a base; At least two side-by-side arms inside the room, each arm having a fixed end joint, the arms rotating and extending about the end joint, the end joint being common to each arm and connecting each arm inside the room to each other arm and base via the common end joint, such that the at least two side-by-side arms rotate as a whole about the common end joint, each arm having at least one arm link and an end effector attached thereto, each arm link being connected in series with the end effector at the distal end of the arm; A drive section operably connected to each arm, wherein the drive section has more than one independent motor, each motor defining an independent drive axis, operably connected to each arm to describe at least one degree of freedom motion of the end effector of the respective arm, the motion being proportional to more than one independent drive axis connected to the respective arm, thereby causing the end effector to extend and laterally pass through one of the two substrate delivery ports; The substrate buffer inside the room has more than one substrate buffer stage, each substrate buffer stage being movably connected to the base inside the room so as to move from an open position to a closed position inside the room; In the open position, the buffer stage corresponds to the end effector inside the chamber of each arm, allowing communication between the end effector and the buffer stage, thereby transferring the substrate between the end effector and the buffer stage; and in the closed position, the buffer stage is displaced away from the end effector, preventing communication between the end effector and the buffer stage; and More than one buffer stage is arranged such that each end effector of each arm has at least one buffer stage in at least one of the open and closed positions.

2. The substrate delivery device as claimed in claim 1, wherein, More than one buffer is arranged such that each end effector of each arm has at least one buffer in both the open and closed positions.

3. The substrate delivery device as claimed in claim 1, wherein, More than one buffer platform is connected to the base via an end joint.

4. The substrate delivery device as claimed in claim 3, wherein, The end joints of more than one buffer platform substantially overlap with the end joints of at least two side-by-side arms.

5. The substrate transport apparatus of claim 1, wherein the substrate buffer has at least four substrate buffer stages.

6. The substrate delivery apparatus of claim 1, wherein the substrate buffer comprises: The first buffer arm has a first pair of substrate buffer stages disposed at opposite ends of the first buffer arm; and The second buffer arm has a second pair of substrate buffer stages disposed at opposite ends of the second buffer arm.

7. The substrate transport apparatus of claim 6, wherein the drive portion includes at least one Z-axis drive motor operatively connected to the substrate buffer to raise or lower one of the first buffer arm and the second buffer arm relative to the other of the first buffer arm and the second buffer arm.

8. The substrate delivery apparatus as claimed in claim 6, wherein, The first buffer arm is configured such that the first pair of buffer platforms are set approximately 180º apart from each other, and the second buffer arm is configured such that the second pair of buffer platforms are set approximately 180º apart from each other.

9. The substrate delivery apparatus as claimed in claim 6, wherein, The first buffer arm is configured such that the first pair of buffer platforms are set approximately 59.56º apart from each other, and the second buffer arm is configured such that the second pair of buffer platforms are set approximately 59.56º apart from each other.

10. The substrate delivery device of claim 1, wherein the substrate buffer switches from the open position to the closed position substantially simultaneously with the extension or retraction of at least one of the at least two side-by-side arms.

11. A method comprising: A substrate delivery device is provided, comprising: A chamber arranged to accommodate a sealed environment, the chamber having two substrate delivery ports arranged side by side on a common side of the chamber, the chamber having a base; Two parallel arms inside the interior, each arm having a fixed end joint, the arms rotating and extending about the end joint, the end joint being common to each arm and connecting each arm inside the interior to each other arm and base via the common end joint, such that at least two parallel arms rotate as a whole about the common end joint, each arm having at least one arm link and an end effector attached thereto, each arm link being connected in series with the end effector at the distal end of the arm; A drive section operably connected to each arm, wherein the drive section has more than one independent motor, each motor defining an independent drive axis, operably connected to each arm to describe at least one degree of freedom motion of the end effector of the respective arm, the motion being proportional to more than one independent drive axis connected to the respective arm, thereby causing the end effector to extend and laterally pass through one of the two substrate delivery ports; An indoor substrate buffer, the substrate buffer having more than one substrate buffer stage, each substrate buffer stage being movably connected to a base indoors; and Indoors, move the substrate buffer from the open position to the closed position; in: In the open position, the buffer stage corresponds to the end effector of each arm in the interior, such that the end effector and the buffer stage communicate in the open position, thereby transferring the substrate between the end effector and the buffer stage; and wherein in the closed position, the buffer stage is displaced away from the end effector and prevents communication between the end effector and the buffer stage. More than one buffer is arranged such that each end effector of each arm has at least one buffer in at least one of the open and closed positions.

12. The method of claim 11, wherein, More than one buffer is arranged such that each end effector of each arm has at least one buffer in both the open and closed positions.

13. The method of claim 11, wherein, More than one buffer platform is connected to the base via an end joint.

14. The method of claim 13, wherein, The end joints of more than one buffer platform substantially overlap with the end joints of at least two side-by-side arms.

15. The method of claim 11, wherein, The substrate buffer has at least four substrate buffer stages.

16. The method of claim 11, wherein, The substrate buffer includes: The first buffer arm has a first pair of substrate buffer stages disposed at opposite ends of the first buffer arm; and The second buffer arm has a second pair of substrate buffer stages disposed at opposite ends of the second buffer arm.

17. The method of claim 16, wherein, The drive section includes at least one Z-axis drive motor operably connected to the substrate buffer, and the method further includes raising or lowering one of the first buffer arm and the second buffer arm relative to the other of the first buffer arm and the second buffer arm.

18. The method of claim 16, wherein, The first buffer arm is configured such that the first pair of buffer platforms are set approximately 180º apart from each other, and the second buffer arm is configured such that the second pair of buffer platforms are set approximately 180º apart from each other.

19. The method of claim 16, wherein, The first buffer arm is configured such that the first pair of buffer platforms are set approximately 59.56º apart from each other, and the second buffer arm is configured such that the second pair of buffer platforms are set approximately 59.56º apart from each other.

20. The method of claim 11, wherein, The substrate buffer switches from the open position to the closed position substantially simultaneously with the extension or retraction of at least one of the at least two side-by-side arms.

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